WO2012015184A2 - 피씨비 택트 스위치 - Google Patents
피씨비 택트 스위치 Download PDFInfo
- Publication number
- WO2012015184A2 WO2012015184A2 PCT/KR2011/005052 KR2011005052W WO2012015184A2 WO 2012015184 A2 WO2012015184 A2 WO 2012015184A2 KR 2011005052 W KR2011005052 W KR 2011005052W WO 2012015184 A2 WO2012015184 A2 WO 2012015184A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive plate
- metal dome
- insulating
- tact switch
- film
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/02—Details
- H01H13/12—Movable parts; Contacts mounted thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/02—Details
- H01H13/04—Cases; Covers
- H01H13/06—Dustproof, splashproof, drip-proof, waterproof or flameproof casings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/02—Details
- H01H13/26—Snap-action arrangements depending upon deformation of elastic members
- H01H13/48—Snap-action arrangements depending upon deformation of elastic members using buckling of disc springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2205/00—Movable contacts
- H01H2205/016—Separate bridge contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2207/00—Connections
- H01H2207/032—Surface mounted component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2215/00—Tactile feedback
- H01H2215/004—Collapsible dome or bubble
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2223/00—Casings
- H01H2223/002—Casings sealed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2229/00—Manufacturing
- H01H2229/04—Solder problems
Definitions
- the present invention relates to a PCB tact switch, and more particularly, there is no hole open to the outside at the upper and lower parts to provide excellent waterproofness as well as to improve contact stability to prevent malfunction and to improve the fixing force by soldering on a product. It is invented to prevent the departure.
- the tact switch is a typical switch used for various electronic products such as performing the opening and closing operation of the circuit by light contact, and the opening and closing operation of the circuit is accurate, easy, and simple in structure.
- FIG. 1 A conventional known PCB type tact switch configuration is shown in FIG. 1
- the insulating member 10 formed of a non-conductive material that is not electrically conductive in a thin plate shape
- the lower surface of the lower conductive plate 30 is composed of a solder mask 70 to cover the portion except the position requiring the solder as a non-conductor.
- the user presses and presses the center portion of the metal dome 40 while being applied to the electronic device, and the circumference of the metal dome 40 is already in contact with the variable contact portion 23, and the center portion thereof has a central contact portion ( 21) to operate or to apply an operation signal to the circuit connected by soldering to any corner of the lower conductive plate (30).
- a machining process using a drill in the body of the substrate member, and the external exposed surface of the upper conductive plate 20 and the lower conductive plate 30 including the periphery of the hole is electrically Copper plating process to have a conductive state, etching process to cut copper plated part for electrical short for switch function in electrical connection by this copper plating process, and finally to perform electrical insulation on the part corresponding to solder mask It is largely composed of a printing process.
- the conventional PCB-type tact switch as described above has a problem in that the manufacturing process and configuration is complicated, thereby increasing the manufacturing cost and thereby increasing the defective rate of the product.
- the biggest problem of the conventional tact switch is that the center portion is in contact with the upper conductive plate when the metal dome is pressed by the creek, at which time the air inside the metal dome does not go out, resulting in incomplete touch.
- Another object of the present invention is to provide a PC bit tact switch to improve the contact stability by making the line contact is made by the step of the center contact when the metal dome and the upper conductive plate is in contact.
- Still another object of the present invention is to provide a PCB-tact switch having excellent water resistance since no openings or gaps are formed with the outside.
- the insulating member 100 is formed of an insulator that is not electrically conductive in a thin plate shape;
- An upper conductive plate 300 formed of an electrically conductive material, covered with an upper surface of the insulating member 100, and having a central contact terminal 320 and an outer circumferential contact terminal 330 by a short circuit portion 310;
- a metal dome 500 elastically deformed by a user's click and electrically contacting or shorting the upper conductive plate 300 and the lower conductive plate 400;
- An insulating insulating cover film 600 covering the upper part of the upper conductive plate 300 and the metal dome 500 to protect the inside thereof;
- An insulating solder mask 700 bonded to a bottom surface of the lower conductive plate 400 to cover a portion except for a position requiring soldering with an insulator;
- the receiving groove 360 is formed by the receiving hole 110 penetrating through the insulating member 100 and the insulating film 111, and the metal dome 500 is disposed in the receiving groove 360. Is achieved by.
- the silicon adhesive 610 is applied to the bottom of the insulating cover film 600 at the contact portion of the metal dome 500.
- the center of the metal dome 500 may be drilled through the through hole 611 to expose only the outer circumferential portion of the metal dome 500 with the adhesive 620.
- An adhesive film 800 having a through hole 810 formed therebetween may be interposed between the upper conductive plate 300 and the insulating cover film 600.
- the insulating cover film 600 and the solder mask 700 may be switched with each other according to the change of the installation position of the metal dome 500.
- the internal electrical contact portion has a sealed structure without being exposed to the outside, and in particular, there is an effect excellent in waterproofing.
- the metal dome 500 is located in the receiving groove 360 provided inside the insulating member 100, and when the metal dome 500 is pressurized, the internal air is discharged into the step space to increase the feel.
- the distance between the metal dome 500 and the upper conductive plate 300, the receiving hole 110 can be secured by a step so that it cannot penetrate, thereby preventing contact failure.
- the overall thickness can be formed, and the product configuration can be simplified to produce a low product at low cost.
- FIG. 1 is an exploded perspective view showing the configuration of the PC-type tact switch of the present invention.
- Figure 2 is a plan view of the assembled state of the present inventors PCB-type tact switch.
- FIG. 3 is a cross-sectional view taken along the line AA ′ of FIG. 2.
- FIG. 4 is a cross-sectional view taken along line BB ′ of FIG. 2.
- Figure 5 is an enlarged cross-sectional view showing the structure of each member just before the present invention is molded.
- FIG. 6 is a cross-sectional view illustrating a state in which a receiving groove and a through hole are formed in the state of FIG. 5.
- FIG. 7 is an enlarged cross-sectional view illustrating a process of pressing the upper conductive plate to a high pressure to closely contact the edge of the receiving groove and the upper surface of the insulating adhesive film.
- FIG. 8 is an enlarged cross-sectional view of an embodiment showing a structure in which a silicon adhesive is bonded to a contact portion of a metal dome and an insulating cover film.
- Figure 9 is an enlarged cross-sectional view showing an embodiment for blocking the penetration of water while opening the through hole in the insulating cover film and exposed the central portion of the metal dome using an adhesive on the bottom of the insulating cover film.
- FIG. 10 is an enlarged cross-sectional view illustrating an embodiment in which a metal dome is installed by switching the deformation direction of the upper conductive plate and the lower conductive plate to press the lower conductive plate into the receiving groove.
- 11 is a cross-sectional view showing the configuration of a conventional PC-type tact switch.
- the insulating member 100 of the PC-type tact switch of the present invention has a thin plate-like insulator formed therein, and the insulating film 111 is adhered to the upper surface thereof.
- the upper conductive plate 300 is positioned above the insulating member 100.
- the upper conductive plate 300 is deformed to a position of the accommodating hole 110 of the insulating member 100 and applied to the upper portion of the insulating adhesive film 200 as shown in FIG.
- the pressing groove 360 is formed by pressing.
- the upper conductive plate 300 is formed by an etching method, and a short circuit part 310 is formed to electrically short the outer periphery and the center, and the center part and the PCB of the upper side of the insulating member 100 are diagonally formed.
- the contact pad 320 is provided to make electrical contact by soldering.
- the lower conductive plate 400 having the relatively thin insulating adhesive film 200 coated thereon is positioned under the insulating member 100.
- the lower conductive plate 400 of the insulating adhesive film 200 is formed with a through hole 410 having a diameter smaller than that of the receiving hole 110, and the upper conductive plate 300 covered with the upper portion at the position of the through hole 410.
- a recess is formed toward the lower portion to form a central contact portion step 350.
- the upper conductive plate 300 and the lower conductive plate 400 are electrically shorted up and down by the insulating member 100 and the insulating adhesive film 200.
- the double-sided substrate having such a configuration performs copper plating in a state where the center through hole 410 is formed, and in the process of forming a short circuit at a required position by etching, the upper conductive plate 300 and the lower conductive plate ( A through hole 410 and a short circuit part that electrically connect the 400 are formed.
- the upper conductive plate 300 and the silver plate shape are kept intact, whereas the upper side of the lower conductive plate 400 is pressurized to a high pressure as opposed to the above embodiment.
- Protruding portion of the insulating adhesive film 200 coated on the lower conductive plate 400 on the lower conductive plate 400 may be designed to be pressed onto the upper conductive plate 300.
- the installation direction of the metal dome 500 is switched, and only the roles of the insulating cover film 600 and the solder mask 700 are switched to each other.
- the upper conductive plate 300-or the lower conductive plate 400- is convex toward the upper portion of the receiving groove 360 formed by the receiving hole 110 of the insulating member 100 in the space border thereof. And a good elasticity metal dome 500 is located.
- the edge portion of the metal dome 500 is connected to the outer peripheral point portion terminal 330 electrically by contacting the outside of the upper portion of the upper conductive plate 300 by the short circuit portion 310.
- the upper portion of the upper conductive plate 300 and the metal dome 500 covers the entire insulating insulating cover film 600 with the adhesive applied to the bottom to protect the inside from foreign matter or especially moisture.
- an adhesive film 800 having a through hole 810 may be interposed between the upper conductive plate 300 and the insulating cover film 600.
- the adhesive film 800 bonds the upper conductive plate 300 and the insulating blocking film 600 to each other, and the insulating blocking film 600 can be conveniently maintained in accordance with the height of the metal dome 500. It will play a role.
- the bottom surface of the insulating cover film 600, the adhesive is applied to the bottom can be completed by applying the silicone adhesive 610 as shown in Figure 8 in consideration of the position of the contact portion of the metal dome 500.
- the adhesive of the silicone component applied to the bottom surface of the insulating cover film 600 covers the entire metal dome 500 to prevent the touch from being reduced, and temporarily fixes the metal dome 500 by the viscosity of silicon to improve assemblability. The cost can be reduced.
- the metal dome 500 when the metal dome 500 is attached to the bottom surface and the switches are moved to the position where the switches are arranged, and placed in the accommodation groove 360 formed by the accommodation hole 110, the metal dome 500 does not need to be assembled one by one. There is an advantage that can be easily produced.
- the center portion of the insulation cover film 600 is opened, and the center of the metal dome 500 is drilled through the through hole 611 to expose the metal dome 500.
- Fixed to the adhesive tape may be temporarily fixed to the receiving groove 360 may be designed to allow mass production.
- a solder mask 700 is bonded to the bottom surface of the lower conductive plate 400 to cover a portion except the position requiring soldering as an insulator to complete a double-sided switch.
- the central portion of the metal dome 500 is electrically connected by the central contact portion 320.
- the metal dome 500 has an elastic force which is immediately returned by elasticity when the pressure is released.
- thermosetting insulating adhesive film 200 is positioned on the upper side of the copper plate for forming the lower conductive plate 400, and the through hole 410 is processed at the center thereof.
- the receiving hole 110 is dug is located on the upper portion of the insulating adhesive film 200, the conductive upper conductive plate 300 is disposed on the upper portion of the insulating film 100 and then thermally pressurized It is modified as shown in FIG.
- the bottom is a flat jig (JIG) and pressurized on the upper conductive plate 300
- the PVC is positioned and flowability is generated at high temperature and high pressure, so that the upper conductive substrate is pushed to the floor and the upper conductive substrate is pushed to the bottom. This is to be formed.
- the present invention having such a configuration has advantages in that it is excellent in waterproof since the upper and the lower holes of the inside and the opening are not exposed.
- the contact portion is brought into line contact by the central contact portion step 350 formed by the circumference of the through hole 410 instead of the contact portion at the center portion of the upper conductive plate 300. Stability is improved.
- the metal dome 500 is located in the receiving groove 360 formed through the insulating film 100, the product thickness is also thin, the position of the metal dome 500 is stable and assembled It is convenient to secure the quality because of the convenience.
Landscapes
- Push-Button Switches (AREA)
Abstract
Description
Claims (7)
- 얇은 판형상으로 전기가 통하지 않는 절연체로 형성되는 절연부재(100)와;통전이 가능한 전도체로 형성되어, 절연부재(100)의 상부면에 덮어지며 단락부(310)에 의해 중앙접점단자(320)와 외주접점단자(330)를 갖는 상부도전기판(300)과;상기 절연부재(100)의 하부면에는 절연접착필름(200)이 상부에 도포되고 스루홀(410)에 의해 상부기판(300)과 전기적으로 연결시키는 하부도전기판(400)과;사용자의 클릭에 의해 탄성 변형되며 상부도전기판(300)과 하부도전기판(400)을 전기적으로 접점 또는 단락시키는 메탈돔(500)과;상기 상부도전기판(300) 및 메탈돔(500)의 상부를 전체적으로 덮어서 내부를 보호하는 절연성 절연커버필름(600)와;상기 하부도전기판(400)의 저면에 접착되어 납땜을 필요로 한 위치를 제외한 부분을 절연체로 커버하는 절연성 솔더마스크(700)로 구성된 것에 있어서;상기 절연부재(100) 및 절연필름(111)을 관통하여 된 수용홀(110)에 의해 수용홈(360)이 형성되게 하고, 이 수용홈(360) 내에 메탈돔(500)이 위치되도록 구성하는 것을 특징으로 하는 피씨비 택트 스위치.
- 청구항 1에 있어서, 상기 메탈돔(500)의 중앙부에 위치한 절연커버필름(600)의 저면에 실리콘 고무를 도포하는 것을 특징으로 하는 피씨비 택트 스위치.
- 청구항 1에 있어서, 상기 절연커버필름(600)의 중앙부를 개방하여 메탈돔(500)의 중앙은 노출되게 통과구멍(611)을 뚫어 메탈돔(500)의 외주부만 접착제(620)로 접착시키는 것을 특징으로 하는 피씨비 택트 스위치.
- 청구항 1에 있어서, 상기 절연부재(100)의 상부면에는 절연필름(111)이 더 개재됨을 특징으로 하는 피씨비 택트 스위치.
- 청구항 1에 있어서, 상기 상부도전기판(300)의 중앙 접점부는 중앙접점부단차(350)에 의해 선접촉됨을 특징으로 하는 피씨비 택트 스위치.
- 청구항 1 내지 청구항 5중 어느 한 항에 있어서, 상기 상부도전기판(300)과 절연커버필름(600) 사이에는 통과공(810)이 뚫어진 접착필름(800)을 개재시키는 것을 특징으로 하는 피씨비 택트 스위치.
- 청구항 1 내지 청구항 5중 어느 한 항에 있어서, 상기 하부도전기판(400)을 가압하여 수용홀(110)의 테두리와 절연접착필름(200)의 돌출부가 상부도전기판(300)의 저면에 압착시켜 하부도전기판(400)의 중앙부에 메탈돔(500)이 위치되도록 하는 것을 특징으로 하는 피씨비 택트 스위치.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013520640A JP5566536B2 (ja) | 2010-07-28 | 2011-07-11 | Pcbタクトスイッチ |
CN201180036637.0A CN103026441B (zh) | 2010-07-28 | 2011-07-11 | Pcb轻触开关 |
US13/812,463 US20140144765A1 (en) | 2010-07-28 | 2011-07-11 | Pcb tact switch |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0072738 | 2010-07-28 | ||
KR1020100072738A KR20120011136A (ko) | 2010-07-28 | 2010-07-28 | 피씨비 택트 스위치 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012015184A2 true WO2012015184A2 (ko) | 2012-02-02 |
WO2012015184A3 WO2012015184A3 (ko) | 2012-05-03 |
Family
ID=45530571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/005052 WO2012015184A2 (ko) | 2010-07-28 | 2011-07-11 | 피씨비 택트 스위치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20140144765A1 (ko) |
JP (1) | JP5566536B2 (ko) |
KR (1) | KR20120011136A (ko) |
CN (1) | CN103026441B (ko) |
WO (1) | WO2012015184A2 (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104903986A (zh) * | 2012-11-19 | 2015-09-09 | 波肯斯有限公司 | 一种薄膜开关及其制造方法 |
KR101388589B1 (ko) | 2012-12-28 | 2014-04-23 | 박경춘 | 멤브래인 스위치 모듈 및 그 제조방법 |
KR101350482B1 (ko) * | 2013-06-14 | 2014-01-15 | (주)디오코리아 | 보스 보호형 택트 스위치 |
CN103903886A (zh) * | 2014-04-02 | 2014-07-02 | 昆山市张浦镇佳聚辉电子厂 | 一种电子产品按键装置 |
KR101516297B1 (ko) * | 2014-11-27 | 2015-05-04 | 김경희 | 전자부품용 택트 스위치 |
CN104465171B (zh) * | 2014-12-10 | 2016-09-07 | 深圳市东强精密塑胶电子有限公司 | 一种超薄型轻触开关制造方法 |
US10256057B2 (en) | 2015-03-05 | 2019-04-09 | Dolby Laboratories Licensing Corporation | Mechanical structure for button on satellite microphone |
CN105845468B (zh) * | 2016-05-20 | 2018-05-29 | 浙江虹穗精密电子有限公司 | 一种触动开关及其制造方法 |
JP6707710B2 (ja) * | 2017-02-28 | 2020-06-10 | 株式会社フジクラ | 荷重検知センサ |
KR101970600B1 (ko) * | 2017-09-06 | 2019-04-19 | 주식회사 로스윈 | 돔 스위치 제조방법 |
CN108346537B (zh) * | 2018-02-06 | 2020-02-18 | 维沃移动通信有限公司 | 一种按键结构及终端 |
DE102020126777A1 (de) | 2020-10-13 | 2022-04-14 | Valeo Schalter Und Sensoren Gmbh | Eingabevorrichtung für ein Kraftfahrzeug mit einer spannungsbasierten Fehlererkennung |
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KR200340101Y1 (ko) * | 2003-08-28 | 2004-01-31 | 금승호 | 택트 스위치 구조 |
KR100607043B1 (ko) * | 2004-07-22 | 2006-08-01 | 이수호 | 피씨비 택트 스위치 |
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JPH0662433U (ja) * | 1993-02-15 | 1994-09-02 | 日本航空電子工業株式会社 | 防水型パネルスイッチユニット |
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2010
- 2010-07-28 KR KR1020100072738A patent/KR20120011136A/ko not_active Application Discontinuation
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2011
- 2011-07-11 CN CN201180036637.0A patent/CN103026441B/zh not_active Expired - Fee Related
- 2011-07-11 WO PCT/KR2011/005052 patent/WO2012015184A2/ko active Application Filing
- 2011-07-11 JP JP2013520640A patent/JP5566536B2/ja not_active Expired - Fee Related
- 2011-07-11 US US13/812,463 patent/US20140144765A1/en not_active Abandoned
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---|---|---|---|---|
KR200340101Y1 (ko) * | 2003-08-28 | 2004-01-31 | 금승호 | 택트 스위치 구조 |
KR100607043B1 (ko) * | 2004-07-22 | 2006-08-01 | 이수호 | 피씨비 택트 스위치 |
KR100837892B1 (ko) * | 2006-08-24 | 2008-06-13 | 이수호 | 피씨비 택트 스위치 |
KR20100100183A (ko) * | 2009-03-05 | 2010-09-15 | 이수호 | 피씨비 택트 스위치 |
Also Published As
Publication number | Publication date |
---|---|
US20140144765A1 (en) | 2014-05-29 |
JP5566536B2 (ja) | 2014-08-06 |
CN103026441A (zh) | 2013-04-03 |
CN103026441B (zh) | 2015-05-13 |
KR20120011136A (ko) | 2012-02-07 |
WO2012015184A3 (ko) | 2012-05-03 |
JP2013534710A (ja) | 2013-09-05 |
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