WO2012013521A1 - Optoelektronisches halbleiterbauelement und zugehöriges herstellverfahren durch direktverschweissung von glasgehäusebauteilen mittels ultrakurzpulslaser ohne glaslot - Google Patents
Optoelektronisches halbleiterbauelement und zugehöriges herstellverfahren durch direktverschweissung von glasgehäusebauteilen mittels ultrakurzpulslaser ohne glaslot Download PDFInfo
- Publication number
- WO2012013521A1 WO2012013521A1 PCT/EP2011/062145 EP2011062145W WO2012013521A1 WO 2012013521 A1 WO2012013521 A1 WO 2012013521A1 EP 2011062145 W EP2011062145 W EP 2011062145W WO 2012013521 A1 WO2012013521 A1 WO 2012013521A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- glass
- optoelectronic semiconductor
- components
- laser
- semiconductor element
- Prior art date
Links
- 239000011521 glass Substances 0.000 title claims abstract description 33
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 230000005693 optoelectronics Effects 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 238000003466 welding Methods 0.000 title claims description 10
- 229910000679 solder Inorganic materials 0.000 title description 4
- 239000000758 substrate Substances 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000012044 organic layer Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004571 lime Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/20—Uniting glass pieces by fusing without substantial reshaping
- C03B23/24—Making hollow glass sheets or bricks
- C03B23/245—Hollow glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/206—Laser sealing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/20—Uniting glass pieces by fusing without substantial reshaping
- C03B23/203—Uniting glass sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
Definitions
- the invention is based on an optoelectronic semiconductor component according to the preamble of claim 1. It also describes an associated manufacturing method.
- DE-A 10118630 and DE-A 10159544 disclose LEDs with glass components.
- JP 2001-266800 describes a method for hot laser welding of two glass moldings. From US-A 6,936,963 a method for the encapsulation of a component on the basis of organ safely semiconductor is already known to be ⁇ standing of a transparent substrate having thereon electrodes, luminescent layers of different colors and a counter electrode.
- the semi-conductor device ⁇ is encapsulated airtightly by a casing which is connected to the substrate by adhesive.
- Another alternative is the use of an IR diode laser or C02 laser in addition to the adhesive.
- An object of the present invention is, in the case of an optoelectronic semiconductor component according to the preamble of claim 1, a permanent and hermetic one Encapsulation of sensitive components in glass create.
- the present invention solves to provide an unaffected by temperature and weather-resistant encapsulation for optoe ⁇ lectronic semiconductor devices the problem.
- a hermetically sealed encapsulation of components such as organic layers in OLEDs or other sensitive components in LEDs is realized today by means of glass solder or or ⁇ ganic adhesives between the glass parts to be joined.
- Organic LEDs (OLED) in particular displays constructed of organic LEDs, consist of a layer package of organic layers (the actual OLED) and metallic layers for contacting (electrodes) which are located between two thin glass plates (eg 0.5 to 1.0 mm thick). These form the bottom (substrate) and the lid of a housing.
- the housing may also have sidewalls.
- a method was developed to stably bond the substrate and the remaining housing parts made of glass, between which the OLED is located, and to seal the OLED in a gastight manner without the aid of glass solder.
- LEDs are usually prepared Einbezie ⁇ hung organic components, for example, in particular this applies to board, lens or conversion elements of the LED.
- an organic adhesive is used, for example, to attach a glass lid or glue a conversion element on a chip.
- Such organic components have a poor rmeleitmeld Wä- and low UV resistance, into ⁇ particular as regards the resistance to radiation in the range below 420 nm. In addition, they are sensitive to temperature. Ultimately, all this leads to low efficiency because the LED is discolored or operated at too high a temperature.
- a durable and hermetic up ⁇ te connection of two components made of glass is achieved by a direct fusion of the glass mold parts.
- the direct laser welding of the glass moldings results in a permanent and hermetic connection between the two glass moldings.
- the laser welding process can be carried out at room temperature or at elevated temperature.
- a thus produced optoelectronic semiconductor ⁇ component is in particular an OLED.
- Optoelectronic semiconductor component with a light source, a housing and electrical circuits, wherein the optoelectronic semiconductor component ⁇ components gefer ⁇ manufactured from glass, characterized in that at least two components touch mutually adapted to nz vom GRE, where they are directly welded to each other.
- Optoelectronic semiconductor component according to claim ⁇ 1 characterized in that the components are components of the housing. 3.
- the method according to claim 4 characterized in that the laser pulses are between 100 fs and 500 ps long, in particular between 500 fs and 100 ps. 6. The method according to claim 4, characterized in that the repetition rate of the laser pulses is between 10 kHz and 2 MHz.
- FIG. 1 shows an LED with glass cover in cross section
- FIG. 2 shows an OLED in cross section
- Figure 3 is a schematic diagram of a weld seen from above;
- Figure 4 is a plan view of an OLED
- Figure 5 is a side view of an OLED.
- FIG. 1 schematically shows a schematic diagram of an LED 1 in which a laser direct welding of glass moldings is used.
- the LED has a housing 2, in which a chip 3 is seated.
- the housing 2 of the LED is joined by means of ⁇ Laserdirektversch bulkung.
- the glass molded parts are an approximately rectangular bottom part 5 and a similarly shaped ceiling part 6. These are on seen ⁇ de 7 in contact.
- FIG. 2 schematically shows an OLED 10, which in principle has a similar structure to the LED from FIG. 1.
- the lid 11 is a glass substrate on which the OLED layers and the electrodes are applied (not shown separately).
- the bottom part 12 is trough-shaped. Separate side walls omitted.
- the beam 9 of an ultrashort pulse laser for example a picosecond laser, is focused by means of lens 8 in such a way that its focus lies at the boundary 15 between the cover part 11 and the bottom part 12.
- the ultrakur ⁇ zen laser pulses, this limit can be 15 reliably sealed by glass sealing.
- the melted region of the border region 15 between the bottom 12 and the cover 11 can be sealed simultaneously at several points.
- FIG 3 shows a sketch of a welded glass composite system 20.
- Both the first component 21 and the second component 22 is a plate made of glass. Both parts are welded together at room temperature by ultrashort laser pulses (23).
- the method of glass direct welding by means of a laser is particularly suitable for soft glasses, since in this case only low stresses occur in the glass.
- hard glass or quartz glass can also be combined with one another or with their own or, in particular, with soft glass.
- FIG. 4 shows a top view of a typical OLED.
- the Sei ⁇ th view is shown in Figure 5.
- the OLED 31 be ⁇ is composed of a substrate 32 on which an OLED array of pixels 33 is applied. This consists in a known manner of electrodes 34, electroluminescent organic layers, which are applied in layers, and counterelectrodes 39. Of the electrodes 34 and counter-electrodes 39 each of the leading conductor leads are visible. The sealing of these connections may possibly also by ultra-short laser pulses accomplished ⁇ to.
- the housing is reali ⁇ Siert for example through a transparent in the visible and near IR flat glass as the cover 35, the latter having a drawn-down side wall 36th
- a similar side wall 37 is the bottom part 32.
- the side walls 36 and 37 form a angiolie ⁇ constricting interface, which are welded together by means of ultra-short laser pulses.
- the manufacturing process proceeds, for example so, that is used as substrate and cover respectively a flat glass, as the example ⁇ -lime glass of the display Fa. Merck.
- a typical seam comprises a boundary zone with a thickness of 5 to 50 ⁇ m, which is produced at room temperature by the ultra-short laser by means of fast pulses.
- the pulse lengths move in the picosecond range at repetition rates of up to several hundred kilohertz.
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- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Electroluminescent Light Sources (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013521055A JP2013535393A (ja) | 2010-07-28 | 2011-07-15 | オプトエレクトロニクス半導体素子及びガラスろうを用いない超短波パルスレーザーを用いたガラスハウジング部材の直接融着によるその製造方法 |
CN2011800224878A CN102884015A (zh) | 2010-07-28 | 2011-07-15 | 光电半导体元器件和所属的不使用玻璃焊剂通过借助超短脉冲激光直接焊接玻璃壳体组件的制造方法 |
US13/812,809 US20130126938A1 (en) | 2010-07-28 | 2011-07-15 | Optoelectronic Semiconductor Element and Associated Method of Production by Direct Welding of Glass Housing Components by Means of Ultra Short Pulsed Laser without Glass Solder |
KR1020137004645A KR20130094308A (ko) | 2010-07-28 | 2011-07-15 | 유리 땜납 없이 극초단 펄스 레이저에 의한 유리 하우징 컴포넌트들의 직접 용접에 의한 광전자 반도체 엘리먼트 및 연관된 생산 방법 |
EP11743473A EP2523914A1 (de) | 2010-07-28 | 2011-07-15 | Optoelektronisches halbleiterbauelement und zugehöriges herstellverfahren durch direktverschweissung von glasgehäusebauteilen mittels ultrakurzpulslaser ohne glaslot |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010038554.9 | 2010-07-28 | ||
DE102010038554A DE102010038554A1 (de) | 2010-07-28 | 2010-07-28 | Optoelektronisches Halbleiterbauelement und zugehöriges Herstellverfahren |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012013521A1 true WO2012013521A1 (de) | 2012-02-02 |
Family
ID=44630156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2011/062145 WO2012013521A1 (de) | 2010-07-28 | 2011-07-15 | Optoelektronisches halbleiterbauelement und zugehöriges herstellverfahren durch direktverschweissung von glasgehäusebauteilen mittels ultrakurzpulslaser ohne glaslot |
Country Status (7)
Country | Link |
---|---|
US (1) | US20130126938A1 (de) |
EP (1) | EP2523914A1 (de) |
JP (1) | JP2013535393A (de) |
KR (1) | KR20130094308A (de) |
CN (1) | CN102884015A (de) |
DE (1) | DE102010038554A1 (de) |
WO (1) | WO2012013521A1 (de) |
Cited By (1)
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JP2015535788A (ja) * | 2012-08-28 | 2015-12-17 | エムベー−ミクロテック アクチェンゲゼルシャフト | 電子デバイス用の密閉型ハウジングの生産方法 |
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JP2015063416A (ja) * | 2013-09-24 | 2015-04-09 | 三星ダイヤモンド工業株式会社 | レーザ光によるガラス基板融着方法及びレーザ加工装置 |
JP2015063417A (ja) * | 2013-09-24 | 2015-04-09 | 三星ダイヤモンド工業株式会社 | レーザ光によるガラス基板融着方法及びレーザ加工装置 |
JP2015063418A (ja) * | 2013-09-24 | 2015-04-09 | 三星ダイヤモンド工業株式会社 | レーザ光によるガラス基板融着方法及びレーザ加工装置 |
CN104761132B (zh) * | 2014-01-02 | 2017-05-31 | 上海微电子装备有限公司 | 一种双光束耦合的激光辅助玻璃料封装系统和方法 |
TWI574442B (zh) * | 2014-04-10 | 2017-03-11 | 友達光電股份有限公司 | 顯示面板 |
KR20160147833A (ko) | 2014-04-21 | 2016-12-23 | 코닝 인코포레이티드 | 고 열팽창 유리 및 유리-세라믹의 레이저 용접 |
FI125935B (fi) * | 2014-09-26 | 2016-04-15 | Primoceler Oy | Menetelmä optisen komponentin suojana käytettävän läpinäkyvän kappaleen valmistamiseksi |
DE102014116778A1 (de) * | 2014-11-17 | 2016-05-19 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Konversionselements, Konversionselement sowie optoelektronisches Bauelement mit einem solchen Konversionselement |
CN106299157B (zh) * | 2015-05-24 | 2018-03-02 | 上海微电子装备(集团)股份有限公司 | 一种激光加热封装系统及方法 |
JP2017186204A (ja) * | 2016-04-07 | 2017-10-12 | 英興株式会社 | シリカガラス溶接方法 |
CN106449439B (zh) * | 2016-09-27 | 2018-11-02 | 华中科技大学 | 一种玻璃芯片封装方法 |
KR102587002B1 (ko) * | 2017-11-15 | 2023-10-10 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
CN107892469A (zh) * | 2017-12-15 | 2018-04-10 | 华中科技大学 | 一种多激光束合束焊接玻璃材料的方法及装备 |
KR20190089602A (ko) | 2018-01-23 | 2019-07-31 | 주식회사 비에스피 | 레이저 용접 모니터링 장치 및 이의 방법 |
KR102089584B1 (ko) | 2018-02-06 | 2020-03-17 | 주식회사 비에스피 | 유리기판 레이저 용접장치 |
KR102566338B1 (ko) | 2018-04-13 | 2023-08-11 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
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DE102018220477A1 (de) | 2018-11-28 | 2020-05-28 | Trumpf Laser Gmbh | Verfahren zum Laserschweißen einer Lichtleitfaser in einem Lochelement mittels eines UKP-Laserstrahls sowie zugehöriges optisches Element |
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DE112020002981A5 (de) * | 2019-06-21 | 2022-03-03 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Bearbeiten eines Werkstücks |
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CN110723900A (zh) * | 2019-09-16 | 2020-01-24 | 深圳市裕展精密科技有限公司 | 玻璃复合件、玻璃复合件的制备方法以及激光焊接设备 |
CN110627380A (zh) * | 2019-09-16 | 2019-12-31 | 深圳市裕展精密科技有限公司 | 玻璃复合件、玻璃复合件的制备方法以及激光焊接设备 |
CN110989101A (zh) * | 2019-12-10 | 2020-04-10 | 武汉光谷信息光电子创新中心有限公司 | 光波导器件 |
KR20210091856A (ko) | 2020-01-14 | 2021-07-23 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
DE102020104613A1 (de) | 2020-02-21 | 2021-08-26 | Schott Ag | Hermetisch verschlossene Glasumhäusung |
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- 2011-07-15 JP JP2013521055A patent/JP2013535393A/ja active Pending
- 2011-07-15 EP EP11743473A patent/EP2523914A1/de not_active Withdrawn
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Also Published As
Publication number | Publication date |
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CN102884015A (zh) | 2013-01-16 |
KR20130094308A (ko) | 2013-08-23 |
JP2013535393A (ja) | 2013-09-12 |
DE102010038554A1 (de) | 2012-02-02 |
EP2523914A1 (de) | 2012-11-21 |
US20130126938A1 (en) | 2013-05-23 |
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