WO2011152410A1 - Cigs型の太陽電池およびcigs型の太陽電池用の基板 - Google Patents
Cigs型の太陽電池およびcigs型の太陽電池用の基板 Download PDFInfo
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- WO2011152410A1 WO2011152410A1 PCT/JP2011/062512 JP2011062512W WO2011152410A1 WO 2011152410 A1 WO2011152410 A1 WO 2011152410A1 JP 2011062512 W JP2011062512 W JP 2011062512W WO 2011152410 A1 WO2011152410 A1 WO 2011152410A1
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- Prior art keywords
- layer
- cigs
- solar cell
- alkali metal
- electrode layer
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- 239000000758 substrate Substances 0.000 title claims abstract description 111
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract description 84
- 150000001340 alkali metals Chemical class 0.000 claims abstract description 84
- 150000001875 compounds Chemical class 0.000 claims abstract description 73
- 239000011521 glass Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 17
- 229910013641 LiNbO 3 Inorganic materials 0.000 claims description 12
- 239000002585 base Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229940125904 compound 1 Drugs 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 2
- 229910003334 KNbO3 Inorganic materials 0.000 abstract 1
- 229910003327 LiNbO3 Chemical class 0.000 abstract 1
- MUPJWXCPTRQOKY-UHFFFAOYSA-N sodium;niobium(5+);oxygen(2-) Chemical class [O-2].[O-2].[O-2].[Na+].[Nb+5] MUPJWXCPTRQOKY-UHFFFAOYSA-N 0.000 abstract 1
- 239000011734 sodium Substances 0.000 description 30
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 22
- 238000011156 evaluation Methods 0.000 description 15
- 238000012360 testing method Methods 0.000 description 15
- 239000003513 alkali Substances 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 239000011787 zinc oxide Substances 0.000 description 11
- 238000004544 sputter deposition Methods 0.000 description 10
- 239000012298 atmosphere Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 229910052708 sodium Inorganic materials 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 229910052738 indium Inorganic materials 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000000605 extraction Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000011669 selenium Substances 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 229910052733 gallium Inorganic materials 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 239000011701 zinc Substances 0.000 description 5
- -1 Cu (In Chemical class 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 230000031700 light absorption Effects 0.000 description 4
- 239000000395 magnesium oxide Substances 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 239000011591 potassium Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 description 2
- 229910052951 chalcopyrite Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 230000001443 photoexcitation Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000010913 antigen-directed enzyme pro-drug therapy Methods 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- PNHVEGMHOXTHMW-UHFFFAOYSA-N magnesium;zinc;oxygen(2-) Chemical compound [O-2].[O-2].[Mg+2].[Zn+2] PNHVEGMHOXTHMW-UHFFFAOYSA-N 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
- H01L31/0749—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type including a AIBIIICVI compound, e.g. CdS/CulnSe2 [CIS] heterojunction solar cells
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3607—Coatings of the type glass/inorganic compound/metal
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3668—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties
- C03C17/3678—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties specially adapted for use in solar cells
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
- C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03923—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate including AIBIIICVI compound materials, e.g. CIS, CIGS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
Definitions
- the present invention relates to a CIGS type solar cell and a substrate constituting such a solar cell.
- a general CIGS type solar cell is configured by laminating a Mo (molybdenum) electrode, a CIGS layer, a buffer layer, and a ZnO (zinc oxide) electrode in this order on a substrate such as glass.
- the buffer layer is an n-type semiconductor layer
- the CIGS layer is a p-type semiconductor layer. Therefore, when the CIGS layer (pn junction) is irradiated with light, a photoelectromotive force is generated by photoexcitation of electrons. For this reason, a direct current can be taken out from both electrodes by light irradiation to the solar cell.
- the CIGS layer is usually composed of a compound such as Cu (In, Ga) Se 2 . Further, it is known that the CIGS layer has a reduced defect density and an improved carrier concentration due to the presence of an alkali metal such as Na (sodium). When a CIGS layer having a high carrier concentration is used, the energy conversion efficiency of the solar cell is improved. Therefore, it has been proposed to provide a layer containing an alkali metal such as Na (sodium) between the Mo electrode and the CIGS layer (Patent Documents 1 and 2). In this case, in the solar cell manufacturing process, the alkali metal can be diffused from the layer containing the alkali metal to the CIGS layer. Thereby, the energy conversion efficiency of the solar cell can be further improved.
- the layer containing an alkali metal described in the above-mentioned literature has hygroscopicity or has a property of dissolving in water, there is a problem that handling is difficult and durability is inferior.
- Na 2 S as described in Patent Document 1 an environment in which contact with an atmosphere containing moisture is blocked during the manufacture of a solar cell, or an environment in which humidity is controlled. Is required.
- the member cannot be washed with water or an aqueous solution when the foreign matter is removed, or the member cannot be washed.
- SLG soda lime glass
- SLG has an alkali metal content of only about 22 atomic% with respect to the total amount of other metal cation elements, and an alkali metal source having a higher alkali metal content is desired.
- the present invention has been made in view of such a background, and the present invention provides a CIGS solar cell capable of diffusing an alkali metal in a CIGS layer with a more realistic configuration. Objective. Moreover, it aims at providing the board
- the alkali metal supply layer may have a thickness in a range of 20 nm to 200 nm. More preferably, it may have a thickness in the range of 20 nm to 100 nm.
- the substrate on which the back electrode layer is provided (in this specification, this substrate is referred to as an insulating support substrate) is composed of an insulating base material itself or a conductive substrate. You may comprise by providing an insulating layer in a material.
- the insulating support substrate is preferably a glass substrate or a plastic substrate.
- this invention has a back surface electrode layer installed on the 1st surface of an insulating support substrate, and an alkali metal supply layer, and this alkali metal supply layer is the said 1st surface and the said back surface electrode.
- the alkali metal supply layer Provided between the layers, or on the upper layer of the back electrode layer, or between the first surface and the back electrode layer and on the upper layer of the back electrode layer, The alkali metal supply layer, a substrate for a solar cell of a CIGS type, characterized in that it comprises a NaNbO 3 compound and KNbO 3 Compound 1 or more compounds selected from the group consisting of are provided.
- the alkali metal supply layer is the said 1st surface and the said back surface electrode.
- the alkali metal supply layer includes one or more compounds selected from the group consisting of LiNbO 3 , NaNbO 3 compounds, and KNbO 3 compounds, thereby providing a substrate for a CIGS type solar cell.
- the alkali metal supply layer preferably has a thickness in the range of 20 nm to 200 nm. More preferably, the thickness is in the range of 20 nm to 100 nm.
- the substrate for a solar cell according to the present invention may be constituted by an insulating base material itself, or may be constituted by providing an insulating layer on a conductive base material.
- the present invention has an alkali metal supply layer installed on the first surface of the insulating support substrate,
- the alkali metal supply layer, a substrate for a solar cell of a CIGS type, characterized in that it comprises a NaNbO 3 compound and KNbO 3 Compound 1 or more compounds selected from the group consisting of are provided.
- it has an alkali metal supply layer installed on the first surface of the insulating support substrate,
- the alkali metal supply layer includes at least one compound selected from the group consisting of a LiNbO 3 compound, a NaNbO 3 compound, and a KNbO 3 compound, thereby providing a substrate for a CIGS type solar cell.
- the alkali metal supply layer preferably has a thickness in the range of 20 nm to 200 nm. More preferably, the thickness is in the range of 20 nm to 100 nm.
- substrate for solar cells by this invention may be comprised by insulating base material itself, or may be comprised by installing an insulating layer in a conductive base material.
- the alkali metal is diffused into the CIGS layer with a more realistic configuration without impairing water resistance, low hygroscopicity or low solubility in water, and without impairing handling characteristics in the manufacturing process of the solar cell. It is possible to provide a CIGS solar cell that can be made to operate. Moreover, it becomes possible to provide the board
- FIG. 1 schematically shows a cross-sectional view of an example of a conventional CIGS type solar cell.
- a conventional CIGS solar cell 10 includes an insulating support substrate 11, a first conductive layer 12a, an alkali metal-containing layer (alkali metal supply layer) 19, and a second conductive layer.
- the layer 12b, the light absorption layer 13, the first semiconductor layer 14, the second semiconductor layer 15, and the transparent conductive layer 16 are stacked in this order.
- the solar cell 10 has extraction electrodes 17 and 18.
- the arrow 90 indicates the incident direction of light with respect to the solar cell 1.
- the first conductive layer 12 a and the second conductive layer 12 b are made of Mo (molybdenum) and function as the positive electrode of the solar cell 10.
- the transparent conductive layer 16 is made of ZnO (zinc oxide) or the like and functions as the negative electrode of the solar cell 1.
- the first semiconductor layer 14 and the second semiconductor layer 15 are also referred to as buffer layers, and a high resistance layer is formed between the light absorption layer 13 and the transparent conductive layer 16, so that a shunt path of the solar cell is formed. ).
- the light absorption layer 13 is usually composed of a compound such as Cu (In, Ga) Se 2 .
- this layer is referred to as a “CIGS layer 13”.
- the alkali metal supply layer 19 is provided to supply the alkali metal to the CIGS layer 13.
- the alkali metal supply layer 19 is made of a compound such as Na 2 S, Na 2 Se, NaCl, or NaF, for example.
- the CIGS layer 13 is known to have a reduced defect density and an improved carrier concentration due to the presence of an alkali metal such as Na (sodium). Therefore, when the alkali metal supply layer 19 is installed in the vicinity of the CIGS layer 13, the alkali metal moves from the alkali metal supply layer 19 toward the CIGS layer 13, thereby reducing the defect density of the CIGS layer 13. Carrier concentration is improved. Thereby, the energy conversion efficiency of the solar cell 1 is improved.
- the buffer layers 14 and 15 are n-type semiconductor layers, and the CIGS layer 13 is a p-type semiconductor layer. Therefore, when the CIGS layer 13 (pn junction) is irradiated with light, a photovoltaic force is generated by photoexcitation of electrons. For this reason, the solar cell 1 was irradiated with light and connected to the extraction electrode 17 connected to the first conductive layer 12a and the second conductive layer 12b (hereinafter positive electrode) and to the transparent conductive layer 16 (negative electrode). A direct current can be taken out through the take-out electrode 18.
- the above-described compound constituting the alkali metal supply layer 4 has a hygroscopic property or a property of being dissolved in water.
- the conventional solar cell 1 has the problem that handling is difficult at the time of manufacture of a solar cell, and durability is inferior.
- the alkali metal supply layer 4 having Na 2 S an environment in which contact with an atmosphere containing moisture is cut off or an environment in which the humidity is controlled is required during manufacturing of the solar cell. Further, in the process of manufacturing the solar cell, the member cannot be washed with water or an aqueous solution when the foreign matter is removed.
- FIG. 2 schematically shows a cross-sectional view of an example of a CIGS type solar cell 100 according to the present invention.
- the CIGS solar cell 100 according to the present invention includes an insulating support substrate 110, an alkali metal supply layer 120, a back electrode layer 130, a CIGS layer 160, a buffer layer 170, and a transparent surface.
- the electrode layer 180 is configured by stacking in this order.
- the solar cell 100 has an extraction part electrically connected to each electrode layer, such as the extraction electrodes 17 and 18 shown in FIG.
- An arrow 190 indicates the incident direction of light with respect to the CIGS type solar cell 100.
- the insulative support substrate 110 has a function of supporting each layer stacked thereon.
- the alkali metal supply layer 120 functions as a supply source for supplying an alkali metal such as Na (sodium), K (potassium), Li (lithium) or the like into the CIGS layer 160.
- the back electrode layer 130 and the transparent surface electrode layer 180 function as electrodes for taking out electricity generated in the CIGS layer 160 by light irradiation to the outside.
- the CIGS layer 160 and the buffer layer 170 those having various known materials, characteristics, and functions used for CIGS type solar cells can be used.
- NaNbO 3 compound has a feature that it includes a KNbO 3 compound and LiNbO 3 1 or more compounds selected from the group consisting of compounds.
- NaNbO 3 compounds, KNbO 3 compounds and LiNbO 3 compounds are stable oxides in the atmosphere and have the property of hardly dissolving in water. Therefore, by configuring the alkali metal supply layer 120 to have such a compound, the solar cell 10 is manufactured due to the above-described problems, that is, the hygroscopicity of the alkali metal supply layer 19 and the solubility in water. The problem that handling at the time becomes complicated or the durability is lowered can be significantly suppressed. In addition, in the manufacturing process of the solar cell, the problem that it becomes impossible to wash or wash the member with water or an aqueous solution when removing foreign matters is solved.
- the solar cell 100 of this invention since the solar cell 100 of this invention has the alkali metal supply layer 120 containing an above-described compound, it can supply an alkali metal in the CIGS layer 160.
- FIG. 1 In the CIGS layer 160 supplied with the alkali metal, the defect density is reduced and the carrier concentration is improved. Therefore, in the solar cell 100 of the present invention, it can be expected that high energy conversion efficiency can be obtained.
- the alkali metal supply layer 120 is disposed between the insulating support substrate 110 and the back electrode layer 130.
- the configuration of the present invention is not limited to this.
- the alkali metal supply layer 120 may be disposed between the back electrode layer 130 and the CIGS layer 160.
- the alkali metal supply layer 120 may be provided at two places between the insulating support substrate 110 and the back electrode layer 130 and between the back electrode layer 130 and the CIGS layer 160.
- the insulating support substrate 110 may be composed of any member as long as it has a function of supporting each member stacked on the insulating support substrate 110. Further, the shape of the insulating support substrate is not limited to a flat plate shape, and may be a curved shape or a tubular shape. As long as it has a function which can form each layer laminated
- the insulating support substrate is preferably made of an insulator itself, such as glass or polyimide.
- the composition is not particularly limited, and the glass may be phosphate-based or silica-based.
- the insulating support substrate 110 is, for example, in terms of oxide, 60 mol% to 80 mol% SiO 2 , 0.5 mol% to 7 mol% Al 2 O 3 , 3 mol% to 10 mol% MgO, 6 mol% ⁇ 9 mol% of CaO, 0 ⁇ 5mol% of SrO, 0 ⁇ 4mol% of BaO, 0 ⁇ 2mol% of ZrO 2, 4mol% ⁇ 13mol% of Na 2 O, and 0.1 mol% ⁇ 7 mol% of K
- a composition containing 2 O may also be used.
- the insulating support substrate may be one containing only a small amount of alkali metal, such as non-alkali glass.
- alkali-free glass in terms of oxide, the sum of Li 2 O + Na 2 O + K 2 O refers to 0.1 mass% of glass.
- the alkali-free glass include SiO 2 : 50 to 66%, Al 2 O 3 : 10.5 to 22%, B 2 O 3 : 0 to 12%, MgO: 0 in terms of mass% based on oxide.
- the insulating support substrate 110 may be configured by installing an insulating layer on the surface of a conductive material.
- the conductive material may be a metal such as stainless steel or an aluminum alloy.
- the insulating layer may be an oxide or the like.
- the thickness of the insulating support substrate 110 is, for example, in the range of 0.5 mm to 6 mm.
- the alkali metal supply layer 120 is made of a niobium oxide containing an alkali metal.
- the alkali metal supply layer 120 is preferably at least one compound selected from the group consisting of a LiNbO 3 compound, a NaNbO 3 compound, and a KNbO 3 compound.
- One or more compounds selected from the group consisting of LiNbO 3 compounds, NaNbO 3 compounds, and KNbO 3 compounds have a high alkali atom content of 50 atomic% with respect to the total amount of other metal cation elements. Has metal content.
- the NaNbO 3 compound has the highest melting point and is sintered at a higher sintering temperature than the LiNbO 3 compound and KNbO 3 compound. Therefore, it is particularly preferable in that a sintered compact sputtering target used for film formation can be easily produced at a high density.
- the alkali metal supply layer 120 does not have any trouble even if other components are contained to such an extent that the objects and effects of the present invention are not impaired.
- the alkali metal supply layer 120 contains elements other than Li (lithium), Na (sodium), K (potassium), Nb (niobium), and O (oxygen) in a range of 20% by mass or less based on the total mass. It does not matter. Such a compound is not hygroscopic and has a very low solubility in water and is stable.
- the thickness of the alkali metal supply layer 120 is, for example, in the range of 20 nm to 200 nm.
- the thickness of the alkali metal supply layer 120 is more preferably in the range of 20 nm to 100 nm. In such a range, good adhesion can be obtained between the alkali metal supply layer 120 and the back electrode layer 130 or between the back electrode layer 130 and the CIGS layer 160.
- the back electrode layer 130 is made of, for example, Mo (molybdenum), Ti (titanium), Al (aluminum), or Cr (chromium).
- the thickness of the back electrode layer 130 is, for example, in the range of 100 nm to 1000 nm (preferably 300 nm to 700 nm, for example, 500 nm).
- the adhesion with the substrate 110 or the adhesion with the alkali supply layer may be reduced.
- the film thickness of the back surface electrode layer 130 becomes too thin, the electrical resistance of the electrode increases.
- the method for forming the back electrode layer 130 is not particularly limited.
- the back electrode layer 130 can be formed on the surface of the insulating support substrate 110 by, for example, sputtering, vapor deposition, vapor deposition (PVD, CVD), or the like.
- CIGS layer 160 is made of a compound containing a group Ib element, a group IIIb element, and a group VIb element in the periodic table.
- the CIGS layer 160 is made of, for example, a semiconductor having a crystal structure typified by chalcopyrite.
- the CIGS layer 160 includes at least one element M selected from the group consisting of Cu (copper), In (indium), and Ga (gallium), and a group consisting of Se (selenium) and S (sulfur). And at least one selected element A.
- the CIGS layer 160 can be used as a CIGS layer 160, CuInSe 2, CuIn (Se , S) 2, Cu (In, Ga) Se 2, and Cu (In, Ga) (Se , S) 2 and the like.
- the CIGS layer 160 may be made of a semiconductor having a crystal structure similar to chalcopyrite.
- the thickness of the CIGS layer 160 is not particularly limited, but is, for example, in the range of 1000 nm to 3000 nm.
- the buffer layer 170 is made of, for example, a compound containing Cd (cadmium) or Zn (zinc) that forms a semiconductor layer.
- the compound containing Cd include CdS (cadmium sulfide), and examples of the compound containing Zn include materials such as ZnO (zinc oxide), ZnS (sulfurized zinc), and ZnMgO (zinc magnesium oxide).
- the buffer layer 170 may be composed of a plurality of semiconductor layers, as shown in FIG.
- the first layer on the side close to the CIGS layer 160 is made of the compound containing CdS or Zn as described above, and the second layer on the side far from the CIGS layer 160 is ZnO (zinc oxide). Or a material containing ZnO.
- the thickness of the buffer layer 170 is not particularly limited, but is, for example, in the range of 50 nm to 300 nm.
- the transparent surface electrode layer 180 is made of, for example, a material such as ZnO (zinc oxide) or ITO (indium tin oxide). Alternatively, these materials may be doped with a group III element such as Al (aluminum).
- the transparent surface electrode layer 180 may be formed by laminating a plurality of layers.
- the thickness of the transparent surface electrode layer 180 (the total thickness in the case of a plurality of layers) is not particularly limited, but is, for example, in the range of 100 nm to 3000 nm. Note that a conductive extraction member may be further electrically connected to the transparent surface electrode layer 180.
- Such a takeout member is preferably composed of one or more metals selected from, for example, Ni (nickel), Cr (chromium), Al (aluminum), and Ag (silver).
- the solar cell of the present invention has an alkali supply layer, a back electrode layer, a CIGS layer, a buffer layer, and a transparent surface electrode layer on the surface of the insulating support substrate, or on the surface of the insulating support substrate.
- the substrate for solar cells of the present invention has an alkali supply layer and a back electrode layer on the surface of the insulating support substrate, or a back electrode layer and an alkali supply layer on the insulating support substrate. Or having an alkali supply layer, a back electrode layer, and an alkali supply layer on the insulating support substrate.
- the substrate for a solar cell of the present invention is characterized by having an alkali supply layer on the surface of the insulating support substrate.
- it is durable between the above-described layers, or between the surface of the insulating support substrate and the layer formed thereon, as necessary. Additional layers may be formed to improve the properties, adhesion, electrical characteristics, power generation efficiency, and the like.
- a NaNbO 3 layer as an alkali supply layer and a Mo layer as a back electrode layer were sequentially formed on a glass substrate to prepare a test sample. Moreover, each characteristic shown below was evaluated using these test samples.
- a glass substrate was prepared. The dimensions of the glass substrate were 50 mm long ⁇ 50 mm wide ⁇ 1.1 mm thick. The composition of this glass substrate is 72 mol% SiO 2 , 1.1 mol% Al 2 O 3 , 5.5 mol% MgO, 8.6 mol% CaO, 12.6 mol% Na 2 O in terms of oxide. And 0.2 mol% K 2 O.
- a NaNbO 3 layer was formed on the glass substrate by sputtering.
- a magnetron RF sputtering apparatus (SPF210H, manufactured by Anerva Corporation) was used.
- SPF210H magnetron RF sputtering apparatus
- a NaNbO 3 sintered body target a NaNbO 3 layer was formed on a glass substrate.
- the NaNbO 3 sintered body target used was Na 2 CO 3 powder (special grade manufactured by Kanto Chemical Co., Ltd.) and Nb 2 O 5 powder (3N grade manufactured by High Purity Chemical Laboratory).
- a sintered compact target was prepared through pulverization, molding, and sintering (at 1330 ° C. in air for 2 hours).
- the NaNbO 3 sintered body target used contained 0.01 mass% of K (potassium) with respect to the total mass in terms of K 2 O.
- the film forming atmosphere was a mixed gas of argon and oxygen. Oxygen in the mixed gas is 3 vol%.
- the sputtering pressure was 1.3 Pa, and the film formation temperature (substrate temperature) was room temperature.
- the film thickness of the NaNbO 3 layer was 20 nm, 50 nm, 100 nm, 200 nm, and 500 nm (respectively, test samples No. 1 to No. 5).
- a Mo layer was formed on the NaNbO 3 layer of each sample.
- a magnetron DC sputtering apparatus (SPL-711V, manufactured by Tokki Co., Ltd.) was used for forming the Mo layer.
- Mo target was used for the target.
- the film forming atmosphere was argon, and the sputtering pressure was 1.3 Pa.
- the film formation temperature was room temperature.
- the thickness of the Mo layer was unified to about 500 nm.
- test sample No. 6 a test sample in which a Mo layer (500 nm) was directly formed on the surface of a glass substrate without forming a NaNbO 3 layer was prepared (referred to as test sample No. 6). Table 1 summarizes the layer structure and the film thickness of NaNbO 3 in each test sample.
- an ITO (indium tin oxide) film having a thickness of about 300 nm was formed on the top of the Mo layer by sputtering to produce an evaluation sample.
- the above-described magnetron DC sputtering apparatus was used for forming the ITO film.
- An ITO target doped with 10% by mass of SnO 2 was used as the target.
- a mixed gas of argon and oxygen (oxygen 1 vol%) was used as the sputtering gas.
- the sputtering pressure was 0.4 Pa.
- the film formation temperature (substrate temperature) was room temperature.
- this evaluation sample was held at 550 ° C. for 30 minutes in a nitrogen atmosphere to diffuse Na in the glass substrate into the ITO film.
- the ITO film of the evaluation sample was dry-etched from the outermost surface side using a SIMS (Secondary Ion Mass Spectroscopy) apparatus (ADEPT 1010, manufactured by ULVAC-PHI), and the amount of Na detected at this time was measured.
- O 2 + ions were used as primary ions.
- the acceleration voltage was 3 kV and the beam current was 200 nA.
- the raster size is 300 ⁇ m ⁇ 300 ⁇ m.
- the etching rate was about 1 nm / second. The measurement was performed at two places for each evaluation sample.
- FIG. 3 shows that the amount of Na diffusion can be changed by changing the thickness of the NaNbO 3 layer. That is, in the configuration of the present invention, it is considered that the amount of Na diffused into the CIGS layer can be controlled relatively easily by adjusting the thickness of the NaNbO 3 layer.
- test sample No. 1-No. 6 was used for relative evaluation of the adhesion of the Mo layer by the following method. First, each test sample was held in a nitrogen atmosphere for 10 minutes at 550 ° C. and (2) in an atmosphere adjusted to 50 ° C. and a relative humidity of 50% for 24 hours. Next, an adhesive tape (CT-24, manufactured by Nichiban Co., Ltd.) was applied on the Mo layer, and it was evaluated whether or not the Mo layer was peeled when it was peeled off.
- CT-24 manufactured by Nichiban Co., Ltd.
- the present invention has excellent water resistance, low moisture absorption, and poor solubility in water, can diffuse alkali metal in the CIGS layer, can increase the carrier concentration, and can achieve the energy conversion efficiency of the solar cell. It is possible to provide a substrate for a solar cell that can improve the efficiency of the solar cell, and by using such a substrate, it is possible to obtain a CIGS type solar cell with improved energy conversion efficiency, which is useful.
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Abstract
Description
一般的なCIGS型の太陽電池は、ガラス等の基板の上に、Mo(モリブデン)電極、CIGS層、バッファ層、およびZnO(酸化亜鉛)電極を、この順に積層することにより構成される。
このような構成において、バッファ層は、n型半導体層となり、CIGS層は、p型半導体層となっている。従って、CIGS層(pn接合部)に光が照射されると、電子の光励起によって、光起電力が発生する。このため、太陽電池への光照射によって、両電極から、外部に直流電流を取り出すことができる。
そのため、Mo電極とCIGS層の間に、Na(ナトリウム)のようなアルカリ金属を含む層を設けることが提案されている(特許文献1、2)。この場合、太陽電池の製造過程において、アルカリ金属を含む層からCIGS層に、アルカリ金属を拡散させることができる。またこれにより、太陽電池のエネルギー変換効率をさらに向上させることができる。
また、アルカリ金属の供給源として、基板にソーダライムガラス(SLGと称す)を用いることが知られている。しかしながら、SLGは、アルカリ金属含有率が、他の金属カチオン元素の総量に対して、おおよそ22原子%でしかなく、より高いアルカリ金属含有率を有するアルカリ金属の供給源が望まれている。
絶縁性支持基板と、
前記絶縁性支持基板の上に設けられた裏面電極層と、
前記裏面電極層の上に設けられたCIGS層と、
前記CIGS層の上に設けられたバッファ層と、
前記バッファ層の上に設けられた透明表面電極層と、
を有するCIGS型の太陽電池であって、
さらに、前記絶縁性支持基板と前記裏面電極層の間、または前記裏面電極層と前記CIGS層の間、または前記絶縁性支持基板と前記裏面電極層の間と前記裏面電極層と前記CIGS層の間の双方に、アルカリ金属供給層を有し、
該アルカリ金属供給層は、NaNbO3化合物およびKNbO3化合物からなる群から選ばれる1種以上の化合物を含むことを特徴とする太陽電池が提供される。
また、本発明では、
絶縁性支持基板と、
前記絶縁性支持基板の上に設けられた裏面電極層と、
前記裏面電極層の上に設けられたCIGS層と、
前記CIGS層の上に設けられたバッファ層と、
前記バッファ層の上に設けられた透明表面電極層と、
を有するCIGS型の太陽電池であって、
さらに、前記絶縁性支持基板と前記裏面電極層の間、または前記裏面電極層と前記CIGS層の間、または前記絶縁性支持基板と前記裏面電極層の間と前記裏面電極層と前記CIGS層の間の双方に、アルカリ金属供給層を有し、
該アルカリ金属供給層は、LiNbO3化合物、NaNbO3化合物およびKNbO3化合物からなる群から選ばれる1種以上の化合物を含むことを特徴とする太陽電池。
また、本発明による太陽電池において、裏面電極層が設けられる基板(本明細書において、この基板を絶縁性支持基板と称する。)は、絶縁性の基材自体で構成され、または導電性の基材に絶縁層を設けることにより構成されても良い。
この場合、特に、前記絶縁性支持基板は、ガラス基板またはプラスチック基板が好ましい。
前記アルカリ金属供給層は、NaNbO3化合物およびKNbO3化合物からなる群から選ばれる1種以上の化合物を含むことを特徴とするCIGS型の太陽電池用の基板が提供される。
また、本発明では、絶縁性支持基板の第1の表面上に設置された裏面電極層と、アルカリ金属供給層とを有し、該アルカリ金属供給層は、前記第1の表面と前記裏面電極層の間、または前記裏面電極層の上層に、または前記第1の表面と前記裏面電極層の間と前記裏面電極層の上層の双方に、設けられ、
前記アルカリ金属供給層は、LiNbO3、NaNbO3化合物およびKNbO3化合物からなる群から選ばれる1種以上の化合物を含むことを特徴とするCIGS型の太陽電池用の基板が提供される。
ここで、本発明による太陽電池用の基板において、前記アルカリ金属供給層は、20nm~200nmの範囲の厚さが好ましい。より好ましくは、20nm~100nmの範囲の厚さである。
また、本発明による太陽電池用の基板は、絶縁性の基材自体で構成され、または導電性の基材に絶縁層を設けることにより構成されても良い。
該アルカリ金属供給層は、NaNbO3化合物およびKNbO3化合物からなる群から選ばれる1種以上の化合物を含むことを特徴とするCIGS型の太陽電池用の基板が提供される。
さらに、本発明では、絶縁性支持基板の第1の表面上に設置されたアルカリ金属供給層を有し、
該アルカリ金属供給層は、LiNbO3化合物、NaNbO3化合物およびKNbO3化合物からなる群から選ばれる1種以上の化合物を含むことを特徴とするCIGS型の太陽電池用の基板が提供される。
ここで、本発明による太陽電池用の基板において、前記アルカリ金属供給層は、20nm~200nmの範囲の厚さが好ましい。より好ましくは、20nm~100nmの範囲の厚さである。
また、本発明による太陽電池用の基板は、絶縁性の基材自体で構成され、または導電性の基材に絶縁層を設置することにより構成されても良い。
まず、本発明の特徴をより良く理解するため、従来のCIGS型太陽電池の構成について、簡単に説明する。
図1には、従来のCIGS型の太陽電池の一例の断面図を概略的に示す。
図1に示すように、従来のCIGS型の太陽電池10は、絶縁性支持基板11と、第1の導電層12aと、アルカリ金属を含む層(アルカリ金属供給層)19と、第2の導電層12bと、光吸収層13と、第1の半導体層14と、第2の半導体層15と、透明導電層16とを、この順に積層することにより構成される。さらに、通常の場合、太陽電池10は、取り出し電極17および18を有する。なお、矢印90は、太陽電池1に対する光の入射方向を示している。
第1の半導体層14および第2の半導体層15は、バッファ層とも呼ばれ、光吸収層13と透明導電層16との間に高抵抗層を形成することにより、太陽電池のシャントパス(shuntpass)を低減する機能を有する。
光吸収層13は、通常、Cu(In,Ga)Se2のような化合物で構成される。なお、光吸収層13は、通常、CIGS層とも称されるため、以下、この層を「CIGS層13」と称する。
これに対して、本発明による太陽電池では、以降に詳細に示すように、特別なハンドリングを行う必要がなく、水洗等が可能であり、前述のような耐久性に対する問題も有意に抑制されるという特徴を有する。
図2には、本発明によるCIGS型の太陽電池100の一例の断面図を概略的に示す。
図2に示すように、本発明によるCIGS型の太陽電池100は、絶縁性支持基板110と、アルカリ金属供給層120と、裏面電極層130と、CIGS層160と、バッファ層170と、透明表面電極層180とを、この順に積層することにより構成される。なお、図には示さないが、この他、通常の場合、太陽電池100は、図1に示した取り出し電極17、18のような、各電極層と電気的に接続された取り出し部を有する。矢印190は、CIGS型の太陽電池100に対する光の入射方向を示している。
アルカリ金属供給層120は、CIGS層160中に、アルカリ金属、例えばNa(ナトリウム)、K(カリウム)、Li(リチウム)等を供給するための供給源として機能する。
裏面電極層130および透明表面電極層180は、光照射によってCIGS層160で生じた電気を外部に取り出すための電極として機能する。
なお、CIGS層160、バッファ層170としては、CIGS型の太陽電池用として使用されている公知な各種材料、特性、機能を有するものが使用できる。
NaNbO3化合物、KNbO3化合物およびLiNbO3化合物は、大気中で安定な酸化物であり、水に対してほとんど溶解しないという特性を有する。
従って、アルカリ金属供給層120をこのような化合物を有するように構成することにより、前述のような問題、すなわちアルカリ金属供給層19の吸湿性、および水に対する溶解性のため、太陽電池10の製造時のハンドリングが煩雑になったり、耐久性が低下したりするという問題を、有意に抑制することができる。また、太陽電池の製造過程において、異物の除去の際に、部材の水や水溶液による水洗、洗浄ができなくなってしまうという問題が解消される。
なお、図2において、アルカリ金属供給層120は、絶縁性支持基板110と裏面電極層130の間に設置されている。しかしながら、本発明の構成は、これに限られるものではない。例えば、アルカリ金属供給層120は、裏面電極層130とCIGS層160の間に設置されても良い。また、必要な場合、アルカリ金属供給層120は、絶縁性支持基板110と裏面電極層130の間、および裏面電極層130とCIGS層160の間の2箇所に設置されても良い。
以下、本発明によるCIGS型の太陽電池100の各構成層、構成部材の仕様等について、詳しく説明する。
(絶縁性支持基板110)
絶縁性支持基板110は、その上部に積層された各部材を支持する機能を有する限り、いかなる部材で構成されても良い。また、絶縁性支持基板の形状は、平板状に限らず、湾曲状であってもよく、また管状のものでも良い。絶縁性支持基板の表面に積層された各層を形成することができる機能を有する限り、絶縁性支持基板の形状は、いかなる形状でも良い。より好ましくは、第1の表面とその反対面に第2の表面を有する平板状、あるいは湾曲状の板状体である。
絶縁性支持基板は、例えば、ガラスやポリイミドのような、それ自体が絶縁体で構成されるのが好ましい。ガラスの場合、その組成は、特に限られず、ガラスは、リン酸塩系のものであっても、シリカ系のものであっても良い。シリカ系ガラスの場合、絶縁性支持基板110は、例えば、酸化物換算で、60mol%~80mol%のSiO2、0.5mol%~7mol%のAl2O3、3mol%~10mol%のMgO、6mol%~9mol%のCaO、0~5mol%のSrO、0~4mol%のBaO、0~2mol%のZrO2、4mol%~13mol%のNa2O、および0.1mol%~7mol%のK2Oを含む組成であっても良い。
無アルカリガラスとしては、例えば、酸化物基準の質量%表示で、SiO2:50~66%、Al2O3:10.5~22%、B2O3:0~12%、MgO:0~8%、CaO:0~14.5%、SrO:0~24%、BaO:0~13.5%を含有し、MgO+CaO+SrO+BaO:9~29.5質量%である無アルカリガラスが用いられる。
あるいは、絶縁性支持基板110は、導電性材料の表面に絶縁層を設置して構成しても良い。導電性材料は、ステンレス鋼またはアルミニウム合金等の金属であっても良い。また、絶縁層は、酸化物等であっても良い。
絶縁性支持基板110の厚さは、例えば、0.5mm~6mmの範囲である。
アルカリ金属供給層120は、アルカリ金属を含むニオブ酸化物で構成される。アルカリ金属供給層120は、例えば、LiNbO3化合物、NaNbO3化合物、およびKNbO3化合物からなる群から選ばれる1種以上の化合物が好ましい。また、LiNbO3化合物、NaNbO3化合物、およびKNbO3化合物からなる群から選ばれる1種以上の化合物は、アルカリ金属含有率が、他の金属カチオン元素の総量に対して、50原子%の高いアルカリ金属含有率を有する。また、LiNbO3化合物、NaNbO3化合物、およびKNbO3化合物のうちでは、NaNbO3化合物が、融点が最も高く、LiNbO3化合物およびKNbO3化合物と比較して、高温の焼結温度を選んで焼結できるので、成膜に用いる焼結体スパッタリングターゲットを高密度で作製しやすい点で特に好ましい。
このような化合物は、吸湿性がなく、水に対しても溶解性が著しく低く、安定である。
アルカリ金属供給層120の厚さは、例えば、20nm~200nmの範囲である。特に、アルカリ金属供給層120の厚さは、20nm~100nmの範囲であることがより好ましい。この様な範囲の場合、アルカリ金属供給層120と裏面電極層130の間に、または裏面電極層130とCIGS層160の間に、良好な密着性が得られる。
裏面電極層130は、例えば、Mo(モリブデン)、Ti(チタン)、Al(アルミニウム)、またはCr(クロム)等で構成される。
裏面電極層130の厚さは、例えば、100nm~1000nm(好ましくは、300nm~700nm。例えば500nm)の範囲である。裏面電極層130の膜厚が厚くなると、基板110との密着性が、あるいはアルカリ供給層との密着性が、低下するおそれがある。また、裏面電極層130の膜厚が薄くなりすぎると、電極の電気抵抗が増大する。
裏面電極層130の形成方法は、特に限られない。裏面電極層130は、例えば、スパッタリング法、蒸着法、気相成膜法(PVD、CVD)等により、絶縁性支持基板110面上に形成することができる。
CIGS層160は、周期律表のIb族元素と、IIIb族元素と、VIb族元素とを含む化合物で構成される。
CIGS層160は、例えば、カルコパイライト(chalcopyrite)に代表される結晶構造を有する半導体で構成される。この場合、CIGS層160は、Cu(銅)、In(インジウム)、およびGa(ガリウム)からなる群から選定された少なくとも一つの元素Mと、Se(セレン)およびS(硫黄)からなる群から選定された少なくとも一つの元素Aとを含むことができる。例えば、CIGS層160として、CuInSe2、CuIn(Se,S)2、Cu(In,Ga)Se2、およびCu(In,Ga)(Se,S)2などを使用することができる。また、CIGS層160は、カルコパイライトと同様な結晶構造を有する半導体で構成されてもよい。
CIGS層160の膜厚は、特に限られるものではないが、例えば1000nm~3000nmの範囲である。
バッファ層170は、例えば、半導体層を形成する、Cd(カドミウム)やZn(亜鉛)を含む化合物で構成される。Cdを含む化合物としては、CdS(硫黄化カドミウム)等があり、Znを含む化合物としては、ZnO(酸化亜鉛)、ZnS(硫黄化亜鉛)、ZnMgO(亜鉛マグネシウム酸化物)等の材料がある。
また、バッファ層170は、図1に示した構成のように、複数の半導体の層で構成されても良い。この場合、CIGS層160に近い側にある第1の層は、前述のような、CdSまたはZnを含む化合物によって構成され、CIGS層160から遠い側にある第2の層は、ZnO(酸化亜鉛)、またはZnOを含む材料等で構成される。
バッファ層170の膜厚は、特に限られるものではないが、例えば50nm~300nmの範囲である。
透明表面電極層180は、例えばZnO(酸化亜鉛)、またはITO(インジウムスズ酸化物)のような材料等で構成される。あるいは、これらの材料にAl(アルミニウム)などのIII族元素をドープしても良い。また、透明表面電極層180は、複数の層を積層させて構成しても良い。
透明表面電極層180の厚さ(複数層の場合は、全厚)は、特に限られるものではないが、例えば100nm~3000nmの範囲である。
なお、透明表面電極層180には、さらに導電性の取り出し部材が電気的に接続されても良い。そのような取り出し部材は、例えば、Ni(ニッケル)、Cr(クロム)、Al(アルミニウム)およびAg(銀)から選ばれる1種以上の金属で構成されることが好ましい。
本発明の太陽電池は、絶縁性支持基板の表面に、アルカリ供給層と、裏面電極層と、CIGS層と、バッファ層と、透明表面電極層とを有すること、または絶縁性支持基板の表面に、裏面電極層と、アルカリ供給層と、CIGS層と、バッファ層と、透明表面電極層とを有すること、または絶縁性支持基板の表面に、アルカリ供給層と、裏面電極層と、アルカリ供給層と、CIGS層と、バッファ層と、透明表面電極層とを有すること、を特徴とする。
また、本発明の太陽電池用の基板は、絶縁性支持基板の表面に、アルカリ供給層と、裏面電極層とを有すること、または絶縁性支持基板に、裏面電極層と、アルカリ供給層とを有すること、または絶縁性支持基板に、アルカリ供給層と、裏面電極層と、アルカリ供給層とを有すること、を特徴とする。また、本発明の太陽電池用の基板は、絶縁性支持基板の表面に、アルカリ供給層を有することを特徴とする。
しかしながら、上記した本発明の太陽電池、あるいは太陽電池用の基板において、上記した各層の間、あるいは絶縁性支持基板の表面とその上に形成される層との間に、必要に応じて、耐久性向上、密着性向上、電気的特性向上、発電効率向上等のために、付加層を形成してもよい。
以下の方法により、ガラス基板上に、アルカリ供給層としてのNaNbO3層および裏面電極層としてのMo層を順次成膜して、試験サンプルを作製した。また、これらの試験サンプルを用いて、以下に示す各特性を評価した。
(試験サンプルの作製)
まず、ガラス基板を準備した。ガラス基板の寸法は、縦50mm×横50mm×厚さ1.1mmとした。このガラス基板の組成は、酸化物換算で、72mol%のSiO2、1.1mol%のAl2O3、5.5mol%のMgO、8.6mol%のCaO、12.6mol%のNa2O、および0.2mol%のK2Oを含む。
スパッタ装置には、マグネトロンRFスパッタリング装置(SPF210H、アネルバ社製)を使用した。NaNbO3焼結体ターゲットを使用し、ガラス基板上にNaNbO3層を成膜した。また、使用したNaNbO3焼結体ターゲットは、Na2CO3粉末(関東化学製特級)とNb2O5粉末(高純度化学研究所製3Nグレード)を用いて、粉末混合、仮焼、湿式粉砕、成形、焼結(空気中1330℃、2時間保持)を経て、焼結体ターゲットを作製した。なお、使用したNaNbO3焼結体ターゲットには、K(カリウム)が、K2O換算で総質量に対して、0.01質量%含有することを、蛍光X線法により確かめた。
NaNbO3層の膜厚は、20nm、50nm、100nm、200nm、および500nmとした(それぞれ、試験サンプルNo.1~No.5とする)。
Mo層の成膜には、マグネトロンDCスパッタリング装置(SPL-711V、トッキ社製)を使用した。ターゲットには、Moターゲットを使用した。成膜雰囲気は、アルゴンとし、スパッタリング圧力は、1.3Paとした。また、成膜温度(基板温度)は、室温とした。Mo層の厚さは、約500nmに統一した。
この他、比較例として、NaNbO3層の成膜を実施せずに、ガラス基板の表面にMo層(500nm)を直接成膜した試験サンプルを準備した(試験サンプルNo.6とする)
表1には、各試験サンプルにおける層構造、およびNaNbO3の膜厚をまとめて示した。
前述の工程で得られた各試験サンプル(No.1~No.6)を用いて、Na拡散挙動の測定、およびMo層の密着性試験を行った。
(Na拡散挙動の測定)
サンプルNo.1~No.4、およびサンプルNo.6を用いて、Na拡散挙動の測定を行った。
なお、ITO膜の成膜には、前述のマグネトロンDCスパッタリング装置を使用した。ターゲットには、10質量%のSnO2がドープされたITOターゲットを使用した。また、スパッタリングガスには、アルゴンと酸素の混合ガス(酸素1vol%)を使用した。スパッタリング圧力は、0.4Paとした。成膜温度(基板温度)は、室温とした。
次に、この評価試料を窒素雰囲気下において、550℃で30分間保持し、ガラス基板中のNaを、ITO膜中に拡散させた。
測定は、一つの評価試料につき、2箇所で実施した。
この図3から、NaNbO3層の厚さを変化させることにより、Na拡散量を変化させることができることがわかる。すなわち、本発明の構成では、NaNbO3層の厚さを調整することにより、比較的容易に、CIGS層中に拡散されるNa量を制御することができると考えられる。
次に、試験サンプルNo.1~No.6を用いて、以下の方法により、Mo層の密着性を相対評価した。
まず、各試験サンプルを(1)窒素雰囲気中に、550℃で10分間、および(2)50℃、相対湿度50%に調整した大気中に24時間、それぞれ保持した。次に、Mo層の上に、接着テープ(CT-24、ニチバン社製)を貼り付け、これを剥がした際に、Mo層に剥離が生じるかどうかを評価した。
なお、2010年5月31日に出願された日本特許出願2010-124976号の明細書、特許請求の範囲、図面及び要約書の全内容をここに引用し、本発明の開示として取り入れるものである。
11 絶縁性支持基板
12a 第1の導電層
12b 第2の導電層
13 光吸収層
14 第1の半導体層
15 第2の半導体層
16 透明導電層
17、18 取り出し電極
19 アルカリ金属供給層
90 光の入射方向
100 本発明によるCIGS型の太陽電池
110 絶縁性支持基板
120 アルカリ金属供給層
130 裏面電極層
160 CIGS層
170 バッファ層
180 透明表面電極層
190 光の入射方向
Claims (13)
- 絶縁性支持基板と、
前記絶縁性支持基板の上に設けられた裏面電極層と、
前記裏面電極層の上に設けられたCIGS層と、
前記CIGS層の上に設けられたバッファ層と、
前記バッファ層の上に設けられた透明表面電極層と、
を有するCIGS型の太陽電池であって、
さらに、前記絶縁性支持基板と前記裏面電極層の間、または前記裏面電極層と前記CIGS層の間、または前記絶縁性支持基板と前記裏面電極層の間と前記裏面電極層と前記CIGS層の間の双方に、アルカリ金属供給層を有し、
該アルカリ金属供給層は、NaNbO3化合物およびKNbO3化合物からなる群から選ばれる1種以上の化合物を含むことを特徴とする太陽電池。 - 絶縁性支持基板と、
前記絶縁性支持基板の上に設けられた裏面電極層と、
前記裏面電極層の上に設けられたCIGS層と、
前記CIGS層の上に設けられたバッファ層と、
前記バッファ層の上に設けられた透明表面電極層と、
を有するCIGS型の太陽電池であって、
さらに、前記絶縁性支持基板と前記裏面電極層の間、または前記裏面電極層と前記CIGS層の間、または前記絶縁性支持基板と前記裏面電極層の間と前記裏面電極層と前記CIGS層の間の双方に、アルカリ金属供給層を有し、
該アルカリ金属供給層は、LiNbO3化合物、NaNbO3化合物およびKNbO3化合物からなる群から選ばれる1種以上の化合物を含むことを特徴とする太陽電池。 - 前記アルカリ金属供給層は、20nm~200nmの範囲の厚さを有することを特徴とする請求項1または2に記載の太陽電池。
- 前記絶縁性支持基板は、絶縁性の基材自体で構成され、または導電性の基材に絶縁層を設けることにより構成されることを特徴とする請求項1~3のいずれか1項に記載の太陽電池。
- 前記絶縁性支持基板は、ガラス基板またはプラスチック基板であることを特徴とする請求項1~4のいずれか1項に記載の太陽電池。
- 絶縁性支持基板の第1の表面上に設けられた裏面電極層と、アルカリ金属供給層とを有し、
該アルカリ金属供給層は、前記第1の表面と前記裏面電極層の間、または前記裏面電極層の上層に、または前記第1の表面と前記裏面電極層の間と前記裏面電極層の上層の双方に、設けられ、
前記アルカリ金属供給層は、NaNbO3化合物およびKNbO3化合物からなる群から選ばれる1種以上の化合物を含むことを特徴とするCIGS型の太陽電池用の基板。 - 絶縁性支持基板の第1の表面上に設けられた裏面電極層と、アルカリ金属供給層とを有し、
該アルカリ金属供給層は、前記第1の表面と前記裏面電極層の間、または前記裏面電極層の上層に、または前記第1の表面と前記裏面電極層の間と前記裏面電極層の上層の双方に、設けられ、
前記アルカリ金属供給層は、LiNbO3化合物、NaNbO3化合物およびKNbO3化合物からなる群から選ばれる1種以上の化合物を含むことを特徴とするCIGS型の太陽電池用の基板。 - 前記アルカリ金属供給層は、20nm~200nmの範囲の厚さを有することを特徴とする請求項6または7に記載のCIGS型の太陽電池用の基板。
- 絶縁性支持基板は、絶縁性の基材自体で構成され、または導電性の基材に絶縁層を設けることにより構成されることを特徴とする請求項6~8のいずれか1項に記載のCIGS型の太陽電池用の基板。
- 絶縁性支持基板の第1の表面上に設けられたアルカリ金属供給層を有し、
該アルカリ金属供給層は、NaNbO3化合物およびKNbO3化合物からなる群から選ばれる1種以上の化合物を含むことを特徴とするCIGS型の太陽電池用の基板。 - 絶縁性支持基板の第1の表面上に設けられたアルカリ金属供給層を有し、
該アルカリ金属供給層は、LiNbO3化合物、NaNbO3化合物およびKNbO3化合物からなる群から選ばれる1種以上の化合物を含むことを特徴とするCIGS型の太陽電池用のCIGS型の太陽電池用の基板。 - 前記アルカリ金属供給層は、20nm~200nmの範囲の厚さを有することを特徴とする請求項10または11に記載のCIGS型の太陽電池用の基板。
- 前記絶縁性支持基板は、絶縁性の基材自体で構成され、または導電性の基材に絶縁層を設けることにより構成されることを特徴とする請求項10~12のいずれか1項に記載のCIGS型の太陽電池用の基板。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020127028102A KR20130086932A (ko) | 2010-05-31 | 2011-05-31 | Cigs 형 태양 전지 및 cigs 형 태양 전지용 기판 |
EP11789813.0A EP2579326A1 (en) | 2010-05-31 | 2011-05-31 | Cigs solar cell and substrate for cigs solar cell |
CN2011800267708A CN102918652A (zh) | 2010-05-31 | 2011-05-31 | Cigs型太阳能电池和cigs型太阳能电池用基板 |
JP2012518406A JPWO2011152410A1 (ja) | 2010-05-31 | 2011-05-31 | Cigs型の太陽電池およびcigs型の太陽電池用の基板 |
US13/690,728 US20130087187A1 (en) | 2010-05-31 | 2012-11-30 | Cigs type solar cell and substrate for cigs type solar cell |
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JP2010124976 | 2010-05-31 | ||
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US13/690,728 Continuation US20130087187A1 (en) | 2010-05-31 | 2012-11-30 | Cigs type solar cell and substrate for cigs type solar cell |
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US (1) | US20130087187A1 (ja) |
EP (1) | EP2579326A1 (ja) |
JP (1) | JPWO2011152410A1 (ja) |
KR (1) | KR20130086932A (ja) |
CN (1) | CN102918652A (ja) |
TW (1) | TW201216486A (ja) |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014075407A (ja) * | 2012-10-03 | 2014-04-24 | Asahi Glass Co Ltd | Cigs型太陽電池用基板及びそれを用いたcigs型太陽電池の製造方法 |
JP2014096472A (ja) * | 2012-11-09 | 2014-05-22 | Asahi Glass Co Ltd | Cigs型太陽電池用基板及びcigs型太陽電池 |
WO2020090612A1 (ja) * | 2018-10-29 | 2020-05-07 | アートビーム有限会社 | 太陽電池および太陽電池の製造方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9701567B2 (en) * | 2013-04-29 | 2017-07-11 | Corning Incorporated | Photovoltaic module package |
TWI488327B (zh) * | 2013-12-13 | 2015-06-11 | Nat Univ Chin Yi Technology | Thin film solar cell structure and process |
TWI488312B (zh) * | 2013-12-13 | 2015-06-11 | Nat Univ Chin Yi Technology | Structure and Process of Thin - film Solar Cell Buffer Layer |
CN104617183B (zh) * | 2014-09-05 | 2016-09-28 | 厦门神科太阳能有限公司 | 一种cigs基薄膜太阳电池及其制备方法 |
CN107749348A (zh) * | 2017-10-27 | 2018-03-02 | 重庆科技学院 | 一种铁电/TiO2纳米晶复合薄膜及其制备方法和在敏化太阳能电池中的应用 |
KR102524637B1 (ko) * | 2020-08-28 | 2023-04-21 | 인천대학교 산학협력단 | 박막 태양전지 및 광흡수층에 대한 용액 기반 알카리 원소 후증착 처리 방법 |
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WO2009076690A2 (de) * | 2007-12-18 | 2009-06-25 | Plansee Metall Gmbh | Dünnschichtsolarzelle mit molybdän-hältiger rückelektrodenschicht |
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JPH11274534A (ja) * | 1998-03-25 | 1999-10-08 | Yazaki Corp | I−iii−vi族系化合物半導体及びこれを用いた薄膜太陽電池 |
KR100798234B1 (ko) * | 2000-04-06 | 2008-01-24 | 아크조 노벨 엔.브이. | 광기전성박의 제조 방법 |
JP4629151B2 (ja) * | 2009-03-10 | 2011-02-09 | 富士フイルム株式会社 | 光電変換素子及び太陽電池、光電変換素子の製造方法 |
-
2011
- 2011-05-31 TW TW100119157A patent/TW201216486A/zh unknown
- 2011-05-31 KR KR1020127028102A patent/KR20130086932A/ko not_active Application Discontinuation
- 2011-05-31 CN CN2011800267708A patent/CN102918652A/zh active Pending
- 2011-05-31 WO PCT/JP2011/062512 patent/WO2011152410A1/ja active Application Filing
- 2011-05-31 JP JP2012518406A patent/JPWO2011152410A1/ja not_active Withdrawn
- 2011-05-31 EP EP11789813.0A patent/EP2579326A1/en not_active Withdrawn
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WO2009076690A2 (de) * | 2007-12-18 | 2009-06-25 | Plansee Metall Gmbh | Dünnschichtsolarzelle mit molybdän-hältiger rückelektrodenschicht |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014075407A (ja) * | 2012-10-03 | 2014-04-24 | Asahi Glass Co Ltd | Cigs型太陽電池用基板及びそれを用いたcigs型太陽電池の製造方法 |
JP2014096472A (ja) * | 2012-11-09 | 2014-05-22 | Asahi Glass Co Ltd | Cigs型太陽電池用基板及びcigs型太陽電池 |
WO2020090612A1 (ja) * | 2018-10-29 | 2020-05-07 | アートビーム有限会社 | 太陽電池および太陽電池の製造方法 |
JPWO2020090612A1 (ja) * | 2018-10-29 | 2021-09-09 | アートビーム有限会社 | 太陽電池および太陽電池の製造方法 |
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CN102918652A (zh) | 2013-02-06 |
KR20130086932A (ko) | 2013-08-05 |
EP2579326A1 (en) | 2013-04-10 |
JPWO2011152410A1 (ja) | 2013-08-01 |
TW201216486A (en) | 2012-04-16 |
US20130087187A1 (en) | 2013-04-11 |
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