WO2011155367A1 - Composition de résine permettant d'améliorer la force d'adhérence, article moulé en résine, article lié, et agent permettant d'améliorer la force d'adhérence - Google Patents

Composition de résine permettant d'améliorer la force d'adhérence, article moulé en résine, article lié, et agent permettant d'améliorer la force d'adhérence Download PDF

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Publication number
WO2011155367A1
WO2011155367A1 PCT/JP2011/062479 JP2011062479W WO2011155367A1 WO 2011155367 A1 WO2011155367 A1 WO 2011155367A1 JP 2011062479 W JP2011062479 W JP 2011062479W WO 2011155367 A1 WO2011155367 A1 WO 2011155367A1
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WO
WIPO (PCT)
Prior art keywords
resin
terephthalate resin
polyalkylene terephthalate
modified
adhesive
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Application number
PCT/JP2011/062479
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English (en)
Japanese (ja)
Inventor
耕一 坂田
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ウィンテックポリマー株式会社
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Publication date
Application filed by ウィンテックポリマー株式会社 filed Critical ウィンテックポリマー株式会社
Priority to JP2012519343A priority Critical patent/JP5773999B2/ja
Publication of WO2011155367A1 publication Critical patent/WO2011155367A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Definitions

  • the present invention relates to an adhesive force improving resin composition, a resin molded body obtained by molding the resin composition, a bonded body obtained by bonding the resin molded body to another molded body, and an adhesive strength improving agent.
  • Polyalkylene terephthalate resins have excellent mechanical strength, heat resistance, electrical properties, and moldability, and are therefore used in various fields as engineering plastics.
  • polybutylene terephthalate resin has particularly excellent mechanical strength, electrical properties, other physical and chemical properties, and is excellent in processability. For this reason, polybutylene terephthalate resins are used as engineering plastics in a wide range of applications such as automobiles, electrical / electronic parts, and the like.
  • an epoxy-based adhesive, a silicone-based adhesive, or the like can be used, but a silicone-based adhesive is preferably used for parts that require heat resistance, cold resistance, and the like.
  • improvement in the adhesion between the resin molded body and the silicone-based adhesive has been promoted.
  • a technique for improving the adhesive strength between a resin molded body containing a polybutylene terephthalate resin and a silicone-based adhesive is known. (Patent Documents 1 and 2).
  • Patent Document 1 discloses a polybutylene terephthalate resin having good adhesion to a silicone-based adhesive.
  • Patent Document 2 discloses a method for improving the adhesiveness of a resin molded product to a silicone-based adhesive by incorporating a specific elastomer and glass fiber in a polybutylene terephthalate resin composition.
  • Patent Documents 3 and 4 disclose a technique for making it easy to weld to another member by utilizing a decrease in melting point due to a decrease in crystallinity.
  • Patent Document 4 the technique which suppresses the deformation
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide a technique for improving the adhesiveness of a resin molded article containing a polyalkylene terephthalate resin to a silicone-based adhesive.
  • the present inventors include a modified polyalkylene terephthalate resin (A) obtained by copolymerizing an aromatic dicarboxylic acid excluding terephthalic acid and / or an esterified product thereof as a modifying component, and an unmodified polyalkylene terephthalate resin (B). It has been found that the above problems can be solved by using the mixture with the content of the modifying component adjusted to a specific range, and the present invention has been completed. More specifically, the present invention provides the following.
  • the modified polyalkylene terephthalate resin (A) is a modified polybutylene terephthalate resin
  • the unmodified polyalkylene terephthalate resin (B) is an unmodified polybutylene terephthalate resin. Resin composition.
  • a bonded body in which a pair of molded bodies are bonded via a silicone-based adhesive, and at least one of the pair of molded articles is a resin molded body according to (4).
  • An adhesive strength improver that is added to the raw material of the resin molded body in order to improve the adhesive force between the resin molded body and the silicone-based adhesive, and an aromatic dicarboxylic acid excluding terephthalic acid, and / or its Adhesion improvement wherein the modified polyalkylene terephthalate resin obtained by copolymerizing the esterified product as a modifying component is a main component, and the modification amount of the modifying component with respect to all dicarboxylic acid components is more than 12.5 mol% and not more than 35 mol%. Agent.
  • A modified polyalkylene terephthalate resin
  • B unmodified polyalkylene terephthalate resin
  • an adhesive strength improving agent an adhesive strength improving resin composition
  • a resin molded body a resin molded body
  • a bonded body a resin molded body
  • the adhesive force improver of the present invention is mainly composed of a modified polyalkylene terephthalate resin obtained by copolymerizing an aromatic dicarboxylic acid excluding terephthalic acid and / or an esterified product thereof as a modifying component.
  • the amount of modification exceeds 12.5 mol% and is 35 mol% or less.
  • Modified polyalkylene terephthalate resin (A) contains an aromatic dicarboxylic acid excluding terephthalic acid and / or an esterified product thereof as a copolymer component (hereinafter, this copolymer component may be referred to as “modified component”). Further, the modification amount of the modifying component is more than 12.5 mol% and 35 mol% or less. The modified amount of the modified component refers to the content (mol%) of the repeating unit derived from the modified component in all the dicarboxylic acid components of the modified polyalkylene terephthalate resin.
  • modification amount of the modifying component is 12.5 mol% or less, the effect of improving the adhesion of the resin molded body obtained using the resin composition of the present invention to the silicone-based adhesive is insufficient. If the amount of modification exceeds 35 mol%, the difference in melting point from the unmodified polyalkylene terephthalate (B) becomes large, so the component (B) is first melted during melt kneading or melt processing. ) Component and (B) component may not be uniformly melt-kneaded. About the upper limit of content, it can set suitably according to a use.
  • the modified polyalkylene terephthalate resin is a resin obtained by polycondensation of a dicarboxylic acid component and a glycol component containing alkylene glycol or an esterified product thereof.
  • the modified polyalkylene terephthalate resin contains an aromatic dicarboxylic acid excluding terephthalic acid and / or an esterified product thereof as a modified component. This does not mean that terephthalic acid is included as a copolymerization component. That is, a resin containing terephthalic acid as a copolymerization component and an aromatic dicarboxylic acid excluding terephthalic acid and / or its esterified product as a copolymerization component can also be used in the present invention.
  • aromatic dicarboxylic acids excluding terephthalic acid and / or esterified products thereof include C 8-14 aromatics such as isophthalic acid, phthalic acid, 2,6-naphthalenedicarboxylic acid, and 4,4′-dicarboxydiphenyl ether.
  • dicarboxylic acid components can be used alone or in combination of two or more.
  • aromatic dicarboxylic acid excluding terephthalic acid and / or its esterified product (modified component) it is particularly preferable to use isophthalic acid and / or an esterified product thereof.
  • glycol component examples include C 2 ⁇ such as 1,4-butanediol, ethylene glycol, propylene glycol, trimethylene glycol, 1,3-butylene glycol, hexamethylene glycol, neopentyl glycol, and 1,3-octanediol.
  • alkylene glycols such as diethylene glycol, triethylene glycol and dipropylene glycol; cycloaliphatic diols such as cyclohexanedimethanol and hydrogenated bisphenol A; aromatics such as bisphenol A and 4,4′-dihydroxybiphenyl diols, ethylene oxide 2 mol adduct of bisphenol a, propylene oxide 3 mol adduct of bisphenol a, alkylene oxide adducts of C 2-4 of bisphenol a Or ester-forming derivatives of these glycols (acetylated, etc.).
  • polyoxyalkylene glycols such as diethylene glycol, triethylene glycol and dipropylene glycol
  • cycloaliphatic diols such as cyclohexanedimethanol and hydrogenated bisphenol A
  • aromatics such as bisphenol A and 4,4′-dihydroxybiphenyl diols, ethylene oxide 2 mol adduct of bisphenol a, prop
  • the modified polyalkylene terephthalate resin is particularly preferably a modified polybutylene terephthalate resin.
  • Modified polybutylene terephthalate resin is a resin containing terephthalic acid, aromatic dicarboxylic acid excluding terephthalic acid and / or its esterified product (modified component) as a dicarboxylic acid component, and 1,4-butanediol as a glycol component. It is.
  • the modified polybutylene terephthalate resin contains the modified component in excess of 12.5 mol% and 35 mol% or less with respect to the total dicarboxylic acid component.
  • the modified polybutylene terephthalate resin has very good physical properties among the modified polyalkylene terephthalate resins, so it gives the molded resin a very good mechanical strength, electrical properties, and other physical and chemical properties. can do. Moreover, the high adhesiveness with a silicone type adhesive agent can also be provided with respect to the resin molding obtained.
  • the modified polyalkylene terephthalate resin can also contain monomer components other than the above-described monomers within a range not impairing the effects of the present invention.
  • the amount of terminal carboxyl groups of the modified polyalkylene terephthalate resin is not particularly limited as long as the object of the present invention is not impaired.
  • the terminal carboxyl group amount of the modified polyalkylene terephthalate resin is preferably 30 meq / kg or less, and more preferably 25 meq / kg or less. In the case of using a modified polyalkylene terephthalate resin having a terminal carboxyl group amount in such a range, it is difficult to receive a decrease in strength due to hydrolysis in a humid heat environment.
  • the melt index (MI) of the polyalkylene terephthalate resin of the present invention is not particularly limited as long as the object of the present invention is not impaired.
  • the melt index is preferably 5 g / min or more and 140 g / min or less. More preferably, it is 20 g / min or more and 100 g / min or less.
  • the resin composition has particularly excellent moldability.
  • the melt index is measured under the conditions of 235 ° C. and load of 2160 g by a method based on ASTM D-1238.
  • the melt index can be adjusted by blending polyalkylene terephthalate resins having different melt indexes, other resins, and other components (additives, etc.).
  • the production method of the modified polyalkylene terephthalate resin is not particularly limited, it can be suitably produced by a conventionally known method such as interfacial polycondensation using a condensation reaction or a transesterification reaction, melt polymerization, or solution polymerization.
  • the degree of polymerization of the resin can be further increased by heat-treating the obtained resin under reduced pressure or in the presence of an inert gas to cause solid phase polymerization.
  • the adhesive strength improver of the present invention may contain other components such as other resins and conventionally known additives as long as the effects of the present invention are not impaired.
  • the resin composition for improving adhesive force of the present invention comprises a modified polyalkylene terephthalate resin (A) obtained by copolymerizing an aromatic dicarboxylic acid excluding terephthalic acid and / or an esterified product thereof as a modifying component, and an unmodified polyalkylene terephthalate.
  • Resin (B) In the modified polyalkylene terephthalate resin (A), the modification amount of the modification component is more than 12.5 mol% and 35 mol% or less. That is, the adhesive force improving resin composition of the present invention is a resin composition containing the adhesive force improving agent of the present invention. Moreover, the resin composition of this invention is 8 mol% or more of the total modification amount represented by following formula (I).
  • the adhesiveness of the resin molded product to the silicone-based adhesive can be improved. While improving, the fall of physical properties, such as mechanical strength resulting from the fall of crystallinity, can be suppressed.
  • Modified polyalkylene terephthalate resin (A) The modified polyalkylene terephthalate resin (A) is the same as described above.
  • the effect of improving the adhesiveness with the silicone-based adhesive is easily obtained when the modified polybutylene terephthalate resin (A) having a large amount of modification of the modifying component is used.
  • the modification amount of the modifying component in the modified polyalkylene terephthalate resin is preferably 15 mol% or more.
  • the unmodified polyalkylene terephthalate resin (B) is a resin obtained by polycondensation of terephthalic acid and a glycol component containing alkylene glycol or an esterified product thereof.
  • the content of the unmodified polyalkylene terephthalate resin (B) in the resin composition of the present invention is not particularly limited, and as described above, the content is such that the total modification amount is 8 mol% or more according to the formula (I). Can be adjusted.
  • the resin composition of the present invention contains the modified polyalkylene terephthalate resin (A).
  • the modified polyalkylene terephthalate resin contains an aromatic dicarboxylic acid excluding terephthalic acid and / or an esterified product (modified component) as a copolymer component.
  • These modifying components impart a bent structure to the polymer. If the polymer has a bent structure, the crystallinity of the resin generally decreases. When the crystallinity of the resin is lowered, physical properties such as mechanical strength of the resin molded body may be lowered.
  • the resin composition of the present invention contains a modified polyalkylene terephthalate resin (A) and an unmodified polyalkylene terephthalate resin (B). If the unmodified polyalkylene terephthalate resin (B) is contained, even if the modified polyalkylene terephthalate resin (A) is included, a significant decrease in crystallinity as a resin composition can be avoided, and Decrease in physical properties can be suppressed. If the above-mentioned mixing suppresses the decrease in crystallinity within the above-mentioned preferable content range, the decrease in crystallinity can be sufficiently suppressed.
  • ⁇ Crystal density of sample
  • ⁇ c Crystal density of polyalkylene terephthalate
  • the modification amount of the modification component of the modified polyalkylene terephthalate resin (A) increases (for example, the modification amount is 20 mol% or more), it becomes difficult to mold a resin molded body made of the modified polyalkylene terephthalate resin (A).
  • the unmodified polyalkylene terephthalate resin (B) in combination, it can be easily molded even if the modification amount of the modifying component of the modified polyalkylene terephthalate resin (A) is large.
  • the effect of improving the moldability is exhibited even when the content of the modified polyalkylene terephthalate resin (A) is very large (for example, 50% by mass or more and 90% by mass or less).
  • the resin composition of the present invention may contain other resins within a range that does not impair the effects of the present invention, and within a range that does not impair the effects of the present invention, a nucleating agent, a colorant, an antioxidant, You may contain conventionally well-known additives, such as a stabilizer, a plasticizer, a lubricant, a mold release agent, and a flame retardant.
  • the resin composition of the present invention can be easily prepared using general equipment and methods conventionally used for preparing resin compositions.
  • the resin molded body of the present invention is formed by molding the resin composition of the present invention.
  • the molded article of the present invention is excellent in adhesiveness with a silicone-based adhesive.
  • the silicone adhesive will be described later.
  • a conventionally known method can be employed as a molding method for producing the resin molded body.
  • Examples of conventionally known molding methods include injection molding methods, injection compression molding methods, gas assist injection molding methods, heat compression molding methods, extrusion molding methods, and blow molding methods.
  • the bonded body of the present invention is a bonded body in which a pair of molded bodies are bonded via a silicone adhesive, and at least one of the pair of molded bodies is the resin molded body of the present invention. Since the resin molded body of the present invention is excellent in adhesiveness to the silicone adhesive, the problem of poor adhesion hardly occurs at the location where the resin molded body of the present invention and the silicone adhesive are bonded.
  • Silicone adhesive is an adhesive that cures at room temperature or by heating, and conventionally known adhesives can be used.
  • an addition reaction type silicone adhesive that cures by an addition reaction with a platinum catalyst is used. It is preferable to do.
  • the manufacturing method of a joined body is not specifically limited, For example, it can manufacture by the following methods.
  • the number of molded bodies to be joined may be two or more.
  • a silicone-based adhesive is disposed on the first resin molded body.
  • the arrangement method is not particularly limited, and examples thereof include brushing and potting.
  • the second resin molded body is placed on the silicone-based adhesive disposed on the first resin molded body, and the first resin molded body and the second resin molded body are in close contact with each other as necessary.
  • pressure is applied in the direction in which the first resin molded body and the second resin molded body overlap.
  • the silicone adhesive is cured at room temperature or by heating.
  • Unmodified polybutylene terephthalate resin 1 (unmodified PBT1): manufactured by Polyplastics Co., Ltd., trade name “DURANEX 400FP” (melt index (MI): 45 g / 10 min)
  • Unmodified polybutylene terephthalate resin 2 (unmodified PBT2): manufactured by Polyplastics Co., Ltd., trade name “DURANEX 500FP” (melt index (MI): 20 g / 10 min)
  • the melt index was measured under the conditions of 235 ° C. and load of 2160 g by a method based on ASTM D-1238.
  • Modified polybutylene terephthalate resin 1 (modified PBT1): isophthalic acid modified polybutylene terephthalate having a modified amount of 12.5 mol% (melt index (MI): 46 g / 10 min)
  • Modified polybutylene terephthalate resin 2 (modified PBT2): isophthalic acid modified polybutylene terephthalate having a modification amount of 15 mol% (melt index (MI): 46 g / 10 min)
  • Modified polybutylene terephthalate resin 3 (modified PBT3): isophthalic acid modified polybutylene terephthalate having a modification amount of 17 mol% (melt index (MI): 30 g / 10 min)
  • Modified polybutylene terephthalate resin 4 (modified PBT4): isophthalic acid-modified polybutylene terephthalate having a modification amount of 30 mol% (melt index (MI): 46 g / 10 min)
  • ⁇ Measurement of adhesive strength The bonded body is left in an environment of 23 ° C. and 50% RH for 24 hours or more, and the other resin test piece is peeled off at a peeling test speed of 5 mm / min using a universal testing machine, and the maximum peel strength is obtained. Was measured. The measurement results are shown in Tables 1 and 2.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

La présente invention concerne une technique permettant d'améliorer l'adhésivité d'un article moulé en résine, qui comprend une résine de polyalkylène téréphtalate sur un adhésif à base de silicone. Un mélange d'une (A) résine de polyalkylène téréphtalate modifié, obtenue par copolymérisation d'un acide dicarboxylique aromatique excluant l'acide téréphtalique et/ou son produit estérifié en tant que composant modificateur, et d'une (B) résine de polyalkylène téréphtalate non modifié, dans laquelle la teneur en composant modificateur est ajustée dans une plage spécifique, est utilisé. Il est préférable que la résine de polyalkylène téréphtalate modifié soit une résine de polybutylène téréphtalate modifié, et que l'acide dicarboxylique aromatique modifié et/ou son produit estérifié soit un acide isophtalique et/ou son produit estérifié.
PCT/JP2011/062479 2010-06-10 2011-05-31 Composition de résine permettant d'améliorer la force d'adhérence, article moulé en résine, article lié, et agent permettant d'améliorer la force d'adhérence WO2011155367A1 (fr)

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JP2012519343A JP5773999B2 (ja) 2010-06-10 2011-05-31 接着力改善用樹脂組成物、樹脂成形体、接合体及び接着力改善剤

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JP2010-133088 2010-06-10
JP2010133088 2010-06-10

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016199100A1 (fr) * 2015-06-10 2016-12-15 Sabic Global Technologies B.V. Jonctions plastique-métal et leurs procédés de fabrication

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07126496A (ja) * 1993-10-28 1995-05-16 Polyplastics Co ポリエステル樹脂組成物及び成形品
JP2002338797A (ja) * 2001-05-11 2002-11-27 Sumitomo Dow Ltd インサート成形に適したフィルム用樹脂組成物およびそれからなるインサート成形用フィルム
JP2005238851A (ja) * 1999-08-30 2005-09-08 Toyo Kohan Co Ltd 化粧板積層用印刷樹脂フィルム及びそれを積層した化粧板
JP2009155447A (ja) * 2007-12-26 2009-07-16 Wintech Polymer Ltd ポリブチレンテレフタレート樹脂組成物
JP2009155449A (ja) * 2007-12-26 2009-07-16 Wintech Polymer Ltd 携帯端末部品

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4456392B2 (ja) * 2003-03-28 2010-04-28 ウィンテックポリマー株式会社 レーザー溶着用樹脂組成物及び成形品
JP4799857B2 (ja) * 2004-12-24 2011-10-26 ウィンテックポリマー株式会社 インサート成形品

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07126496A (ja) * 1993-10-28 1995-05-16 Polyplastics Co ポリエステル樹脂組成物及び成形品
JP2005238851A (ja) * 1999-08-30 2005-09-08 Toyo Kohan Co Ltd 化粧板積層用印刷樹脂フィルム及びそれを積層した化粧板
JP2002338797A (ja) * 2001-05-11 2002-11-27 Sumitomo Dow Ltd インサート成形に適したフィルム用樹脂組成物およびそれからなるインサート成形用フィルム
JP2009155447A (ja) * 2007-12-26 2009-07-16 Wintech Polymer Ltd ポリブチレンテレフタレート樹脂組成物
JP2009155449A (ja) * 2007-12-26 2009-07-16 Wintech Polymer Ltd 携帯端末部品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016199100A1 (fr) * 2015-06-10 2016-12-15 Sabic Global Technologies B.V. Jonctions plastique-métal et leurs procédés de fabrication

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JPWO2011155367A1 (ja) 2013-08-01

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