WO2011132620A1 - 配向処理方法及び配向処理装置 - Google Patents
配向処理方法及び配向処理装置 Download PDFInfo
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- WO2011132620A1 WO2011132620A1 PCT/JP2011/059435 JP2011059435W WO2011132620A1 WO 2011132620 A1 WO2011132620 A1 WO 2011132620A1 JP 2011059435 W JP2011059435 W JP 2011059435W WO 2011132620 A1 WO2011132620 A1 WO 2011132620A1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
- G02F1/13378—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by treatment of the surface, e.g. embossing, rubbing or light irradiation
- G02F1/133788—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by treatment of the surface, e.g. embossing, rubbing or light irradiation by light irradiation, e.g. linearly polarised light photo-polymerisation
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/7035—Proximity or contact printers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70566—Polarisation control
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
Definitions
- the present invention relates to an alignment processing method for alternately forming two types of stripe-shaped alignment regions having different alignment states while moving a substrate, and more specifically, an alignment processing method and an alignment for shortening the tact of the alignment processing step.
- This relates to a processing apparatus.
- This type of conventional alignment treatment method uses a photomask in which stripe-shaped openings are formed at a constant arrangement pitch, and after the first ultraviolet irradiation from an oblique direction to the substrate coated with the alignment film, The substrate or both the substrate and the photomask are rotated 180 degrees, the relative position of the photomask with respect to the substrate is shifted, and the region where the ultraviolet rays are not irradiated for the first time is irradiated for the second time (for example, Patent Document 1).
- Another alignment processing method is to irradiate the alignment film on the substrate with ultraviolet rays from the direction of 45 ° with respect to the substrate normal through the openings of the photomask in which the stripe-shaped openings are formed at a constant arrangement pitch.
- the polarized ultraviolet rays are irradiated from a direction opposite to the substrate perpendicular by shifting the mask by 45 ° (see, for example, Patent Document 2).
- Still another orientation processing method uses a photomask in which a plurality of openings are formed at a constant arrangement pitch in a direction orthogonal to the moving direction of the color filter substrate while moving the color filter substrate along the surface direction. After irradiating the color filter substrate coated with the alignment film with ultraviolet rays from an oblique direction and exposing half the area of each pixel of the color filter substrate, the exposure position is shifted by a half pitch and the irradiation angle of the ultraviolet rays is changed. The remaining half of each pixel is exposed (see, for example, Patent Document 3).
- the alignment processing can be performed while continuously supplying the substrate.
- the present invention addresses such problems, and an alignment processing method for shortening the tact time of the alignment treatment process by forming two types of stripe alignment regions having different alignment states by a single alignment process. And it aims at providing the orientation processing apparatus.
- an alignment processing method is provided in parallel with a first mask pattern group in which a plurality of elongated openings are formed at a constant arrangement pitch, and the first mask pattern group.
- a substrate coated with an alignment film is formed by placing a plurality of elongated openings in close proximity to a photomask having a second mask pattern group formed with the same pitch as the arrangement pitch of the plurality of openings. Move in a direction intersecting the second mask pattern group, and irradiate the first and second mask pattern groups of the photomask with polarized light having at least one of a polarization direction and an incident angle, respectively, and the orientation Striped first and second alignment regions having different alignment states are alternately formed on the film.
- the first mask pattern group of the photomask is formed by forming a plurality of elongated openings in the moving direction of the substrate at a constant arrangement pitch in a direction intersecting the moving direction of the substrate.
- the second mask pattern group is provided parallel to the first mask pattern group by a certain distance in the movement direction of the substrate, and a plurality of elongated openings are provided in the movement direction of the substrate.
- the first and second alignment regions in the form of stripes parallel to the moving direction of the substrate intersect with the moving direction of the substrate. It is formed alternately in the direction. As a result, stripe-shaped first and second alignment regions parallel to the moving direction of the substrate are alternately formed in a direction intersecting the moving direction of the substrate.
- the first and second mask pattern groups of the photomask each have a plurality of elongated openings in a direction intersecting the moving direction of the substrate at a constant arrangement pitch in the moving direction of the substrate.
- the stripe-shaped first and second alignment regions that are irradiated and intersect the moving direction of the substrate are alternately formed in the moving direction of the substrate.
- stripe-shaped first and second alignment regions intersecting with the moving direction of the substrate are alternately formed in the moving direction of the substrate.
- each of the polarized lights applied to the first and second mask pattern groups of the photomask is P-polarized light, and has different incident angles.
- the P-polarized light is irradiated onto the first and second mask pattern groups of the photomask at different incident angles.
- one of the polarized lights irradiated to the first and second mask pattern groups of the photomask is P-polarized light and the other is S-polarized light.
- one of the first and second mask pattern groups of the photomask is irradiated with P-polarized light and the other is irradiated with S-polarized light.
- an alignment processing apparatus includes a transport unit that places a substrate coated with an alignment film on an upper surface and moves the substrate in a certain direction, and is disposed to face the upper surface of the transport unit, and has a plurality of elongated openings.
- a first mask pattern group formed with a constant arrangement pitch, and a plurality of elongated openings formed at the same pitch as the arrangement pitch of the plurality of openings, provided in parallel to the first mask pattern group.
- a mask stage holding a photomask having two mask pattern groups and the first and second mask pattern groups of the photomask are each irradiated with polarized light having at least one of a polarization direction and an incident angle different from each other.
- a polarizing optical system, and stripe-like first and second alignment regions having different alignment states can be alternately formed on the alignment film.
- a first mask pattern group in which a plurality of elongated openings are formed in the mask stage at a constant arrangement pitch, and a plurality of elongated openings provided in parallel to the first mask pattern group.
- a photomask having a second mask pattern group formed at the same pitch as the arrangement pitch of the plurality of openings, and the substrate on which the alignment film is applied by the transport means the first and second mask patterns of the photomask.
- the first mask pattern group and the second mask pattern group of the photomask are irradiated with polarized light having different polarization direction and incident angle, respectively, by the polarization optical system, and the orientation on the substrate Striped first and second alignment regions having different alignment states are alternately formed on the film.
- the first mask pattern group of the photomask is formed by forming a plurality of elongated openings in the moving direction of the substrate at a constant arrangement pitch in a direction intersecting the moving direction of the substrate.
- the second mask pattern group is provided parallel to the first mask pattern group by a certain distance in the movement direction of the substrate, and a plurality of elongated openings are provided in the movement direction of the substrate.
- the first and second alignment regions in the form of stripes parallel to the moving direction of the substrate intersect with the moving direction of the substrate. It can be formed alternately in the direction of. As a result, stripe-shaped first and second alignment regions parallel to the moving direction of the substrate are alternately formed in a direction intersecting the moving direction of the substrate.
- the first and second mask pattern groups of the photomask each have a plurality of elongated openings in a direction intersecting the moving direction of the substrate at a constant arrangement pitch in the moving direction of the substrate.
- they are provided in parallel with each other in the movement direction of the substrate by a distance that is an integral multiple of a half pitch of the arrangement pitch, and the polarized light is intermittently generated every time the substrate moves by a distance equal to the arrangement pitch.
- the stripe-shaped first and second alignment regions intersecting the moving direction of the substrate can be alternately formed in the moving direction of the substrate. As a result, stripe-shaped first and second alignment regions intersecting with the moving direction of the substrate are alternately formed in the moving direction of the substrate.
- the polarization optical system separates the P-polarized light into two by a beam splitter, makes one P-polarized light incident on the first mask pattern group of the photomask at a predetermined angle, and the other P-polarized light.
- the light is incident on the second mask pattern group of the photomask at an angle different from the angle.
- one of the P-polarized light separated into two by the beam splitter is incident on the first mask pattern group of the photomask at a predetermined angle, and the other is incident on the second mask pattern group of the photomask with the above angle. Incident at different angles.
- the beam splitter is provided with its reflecting surface disposed in a plane that intersects the photomask substantially perpendicularly at an intermediate position between the first and second mask pattern groups of the photomask. .
- the P-polarized light is separated in two directions by the reflecting surface of the beam splitter disposed in a plane that intersects the photomask substantially perpendicularly at an intermediate position between the first and second mask pattern groups of the photomask.
- the polarization optical system causes one of the two polarized lights having different polarization directions to enter the first mask pattern group of the photomask, and the other polarized light to the second mask pattern group of the photomask. It is made to enter. As a result, one of the two polarized light beams having different polarization directions is incident on the first mask pattern group of the photomask, and the other is incident on the second mask pattern group of the photomask.
- two kinds of stripe alignment regions having different alignment states can be formed by one alignment treatment, and the tact of the alignment treatment step can be shortened.
- the first mask pattern group for forming the first alignment region and the second mask pattern group for forming the second alignment region are formed on the same photomask, the first and the different alignment states are formed. The positional accuracy of the second alignment region is improved.
- two types of alignment regions having different alignment states can be simultaneously formed with one alignment processing apparatus, the cost of the apparatus can be reduced.
- stripe-shaped first and second alignment regions that are arranged alternately in a direction crossing the moving direction of the substrate and parallel to the moving direction of the substrate are easily formed. can do.
- the alignment treatment of the TFT substrate and the color filter substrate of the liquid crystal display device can be easily performed.
- manufacture of the polarizing filter for 3D television can be performed easily.
- the first and second mask pattern groups of the photomask can be directly irradiated with the two P-polarized lights separated by the beam splitter, respectively. Therefore, it is possible to reduce the cost of the apparatus by reducing the number of parts constituting the polarization optical system.
- FIG. 5A and 5B are explanatory views showing alignment of liquid crystal molecules in each alignment region of the substrate subjected to the alignment treatment, wherein FIG. 4A is a cross-sectional view taken along the line AA in FIG. 4 and FIG. It is. It is a top view which shows the modification of a structure of a photomask.
- FIG. 1 It is a top view which shows the orientation state of the board
- FIG. 2nd Embodiment of the orientation processing apparatus of this invention It is a top view which shows the orientation state of the board
- FIG. 1 is a front view showing a schematic configuration of a first embodiment of an alignment processing apparatus according to the present invention.
- This alignment processing apparatus alternately forms two types of stripe-shaped alignment regions having different alignment states while moving the substrate, and includes a transport means 1, a mask stage 2, and a polarization optical system 3. .
- the transport means 1 is for placing a substrate 4 coated with an alignment film on the upper surface 1a and moving it at a constant speed in the X direction in FIG. 1, and includes a speed sensor and a position sensor not shown.
- a mask stage 2 is arranged opposite to the upper surface 1a of the transfer means 1.
- the mask stage 2 includes a first mask pattern group 6A in which a plurality of elongated openings 5A are formed at a constant arrangement pitch in the moving direction of the substrate 4 as shown in FIG. 2, and the first mask pattern group 6A.
- a second mask pattern group 6B having a plurality of elongated openings 5B formed in the moving direction of the substrate 4 at the same pitch as the arrangement pitch of the plurality of openings 5A.
- the holding means is configured so that it can be finely moved in a direction perpendicular to the moving direction of the substrate 4 in a plane parallel to the upper surface 1a of the transport means 1.
- the first mask pattern group 6 ⁇ / b> A has a plurality of openings 5 ⁇ / b> A in a direction (hereinafter referred to as “Y direction”) intersecting the moving direction of the substrate 4 (hereinafter referred to as “X direction”).
- the second mask pattern group 6B is formed with an arrangement pitch P, and is provided parallel to the first mask pattern group 6A with a distance L between the center lines in the X direction and a plurality of openings 5B. Are formed at the same pitch as the arrangement pitch P of the plurality of openings 5A and shifted by a half pitch in the arrangement direction (Y direction).
- the distance L is such that a part of the polarized light applied to the first mask pattern group 6B and a part of the polarized light applied to the second mask pattern group 6B leak to the opposite mask pattern group side.
- the distance is set so as not to enter.
- the width W in the arrangement direction of the openings 5A and 5B is set to W ⁇ P / 2.
- a polarizing optical system 3 is provided above the mask stage 2.
- the polarization optical system 3 irradiates the first and second mask pattern groups 6A and 6B of the photomask 7 with polarized light having at least one of a polarization direction and an incident angle different from each other.
- P-polarized light whose polarization direction is parallel to the X direction is made incident on the mask surface (or substrate 4 surface) of the photomask 7 at an angle ⁇ (for example, 45 °).
- a specific configuration example of the polarizing optical system 3 includes, for example, a light source 8 of an ultra-high pressure mercury lamp that emits ultraviolet rays from the upstream side to the downstream side in the light traveling direction, and an incident surface of random light emitted from the light source 8.
- a polarizing plate 9 that selectively transmits P-polarized light parallel to the light beam and a reflecting surface 10a inclined with respect to the optical axis, a 50% beam splitter that transmits half of the P-polarized light and reflects the remaining half (hereinafter referred to as a 50% beam splitter). "Half mirror 10").
- a 50% beam splitter that transmits half of the P-polarized light and reflects the remaining half
- the reflection surface 10a of the half mirror 10 is in a plane that intersects the photomask 7 substantially perpendicularly at an intermediate position between the first and second mask pattern groups 6A and 6B of the photomask 7.
- the P-polarized light separated in two directions can be directly incident on the first and second mask pattern groups 6A and 6B of the photomask 7 at different angles ⁇ , and the components constituting the polarization optical system 3 The score can be reduced.
- each P-polarized light separated in two directions by the reflecting surface 10a of the half mirror 10 is further reflected by the reflecting mirror and incident on the first and second mask pattern groups 6A and 6B of the photomask 7 at different angles ⁇ . You may let them.
- a color filter substrate (substrate 4) in which an alignment film is formed on a glass substrate by spin coating, spray coating, or the like is positioned and placed on the upper surface 1a of the conveying means 1, and is moved at a constant speed in the X direction. Move with.
- a reference position of a reference pattern formed at regular intervals in the X direction (for example, an edge portion parallel to the X direction of each pixel of the color filter substrate) is omitted through a viewing window (not shown) provided in the photomask 7.
- detecting by the imaging means detecting a positional deviation in the Y direction of the reference position of the reference pattern with respect to a reference position preset in the imaging means, and finely moving the mask stage 2 in the Y direction so as to correct the positional deviation
- ultraviolet light P-polarized light with different incident angles ⁇ (for example, 45 ° opposite to each other) with respect to the first and second mask pattern groups 6A and 6B of the photomask 7 by the polarization optical system 3.
- the alignment film on the substrate 4 is exposed through the openings 5A and 5B of the first and second mask pattern groups 6A and 6B.
- the alignment film has a plurality of first alignment regions 11 in the form of stripes long in the X direction formed by the first mask pattern group 6A, and the second mask pattern group 6B.
- a plurality of second alignment regions 12 in the form of stripes that are long in the X direction and different in alignment state from the alignment state of the first alignment region 11 are alternately formed in the Y direction.
- the first alignment region 11 tilts the adjacent liquid crystal molecules 13 from the vertical state to the left side in FIG. 5 by an angle ⁇ (pretilt angle (90 ⁇ )).
- the first alignment state is set.
- the second alignment region 12 is aligned by tilting the adjacent liquid crystal molecules 13 from the vertical state to the right side by an angle ⁇ (pretilt angle (90 ⁇ )).
- the second orientation state is set.
- the image pickup means is a line CCD in which a plurality of light receiving elements are arranged in a straight line in the Y direction, position detection can be performed in real time, and alignment between the substrate 4 and the photomask 7 can be performed at high speed. Can be done.
- FIG. 6 shows a modification of the photomask 7 in which the first and second mask pattern groups 6A and 6B are provided apart from each other by a certain distance in the moving direction of the substrate 4, and a plurality of elongated patterns in the Y direction are provided.
- the openings 5A and 5B are formed with an arrangement pitch Q in the X direction.
- the distance between the longitudinal central axis of the opening 5A on the X direction leading side of the first mask pattern group 6A and the longitudinal central axis of the opening 5B on the X direction leading side of the second mask pattern group 6B is defined as nQ /.
- the second alignment region 12 can be formed by the second mask pattern group 6B in a portion between adjacent regions of the plurality of first alignment regions 11 formed by the pattern group 6A.
- the width W in the arrangement direction of the openings 5A and 5B is set to W ⁇ Q / 2.
- FIG. 8 is an enlarged view of a main part showing a second embodiment of the alignment processing apparatus according to the present invention.
- the polarization optical system 3 applies one of the two polarized lights (P-polarized light and S-polarized light) having different polarization directions separated by the polarizing beam splitter 14 (P-polarized light) to the photomask 7.
- P-polarized light the polarizing beam splitter 14
- S-polarized light the other polarized light
- the incident angles of P-polarized light and S-polarized light may be the same or different.
- FIG. 8 shows a case where each polarized light is vertically incident on the photomask 7.
- reference numeral 15 denotes a total reflection mirror.
- the photomask 7 used in the second embodiment may be the one shown in FIG. 2 or the one shown in FIG. As a result, as shown in FIG. 9, a plurality of first alignment regions 11 and a plurality of second alignment regions 12 in a stripe shape whose alignment directions are orthogonal to each other are alternately formed.
- 9A shows the alignment state of the alignment film when the photomask 7 shown in FIG. 2 is applied
- FIG. 9B shows the alignment state when the photomask 7 shown in FIG. 6 is applied. Indicates.
- each of the polarizing plates 9 is a polarizing plate that selectively transmits P-polarized light.
- one polarizing plate 9 is a polarizing plate that selectively transmits P-polarized light
- the other polarizing plate 9 is a polarizing plate that selectively transmits S-polarized light.
- each polarized light may be incident on the photomask 7 perpendicularly.
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Abstract
Description
先ず、スピンコートやスプレーコート等によりガラス基板上に配向膜を一定の厚みに形成した例えばカラーフィルタ基板(基板4)を搬送手段1の上面1aに位置決めして載置し、X方向に一定速度で移動させる。
この第2の実施形態は、偏光光学系3が、偏光ビームスプリッタ14により分離された偏光方向の異なる二つの偏光(P偏光及びS偏光)のうち、一方の偏光(P偏光)をフォトマスク7の第1のマスクパターン群6Aに入射させ、他方の偏光(S偏光)をフォトマスク7の第2のマスクパターン群6Bに入射させる点において上記第1の実施形態と相違する。この場合、P偏光及びS偏光の入射角度は、同じであっても異なっていてもよい。図8においては、各偏光をフォトマスク7に垂直に入射させた場合を示している。なお、同図において、符号15は全反射ミラーである。
2…マスクステージ
3…偏光光学系
4…基板
5A,5B…開口
6A…第1のマスクパターン群
6B…第2のマスクパターン群
7…フォトマスク
10…ハーフミラー(ビームスプリッタ)
11…第1の配向領域
12…第2の配向領域
Claims (11)
- 細長状の複数の開口を一定の配列ピッチで形成した第1のマスクパターン群と、該第1のマスクパターン群に平行に設けられ、細長状の複数の開口を前記複数の開口の配列ピッチと同ピッチで形成した第2のマスクパターン群とを有するフォトマスクに近接対向させて、配向膜が塗布された基板を前記第1及び第2のマスクパターン群に交差する方向に移動し、
前記フォトマスクの第1及び第2のマスクパターン群に夫々、偏光方向及び入射角度のうち少なくともいずれか一方が異なる偏光を照射し、
前記配向膜に配向状態が異なるストライプ状の第1及び第2の配向領域を交互に形成する、
ことを特徴とする配向処理方法。 - 前記フォトマスクの前記第1のマスクパターン群は、前記基板の移動方向に細長状の複数の開口を前記基板の移動方向と交差する方向に一定の配列ピッチで形成したもので、
前記第2のマスクパターン群は、前記第1のマスクパターン群に対して前記基板の移動方向に一定距離だけ離れて平行に設けられ、前記基板の移動方向に細長状の複数の開口を前記複数の開口の配列ピッチと同ピッチで且つ配列方向に半ピッチだけずらして形成したものであり、
前記基板の移動方向に平行なストライプ状の前記第1及び第2の配向領域を前記基板の移動方向と交差する方向に交互に形成することを特徴とする請求項1記載の配向処理方法。 - 前記フォトマスクの前記第1及び第2のマスクパターン群は、夫々前記基板の移動方向と交差する方向に細長状の複数の開口を前記基板の移動方向に一定の配列ピッチで形成すると共に、前記配列ピッチの半ピッチの整数倍の距離だけ前記基板の移動方向に互いに離れて平行に設けられており、
前記基板が前記配列ピッチと等しい距離だけ移動する毎に、前記偏光を間欠的に照射して前記基板の移動方向と交差するストライプ状の前記第1及び第2の配向領域を前記基板の移動方向に交互に形成することを特徴とする請求項1記載の配向処理方法。 - 前記フォトマスクの第1及び第2のマスクパターン群に照射する前記各偏光は、共にP偏光であり、夫々入射角度が異なることを特徴とする請求項1記載の配向処理方法。
- 前記フォトマスクの第1及び第2のマスクパターン群に照射する前記各偏光は、一方がP偏光であり、他方がS偏光であることを特徴とする請求項1記載の配向処理方法。
- 配向膜を塗布した基板を上面に載置して一定方向に移動させる搬送手段と、
前記搬送手段の上面に対向して配置され、細長状の複数の開口を一定の配列ピッチで形成した第1のマスクパターン群と、該第1のマスクパターン群に平行に設けられ、細長状の複数の開口を前記複数の開口の配列ピッチと同ピッチで形成した第2のマスクパターン群とを有するフォトマスクを保持するマスクステージと、
前記フォトマスクの前記第1及び第2のマスクパターン群に夫々、偏光方向及び入射角度のうち少なくともいずれか一方が異なる偏光を照射させる偏光光学系と、を備え、
前記配向膜に配向状態が異なるストライプ状の第1及び第2の配向領域を交互に形成可能としたことを特徴とする配向処理装置。 - 前記フォトマスクの前記第1のマスクパターン群は、前記基板の移動方向に細長状の複数の開口を前記基板の移動方向と交差する方向に一定の配列ピッチで形成したもので、
前記第2のマスクパターン群は、前記第1のマスクパターン群に対して前記基板の移動方向に一定距離だけ離れて平行に設けられ、前記基板の移動方向に細長状の複数の開口を前記複数の開口の配列ピッチと同ピッチで且つ配列方向に半ピッチだけずらして形成したものであり、
前記基板の移動方向に平行なストライプ状の前記第1及び第2の配向領域を前記基板の移動方向と交差する方向に交互に形成可能としたことを特徴とする請求項6記載の配向処理装置。 - 前記フォトマスクの前記第1及び第2のマスクパターン群は、夫々前記基板の移動方向と交差する方向に細長状の複数の開口を前記基板の移動方向に一定の配列ピッチで形成すると共に、前記配列ピッチの半ピッチの整数倍の距離だけ前記基板の移動方向に互いに離れて平行に設けられており、
前記基板が前記配列ピッチに等しい距離だけ移動する毎に、前記偏光を間欠的に照射して前記基板の移動方向と交差するストライプ状の前記第1及び第2の配向領域を前記基板の移動方向に交互に形成可能としたことを特徴とする請求項6記載の配向処理装置。 - 前記偏光光学系は、P偏光をビームスプリッタで二つに分離し、一方のP偏光を前記フォトマスクの第1のマスクパターン群に予め定められた角度で入射させ、他方のP偏光を前記フォトマスクの第2のマスクパターン群に前記角度と異なる角度で入射させることを特徴とする請求項6記載の配向処理装置。
- 前記ビームスプリッタは、その反射面を前記フォトマスクの前記第1及び第2のマスクパターン群の中間位置で前記フォトマスクに略垂直に交差する面内に配置して備えられたことを特徴とする請求項9記載の配向処理装置。
- 前記偏光光学系は、偏光方向の異なる二つの偏光のうち、一方の偏光を前記フォトマスクの第1のマスクパターン群に入射させ、他方の偏光を前記フォトマスクの第2のマスクパターン群に入射させることを特徴とする請求項6記載の配向処理装置。
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