WO2011150738A1 - Carte à circuit et procédé pour sa fabrication - Google Patents

Carte à circuit et procédé pour sa fabrication Download PDF

Info

Publication number
WO2011150738A1
WO2011150738A1 PCT/CN2011/074076 CN2011074076W WO2011150738A1 WO 2011150738 A1 WO2011150738 A1 WO 2011150738A1 CN 2011074076 W CN2011074076 W CN 2011074076W WO 2011150738 A1 WO2011150738 A1 WO 2011150738A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
circuit board
transmission line
dielectric layer
bonding layer
Prior art date
Application number
PCT/CN2011/074076
Other languages
English (en)
Chinese (zh)
Inventor
高峰
刘山当
宗晅
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=44410785&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2011150738(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to HU1200255A priority Critical patent/HU230941B1/hu
Priority to BRPI1105246A priority patent/BRPI1105246B1/pt
Priority to MX2011013097A priority patent/MX2011013097A/es
Publication of WO2011150738A1 publication Critical patent/WO2011150738A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Definitions

  • the present invention relates to a circuit board, and more particularly to a circuit board having a higher signal transmission quality and a method of fabricating the same.
  • PCB printed circuit board
  • Df and Dk dielectric constant Df and low dielectric loss Dk characteristics.
  • the means for reducing the Df and Dk of PCB boards are mainly modified from glass fiber and resin systems, such as ceramic filling, flat glass fiber, and non-epoxy resin (PTFE).
  • PTFE non-epoxy resin
  • embodiments of the present invention provide a low-cost circuit board, and a method of fabricating the circuit board.
  • a circuit board comprising at least one bonding layer and at least one transmission line, wherein an air cavity is formed in the bonding layer, and an orthographic projection of the transmission line falls in a region where an air cavity of the bonding layer is located.
  • a method of manufacturing a circuit board comprising the steps of:
  • the core board comprising a dielectric layer, and a conductive medium covering at least one side of the dielectric layer;
  • the core board comprising a dielectric layer, and a conductive medium covering at least one side of the dielectric layer;
  • the circuit board and the electric board manufacturing method provided by the embodiments of the present invention by providing an air cavity in the bonding layer of the circuit board, the characteristics of Dk and Df of the entire circuit board are reduced by utilizing the characteristics of low Df and low Dk of air. Thereby, the signal transmission quality of the circuit board is improved; in addition, the step of providing the air cavity on the bonding layer is easy to implement, thereby reducing the manufacturing cost of the circuit board.
  • FIG. 1 is a schematic diagram of a circuit board according to a first embodiment of the present invention
  • FIG. 2 is a schematic diagram of another structure of a circuit board according to a first embodiment of the present invention
  • FIG. 3 is a schematic diagram of a circuit board according to a second embodiment of the present invention
  • FIG. 4 is a schematic diagram of a circuit board according to a third embodiment of the present invention.
  • FIG. 5 is a schematic diagram of a circuit board according to a fourth embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a circuit board according to a fourth embodiment of the present invention.
  • the circuit board 100 provided by the embodiment of the present invention includes at least one circuit board unit composed of the bonding layer 120 and the transmission line 140.
  • An air cavity 124 is formed on the bonding layer 120 of each of the circuit board units, and an orthographic projection of the transmission line 140 falls in a region where the air cavity 124 of the bonding layer 120 is located.
  • a circuit board 100 is provided by an embodiment of the present invention.
  • the circuit board 100 is composed of a circuit board unit.
  • the circuit board unit includes a reference layer 110, the bonding layer 120, and at least one dielectric layer. 130 and the transmission line 140 described.
  • the adhesive layer 120 is provided with adhesive layers 120 corresponding to the circumferences to be pressed against each other to form the air chamber 124.
  • the transmission line 140 is disposed on the dielectric layer 130 and its orthographic projection falls in the area where the air cavity 124 is located.
  • the reference layer 110 is made of a conductive material, and the reference layer 110 in the embodiment is a copper foil.
  • the reference layer 110 includes a first surface 112 and a second surface 114 corresponding to the first surface 112.
  • a reinforcing layer 150 is further disposed on the second surface 114 of the reference layer 110, and the reinforcing layer 150 may be made of an insulating material.
  • the adhesive layer 120 is made of a material colloid having a strong adhesive property and a low amount of glue, for example, a polyimide having a glue layer or a photosensitive resin.
  • the width of the slot 122 formed on the bonding layer 120 is wider than the width of the transmission line 140, and the projection of the transmission line 140 may fall into the slot 122, and this embodiment The width of the slot 122 is 0.2 mm to 0.3 mm wider than the width of the transmission line 140.
  • the dielectric layer 130 is made of an insulating material.
  • the dielectric layer 130 includes an upper surface 132 and a lower surface 134 corresponding to the upper surface 132.
  • the dielectric layer 130 is bonded to the other side of the bonding layer 120 through its lower surface 134.
  • the transmission line 140 is disposed on the lower surface 134 of the dielectric layer 130 and is received in the air cavity 124.
  • the dielectric layer may also be A ground layer 160 is disposed on the upper surface of the substrate 130.
  • the ground layer 160 is made of a conductive material.
  • the ground layer 160 is made of copper foil.
  • the transmission line 140 may also be formed on the upper surface 132 of the dielectric layer 130 as shown in FIG.
  • the circuit board 100 provided in the embodiment of the present invention reduces the dielectric constant and the medium of the circuit board 100 by forming the air cavity 124 facing the transmission line 140 on the bonding layer 120, utilizing the characteristics of the low Df and Dk of the air.
  • the loss, the transmission quality of the signal is improved; in addition, the manufacturing process of forming the air cavity 124 on the bonding layer 120 to form the air cylinder 124 is easy to implement, thereby reducing the manufacturing cost.
  • a circuit board 200 is provided in a second embodiment of the present invention.
  • the circuit board 200 includes a plurality of circuit board units that are sequentially stacked.
  • the circuit board 200 includes the circuit in the first embodiment.
  • the structure of the board 100 is substantially the same as that of the first circuit board unit 200a, the second circuit board unit 200b, and the third circuit board unit 200c.
  • the reference layer 210b of the second circuit board unit 200b is disposed on the dielectric layer 240a of the first circuit board unit 200a; the reference layer 210c of the third circuit board unit 200c is disposed on the medium of the second circuit board unit 200b On layer 240b.
  • circuit board units 200a, 200b, and 200c having substantially the same structure are combined with each other to form a multi-layer circuit board as an example to illustrate how to construct a plurality of air chambers by using a plurality of circuit board units.
  • the structure of the layer circuit board, but the number of layers of the circuit board 200 is not limited to the number of superpositions shown in this embodiment.
  • the dielectric layer 240c of the third circuit board unit 200c that is, the outermost circuit board unit is exposed on the outer dielectric layer, and a ground layer 260 may be disposed.
  • a circuit board 300 includes a circuit board unit including a sub-circuit board 310, a secondary bonding layer 320, and a second time. Reference layer 330, and a secondary dielectric layer 340.
  • the sub-board 310 has the same structure as the circuit board 100 in the first embodiment, and includes a reference layer 311, a bonding layer 312, a dielectric layer 313, and a transmission line 314. The difference is that the dielectric layer 313 has a thin structure, that is, the thickness of the dielectric layer 313, the dielectric layer 340, which is the thickness of the dielectric layer in the embodiment is 2 mils.
  • the secondary bonding layer 320 is disposed outside the dielectric layer 313 of the circuit board 310, and the second bonding layer 320 is provided with another slot 322 opposite to the transmission line 314 of the sub-board 310.
  • Another air cavity 324 is formed in the bonding layer 320. The orthographic projection of the transmission line 314 falls within the other air cavity 324.
  • the secondary dielectric layer 340 is disposed on the secondary reference layer 330.
  • the circuit board 300 provided in this embodiment can further reduce the dielectric constant and dielectric loss of the circuit board 300 by using an air cavity on both sides of the transmission line 314 to further reduce the characteristics of the air Dk and Df. Thereby improving the transmission quality of the signal.
  • a circuit board 400 includes a plurality of circuit board units that are sequentially stacked, and the circuit board unit and the circuit board 300 structure in the third embodiment. Similarly, it includes a first circuit board unit 400a, and a second circuit board unit 400b.
  • the reference layer 411b of the second circuit board unit 400b is disposed on the sub-dielectric layer 440b of the first circuit board unit 400a to constitute a multi-layer circuit board structure.
  • FIG. 6 Please refer to FIG. 6 for a circuit board manufacturing method provided by the present invention.
  • Step 1 providing a core board 500, the core board 500 includes a dielectric layer 510, and a conductive medium 512 covering at least the side of the dielectric layer 510;
  • the core plate 500 may be made of FR4® or ceramic filled or PTFE® type core material, wherein the conductive medium 512 may be copper foil. Forming a transmission line 540 on the conductive medium 512 on one side of the core board 500;
  • the formation of the transmission line 540 can be implemented by chemical etching or physical etching.
  • Step 2 providing another core board 500, the core board 500 includes a dielectric layer 510, and a conductive medium 512 covering at least the side of the dielectric layer 510; a sticky layer is disposed on the conductive medium 512 on the side of the core board 500 Connection layer 520;
  • Step 3 opening a groove 522 for forming an air cavity 524 on the bonding layer 520;
  • the slit 522 may be formed by a method such as laser forming, development molding or mold pre-forming; when forming the slit 522, it is required to be on the conductive medium 512 corresponding to the slit 522, that is, There is no glue residue on the bottom of the air chamber 524.
  • Step 4 The core plate 500 formed with the transmission line 540 is superposed on the bonding layer 520 around the slot 522 to form the air cavity 514, and the orthographic projection of the transmission line 510 and the air cavity 524 is right.
  • the method of fabricating the board further includes the steps of repeating the above-described fabrication steps to form various multilayer circuit boards as provided in the embodiments of the present invention.
  • the lower Dk and Df characteristics of the air are used to reduce the entire
  • the Dk and Df characteristics of the circuit board improve the signal transmission quality of the circuit board.
  • the step of providing the air cavity 524 on the bonding layer 520 is easy to implement, thereby reducing the manufacturing cost of the circuit board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne une carte (100) à circuit et un procédé pour sa fabrication. La carte (100) à circuit comporte au moins une couche adhésive (120) et au moins une ligne (140) de transmission, une cavité (124) d'air est formée dans la couche adhésive (120) et une projection orthographique de la ligne (140) de transmission est située dans la zone de la cavité (124) d'air de la couche adhésive (120).
PCT/CN2011/074076 2010-11-25 2011-05-16 Carte à circuit et procédé pour sa fabrication WO2011150738A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
HU1200255A HU230941B1 (hu) 2010-11-25 2011-05-16 Nyomtatott áramköri lap és eljárás a nyomtatott áramköri lap gyártására
BRPI1105246A BRPI1105246B1 (pt) 2010-11-25 2011-05-16 placa de circuito
MX2011013097A MX2011013097A (es) 2010-11-25 2011-05-16 Tarjeta de circuito y metodo para fabricar una tarjeta de circuito.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201010564278.3A CN102143647B (zh) 2010-11-25 2010-11-25 一种电路板及其制作方法
CN201010564278.3 2010-11-25

Publications (1)

Publication Number Publication Date
WO2011150738A1 true WO2011150738A1 (fr) 2011-12-08

Family

ID=44410785

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2011/074076 WO2011150738A1 (fr) 2010-11-25 2011-05-16 Carte à circuit et procédé pour sa fabrication

Country Status (5)

Country Link
CN (1) CN102143647B (fr)
BR (1) BRPI1105246B1 (fr)
HU (1) HU230941B1 (fr)
MX (1) MX2011013097A (fr)
WO (1) WO2011150738A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11277907B2 (en) 2019-11-08 2022-03-15 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with exposed layer

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106470523B (zh) * 2015-08-19 2019-04-26 鹏鼎控股(深圳)股份有限公司 柔性电路板及其制作方法
CN106488642A (zh) * 2015-08-27 2017-03-08 富葵精密组件(深圳)有限公司 柔性线路板及其制作方法
CN105636341A (zh) * 2016-01-01 2016-06-01 广州兴森快捷电路科技有限公司 一种具有空腔结构的pcb板及其制作方法
CN107666764B (zh) * 2016-07-27 2021-02-09 庆鼎精密电子（淮安）有限公司 柔性电路板及其制作方法
CN106231801A (zh) * 2016-08-19 2016-12-14 深圳崇达多层线路板有限公司 用于制作陶瓷板料hdi板的工艺
CN108633167A (zh) * 2018-05-28 2018-10-09 维沃移动通信有限公司 一种电路板、信号传输线及其制作方法
CN109195311B (zh) * 2018-09-11 2021-07-20 番禺得意精密电子工业有限公司 电路板
CN109788648A (zh) * 2018-12-31 2019-05-21 广州添利电子科技有限公司 雷达电路板空气腔制造工艺
CN110139490A (zh) * 2019-05-31 2019-08-16 上海安费诺永亿通讯电子有限公司 一种传输线路板的制作方法及传输线路板
CN110636718B (zh) * 2019-10-30 2021-01-05 生益电子股份有限公司 一种pcb的制作方法
CN112261802B (zh) * 2020-11-04 2021-08-13 生益电子股份有限公司 一种内埋空腔的制作方法及pcb
CN112105150B (zh) * 2020-11-04 2021-08-13 生益电子股份有限公司 一种内埋空腔的制作方法及pcb
CN116033651A (zh) 2021-10-25 2023-04-28 鹏鼎控股(深圳)股份有限公司 线路基板及其制造方法
CN114364168A (zh) * 2022-01-07 2022-04-15 安捷利（番禺）电子实业有限公司 一种内置空腔的线路板的制备方法、线路板及电子设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2479712Y (zh) * 2001-03-27 2002-02-27 安捷利（番禺）电子实业有限公司 分段粘接的柔性印刷电路板
US20020104681A1 (en) * 2001-02-07 2002-08-08 Masayuki Ishiwa Multilayer circuit board
JP2006216723A (ja) * 2005-02-02 2006-08-17 Tohoku Ricoh Co Ltd プリント配線基板
JP2007080858A (ja) * 2005-09-09 2007-03-29 Fujikura Ltd 多層プリント配線板及びその製造方法
CN101841079A (zh) * 2010-04-21 2010-09-22 惠州Tcl移动通信有限公司 一种用于承载手机天线中馈电焊盘的pcb板及天线

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1543298A (zh) * 2000-06-27 2004-11-03 ���µ�����ҵ��ʽ���� 陶瓷叠层器件

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020104681A1 (en) * 2001-02-07 2002-08-08 Masayuki Ishiwa Multilayer circuit board
CN2479712Y (zh) * 2001-03-27 2002-02-27 安捷利（番禺）电子实业有限公司 分段粘接的柔性印刷电路板
JP2006216723A (ja) * 2005-02-02 2006-08-17 Tohoku Ricoh Co Ltd プリント配線基板
JP2007080858A (ja) * 2005-09-09 2007-03-29 Fujikura Ltd 多層プリント配線板及びその製造方法
CN101841079A (zh) * 2010-04-21 2010-09-22 惠州Tcl移动通信有限公司 一种用于承载手机天线中馈电焊盘的pcb板及天线

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11277907B2 (en) 2019-11-08 2022-03-15 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with exposed layer

Also Published As

Publication number Publication date
BRPI1105246A2 (pt) 2016-05-03
BRPI1105246B1 (pt) 2020-04-22
HUP1200255A2 (en) 2013-01-28
MX2011013097A (es) 2012-02-08
CN102143647B (zh) 2014-08-20
HU230941B1 (hu) 2019-05-28
CN102143647A (zh) 2011-08-03

Similar Documents

Publication Publication Date Title
WO2011150738A1 (fr) Carte à circuit et procédé pour sa fabrication
US8536460B2 (en) Composite double-sided copper foil substrates and flexible printed circuit board structures using the same
KR20110045991A (ko) 다층 경연성 인쇄회로기판 및 다층 경연성 인쇄회로기판의 제조방법
JP5399995B2 (ja) 多層プリント配線板及び多層金属張積層板
US9433098B2 (en) Method of manufacturing a combined circuit board
WO2022179163A1 (fr) Carte de circuit imprimé et son procédé de fabrication, et dispositif d'affichage
US11818835B2 (en) Multilayer printed wiring board, multilayer metal-clad laminated board, and resin-coated metal foil
WO2014162478A1 (fr) Substrat à composants intégrés et son procédé de fabrication
WO2015014048A1 (fr) Carte de circuit imprimé flexo-rigide et son procédé de fabrication
JP5955331B2 (ja) 新規なプリント回路基板及びその製造方法
TWI526129B (zh) Multilayer printed circuit boards with dimensional stability
US20130213693A1 (en) Circuit board, structural unit thereof and manufacturing method thereof
WO2013141339A1 (fr) Carte de câblage multicouche et son procédé de fabrication
TW201429331A (zh) 印刷電路板及其製造方法
WO2015083216A1 (fr) Substrat multicouche et son procédé de fabrication
KR101872525B1 (ko) 인쇄회로기판 및 그 제조 방법
WO2021088336A1 (fr) Procédé de fabrication d'une carte de circuit imprimé contenant une pièce en céramique, et carte de circuit imprimé correspondante
TWI405520B (zh) 電路板製作方法
US10568201B2 (en) Multilayer printed wiring board and multilayer metal clad laminated board
CN102958293A (zh) 具有断差结构的电路板的制作方法
KR101811423B1 (ko) 다층 인쇄회로기판 제조방법
WO2015083222A1 (fr) Substrat multicouche et son procédé de fabrication
CN112533400B (zh) 电路板的制造方法
KR20140032674A (ko) 리지드 플렉시블 기판 제조방법
KR200415210Y1 (ko) 리지드 플렉시블 인쇄회로기판

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 9129/CHENP/2011

Country of ref document: IN

Ref document number: MX/A/2011/013097

Country of ref document: MX

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11789117

Country of ref document: EP

Kind code of ref document: A1

REG Reference to national code

Ref country code: BR

Ref legal event code: B01A

Ref document number: PI1105246

Country of ref document: BR

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11789117

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: PI1105246

Country of ref document: BR

Kind code of ref document: A2

Effective date: 20111213