BRPI1105246A2 - placa de circuito e método para fabricação de placa de circuito. - Google Patents

placa de circuito e método para fabricação de placa de circuito.

Info

Publication number
BRPI1105246A2
BRPI1105246A2 BRPI1105246A BRPI1105246A BRPI1105246A2 BR PI1105246 A2 BRPI1105246 A2 BR PI1105246A2 BR PI1105246 A BRPI1105246 A BR PI1105246A BR PI1105246 A BRPI1105246 A BR PI1105246A BR PI1105246 A2 BRPI1105246 A2 BR PI1105246A2
Authority
BR
Brazil
Prior art keywords
circuit board
manufacturing
manufacturing circuit
board
circuit
Prior art date
Application number
BRPI1105246A
Other languages
English (en)
Inventor
Feng Gao
Shandang Liu
Xuan Zong
Original Assignee
Huawei Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=44410785&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=BRPI1105246(A2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Huawei Tech Co Ltd filed Critical Huawei Tech Co Ltd
Publication of BRPI1105246A2 publication Critical patent/BRPI1105246A2/pt
Publication of BRPI1105246B1 publication Critical patent/BRPI1105246B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Credit Cards Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
BRPI1105246A 2010-11-25 2011-05-16 placa de circuito BRPI1105246B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201010564278.3A CN102143647B (zh) 2010-11-25 2010-11-25 一种电路板及其制作方法
PCT/CN2011/074076 WO2011150738A1 (zh) 2010-11-25 2011-05-16 一种电路板及其制作方法

Publications (2)

Publication Number Publication Date
BRPI1105246A2 true BRPI1105246A2 (pt) 2016-05-03
BRPI1105246B1 BRPI1105246B1 (pt) 2020-04-22

Family

ID=44410785

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1105246A BRPI1105246B1 (pt) 2010-11-25 2011-05-16 placa de circuito

Country Status (5)

Country Link
CN (1) CN102143647B (pt)
BR (1) BRPI1105246B1 (pt)
HU (1) HU230941B1 (pt)
MX (1) MX2011013097A (pt)
WO (1) WO2011150738A1 (pt)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106470523B (zh) * 2015-08-19 2019-04-26 鹏鼎控股(深圳)股份有限公司 柔性电路板及其制作方法
CN106488642A (zh) * 2015-08-27 2017-03-08 富葵精密组件(深圳)有限公司 柔性线路板及其制作方法
CN105636341A (zh) * 2016-01-01 2016-06-01 广州兴森快捷电路科技有限公司 一种具有空腔结构的pcb板及其制作方法
CN107666764B (zh) * 2016-07-27 2021-02-09 庆鼎精密电子（淮安）有限公司 柔性电路板及其制作方法
CN106231801A (zh) * 2016-08-19 2016-12-14 深圳崇达多层线路板有限公司 用于制作陶瓷板料hdi板的工艺
CN108633167A (zh) * 2018-05-28 2018-10-09 维沃移动通信有限公司 一种电路板、信号传输线及其制作方法
CN109195311B (zh) * 2018-09-11 2021-07-20 番禺得意精密电子工业有限公司 电路板
CN109788648A (zh) * 2018-12-31 2019-05-21 广州添利电子科技有限公司 雷达电路板空气腔制造工艺
CN110139490A (zh) * 2019-05-31 2019-08-16 上海安费诺永亿通讯电子有限公司 一种传输线路板的制作方法及传输线路板
CN110636718B (zh) * 2019-10-30 2021-01-05 生益电子股份有限公司 一种pcb的制作方法
EP3820258A1 (en) 2019-11-08 2021-05-12 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with exposed layer
CN112105150B (zh) * 2020-11-04 2021-08-13 生益电子股份有限公司 一种内埋空腔的制作方法及pcb
CN112261802B (zh) * 2020-11-04 2021-08-13 生益电子股份有限公司 一种内埋空腔的制作方法及pcb
CN116033651A (zh) * 2021-10-25 2023-04-28 鹏鼎控股(深圳)股份有限公司 线路基板及其制造方法
CN114364168A (zh) * 2022-01-07 2022-04-15 安捷利（番禺）电子实业有限公司 一种内置空腔的线路板的制备方法、线路板及电子设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6570469B2 (en) * 2000-06-27 2003-05-27 Matsushita Electric Industrial Co., Ltd. Multilayer ceramic device including two ceramic layers with multilayer circuit patterns that can support semiconductor and saw chips
US6653572B2 (en) * 2001-02-07 2003-11-25 The Furukawa Electric Co., Ltd. Multilayer circuit board
CN2479712Y (zh) * 2001-03-27 2002-02-27 安捷利（番禺）电子实业有限公司 分段粘接的柔性印刷电路板
JP4540493B2 (ja) * 2005-02-02 2010-09-08 東北リコー株式会社 プリント配線基板
JP4817771B2 (ja) * 2005-09-09 2011-11-16 株式会社フジクラ 多層プリント配線板の製造方法
CN101841079B (zh) * 2010-04-21 2013-08-14 惠州Tcl移动通信有限公司 一种用于承载手机天线中馈电焊盘的pcb板及天线

Also Published As

Publication number Publication date
MX2011013097A (es) 2012-02-08
CN102143647B (zh) 2014-08-20
WO2011150738A1 (zh) 2011-12-08
HUP1200255A2 (en) 2013-01-28
CN102143647A (zh) 2011-08-03
BRPI1105246B1 (pt) 2020-04-22
HU230941B1 (hu) 2019-05-28

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 16/05/2011, OBSERVADAS AS CONDICOES LEGAIS.