WO2012011562A1 - 光照射デバイス、光照射モジュール、および印刷装置 - Google Patents
光照射デバイス、光照射モジュール、および印刷装置 Download PDFInfo
- Publication number
- WO2012011562A1 WO2012011562A1 PCT/JP2011/066690 JP2011066690W WO2012011562A1 WO 2012011562 A1 WO2012011562 A1 WO 2012011562A1 JP 2011066690 W JP2011066690 W JP 2011066690W WO 2012011562 A1 WO2012011562 A1 WO 2012011562A1
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- WIPO (PCT)
- Prior art keywords
- heat transfer
- transfer member
- light irradiation
- light emitting
- light
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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- B41J11/0015—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
- B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
- B41J11/0021—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using irradiation
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- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
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- H01L33/64—Heat extraction or cooling elements
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Definitions
- the present invention relates to a light irradiation device, a light irradiation module, and a printing apparatus used for curing an ultraviolet curable resin or a paint.
- ultraviolet irradiation devices have been widely used for the purpose of fluorescence reaction observation in medical and bio fields, sterilization applications, adhesion of electronic components, ultraviolet curing resin and ink curing.
- a high-pressure mercury lamp is used as a lamp light source for UV irradiation devices used for curing UV curable resins used for bonding small parts in the field of electronic components, etc., and UV curable ink used for printing.
- metal halide lamps are used.
- the present invention has been made in view of the above problems, and even when heat generation from a light emitting element is increased, a light irradiation device and a light having a relatively high heat dissipation property while ensuring the reliability of the substrate.
- An object is to provide an irradiation module and a printing apparatus.
- a light irradiation device includes a light emitting element and a base on which the light emitting element is mounted.
- the base body includes a laminated body in which a plurality of insulating layers are laminated, a first heat transfer member disposed in the laminated body so that a part thereof is located directly below the light emitting element, and the base body in a plan view. And a second heat transfer member disposed between the insulating layers so as to surround the first heat transfer member.
- the heat conductivity of the first heat transfer member and the second heat transfer member is higher than the heat conductivity of the laminate.
- a light irradiation module includes the plurality of light irradiation devices described above and a heat radiating member on which the plurality of light irradiation devices are placed.
- a printing apparatus includes a printing unit that performs printing on a recording medium, and the above-described light irradiation module that irradiates light onto the printed recording medium.
- the light irradiation device the light irradiation module, and the printing apparatus described above, for example, even if a relatively large number of light emitting elements are mounted on the substrate, the heat generated by driving the light emitting elements can be effectively dissipated. As a result, the illuminance of the light emitting element can be made relatively high, and the illuminance variation between the light emitting elements in the substrate can be made relatively small.
- FIG. 1 is a plan view of a light irradiation device according to the first embodiment of the present invention.
- 2 is a cross-sectional view taken along line 1I-1I in the light irradiation device shown in FIG.
- FIG. 3 is a perspective view for explaining the arrangement of the first heat transfer member and the second heat transfer member constituting the light irradiation device according to the first embodiment of the present invention.
- FIG. 4 is a perspective view for explaining the arrangement of electrical wirings constituting the light irradiation device according to the first embodiment of the present invention.
- FIG. 5 is a plan view of a light irradiation device according to the second embodiment of the present invention.
- FIG. 6 is a cross-sectional view taken along line 5I-5I in the light irradiation device shown in FIG.
- FIG. 7 is a plan view of a light irradiation module using the light irradiation device of FIG. 8 is a cross-sectional view taken along line 7I-7I of the light irradiation module shown in FIG.
- FIG. 9 is a top view of a printing apparatus using the light irradiation module shown in FIG. 10 is a side view of the printing apparatus shown in FIG.
- FIG. 11 is a cross-sectional view showing a first modification of the light irradiation device of FIG. 12 is a cross-sectional view showing a second modification of the light irradiation device of FIG.
- FIG. 13 is a cross-sectional view showing a third modification of the light irradiation device of FIG.
- FIG. 14 is a perspective view for explaining the arrangement of the electrode layers.
- FIG. 15 is a cross-sectional view showing a fourth modification of the light irradiation device in FIG. 1.
- FIG. 16 is a cross-sectional view showing a fifth modification of the light irradiation device in FIG. 1.
- FIG. 17 is a diagram illustrating the shape of the second heat transfer member.
- FIG. 18 is a diagram illustrating the arrangement position of the third heat transfer member that connects the second heat transfer members.
- the light irradiation device 1A according to the first embodiment of the present invention shown in FIGS. 1 and 2 is incorporated in a printing apparatus such as an offset printing apparatus or an inkjet printing apparatus that uses ultraviolet curable ink, and the ultraviolet curable ink is covered. It functions as an ultraviolet light generating light source of an ultraviolet irradiation module that cures the ultraviolet curable ink by irradiating the attached recording medium with ultraviolet rays.
- FIG. 1 A of light irradiation devices are arrange
- FIG. The plurality of light emitting elements 20 electrically connected to the connection pads 13 and the plurality of sealing materials 30 filled in the respective openings 12 and covering the light emitting elements 20 are provided.
- the base body 10 is provided with a stacked body 40 in which a plurality of first insulating layers 41 and second insulating layers 42 are stacked, and is disposed in the stacked body 40, and a plurality of light emitting elements 20 are mounted on the upper surface.
- the first insulating layer 41 includes, for example, an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, and resins such as epoxy resins and liquid crystal polymers (LCP). , Etc.
- the first heat transfer member 50a is a first heat transfer member such as copper (Cu), tungsten (W), molybdenum (Mo), silver (Ag), copper-tungsten (Cu-W), copper-molybdenum (Cu-Mo), or the like.
- One or a plurality of light-emitting elements 20 are placed on the upper surface exposed from the first insulating layer 41 (this book). 8 in the embodiment). Since the light emitting element 20 is thus placed on the upper surface of the exposed portion of the first heat transfer member 50a having a high thermal conductivity via an adhesive (not shown) such as an epoxy resin, the light emitting element 20 is driven. The generated heat can be dissipated well.
- the material of the first heat transfer member 50a is not limited to the above-described metal, and a metal filler such as gold (Au), silver (Ag), or copper (Cu) is added to a resin such as an epoxy resin, a silicone resin, or a polyimide resin. Or a carbon fiber reinforced carbon composite material (carbon carbon, carbon carbon composite material, reinforced carbon carbon (RCC)).
- a metal filler such as gold (Au), silver (Ag), or copper (Cu) is added to a resin such as an epoxy resin, a silicone resin, or a polyimide resin.
- a carbon fiber reinforced carbon composite material carbon carbon, carbon carbon composite material, reinforced carbon carbon (RCC)
- the heat generated by driving the light emitting element 20 can be effectively dissipated, and as a result, the illuminance of the light emitting element 20 can be made relatively high, and the illuminance variation between the light emitting elements in the substrate can be made relatively small. it can.
- the shape of the first heat transfer member 50a of the present embodiment is from the first main surface 11a side where the light emitting element 20 is mounted as shown in FIG. 2 to the second main surface 11b side facing the first main surface 11a.
- the cross-sectional area is increasing toward it. By setting it as such a shape, it becomes possible to thermally radiate the heat generated in the light emitting element 20 more efficiently.
- peeling may occur between the first heat transfer member 50a and the laminate 40. This is because when the light emitting element 20 generates heat, heat is generated at the interface between the first heat transfer member and the laminate 40 due to mismatch between the thermal expansion coefficient of the first heat transfer member 50 a and the thermal expansion coefficient of the laminate 40.
- the shape and dimensions of the first heat transfer member 50a are adjusted as appropriate so that no separation occurs at the interface between the first heat transfer member 50a and the laminate 40. That's fine.
- the second heat transfer member 50b like the first heat transfer member 50a, is copper (Cu), tungsten (W), molybdenum (Mo), silver (Ag), copper-tungsten (Cu-W),
- the second insulating layer 41 is made of a material having higher thermal conductivity than the first insulating layer 41 such as copper-molybdenum (Cu-Mo).
- the heat transfer member 50b is disposed so as to surround the first heat transfer member 50a.
- a three-layer second heat transfer member 50b is disposed so as to surround the first heat transfer member 50a. Note that the number of layers, the shape, and the like of the second heat transfer member 50b may be appropriately adjusted in consideration of the heat generation amount of the light emitting element 20 and the heat dissipation amount of the first heat transfer member 50a.
- the second heat transfer member 50b disposed between the same first insulating layers 41 is integrally formed, but may be formed in a divided shape, The second heat transfer member 50b disposed between the first insulating layers 41 may have a different shape.
- the material of the first heat transfer member 50a is not limited to the above-mentioned metal, but a resin such as an epoxy resin, a silicone resin, or a polyimide resin, such as gold (Au), silver (Ag), or copper (Cu).
- a metal filler may be contained, or a carbon fiber reinforced carbon composite material (carbon carbon, carbon carbon composite material, reinforced carbon carbon (RCC)) may be used.
- the electrical wiring 60 includes an anode wiring 61a connected to the anode of the light emitting element 20, a cathode wiring 61b connected to the cathode, and a common wiring 61c for connecting the anode and the cathode.
- FIG. 4 is a perspective view from the first main surface 11a side.
- These electrical wirings 60 are formed in a predetermined pattern from a conductive material such as tungsten (W), molybdenum (Mo), manganese (Mn), copper (Cu), and the like. It functions as a power supply wiring for supplying current or current from the light emitting element 20.
- the second insulating layer 42 stacked on the uppermost insulating layer 41 is formed with the opening 12 penetrating the second insulating layer 42. ing.
- the opening 12 has an inner peripheral surface 14 inclined so that the opening area of each opening 12 is larger on the first main surface 11a side of the base body 10 than the mounting surface of the light emitting element 20.
- it has a substantially rectangular shape.
- the opening shape is not limited to a rectangle, and may be a substantially circular shape.
- Such an opening 12 has a function of reflecting light emitted from the light emitting element 20 upward on the inner peripheral surface 14 to improve light extraction efficiency.
- the material of the second insulating layer 42 is a porous ceramic material having a relatively good reflectivity with respect to light in the ultraviolet region, such as an aluminum oxide sintered body, an oxide It is preferable to form with a zirconium sintered body and an aluminum nitride sintered body. Further, from the viewpoint of improving the light extraction efficiency, a metal reflection film may be provided on the inner peripheral surface 14 of the opening 12.
- Such openings 12 are arranged in a regular lattice pattern, for example, over the entire first main surface 11a of the base 10.
- the light emitting elements 20 can be arranged at a higher density, and the illuminance per unit area can be increased.
- Examples of the metal paste used as the internal wiring 60 include a paste containing a metal such as tungsten (W), molybdenum (Mo), manganese (Mn), and copper (Cu). Next, by firing the laminated body, the first heat transfer member 50a, the second heat transfer member 50b, and the green sheet, the metal paste, and the first heat transfer member 50a are fired together.
- the base body 10 having the internal wiring 60 can be formed.
- the first heat transfer member is metallized by filling the hole formed in the green sheet as a metal paste and firing it. May be performed.
- the following method can be considered as a method of manufacturing the base 10.
- a precursor sheet of a thermosetting resin is prepared.
- a plurality of precursor sheets are laminated so that lead terminals made of a metal material to be the internal wiring 60 are disposed between the precursor sheets and the lead terminals are embedded in the precursor sheets.
- the material for forming the lead terminal include metal materials such as Cu, Ag, Al, iron (Fe) -nickel (Ni) -cobalt (Co) alloy, and Fe—Ni alloy.
- a hole corresponding to the opening 12 and a hole in which the first heat transfer member 50a is disposed are formed in the precursor sheet by a method such as laser processing or etching, and then the substrate 10 is thermally cured. Is completed.
- connection pad 13 electrically connected to the light emitting element 20 and a connection material 15 such as a gold (Au) wire or an aluminum (Al) wire are connected to the connection pad 13.
- connection material 15 such as a gold (Au) wire or an aluminum (Al) wire are connected to the connection pad 13.
- the light emitting element 20 and the sealing material 30 for sealing the light emitting element 20 are provided.
- connection pad 13 is formed of a metal layer made of a metal material such as tungsten (W), molybdenum (Mo), manganese (Mn), and copper (Cu). If necessary, a nickel (Ni) layer, a palladium (Pd) layer, a gold (Au) layer, or the like may be further laminated on the metal layer.
- the connection pad 13 is connected to the light emitting element 20 by a bonding material 15 such as solder, gold (Au) wire, or aluminum (Al) wire.
- the light-emitting element 20 includes, for example, a light-emitting diode in which a p-type semiconductor layer and an n-type semiconductor layer made of a semiconductor material such as GaAs or GaN are stacked on an element substrate 21 such as a sapphire substrate, or a semiconductor layer is organic.
- An organic EL element made of a material is used.
- the light emitting element 20 includes a semiconductor layer 22 having a light emitting layer, Ag connected to a connection pad 13 disposed on the substrate 10 via a bonding material 15 such as a gold (Au) wire, an aluminum (Al) wire, or the like.
- Device electrodes 23 (not shown) and 24 made of the above metal materials are connected to the base 10 by wire bonding.
- the light emitting element 20 emits light having a predetermined wavelength in accordance with the current flowing between the element electrodes 23 and 24 with predetermined luminance, and emits the light to the outside directly or via the element substrate 21. As is well known, the element substrate 21 can be omitted.
- the light emitting element 20 and the connection pad 13 are connected by wire bonding using gold (Au) wire, aluminum (Al) wire, or the like, but is performed by flip chip bonding using solder or the like as the bonding material 15. May be.
- an LED that emits UV light whose wavelength peak of light emitted from the light emitting element 20 is 250 to 395 [nm] or less is employed. That is, in the present embodiment, a UV-LED element is employed as the light emitting element 20.
- the light emitting element 20 is formed by a conventionally known thin film forming technique.
- the sealing material 30 is formed of an insulating material such as a light-transmitting resin material, and prevents the entry of moisture from the outside by sealing the light emitting element 20 well, or from the outside. The impact is absorbed and the light emitting element 20 is protected.
- the sealing material 30 is a material having a refractive index between the refractive index of the element substrate 21 constituting the light emitting element 20 (in the case of sapphire: 1.7) and the refractive index of air (about 1.0), for example, By being formed of silicone resin (refractive index: about 1.4) or the like, the light extraction efficiency of the light emitting element 20 can be improved.
- the sealing material 30 is formed by mounting the light emitting element 20 on the base 10, filling a precursor such as a silicone resin into the opening 12, and curing it.
- Light Irradiation Module 5 and 6 show a light irradiation device 1B according to a second embodiment of the present invention.
- the basic configuration, function, and manufacturing method of the light irradiation device 1B are the same as those of the light irradiation device 1A described above. Therefore, the structure etc. which differ from the light irradiation device 1A of the light irradiation device 1B are demonstrated below.
- the difference of this embodiment from the first embodiment is the configuration of the substrate 10.
- the first insulating layer 41 is interposed between the light emitting element 20 and the first heat transfer member 50a, and the upper surface of the first heat transfer member 50a is the first insulating layer.
- the point covered with 41 is different from the first embodiment.
- the light emitting element 20 is placed on the upper surface of the first heat transfer member 50 a via the first insulating layer 41.
- the insulation between the light emitting element 20 and the 1st heat-transfer member 50a can be improved, and the electrical reliability of the light irradiation device 1B can be improved by extension.
- substrate 10 by the thermal expansion of the 1st heat-transfer member 50a can be reduced.
- the one smaller than the thickness of the 1st insulating layer which covers the 1st heat-transfer member 50a is preferable from a heat dissipation viewpoint.
- the first heat transfer member 50a is disposed in the hole corresponding to the opening 12, and It differs from the manufacturing method of 1st Embodiment by the point which bakes what laminated
- the first heat transfer member 50a is disposed in the hole corresponding to the opening 12, and It differs from the manufacturing method of 1st Embodiment by the point which laminates
- the light irradiation module 100 shown in FIGS. 7 and 8 includes a heat radiating member 110 and a plurality of light irradiating devices 1 ⁇ / b> A or light irradiating devices 1 ⁇ / b> B arranged on the heat radiating member 110.
- the heat radiation member 110 functions as a support for the plurality of light irradiation devices 1A or the light irradiation devices 1B.
- a material for forming the heat radiating member 110 a material having a high thermal conductivity is preferable. Examples thereof include various metal materials, ceramics, and resin materials.
- the heat radiating member 110 of this embodiment is made of copper.
- the light irradiation device 1A or the light irradiation device 1B is bonded to the heat radiation member 110 via an adhesive 70 such as a silicone resin or an epoxy resin, and is arranged on the heat radiation member 110 in a matrix.
- the adjacent light irradiation devices 1A or 1B are in close contact with each other.
- the heat generated from the light emitting element 20 is more likely to be trapped near the module center than near the module outer periphery, and therefore the first and the light irradiation devices 1A and 1B disposed near the module center.
- the second heat transfer members 50a and 50b and the first and second heat transfer members 50a and 50b of the light irradiation device 1A or the light irradiation device 1B disposed in the vicinity of the outer periphery of the module are made different from each other.
- the in-plane temperature of 100 can be made uniform.
- first and second heat transfer members 50a and 50b of the light irradiation module 1 disposed near the center of the module are disposed, and the light irradiation module 1 disposed on the outer periphery of the module.
- the first and second heat transfer members 50a and 50b are disposed in a relatively small amount.
- the light emission illuminance of the light emitting element 20 varies depending on the ambient temperature in the vicinity of the light emitting element 20, it is possible to make the in-plane illuminance of the light irradiation module 100 uniform by making the in-plane temperature of the light irradiation module 100 uniform. It becomes.
- the printing apparatus 200 includes a transport mechanism 210 for transporting the recording medium 250, an inkjet head 220 as a printing mechanism for printing on the transported recording medium 250, and an ultraviolet for the recording medium 250 after printing.
- the light irradiation module 100 which irradiates light
- the control mechanism 230 which controls light emission of the light irradiation module 100 are provided.
- the transport mechanism 210 is for transporting the recording medium 250 so as to pass through the inkjet head 220 and the light irradiation module 1 in this order.
- the transport mechanism 210 and the mounting table 211 are arranged to face each other and are rotatably supported. And a roller 212.
- the recording medium 250 supported by the mounting table 211 is sent between the pair of transport rollers 212, and the transport roller 212 is rotated to send the recording medium 250 in the transport direction.
- the inkjet head 220 has a function of attaching a photosensitive material to the recording medium 250 conveyed through the conveyance mechanism 210.
- the ink-jet head 220 is configured to eject droplets containing the photosensitive material toward the recording medium 250 and adhere to the recording medium 250.
- ultraviolet curable ink is employed as the photosensitive material.
- the photosensitive material include a photosensitive resist and a photocurable resin in addition to the ultraviolet curable ink.
- a line-type inkjet head is employed as the inkjet head 220.
- the inkjet head 220 has a plurality of ejection holes 220a arranged in a line, and is configured to eject ultraviolet curable ink from the ejection holes 220a.
- the inkjet head 220 ejects ink from the ejection holes 220a to the recording medium 250 conveyed in a direction orthogonal to the arrangement of the ejection holes 220a, and deposits the ink on the recording medium 250, thereby recording the recording medium. 250 is printed.
- a line-type inkjet head has been described as an example of the printing mechanism, but the present invention is not limited to this.
- a serial-type inkjet head may be employed, A serial type spray head may be employed.
- an electrostatic head that accumulates static electricity of the recording medium 250 and attaches the photosensitive material with the static electricity may be employed, or the recording medium 250 is immersed in a liquid photosensitive material and the photosensitive medium is used.
- An immersion apparatus for attaching a conductive material may be employed.
- a brush, a brush, and a roller may be employed as the printing mechanism.
- the light irradiation module 100 has a function of exposing the recording medium 250 to which the photosensitive material is adhered, which is transported through the transport mechanism 210.
- the light irradiation module 100 is provided on the downstream side in the transport direction with respect to the inkjet head 220.
- the light emitting element 20 has a function of exposing a photosensitive material attached to the recording medium 250.
- the control mechanism 230 has a function of controlling the light emission of the light irradiation module 100.
- the memory of the control mechanism 230 stores information indicating light characteristics that make it relatively good to cure the ink droplets ejected from the inkjet head 220. Specific examples of the stored information include wavelength distribution characteristics suitable for curing ejected ink droplets, and numerical values representing emission intensity (emission intensity in each wavelength range).
- the control mechanism 230 by including the control mechanism 230, the magnitude of the drive current input to the plurality of light emitting elements 20 can be adjusted based on the stored information of the control mechanism 230. Therefore, according to the printing apparatus 200, it is possible to irradiate light with an appropriate amount of light according to the characteristics of the ink used, and it is possible to cure the ink droplets with relatively low energy light.
- the transport mechanism 210 transports the recording medium 250 in the transport direction.
- the inkjet head 220 discharges ultraviolet curable ink to the recording medium 250 being conveyed, and causes the ultraviolet curable ink to adhere to the surface of the recording medium 250.
- the ultraviolet curable ink to be adhered to the recording medium 250 may be adhered to the entire surface, partially adhered, or adhered in a desired pattern.
- the ultraviolet curable ink adhered to the recording medium 250 is irradiated with ultraviolet rays emitted from the light irradiation module 100 to cure the ultraviolet curable ink.
- the printing apparatus 200 can enjoy the effects of the light irradiation module 100. Therefore, in the printing apparatus 200, since the in-plane temperature distribution of the light irradiation module 100 due to heat generated by the light emitting element 20 can be made relatively small, the illuminance variation in the light irradiation module surface can be kept relatively small, As a result, it is possible to irradiate the recording medium 250 with ultraviolet rays substantially uniformly over a wide range. Therefore, the printing apparatus 200 can stably irradiate the photosensitive material with ultraviolet rays.
- the printing apparatus 200 of the present embodiment since the light irradiation module 100 has a relatively small in-plane illuminance variation, the light irradiation device 1A or the light irradiation device 1B can be disposed close to the recording medium 250. Therefore, this printing apparatus 200 is suitable for downsizing.
- the first heat transfer member 50a and the second heat transfer member 50b of the light irradiation device 1A may be connected.
- the heat emitted from the light emitting element 20 is effectively radiated from the first heat transfer member 50a to the second heat transfer member 50b, so that the heat dissipation can be further improved.
- an electrode layer 62 connected to either one of the anode wiring 61a and the cathode wiring 61b of the light irradiation device 1A may be provided. You may also use as the heat-transfer member 50b.
- FIG. 14 shows how the electrode layer 62 is arranged as a perspective view from the first main surface 11a side. By providing the electrode layer 62 in this manner, the cross-sectional area of the electric wiring 60 can be increased, and the power supply can be stabilized. Further, by using the electrode layer 62 also as the second heat transfer member 50b, more heat transfer members can be disposed in the stacked body 40 having the same volume, and heat dissipation can be further improved.
- the second heat transfer member 50b having the same volume can be disposed even if the volume of the stacked body 40 is reduced.
- the light irradiation device 1A and the light irradiation module 100 can be downsized.
- the first heat transfer member 50a of the light irradiation device 1A may be exposed from the second main surface 11b.
- fever from the light emitting element 20 can be thermally radiated more effectively.
- the second heat transfer member 50b of the light irradiation device 1A may be disposed between the first heat transfer member 50a and the second main surface 11b. With such a configuration, the heat generated from the light emitting element 20 can be more effectively generated.
- the second heat transfer member 50b of the light irradiation device 1A is disposed in the center of the base 10 where the temperature is increased by heat generated from the light emitting element 20 as shown in FIG. The two heat transfer members 50b may not be provided. By setting it as such a structure, the temperature variation in the surface of the light irradiation device 1A can be made comparatively small.
- the third heat transfer member 50c is used. 18 may be made smaller at the outer peripheral portion of the base body 10 than at the central portion of the base body 10 as shown in FIG. This is because the heat of the central portion of the base 10 can be radiated more effectively by adopting such a configuration.
- the size of the first heat transfer member 50a disposed on the outer peripheral portion of the base body 10 is larger than the size of the first heat transfer member 50a disposed on the center portion of the base body 10. By making it smaller, the heat is dissipated better near the center of the substrate 10, and the in-plane temperature variation of the light irradiation device 1A can be made relatively small.
- the thermal conductivity of the second heat transfer member 50b is higher than the thermal conductivity of the first heat transfer member 50a. By doing so, heat generated from the light emitting element 20 is transferred from the first heat transfer member to the second heat transfer member 50b, and can be effectively dissipated.
- the thermal expansion coefficient of the first heat transfer member 50a is preferably closer to the thermal expansion coefficient of the first insulating layer 41 than the thermal expansion coefficient of the second heat transfer member 50b.
- One may be connected to the heat radiating member 110 via the third heat transfer member 50c.
- the heat radiation effect can be further enhanced.
- the embodiment of the printing apparatus 200 is not limited to the above embodiment.
- a so-called offset printing type printer that rotates a shaft-supported roller and conveys a recording medium along the roller surface may exhibit the same effect.
- the light irradiation module 100 cures, for example, a photo-curing resin spin-coated on the surface of the object. It can also be applied to the curing of various types of photo-curing resins such as dedicated devices. Moreover, you may use the light irradiation module 100 for the irradiation light source etc. in an exposure apparatus, for example.
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Abstract
Description
図1および図2に示す本発明の第1実施形態に係る光照射デバイス1Aは、紫外線硬化型インクを使用するオフセット印刷装置やインクジェット印刷装置等の印刷装置に組み込まれ、紫外線硬化型インクが被着された記録媒体に紫外線を照射することで紫外線硬化型インクを硬化させる紫外線照射モジュールの紫外線発生光源として機能する。
図5および図6に本発明の第2実施形態に係る光照射デバイス1Bを示す。光照射デバイス1Bの基本的な構成、機能および製造方法は、上述した光照射デバイス1Aと同じである。よって、光照射デバイス1Bの、光照射デバイス1Aと異なる構成等について以下に説明する。
図7および図8に示す光照射モジュール100は、放熱用部材110と、該放熱用部材110に配列された複数の光照射デバイス1Aまたは光照射デバイス1Bと、を備えている。
本発明の印刷装置の実施形態として、図9および図10に示した印刷装置200を例に挙げて説明する。この印刷装置200は、記録媒体250を搬送するための搬送機構210と、搬送された記録媒体250に印刷を行うための印刷機構としてのインクジェットヘッド220と、印刷後の記録媒体250に対して紫外光を照射する、上述した光照射モジュール100と、該光照射モジュール100の発光を制御する制御機構230と、を備えている。
10 基体
11a 第1主面
11b 第2主面
12 開口部
13 接続パッド
14 内周面
15 接合材
20 発光素子
21 素子基板
22 半導体層
23、24 素子電極
30 封止材
40 積層体
41 第1の絶縁層
42 第2の絶縁層
50a 第1の伝熱部材
50b 第2の伝熱部材
50c 第3の伝熱部材
60 電気配線
61a アノード配線
61b カソード配線
61c 共通配線
62 電極層
70 接着剤
100 光照射モジュール
110 放熱用部材
200 印刷装置
210 搬送機構
211 載置台
212 搬送ローラ
220 インクジェットヘッド
220a 吐出孔
250 記録媒体
Claims (15)
- 発光素子と、該発光素子が載置された基体とを備え、
該基体は、複数の絶縁層が積層されてなる積層体と、一部が前記発光素子の直下に位置するように前記積層体内に配設されている第1の伝熱部材と、平面視で該第1の伝熱部材を取り囲むように前記絶縁層間に配設された第2の伝熱部材とを有し、
前記第1の伝熱部材および前記第2の伝熱部材の熱伝導率は、前記積層体の熱伝導率よりも高い光照射デバイス。 - 前記第1の伝熱部材の上面が露出しており、前記発光素子は前記第1の伝熱部材の露出した前記上面に載置されている請求項1に記載の光照射デバイス。
- 前記第1の伝熱部材の上面が前記絶縁層の一部に覆われており、前記発光素子は、前記第1の伝熱部材の上面に前記絶縁層の前記一部を介して載置されている請求項1に記載の光照射モジュール。
- 前記第2の伝熱部材は複数存在し、各第2の伝熱部材が複数の前記絶縁層間に配設されており、前記第2の伝熱部材同士が第3の伝熱部材を介して接続されている請求項1乃至3のいずれか1項に記載の光照射デバイス。
- 前記第1の伝熱部材と前記第2の伝熱部材とが接続されている請求項1乃至4のいずれか1項に記載の光照射デバイス。
- 前記積層体の表面および内部の少なくとも一方に配設された、前記発光素子同士を電気的に接続している電気配線を備え、
該電気配線は、前記発光素子のアノードに接続されるアノード配線と、前記発光素子のカソードに接続されるカソード配線と、前記発光素子の前記アノードと前記カソードとを接続する共通配線とを備え、
隣接する前記絶縁層間に介在して前記アノード配線および前記カソード配線のいずれか一方に接続された電極層を備えている請求項1乃至5のいずれか1項に記載の光照射デバイス。 - 前記第2の伝熱部材が前記電極層を兼ねている請求項6に記載の光照射デバイス。
- 前記電極層が前記第2の伝熱部材に接続されている請求項6に記載の光照射デバイス。
- 前記電極層が前記第1の伝熱部材に接続されている請求項6乃至8のいずれか1項に記載の光照射デバイス。
- 前記第2の伝熱部材の熱伝導率が前記第1の伝熱部材の熱伝導率よりも高い請求項1乃至9のいずれか1項に記載の光照射デバイス。
- 前記第1の伝熱部材の熱膨張係数が前記第2の伝熱部材の熱膨張係数よりも前記絶縁層の熱膨張係数に近い請求項1乃至10のいずれか1項に記載の光照射デバイス。
- 請求項1乃至5のいずれか1項に記載の光照射デバイスが複数個と、複数の前記光照射デバイスが載置された放熱用部材とを備えた光照射モジュール。
- 請求項8乃至11のいずれか1項に記載の光照射デバイスが複数個と、複数の前記光照射デバイスが載置された放熱用部材とを備えた光照射モジュール。
- 前記第1の伝熱部材、前記第2の伝熱部材および前記電極層の少なくとも1つと前記放熱用部材とが接続されている請求項13に記載の光照射モジュール。
- 記録媒体に対して印刷を行なう印刷手段と、
印刷された前記記録媒体に対して光を照射する請求項12乃至14のいずれか1項に記載の光照射モジュールと
を有する印刷装置。
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EP11809732.8A EP2597691B1 (en) | 2010-07-23 | 2011-07-22 | Light irradiation device, light irradiation module, and printing device |
CN201180035873.0A CN103026518B (zh) | 2010-07-23 | 2011-07-22 | 光照射设备、光照射模块以及印刷装置 |
JP2012525438A JPWO2012011562A1 (ja) | 2010-07-23 | 2011-07-22 | 光照射デバイス、光照射モジュール、および印刷装置 |
US13/811,632 US9004667B2 (en) | 2010-07-23 | 2011-07-22 | Light irradiation device, light irradiation module, and printing apparatus |
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CN103026518A (zh) | 2013-04-03 |
CN103026518B (zh) | 2016-04-20 |
JPWO2012011562A1 (ja) | 2013-09-09 |
US20130120514A1 (en) | 2013-05-16 |
EP2597691A4 (en) | 2014-05-28 |
EP2597691A1 (en) | 2013-05-29 |
EP2597691B1 (en) | 2015-09-09 |
US9004667B2 (en) | 2015-04-14 |
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