WO2011132653A1 - 微小部品配置ユニット - Google Patents

微小部品配置ユニット Download PDF

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Publication number
WO2011132653A1
WO2011132653A1 PCT/JP2011/059579 JP2011059579W WO2011132653A1 WO 2011132653 A1 WO2011132653 A1 WO 2011132653A1 JP 2011059579 W JP2011059579 W JP 2011059579W WO 2011132653 A1 WO2011132653 A1 WO 2011132653A1
Authority
WO
WIPO (PCT)
Prior art keywords
shaft body
shaft
pressing
suction nozzle
micro component
Prior art date
Application number
PCT/JP2011/059579
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
栄一 小関
Original Assignee
ヒーハイスト精工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヒーハイスト精工株式会社 filed Critical ヒーハイスト精工株式会社
Priority to CN201180020195.0A priority Critical patent/CN102845144B/zh
Priority to KR1020127029476A priority patent/KR101738713B1/ko
Publication of WO2011132653A1 publication Critical patent/WO2011132653A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools

Definitions

  • the present invention relates to a micro component placement unit that can be used particularly advantageously by being incorporated in an electronic component mounting apparatus for mounting electronic components on the surface of a printed wiring board.
  • an electronic component mounting apparatus has been used to mount an electronic component on the surface of a printed wiring board.
  • an electronic component mounting apparatus incorporates a micro component placement unit including a shaft body provided with a suction nozzle for electronic components (micro components) at the lower end and an elevating drive device for the shaft body.
  • the micro component placement unit In the operation of the electronic component mounting apparatus, first, the micro component placement unit is moved above the tray in which the electronic components are accommodated. The micro component placement unit lowers the shaft body, lifts the shaft body after sucking the electronic component by the suction nozzle provided at the lower end thereof. Next, the electronic component mounting apparatus moves the micro component placement unit above the printed wiring board. The micro component placement unit lowers the shaft body, and after placing (mounting) the electronic component sucked by the suction nozzle on the surface of the printed wiring board, the shaft body is raised. By repeating such an operation, a large number of electronic components are mounted on the surface of the printed wiring board.
  • the micro component placement unit In order to mount a large number of electronic components on the surface of the printed wiring board efficiently (in a short time), the micro component placement unit is usually configured with a plurality of shaft bodies each having a suction nozzle at the lower end. The micro component placement unit is repeatedly moved at high speed.
  • Patent Document 1 discloses a micro component placement unit (head unit) including a plurality of (for example, 10) shaft bodies (drive shafts) each having a suction nozzle at the lower end.
  • a lift driving device linear motor is provided for each shaft body.
  • Patent Document 2 discloses a micro component placement unit (component transfer device) including a plurality of (e.g., eight) shaft bodies (spindles) each having a suction nozzle at the lower end.
  • the plurality of shafts are attached to the peripheral edge of the disk-shaped rotary head.
  • a rotary drive device (servo motor 43) is connected to the rotary head. By operating this rotational drive device, the rotary head rotates (spins). As a result, the plurality of shaft bodies also rotate (revolve around the rotation axis of the rotary head).
  • the micro component placement unit is provided with an elevating drive device (servo motor 45, feed screw 46, and lowering lever 47). By operating this lifting drive, the shaft disposed under the lowering lever of the lifting drive is lowered by the rotation of the rotary head.
  • JP 2009-170525 A (FIGS. 2 and 3) JP 2009-135553 A (FIG. 7)
  • the micro component placement unit Since the micro component placement unit is repeatedly moved at a high speed, it is desirable that the micro component placement unit has a simple configuration and is lightweight. If the mass of the micro component placement unit is large, the accuracy of the movement (positioning accuracy) may be reduced due to the inertia that occurs when the micro component placement unit starts or stops moving at high speed. The power consumption required for this is also increased.
  • Patent Document 1 Since the micro component placement unit of Patent Document 1 has a complicated configuration including a lifting drive device (total of 10 linear motors) for each shaft body, it is not easy to reduce the weight thereof. .
  • the micro component placement unit of Patent Document 2 has a complicated configuration in which a plurality of shafts are rotated (revolved) by a rotary head, it is not easy to reduce the weight. Further, since each shaft body moves in the horizontal direction by rotation (revolution), the position of the electronic component sucked by the suction nozzle of the shaft body fluctuates unless the rotary head is rotated and positioned with high accuracy. Although the rotary head can be rotated using a high-precision rotary drive device, such a rotary drive device has a complicated configuration and tends to increase the mass of the micro component placement unit.
  • An object of the present invention is to provide a micro component placement unit that is simple in configuration and easy in weight reduction.
  • the present invention comprises a plurality of micropart raising / lowering means each comprising a shaft body provided with a micropart suction nozzle connected to a decompression mechanism at the lower end and a bearing for guiding the shaft body provided around the shaft body. Supporting and fixing the lifting mechanism and lifting mechanism for micro parts, in which the top part of the shaft body and the lower end part of the suction nozzle are aligned in the width direction of the shaft body in such a positional relationship that they are at the same height.
  • a frame body an elastic body that engages the shaft body of each lifting means and the bearing or the frame body, and supports the shaft body so that the height of all the tops thereof is a predetermined height, and the top of each shaft body Connected to a pressing device disposed above a space between the top of the arbitrary shaft body and the space between the bottom surface of the pressure device, and a pressure assisting member that can be inserted into the space between the bottom surface of the pressure device, This pressing assist member is driven to move and position in the horizontal direction.
  • microcomponents deployment unit comprising a pressing assistant member drive mechanism.
  • the preferable aspect of the micro component placement unit of the present invention is as follows.
  • the pressing auxiliary member includes a disk-shaped member and a moving member that rotatably holds the disk-shaped member, and the pressing auxiliary member driving mechanism includes an annular belt and a driving device that realizes circular movement of the annular belt. .
  • the pressure reducing mechanism to which the micro component suction nozzle is connected is connected to the micro component suction nozzle through the hollow internal space of the shaft body.
  • Each shaft body is rotatable in the bearing.
  • micro component placement unit of the present invention does not need to be provided with an elevating drive device for each shaft body, the configuration is simple and the weight can be easily reduced.
  • FIG. 1 It is a front view which shows the structural example of the micro component arrangement
  • the electronic components 91a to 91f, the tray 92, the annular packing 18 and the frame 16 are shown as cross sections.
  • the connection tool (FIG. 2:11) provided in the near side with respect to the paper surface of the figure of the frame 16 is not filled in.
  • FIG. 2 It is a left view of the micro component placement unit 10 of FIG. It is a figure which shows the structure of the press apparatus 51, the press auxiliary member 61, and the press auxiliary member drive mechanism 71 of the micro component arrangement
  • FIG. 2 is a diagram illustrating the micro component placement unit 10 of FIG. 1 in a state where a shaft body 13a is lowered together with a micro component suction nozzle 12a for sucking a first electronic component 91a.
  • FIG. 2 is a diagram showing the micro component placement unit 10 of FIG.
  • FIG. 1 is a diagram showing the micro component placement unit 10 of FIG. 1 in a state where a shaft body 13b is lowered together with a micro component suction nozzle 12b for sucking a second electronic component 91b.
  • FIG. 2 is a view showing the minute component placement unit 10 of FIG.
  • FIG. 2 is a diagram showing the micro component placement unit 10 of FIG. 1 in a state where electronic components 91a to 91f are sucked by all the minute component suction nozzles 12a to 12f, respectively.
  • FIG. 2 is a diagram showing the micro component placement unit 10 of FIG. 1 in a state where a shaft body 13f is lowered together with a micro component suction nozzle 12f in order to place a first electronic component 91f on the surface of a printed wiring board 93.
  • FIG. 2 is a diagram showing the micro component placement unit 10 of FIG. 1 in a state where shafts 13a to 13f are lowered together with micro component suction nozzles 12a to 12f in order to simultaneously suck all the electronic components 91a to 91f.
  • FIG. 1 is a front view showing a configuration example of a micro component placement unit 10 of the present invention.
  • FIG. 2 is a left side view of the micro component placement unit 10 of FIG.
  • the electronic components 91a to 91f, the tray 92 for storing the electronic components, the annular packing 18 mounted around each of the shaft bodies 13a to 13f, and the lifting mechanism 15 are supported and fixed.
  • Each frame 16 is shown as a cross section.
  • the connection tool (FIG. 2:11) provided in the near side with respect to the paper surface of the figure of the frame 16 is not filled in.
  • a shaft body e.g., shaft body 13a
  • a micro-part suction nozzle e.g., suction nozzle 12a
  • a decompression mechanism at the lower end, and around the shaft body.
  • micropart elevating means for example, elevating means 15a
  • bearings 14 that guide the elevating and lowering of the provided shaft body, and the top of each shaft body and the lower end of the suction nozzle are respectively at the same height.
  • a frame raising / lowering mechanism 15 that supports and fixes the lifting mechanism 15, a shaft body and a frame body 16 of each lifting means,
  • An elastic body 17 that engages the shaft body and supports the shaft body so that the height of all the top portions thereof is a predetermined height
  • a pressing device 51 disposed above the top portion of each shaft body with an interval, Insert it in the space between the top of the shaft and the bottom of the pressing device 51.
  • Connected to the pressing assistant member 61 and the pressing assistant member 61 it is enabled, and a pressing assistant member driving mechanism 71 that drives the pressing assistant member 61 for moving and positioning in the horizontal direction.
  • the micro component placement unit 10 is incorporated into the electronic component mounting apparatus in a state where the support plate 19 is connected and fixed to a driving device provided in the electronic component mounting apparatus, for example.
  • a driving device provided in the electronic component mounting apparatus, for example.
  • the micro component placement unit 10 is repeatedly moved at high speed between the tray 92 containing a plurality of electronic components and the printed wiring board (FIG. 11: 93). It is.
  • the micro component placement unit 10 includes, for example, six lifting means 15a to 15f.
  • the number of elevating means ie, corresponding to the number of shaft bodies provided with minute component suction nozzles
  • the number of elevating means is usually in the range of 2 to 30, preferably 3 to 20, and more preferably 4 to 10. Is set.
  • the lifting / lowering means 15a includes a minute component suction nozzle 12a, a shaft body 13a, and a bearing 14 connected to a pressure reducing mechanism (not shown).
  • the configuration of each of the elevating means 15b to 15f is the same as that of the elevating means 15a.
  • the configuration and operation of the elevating means 15a to 15f will be described using the elevating means 15a as a representative example.
  • the decompression mechanism is connected to the tube 11 a of the connector 11 provided in the frame 16.
  • a known pump represented by an ejector vacuum pump can be used.
  • the decompression mechanism may be connected to the minute component suction nozzle, but as shown in FIG. 2, it is preferably connected to the minute component suction nozzle 12a via the hollow inner space 22 of the shaft body 13a.
  • the pressure reducing mechanism does not move up and down together with the suction nozzle 12a. Smooth up and down is realized.
  • the electronic component By operating the pump of the decompression mechanism to decompress the internal space 22 of the shaft body 13a, the electronic component can be adsorbed to the lower end of the minute component adsorption nozzle 12a.
  • a hole 23 connected to the internal space 22 is formed in the shaft body 13a.
  • an annular packing 18 is mounted around the shaft body 13a.
  • a bearing 14 for guiding the lifting and lowering of the shaft body 13a.
  • a known linear motion bearing eg, a ball bush
  • the elevating means 15a to 15f are arranged such that the top of each shaft body and the lower end of the suction nozzle are aligned in the width direction of the shaft body in such a positional relationship that they are at the same height.
  • An elevating mechanism 15 is configured.
  • the elevating mechanism 15 is supported and fixed to the frame body 16 via the bearings 14 of the elevating means.
  • the frame body 16 is fixed to the support plate 19 (via the connection member 24 and the rotation driving device 83).
  • the micro component placement unit 10 is provided with an elastic body 17 that engages with the shaft body of each lifting means and the frame body 16 and supports the shaft body so that the height of the top of the shaft body becomes a predetermined height.
  • a coil spring is used as the elastic body 17. Instead of the coil spring, for example, a rubber cylinder may be used.
  • the above-mentioned “predetermined height” means the height at which the lower end of the micro component suction nozzle can reach the electronic component (micro component) when the shaft is lowered, and the micro component placement unit is incorporated. It is set to an appropriate height according to the device to be used.
  • the elastic body 17 engaged with the shaft body 13a and the frame body 16 is shortened. Accordingly, when the pressing to the shaft body 13a is stopped, the elastic body 17 is extended and the shaft body 13a is raised.
  • the elastic body may be engaged with a shaft body and a bearing (eg, bearing 14).
  • a bearing eg, bearing 14
  • the engagement between the elastic body, the shaft body, and the frame body (or bearing) will be described in detail later.
  • a pressing device 51 is disposed above the top of each shaft body with a gap therebetween.
  • the pressing device 51 is disposed above the plurality of shaft bodies 13a to 13f so as to be movable up and down.
  • the movable block 52 has a bottom surface facing the upper end surface of each shaft body, and is disposed above the movable block 52. And one end is connected to a position different from the center of the rotation shaft 53a of the rotation driving device 53, and the rotation driving device 53 having the rotation shaft 53a arranged parallel to the bottom surface of the movable block 52, The other end is connected to the side surface (or top surface) of the movable block 52, and is composed of a rod 54 that can be tilted and moved around the respective ends.
  • the movable block 52 and the plate 55 provided in the rotation drive device 53 are connected to each other via linear motion guide devices (linear guides) 56 and 56.
  • Each linear motion guide device 56 includes a rail 56a extending in the vertical direction and a slider 56b slidably mounted on the rail 56a.
  • the movable block 52 is movable (lifted / lowered) along the rail 56 a together with the slider 56 b of each linear motion guide device 56.
  • the rotation driving device 53 and the rod 54 of the pressing device 51 function as a linear motion driving device that moves (moves up and down) the movable block 52 in the vertical direction.
  • a known linear drive device can be used in place of the rotary drive device 53 and the rod 54. Examples of the linear drive device include a linear motor or a linear drive device that combines a rotary drive device and a feed screw.
  • the micro component placement unit 10 can be inserted into a space between the top of any of the shaft bodies 13a to 13f and the bottom surface of the pressing device 51 (that is, the bottom surface of the movable block 52).
  • a pressing assisting member 61, and a pressing assisting member driving mechanism 71 that is connected to the pressing assisting member 61 and drives the pressing assisting member 61 to move and position in the horizontal direction.
  • the pressing assisting member 61 is shown in a state of being inserted into a space (gap) between the top of the shaft body 13 a and the bottom surface of the pressing device 51, for example.
  • the plate 62 a supporting the pressing assist member 61 is fixed to the linear motion guide device 63.
  • the linear motion guide device 63 includes a rail 63a extending in the vertical direction and a slider 63b slidably mounted on the rail 63a.
  • the rail 63a is fixed to the plate 62b, and the slider 63b is fixed to the plate 62a.
  • a plate 62c is fixed to the lower end surface of the plate 62a.
  • the plates 62b and 62c are connected to each other via elastic bodies 64 and 64.
  • a coil spring is used as the elastic body 64.
  • the pressing auxiliary member 61 is pressed (pressed) by the movable block 52 and moves downward along the rail 63a together with the plates 62a and 62c and the slider 63b. Move (down). At this time, the elastic body 64 connecting the plate 62b and the plate 62c extends. For this reason, by raising the movable block 52, the elastic body 64 is shortened, and the pressing auxiliary member 61 moves (rises) along the rail 63a together with the plates 62a and 62c and the slider 63b. With such a mechanism, the pressing assist member 61 can be moved up and down.
  • the linear motion guide device 65 includes a rail 65a extending in the horizontal direction (along the alignment direction of the shaft bodies 13a to 13f) and a slider 65b slidably mounted on the rail 65a.
  • the rail 65a is fixed to the end surface of the shelf plate 21 extending in the horizontal direction from the support plate 19.
  • the pressing auxiliary member 61 is moved horizontally along the rail 65a (in the alignment direction of the shaft bodies 13a to 13f) together with the plates 62a and 62c, the linear motion guide device 63, the plate 62b, and the slider 65b of the linear motion guide device 65. It is possible to move along.
  • the pressing assisting member driving mechanism 71 includes an annular belt 72 and a driving device 73 that realizes circulation movement of the annular belt 72.
  • the drive device 73 includes a rotary drive device (eg, a motor) 74 having a rotary shaft 74a, a pulley 75a connected to the rotary shaft 74a, and four other pulleys 75b to 75e.
  • a rotary drive device eg, a motor
  • the drive device 73 includes a rotary drive device (eg, a motor) 74 having a rotary shaft 74a, a pulley 75a connected to the rotary shaft 74a, and four other pulleys 75b to 75e.
  • a timing belt is used as the annular belt 72, and timing pulleys are used as the pulleys 75a to 75c that support the inner surface of the annular belt 72.
  • the annular belt 72 is connected to a plate 62b that supports the pressing assisting member 61 via an L-shaped connecting member 76, for example. Accordingly, by rotating (or reversely rotating) the rotating shaft 74a of the rotation driving device 74 and circulatingly moving the annular belt 72, the pressing auxiliary member 61 connected to the annular belt 72 via the connecting member is moved in the horizontal direction. Can be moved and positioned.
  • the pressing assisting member driving mechanism 71 using the annular belt has an advantage that the structure is simple and the weight can be easily reduced.
  • the pressing assist member driving mechanism 71 functions as a linear drive device that moves the pressing assist member 61 in the horizontal direction.
  • a known linear drive device can be used. Examples of the linear drive device include a linear motor or a linear drive device that combines a rotary drive device and a feed screw.
  • FIG. 4 shows a state in which the pressing assisting member 61 is positioned above the top of the shaft body 13b shown in FIG. 1 by the above positioning operation, for example.
  • the rotary drive device (FIG. 2: 53) of the pressing device 51 is operated, and the rotary shaft 53a is rotated in the direction indicated by the arrow 59a to lower the movable block 52.
  • the auxiliary pressing member 61 moves (lowers) in the direction indicated by the arrow 69b.
  • FIG. 5 shows a state where the pressing auxiliary member 61 is lowered.
  • the auxiliary pressing member 61 is positioned above the top of the shaft body 13b shown in FIG. Therefore, by lowering the pressing auxiliary member 61 as described above, the shaft body 13b shown in FIG. 1 is lowered together with the minute component suction nozzle 12b. Then, by raising the pressing auxiliary member 61, the elastic body 17 supporting the shaft body 13b is extended, and the shaft body 13b is also raised.
  • the micro component placement unit 10 shown in FIGS. 1 and 2 uses the pressing assist member driving mechanism 71 to move the pressing assisting member 61 above the top of an arbitrary shaft body to perform positioning, and then presses the pressing device 51.
  • the shaft body can be selectively raised and lowered together with the minute component suction nozzle provided at the lower end thereof, that is, it is necessary to provide a lifting drive device for each shaft body Therefore, the configuration is simple and the weight can be easily reduced.
  • the shaft bodies 13a to 13f are fixed to the frame body 16 and the shaft bodies do not move in the horizontal direction, the shaft bodies are moved in the horizontal direction and positioned with high accuracy. There is no need to use a driving device.
  • the pressing auxiliary member 61 is moved in the horizontal direction by the pressing auxiliary member driving mechanism 71 and positioned above the top of the shaft body 13a. Thereby, the pressing assisting member 61 is inserted into the space (gap) between the bottom surface of the pressing device 51 (that is, the bottom surface of the movable block 52) and the top portion of the shaft body 13a.
  • the shaft body 13a is lowered together with the minute component suction nozzle 12a as shown in FIG.
  • the electronic component 91a is attracted to the lower end of the suction nozzle 12a by operating the decompression mechanism.
  • the pressing assisting member 61 is raised, and as shown in FIG. 7, the shaft body 13a is lifted together with the minute component suction nozzle 12a that sucks the electronic component 91a. . In this way, the first electronic component 91a is sucked.
  • the pressing auxiliary member 61 is moved in the horizontal direction by the pressing auxiliary member driving mechanism 71 and positioned above the top of the shaft body 13b as shown in FIG. Then, by moving the movable block 52 of the pressing device 51 together with the pressing auxiliary member 61 in the same manner as described above, the shaft body 13b is lowered together with the minute component suction nozzle 12b as shown in FIG. After the lower end of the minute component suction nozzle 12b reaches the electronic component 91b, the electronic component 91b is attracted to the lower end of the suction nozzle 12b by operating the pressure reducing mechanism.
  • the shaft body 13f is moved down together with the micro component suction nozzle 12f, so that the surface of the printed wiring board 93 has an electron.
  • the component 91f can be arranged (mounted).
  • the remaining electronic components are arranged on the surface of the printed wiring board 93.
  • the pressing assist member 61 is composed of a disk-shaped member 61a and a moving member 61b that rotatably holds the disk-shaped member 61a.
  • a pressing assist member 61 for example, a roller with a shaft, a component having a rotary bearing mounted around the shaft, or a cam follower used for a cam mechanism can be used.
  • the pressing auxiliary member 61 When the pressing auxiliary member 61 is composed of the disk-shaped member 61a and the moving member 61b, the disk-shaped member 61a is moved to the bottom surface of the pressing device 51 (that is, the movable block 52) when the pressing auxiliary member 61 moves in the horizontal direction. Roll while touching the bottom surface. As a result, the friction between the pressing auxiliary member 61 and the pressing device 51 becomes extremely small, so that the durability of the pressing auxiliary member 61 is improved.
  • the pressing assisting member can be constituted by, for example, a metal member.
  • each shaft body can be rotated in the bearing so that the micro components (eg, electronic components) sucked by the micro component suction nozzle are arranged in a predetermined direction. It is preferable that
  • the shaft body 13a for example, the shaft body 13a can be moved up and down and rotated.
  • a bearing 81 is further provided around each shaft body.
  • a known bearing that supports the shaft body in a non-rotating state so as to be movable up and down can be used.
  • a plurality of linear grooves are formed on the outer peripheral surface of each shaft body at intervals in the circumferential direction, and the shaft body can be moved up and down and supported in a non-rotating state by engagement with each linear groove.
  • Spline bearings can be used.
  • Rotating bearings 82 are mounted around each bearing 81, and the bearing 81 can be rotated together with the shaft body.
  • the shaft bodies 13a to 13f are provided with pulleys 84a to 84f via bearings 81, respectively.
  • the micro component placement unit 10 is provided with a rotation drive device 83.
  • a pulley 85 a is provided on the rotation shaft 83 a of the rotation drive device 83.
  • the pulley 85a is connected to the pulley 85b via the annular belt 86a.
  • the pulley 85b is connected to the pulley 85c via the rotating shaft 87.
  • the pulley 85c is connected to the pulleys 84a and 84b via the annular belt 86b and to the pulleys 84b and 84c via the annular belt 86c.
  • the pulley 85a is similarly connected to the pulley 85d via the annular belt 86d.
  • a pulley (not shown) connected to the pulley 85d via its rotating shaft is connected to the pulleys 84d and 84e via the annular belt 86e and to the pulleys 84e and 84f via the annular belt 86f. Yes.
  • the rotary drive device 83 is driven to rotate the rotary shaft 83a, thereby rotating the pulleys 84a to 84f, thereby rotating the shaft bodies 13a to 13f simultaneously while being supported by the bearings 81, respectively. be able to.
  • pulleys 84a, 84c, 84e are connected to the rotation shaft of one rotation drive device via pulleys and a belt, and the rotation of the other rotation drive device is performed.
  • Pulleys 84b, 84d, and 84f can be connected to the shaft via pulleys and belts. That is, the shaft bodies 13a, 13c, and 13e can be simultaneously rotated by one rotation driving device, and the shaft bodies 13b, 13d, and 13f can be simultaneously rotated by the other rotation driving device.
  • the electronic component 91f is mounted on the surface of the printed wiring board 93 using the micro component suction nozzle 12f included in the shaft body 13f as shown in FIG.
  • the electronic component 91e sucked by the suction nozzle 12e can be rotated in a predetermined direction. Therefore, a plurality of electronic components can be efficiently mounted on the surface of the printed wiring board (in a short time). Since the rotation driving method of the shaft body is known, no further explanation will be given.
  • the elastic body 17 shown in FIG. 2 supports the cylindrical body 25a at its upper end, and is engaged with the shaft body 13a via the cylindrical body 25a and the rotary bearing 26.
  • the elastic body 17 also has a lower end portion supported by another cylindrical body 25b and is engaged with the frame body 16 through the cylindrical body 25b. Therefore, the shaft body 13a can be rotated while being supported by the rotary bearing 26, and can be lowered together with the rotary bearing 26 and the cylindrical body 25a by pressing the top of the shaft body 13a downward.
  • the elastic body 17 can be engaged with this bearing (for example, the bearing 14) by supporting the lower end portion of the elastic body 17 directly or via another component.
  • the elastic body 17 can be engaged with the shaft body by fixing the upper end of the elastic body 17 to the top of the shaft body without using a rotary bearing.
  • FIG. 12 is a diagram showing the micro component placement unit 10 of FIG. 1 in a state where the shaft bodies 13a to 13f are lowered together with the micro component suction nozzles 12a to 12f in order to suck all the electronic components 91a to 91f at the same time. is there.
  • the pressing auxiliary member 61 is movable outside a region below the bottom surface of the pressing device 51 (that is, the bottom surface of the movable block 52).
  • the pressing auxiliary member driving mechanism 71 moves the pressing auxiliary member 61 to the outside of the region below the bottom surface of the pressing device 51, and then lowers the movable block 52 of the pressing device 51, As shown in FIG. 12, the shaft bodies 13a to 13f can be lowered at the same time, and the electronic components 91a to 91f can be simultaneously sucked by the plurality of minute component suction nozzles 12a to 12f.
  • the electronic components can be adsorbed to the minute component adsorbing nozzles 12a to 12f in a short time, so that a plurality of electronic components can be mounted on the surface of the printed wiring board extremely efficiently.
  • the micro component placement unit of the present invention can be advantageously used by incorporating it into a device for mounting or moving various micro components typified by micro electronic components and mechanical components.
  • the electronic component include a chip type electronic component represented by a chip capacitor and a chip resistor.
  • mechanical parts include small-sized optical lenses and optical filters used in cameras mounted on mobile phones.
  • the component placement unit according to the present invention moves, for example, a device for mounting a small-sized optical lens or optical filter as described above to a predetermined position inside a mobile phone, or a micro component housed in a tray, and orders a customer. Accordingly, it can be used by being incorporated in a device that is accommodated in another tray.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Specific Conveyance Elements (AREA)
PCT/JP2011/059579 2010-04-22 2011-04-19 微小部品配置ユニット WO2011132653A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201180020195.0A CN102845144B (zh) 2010-04-22 2011-04-19 微小零件配置单元
KR1020127029476A KR101738713B1 (ko) 2010-04-22 2011-04-19 미소 부품 배치 유닛

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010099104A JP5415349B2 (ja) 2010-04-22 2010-04-22 微小部品配置ユニット
JP2010-099104 2010-04-22

Publications (1)

Publication Number Publication Date
WO2011132653A1 true WO2011132653A1 (ja) 2011-10-27

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CN112351669B (zh) * 2020-10-28 2021-09-21 昆山得士成自动化设备有限公司 一种芯片智能加工用自动化贴装设备

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JP2004200589A (ja) * 2002-12-20 2004-07-15 Matsushita Electric Ind Co Ltd 部品挿入機
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CN107745965A (zh) * 2017-10-26 2018-03-02 苏州均华精密机械有限公司 一种取放机构

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JP5415349B2 (ja) 2014-02-12
CN102845144A (zh) 2012-12-26
TWI523588B (zh) 2016-02-21
JP2011228592A (ja) 2011-11-10
KR101738713B1 (ko) 2017-05-22
CN102845144B (zh) 2015-06-10
TW201233269A (en) 2012-08-01

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