WO2012009831A1

WO2012009831A1 - Wiring board and manufacturing method thereof

Info

Publication number: WO2012009831A1
Application number: PCT/CN2010/001116
Authority: WO
Inventors: 张振铨; 黄瀚霈; 张钦崇
Original assignee: 欣兴电子股份有限公司
Priority date: 2010-07-23
Filing date: 2010-07-23
Publication date: 2012-01-26
Also published as: CN102742367A; CN102742367B

Abstract

A wiring board and a manufacturing method thereof are provided. The wiring board includes: an outer wiring layer, a wiring layer, a body layer, a high density interconnection board (HDI board), and at least a first conductive plug. The body layer is mounted between the outer wiring layer and the wiring layer, and the HDI board is buried in the body layer. The first conductive plug is formed in the body layer, and connects the HDI board to the outer wiring board.

Description

Circuit board and manufacturing method thereof

The present invention relates to a wiring board and a method of fabricating the same, and, in particular, to a wiring board having a high-density interconnector board (HDI Board) and a method of fabricating the same. Background technique

The circuit board is currently an electronic device such as a mobile phone, a computer and a digital camera, and a component required for a home appliance such as a television, a washing machine, and a refrigerator. In detail, the circuit board can carry and serve as a chip component, an ass ive component, an active component, and a microelectromechanical system (MEMS) and other electronic components. Installation. In this way, current can be transmitted to these electronic components via the circuit board, thereby enabling these electronic devices and home appliances to operate. Summary of the invention

The present invention provides a wiring board capable of accommodating at least one electronic component.

The present invention provides a method of manufacturing a wiring board for manufacturing the above wiring board.

The present invention can be implemented by the following technical solutions. A circuit board according to the present invention includes an outer wiring layer, a circuit layer, a body layer, a high density interconnect board (HDI board), and at least one A conductive column. The main layer is disposed between the outer circuit layer and the circuit layer, and the high density inner wiring plate is buried in the main layer. The first conductive pillar is disposed in the main body layer and is connected between the high-density interconnecting board and the outer wiring layer, wherein the main body layer comprises an adhesive layer and an insulating layer (insutralation) The adhesive layer is bonded between the high-density interconnecting board and the outer wiring layer, and the first conductive pillar passes through the adhesive layer. The insulating layer covers the high-density interconnecting board, and the wiring layer is disposed on the insulating layer. , and contact the insulation layer.

The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures. The aforementioned wiring board, wherein the adhesive layer comprehensively covers the outer wiring layer.

The aforementioned wiring board, wherein the adhesive layer partially covers the outer wiring layer.

The circuit board of the foregoing, wherein the body layer further comprises a substrate between the outer wiring layer and the insulating layer, and the substrate surrounds the high density interconnecting board.

The foregoing circuit board further includes at least one second conductive pillar passing through the insulating layer. The second conductive pillar is connected between the high-density interconnecting board and the wiring layer, and the substrate is a semi-cured film (prepreg); or The substrate is a wiring subs trate, and the second conductive pillar is connected between the circuit substrate and the circuit layer.

In the foregoing circuit board, when the substrate is a circuit substrate, the distance between the high-density interconnecting board and the outer wiring layer is smaller than the distance between the high-density interconnecting board and the wiring layer.

In the foregoing circuit board, the number of layers of the high-density interconnecting board is greater than or equal to the number of layers of the circuit substrate, and the average wiring density of the high-density interconnecting board is greater than or equal to the circuit substrate. Average wiring density.

In the foregoing circuit board, the above further includes a high density interconnect sub-board (H D I Sub-board ). The high-density interconnect wiring sub-board is buried in a high-density interconnecting board.

In the foregoing circuit board, wherein the number of layers of the high-density interconnecting sub-board is greater than or equal to the number of layers of the high-density interconnecting board, and the average wiring density of the high-density interconnecting sub-board is greater than or equal to the high density The average wiring density of the wiring board.

The aforementioned wiring board, wherein the first conductive pillar extends from the outer wiring layer to the inside of the high density interconnecting board.

The invention can also be implemented by the following technical solutions. A method of manufacturing a wiring board according to the present invention. First, at least a uniform hole is formed on a substrate. After the through holes are formed, a high density interconnecting plate is fixed to the substrate, wherein the high density interconnecting wires cover the through holes. A body layer is formed on the substrate, wherein the body layer is coated with a high density interconnector. A metal layer is formed on the body layer. After forming the body layer, at least one first conductive pillar connected between the high density interconnector plate and the substrate is formed. After forming the first conductive pillar, the substrate and the metal layer are patterned to form an outer wiring layer and a wiring layer, respectively, wherein the method of fixing the high-density interconnecting board on the substrate and the method of forming the main layer are as follows Said. An adhesive layer is applied or stuck on the substrate. Next, the high density interconnector board is bonded to the adhesive layer. Thereafter, an insulating layer is formed on the substrate and on the high-density interconnecting board, wherein the insulating layer covers the high-density interconnecting board.

The present invention can also be further implemented by the following technical measures.

In the above method of manufacturing a wiring board, wherein the adhesive layer fills the through hole, and the method of forming the first conductive post is as follows. Remove a portion of the adhesive layer within the through hole. The through holes are subjected to a through hole (PTH) after removing a portion of the adhesive layer and before patterning the substrate.

The method for manufacturing a circuit board, wherein the method of forming the main body layer further comprises: after bonding the high-density inner wiring board to the adhesive layer, disposing a substrate between the insulating layer and the substrate, wherein the substrate has a The opening, while the high density interconnecting strip is in the opening.

The method for manufacturing a circuit board, after forming the main body layer, further comprises forming at least one second conductive pillar connected between the high-density interconnecting board and the metal layer, wherein the substrate is a half-cured film; or, the substrate A circuit substrate, and after forming the body layer, further comprising forming at least one second conductive pillar connected between the circuit substrate and the metal layer. In the above method for manufacturing a wiring board, when the substrate is a wiring substrate, the method of forming the main body layer further comprises disposing a half-cured film between the substrate and the substrate.

In the above method for manufacturing a wiring board, wherein the high-density interconnecting board is formed by cutting a first wiring mother board, and the circuit substrate is formed by cutting a second wiring mother board, wherein The first line mother board includes a plurality of high density interconnect boards, and the second line mother board includes a plurality of circuit boards.

In the above method of manufacturing a wiring board, the high-density interconnecting board has at least one pad, and the pad covers the through hole. .

In the above method of manufacturing a wiring board, the high-density interconnecting wiring board has an inner wiring layer, and the first conductive pillar is connected to the inner wiring layer.

The wiring board of the present invention can be electrically connected to at least one electronic component by including an outer wiring layer, and therefore the wiring board of the present invention can be provided with at least one electronic component so that current can be transmitted to the electronic component.

The above description is only an overview of the technical solutions of the present invention, and the technical means of the present invention can be more clearly understood, and can be implemented in accordance with the contents of the specification, and the above and other objects, features and advantages of the present invention can be more clearly understood. The following specific embodiments are described in detail with reference to the accompanying drawings: BRIEF DESCRIPTION OF THE DRAWINGS

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A to Fig. 2 are schematic cross sectional views showing a method of manufacturing a wiring board according to an embodiment of the present invention.

2A to 2F are schematic cross-sectional views showing a method of manufacturing a wiring board according to another embodiment of the present invention.

10: Substrate 12: Plane

34: Second line motherboard 40: First line motherboard

100, 200: circuit board 110: outer circuit layer

112, 142a, 142b: interface 114: routing

120, 144, 144a, 144b: circuit layer 122: metal layer

130, 230: main body layer 132, 232: adhesive layer

134, 234: substrate 136, 236: insulation

140: High-density interconnect plate 146, 148a, 148b: conductive column

150: first conductive column 160, 260: 笫 two conductive columns

180: High Density Interconnect Daughter Board 238: Semi-cured Film

300: Electronic components Dl, D2: distance

HI: through hole H2, H4: opening

H3: Opening SI: Solder block Tl, T2: the best way to achieve the invention in thickness

In order to further explain the technical means and functions of the present invention for achieving the intended purpose of the invention, the following describes the specific embodiments, structures, methods, and steps of the circuit board and the manufacturing method thereof according to the present invention with reference to the accompanying drawings and embodiments. Features and their effects, as detailed below.

1A to 1 are schematic cross-sectional views showing a method of manufacturing a wiring board according to an embodiment of the present invention, and Fig. 1G is a sectional view showing the structure of the wiring board of the present embodiment. Referring first to FIG. 1G, the structural features of the circuit board 100 of the present embodiment will be described first. The circuit board 100 of the present embodiment includes an outer circuit layer 110, a circuit layer 120, a body layer 130, a high density interconnecting board 140, and a plurality of first conductive pillars 150.

The main body layer 130 is disposed between the outer wiring layer 110 and the wiring layer 120, that is, the outer wiring layer 110 and the wiring layer 120 are respectively located on opposite surfaces of the main body layer 130. The high density interconnecting board 140 is buried in the body layer 130, that is, the body layer 130 covers the high density interconnecting board 140. These first conductive pillars 150 are disposed in the body layer 130 and are connected between the high density interconnecting board 140 and the outer wiring layer 110.

The outer wiring layer 110 may include a plurality of pads 112 and at least one trace 114, and the high density interconnect panel 140 has a plurality of pads 142a, 142b, wherein the first conductive pillars 150 may be connected Between these pads 112 and the pads 142a. At least one electronic component 300 can be mounted on the circuit board 100 and electrically connected to the pads 112. The electronic component 300 is, for example, a chip, a passive component, an active component, or a MEMS component, and the electronic component 300 may be mounted on the wiring board 100 by means of flip chip or wire bonding.

Taking FIG. 1G as an example, the electronic component 300 is mounted on the circuit board 100 in a flip chip manner, so that a plurality of solder bumps S1 are connected between the electronic component 300 and the pads 112 so that the electronic component 300 can pass. the solder bump is electrically connected to S1 and the pads 112, wherein the solder is a solder ball, for example, block S1 (solder bal l) ₀ thus, the electronic component 300 may be electrically connected 150 via the high density of these pads 112 and the first conductive post The interconnect board 140, in turn, allows current to be transferred to the electronic component 300 via the board 100.

Although FIG. 1G illustrates a plurality of first conductive pillars 150, in other embodiments, the circuit board 100 may include only one first conductive pillar 150, that is, the number of first conductive pillars 150 included in the circuit board 100 may be Just one. Therefore, the number of first conductive pillars 150 shown in Fig. 1G is merely illustrative and is not intended to limit the invention.

In this embodiment, the main body layer 130 may include an adhesive layer 132, a substrate 134, and an insulating layer 136. The adhesive layer 132, the substrate 134, and the insulating layer 136 may be made of a resin material. The substrate 134 can be a semi-cured film. Adhesive layer 132 adheres to high density The inner wiring board 140 and the outer wiring layer 110 are partially covered, and the outer conductive layer 110 is partially covered, and the first conductive pillars 150 pass through the adhesive layer 132 to connect the high-density interconnecting board 140 and the outer wiring. Layer 11 0.

The insulating layer 136 covers the high density interconnecting board 140, and the wiring layer 120 is disposed on the insulating layer 136 and contacts the insulating layer 136. 134 is between the outer wiring layer 110 and the insulating layer 136 and surrounds the high density interconnecting board 140, so the insulating layer 136 is located between the wiring layers 120 and 134. Since the adhesive layer 1 32 bonds the high-density interconnecting board 140, the substrate 134 surrounds the high-density interconnecting board 140, and the insulating layer 136 covers the high-density interconnecting board 140, the high-density interconnecting board 140 It is buried in the main body layer 130.

It should be noted that although the body layer 130 shown in FIG. 1G includes the substrate 134, in other embodiments, particularly when the high density interconnector plate 140 has a very thin thickness T1, the insulating layer 136 may be half. The film is cured, and the body layer 130 may not require the substrate 134, i.e., the substrate 134 is only a selective component of the present invention and is not an essential component. Therefore, the high-density interconnecting board 140 may be surrounded only by the adhesive layer 132 and the insulating layer 136, and the substrate 134 shown in Fig. 1G is merely illustrative and does not limit the present invention.

The circuit board 100 may further include at least one second conductive pillar 160. For example, the circuit board 100 shown in FIG. 1G includes a plurality of second conductive pillars 160, but in other embodiments, the circuit board 100 may include only one second conductive Column 160. These second conductive pillars 160 pass through the insulating layer 136 and are connected between the high density interconnector board 140 and the wiring layer 120. The second conductive pillars 160 can be connected to the pads 142b, respectively, such that the high-density interconnecting board 140 can be electrically connected to the wiring layer 120 via the second conductive pillars 160.

In addition, the circuit board 100 may further include at least one conductive connection structure (conductive connection s tructure). The conductive connection structure is disposed in the body layer 130 and is connected between the outer circuit layer 110 and the circuit layer 120. The conductive connection structure may be a conductive bl ind via s tructure or a conductive via. The irth through hole structure utilizes a conductive connection structure, and the outer circuit layer 110 can electrically connect the circuit layer 120.

It is worth mentioning that the circuit board 100 can be not only a finished circuit board finished product, but also a component of a mul ti layer wi ring board (par t ), ie The circuit board 100 can function as a line structure within a multilayer circuit board. In detail, in other embodiments, one or more wiring layers may be additionally formed on the insulating layer 136 by using a build-up method or a stacking method, so that the circuit layer 120 becomes a plurality of layers. The inner wir ing layer of the board.

Therefore, although in the embodiment shown in FIG. 1G, no circuit layers are depicted above the line house 120 and the insulating layer 136, the circuit board 100 illustrated in FIG. 1G appears to be an already completed circuit board. Finished product, but in other embodiments, circuit board 100 can also be used as a multilayer line The wiring structure inside the road board. Therefore, the circuit board 100 illustrated in FIG. 1G is merely illustrative and does not limit the present invention.

Referring to Figure 1H, an enlarged view of the high density interconnect panel 140 of Figure 1G is shown. The circuit board 100 can further include a high density interconnect wiring board 180 which is a high density interconnecting board. The high density interconnect wiring board 180 is buried in the high density interconnecting board 140 and may be buried in the high density interconnecting board 140 via a bulking or stacking process. In addition, the average wiring density and the number of layers of the high-density interconnecting sub-board 180 may be greater than or equal to the average wiring density and the number of layers of the high-density interconnecting board 140, wherein the number of layers mentioned in the present invention refers to the circuit layer. quantity.

Taking FIG. 1H as an example, in addition to the pads 142a, 142b, the high-density interconnecting board 140 further has two wiring layers 144a, 144b, wherein the wiring layers 144a, 144b are the inner layers of the high-density interconnecting board 140. The circuit layer, and thus the high-density interconnecting board 140 has a total of four wiring layers, that is, the number of layers of the high-density interconnecting board 140 is four. However, it must be emphasized that the number of layers of the high-density interconnecting board 140 in Fig. 1H is merely illustrative and does not limit the invention.

In addition, the high-density interconnecting board 140 may further have at least one conductive pillar 146, at least one conductive pillar 148a, and at least one conductive pillar 148b, wherein the conductive pillar 146 is connected between the circuit layers 144a and 144b, and the conductive pillar 148a It is connected between the high-density interconnecting sub-board 180 and the pad 142a, and the conductive post 8b is connected between the high-density interconnecting sub-board 180 and the pad 142b. With these conductive pillars 148a and 148b, the high-density interconnect wiring sub-board 180 is electrically connected to the high-density interconnecting board 140 so that current can be connected between the high-density interconnecting sub-board 180 and the high-density interconnecting board 140. Transfer between.

In particular, although the first conductive pillars 150 may be connected between the pads 112 and the pads 142a, in other embodiments, the first conductive pillars 150 may not pass through any of the pads 142a. It is directly connected between the pad 112 and the circuit layer 144a or 144b, or directly connected to the high-density interconnect sub-board 180. In other words, the first conductive pillar 150 may extend from the outer wiring layer 110 to the inside of the high density interconnecting board 140.

The above mainly describes the structural features of the circuit board 100. Next, a method of manufacturing the wiring board 100 will be described in detail with reference to Figs. 1A to II.

Referring to FIG. 1A, in the method of manufacturing the circuit board 100, first, at least one through hole H1 is formed on a substrate 10. For example, in the embodiment of FIG. 1A, a plurality of through holes HI are formed on the substrate 10, but In other embodiments, only one through hole H1 may be formed. There are many ways to form the through hole HI, such as laser ray l, mechanical lining or microlithography. Further, the substrate 10 may be a metal foil such as a copper foil or an aluminum foil; or the substrate 10 may be a composite sheet such as a copper clad laminate (CCL).

Referring to FIG. 1B and FIG. 1C, after the through holes HI are formed, the high-density interconnecting board 140 is fixed on the substrate 10, wherein the high-density interconnecting board 140 covers the through holes HI, and is high. The pads 142a of the density inner wiring board 140 cover the through holes H1, that is, the pads 142a correspond to the through holes H1, respectively. There are various ways of fixing the high-density interconnecting board 140 on the substrate 10. In the embodiment shown in FIGS. 1B and 1C, the high-density interconnecting board 140 can be fixed on the substrate 10 by adhesive bonding. .

In detail, referring to FIG. 1B, an adhesive layer 132 is first coated or laminated on the substrate 10. The adhesive layer 132 may partially cover a plane 12 of the substrate 10 and cover the through holes H1. The adhesive layer 132 may be formed of a resin material such as epoxy, and the method of applying the adhesive layer 132 may be a method such as spraying, brushing or screen printing.

Referring to Fig. 1C, the high-density interconnecting board 140 is then bonded to the adhesive layer 132. Thus, the high-density interconnecting board 140 is fixed to the substrate 10. Further, the adhesive layer 132 may be a liquid material or a paste material having fluidity, so that the adhesive layer 132 can fill the through holes H1. In addition, before the high-density interconnecting board 140 is bonded to the adhesive layer 132, the high-density interconnecting board 140 can be aligned to enable the high-density interconnecting board 140 to be seated in the correct position. in.

Referring to FIG. 1D and FIG. 1E, a body layer 130 covering the high-density interconnecting board 140 is formed on the substrate 10. There are many methods of forming the body layer 130, and in the present embodiment, since the body layer 130 includes the adhesive layer 132, when the adhesive layer 132 is coated or bonded on the substrate 10, it is bonded in a high density. When the board 140 is connected, the body layer 130 has begun to form.

After the high-density interconnector board 140 is bonded to the adhesive layer 132, an insulating layer 136 is formed on the substrate 10 and on the high-density interconnecting board 140, and a substrate is disposed between the insulating layer 136 and the substrate 10. 134. The substrate 134 has an opening H2, and the opening H2 may be formed by external routing or laser ablating. When the substrate 134 is disposed, the high density interconnector plate 140 will be positioned within the opening H2 so that the substrate 134 can surround the high density interconnect plate 140.

The insulating layer 136 and the substrate 134 may be formed by press bonding. In detail, the method of forming the insulating layer 136 and the substrate 134 may be to press the resin layer and the prepreg film onto the substrate 10, wherein the prepreg is disposed between the resin layer and the counter 10. In the process of lamination, the resin layer and the prepreg film may be heated, i.e., the resin layer and the prepreg film are thermocompression bonded to form the body layer 130.

In addition, the method of manufacturing the wiring board 100 further includes forming a metal layer 122 on the body layer 130. The metal layer 122 may be formed on the insulating layer 136 and may be a metal foil such as a copper foil or an aluminum foil. The metal layer 122 may be formed simultaneously with the insulating layer 136. For example, the method of forming the metal layer 122 and the insulating layer 136 may be to press a composite sheet onto the substrate 134, and the composite sheet may have a metal foil and a resin layer, for example Copper foil substrate.

It should be noted that since the substrate 134 is not an essential component of the present invention, in other embodiments, the substrate 134 does not have to be formed, and only the substrate 134 may be formed, and only the substrate 134 may be formed. A piece of metal foil and a piece of semi-cured film are formed on the substrate 10 to form a metal layer 122 and a body layer 130, wherein the metal foil may be a foil coated with a glue, such as a backing copper foil (Res in Coated) Copper, RCC). Therefore, the substrate 134 shown in Fig. ID and Fig. IE is for illustrative purposes only and is not intended to limit the invention.

Referring to FIG. 1E and FIG. 1F, at least one first conductive pillar 150 and at least one second conductive pillar 160 are formed. The first conductive pillar 150 is connected between the high density interconnecting board 140 and the substrate 10, and the second conductive pillar 160 is connected between the high density interconnecting board 140 and the metal layer 122. The first conductive pillar 150 and the second conductive pillar 160 may be formed by via plating, and the method of forming the first conductive pillar 150 and the second conductive pillar 160 may include electroless plating and electric electricity. After (electroplat ing).

The method of forming the first conductive pillar 150 may include the following flow. First, when the adhesive layer 132 fills the through holes HI (as shown in FIG. 1D), the partial adhesive layer 132 in the through holes HI is removed, and the method of removing the partial adhesive layer 132 may include laser burning. A laser ablat ion, that is, an adhesive layer 132 exposed by the laser beam at the through holes HI, enables the through hole HI to partially expose the high density interconnecting plate 140.

Further, after the above laser ablation, the through holes HI may be desmear to clean the through holes H1. Thereafter, the through holes HI are subjected to through-hole plating, that is, the through holes HI are sequentially subjected to electroless plating and electroplating. Thus, the first conductive pillar 150 is formed in the through hole HI, and connects the substrate 10 and the high-density interconnecting board 140. When the through holes HI are subjected to through-hole plating, the through holes HI may be filled with Ful l-Fi l led Plating to make the first conductive pillars 150 a solid conductive pillar structure.

When the first conductive pillar 150 is formed, a flow of forming the second conductive pillar 160 may be performed to enable the first conductive pillar 150 and the second conductive pillar 160 to be simultaneously formed, and the second conductive pillar 160 is formed as follows. . First, one or more openings H3 are formed on the metal layer 122, wherein the openings H3 are formed through the metal layer 122 and the insulating layer 136, and the method of forming the opening H3 may be laser drilling or lithography. Further, after the above laser drilling, the openings H3 may be subjected to desmearing.

After the opening H3 is formed, the opening H3 is subjected to through-hole plating, that is, the openings H3 are sequentially subjected to electroless plating and electroplating, wherein the through holes HI and the openings H3 are simultaneously through holes. plating. In this way, the second conductive pillars 160 can be respectively formed in the openings H3, and the high-density interconnecting wires 140 and the metal layer 122 are connected, and the first conductive pillars 150 and the second conductive pillars 160 can be in the same pass. The hole plating process is formed. In addition, when the openings H3 are subjected to through-hole plating, the openings H3 may be filled with holes to make the second conductive pillars 160 a solid conductive pillar structure.

Referring to FIG. 1F and FIG. 1G, the substrate 10 and the metal layer 122 are patterned to form an outer wiring layer 110 and a wiring layer 120, respectively, wherein the substrate 10 and the metal layer 122 are patterned. The method can be: shadow etching. At this point, the circuit board 100 has been substantially completed. In addition, after the circuit board 100 is completed, one or more wiring layers may be additionally formed on the insulating layer 136 or the outer wiring layer 110 by a build-up method or a stacking method, so that the outer wiring layer 110 or the wiring layer 120 becomes the inner wiring layer of the multilayer wiring board.

Referring to FIG. 2 , it is worth mentioning that, since the first conductive pillar 150 can extend to the inside of the high-density interconnecting board 140 , the first conductive pillar 150 can also be formed in the process of forming the first conductive pillar 150 . An inner wiring layer 144 is attached to the high density interconnecting board 140, as shown in FIG. II, wherein the inner wiring layer 144 is, for example, the wiring layer 144a or 144b (please refer to FIG. 1H).

2A to 2F are schematic cross-sectional views showing a method of manufacturing a wiring board according to another embodiment of the present invention. Referring to FIG. 2D, the circuit board 200 of the present embodiment is similar in structure to the circuit board 100 of the foregoing embodiment, and the following mainly introduces the difference in structural characteristics between the circuit boards 100 and 200.

The circuit board 200 can be provided for at least one electronic component 300 (see FIG. 1G), and the circuit board 200 includes components similar to those of the circuit board 100. For example, the circuit board 200 also includes an outer circuit layer 110, The circuit layer 120, a high density interconnecting board 140, and a plurality of first conductive pillars 150. However, the body layer 230 included in the wiring board 200 is different from the body layer 130 of the aforementioned wiring board 100.

In detail, the body layer 230 includes an adhesive layer 232, a substrate 234, an insulating layer 236, and a half cured film 238. The prepreg 238 is disposed between the substrate 234 and the outer wiring layer 110, and the adhesive layer 232 is bonded between the high density interconnecting board 140 and the outer wiring layer 110, and comprehensively covers the outer wiring layer. 110, wherein the material of both the adhesive layer 232 and the insulating layer 236 may include a resin material. Since the adhesive layer 232 comprehensively covers the outer wiring layer 110, the insulating layer 236, the substrate 234 and the prepreg 238 are substantially not in contact with the outer wiring layer 110.

In addition, in the present embodiment, the substrate 234 has an opening H4, and the high-density interconnecting board 140 is located in the opening H4, so that the substrate 234 surrounds the high-density interconnecting board 140. The substrate 234 is a wiring substrate, so the substrate 234 can be substantially regarded as a wiring board. Taking FIG. 2D as an example, the substrate 234 can be considered, for example, as a multilayer wiring board having four wiring layers. In addition, the average wiring density of the high-density interconnecting board 140 may be greater than or equal to the average wiring density of the circuit substrate (ie, the substrate 234), and the number of layers of the high-density interconnecting board 140 may also be greater than or equal to the substrate 234. The number of layers.

For example, the high-density interconnecting board 140 shown in FIG. 1H may have four layers, and the substrate 234 shown in FIG. 2D may have four wiring layers, so from FIG. 1H and FIG. 2D, The number of layers of the high density interconnect panel can be equal to the number of layers of the substrate 234. Of course, in other embodiments, the number of layers of the high-density interconnecting board 140 may also be greater than the number of layers of the substrate 234, so the number of layers of the high-density interconnecting board 140 shown in FIG. 1H, and FIG. 2D The number of layers of the substrate 234 is both illustrative and not limiting.

When the substrate 234 is a circuit substrate, the thickness T2 of the substrate 234 may be greater than or equal to the high density. The thickness T1 of the interconnecting board 140 is such that the distance D1 between the high-density interconnecting board 140 and the outer wiring layer 110 is smaller than the distance D2 between the high-density interconnecting board 140 and the wiring layer 120, so the high density The interconnect board 140 is closer to the outer wiring layer 110 and is further away from the wiring layer 120.

Therefore, the electronic component 300 can be mounted close to the high-density interconnecting board 140, and electrically connected to the high-density interconnecting board 140 via the outer wiring layer 110 and the first conductive post 150. In addition, since the average wiring density of the high-density interconnecting board 140 is larger than the average wiring density of the substrate 234, and the average wiring density of the high-density interconnecting board 140 and the substrate 234, the average wiring density of the electronic component 300 The average wiring density of the high density interconnecting board 140 will be relatively close, thereby facilitating the mounting of the electronic component 300 near the high density interconnecting board 140, as shown in Fig. 2D.

In addition, although the circuit board 200 may further include at least one second conductive pillar 260, and the shape and material of the second conductive pillar 260 are substantially the same as those of the second conductive pillar 160, different from the foregoing embodiment, the embodiment The second conductive pillar 260 passes through the insulating layer 236 and is connected between the wiring substrate (ie, the substrate 234) and the wiring layer 120. As such, the substrate 234 can be electrically connected to the circuit layer 120 via the second conductive pillars 160. However, in other embodiments, at least one second conductive pillar 160 may also be connected between the high density interconnect plate 140 and the wiring layer 120 through the insulating layer 236.

The above mainly describes the structural features of the circuit board 200. Next, a method of manufacturing the wiring board 200 will be described in detail with reference to Figs. 2A to 2F. Since the manufacturing method of the wiring board 200 and the manufacturing method of the aforementioned wiring board 100 all include the same flow, the following mainly describes the difference in manufacturing methods of the wiring boards 100 and 200.

Referring to Fig. 2A, after the through hole HI is formed, the high density interconnecting plate 140 is fixed to the reverse 10. The high-density interconnector plate 140 can be attached to the _3⁄4^reverse 10 by means of bonding. For example, an adhesive layer 232 is applied or laminated on the substrate 10, and the method of applying the adhesive layer 232 therein may be the same as the method of applying the adhesive layer 132. The adhesive layer 232 covers the plane 12 of the substrate 10 in a comprehensive manner, so that these through holes HI are covered by the adhesive layer 232. Next, the high-density interconnecting board 140 is bonded to the adhesive layer 232 so that the high-density interconnecting board 140 is fixed to the substrate 10.

Referring to FIG. 2B and FIG. 2C, an insulating layer 236 covering the high-density interconnecting board 140 is formed on the reverse 10 and on the high-density interconnecting board 140, and between the insulating layer 236 and the substrate 10. The substrate 234 is disposed, wherein the opening H4 can be formed in the same manner as the opening H2. Further, a prepreg 238 is disposed between the substrate 234 and the substrate 10, wherein the prepreg 238 is disposed between the adhesive layer 232 and the substrate 234.

The method of forming the insulating layer 236 may be the same as the method of forming the insulating layer 136. For example, the method of forming the insulating layer 236 may be to laminate the resin on the substrate 234. When the prepreg film 238 is disposed, the prepreg film 238 can be pressed between the substrate 10 and the substrate 234. In addition, in progress In the process of press-bonding, the resin layer and the prepreg film 238 may be heated to allow the glue material of both the resin layer and the prepreg film 238 to flow, thereby filling the opening H4. As such, the body layer 230 is formed.

It is worth mentioning that since the adhesive layer 232 comprehensively covers the plane 12 of the substrate 10, the adhesive layer 232 can be bonded between the substrate 234 and the substrate 10 even without the semi-cured film 238. It can be seen that the prepreg film 238 is only a selective component of the present invention and is not an essential component, so the prepreg film 238 shown in Figs. 2B to 2D is merely illustrative and not limiting.

Referring to FIG. 2C, after the body layer 230 is formed, at least one second conductive pillar 260 connected between the substrate 234 and the metal layer 122 may be formed, and at least one first conductive pillar 150 may be formed. The second conductive pillar 260 is formed in the same manner as the second conductive pillar 160 in the foregoing embodiment, and therefore the method of forming the second conductive pillar 26G will not be repeatedly described below.

Referring to FIG. 2C and FIG. 2D, the substrate 10 and the metal layer 122 are patterned to form the outer wiring layer 110 and the wiring layer 120, respectively. At this point, the circuit board 200 has been substantially completed. Further, the above-described patterning method is the same as that of the foregoing embodiment, that is, the method of patterning the substrate 10 and the metal layer 122 may be lithography etching. In addition, after the circuit board 200 is completed, one or more circuit layers may be additionally formed on the insulating layer 236 or the outer wiring layer 110 by the build-up method or the stacking method, so that the outer circuit layer 110 or the circuit layer 120 becomes the inner wiring layer of the multilayer wiring board.

2E is a top plan view of a first line mother board including a plurality of high density interconnect boards of FIG. 2D, and FIG. 2F is a top plan view of a second line mother board including a plurality of circuit boards of FIG. 2D. Referring to FIG. 2E and FIG. 2F, in the embodiment, the high-density interconnecting board 140 may be formed by cutting a first line mother board 40, and the circuit substrate (ie, the substrate 234) may be a cutting one. The second line mother board 34 is formed.

The first line mother board 40 includes a plurality of high density interconnect boards 140 and the second line mother board 34 includes a plurality of substrates 234. After the first line mother board 40 and the second line mother board 34 are manufactured, the first line mother board 40 and the second line mother board 34 are cut to obtain a plurality of high density interconnect boards 140 and a plurality of bases. Material 234. Therefore, the use of the first wiring mother board 40 and the second wiring mother board 34 facilitates mass production of the high-density interconnecting board 140 and the substrate 234.

Since the average wiring density of the high-density interconnecting board 140 is larger than the average wiring density of the substrate 234, and the number of layers of the high-density interconnecting board 140 is larger than the number of layers of the substrate 234, the high-density interconnecting board 140 is manufactured. The time required will be longer than the time required to make the material 234, so the high density interconnector board 140 takes a lot of time to manufacture.

However, both the high-density interconnector board 140 and the substrate 234 can be cut from different line mother boards (ie, the first line mother board 40 and the second line mother board 34), and the first line mother board 40 is Both of the second line mother boards 34 can be fabricated simultaneously for the same period of time. In this way, the time required to manufacture the wiring board 200 can be reduced, so that the circuit board 200 can be manufactured quickly. In summary, the outer circuit layer included in the circuit board of the present invention can electrically connect a plurality of electronic components, such as a chip, a passive component, an active component, or a germanium electromechanical system component, so that the circuit board of the present invention can be provided. At least one electronic component is mounted so that current can be transmitted to the electronic component, thereby allowing an electronic device (such as a cell phone, a computer or a digital camera) and household appliances (such as a television, a washing machine, or a water tank) to operate.

Secondly, in the circuit board of the present invention, the high-density interconnecting board is buried in the main body layer, and the average wiring density and the number of layers of the high-density interconnecting board are larger than the wiring substrate in the main body layer (ie, the substrate)

234) the average wiring density and the number of layers, so that a densely distributed and a large number of layers can be formed in a certain area of the wiring board; in another area of the wiring board, a thin distribution and a small number of layers are formed. wiring. Thus, the overall number of layers of the board and the overall thickness can be reduced, and the wiring design of the board can be simplified.

The above is only the embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any skilled person in the art Without departing from the spirit and scope of the invention, the invention may be modified or modified to the equivalents of the equivalents. It is still within the scope of the technical solution of the present invention to make any simple modifications, equivalent changes and modifications to the above embodiments.

Claims

Rights request

A circuit board characterized in that it comprises:

An outer circuit layer;

a circuit layer

a body layer disposed between the outer circuit layer and the circuit layer;

a high density interconnecting board embedded in the body layer;

At least one first conductive pillar disposed in the body layer and connected between the high density interconnecting board and the outer wiring layer, wherein the body layer comprises an adhesive layer and an insulating layer, An adhesive layer is bonded between the high-density interconnecting board and the outer wiring layer, and the first conductive pillar passes through the adhesive layer, the insulating layer covers the high-density interconnecting board, and the line A layer is disposed on the insulating layer and contacts the insulating layer.

The wiring board according to claim 1, wherein said adhesive layer comprehensively covers said outer wiring layer.

3. The wiring board according to claim 1, wherein said adhesive layer partially covers said outer wiring layer.

The circuit board according to claim 2 or 3, wherein said main body layer further comprises a substrate between said outer circuit layer and said insulating layer, said substrate surrounding said high density Inner wiring board.

5. The circuit board according to claim 1, wherein said main body layer further comprises a substrate between said outer circuit layer and said insulating layer, said substrate surrounding said high density interconnect Wire board.

6. The wiring board according to claim 5, further comprising at least one second conductive pillar passing through the insulating layer, the second conductive pillar being connected between the high density interconnecting board and the wiring layer And the substrate is a half cured film.

The circuit board according to claim 5, further comprising at least one second conductive pillar passing through the insulating layer, the substrate is a circuit substrate, and the second conductive pillar is connected to the circuit substrate Between the circuit layers.

8. The wiring board according to claim 7, wherein said main body layer further comprises a half-cured film disposed between said substrate and said outer circuit layer.

9. The wiring board according to claim 7, wherein a distance between said high density interconnecting board and said outer wiring layer is smaller than a distance between said high density interconnecting board and said wiring layer. .

The circuit board according to claim 7, wherein the number of layers of the high-density interconnecting board is greater than or equal to the number of layers of the circuit substrate, and the average wiring density of the high-density interconnecting board Greater than or equal to the average wiring density of the circuit substrate.

The circuit board according to claim 1, 8 or 9, further comprising a high density interconnecting sub-board embedded in the high-density interconnecting board.

The circuit board according to claim 11, wherein the number of layers of the high-density interconnecting sub-board is greater than or equal to the number of layers of the high-density interconnecting board, and the high-density interconnecting line The average wiring density of the daughter boards is greater than or equal to the average wiring density of the high density interconnect boards.

13. The circuit board of claim 1 wherein said first conductive post extends from said outer circuit layer to the interior of said high density interconnect.

14. A method of manufacturing a circuit board, characterized in that it comprises the following steps:

Forming at least a consistent hole on a substrate;

After forming the through hole, a high-density interconnecting board is fixed on the substrate, wherein the high-density interconnecting board covers the through hole;

Forming a body layer on the substrate, wherein the body layer covers the high-density interconnecting plate; forming a metal layer on the body layer;

After forming the body layer, forming at least one first conductive pillar connected between the high density interconnecting board and the substrate;

After forming the first conductive pillar, patterning the substrate and the metal layer to form an outer wiring layer and a wiring layer, respectively; wherein the high density interconnecting board is fixed on the substrate and forming the same The method of the main layer includes:

Coating or laminating an adhesive layer on the substrate;

Bonding the high density interconnector board to the adhesive layer;

An insulating layer is formed on the substrate and on the high density interconnecting board, wherein the insulating layer covers the high density interconnecting board.

The method of manufacturing a circuit board according to claim 14, wherein the adhesive layer fills the through hole, and the method of forming the first conductive column comprises:

Removing a portion of the adhesive layer within the through hole;

The through holes are subjected to through plating after removing a portion of the adhesive layer and before patterning the substrate.

The method of manufacturing a circuit board according to claim 14, wherein the method of forming the body layer further comprises:

After the high-density interconnecting board is bonded to the adhesive layer, a substrate is disposed between the insulating layer and the substrate, wherein the substrate has an opening, and the high-density interconnecting board is located at Inside the opening.

The method of manufacturing a circuit board according to claim 16, further comprising forming at least one second conductive pillar connected between the high-density interconnecting board and the metal layer after forming the main body layer. Wherein the substrate is a half cured film.

A method of manufacturing a wiring board according to claim 16, wherein the method is formed The method of the bulk layer further includes disposing a half cured film between the substrate and the substrate.

The method of manufacturing a circuit board according to claim 16, wherein the substrate is a circuit substrate, and after forming the body layer, further comprising forming at least one of the circuit substrate and the metal layer. A second conductive column between.

The method of manufacturing a circuit board according to claim 19, wherein said high-density interconnecting board is formed by cutting a first line mother board, and wherein said circuit board is cut by a second line mother board. Forming, the first line mother board includes a plurality of the high density interconnect boards, and the second line mother board includes a plurality of the circuit boards.

The method of manufacturing a circuit board according to claim 14, wherein said high-density interconnecting board has at least one pad, and said pad covers said through hole.

A method of manufacturing a wiring board according to claim 14, wherein said high-density interconnecting wiring board has an inner wiring layer, and said first conductive pillar is connected to said inner wiring layer.