WO2011137767A1 - 一种导热装置及其应用的电子装置 - Google Patents

一种导热装置及其应用的电子装置 Download PDF

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Publication number
WO2011137767A1
WO2011137767A1 PCT/CN2011/074077 CN2011074077W WO2011137767A1 WO 2011137767 A1 WO2011137767 A1 WO 2011137767A1 CN 2011074077 W CN2011074077 W CN 2011074077W WO 2011137767 A1 WO2011137767 A1 WO 2011137767A1
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WO
WIPO (PCT)
Prior art keywords
heat conducting
arm
elastic
heat
plate
Prior art date
Application number
PCT/CN2011/074077
Other languages
English (en)
French (fr)
Inventor
杨右权
刘树忠
魏海霞
杨波
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2011137767A1 publication Critical patent/WO2011137767A1/zh
Priority to US13/871,584 priority Critical patent/US20130235529A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat conducting device, and more particularly to a heat conducting device for use in an electronic product. Background technique
  • a heat transfer medium is usually disposed between the heat source and the heat sink in the electronic product to conduct heat generated by the heat source in the electronic product to the heat sink.
  • the spacing between the heat source of the electronic product and the heat sink is not constant due to manufacturing errors, but varies within a certain range.
  • Most existing heat transfer media often cannot be independently adjusted to a suitable thickness to accommodate the change in the spacing between the heat source and the heat sink. This results in a high thermal resistance between the heat source and the heat sink, and rapid heat transfer cannot be achieved.
  • Embodiments of the present invention provide a heat conduction device having high thermal conductivity and reliability and an electronic device using the same.
  • a heat conducting device comprising a first heat conducting plate and a heat conducting structure.
  • the first heat guide plate includes an upper heat conducting arm disposed on a surface thereof.
  • the heat conducting structure slidably abuts against the upper heat conducting arm of the first heat conducting plate to form a contact surface, and heat is transferred through the contact surface.
  • the heat conducting structure includes a heat conducting surface for maintaining a relative position between the first heat conducting plate and the heat conducting surface, and capable of being relatively slid by the upper heat conducting arm and the heat conducting structure The distance between the first heat conducting plate and the heat conducting surface of the heat conducting structure is changed while ensuring that there is always a contact surface for heat transfer between the upper heat conducting arm of the first heat conducting plate and the heat conducting structure.
  • An electronic device using the above-described heat conducting device comprising a circuit board, a plurality of chips disposed on the circuit board, one disposed on the circuit board and housing the chip a heat dissipation cover therein, a heat dissipation device disposed on the heat dissipation cover, and a plurality of the heat conduction devices.
  • the plurality of heat conducting devices are disposed between the chip and the heat sink cover, the first heat conducting plate of the heat conducting device is in close contact with the chip, and the heat conducting structure of the heat conducting device passes through the heat conducting surface thereof The heat sink is tightly resisted.
  • the heat conduction device and the electronic device thereof used in the embodiments of the present invention can adjust the thickness of the heat conduction device and the lower heat conduction arm according to different use environments and manufacturing errors to adapt to the distance between the heat source and the heat dissipation structure. Changes to ensure effective heat transfer to electronic products to improve heat dissipation.
  • FIG. 1 is a side view of a heat conducting device according to a first embodiment of the present invention
  • FIG. 2 is a side view of a heat conducting device according to a second embodiment of the present invention.
  • Figure 3 is a side view of a heat conducting device according to a third embodiment of the present invention.
  • FIG. 4 is a side view of a heat conducting device according to a fourth embodiment of the present invention.
  • Figure 5 is a side view of a heat conducting device according to a fifth embodiment of the present invention.
  • FIG. 6 is a perspective exploded view of a heat conducting device according to a fifth embodiment of the present invention.
  • Figure 7 is a side view of a heat conducting device according to a sixth embodiment of the present invention.
  • Figure 8 is a side view of a heat conducting device according to a seventh embodiment of the present invention.
  • Figure 9 is a side view of another heat conducting device according to a seventh embodiment of the present invention.
  • Figure 10 is a side view of a third heat conducting device according to a seventh embodiment of the present invention.
  • Figure 11 is a side view of a heat conducting device according to an eighth embodiment of the present invention.
  • Figure 12 is a side view of a heat conducting device according to a ninth embodiment of the present invention.
  • Figure 13 is a perspective view showing the heat conducting structure of the heat conducting device of Figure 12;
  • Figure 14 is a side view of a heat conducting device according to a tenth embodiment of the present invention.
  • FIG 15 is a perspective view showing the heat conducting structure of the heat conducting device of Figure 14;
  • Figure 16 is a side view of another heat conducting device according to a tenth embodiment of the present invention.
  • Figure 17 is a side elevational view of another electronic device according to an eleventh embodiment of the present invention.
  • a side view of a heat conducting device 100 includes a first heat conducting plate 110 and a heat conducting structure 130 .
  • the plate 110 includes at least one upper heat conducting arm 120 disposed on one side surface thereof.
  • the heat conducting structure 130 of the first heat conducting plate 110 is slidably held together to form a contact surface, and heat is transmitted through the contact surface.
  • the heat conducting structure 130 includes a heat conducting surface 131 for contacting the heat source or the heat sink.
  • the heat conducting structure 130 is configured to maintain a relative position between the first heat conducting plate 110 and the heat conducting surface 131, and is capable of passing the
  • the upper heat conducting arm 120 is separated from the heat conducting structure 130 while ensuring that there is always a contact surface for heat transfer between the upper heat conducting arm 120 of the first heat conducting plate 110 and the heat conducting structure 130.
  • the first heat conducting plate 110 includes a first surface 112 and a second surface 114 corresponding to the first surface 112.
  • the upper heat conducting arm 120 is formed on the second surface 114 of the first heat conducting plate 110. It can be understood that the upper heat conducting arm 120 may be integrally formed with the first heat conducting plate 110, or may be separately manufactured and then fixed to the first heat conducting plate 110 by mechanical connection such as welding or screwing. .
  • the first heat conducting plate 110 and the upper heat conducting arm 120 are made of a metal material having good thermal conductivity such as copper, aluminum or the like or a non-metallic solid material such as graphite, boron nitride or aluminum nitride.
  • Each of the upper thermally conductive arms 120 includes an end surface 122 and a side surface 124 that vertically surrounds the periphery of the end surface 122. Since the end surface 122 is perpendicular to the side surface 124, the shape of the end surface 122 can reflect the shape of the cross section of the upper heat conducting arm 120, and the end surface 122 of the upper heat conducting arm 120 can be set to any shape according to requirements. , such as regular polygons such as an equilateral triangle, a positive direction, a rectangle or an irregular polygon or a shape such as a circle or an ellipse. In this embodiment, the side surface 124 of the upper heat conducting arm 120 is in contact with the heat conducting structure 130.
  • the heat conducting structure 130 includes a second heat conducting plate 132, and the plurality of sets of two heat conducting plates 132 includes an upper surface 132a and a lower surface 132b corresponding to the upper surface 132a.
  • the heat conducting surface 131 and the lower surface 132b of the second heat conducting plate 132 are the same surface.
  • the lower heat conducting arm 134 is disposed on the upper surface 132a of the second heat conducting plate 132 and forms an angle with the upper surface 132a. The optimum value of the angle is 90 degrees.
  • Each set of lower heat conducting arms 134 includes two heat conducting springs 134a, 134b of identical construction and symmetrically disposed on the upper surface 132a of the second heat conducting plate 132.
  • the heat transfer spring 134a is taken as an example to illustrate heat conduction.
  • Each of the heat transfer springs 134a includes a support portion 134c and an elastic portion 134d formed at an end of the support portion 134c.
  • the support portion 134c includes a fixed end 134e and a free end 134f corresponding to the fixed end 134e.
  • the support portion 134c is fixed to the upper surface 132a of the second heat conducting plate 132 through its fixed end 134e.
  • the elastic portion 134d is coupled to the free end 134f of the support portion 134c and forms an angle with the support portion 134c, and the included angle is preferably an acute angle.
  • the elastic portions 134d of the two heat conducting springs 134a, 134b of each of the lower heat conducting arms 134 are aligned with each other and at a distance to form a receiving space 136 for accommodating the upper heat conducting arms 120.
  • the lower heat conducting arm 134 is made of beryllium copper, spring steel or the like. It can be understood that, in this embodiment, the position of the lower heat conducting arm 134 and the upper heat conducting arm 120 can be interchanged, that is, the lower heat conducting arm 134 is disposed on the second surface 114 of the first heat conducting board 110, The upper heat conducting arm 120 is correspondingly disposed on the upper surface 132a of the second heat conducting plate 132.
  • the heat conducting arm 120 on the first heat conducting plate 110 corresponds to a corresponding set of heat conducting springs 134a, 134b on the heat conducting structure 130, and the end surface 122 of the upper heat conducting arm 120 is resisted.
  • a certain pre-pressure is applied to the first heat conducting plate 110 to insert the upper heat conducting arm 120 into the receiving space 136 of the corresponding lower heat conducting arm 134.
  • the elastic portion 134d of the heat conducting springs 134a, 134b is elastically bent in the direction of the supporting portion 134c under the pre-pressure, and the bent elastic portion 134d is in close contact with the side surface 124 of the upper heat conducting arm 120.
  • the upper pressure can achieve the distance between the heat conducting surface 131 of the heat conducting structure 130 and the first heat conducting plate 110 by the relative sliding between the heat conducting structure 130 and the first heat conducting plate 110, when the heat conducting device is When used in an electronic device, the 100 can compensate for the accumulated tolerances generated by the electronic device during the manufacturing process, so as to facilitate the installation and manufacture, and at the same time ensure the effectiveness of the heat conduction channel. Improve the heat dissipation effect during the use of electronic products.
  • FIG. 2 a side view of a heat conducting device 200 according to a second embodiment of the present invention is shown.
  • the structure of the heat conducting device 200 is similar to that in the heat conducting device 100 of the first embodiment, including a The first heat conducting plate 210 and a heat conducting structure 230, the first heat conducting plate 210 includes at least one upper heat conducting arm 220 disposed on one side surface thereof.
  • the heat conducting structure 230 is opposite to the upper heat conducting arm 220 of the first heat conducting plate 210 and slidably abuts the upper heat conducting arm 220, and passes between the heat conducting structure 230 and the upper heat conducting arm 220.
  • the contact surface performs heat transfer.
  • the heat conducting structure 230 includes a heat conducting surface 231 for maintaining a relative position between the first heat conducting plate 210 and the heat conducting surface 231, and is capable of passing the upper heat conducting arm 220 and the heat conducting structure.
  • the relative sliding between 230 changes the distance between the first heat conducting plate 210 and the heat conducting surface 231 of the heat conducting structure 230 while ensuring that there is always between the upper heat conducting arm 220 of the first heat conducting plate 210 and the heat conducting structure 230 A contact surface that allows heat transfer.
  • the difference between the heat conducting device 200 provided by the second embodiment of the present invention and the heat conducting device 100 provided by the first embodiment is:
  • each of the upper heat conducting arms 220 includes two structurally symmetrical elastic pieces 222, wherein each of the elastic pieces 222 includes a connecting portion 222a and a resisting portion 222b connected to the connecting portion 222a.
  • the connecting portion 222a is connected to the second surface 214 of the first heat conducting plate 210 through one end thereof, and forms an angle with the second surface 214. The degree of the angle is preferably 90 degrees.
  • the abutting section 222b is connected to one end of the first heat conducting plate 210 at the connecting section 222a, and forms a certain angle with the connecting section 222a, and the angle is preferably an acute angle.
  • the two elastic pieces 222 of each of the upper heat conducting arms 220 are symmetrically disposed on the second surface 214 of the first heat conducting plate 210, and the resisting segments 222b on the two elastic pieces 222 are respectively located
  • the two connecting segments 222a of the elastic piece 222 are on the side away from each other, thereby forming a taper having a cross-sectional dimension gradually decreasing from the first heat conducting plate 210 to a direction away from the first heat conducting plate 210.
  • the heat conducting structure 230 includes a second heat conducting plate 232, and the plurality of sets of two heat conducting plates 232 includes an upper surface 232a and a lower surface 232b corresponding to the upper surface 232a.
  • the heat conducting surface 231 and the lower surface 232b of the second heat conducting plate 232 are the same surface.
  • the lower heat conducting arm 234 is disposed on the upper surface 232a of the second heat conducting plate 232 and forms an angle with the upper surface 232a. The optimum value of the angle is 90 degrees.
  • Each set of lower heat conducting arms 234 includes two heat conducting springs 234a, 234b of identical construction and symmetrically disposed on the upper surface 232a of the second heat conducting plate 232.
  • the heat conducting springs 234a, 234b in this embodiment are leaf springs vertically disposed on the second heat conducting plate 232, and the two heat conducting springs 234a, 234b are spaced apart from each other. A fixed distance forms a receiving space 236 that can accommodate the upper thermally conductive arm 220.
  • each of the upper heat conducting arm 220 and the lower heat conducting arm 234 can be made of an elastic material such as beryllium copper or spring steel. It can be understood that, in this embodiment, the positions of the lower heat conducting arm 234 and the upper heat conducting arm 220 are interchangeable, that is, the lower heat conducting arm 234 is disposed on the second surface 214 of the first heat conducting board 210.
  • the upper heat conducting arm 220 is correspondingly disposed on the upper surface 232a of the second heat conducting plate 232.
  • the upper heat conducting arm 220 of the first heat conducting plate 210 corresponds to a corresponding set of heat conducting springs 234a, 234b on the heat conducting structure 230, and the four holding sections 222b of each upper heat conducting arm 220 are used. Resisting the heat conducting springs 234a, 234b, a certain pre-pressure is applied to the first heat conducting plate 210 to insert the upper heat conducting arm 220 into the receiving space 236 of the corresponding lower heat conducting arm 234.
  • the abutting portion 222b of the upper heat conducting arm 220 and the heat conducting springs 234a, 234b are closely held together to maintain effective heat transfer between the heat conducting springs 234a, 234b and the elastic piece 222 through the contact surface.
  • the distance between the heat conducting surface 231 of the structure 230 and the first heat conducting plate 210 is adjusted, and when the heat conducting device 200 is used in an electronic device, the electronic device can be compensated for during the manufacturing process. Cumulative tolerances.
  • the elastic sheet 222 and the heat transfer springs 234a and 234b which are provided correspondingly are used to realize the functions of position adjustment and heat transfer, and the entire heat transfer device 200 can be made lighter and the structure can be simplified.
  • FIG. 3 a side view of a heat conducting device 300 according to a third embodiment of the present invention is shown.
  • the structure of the heat conducting device 300 is similar to that of the heat conducting device 100 in the first embodiment, and includes a first heat conducting plate 310 and a heat conducting structure 330, and the first heat conducting plate 310 includes at least one disposed on one side thereof.
  • the upper heat conducting arm 320 on the surface.
  • the heat conducting structure 330 is slidably opposed to the upper heat conducting arm 320 of the first heat conducting board 310 and to the upper heat conducting arm 320, and passes between the heat conducting structure 330 and the upper heat conducting arm 320.
  • the contact surface performs heat transfer.
  • the heat conducting structure 330 includes a heat conducting surface 331 for maintaining the first heat conducting plate 310 and the heat conducting surface 331
  • the relative position between the two, and the relative sliding between the upper heat conducting arm 320 and the heat conducting structure 330 can change the distance between the first heat conducting plate 310 and the heat conducting surface 331 of the heat conducting structure 330 while performing heat transfer. Contact surface.
  • the difference between the heat conducting device 300 provided by the third embodiment of the present invention and the heat conducting device 100 provided by the first embodiment of the present invention is:
  • a plurality of regularly arranged heat dissipation fins 316 are formed on the first surface 312 of the first heat conducting plate 310 for rapidly diffusing heat on the first heat conducting plate 310 into the surrounding medium. .
  • a male surface 326 is formed between the end surface 322 of each of the upper heat conducting arms 320 and the side surface 324.
  • the male surface 326 is connected between the side surface 324 and the end surface 322 at a certain connection angle.
  • the angle of attachment is preferably an obtuse angle.
  • the heat conducting structure 330 includes at least one cantilevered lower heat conducting arm 334 that are separated from each other.
  • the plurality of cantilevered lower heat conducting arms 334 are identical in structure, and each of the cantilevered lower heat conducting arms 334 includes a positioning section 334a, two elastic sections 334b respectively connected to opposite ends of the positioning section 334a, and two Elastic cantilever segments 334c are respectively attached to the ends of the elastic segments 334b.
  • the bottom surface of the positioning section 334a constitutes the heat conducting surface 331.
  • the two elastic segments 334b are coupled at opposite ends of the positioning segment 334a at an angle.
  • the central portions of the two elastic segments 334b are bent in opposite directions to form an energy storage portion 334d.
  • the two elastic cantilever segments 334c are respectively connected to one end of the elastic segment 334b away from the positioning segment 334a in a manner substantially parallel to the positioning segment 334a, and are disposed opposite to each other. It can be understood that the mutually corresponding ends of the two elastic cantilever segments 334c can be connected to each other to form a unitary structure in which both ends are connected to the elastic segment 334b.
  • the upper heat conducting arm 320 on the first heat conducting plate 310 corresponds to the two elastic cantilever segments 334c on the heat conducting structure 330, and the end surface 322 of each upper heat conducting arm 320 is resisted by the elasticity.
  • a certain pre-pressure is applied to the first heat conducting plate 310 to insert the upper heat conducting arm 320 between the two elastic segments 334b of the corresponding cantilevered lower heat conducting arm 334.
  • the elastic cantilever section 334c of the cantilever-type lower heat conducting arm 334 is elastically deformed toward the positioning section 334a under the pre-pressure, and at this time, the tapered surface 326 formed on the upper heat conducting arm 320 will be bent
  • the rear elastic cantilever segments 334c are closely abutted against each other, thereby causing the upper heat conducting arms 320 and the heat conduction
  • the structure 330 has sufficient contact to ensure effective heat transfer between the upper heat conducting arm 320 and the heat conducting structure 330 through the contact surface, and at the same time, the heat conducting surface 331 of the heat conducting structure 330 and the first heat conducting board can be maintained.
  • the relative position between the 310s only needs to apply pressure to the first heat conducting plate 310 or release the pressure applied to the first heat conducting plate 310 through the heat conducting structure 330 and the first heat conducting plate 310.
  • the relative sliding between the heat conducting surface 331 of the heat conducting structure 330 and the first heat conducting plate 310 is adjusted, and the heat conducting device 300 can be used in the electronic device to compensate for the electronic device generated during the manufacturing process. Accumulated tolerances.
  • the plurality of cantilevered lower heat conducting arms 334 in the heat conducting structure 330 have their own positioning segments 334a, thereby allowing the heat conducting structures 330 to be simultaneously applied to electronic devices having multiple separate heat sources. In the middle, the heat dissipation structure is used to reduce the manufacturing cost.
  • FIG. 4 a side view of a heat conducting device 400 according to a fourth embodiment of the present invention is shown.
  • the structure of the heat conducting device 400 is similar to that of the heat conducting device 300 in the third embodiment, and includes a first heat conducting plate 410 and a heat conducting structure 430.
  • the first heat conducting plate 410 includes two spaced apart distances.
  • the upper heat conducting arm 420 on one side of the surface.
  • the heat conducting structure 430 is opposite to the upper heat conducting arm 420 of the first heat conducting board 410 and slidably abuts the upper heat conducting arm 420, and passes between the heat conducting structure 430 and the upper heat conducting arm 420.
  • the contact surface performs heat transfer.
  • the heat conducting structure 430 includes a heat conducting surface 431 for maintaining a relative position between the first heat conducting plate 410 and the heat conducting surface 431 and capable of passing the upper heat conducting arm 420 and the heat conducting structure.
  • the relative sliding between the 430 changes the distance between the first heat conducting plate 410 and the heat conducting surface 431 of the heat conducting structure 430 while ensuring that there is always between the upper heat conducting arm 420 of the first heat conducting plate 410 and the heat conducting structure 430 A contact surface that allows heat transfer.
  • the difference between the heat conducting device 400 provided by the fourth embodiment of the present invention and the heat conducting device 300 provided by the third embodiment of the present invention is:
  • the heat conducting structure 430 includes a plurality of cantilevered lower heat conducting arms 434 that are separated from each other.
  • the plurality of cantilevered lower heat conducting arms 434 have the same structure and correspond to the spacing area between the plurality of upper heat conducting arms 420 on the first heat conducting plate 410, and each of the cantilever type heat conduction
  • the arm 434 includes a positioning section 434a, two elastic sections 434b respectively connected at opposite ends of the positioning section 434a, and two elastic cantilever sections 434c respectively connected to the corresponding ends of the elastic section 434b.
  • the bottom surface of the positioning section 434a constitutes the heat conducting surface 431.
  • the two elastic segments 434b are connected at opposite ends of the positioning segment 434a at an angle.
  • the two elastic cantilever segments 434c are along the phase The directions of the mutual back are respectively connected to one end of the elastic segment 434b away from the positioning segment 434a, and are deflected in the direction in which the positioning segment 434a is located
  • the upper heat conducting arm 420 on the first heat conducting plate 410 corresponds to the adjacent elastic cantilever segment 434c of the two adjacent cantilevered lower heat conducting arms 434 of the heat conducting structure 430, and each of the upper arms The end surface 422 of the heat conducting arm 420 is abutted on the elastic cantilever segment 434c, and then a certain pre-pressure is applied to the first heat conducting plate 410, so that the upper heat conducting arm 420 is inserted into the adjacent two cantilever type heat conduction. Between arms 434.
  • the elastic cantilever section 434c of the adjacent cantilevered lower heat conducting arm 434 is elastically deformed in the direction of the positioning section 434a under the preload, and at this time, the tapered surface 426 formed on the upper heat conducting arm 420 will
  • the elastic cantilever segments 434c are closely abutted against each other, so that the upper heat conducting arms 420 are in sufficient contact with the heat conducting structure 430, thereby ensuring a contactable surface between the upper heat conducting arms 420 and the heat conducting structure 430.
  • Effective heat transfer is performed while maintaining the relative position between the heat conducting surface 431 of the heat conducting structure 430 and the first heat conducting plate 410.
  • the heat transfer device 400 provided in this embodiment is adjusted in the same manner as the heat transfer device 300 provided in the third embodiment of the present invention, and has the same advantages as the heat transfer device 300.
  • a side view of a heat conducting device 500 includes a first heat conducting plate 510 and a heat conducting structure 530.
  • the first heat conducting plate 510 includes at least one upper heat conducting arm 520 disposed on a side surface thereof.
  • the heat conducting structure 530 is slidably abutted against the upper heat conducting arm 520 of the first heat conducting board 510 and with the upper heat conducting arm 520, and passes between the heat conducting structure 530 and the upper heat conducting arm 520.
  • the contact surface performs heat transfer.
  • the heat conducting structure 530 includes a heat conducting surface 531 for maintaining a relative position between the first heat conducting plate 510 and the heat conducting surface, and is capable of passing the upper heat conducting arm 520 and the heat conducting structure 530.
  • the relative sliding between them changes the distance between the first heat conducting plate 510 and the heat conducting surface 531 of the heat conducting structure 530, while ensuring that there is always a space between the upper heat conducting arm 520 of the first heat conducting plate 510 and the heat conducting structure 530 The contact surface for heat transfer.
  • the first heat conducting plate 510 includes a first surface 512 and a second surface 514 corresponding to the first surface 512.
  • Two first positioning posts 516 are formed on the second surface 514 of the first heat conducting plate 510.
  • the positioning posts 516 are formed on the second surface 514 near the edge of the second surface 514 in this embodiment. Position, but not limited to the above, the positioning post 516 can be disposed at any desired location on the second surface 514 to ensure proper use of the thermally conductive device 500.
  • a plurality of upper heat conducting arms 520 are disposed on the first heat conducting plate 510 at a distance, and the plurality of upper heat conducting arms 520 are disposed in a plurality of parallel manners on the first heat conducting plate 510.
  • the upper heat conducting arm 520 may be integrally formed with the first heat conducting plate 510, or may be fixed separately from the first heat conducting board 510 by soldering or screwing or bonding. Together.
  • the first heat conducting plate 510 and the upper heat conducting arm 520 are both made of a metal material having good thermal conductivity such as copper, aluminum or the like or a non-metallic solid material such as graphite, boron nitride or aluminum nitride.
  • each of the upper heat conducting arms 520 includes an end surface 522 and a side surface 524 vertically surrounding the outer surface of the end surface 522. Since the end surface 522 is perpendicular to the side surface 524, the shape of the end surface 522 can represent the shape of the cross section of the upper heat conducting arm 520, and the end surface 522 of the upper heat conducting arm 520 can be set to any shape according to requirements. , such as regular polygons such as an equilateral triangle, a positive direction, a rectangle or an irregular polygon or a shape such as a circle or an ellipse.
  • the side surface 524 of the upper heat conducting arm 520 abuts against the heat conducting structure 530.
  • the plurality of upper heat conduction holes 526 and the first sliding hole 528 are disposed on the same upper heat conducting arm 520, and the first sliding hole 528 is thermally conductive on the other. On the arm 520.
  • the heat conducting structure 530 includes a second heat conducting plate 532, a plurality of lower heat conducting arms 534 formed on the second heat conducting plate 532, a plurality of elastic members 536, and a plurality of locking members 538.
  • the second heat conducting plate 532 includes an upper surface 532a and a lower surface 532b corresponding to the upper surface 532a.
  • the heat conducting surface 531 and the lower surface 532b of the second heat conducting plate 532 are the same surface.
  • Two second positioning posts 532c are formed on the upper surface 532a of the second heat conducting plate 532.
  • the second positioning posts 532c are spatially symmetric with the first positioning posts 516 on the first heat conducting plate 510. That is, the orthographic projection of the first positioning post 516 and the second positioning post 532c in the plane of the second surface 514 of the first heat conducting plate 510 is symmetric with respect to the geometric center of the second surface 514. status.
  • the second heat conducting plate 532 is formed in a square shape.
  • Two convex blocks 532d are respectively formed at diagonal positions of the second heat conducting plate 532, and two through holes 532e are respectively formed in the protruding block 532d.
  • the fixing member passes through the through hole 532e to fix the second heat conducting plate 532 on a heat source in an attachment such as an electronic device or a heat dissipation housing.
  • the bump 532d is also It may be disposed at any position of the second heat conducting plate 532 as long as it is in a mutually opposing structure so that the second heat conducting plate 532 can be stably attached to the attached object.
  • the upper surface 532a of the second heat conducting plate 532 is on.
  • the second lower heat conducting arms 534 of the plurality of lower heat conducting arms 534 are respectively provided with second sliding holes 534a corresponding to the first screw holes 526 and the first sliding holes 528 of the upper heat conducting arms 520.
  • the second screw hole 534b wherein the first sliding hole 528 and the second sliding hole 534a have larger apertures than the first screw hole 526 and the second screw hole 534b, and the first sliding hole 528 and the second sliding hole
  • the 534a extends a certain distance along a direction perpendicular to the first heat conducting plate 510 to form an elongated opening having a certain stroke space.
  • the elastic member 536 in this embodiment includes a plurality of first limiting elastic members 536a and a plurality of second limiting elastic members 536b.
  • the plurality of first limiting elastic members 536a are disposed on the first positioning post 516 and the second positioning post 532c for holding the heat conducting surface 531 of the first heat conducting plate 510 and the heat conducting structure 530. The distance between them.
  • the plurality of second elastic members 536b are in a state of being in phase with the locking member 538.
  • the elastic member 536 is a coil spring.
  • the locking member 538 is a bolt in the embodiment for slidably connecting the first heat conducting plate 510 and the heat conducting structure 530 together.
  • the first limiting elastic member 536a is respectively sleeved on the first positioning post 516 and the second positioning post 532c, and then the first heat conducting plate 510 is covered on the heat conducting structure 530.
  • the upper heat conducting arm 520 and the lower heat conducting arm 534 are staggered with each other, wherein a plurality of the upper heat conducting arms 520 are respectively located on the same side of the plurality of the lower heat conducting arms 534.
  • a certain pressure is applied to the first heat conducting plate 510 to elastically deform the first limiting elastic member 536a to store a certain elastic potential energy, which is provided by the elastic potential energy stored in the first limiting elastic member 526a.
  • the elastic force thereby maintains the positional relationship between the first heat conducting plate 510 and the heat conducting structure 530.
  • the first screw hole 526 and the first sliding hole 528 of the upper heat conducting arm 520 and the second sliding hole 534a and the second screw hole 534b of the lower heat conducting arm 534 are aligned with each other.
  • the second limiting elastic member 536b locking member 538 is respectively locked into the first screw hole 526 and the second screw hole 534b, and the locking member 538 is inserted into the first sliding hole.
  • the second limiting elastic member 536b provides a force acting on the upper heat conducting arm 520 and the lower heat conducting arm 534 by storing the elastic potential energy therein, so that the upper heat conducting arm 520 and the lower heat conducting arm 534 are always close to each other. The trend is to ensure that the upper thermally conductive arm 520 and the lower thermally conductive arm 534 are always in close contact to achieve heat transfer.
  • the heat conducting device 500 maintains the relative position between the heat conducting surface 531 of the heat conducting structure 530 and the first heat conducting plate 510 through the locking member 538 and the first limiting elastic member 536a. Adjusting the distance between the heat conducting surface 531 of the heat conducting structure 530 and the first heat conducting plate 510 requires only applying pressure to the first heat conducting plate 510 or releasing the pressure applied to the first heat conducting plate 510. The adjustment of the distance between the thermally conductive structure 530 and the first thermally conductive plate 510 can be achieved, thereby compensating for the cumulative tolerances that the electronic device produces during the manufacturing process.
  • the heat conducting device increases the heat conducting structure 530 and the first heat conducting plate by disposing a lower heat conducting arm 534 on the second heat conducting plate 532 that can abut against the upper heat conducting arm 520.
  • the contact surface for heat transfer between the 510s reduces the thermal resistance to further improve the heat dissipation efficiency.
  • a side view of a heat conducting device 600 is similar to the heat conducting device 500 provided by the fifth embodiment, and includes a first heat conducting plate 610 and a heat conducting. Structure 630.
  • the first heat conducting plate 610 includes at least one upper heat conducting arm 620 disposed on a side surface thereof.
  • the heat conducting structure 630 is opposite to the upper heat conducting arm 620 of the first heat conducting board 610 and slidably abuts the upper heat conducting arm 620, and passes through the lower heat conducting arm 634 formed on the heat conducting structure 630. Heat transfer is performed with the contact surface between the upper heat conducting arms 620.
  • the heat conducting structure 630 includes a heat conducting surface 631 for maintaining a relative position between the first heat conducting plate 610 and the heat conducting surface, and is capable of passing the upper heat conducting arm 620 and the heat conducting structure 630.
  • the relative sliding between them changes the distance between the first heat conducting plate 610 and the heat conducting surface 631 of the heat conducting structure 630, while ensuring that there is always between the upper heat conducting arm 620 of the first heat conducting plate 610 and the heat conducting structure 630
  • the heat conduction device 600 provided by the sixth embodiment of the present invention is different from the heat conduction device 500 provided by the fifth embodiment of the present invention in that:
  • the first positioning post 516, the second positioning post 532c, and the first positioning post 516 and the second positioning post 532c of the heat conducting device 500 in the fifth embodiment are omitted.
  • a limit elastic member 536a in the embodiment, a first elastic member 650 disposed between the second surface 614 of the first heat conducting plate 610 and the upper surface 632a of the second heat conducting plate 632 is used to hold the first heat conducting plate. The relative position of the 610 to the heat conducting surface 631 of the heat conducting structure 630.
  • the first elastic member 650 is located in a space surrounded by the upper heat conducting arm 620 and the lower heat conducting arm 634.
  • the first elastic member 650 is an elastic spring.
  • the heat conducting device 600 provided by the sixth embodiment of the present invention can achieve the same function as the heat conducting device 500 provided by the fifth embodiment.
  • a first elastic member is used in the heat conducting device 600 to greatly heat the heat.
  • the structure of the device 600 can further reduce the manufacturing cost of the heat conducting device 600.
  • a side view of a heat conducting device 700 according to a seventh embodiment of the present invention is similar to the heat conducting device 600 provided in the sixth embodiment, and includes a first heat conducting plate 710 and a heat conducting structure. 730.
  • the first heat conducting plate 710 includes at least one upper heat conducting arm 720 disposed on a side surface thereof.
  • the heat conducting structure 730 is opposite to the upper heat conducting arm 720 of the first heat conducting board 710 and slidably abuts the upper heat conducting arm 720, and passes between the heat conducting structure 730 and the upper heat conducting arm 720.
  • the contact surface performs heat transfer.
  • the heat conducting structure 730 includes a heat conducting surface 731 for maintaining a relative position between the first heat conducting plate 710 and the heat conducting surface, and is capable of passing the upper heat conducting arm 720 and the heat conducting structure 730. The relative sliding between them changes the distance between the first heat conducting plate 710 and the heat conducting surface 731 of the heat conducting structure 730 while ensuring the first contact surface.
  • the heat conduction device 700 provided by the seventh embodiment of the present invention is different from the heat conduction device 600 provided by the sixth embodiment in that:
  • the locking member 638 and the second limiting elastic member 636b in the heat conducting device 600 in the sixth embodiment are further omitted.
  • two second elastic member disposed on the upper surface 732a of the second heat conducting plate 732 is 770, the second elastic member 770 adjacent to the lower heat conducting arm 734 and abuts against the
  • the upper heat conducting plate 710 is disposed on the first heat conducting board 710 to closely abut the lower heat conducting arm 734 of the heat conducting structure 730, thereby ensuring the first heat conducting board 710 and the heat conducting structure. There is always a contact surface between the 730 for heat transfer.
  • the second elastic member 770 is an elastic spring, but is not limited to the elastic spring.
  • the heat conducting device 700 provided by the seventh embodiment of the present invention can achieve the same function as the heat conducting device 600 provided by the sixth embodiment.
  • two second elastic members 770 are used in the heat conducting device 700 to maintain the upper portion. The close contact between the heat conducting arm 720 and the lower heat conducting arm 734 not only realizes the structure of the 700, but further reduces the manufacturing cost of the heat conducting device 700.
  • the first elastic member 750 in the embodiment may have other alternatives.
  • the first elastic member 750 may be disposed on the first heat conducting board 710 and the second heat conducting portion.
  • the elastic members 780 are replaced by plates 732.
  • the elastic members 780 are respectively symmetrical in the region.
  • the elastic member 780 is a metal coil spring, but is not limited to a metal coil spring.
  • the elastic member 780 may be replaced by other elastic devices or elements such as elastic rubber.
  • the first heat conducting plate 710 in the heat conducting device 700 in the embodiment is connected to the second heat conducting plate 732 in the heat conducting structure 730 by screwing, riveting, bonding, etc., it is reliable.
  • the first elastic member 750 or the elastic member 780 in the heat conducting device 700 can be omitted, and thus, further The structure of the cylindrical heat transfer device 700.
  • a side view of a heat conducting device 800 according to a seventh embodiment of the present invention is similar to the heat conducting device 700 provided by the seventh embodiment of the present invention, and includes a first heat conducting plate 810 and a Thermally conductive structure 830.
  • the first heat conducting plate 810 includes at least one upper heat conducting arm 820 disposed on a side surface thereof.
  • the heat conducting structure 830 is opposite to the upper heat conducting arm 820 of the first heat conducting board 810 and slidably abuts the upper heat conducting arm 820, and passes between the heat conducting structure 830 and the upper heat conducting arm 820.
  • the contact surface performs heat transfer.
  • the heat conducting structure 830 includes a heat conducting surface 831 for maintaining a relative position between the first heat conducting plate 810 and the heat conducting surface 831, and is capable of passing the upper heat conducting arm 820 and the heat conducting structure.
  • the relative sliding between 830 changes the distance between the first heat conducting plate 810 and the heat conducting surface 831 of the heat conducting structure 830, while The contact surface for heat transfer.
  • the heat conduction device 800 provided by the eighth embodiment of the present invention is different from the heat conduction device 700 provided by the seventh embodiment in that:
  • the first elastic member 750 and the second elastic member 770 in the heat conducting device 700 of the seventh embodiment are replaced by a plurality of integral elastic members 850 in a heat conducting device 800 according to the eighth embodiment of the present invention.
  • the elastic member 850 can maintain the positional relationship between the first heat conducting plate 810 and the heat conducting structure 830, and can also maintain the close relationship between the upper heat conducting arm 820 and the lower heat conducting arm 834. An efficient heat transfer between the thermally conductive plate 810 and the thermally conductive structure 830 is achieved.
  • Each of the elastic members 850 includes a positioning section 852, a support section 854 connected to the positioning section 852, and an elastic section 856 connected to the end of the support section 854.
  • the positioning segment 852 is fixed on the upper surface 832a of the second heat conducting plate 832.
  • the support section 854 is coupled to one end of the positioning section 852 in a substantially vertical manner, and an angle between the support section 854 and the positioning section 852 allows a certain positive and negative margin.
  • the elastic section 856 is coupled to one end of the support section 854 away from the support section 854 and is inclined toward the direction in which the second heat conducting plate 832 is located.
  • a side surface 824 of the upper heat conducting arm 820 is provided with a slope 826. The ramp 826 of the upper heat conducting arm 820 abuts against a resilient section 856 of the corresponding resilient member 850.
  • the elastic section 856 exerts an elastic force on the inclined surface 826 of the upper heat conducting arm 820, and the elastic force can be decomposed into a thrust perpendicular to the side surface 824 of the upper heat conducting arm 820 to hold the upper heat conducting arm 820 and the lower side.
  • the heat conducting device 800 can provide a force required to maintain a positional relationship between the first heat conducting plate 810 and the heat conducting structure 830 and a close abutment between the upper heat conducting arm 820 and the lower heat conducting arm 834 by a separate elastic member 850. Thereby, the structure of the heat conducting device 800 is collapsed.
  • a large area of contact between the elastic member 850 and the second heat conducting plate 832 and the upper heat conducting arm 820 can also achieve heat transfer, thereby improving heat transfer efficiency between the first heat conducting plate 810 and the heat conducting structure 830.
  • the inclined surface 826 and the end surface 822 of the upper heat conducting arm 820 pass through a side parallel to the side surface 824.
  • the transition face 828 is coupled and a stop 823 projecting from the transition face 828 is disposed at a location adjacent the end face 822 of the transition face 828.
  • the stopper 823 and the end of the elastic section 856 of the elastic member 850 abut each other, thereby preventing the upper heat conducting arm 820 and the elastic member 850 from being between The phenomenon of detachment occurred.
  • a side view of a heat conducting device 900 includes a first heat conducting plate 910 and a heat conducting structure 930.
  • the first heat guide plate 910 includes at least one upper heat conducting arm 920 disposed on one side surface thereof.
  • the heat conducting structure 930 is slidably opposed to the upper heat conducting arm 920 of the first heat conducting board 910 and to the upper heat conducting arm 920, and passes between the heat conducting structure 930 and the upper heat conducting arm 920.
  • the contact surface performs heat transfer.
  • the heat conducting structure 930 includes a heat conducting surface 931 for maintaining a relative position between the first heat conducting plate 910 and the heat conducting surface, and is capable of passing the upper heat conducting arm 920 and the heat conducting structure 930.
  • the relative sliding between them changes the distance between the first heat conducting plate 910 and the heat conducting surface 931 of the heat conducting structure 930, while ensuring that there is always a space between the upper heat conducting arm 920 of the first heat conducting plate 910 and the heat conducting structure 930 The contact surface for heat transfer.
  • the first heat conducting plate 910 includes a first surface 912 and a second surface 914 corresponding to the first surface 912.
  • a plurality of upper heat conducting arms 920 are included.
  • the plurality of upper heat conducting arms 920 include a first upper heat conducting arm 921, two second upper heat conducting arms 923 and a third upper heat conducting arm 925.
  • the first upper heat conducting arm 921, the second upper heat conducting arm 923, and the third upper heat conducting arm 925 are sequentially disposed on the second surface 914 of the first heat conducting plate 910.
  • a first surface of the first upper heat conducting arm 921 adjacent to the edge of the first heat conducting board 910 protrudes from the side 924 and is flush with the end surface 922 of the first upper heat conducting arm 921.
  • Limiting boss 921a, the first limiting boss 921a is used for heat conduction
  • a first slot 921b is defined in the end surface 922 of the first upper heat conducting arm 921 for setting a limiting device in the heat conducting structure 930.
  • the two second upper heat conducting arms 923 are disposed at a side of the first upper heat conducting arm 921 at a distance.
  • the third upper heat conducting arm 925 is disposed on the first heat conducting plate 910 on a side of the second upper heat conducting arm 923 away from the first upper heat conducting arm 921.
  • the third upper heat conducting arm 925 is opposite to the side 924 of the first upper heat conducting arm 931 and has a second slot 925a adjacent to the second surface 914 of the first heat conducting board 910.
  • a second limiting boss 925b is formed on the end of the slot 925a away from the first heat conducting board 910.
  • the second limiting boss 925b is configured to cooperate with a corresponding limiting structure on the heat conducting structure 930 to limit the The position between the first heat conducting plate 910 and the heat conducting structure 930 is described.
  • FIG. 13 a schematic perspective view of a heat conducting structure 930 according to a ninth embodiment of the present invention is shown.
  • the heat conducting structure 930 includes a second heat conducting plate 932, a plurality of lower heat conducting arms 934 formed on the second heat conducting plate 932, a plurality of elastic members 936 and a plurality of locking members 938.
  • the second heat conducting plate 932 includes an upper surface 932a and a lower surface 932b corresponding to the upper surface 932a.
  • the heat conducting surface 931 and the lower surface 932b of the second heat conducting plate 932 are the same surface.
  • the second heat conducting plate 932 is formed in a square shape.
  • Two convex blocks 932d are respectively formed at diagonal positions of the second heat conducting plate 932, and two through holes 932e are respectively formed in the protruding block 932d.
  • the fixing member passes through the through hole 932e to fix the second heat conducting plate 932 on a heat source in an attachment such as an electronic device or a heat dissipation housing.
  • the lower heat conducting arm 934 in this embodiment is identical in structure and arrangement to the upper heat conducting arm 920.
  • the plurality of lower heat conducting arms 934 include a first lower heat conducting arm 934a, two second lower heat conducting arms 934b, and a The third lower heat conducting arm 934c.
  • the first lower heat conducting arm 934a, the second lower heat conducting arm 934b and the third lower heat conducting arm 934c are sequentially disposed on the upper surface 932a of the second heat conducting plate 932.
  • a first lower heat conducting arm 934a is adjacent to a side surface of the second heat conducting plate 932 and a second corresponding limiting boss 925b on the third upper heat conducting arm 925 is protruded from the first lower heat conducting arm 925.
  • the third limiting boss 934d is provided with a third slot 934e at a position on the first lower heat conducting arm 934a adjacent to the third limiting boss 934d.
  • the second lower heat conducting arm 934b is disposed at a distance from the second heat conducting plate 932 on one side of the first lower heat conducting arm 934a.
  • the third lower heat conducting arm 934c is disposed on the second heat conducting plate 932 of the second lower heat conducting arm 934b away from the first lower heat conducting arm 934a, and the third lower heat conducting arm 934c corresponds to the first
  • the first limiting boss 921a on the upper heat conducting arm 921 is formed with a fourth slot 934f, and the fourth slot 934f is formed at an end away from the upper surface 932a of the second heat conducting board 932.
  • the fourth limiting bumps 93 that the first limiting protrusions 921a are engaged with each other are described.
  • the plurality of elastic members 936 are respectively disposed in the first slit 921b and the third slit 934e.
  • the elastic member 936 includes a fixing portion 936a, two first elastic arms 936b symmetrically formed on opposite sides of the fixing portion 936a, and the two first elastic arms 936b disposed on the fixing portion 936a.
  • a second resilient arm 936c on the side between the sides.
  • the two first elastic arms 936b are bent at an angle perpendicular to the side of the fixing portion 936a, and the angle of the bending is such that the bent first elastic arm 936b is convex at the second limit Table 925b and third limit boss 934d and first limit
  • the bumps 921a and the fourth limiting bumps 934g are engaged with each other, it is preferable to be able to resist the first heat conducting plate 910 and the second heat conducting plate 932.
  • the second elastic arm 936c is bent at an angle opposite to a direction in which the first elastic arm 936b is bent, and the angle of the bending is such that the second elastic arm 936c is on the first heat conducting plate 910. It is preferred to be able to resist the adjacent upper heat conducting arm 920 or the lower heat conducting arm 934 when mated with the heat conducting structure 930.
  • the fixing portion 936a of the elastic member 936 is first fixed to the bottom side of the first slot 921b and the third slot 934e by the locking member 938, respectively. Then, the first elastic member 936b and the second elastic member 936c of the elastic member 936 are compressed, and the first limiting boss 921a and the second slot 925a of the first heat conducting plate 910 and the fourth portion of the heat conducting structure 930 are
  • the slot 934f and the third limiting boss 934d are relatively positive, and the first limiting boss 921a is slid into the fourth slotted fourth slot 934f from one side of the heat conducting structure 930, and
  • the third limiting protrusion 934d is slid into the second slot 925a, so that the first limiting protrusion 921a and the second limiting protrusion 925b of the first heat conducting board 910 and the fourth limiting protrusion of the heat conducting structure 930 are respectively
  • the table 934g and the third limit boss 934d are engaged with each other.
  • first elastic member 936b and the second elastic member 936c are released, so that the first elastic members 936b are respectively respectively supported on the first heat conducting plate 910 or the second heat conducting plate 932 corresponding thereto to maintain the first a relative position between the heat conducting plate 910 and the heat conducting structure 930, while causing the second elastic members 936c to respectively abut the second upper heat conducting arm 920 or the second lower heat conducting arm 934 adjacent thereto to provide an elastic force
  • the plurality of upper heat conducting arms 920 are in close contact with the lower heat conducting arms 932 to ensure that there is always a heat transferable contact surface between the heat conducting arms 920 and the lower heat conducting arms 934.
  • the manner of assembling the heat conducting device 900 is merely a way of implementing the assembly, for example, and other assembly methods, such as directly placing the first heat conducting plate 910 above the heat conducting structure 930, and The upper heat conducting arm 920 corresponds to the space between the lower heat conducting arms 934, and then applies pressure to the first heat conducting plate 910. Under the pressure, the first elastic member 936b of the elastic member 936 and The second elastic member 936c will be elastically deformed, and as the upper heat conducting arm 920 is gradually inserted into the space between the lower heat conducting arms 934, the second elastic member 936c will resist heat conduction on the second adjacent thereto.
  • the arm 920 or the second lower heat conducting arm 934 is elastically deformed, and the first heat conducting plate 910 and the adjustable heat conducting structure 930 have relative motion under the elastic force of the second elastic member 936c. a trend of the first limiting boss 921a and the second limiting boss 925b of the first heat conducting plate 910 and the fourth limiting boss 934g and the third limit of the heat conducting structure 930 respectively. Position bosses 934d are engaged with each other, from The assembly of the heat conducting device 900 is completed.
  • the heat conducting device 900 maintains the relative position between the first heat conducting plate 910 and the heat conducting structure 930 and the first heat conducting plate 910 and the heat conducting structure 930 through the integral elastic member 936.
  • the heat transfer contact surface is adjustable to achieve a distance between the first heat conducting plate 910 and the heat conducting structure 930, and at the same time, good heat transfer characteristics are demonstrated.
  • the use of an integral resilient member 936 can collapse the structure of the heat transfer device 900, thereby reducing cost.
  • a side view of a heat conducting device 1000 includes a first heat conducting plate 1010 and a heat conducting structure 1030.
  • the first heat conducting plate 1010 includes at least one upper heat conducting arm 1020 disposed on a side surface thereof.
  • the heat conducting structure 1030 is slidably opposed to the upper heat conducting arm 1020 of the first heat conducting board 1010 and to the upper heat conducting arm 1020, and passes between the heat conducting structure 1030 and the upper heat conducting arm 1020.
  • the contact surface performs heat transfer.
  • the heat conducting structure 1030 includes a heat conducting surface 1031 for maintaining a relative position between the first heat conducting plate 1010 and the heat conducting surface, and is capable of passing the upper heat conducting arm 320 and the heat conducting structure 330.
  • the relative sliding between them changes the distance between the first heat conducting plate 1010 and the heat conducting surface 1031 of the heat conducting structure 1030, while ensuring that there is always a space between the upper heat conducting arm 1020 of the first heat conducting plate 1010 and the heat conducting structure 1030.
  • the contact surface for heat transfer is not limited to.
  • the first heat conducting plate 1010 includes a first surface 1012 and a second surface 1014 corresponding to the first surface 1012.
  • a plurality of upper heat conducting arms are included, and the plurality of upper heat conducting arms 1020 include a first upper heat conducting arm 1021, two second upper heat conducting arms 1023, and a third upper heat conducting arm 1025.
  • the first upper heat conducting arm 1021, the second upper heat conducting arm 1023 and the third upper heat conducting arm 1025 are sequentially disposed on the second surface 1014 of the first heat conducting plate 1010.
  • a first limit of the first upper heat conducting arm 1021 adjacent to the edge 1024 of the edge of the first heat conducting board 1010 protrudes from the side surface 1024 and is flush with the end surface 1022 of the first upper heat conducting arm 1021.
  • the positioning block 1021a is configured to cooperate with a corresponding limiting structure on the heat conducting structure 1030 to limit the position between the first heat conducting plate 1010 and the heat conducting structure 1030.
  • a first groove 1021b is defined in a direction perpendicular to the first heat conducting plate 1010, and the first groove 1021b has a depth smaller than the first limiting boss 1021a. The height of the side 1024 relative to the first limiting boss 1021a.
  • the first groove 1021b is for using the first heat conducting plate 1010 It plays a role in guiding and limiting during assembly with the heat conducting structure 1030.
  • the first upper heat conducting arm 1021 forms a first inclined surface 1024a corresponding to the side 1024 of the other side on which the first groove 1021b is formed, and the first inclined surface 1024a of the first upper heat conducting arm 1021.
  • a first rib 1021c penetrating the first slope 1024a in an extending direction parallel to the longer side of the end surface 1022 of the first upper heat conducting arm 1021 is formed at an intermediate position.
  • the two second upper heat conducting arms 1023 are disposed at a distance from the first heat conducting plate 1010 on the side of the first upper heat conducting arm 1021, and a parallel is formed on each of the second upper heat conducting arms 1023.
  • the second slope 1023a of the first slope 1024a is disposed at a distance from the first heat conducting plate 1010 on the side of the first upper heat conducting arm 1021, and a parallel is formed on each of the second upper heat conducting arms 1023.
  • the third upper heat conducting arm 1025 is disposed on the first heat conducting plate 1010 of the second upper heat conducting arm 1023 away from the first upper heat conducting arm 1021.
  • the third upper heat conducting arm 1025 is opposite to a side surface of the inclined surface 1024a of the first upper heat conducting arm 1031, and a first slot 1025a adjacent to the second surface 1014 of the first heat conducting board 1010 is opened.
  • An end of the first slot 1025a away from the first heat conducting plate 1010 defines a second limiting boss 1025b, and the second limiting boss 1025b is configured to cooperate with a corresponding limiting structure on the heat conducting structure 1030. Thereby the position between the first heat conducting plate 1010 and the heat conducting structure 1030 is maintained.
  • the heat conducting structure 1030 includes a second heat conducting plate 1032, a plurality of lower heat conducting arms 1034 formed on the second heat conducting plate 1032, and a plurality of elastic members 1036.
  • the second heat conducting plate 1032 includes an upper surface 1032a and a lower surface 1032b corresponding to the upper surface 1032a.
  • the heat conducting surface 1031 and the lower surface 1032b of the second heat conducting plate 1032 are the same surface.
  • the second heat conducting plate 1032 is formed in a square shape.
  • Two convex blocks 1032d are respectively formed at diagonal positions of the second heat conducting plate 1032, and two through holes 1032e are respectively formed on the protruding blocks 1032d for
  • the fixing member passes through the through hole 1032e to fix the second heat conducting plate 1032 to a heat source in an attachment such as an electronic device or a heat dissipation housing.
  • the lower heat conducting arm 1034 in this embodiment is identical in structure and arrangement to the upper heat conducting arm 1020.
  • the plurality of lower heat conducting arms 1034 includes a first lower heat conducting arm 1034a, two second lower heat conducting arms 1034b, and a The third lower heat conducting arm 1034c.
  • the first lower heat conducting arm 1034a, the second lower heat conducting arm 1034b and the third lower heat conducting arm 1034c are sequentially disposed on the upper surface 1032a of the second heat conducting plate 1032.
  • One side of the first lower heat conducting arm 1034a adjacent to the edge of the second heat conducting plate 1032 protrudes from a second limiting boss 1025b on the third upper heat conducting arm 1025 and can The third limit boss 1034d is engaged with each other.
  • a second recess 1034e is defined on a side of the third limiting boss 1034d corresponding to the edge of the second heat conducting board 1032, and the second recess 1034e has a width greater than that on the first heat conducting board 1010.
  • the length of the third upper heat conducting arm 1025 accommodates the third upper heat conducting arm 1025.
  • the other side of the first lower heat conducting arm 1034a corresponding to the side where the second groove 1034e is located is formed with a third inclined surface 1034h, and the third inclined surface 1034h is formed with a first along the first lower surface
  • the direction of the longer intersection between the heat conducting arm 1034a and the second heat conducting plate 1032 extends through the second rib 1034i of the third slope 1034h.
  • the second lower heat conducting arm 1034b is disposed at a distance from the second heat conducting plate 1032 on the side of the first lower heat conducting arm 1034a, wherein each of the second lower heat conducting arms 1034b is formed with a parallel to the first The fourth slope 1034g of the three slope 1034h.
  • the third lower heat conducting arm 1034c is disposed on the second heat conducting plate 1032 of the second lower heat conducting arm 1034b away from the first lower heat conducting arm 1034a, and the third lower heat conducting arm 1034c corresponds to the first
  • the first limiting boss 1021a on the upper heat conducting arm 1021 is formed with a second slot 1034f, and the second slot 1034f is formed at an end away from the upper surface 1032a of the second heat conducting board 1032.
  • the fourth limit bumps 1034k are fastened to each other by the first limiting bumps 1021a.
  • the elastic member 1036 is a circlip, wherein each elastic member 1036 includes a raised elastic portion 1036a, and a buckle portion extending outward from the elastic portion 1036a and bent in opposite directions. 1036b, the ends of the two fastening portions 1036b are separated by a certain distance.
  • the plurality of elastic members 1036 are respectively engaged with the first ribs 1021c of the first heat conducting plate 1010 and the second ribs 1034i of the adjustable heat conducting device 1030 through the latching portions 1036b.
  • the first heat conducting plate 1010 When assembled, the first heat conducting plate 1010 is disposed above the heat conducting structure 1030, the upper heat conducting arm 1020 corresponds to the space between the lower heat conducting arms 1034, and the third upper heat conducting arm is 1025 and the third lower heat conducting arm 1034c respectively slide along the second slot 1034e of the first lower heat conducting arm 1034a and the first slot 1021b of the first upper heat conducting arm 1021, so as to be latched in the first
  • the elastic member 1036 on the rib 1021c and the second rib 1034i is held by the elastic portion 1036a on the second inclined surface 1023a of the adjacent upper heat conducting arm 1020 and the fourth inclined surface 1034g of the lower heat conducting arm 1034.
  • a pressure is applied to the first heat conducting plate 1010.
  • the first heat conducting plate 1010 and the heat conducting structure 1030 have a tendency to be separated from each other in a direction perpendicular to the first heat conducting plate 1010, in a direction parallel to the first heat conducting plate 1010. Have a tendency to move closer together.
  • the upper heat conducting arm 1020 is gradually inserted into the space between the lower heat conducting arms 1034, the first limiting boss 1021a and the second limiting boss 1025b of the first heat conducting plate 1010 will be in the elastic state.
  • the elastic force of the member 1036 is respectively engaged with the fourth limiting boss 1034k and the third limiting boss 1034d of the heat conducting structure 1030, thereby completing the assembly of the heat conducting device 1000.
  • the heat conducting device 1000 provided by the embodiment provides the relative position between the first heat conducting plate 1010 and the heat conducting structure 1030 and the contact between the first heat conducting plate 1010 and the heat conducting structure 1030 through the structural elastic member 1036.
  • the surface is adjustable to realize the distance between the first heat conducting plate 1010 and the heat conducting structure 1030, and at the same time, good heat transfer characteristics can be proved, and the structure of the heat conducting device 1000 can be further cooled, thereby reducing the cost.
  • the structure of the elastic member 1036 is not limited to the manner given in the embodiment, and may be any structure that realizes the function of the elastic member 1036 based on the inventive concept, as shown in FIG.
  • the elastic member 1036 may be replaced by a zigzag or V-shaped folded elastic member 1038, and the elastic member 1038 is respectively abutted against the adjacent upper heat conducting arm 1020 by the elastic arms 1038a separated from each other.
  • the second inclined surface 1023a and the fourth inclined surface 1034g of the lower heat conducting arm 1034 are disposed to maintain a positional relationship between the first heat conducting plate 1010 and the adjustable heat conducting device 1030, and the upper heat conducting arm 1020 and the lower heat conducting arm 1034 There is always an elastic force between the contact faces for heat transfer.
  • the heat conduction device provided by the above embodiments of the present invention can be applied to various electronic products for heat dissipation. To explain the arrangement of the heat conduction device in the electronic product of the present invention, only the fifth embodiment is used.
  • a thermally conductive device 500 is provided to illustrate its application in electronic products.
  • an electronic device 1100 to which a heat conducting device 500 is applied is provided in an eleventh embodiment of the present invention.
  • the electronic device includes a circuit board 1110, a plurality of chips 1120 disposed on the circuit board 1110, and a heat dissipation cover 1130 disposed on the circuit board 1110 and housing the chip 1120 therein.
  • the heat dissipating device 1140 on the heat dissipating cover 1130 has a plurality of heat conducting devices 500 disposed between the chip 1120 and the heat dissipating cover 1130.
  • the second heat conducting plate 532 of the heat conducting structure 530 of the heat conducting device 500 is respectively fixed on the inner side of the heat dissipating cover 1130 corresponding to the chip 1120.
  • the heat conducting surface 531 of the heat conducting structure 530 is closely spaced from the heat dissipating cover 1130. fit.
  • the first heat conducting plate 510 of the heat conducting device 500 is disposed on the surface of the chip 1120 and is in close contact with the chip 1120.
  • the heat conduction structure 530 in the heat device 500 is adjusted from the main between the first heat conduction plate 510 and the heat conduction surface 531. The distance thus allows the thermally conductive device 500 to remain in good contact with the chip 1120 and the heat shield 1130 at all times, thereby achieving good heat transfer.
  • a heat dissipation boss 1150 may be disposed between the heat conduction structure 530 and the heat dissipation cover 1130.
  • the heat conducting device of the present invention and the electronic device using the heat conducting device can be used.
  • a thermally conductive filler or conductive interface material is filled between the contact faces for heat transfer.
  • the heat conduction device used in the electronic device provided by the embodiment of the invention can adjust the thickness of the heat conduction device according to different usage environments and manufacturing errors to adapt to the change of the distance between the heat source and the heat dissipation structure, thereby ensuring effective heat dissipation of the electronic product.
  • the heat conduction device provided by the embodiment of the present invention uses a high thermal conductive material for heat conduction, thereby greatly improving the efficiency of heat conduction, and at the same time, the structural unit of the heat conduction device provided by the embodiment of the present invention is easy to implement, thereby mass production. , can reduce costs and save energy.

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Description

一种导热装置及其应用的电子装置
本申请要求于 2010 年 11 月 11 日提交中国专利局、 申请号为 201010539924.0、 发明名称为 "一种导热装置及其应用的电子装置" 的中国专 利申请的优先权， 其全部内容通过引用结合在本申请中。
技术领域
本发明涉及一种导热装置， 特别涉及一种应用于电子产品中的导热装置。 背景技术
目前的电子设备中，随着功能的不断丰富，相应的功耗也随之不断的增加， 同时随之而来的电子产品的散热问题便成了制约电子设备发展的重要问题。为 了能够使电子产品所产生的热量及时的传导至散热装置中，通常会将一热传导 介质设置在电子产品中的热源与散热装置之间，以将电子产品中的热源所产生 的热量传导至散热装置中。
在实现本发明的过程中， 发明人发现现有技术至少存在以下问题： 由于制造误差的存在，所述电子产品的热源与散热装置之间的间距并非恒 定的， 而是在一定范围内变化的， 大多数现有热传导介质往往不能实现自主调 节至合适的厚度来适应热源与散热装置之间间距的变化，这样就导致热源与散 热装置之间的热阻较高， 不能实现快速的热传输。
发明内容
本发明实施例提供一种具有高导热性及可靠性的导热装置及应用该导热 装置的电子装置。
一种导热装置， 所述导热装置包括第一导热板以及导热结构。所述第一导 热板包括设置在其一表面上的上导热臂。所述导热结构与所述第一导热板的上 导热臂可滑动地抵持在一起形成一个接触面， 并通过所述接触面进行热传递。 所述导热结构包括一个导热面，所述导热结构用以保持第一导热板与所述导热 面之间的相对位置，并能够通过所述上导热臂与所述导热结构之间的相对滑动 来改变第一导热板与导热结构的导热面之间的距离，同时确保所述第一导热板 的上导热臂与所述导热结构之间始终具有可进行热传递的接触面。
一种应用上述的导热装置的电子装置， 所述电子装置包括一个电路板， 多 个设置在所述电路板上的芯片，一个设置在所述电路板上并将所述芯片收容于 其内的散热罩， 一个设置在所述散热罩上的散热装置， 多个所述的导热装置。 所述多个导热装置设置在所述芯片以及所述散热罩之间，所述导热装置的第一 导热板与所述芯片紧密贴合，所述导热装置的导热结构通过其导热面与所述散 热罩紧密抵持。
本发明实施例提供的导热装置及其应用的电子装置，能够根据不同的使用 环境及制造误差通过上导热臂及下导热臂之间的滑动来调节自身的厚度以适 应热源及散热结构之间距离的变化，从而保证对电子产品进行有效的热传导提 高散热效果。
附图说明
图 1是本发明第一实施例提供的一种导热装置的侧视图；
图 2是本发明第二实施例提供的一种导热装置的侧视图；
图 3是本发明第三实施例提供的一种导热装置的侧视图；
图 4是本发明第四实施例提供的一种导热装置的侧视图；
图 5是本发明第五实施例提供的一种导热装置的侧视图；
图 6是本发明第五实施例提供的导热装置的立体分解示意图；
图 7是本发明第六实施例提供的一种导热装置的侧视图；
图 8是本发明第七实施例提供的一种导热装置的侧视图；
图 9是本发明第七实施例提供的另一种导热装置的侧视图；
图 10是本发明第七实施例提供的第三种导热装置的侧视图；
图 11是本发明第八实施例提供的一种导热装置的侧视图；
图 12是本发明第九实施例提供的一种导热装置的侧视图；
图 13是图 12中导热装置的导热结构的立体示意图；
图 14是本发明第十实施例提供的一种导热装置的侧视图；
图 15是图 14中导热装置的导热结构的立体示意图；
图 16是本发明第十实施例提供的另一种导热装置的侧视图；
图 17是本发明第十一实施例提供的另一种电子装置的侧视图。
具体实施方式
请参阅图 1 , 本发明第一实施例提供的一种导热装置 100的侧视图， 该导 热装置 100, 包括一个第一导热板 110以及一个导热结构 130。 所述第一导热 板 110包括至少一个设置在其一侧表面上的上导热臂 120。 所述导热结构 130 所述第一导热板 110的上导热臂 120可滑动地抵持在一起形成一个接触面，并 通过所述接触面进行热传递。所述导热结构 130包括一个用以与热源或者散热 装置接触的导热面 131 , 所述导热结构 130用以保持第一导热板 110与所述导 热面 131之间的相对位置， 并能够通过所述上导热臂 120与所述导热结构 130 离，同时确保所述第一导热板 110的上导热臂 120与所述导热结构 130之间始 终具有可进行热传递的接触面。
所述第一导热板 110包括一个第一表面 112以及一个与所述第一表面 112 相对应的第二表面 114。 所述上导热臂 120形成在所述第一导热板 110的第二 表面 114上。 可以理解， 所述上导热臂 120可以是与所述第一导热板 110—体 成型，也可以是分开制造后采用焊接或者螺接等机械连接方式将其与第一导热 板 110固接在一起。所述第一导热板 110与所述上导热臂 120均采用导热性良 好的金属材料如铜、 铝等或者非金属固体材料如石墨、 氮化硼、 氮化铝等制作 而成。
所述每一个上导热臂 120包括端面 122以及垂直环绕在所述端面 122外围 的侧面 124。 由于所述端面 122与所述侧面 124垂直， 因此， 所述端面 122的 形状可以反映所述上导热臂 120的横截面的形状， 所述上导热臂 120的端面 122可以根据需求设置成任意形状， 如规则的多边形如正三角形、 正方向、 长 方形或者不规则的多边形或者圆形、 椭圆形等形状。 本实施例中， 所述上导热 臂 120的侧面 124与所述导热结构 130相抵持。
本实施例中， 所述导热结构 130包括一个第二导热板 132, 以及多组形成 二导热板 132包括一个上表面 132a以及一个与所述上表面 132a对应的下表面 132b。 本实施例中所述导热面 131与所述第二导热板 132的下表面 132b为同 一表面。 所述下导热臂 134设置在所述第二导热板 132的上表面 132a上， 并 与所述上表面 132a之间形成一定夹角， 该夹角的最佳值为 90度。 所述每组下 导热臂 134包括两个结构相同且对称设置在所述第二导热板 132的上表面 132a 上的导热簧片 134a、 134b。 为了筒洁起见， 以导热簧片 134a为例来说明导热 簧片 134a、 134b的结构。 所述每一个导热簧片 134a包括一个支撑部 134c以 及一个形成在所述支撑部 134c端部的弹性部 134d。 所述支撑部 134c包括一 个固定端 134e, 以及一个与所述固定端 134e对应的自由端 134f。 所述支撑部 134c通过其固定端 134e固接在所述第二导热板 132的上表面 132a上。所述弹 性部 134d连接在所述支撑部 134c的自由端 134f上并与所述支撑部 134c之间 形成一个夹角， 该夹角优选为锐角。所述每组下导热臂 134中的两个导热簧片 134a, 134b的所述弹性部 134d相互对正， 并间隔一定距离形成一个可容纳所 述上导热臂 120的容纳空间 136。 本实施例中， 所述下导热臂 134采用铍铜、 弹簧钢等制成。 可以理解， 本实施例中， 所述下导热臂 134 与上导热臂 120 的位置可以互换， 即， 将所述下导热臂 134设置在所述第一导热板 110的第二 表面 114上，而将所述上导热臂 120对应的设置在所述第二导热板 132的上表 面 132a上。
使用时，将所述第一导热板 110上上导热臂 120与所述导热结构 130上的 对应的一组导热簧片 134a、 134b相对应， 并使所述上导热臂 120的端面 122 抵持在导热簧片 134a、 134b的弹性部 134d上。 接着， 对所述第一导热板 110 施加一定的预压力，使所述上导热臂 120插入所述对应的下导热臂 134的容纳 空间 136内。 所述导热簧片 134a、 134b的弹性部 134d在所述预压力下向所述 支撑部 134c所在方向弹性弯折， 且弯折后的弹性部 134d与所述上导热臂 120 的侧面 124紧密抵持， 以保持导热簧片 134a、 134b与所述上导热臂 120之间 通过接触面进行有效的热传递，同时保持所述导热结构 130的导热面 131与所 述第一导热板 110之间的相对位置，当需要调整导热结构 130的导热面 131与 所述第一导热板 110之间的距离时间，只需要对所述第一导热板 110施加压力 或者释放施加在所述第一导热板 110上的压力便可通过所述导热结构 130与第 一导热板 110之间的相对滑动来实现所述导热结构 130的导热面 131与第一导 热板 110之间的距离调节，当将该导热装置 100用于电子装置中时便可补偿电 子装置在制造过程中产生的累积公差， 以达到便于安装制造的目的， 同时能够 保证热传导通道有效性， 提高电子产品使用过程中散热效果。
请参阅图 2, 本发明第二实施例提供的一种导热装置 200的侧视图。 所述 导热装置 200的结构与第一实施例中的导热装置 100中的结构类似，包括一个 第一导热板 210以及一个导热结构 230, 所述第一导热板 210包括至少一个设 置在其一侧表面上的上导热臂 220。所述导热结构 230正对所述第一导热板 210 的上导热臂 220且与所述上导热臂 220可滑动地抵持在一起，并通过所述导热 结构 230与上导热臂 220之间的接触面进行热传递。所述导热结构 230包括一 个导热面 231 , 所述导热结构 230用以保持第一导热板 210与所述导热面 231 之间的相对位置，并能够通过所述上导热臂 220与所述导热结构 230之间的相 对滑动来改变第一导热板 210与导热结构 230的导热面 231之间的距离，同时 确保所述第一导热板 210的上导热臂 220与所述导热结构 230之间始终具有可 进行热传递的接触面。本发明第二实施提供的导热装置 200与第一实施例提供 的导热装置 100之间的区别在于：
本实施例中， 所述每个上导热臂 220包括两个结构对称的弹性片 222, 其 中每个弹性片 222包括一个连接段 222a以及一个与所述连接段 222a相连接的 抵持段 222b。 所述连接段 222a通过其一端连接在所述第一导热板 210的第二 表面 214上， 并与所述第二表面 214之间形成一定夹角， 该夹角的度数以 90 度为最佳。 所述抵持段 222b连接在所述连接段 222a远萬所述第一导热板 210 的一端， 并与所述连接段 222a之间形成一定夹角， 所述夹角优选为锐角。 所 述每个上导热臂 220的两个弹性片 222对称地设置在所述第一导热板 210的第 二表面 214上， 且使所述两个弹性片 222上的抵持段 222b分别位于所述弹性 片 222的两个连接段 222a上相互背离的一侧， 从而形成一个横截面尺寸由邻 近所述第一导热板 210至远离所述第一导热板 210的方向逐渐减小的锥形。
本实施例中， 所述导热结构 230包括一个第二导热板 232, 以及多组形成 二导热板 232包括一个上表面 232a以及一个与所述上表面 232a对应的下表面 232b。 本实施例中所述导热面 231与所述第二导热板 232的下表面 232b为同 一表面。 所述下导热臂 234设置在所述第二导热板 232的上表面 232a上， 并 与所述上表面 232a之间形成一定夹角， 该夹角的最佳值为 90度。 所述每组下 导热臂 234包括两个结构相同且对称设置在所述第二导热板 232的上表面 232a 上的导热簧片 234a、 234b。 本实施例中所述导热簧片 234a、 234b为垂直设置 在所述第二导热板 232上的板簧， 所述两个导热簧片 234a、 234b之间间隔一 定距离形成一个可容纳所述上导热臂 220的容纳空间 236。 本实施例中， 所述 每个上导热臂 220及下导热臂 234均可采用铍铜、弹簧钢等弹性材料制成。可 以理解，本实施例中，所述下导热臂 234与上导热臂 220的位置可以互换，即， 将所述下导热臂 234设置在所述第一导热板 210的第二表面 214上，而将所述 上导热臂 220对应的设置在所述第二导热板 232的上表面 232a上。
使用时，将所述第一导热板 210的上导热臂 220与所述导热结构 230上对 应的一组导热簧片 234a、 234b相对应， 并使每个上导热臂 220的 4氏持段 222b 抵持在导热簧片 234a、 234b上， 对所述第一导热板 210施加一定的预压力， 使所述上导热臂 220插入所述对应的下导热臂 234的容纳空间 236内。所述上 导热臂 220上的弹性片 222以及与其相互抵持的导热簧片 234a、 234b在所述 预压力的作用下均发生一定的弹性变形，由所述弹性形变而产生的弹性回复力 使得所述上导热臂 220的抵持段 222b与导热簧片 234a、 234b之间保持紧密抵 持， 从而保持导热簧片 234a、 234b与所述弹性片 222之间可通过接触面进行 有效的热传递， 同时保持所述导热结构 230的导热面 231与所述第一导热板 210之间的相对位置， 当需要调整导热结构 230的导热面 231与所述第一导热 板 210之间的距离时，只需要对所述第一导热板 210施加压力或者释放施加在 所述第一导热板 210上的压力便可通过所述导热结构 230与第一导热板 210 之间的相对滑动来实现所述导热结构 230的导热面 231与第一导热板 210之间 的距离调节，当将该导热装置 200用于电子装置中时便可补偿电子装置在制造 过程中产生的累积公差。此外， 本实施方式中采用对应设置的弹性片 222以及 导热簧片 234a、 234b来实现位置调节以及热传递的功能， 可以使整个导热装 置 200轻量化， 结构筒单化。
请参阅图 3 , 本发明第三实施例提供的一种导热装置 300的侧视图。 所述 导热装置 300的结构与第一实施例中的导热装置 100中的结构类似，包括一个 第一导热板 310以及一个导热结构 330, 所述第一导热板 310包括至少一个设 置在其一侧表面上的上导热臂 320。所述导热结构 330正对所述第一导热板 310 的上导热臂 320且与所述上导热臂 320可滑动地抵持在一起，并通过所述导热 结构 330与上导热臂 320之间的接触面进行热传递。所述导热结构 330包括一 个导热面 331 , 所述导热结构 330用以保持第一导热板 310与所述导热面 331 之间的相对位置，并能够通过所述上导热臂 320与所述导热结构 330之间的相 对滑动来改变第一导热板 310与导热结构 330的导热面 331之间的距离，同时 进行热传递的接触面。本发明第三实施提供的导热装置 300与本发明第一实施 例提供的导热装置 100之间的区别在于：
本实施例中，在所述第一导热板 310的第一表面 312上形成有多个规则排 列的散热鳍片 316, 用以将第一导热板 310上的热量快速的扩散至周围的介质 中。
本实施例中，所述每一个上导热臂 320的端面 322与侧面 324之间形成一 个雄面 326, 所述雄面 326以一定连接角度连接在所述侧面 324及端面 322之 间， 所述连接角度优选为钝角。
本实施例中，所述导热结构 330包括至少一个相互分离的悬臂式下导热臂 334。所述多个悬臂式下导热臂 334结构相同，每个所述的悬臂式下导热臂 334 包括一个定位段 334a, 两个分别连接在所述定位段 334a相对两端的弹性段 334b,以及两个分别连接在所述弹性段 334b相对应的端部的弹性悬臂段 334c。 所述定位段 334a的底面构成了所述的导热面 331。 所述两个弹性段 334b以一 定角度连接在所述定位段 334a的相对两端。为了使所述弹性段 334b具有足够 的弹性，所述两个弹性段 334b的中部沿相对的方向弯折形成一个储能部 334d。 所述两个弹性悬臂段 334c以与所述定位段 334a大致平行的方式分别连接在所 述弹性段 334b远离所述定位段 334a的一端， 且相对设置。 可以理解， 所述两 个弹性悬臂段 334c相互对应的端部可以相互连接从而形成一个两端与所述弹 性段 334b连接的整体式结构。
使用时，将所述第一导热板 310上上导热臂 320与所述导热结构 330上的 两个弹性悬臂段 334c相对应， 并使每个上导热臂 320的端面 322抵持在所述 弹性悬臂段 334c上， 接着， 对所述第一导热板 310施加一定的预压力， 使所 述上导热臂 320插入所述对应的悬臂式下导热臂 334的两个弹性段 334b之间。 所述悬臂式下导热臂 334 的弹性悬臂段 334c在所述预压力下朝所述定位段 334a所在方向弹性变形， 此时， 形成在所述上导热臂 320上的锥面 326将与 弯折后弹性悬臂段 334c之间相互紧密抵持， 从而使上导热臂 320与所述导热 结构 330之间充分的接触，从而保证上导热臂 320与导热结构 330之间的可通 过接触面进行有效热传递， 同时，可保持所述导热结构 330的导热面 331与所 述第一导热板 310之间的相对位置，只需要对所述第一导热板 310施加压力或 者释放施加在所述第一导热板 310上的压力便可通过所述导热结构 330与所述 第一导热板 310之间的相对滑动来实现所述导热结构 330的导热面 331与第一 导热板 310之间的距离调节，当将该导热装置 300用于电子装置中时便可补偿 电子装置在制造过程中产生的累积公差。 此外， 本实施例中， 导热结构 330 中的相互分离多个的悬臂式下导热臂 334 自身具有定位段 334a, 从而允许所 述导热结构 330可同时应用于具有多个分离式热源的电子装置装中，以筒化散 热结构同时降低制造成本。
请参阅图 4, 本发明第四实施例提供的一种导热装置 400的侧视图。 所述 导热装置 400的结构与第三实施例中的导热装置 300中的结构类似，包括一个 第一导热板 410以及一个导热结构 430, 所述第一导热板 410包括两个间隔一 定距离地设置在其一侧表面上的上导热臂 420。 所述导热结构 430正对所述第 一导热板 410的上导热臂 420且与所述上导热臂 420可滑动地抵持在一起，并 通过所述导热结构 430与上导热臂 420之间的接触面进行热传递。所述导热结 构 430包括一个导热面 431 , 所述导热结构 430用以保持第一导热板 410与所 述导热面 431之间的相对位置，并能够通过所述上导热臂 420与所述导热结构 430之间的相对滑动来改变第一导热板 410与导热结构 430的导热面 431之间 的距离， 同时确保所述第一导热板 410的上导热臂 420与所述导热结构 430 之间始终具有可进行热传递的接触面。 本发明第四实施提供的导热装置 400 与本发明第三实施例提供的导热装置 300之间的区别在于：
本实施例中，所述导热结构 430包括多个相互分离的悬臂式下导热臂 434。 所述多个悬臂式下导热臂 434的结构相同，并与所述第一导热板 410上的所述 多个上导热臂 420之间的间隔区域相对应， 每个所述的悬臂式下导热臂 434 包括一个定位段 434a, 两个分别连接在所述定位段 434a相对两端的弹性段 434b，以及两个分别连接在所述弹性段 434b相对应的端部的弹性悬臂段 434c。 所述定位段 434a的底面构成了所述的导热面 431。 所述两个弹性段 434b以一 定角度连接在所述定位段 434a的相对两端。所述两个弹性悬臂段 434c沿着相 互背萬的方向分别连接在所述弹性段 434b远离所述定位段 434a的一端，且向 所述定位段 434a所在的方向偏折。
使用时，将所述第一导热板 410上上导热臂 420与所述导热结构 430的两 个相邻的悬臂式下导热臂 434的相邻的弹性悬臂段 434c相对应， 并使每个上 导热臂 420的端面 422抵持在所述弹性悬臂段 434c上， 接着， 对所述第一导 热板 410施加一定的预压力，使所述上导热臂 420插入相邻的两个悬臂式下导 热臂 434之间。 所述相邻的悬臂式下导热臂 434的弹性悬臂段 434c在所述预 压力下朝所述定位段 434a所在方向弹性变形，此时，形成在所述上导热臂 420 上的锥面 426将与弯折后弹性悬臂段 434c之间相互紧密抵持， 从而使上导热 臂 420与所述导热结构 430之间充分的接触，从而保证上导热臂 420与导热结 构 430之间的可通过接触面进行有效热传递， 同时， 可保持所述导热结构 430 的导热面 431与所述第一导热板 410之间的相对位置。本实施例中提供的导热 装置 400的调节方式与本发明第三实施例中提供的导热装置 300的调节方式相 同， 并具有与导热装置 300相同的优点。
请参阅图 5 , 本发明第五实施例提供的一种导热装置 500的侧视图， 该导 热装置 500, 包括一个第一导热板 510以及一个导热结构 530。 所述第一导热 板 510包括至少一个设置在其一侧表面上的上导热臂 520。 所述导热结构 530 正对所述第一导热板 510的上导热臂 520且与所述上导热臂 520可滑动地抵持 在一起， 并通过所述导热结构 530与上导热臂 520之间的接触面进行热传递。 所述导热结构 530包括一个导热面 531 , 所述导热结构 530用以保持第一导热 板 510与所述导热面之间的相对位置，并能够通过所述上导热臂 520与所述导 热结构 530之间的相对滑动来改变第一导热板 510与导热结构 530的导热面 531之间的距离， 同时确保所述第一导热板 510的上导热臂 520与所述导热结 构 530之间始终具有可进行热传递的接触面。
所述第一导热板 510包括一个第一表面 512以及一个与所述第一表面 512 相对应的第二表面 514。 所述第一导热板 510的第二表面 514上形成两个第一 定位柱 516, 本实施例中所述定位柱 516形成在所述第二表面 514上靠近所述 第二表面 514的边缘的位置，但并不限于上述位置， 所述定位柱 516可以设置 在所述第二表面 514上可确保所述导热装置 500正常使用的任意所需位置处。 本实施例中，包括多个间隔一定距离分布在所述第一导热板 510上的上导 热臂 520, 所述多个上导热臂 520为多个平行设置在所述第一导热板 510的第 二表面 514上的板状结构。可以理解， 所述上导热臂 520可以是与所述第一导 热板 510—体成型，也可以是分开制造后采用焊接或者螺接或者粘接等连接方 式将其与第一导热板 510 固接在一起。 所述第一导热板 510与所述上导热臂 520均采用导热性良好的金属材料如铜、 铝等或者非金属固体材料如石墨、 氮 化硼、 氮化铝等制作而成。
请一并参阅图 6, 本发明第五实施例提供的导热装置 500的分解示意图， 所述每一个上导热臂 520包括端面 522以及垂直环绕在所述端面 522外围的侧 面 524。 由于所述端面 522与所述侧面 524垂直， 因此， 所述端面 522的形状 可以代表所述上导热臂 520的横截面的形状， 所述上导热臂 520的端面 522 可以根据需求设置成任意形状， 如规则的多边形如正三角形、 正方向、 长方形 或者不规则的多边形或者圆形、 椭圆形等形状。 本实施例中， 所述上导热臂 520的侧面 524与所述导热结构 530的相抵持。 本实施例中， 所述多个上导热 孔 526以及第一滑动孔 528 ,其中所述第一螺孔 526设置在同一个上导热臂 520 上， 所述第一滑动孔 528位于另一上导热臂 520上。
本实施例中， 所述导热结构 530包括一个第二导热板 532, 多个形成在所 述第二导热板 532上的下导热臂 534, 多个弹性件 536以及多个锁定件 538。
所述第二导热板 532包括一个上表面 532a以及一个与所述上表面 532a对 应的下表面 532b。 本实施例中所述导热面 531与所述第二导热板 532的下表 面 532b为同一表面。所述第二导热板 532的上表面 532a上形成有两个第二定 位柱 532c,所述第二定位柱 532c与所述第一导热板 510上的第一定位柱 516在 空间上呈对称分布， 也即所述第一定位柱 516与第二定位柱 532c在所述第一 导热板 510的第二表面 514所在的平面内的正投影相对与所述第二表面 514 的几何中心呈对称分布状态。所述第二导热板 532呈方形，在所述第二导热板 532的对角位置处分别形成有两个凸块 532d, 在所述凸块 532d上分别开设有 两个通孔 532e用以供固定件穿过该通孔 532e将所述第二导热板 532固定在一 附着物如电子装置中的热源上或者散热壳体上。 可以理解， 所述凸块 532d也 可以设置在所述第二导热板 532的任意位置，只要呈相互对成的结构以使所述 第二导热板 532稳定的附着在附着物上即可。 第二导热板 532的上表面 532a上。 所述多个下导热臂 534中位于最外侧的两 个下导热臂 534上分别设置有与所述上导热臂 520上的第一螺孔 526及第一滑 动孔 528对应的第二滑动孔 534a及第二螺孔 534b, 其中所述第一滑动孔 528 及第二滑动孔 534a孔径大于所述第一螺孔 526及第二螺孔 534b, 且所述第一 滑动孔 528及第二滑动孔 534a沿着垂直于所述第一导热板 510方向延伸一定 距离， 从而形成具有一定行程空间的长条状开孔。
本实施例中所述弹性件 536包括多个第一限位弹性件 536a以及多个第二 限位弹性件 536b。 所述多个第一限位弹性件 536a用以套设在所述第一定位柱 516及所述第二定位柱 532c上用以保持所第一导热板 510与导热结构 530的 导热面 531之间的距离。 所述多个第二弹性件 536b用以与所述锁定件 538相 的状态。 本实施例中， 所述弹性件 536采用螺旋弹簧。
本实施例中所述锁定件 538为螺栓，用以将所述第一导热板 510及所述导 热结构 530可滑动地连接在一起。
组装置，首先将所述第一限位弹性件 536a分别套设在所述第一定位柱 516 及所述第二定位柱 532c上， 接着将第一导热板 510盖设在所述导热结构 530 的正上方， 并使所述上导热臂 520与所述下导热臂 534彼此交错排列， 其中多 个所述上导热臂 520分别位于多个所述下导热臂 534的同一侧。接着，对所述 第一导热板 510施加一定压力， 使第一限位弹性件 536a发生弹性形变， 以存 储一定的弹性势能， 通过存储在所述第一限位弹性件 526a内的弹性势能提供 弹性力从而保持所述第一导热板 510及导热结构 530之间的位置关系。同时使 所述上导热臂 520上的第一螺孔 526及第一滑动孔 528与所述下导热臂 534 上的第二滑动孔 534a及第二螺孔 534b相互对正。接着， 将套设有第二限位弹 性件 536b锁定件 538分别锁入所述第一螺孔 526及第二螺孔 534b中，并确保 所述锁定件 538穿置于所述第一滑动孔 528及第二滑动孔 534a内以保证所述 上导热臂 520与所述下导热臂 534在由所述第一滑动孔 528及第二滑动孔 534a 所限定的行程中移动， 同时对所述锁定件 538施加一定的预紧力，从而使穿置 在锁定件 538上的第二限位弹性件 536b发生一定的弹性形变以存储一定的弹 性势能， 所述第二限位弹性件 536b通过存储在其内弹性势能提供作用在所述 上导热臂 520及下导热臂 534上的作用力， 使上导热臂 520及下导热臂 534 之间始终具有相互靠近的趋势， 从而保证所述上导热臂 520 与下导热臂 534 始终保持紧密的接触以实现热传递。
本实施例提供的导热装置 500, 通过所述锁定件 538 及第一限位弹性件 536a来保持所述导热结构 530的导热面 531与所述第一导热板 510之间的相 对位置，当需要调整导热结构 530的导热面 531与所述第一导热板 510之间的 距离时间，只需要对所述第一导热板 510施加压力或者释放施加在所述第一导 热板 510上的压力，便可实现导热结构 530的与第一导热板 510之间的距离的 调节， 从而可补偿电子装置在制造过程中产生的累积公差。 此外， 本实施例中 提供的导热装置通过在所述第二导热板 532上设置与可与所述上导热臂 520 相抵持的下导热臂 534从而增加了导热结构 530与所述第一导热板 510之间可 进行热传递的接触面， 从而降低热阻， 以进一步提升散热效率。
请参阅图 7, 本发明第六实施例提供的一种导热装置 600的侧视图， 该导 热装置 600, 与第五实施例提供的导热装置 500结构类似， 包括一个第一导热 板 610以及一个导热结构 630。 所述第一导热板 610包括至少一个设置在其一 侧表面上的上导热臂 620。 所述导热结构 630正对所述第一导热板 610的上导 热臂 620且与所述上导热臂 620可滑动地抵持在一起，并通过形成在所述导热 结构 630上的下导热臂 634与上导热臂 620之间的接触面进行热传递。所述导 热结构 630包括一个导热面 631 , 所述导热结构 630用以保持第一导热板 610 与所述导热面之间的相对位置，并能够通过所述上导热臂 620与所述导热结构 630之间的相对滑动来改变第一导热板 610与导热结构 630的导热面 631之间 的距离， 同时确保所述第一导热板 610的上导热臂 620与所述导热结构 630 之间始终具有可进行热传递的接触面。 本发明第六实施例提供的导热装置 600 与本发明第五实施例提供的导热装置 500的不同在于：
本实施例中， 省略了第五实施例中导热装置 500中的第一定位柱 516、 所 述第二定位柱 532c以及套设在所述第一定位柱 516及第二定位柱 532c上的第 一限位弹性件 536a。 并在本实施例中采用一个设置在所述第一导热板 610的 第二表面 614及所述第二导热板 632的上表面 632a之间的第一弹性件 650来 保持所述第一导热板 610与所述导热结构 630的导热面 631的相对位置。本实 施例中，所述第一弹性件 650位与所述上导热臂 620与下导热臂 634共同围绕 的空间中。 本实施例中， 所述第一弹性件 650为一弹性簧片。
本发明第六实施例提供的导热装置 600 可实现与所述第五实施例提供的 导热装置 500相同的功能， 此外， 所述导热装置 600 中采用一个第一弹性件 从而极大地筒化了导热装置 600 的结构， 可以进一步的降低该导热装置 600 的制作成本。
请参阅图 8, 本发明第七实施例提供的一种导热装置 700的侧视图， 该导 热装置 700与第六实施例提供的导热装置 600结构类似，包括一个第一导热板 710以及一个导热结构 730。 所述第一导热板 710包括至少一个设置在其一侧 表面上的上导热臂 720。 所述导热结构 730正对所述第一导热板 710的上导热 臂 720且与所述上导热臂 720可滑动地抵持在一起， 并通过所述导热结构 730 与上导热臂 720之间的接触面进行热传递。所述导热结构 730包括一个导热面 731 , 所述导热结构 730用以保持第一导热板 710与所述导热面之间的相对位 置，并能够通过所述上导热臂 720与所述导热结构 730之间的相对滑动来改变 第一导热板 710与导热结构 730的导热面 731之间的距离，同时确保所述第一 接触面。本发明第七实施例提供的导热装置 700与第六实施例提供的导热装置 600的不同在于：
本实施例中， 进一步省略了第六实施例中导热装置 600 中的锁定件 638 以及第二限位弹性件 636b。 并在本实施例中采用两个设置在所述第二导热板 732的上表面 732a上的第二弹性件 770,所述第二弹性件 770邻近所述下导热 臂 734并抵持在所述第一导热板 710上，使所述第一导热板 710上的上导热臂 720与所述导热结构 730中的下导热臂 734紧密抵持， 从而保证所述第一导热 板 710与导热结构 730之间始终具有可进行热传递的接触面，为了使接触面之 间接触的更加充分，可在所述第一导热板 710与导热结构 730的接触面之间填 充一定的导热填充剂如导热硅胶等。本实施例中所述第二弹性件 770为一弹性 簧片， 但并不局限于弹性簧片。
本发明第七实施例提供的导热装置 700 可实现与所述第六实施例提供的 导热装置 600相同的功能， 此外， 所述导热装置 700中采用两个第二弹性件 770来保持所述上导热臂 720与下导热臂 734之间的紧密抵持， 不仅可以实现 置 700的结构， 并进一步的降低该导热装置 700的制作成本。
可以理解， 本是实施例中的第一弹性件 750也可以具有其他的替代方案， 请参阅图 9, 所述第一弹性件 750可由两个设置在所述第一导热板 710及第二 导热板 732之间的弹性件 780所替代， 该实施例中，所述弹性件 780分别对称 于该区域内。该实施例中所述弹性件 780为一金属螺旋弹簧，但并不限于金属 螺旋弹簧，所述弹性件 780还可以由弹性橡胶等其他具有弹性的装置或者元件 来替代。
可以理解， 如图 10所示， 若将本实施例中的导热装置 700中的第一导热 板 710与导热结构 730中的第二导热板 732通过螺接、铆接、粘接等连接方式 可靠的连接在以电子装置的热源 20及一个与该热源 20对应的散热装置或者壳 体 40上， 那么该导热装置 700中的第一弹性件 750或者弹性件 780均可以省 去， 如此， 可进一步的筒化导热装置 700的结构。
请参阅图 11 , 本发明第八实施例提供的一种导热装置 800的侧视图， 该 导热装置 800与本发明第七实施例提供的导热装置 700结构类似，包括一个第 一导热板 810以及一个导热结构 830。 所述第一导热板 810包括至少一个设置 在其一侧表面上的上导热臂 820。 所述导热结构 830正对所述第一导热板 810 的上导热臂 820且与所述上导热臂 820可滑动地抵持在一起，并通过所述导热 结构 830与上导热臂 820之间的接触面进行热传递。所述导热结构 830包括一 个导热面 831 , 所述导热结构 830用以保持第一导热板 810与所述导热面 831 之间的相对位置，并能够通过所述上导热臂 820与所述导热结构 830之间的相 对滑动来改变第一导热板 810与导热结构 830的导热面 831之间的距离，同时 进行热传递的接触面。本发明第八实施例提供的导热装置 800与第七实施例提 供的导热装置 700的不同在于：
本发明第八实施例提供的一种导热装置 800 中将第七实施例提的导热装 置 700中的第一弹性件 750及第二弹性件 770通过多个一体式的弹性件 850 所替代，所述弹性件 850既可保持所述第一导热板 810与导热结构 830之间的 位置关系，同时也可以保持所述上导热臂 820与下导热臂 834之间的紧密抵持 从而在所述第一导热板 810与导热结构 830之间实现有效的热传递。所述每一 个弹性件 850 包括一个定位段 852, —个连接在所述定位段 852上的支撑段 854, 以及一个连接在所述支撑段 854端部的弹性段 856。 所述定位段 852固 设在所述第二导热板 832的上表面 832a上。 所述支撑段 854以大致垂直的方 式连接在所述定位段 852的一端，所述支撑段 854与所述定位段 852之间的夹 角允许有一定的正负余量。所述弹性段 856连接在所述支撑段 854远离所述支 撑段 854的一端， 并朝所述第二导热板 832所在的方向倾斜。对应于所述倾斜 的弹性段 856, 所述上导热臂 820的侧面 824上设置有一个斜面 826。 所述上 导热臂 820的斜面 826抵持在一个与其对应的弹性件 850的弹性段 856上。所 述弹性段 856施加一弹性力于所述上导热臂 820的斜面 826上，该弹性力可以 分解为垂直于所述上导热臂 820的侧面 824的推力以保持所述上导热臂 820 与下导热臂 834之间的紧密抵持， 以及垂直于所述上导热臂 820的端面 822 的推力以保持所述第一导热板 810与导热结构 830之间的位置关系， 因此， 本 实施例中提供的导热装置 800可通过独立的弹性件 850来提供保持第一导热板 810与导热结构 830之间的位置关系及所述上导热臂 820与下导热臂 834之间 的紧密抵持所需的力， 从而筒化所述导热装置 800的结构。 此外， 所述弹性件 850与第二导热板 832与上导热臂 820之间通过大面积的接触， 同样可以实现 热量的传递，从而可以提高第一导热板 810与导热结构 830之间的热传导效率。 此外，为了防止所述上导热臂 820在所述弹性件 850的弹性力下脱离所述弹性 件 850, 在所述斜面 826与所述上导热臂 820的端面 822通过一个平行于所述 侧面 824的过渡面 828连接，并在所述过渡面 828邻近所述端面 822的位置处 设置有一个突出于所述过渡面 828的挡块 823。所述挡块 823与所述弹性件 850 的弹性段 856的端部相互抵持，从而防止上导热臂 820与所述弹性件 850之间 发生脱离的现象。
请参阅图 12, 本发明第九实施例提供的一种导热装置 900的侧视图， 该 导热装置 900, 包括一个第一导热板 910以及一个导热结构 930。 所述第一导 热板 910包括至少一个设置在其一侧表面上的上导热臂 920。所述导热结构 930 正对所述第一导热板 910的上导热臂 920且与所述上导热臂 920可滑动地抵持 在一起， 并通过所述导热结构 930与上导热臂 920之间的接触面进行热传递。 所述导热结构 930包括一个导热面 931 , 所述导热结构 930用以保持第一导热 板 910与所述导热面之间的相对位置，并能够通过所述上导热臂 920与所述导 热结构 930之间的相对滑动来改变第一导热板 910与导热结构 930的导热面 931之间的距离， 同时确保所述第一导热板 910的上导热臂 920与所述导热结 构 930之间始终具有可进行热传递的接触面。
所述第一导热板 910包括一个第一表面 912以及一个与所述第一表面 912 相对应的第二表面 914。
本实施例中， 包括多个上导热臂 920, 所述多个上导热臂 920包括一个第 一上导热臂 921 , 两个第二上导热臂 923以及一个第三上导热臂 925。 所述第 一上导热臂 921、 第二上导热臂 923以及第三上导热臂 925依次设置在所述第 一导热板 910的第二表面 914上。所述第一上导热臂 921的邻近所述第一导热 板 910边缘的侧面 924上凸设一个凸出于所述侧面 924且与所述第一上导热臂 921的端面 922平齐的第一限位凸台 921a, 该第一限位凸台 921a用以与导热
930之间的位置。 所述第一上导热臂 921 的端面 922上开设有一个第一开槽 921b用以设置所述导热结构 930 中的限位装置。 所述两个第二上导热臂 923 间隔一定距离设置在所述第一上导热臂 921 的一侧。 所述第三上导热臂 925 设置在所述第二上导热臂 923远离所述第一上导热臂 921的一侧的第一导热板 910上。 所述第三上导热臂 925正对所述第一上导热臂 931的侧面 924上开设 有一个邻近所述第一导热板 910的第二表面 914的第二开槽 925a, 在所述第 二开槽 925a的远离所述第一导热板 910的一端形成一个第二限位凸台 925b, 所述第二限位凸台 925b用以与导热结构 930上对应的限位结构相互配合从而 限制所述第一导热板 910与导热结构 930之间的位置。 请参阅图 13 , 本发明第九实施例提供的导热结构 930的立体示意图。 所述导热结构 930包括一个第二导热板 932, 多个形成在所述第二导热板 932上的下导热臂 934, 多个弹性件 936以及多个锁定件 938。
述第二导热板 932包括一个上表面 932a以及一个与所述上表面 932a对应 的下表面 932b。 本实施例中所述导热面 931与所述第二导热板 932的下表面 932b为同一表面。 所述第二导热板 932呈方形， 在所述第二导热板 932的对 角位置处分别形成有两个凸块 932d, 在所述凸块 932d上分别开设有两个通孔 932e用以供固定件穿过该通孔 932e将所述第二导热板 932固定在一附着物如 电子装置中的热源上或者散热壳体上。
本实施例中的下导热臂 934与所述上导热臂 920的结构及布置方式相同， 所述多个下导热臂 934包括一个第一下导热臂 934a, 两个第二下导热臂 934b 以及一个第三下导热臂 934c。 所述第一下导热臂 934a, 第二下导热臂 934b以 及第三下导热臂 934c依次设置在所述第二导热板 932的上表面 932a上。所述 第一下导热臂 934a邻近所述第二导热板 932边缘的一侧表面上凸设一个与第 三上导热臂 925上的第二限位凸台 925b对应且可与其相互扣合的第三限位凸 台 934d, 并在所述第一下导热臂 934a上邻近所述第三限位凸台 934d的位置 处开设有一个第三开槽 934e。 所述第二下导热臂 934b间隔一定距离设置在所 述第一下导热臂 934a的一侧的第二导热板 932上。所述第三下导热臂 934c设 置在所述第二下导热臂 934b远离所述第一下导热臂 934a—侧的第二导热板 932上， 所述第三下导热臂 934c上对应所述第一上导热臂 921上的第一限位 凸台 921a形成有一个第四开槽 934f,在所述第四开槽 934f远离所述第二导热 板 932的上表面 932a的一端形成一个可与所述第一限位凸块 921a相互扣合的 第四限位凸块 93 。
所述多个弹性件 936分别设置在所述第一开槽 921b及第三开槽 934e内。 所述弹性件 936包括一个固定部 936a, 两个对称形成在所述固定部 936a相对 两侧的第一弹性臂 936b, 以及设置在所述固定部 936a上位于所述两个第一弹 性臂 936b之间的侧边上的第二弹性臂 936c。 所述两个第一弹性臂 936b朝垂 直于所述固定部 936a的一侧弯折一定的角度， 该弯折的角度以使弯折后的第 一弹性臂 936b在所述第二限位凸台 925b与第三限位凸台 934d以及第一限位 凸块 921a第四限位凸块 934g相互扣合时能抵持在所述第一导热板 910及第二 导热板 932上为最佳。所述第二弹性臂 936c朝与所述第一弹性臂 936b弯折方 向相反的方向弯折一定角度， 所述弯折的角度以使所述第二弹性臂 936c在所 述第一导热板 910与所述导热结构 930相互配合时能够抵持在邻近的上导热臂 920或者下导热臂 934上为最佳。
组装置， 首先将所述弹性件 936的固定部 936a通过所述锁定件 938分别 固定在所述第一开槽 921b及第三开槽 934e内的底侧。接着， 压缩所述弹性件 936的第一弹性件 936b及第二弹性件 936c, 将所述第一导热板 910的第一限 位凸台 921a及第二开槽 925a与导热结构 930的第四开槽 934f及第三限位凸 台 934d相对正，并将所述第一限位凸台 921a由所述导热结构 930的一侧滑入 所述第四开槽第四开槽 934f 中， 并使第三限位凸台 934d滑入第二开槽 925a 中，使得第一导热板 910的第一限位凸台 921a及第二限位凸台 925b分别与导 热结构 930的第四限位凸台 934g及第三限位凸台 934d相互扣合。 最后，释放 所述第一弹性件 936b及第二弹性件 936c, 使所述第一弹性件 936b分别抵持 在与其相对应的第一导热板 910或者第二导热板 932上从而保持所述第一导热 板 910与导热结构 930之间的相对位置， 同时使所述第二弹性件 936c分别抵 持在与其邻近的第二上导热臂 920或者第二下导热臂 934上从而提供弹性力使 所述多个上导热臂 920与下导热臂 932紧密抵持，以保证导热臂 920与下导热 臂 934之间始终具有一可进行热传递的接触面。上述导热装置 900的组装方式 仅仅是介绍本是实施例如合组装的一种方式， 其还可以采用其他的组装方式， 如直接将第一导热板 910设置在所述导热结构 930的上方，并使所述上导热臂 920与所述下导热臂 934之间的空间相对应， 接着对所述第一导热板 910施加 压力， 在所述压力下， 所述弹性件 936的第一弹性件 936b及第二弹性件 936c 将发生弹性形变，随着所述上导热臂 920逐渐插入所述下导热臂 934之间的空 间中， 所述第二弹性件 936c将抵持在与其邻近的第二上导热臂 920或者第二 下导热臂 934上并发生弹性形变，在所述第二弹性件 936c的弹性力的作用下， 所述第一导热板 910与所述可调导热结构 930之间具有相对运动的趋势，在该 运动趋势下，使所述第一导热板 910的第一限位凸台 921a及第二限位凸台 925b 分别与导热结构 930的第四限位凸台 934g及第三限位凸台 934d相互扣合，从 而完成该导热装置 900的组装。
本实施例提供的导热装置 900, 通过一体式的弹性件 936来保持所述第一 导热板 910与导热结构 930之间的相对位置以及第一导热板 910与导热结构 930之间始终具有可进行热传递的的接触面， 以实现第一导热板 910与所述导 热结构 930之间的距离可调， 同时可证良好的热传递特性。 此外， 采用一体式 的弹性件 936可筒化导热装置 900的结构， 从而降低成本。
请参阅图 14, 本发明第十实施例提供的一种导热装置 1000的侧视图， 该 导热装置 1000, 包括一个第一导热板 1010以及一个导热结构 1030。所述第一 导热板 1010包括至少一个设置在其一侧表面上的上导热臂 1020。 所述导热结 构 1030正对所述第一导热板 1010的上导热臂 1020且与所述上导热臂 1020 可滑动地抵持在一起，并通过所述导热结构 1030与上导热臂 1020之间的接触 面进行热传递。所述导热结构 1030包括一个导热面 1031 , 所述导热结构 1030 用以保持第一导热板 1010与所述导热面之间的相对位置， 并能够通过所述上 导热臂 320与所述导热结构 330之间的相对滑动来改变第一导热板 1010与导 热结构 1030的导热面 1031之间的距离， 同时确保所述第一导热板 1010的上 导热臂 1020与所述导热结构 1030之间始终具有可进行热传递的接触面。
所述第一导热板 1010 包括一个第一表面 1012 以及一个与所述第一表面 1012相对应的第二表面 1014。
本实施例中， 包括多个上导热臂， 所述多个上导热臂 1020包括一个第一 上导热臂 1021 , 两个第二上导热臂 1023以及一个第三上导热臂 1025。所述第 一上导热臂 1021、 第二上导热臂 1023 以及第三上导热臂 1025依次设置在所 述第一导热板 1010的第二表面 1014上。 所述第一上导热臂 1021邻近所述第 一导热板 1010边缘的侧面 1024上凸设一个凸出于所述侧面 1024且与所述第 一上导热臂 1021 的端面 1022平齐的第一限位凸台 1021a, 该第一限位凸台 1021a用以与所述导热结构 1030上对应的限位结构相互配合从而限制所述第 一导热板 1010与导热结构 1030之间的位置。所述第一限位凸台 1021a上沿垂 直于所述第一导热板 1010的方向开设有一个第一凹槽 1021b, 所述第一凹槽 1021b的深度小于所述第一限位凸台 1021a的相对于该第一限位凸台 1021a所 在的侧面 1024的高度。 所述第一凹槽 1021b 用以在将所述第一导热板 1010 与导热结构 1030 组装过程中起到导向以及限位的作用。 所述第一上导热臂 1021对应于形成有所述第一凹槽 1021b所在一侧的另一侧的侧面 1024形成一 个第一斜面 1024a, 在所述第一上导热臂 1021的第一斜面 1024a的中间位置 处形成有一个沿平行于所述第一上导热臂 1021的端面 1022较长一侧的延伸方 向贯穿所述第一斜面 1024a的第一凸条 1021c。 所述两个第二上导热臂 1023 间隔一定距离设置在所述第一上导热臂 1021—侧的第一导热板 1010上，在所 述每一个第二上导热臂 1023上形成有一个平行于第一斜面 1024a的第二斜面 1023a。 所述第三上导热臂 1025设置在所述第二上导热臂 1023远离所述第一 上导热臂 1021—侧的第一导热板 1010上。 所述第三上导热臂 1025正对所述 第一上导热臂 1031的斜面 1024a的一侧表面上开设有一个邻近所述第一导热 板 1010的第二表面 1014的第一开槽 1025a, 在所述第一开槽 1025a的远离所 述第一导热板 1010 的一端形成一个第二限位凸台 1025b , 该第二限位凸台 1025b用以与导热结构 1030上对应的限位结构相互配合从而保持所述第一导 热板 1010与导热结构 1030之间的位置。
请参阅图 15 , 本发明第十实施例提供的导热结构 1030的立体示意图。 所述导热结构 1030包括一个第二导热板 1032, 多个形成在所述第二导热 板 1032上的下导热臂 1034以及多个弹性件 1036。
述第二导热板 1032包括一个上表面 1032a以及一个与所述上表面 1032a 对应的下表面 1032b。 本实施例中所述导热面 1031与所述第二导热板 1032的 下表面 1032b为同一表面。 所述第二导热板 1032呈方形， 在所述第二导热板 1032的对角位置处分别形成有两个凸块 1032d,在所述凸块 1032d上分别开设 有两个通孔 1032e用以供固定件穿过该通孔 1032e将所述第二导热板 1032固 定在一附着物如电子装置中的热源上或者散热壳体上。
本实施例中的下导热臂 1034与所述上导热臂 1020的结构及布置方式相 同， 所述多个下导热臂 1034 包括一个第一下导热臂 1034a, 两个第二下导热 臂 1034b以及一个第三下导热臂 1034c。 所述第一下导热臂 1034a, 第二下导 热臂 1034b以及第三下导热臂 1034c依次设置在所述第二导热板 1032的上表 面 1032a上。 所述第一下导热臂 1034a邻近所述第二导热板 1032边缘的一侧 表面上凸设一个与第三上导热臂 1025上的第二限位凸台 1025b对应且可与其 相互扣合的第三限位凸台 1034d。 在所述第三限位凸台 1034d对应于所述第二 导热板 1032边缘的一侧开设有一个第二凹槽 1034e, 该第二凹槽 1034e的宽 度大于所述第一导热板 1010上的第三上导热臂 1025的长度以容纳所述第三上 导热臂 1025。 所述第一下导热臂 1034a对应于所述第二凹槽 1034e所在一侧 的另一侧形成有一个第三斜面 1034h, 在所述第三斜面 1034h上形成有一个沿 着所述第一下导热臂 1034a与所述第二导热板 1032之间较长的交线的方向贯 穿所述第三斜面 1034h的第二凸条 1034i。 所述第二下导热臂 1034b间隔一定 距离设置在所述第一下导热臂 1034a—侧的第二导热板 1032上， 其中， 每一 第二下导热臂 1034b 上形成有一个平行于所述第三斜面 1034h 的第四斜面 1034g。 所述第三下导热臂 1034c设置在所述第二下导热臂 1034b远离所述第 一下导热臂 1034a—侧的第二导热板 1032上， 所述第三下导热臂 1034c上对 应所述第一上导热臂 1021 上的第一限位凸台 1021a 形成有一个第二开槽 1034f, 在所述第二开槽 1034f远离所述第二导热板 1032的上表面 1032a的一 端形成一个可与所述第一限位凸块 1021a相互扣合的第四限位凸块 1034k。
本实施例中所述弹性件 1036为卡簧，其中每一弹性件 1036包括一个隆起 的弹性部 1036a, 以及由所述弹性部 1036a两端向外延伸并沿相对方向弯曲而 成的卡扣部 1036b, 所述两个卡扣部 1036b的端部之间间隔一定距离。 所述多 个弹性件 1036通过所述卡扣部 1036b分别卡合所述第一导热板 1010的第一凸 条 1021c及可调导热装置 1030的第二凸条 1034i上。
组装时，接将第一导热板 1010设置在所述导热结构 1030的上方， 所述上 导热臂 1020与所述下导热臂 1034之间的空间相对应，并使所述的第三上导热 臂 1025及第三下导热臂 1034c分别沿着所述第一下导热臂 1034a的第二开槽 1034e及第一上导热臂 1021的第一开槽 1021b相对滑动， 从而使卡置在所述 第一凸条 1021c及第二凸条 1034i上的弹性件 1036通过其弹性部 1036a抵持 在相邻的上导热臂 1020的第二斜面 1023a及下导热臂 1034的第四斜面 1034g 上。接着，对所述第一导热板 1010施加压力，在所述压力下，所述弹性件 1036 的弹性部 1036a将发生弹性形变，所述弹性部 1036a由于弹性形变而产生的弹 性力将会使所述第一导热板 1010及导热结构 1030在垂直于所述第一导热板 1010的方向内具有相互分离的趋势， 在平行于所述第一导热板 1010的方向内 具有相互靠拢的趋势。 随着所述上导热臂 1020逐渐插入所述下导热臂 1034 之间的空间中， 所述第一导热板 1010的第一限位凸台 1021a及第二限位凸台 1025b将在所述弹性件 1036的弹性力的作用下分别与导热结构 1030的第四限 位凸台 1034k及第三限位凸台 1034d相互扣合后，从而完成了该导热装置 1000 的组装。
本实施例提供的导热装置 1000, 通过结构筒单的弹性件 1036来提供保持 所述第一导热板 1010与导热结构 1030之间的相对位置以及第一导热板 1010 与导热结构 1030之间的接触面以实现第一导热板 1010与所述导热结构 1030 之间的距离可调， 同时可证良好的热传递特性， 并且可进一步的筒化导热装置 1000的结构， 从而降低成本。
可以理解， 所述弹性件 1036的结构并不局限于本实施方式中所给出的方 式， 其可以是基于该发明思想的任何实现所述弹性件 1036功能的结构， 如图 16所示的另一实施例中，所述弹性件 1036可以由 Z字形或者 V字形的折叠式 弹性件 1038所替代，所述弹性件 1038通过其相互分离的弹性臂 1038a分别抵 持在相邻的上导热臂 1020 的第二斜面 1023a及下导热臂 1034 的第四斜面 1034g上， 从而提供保持所述第一导热板 1010及可调导热装置 1030之间位置 关系，及上导热臂 1020与所述下导热臂 1034之间始终具有可进行热传递的接 触面的弹性力。
上述本发明多个实施例所提供的导热装置均可应用于各种电子产品中进 行散热， 为了说明本发明中的导热装置在电子产品中的布置方式，在此仅以第 五实施例中所提供的导热装置 500来说明其在电子产品中的应用方式。
请参阅图 17, 本发明第十一实施例所提供的一种应用导热装置 500的电 子装置 1100。
所述电子装置包括一个电路板 1110, 多个设置在所述电路板 1110上的芯 片 1120,—个设置在所述电路板 1110上并将所述芯片 1120收容于其内的散热 罩 1130, —个所述散热罩 1130上的散热装置 1140, —个多个设置在所述芯片 1120以及所述散热罩 1130之间的导热装置 500。 所述导热装置 500的导热结 构 530的第二导热板 532分别对应所述芯片 1120固设在所述散热罩 1130的内 侧， 所述导热结构 530的导热面 531与所述散热罩 1130之间紧密贴合。 所述 导热装置 500的第一导热板 510设置在所述芯片 1120的表面， 并与所述芯片 1120之间紧密贴合。 当所述多个芯片 1120与所述散热罩 1130之间的距离不 一致时，通过所述到热装置 500中的导热结构 530来自主的调节所述第一导热 板 510与导热面 531之间的距离从而可以使所述导热装置 500始终保持与芯片 1120及散热罩 1130之间的良好接触， 从而实现良好的热传递。 为了使导热结 构 530与散热罩 1130之间的接触更加的充分， 热传递效果更好， 可以在所述 的导热结构 530与散热罩 1130之间设置一个散热凸台 1150。
此外，可以理解为了使本发明上述实施例中所提供的导热装置以及使用所 述导热装置的电子装置能够具有良好的导热特性，可以在本发明的导热装置以 及使用所述导热装置的电子装置中的进行热传递的接触面之间填充导热填充 物或导电界面材料。
本发明实施例提供的电子装置中采用的导热装置能够根据不同的使用环 境及制造误差来调节导热装置自身的厚度从而适应热源及散热结构之间距离 的变化， 从而保证对电子产品进行有效的散热， 此外， 本发明实施例提供的导 热装置中采用高导热材料进行导热， 从而能极大的提高导热的效率， 同时， 本 发明实施例提供的导热装置的结构筒单易于实现，从而规模化生产， 能降低成 本， 节约能源。
以上所述仅为本发明的较佳实施例， 并不用以限制本发明， 凡在本发明的 精神和原则之内， 所作的任何修改、 等同替换、 改进等， 均应包含在本发明的 保护范围之内。

Claims

权 利 要 求
1、 一种导热装置， 其特征在于，
所述导热装置包括第一导热板以及导热结构，所述第一导热板包括设置在 其表面上的上导热臂，所述导热结构与所述第一导热板的上导热臂可滑动地抵 持在一起形成一个接触面， 并通过所述接触面进行热传递， 所述导热结构包括 一个导热面， 所述导热结构用以保持第一导热板与所述导热面之间的相对位 置，并能够通过所述上导热臂与所述导热结构之间的相对滑动来改变第一导热 板与导热结构的导热面之间的距离，同时所述第一导热板的上导热臂与所述导 热结构之间始终具有可进行热传递的接触面。
2、 如权利要求 1所述的导热装置， 其特征在于，
所述导热结构包括至少一个下导热臂，所述导热结构通过所述下导热臂与 所述第一导热板的上导热臂可滑动地抵持在一起，所述上导热臂与下导热臂之 间可相对滑动。
3、 如权利要求 2所述的导热装置， 其特征在于，
所述上导热臂由弹性材料制成。
4、 如权利要求 2或 3所述的导热装置， 其特征在于，
所述下导热臂由弹性材料制成。
5、 如权利要求 2所述的导热装置， 其特征在于，
所述导热结构还包括一个第二导热板，所述第二导热板包括一个上表面以 及一个与所述上表面对应的下表面， 所述导热面位于所述下表面上， 所述下导 热臂设置在所述第二导热板的上表面上。
6、 如权利要求 5所述的导热装置， 其特征在于，
所述至少一个下导热臂包括两个结构相同且对称设置在所述第二导热板 的上表面的导热簧片，每一个导热簧片包括一个支撑部以及一个形成在所述支 撑部端部的弹性部， 所述导热簧片的弹性部 4氏持在所述上导热臂的侧面。
7、 如权利要求 2所述的导热装置， 其特征在于，
所述至少一个上导热臂包括两个结构对称的弹性片，其中每个所述的弹性 片包括一个连接段以及一个与所述连接段相连接的抵持段，所述上导热臂通过 所述抵持段抵持在所述下导热臂上。
8、 如权利要求 7所述的导热装置， 其特征在于，
所述至少一个上导热臂的两个弹性片对称地设置在所述第一导热板上，且 使所述两个弹性片上的抵持段分别位于所述弹性片的两个连接段上相互背离 的一侧。
9、 如权利要求 8所述的导热装置， 其特征在于，
所述的至少一个上导热臂的两个弹性的抵持段形成一个横截面尺寸由邻 近所述第一导热板至远离所述第一导热板的方向逐渐减小的锥形。
10、 如权利要求 9所述的导热装置， 其特征在于，
所述导热结构还包括第二导热板，所述下导热臂设置在所述第二导热板上 并与第二导热板之间形成一定夹角，所述下导热臂包括两个结构相同且对称设 置在所述第二导热板上的导热簧片，所述下导热臂的通过所述导热簧片与所述 上导热臂的抵持段相互抵持。
11、 如权利要求 2所述的导热装置， 其特征在于，
所述下导热臂包括一个定位段、两个分别连接在所述定位段相对两端的弹 性段、 以及两个分别连接在所述弹性段相对应的端部的弹性悬臂段；
所述定位段的底面构成了所述的导热面，所述上导热臂抵持在所述下导热 臂的弹性悬臂段上。
12、 如权利要求 11所述的导热装置， 其特征在于，
所述下导热臂的两个弹性段连接在所述定位段的相对两端，并在所述两个 弹性段的中部沿相对的方向弯折形成一个储能部，所述下导热臂的两个弹性悬 臂段以与所述定位段相平行的方式分别连接在所述弹性段远离所述定位段的 一端， 且相对设置。
13、 如权利要求 12所述的导热装置， 其特征在于，
所述上导热臂包括一个端面以及一个垂直环绕所述端面的侧面，在所述上 导热臂的端面与侧面之间形成一个锥面，所述上导热臂通过其锥面与所述下导 热臂的两个弹性悬臂相互抵持。
14、 如权利要求 2所述的导热装置， 其特征在于，
设置在所述导热装置的第一导热板上的上导热臂为两个，两个上导热臂间 隔设置，所述下导热臂对应于所述第一导热板上的两个上导热臂之间的间隔区 域， 所述下导热臂包括一个定位段， 两个分别连接在所述定位段相对两端的弹 性段， 以及两个分别连接在所述弹性段相对应的端部的弹性悬臂段， 所述定位 段的底面构成了所述的导热面，所述两个上导热臂分别与所述下导热臂的弹性 悬臂段相互抵持。
15、 如权利要求 14所述的导热装置， 其特征在于，
所述下导热臂的两个弹性段连接在所述定位段的相对两端，所述两个弹性 悬臂段沿着相互背萬的方向分别连接在所述弹性段远离所述定位段的一端，且 向所述定位段所在的方向偏折。
16、 如权利要求 2所述的导热装置， 其特征在于，
所述导热结构还包括第二导热板以及弹性件；
所述下导热臂设置在所述第二导热板上，所述导热面形成在所述第二导热 板上 ,所述弹性件设置在所述导热结构上或第一导热板上并抵持在与所述下导
17、 如权利要求 16所述的导热装置， 其特征在于，
所述弹性件包括第一弹性件以及第二弹性件；
所述第一弹性件设置在所述第一导热板及第二导热板之间以保持所述第 一导热板与所述第二导热板的导热面之间的距离，所述第二弹性件设置在所述 第二导热板上邻近所述下导热臂的位置处并抵持在所述上导热臂，使所述第一 导热板的上导热臂与所述导热结构中的下导热臂紧密抵持。
18、 如权利要求 17所述的导热装置， 其特征在于，
所述第一导热板包括一个第一表面以及一个与所述第一表面相对应的第 二表面；
所述上导热臂设置在所述第一导热板的第二表面上，所述第一导热板的第 二表面上还形成第一定位柱，用于保持第一导热板与所述第二导热板之间间距 的弹性件套设在所述第一定位柱上。
19、 如权利要求 18所述的导热装置， 其特征在于，
所述第二导热板包括一个上表面以及一个与所述上表面对应的下表面，所 述导热面与所述第二导热板的下表面为同一表面，所述下导热臂设置在所述第 二导热板的上表面， 所述第二导热板的上表面上形成有第二定位柱， 所述第二 定位柱与所述第一定位柱在空间上呈对称分布，用以保持第一导热板与所述第 二导热板之间间距的弹性件分别套设在所述第一定位柱及所述第二定位柱上。
20、 如权利要求 19所述的导热装置， 其特征在于，
设置在所述导热装置的第一导热板上的上导热臂为多个，多个上导热臂为 多个间隔且平行地设置在所述第一导热板的第二表面上的板状结构，所述第二 导热板上的下导热臂为多个，所述多个下导热臂以与所述上导热臂相同的排列 方式设置在所述第二导热板的上表面上的下导热臂，所述上导热臂与所述下导 热臂彼此交错排列并相互抵持。
21、 如权利要求 20所述的导热装置， 其特征在于，
所述多个上导热臂中位于最外侧的两个上导热臂上分别开设有相互对应 的多个第一螺孔以及第一滑动孔， 其中， 所述多个第一螺孔设置在同一个上导 热臂上， 所述第一滑动孔设置在另一上导热臂上， 所述多个下导热臂中位于最 外侧的两个下导热臂上分别设置有与所述上导热臂上的第一螺孔及第一滑动 孔对应的第二滑动孔及第二螺孔， 所述导热结构还包括多个锁定件， 用以保持 上导热臂与下导热臂紧密抵持的弹性件套设在所述锁定件上，所述锁定件连同 套设在其上的弹性件分别锁入所述第一螺孔及第二螺孔中并对应地穿置在所 述第二滑动孔及第一滑动孔内。
22、 如权利要求 21所述的导热装置， 其特征在于，
其中所述第一滑动孔及第二滑动孔孔径大于所述第一螺孔及第二螺孔，且 所述第一滑动孔及第二滑动孔为长条状开孔。
23、 如权利要求 16所述的导热装置， 其特征在于，
所述弹性件包括一个定位段、一个连接在所述定位段上的支撑段、 以及一 个连接在所述支撑段端部的弹性段；
所述弹性件通过定位段固设在所述第二导热板上 ,所述弹性件的弹性段抵 持在所述上导热臂上。
24、 如权利要求 23所述的导热装置， 其特征在于，
所述弹性件的支撑段以垂直的方式连接在所述定位段的一端，所述弹性段 连接在所述支撑段远离所述定位段的一端并朝所述第二导热板所在的方向倾 斜。
25、 如权利要求 24所述的导热装置， 其特征在于，
所述上导热臂上形成有一个斜面，所述斜面抵持在与所述上导热臂对应的 弹性件的弹性段上。
26、 如权利要求 25所述的导热装置， 其特征在于，
所述斜面与所述上导热臂的端面之间具有一个过渡面，所述过渡面邻近所 述上导热臂的端面的位置处设置有一个突出于所述过渡面的挡块，所述挡块与 所述弹性件的弹性段的端部相互 4氐持。
27、 如权利要求 16所述的导热装置， 其特征在于，
所述上导热臂及下导热臂上分别设置有可以相互卡合的限位结构以限制 所述第一导热板与导热面之间的相对位置。
28、 如权利要求 27所述的导热装置， 其特征在于， 设置在所述上导热臂及下导热臂的开槽中。
29、 如权利要求 28所述的导热装置， 其特征在于，
所述弹性件包括一个固定部、两个对称形成在所述固定部相对两侧的第一 弹性臂、以及设置在所述固定部上位于所述两个第一弹性臂之间的侧边上的第 二弹性臂；
所述弹性件通过固定部固设在所述上导热臂及下导热臂的开槽中，所述弹 性件的第一弹性臂抵持在与其对应的第一导热板或第二导热板上，所述第一弹
30、 如权利要求 29所述的导热装置， 其特征在于，
在所述上导热臂及下导热臂上分别设置有相互平行的斜面，所述弹性件弹
31、 如权利要求 30所述的导热装置， 其特征在于，
所述上导热臂及下导热臂的斜面上分别设置有凸条，所述弹性件卡扣在所 述凸条上。
32、 如权利要求 27至 31任意一项所述的导热装置， 其特征在于， 所述限位结构为分别设置在所述上导热臂及下导热臂上的多个相互对应 卡合的限制位凸台。
33、 一种应用如权利要求 1所述的导热装置的电子装置， 其特征在于， 所述电子装置包括一个电路板、 多个设置在所述电路板上的芯片、一个设 上的散热装置和多个所述导热装置；
所述多个导热装置设置在所述芯片以及所述散热罩之间，所述导热装置的 第一导热板与所述芯片紧密贴合，所述导热装置的导热结构通过其导热面与所 述散热罩紧密抵持。
34、 如权利要求 33所述的电子装置， 其特征在于，
所述导热结构的导热面与散热罩之间设置一个散热凸台。
PCT/CN2011/074077 2010-11-11 2011-05-16 一种导热装置及其应用的电子装置 WO2011137767A1 (zh)

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