WO2021088336A1 - Procédé de fabrication d'une carte de circuit imprimé contenant une pièce en céramique, et carte de circuit imprimé correspondante - Google Patents

Procédé de fabrication d'une carte de circuit imprimé contenant une pièce en céramique, et carte de circuit imprimé correspondante Download PDF

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Publication number
WO2021088336A1
WO2021088336A1 PCT/CN2020/087754 CN2020087754W WO2021088336A1 WO 2021088336 A1 WO2021088336 A1 WO 2021088336A1 CN 2020087754 W CN2020087754 W CN 2020087754W WO 2021088336 A1 WO2021088336 A1 WO 2021088336A1
Authority
WO
WIPO (PCT)
Prior art keywords
pcb board
pcb
embedded
manufacturing
ceramic sheets
Prior art date
Application number
PCT/CN2020/087754
Other languages
English (en)
Chinese (zh)
Inventor
王俊
沙伟强
谢光前
Original Assignee
景旺电子科技(龙川)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 景旺电子科技(龙川)有限公司 filed Critical 景旺电子科技(龙川)有限公司
Publication of WO2021088336A1 publication Critical patent/WO2021088336A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Definitions

  • This application relates to the technical field of PCB board manufacturing technology, and in particular to a method for manufacturing a PCB board embedded with ceramic sheets and the PCB board thereof.
  • PCB printed circuit board
  • ceramic sheet mainly alumina or aluminum nitride
  • the prepreg is melted and filled between the ceramic sheet and the PCB through a pressing process. gap. After pressing, it is necessary to go through the grinding process to remove the excess resin overflowing on the surface of the ceramic sheet, and then do the drilling, PTH, outer layer circuit and titanium removal process.
  • Titanium should be removed after etching the outer circuit.
  • the copper thickness on the ceramic chip needs to be greater than 35um to ensure that after filling the gap, the copper on the ceramic chip will not be exposed to the base material in the overflow removal process.
  • the copper thickness on the ceramic chip It will be greater than 50um, which determines that it cannot be used for precise circuit etching. Secondly, this process must go through the process of removing titanium, otherwise the circuit on the ceramic chip will be short-circuited.
  • the existing design is that the upper and lower sides of the ceramic sheet are the upper and lower sides of the final PCB.
  • the resin overflow gap of the prepreg must be ensured, and the final grinding method is used to ensure that the ceramic sheet and the PCB The leveling of the room.
  • the grinding process will remove the copper on the ceramic sheet, resulting in exposure of the substrate or insufficient copper thickness. Therefore, the existing manufacturing method will increase the copper thickness on the ceramic chip to 1OZ or 2OZ. If the copper thickness is greater than 1OZ, it is impossible to make a precise circuit (line width/line spacing less than 0.075mm).
  • One of the objectives of the embodiments of the present application is to provide a method for manufacturing a PCB board with embedded ceramic sheets and the PCB board, so as to solve the problem that the existing manufacturing method cannot produce a precise circuit.
  • a method for manufacturing a PCB board with embedded ceramic sheets which includes the following steps:
  • Step 1 Provide a PCB board with slots
  • Step 2 Attach a high temperature resistant fixed layer on the bottom surface of the PCB board
  • Step 3 Provide a ceramic sheet with a size corresponding to the slot hole, and place it in the corresponding slot; one end of the ceramic sheet is connected with the fixing layer so as to be fixed in the slot;
  • Step 4 Stack the prepreg and copper foil on the top surface of the PCB in turn;
  • Step 5 Place the PCB with the prepreg and copper foil superimposed on the laminating machine for laminating; after the laminating is completed, the fixed layer is removed to form a PCB with embedded ceramic sheets;
  • Step 6 Paste dry film on the top and bottom surfaces of the PCB board with ceramic sheets embedded;
  • Step 7 The copper foil and prepreg on the top surface of the PCB board with the ceramic sheet embedded are processed by the exposure machine, the dry film developing machine, and the acid etching machine to form the laser drilling window;
  • Step 8 Process a laser hole on the top surface of the PCB board with the ceramic sheet embedded in it by a laser drilling machine;
  • Step 9 Fill the laser hole with copper plating by means of hole filling electroplating, so as to realize the conduction between the copper foil on the top surface and the embedded ceramic sheet of the PCB board.
  • the PCB board is a multi-layer board, and several PCB core boards and prepregs are sequentially stacked and riveted and fixed.
  • the thickness of the ceramic sheet is 0.5-2.0 mm, and the ceramic sheet is covered with a copper layer with a thickness of 0.01-0.20 mm.
  • the aperture of the laser hole is 0.075-0.150 mm.
  • the aperture of the slot is 0.075-0.15 mm; the aperture of the slot is 0.1-0.2 mm larger than that of the ceramic sheet.
  • the resin content of the prepreg is 68%-75%, and the thickness is 0.076-0.13mm.
  • the thickness of the copper foil is 1/3 OZ or 1/2 OZ.
  • the shape of the ceramic sheet is a six-sided cylinder or a square cylinder.
  • the laser hole is a blind hole.
  • the PCB board superimposed with the prepreg and copper foil is placed in the laminating machine, and the PCB board is laminated through the formation of high temperature, high pressure, and vacuum; the high temperature is 180°C-250°C, and the high pressure is 150Kp/ cm 2 -200 Kp/cm 2 , vacuum degree is 680mmHg-1000mmHg.
  • the number of layers of the multilayer PCB board is 4-20 layers, and the thickness of the multilayer PCB board is 0.5-3.0 mm.
  • the fixing layer is high temperature resistant adhesive paper.
  • the slot hole is a through hole.
  • a PCB board is provided, which is manufactured according to the above-mentioned PCB board manufacturing method.
  • the beneficial effects of the method for manufacturing a PCB board with embedded ceramic sheets are: the ceramic sheets are half-buried in the PCB board in this application, and a prepreg sheet is added on the upper surface of the ceramic sheet. After that, there is no need to go through the grinding process, and the surface of the PCB can be guaranteed to be flat, and the copper thickness of the upper surface can be controlled within 0.010—0.020mm, so as to ensure that precise circuits can be made, that is, copper is pasted on the upper surface of the PCB.
  • the thickness of foil and copper foil is easy to control, which is conducive to making precise circuits.
  • FIG. 1 is a structural diagram of a PCB board manufactured by a method for manufacturing a PCB board with embedded ceramic chips provided by an embodiment of the application.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the present application, "a plurality of” means two or more than two, unless otherwise specifically defined.
  • the terms “installed”, “connected”, “connected”, “fixed” and other terms should be understood in a broad sense. For example, they may be connected or detachable. Or integrated; it can be a mechanical connection, or it can be an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction relationship between two components.
  • installed may be connected or detachable. Or integrated; it can be a mechanical connection, or it can be an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction relationship between two components.
  • the "above” or “below” of the first feature of the second feature may include direct contact between the first and second features, or may include the first and second features Not in direct contact but through other features between them.
  • “above”, “above” and “above” the second feature of the first feature include the first feature being directly above and obliquely above the second feature, or it simply means that the level of the first feature is higher than that of the second feature.
  • the “below”, “below” and “below” the first feature of the second feature include the first feature directly below and obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
  • This implementation provides a method for manufacturing a PCB board with embedded ceramic sheets. Please refer to Figure 1, which includes the following steps:
  • Step 1 Provide a PCB board 10 with a slot 11;
  • Step 2 Attach a high temperature resistant fixing layer to the bottom surface of the PCB board 10; optionally, the fixing layer is high temperature resistant adhesive tape;
  • Step 3 Provide a ceramic sheet 12 with a size corresponding to the slot 11, and place it in the corresponding slot 11; one end of the ceramic sheet 12 is connected with a fixing layer so as to be fixed in the slot 11;
  • Step 4 Stack the prepreg 13 and the copper foil 14 on the top surface of the PCB board 10 in sequence;
  • Step 5 Place the PCB board 10 with the prepreg 13 and the copper foil 14 superimposed on the laminating machine for laminating; after the laminating is completed, the fixed layer is removed to form the PCB 10 with the ceramic sheet 12 embedded therein;
  • Step 6 Paste dry films on the top and bottom surfaces of the PCB board 10 with the ceramic sheet 12 embedded therein;
  • Step 7 The copper foil 14 and the prepreg 13 on the top surface of the PCB board 10 with the ceramic sheet 12 embedded are processed by an exposure machine, a dry film developing machine, and an acid etching machine to form an opening for laser drilling;
  • Step 8 Process a laser hole 15 on the top surface of the PCB board 10 in which the ceramic sheet 12 is embedded by a laser drilling machine;
  • Step 9 Fill the laser hole 15 with copper plating 16 by means of hole filling electroplating, so as to realize conduction between the copper foil 14 on the top surface and the embedded ceramic sheet 12 of the PCB board 10.
  • the PCB board 10 is a multi-layer board, and a plurality of PCB core boards and prepregs are sequentially stacked and riveted and fixed.
  • the prepregs and the stacked prepregs 13 may have the same specifications.
  • a slot 11 is milled at a set position of the multilayer PCB board 10, and the diameter of the slot 11 is slightly larger than that of the ceramic sheet 12.
  • the slot 11 is a through hole or a blind hole. In this embodiment, the slot 11 is a through hole.
  • the upper and lower sides of the multilayer PCB board 10 are both copper foil layers, and the copper foil and the superimposed copper foil here can have the same specifications.
  • the number of layers of the multilayer PCB board 10 is 4-20 layers, and the thickness of the multilayer PCB board 10 is 0.5-3.0 mm.
  • the thickness of the ceramic sheet 12 is 0.5-2.0 mm, and the ceramic sheet 12 is covered with a copper layer with a thickness of 0.01-0.20 mm.
  • the copper layer is used to conduct the multilayer PCB board 10.
  • the aperture of the laser hole 15 is 0.075-0.150 mm.
  • the laser hole 15 is a blind hole and communicates with the ceramic sheet 12 inside.
  • the aperture of the slot 11 is 0.075-0.15 mm.
  • the aperture size of the slot 11 is larger than that of the ceramic sheet 12 by 0.1-0.2 mm, so that the ceramic sheet 12 can be inserted into the slot 11.
  • the resin content of the prepreg 13 is 68%-75%, and the thickness is 0.076-0.13mm
  • the thickness of the copper foil 14 is 1/3 OZ or 1/2 OZ.
  • the shape of the ceramic sheet 12 is a six-sided cylinder or a square cylinder, which can better match the slot 11.
  • the PCB board on which the prepreg 13 and the copper foil 14 are superimposed is placed on the laminating machine and then pressed into the PCB board 10 through the formation of high temperature, high pressure and vacuum.
  • the high temperature is 180°C-250°C
  • the high pressure is 150Kp/cm 2 -200Kp/cm 2
  • the vacuum degree is 680mmHg-1000mmHg. Under these conditions, the ceramic sheet can be buried in the PCB board seamlessly and in contact. good.
  • a PCB board is manufactured according to the above-mentioned PCB board manufacturing method.
  • the specific structure is shown in Figure 1.
  • the ceramic sheet 12 is half-buried in the PCB board 10, and a prepreg 13 is added to the upper surface of the ceramic sheet 12 to be pressed. After pressing, there is no need to go through the grinding process, which can ensure the flatness of the upper surface of the PCB board 10. And the copper thickness on the upper surface can be controlled within 0.010—0.020mm, so as to ensure that precise circuits can be made. That is, the copper foil 14 is pasted on the upper surface of the PCB board 10, and the thickness of the copper foil 14 is easy to control, which is beneficial to make a precise circuit.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'une carte de circuit imprimé (PCB) contenant une pièce en céramique et une PCB correspondante. Selon la présente invention, une pièce en céramique (12) est semi-intégrée dans une PCB (10), et une feuille semi-durcie (13) est ajoutée à la surface supérieure de la pièce en céramique (12) et ajustée à la presse. Après l'ajustement à la presse, il n'est pas nécessaire d'effectuer un processus de surbroyage, à la fois la feuille (13) et le processus de surbroyage permettant d'assurer la planéité de la surface supérieure de la PCB (10), et l'épaisseur de cuivre de la surface supérieure pouvant être réglée entre 0,010 et 0,020 mm, ce qui permet d'assurer la fabrication d'un circuit précis. En d'autres termes, une feuille de cuivre (14) est fixée à la surface supérieure de la PCB (10), et l'épaisseur de la feuille de cuivre (14) est facile à régler, ce qui permet de réaliser un circuit précis.
PCT/CN2020/087754 2019-11-05 2020-04-29 Procédé de fabrication d'une carte de circuit imprimé contenant une pièce en céramique, et carte de circuit imprimé correspondante WO2021088336A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911071987.5 2019-11-05
CN201911071987.5A CN110785028A (zh) 2019-11-05 2019-11-05 一种内埋嵌陶瓷片的pcb板制作方法及其pcb板

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WO2021088336A1 true WO2021088336A1 (fr) 2021-05-14

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WO (1) WO2021088336A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110785028A (zh) * 2019-11-05 2020-02-11 景旺电子科技(龙川)有限公司 一种内埋嵌陶瓷片的pcb板制作方法及其pcb板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100288536A1 (en) * 2009-05-15 2010-11-18 High Conduction Scientific Co., Ltd. Ceramic circuit board and method of making the same
CN107222983A (zh) * 2017-06-09 2017-09-29 深圳市景旺电子股份有限公司 一种内嵌AlN陶瓷绝缘散热模块的PCB板及制作方法
CN108419361A (zh) * 2018-05-15 2018-08-17 景旺电子科技(龙川)有限公司 埋铜块印制电路板及其制作方法
CN108650781A (zh) * 2018-06-20 2018-10-12 景旺电子科技(龙川)有限公司 一种内嵌铜基ims的散热基板及其制备方法
CN110785028A (zh) * 2019-11-05 2020-02-11 景旺电子科技(龙川)有限公司 一种内埋嵌陶瓷片的pcb板制作方法及其pcb板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE516692T1 (de) * 2008-03-14 2011-07-15 Asetronics Ag Isoliertes metallsubstrat mit einem metallenen implantat
CN103987187A (zh) * 2014-05-19 2014-08-13 深圳市景旺电子股份有限公司 一种嵌埋铜块pcb板及其制作方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100288536A1 (en) * 2009-05-15 2010-11-18 High Conduction Scientific Co., Ltd. Ceramic circuit board and method of making the same
CN107222983A (zh) * 2017-06-09 2017-09-29 深圳市景旺电子股份有限公司 一种内嵌AlN陶瓷绝缘散热模块的PCB板及制作方法
CN108419361A (zh) * 2018-05-15 2018-08-17 景旺电子科技(龙川)有限公司 埋铜块印制电路板及其制作方法
CN108650781A (zh) * 2018-06-20 2018-10-12 景旺电子科技(龙川)有限公司 一种内嵌铜基ims的散热基板及其制备方法
CN110785028A (zh) * 2019-11-05 2020-02-11 景旺电子科技(龙川)有限公司 一种内埋嵌陶瓷片的pcb板制作方法及其pcb板

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