WO2011129921A3 - Système de diffusion de faisceau souple pour systèmes laser de grande puissance - Google Patents

Système de diffusion de faisceau souple pour systèmes laser de grande puissance Download PDF

Info

Publication number
WO2011129921A3
WO2011129921A3 PCT/US2011/026949 US2011026949W WO2011129921A3 WO 2011129921 A3 WO2011129921 A3 WO 2011129921A3 US 2011026949 W US2011026949 W US 2011026949W WO 2011129921 A3 WO2011129921 A3 WO 2011129921A3
Authority
WO
WIPO (PCT)
Prior art keywords
laser
scanner
high power
pulses
beam delivery
Prior art date
Application number
PCT/US2011/026949
Other languages
English (en)
Other versions
WO2011129921A2 (fr
Inventor
Brent C. Dane
Edward W. H. Lao
Fritz B. Harris
Randall L. Hurd
Jon E. Rankin
Scott N. Fochs
Original Assignee
Metal Improvement Company Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metal Improvement Company Llc filed Critical Metal Improvement Company Llc
Priority to EP11769234.3A priority Critical patent/EP2558242B1/fr
Priority to SG2012076907A priority patent/SG184894A1/en
Priority to ES11769234.3T priority patent/ES2586148T3/es
Priority to JP2013504895A priority patent/JP6046033B2/ja
Priority to CA2795993A priority patent/CA2795993C/fr
Publication of WO2011129921A2 publication Critical patent/WO2011129921A2/fr
Publication of WO2011129921A3 publication Critical patent/WO2011129921A3/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/10—Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void
    • G01J1/20—Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void intensity of the measured or reference value being varied to equalise their effects at the detectors, e.g. by varying incidence angle
    • G01J1/22—Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void intensity of the measured or reference value being varied to equalise their effects at the detectors, e.g. by varying incidence angle using a variable element in the light-path, e.g. filter, polarising means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring device
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G02B27/0966—Cylindrical lenses

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Microscoopes, Condenser (AREA)

Abstract

La présente invention concerne une technologie de diffusion de faisceau pour systèmes laser de grande puissance, tels que des systèmes de martelage laser, pour des pièces de travail pouvant présenter des courbes composées, comprenant le placement d'un ensemble optique comportant une optique de réception, une optique de formation de faisceau et un dispositif de balayage, positionné pour recevoir des impulsions laser provenant d'une source laser et dans une plage de fonctionnement de la zone de traitement. Les impulsions laser polarisées sont envoyées vers l'optique de réception tandis que la position de l'ensemble optique demeure inchangée. Les impulsions passent à travers l'optique de formation de faisceau vers le dispositif de balayage, et sont dirigées vers des zones d'impact respectives ayant des formes et des emplacements nominaux sur la pièce de travail. Le processus de balayage comprend, pour chaque impulsion laser, un réglage de direction, de divergence, de polarisation, de rotation et de rapport de longueur des impulsions laser émises par le dispositif de balayage, afin de commander la polarisation, la forme et l'emplacement sur les zones d'impact respectives.
PCT/US2011/026949 2010-04-16 2011-03-03 Système de diffusion de faisceau souple pour systèmes laser de grande puissance WO2011129921A2 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP11769234.3A EP2558242B1 (fr) 2010-04-16 2011-03-03 Système de diffusion de faisceau souple pour systèmes laser de grande puissance
SG2012076907A SG184894A1 (en) 2010-04-16 2011-03-03 Flexible beam delivery system for high power laser systems
ES11769234.3T ES2586148T3 (es) 2010-04-16 2011-03-03 Sistema de suministro de haz flexible para sistemas láser de alta potencia
JP2013504895A JP6046033B2 (ja) 2010-04-16 2011-03-03 高出力レーザシステムの為のフレキシブルビーム供給システム
CA2795993A CA2795993C (fr) 2010-04-16 2011-03-03 Systeme de diffusion de faisceau souple pour systemes laser de grande puissance

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US34257810P 2010-04-16 2010-04-16
US61/342,578 2010-04-16
US12/945,713 2010-11-12
US12/945,713 US10072971B2 (en) 2010-04-16 2010-11-12 Flexible beam delivery system for high power laser systems

Publications (2)

Publication Number Publication Date
WO2011129921A2 WO2011129921A2 (fr) 2011-10-20
WO2011129921A3 true WO2011129921A3 (fr) 2012-02-23

Family

ID=44787438

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/US2011/026949 WO2011129921A2 (fr) 2010-04-16 2011-03-03 Système de diffusion de faisceau souple pour systèmes laser de grande puissance
PCT/US2011/026954 WO2011129922A2 (fr) 2010-04-16 2011-03-03 Système de diagnostic de séparateur de faisceau compensé en polarisation pour systèmes laser de grande puissance

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/US2011/026954 WO2011129922A2 (fr) 2010-04-16 2011-03-03 Système de diagnostic de séparateur de faisceau compensé en polarisation pour systèmes laser de grande puissance

Country Status (7)

Country Link
US (2) US10072971B2 (fr)
EP (1) EP2558242B1 (fr)
JP (1) JP6046033B2 (fr)
CA (1) CA2795993C (fr)
ES (1) ES2586148T3 (fr)
SG (1) SG184894A1 (fr)
WO (2) WO2011129921A2 (fr)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012199359A (ja) * 2011-03-22 2012-10-18 Sony Corp レーザー照射装置および微小粒子測定装置
EP2564972B1 (fr) * 2011-09-05 2015-08-26 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Appareil de marquage avec plusieurs lasers et des moyens de déflection et de focalisation pour chaque faisceau lser
DK2565994T3 (en) 2011-09-05 2014-03-10 Alltec Angewandte Laserlicht Technologie Gmbh Laser device and method for marking an object
ES2530070T3 (es) * 2011-09-05 2015-02-26 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Aparato de marcado con una pluralidad de láseres y conjuntos ajustables individualmente de medios de desviación
EP2564973B1 (fr) * 2011-09-05 2014-12-10 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Appareil de marquage avec une pluralité de lasers et un déflecteur mélangeur
EP2565996B1 (fr) 2011-09-05 2013-12-11 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Dispositif laser doté d'une unité laser, et récipient pour fluides pour moyen de refroidissement de ladite unité laser
EP2564976B1 (fr) 2011-09-05 2015-06-10 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Appareil de marquage avec au moins un laser à gas et un dissipateur de chaleur
EP2565673B1 (fr) 2011-09-05 2013-11-13 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Dispositif et procédé pour marquer un objet au moyen d'un rayon laser
EP2564974B1 (fr) * 2011-09-05 2015-06-17 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Appareil de marquage avec une pluralité de lasers gaz ayant des tubes résonateurs et des déflecteurs ajustables individuellement
WO2013170090A1 (fr) * 2012-05-11 2013-11-14 California Institute Of Technology Procédés d'imagerie de commande utilisés en microscopie électronique ultrarapide de pointe
JP6159513B2 (ja) * 2012-09-04 2017-07-05 株式会社アマダホールディングス レーザ加工ヘッド
US9445946B2 (en) 2012-11-02 2016-09-20 Optimedica Corporation Laser eye surgery system
CN103063411A (zh) * 2012-12-13 2013-04-24 华中科技大学 一种高功率线偏振激光光束性能的测量装置
CN103203543B (zh) * 2013-02-04 2015-03-11 中国航空工业集团公司北京航空制造工程研究所 一种用于激光冲击强化叶片的水约束层的喷射方法和装置
WO2014144506A1 (fr) * 2013-03-15 2014-09-18 Abbott Cardiovascular Systems Inc. Surveillance et commande de traitement de coupe au laser
CN103468925B (zh) * 2013-08-29 2014-11-05 温州大学 一种飞机叶片榫槽底部平面激光冲击强化方法和装置
WO2015185152A1 (fr) * 2014-06-06 2015-12-10 Trumpf Lasersystems For Semiconductor Manufacturing Gmbh Dispositif et procédé de surveillance d'un faisceau laser
WO2016002043A1 (fr) 2014-07-03 2016-01-07 新日鐵住金株式会社 Dispositif d'usinage au laser
RU2563908C1 (ru) * 2014-07-21 2015-09-27 Общество с ограниченной ответственностью "НАУЧНО-ТЕХНИЧЕСКИЕ ОБЪЕДИНЕНИЕ "ИРЭ-Полюс" (ООО НТО "ИРЭ-Полюс") Способ распределения лазерного излучения и многолучевая лазерная система для его осуществления
JP2016033484A (ja) * 2014-07-31 2016-03-10 横河電機株式会社 参照光分岐用光学系
US9878398B2 (en) * 2014-11-13 2018-01-30 Lsp Technologies, Inc. Automated dynamic laser peening system
US11858065B2 (en) 2015-01-09 2024-01-02 Lsp Technologies, Inc. Method and system for use in laser shock peening and laser bond inspection process
JP6772147B2 (ja) 2015-01-09 2020-10-21 エルエスピー テクノロジーズ，インコーポレイテッド レーザ衝撃ピーニング処理において使用するための方法および装置
CN107429792B (zh) * 2015-03-26 2020-04-14 德纳汽车系统集团有限责任公司 平衡配重至驱动轴的激光焊接
US10596661B2 (en) * 2015-09-28 2020-03-24 Ecole Polytechnique Federale De Lausanne (Epfl) Method and device for implementing laser shock peening or warm laser shock peening during selective laser melting
US20190244391A1 (en) * 2016-10-20 2019-08-08 Spookfish Innovations Pty Ltd An aerial camera boresight calibration system
US20180178322A1 (en) * 2016-12-28 2018-06-28 Metal Industries Research & Development Centre Laser processing device and laser processing method
JP6496340B2 (ja) * 2017-03-17 2019-04-03 ファナック株式会社 スキャナ制御装置、ロボット制御装置及びリモートレーザ溶接ロボットシステム
US10241036B2 (en) * 2017-05-08 2019-03-26 Siemens Energy, Inc. Laser thermography
JP6595558B2 (ja) * 2017-10-30 2019-10-23 ファナック株式会社 レーザ加工システム
WO2019162464A1 (fr) * 2018-02-23 2019-08-29 Avonisys Ag Procédé d'usinage d'un alésage s'étendant à partir d'une paroi externe d'une pièce à travailler avec un faisceau laser guidé par jet de liquide
US11215814B2 (en) * 2018-08-24 2022-01-04 Amo Development, Llc Detection of optical surface of patient interface for ophthalmic laser applications using a non-confocal configuration
US11707805B2 (en) 2018-12-14 2023-07-25 Raytheon Technologies Corporation System and method for laser drilling of shaped cooling holes
DE102019102512A1 (de) * 2019-01-31 2020-08-06 Trumpf Laser- Und Systemtechnik Gmbh Lasersystem
CN109870823B (zh) * 2019-04-03 2020-12-15 中国科学院理化技术研究所 一种偏振光强整形装置
CN110923701A (zh) * 2019-12-05 2020-03-27 西安必盛激光科技有限公司 一种深盲孔内壁激光熔覆装置
KR20210131510A (ko) * 2020-04-23 2021-11-03 삼성디스플레이 주식회사 라인 빔 형성 장치
EP3909498A1 (fr) * 2020-05-11 2021-11-17 Welch Allyn, INC. Systemes et procedes de configuration d'un chemin de lumiere optique
US12030735B2 (en) * 2020-10-30 2024-07-09 Delta Industrial Services, Inc. Adjustable field of view laser system for web processing
US20230065240A1 (en) * 2021-08-25 2023-03-02 The United States of America As Represented By The Director Of The National Geospatial-Intelligence Method and apparatus for the display of volumetric solids using distributed photochromic compounds

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5382770A (en) * 1993-01-14 1995-01-17 Reliant Laser Corporation Mirror-based laser-processing system with visual tracking and position control of a moving laser spot
US20050056626A1 (en) * 2003-09-12 2005-03-17 Orbotech Ltd Multiple beam micro-machining system and method
KR20070086487A (ko) * 2004-11-17 2007-08-27 메탈 임프루브먼트 컴퍼니 엘엘시 공기를 통한 가변 광 경로 세그먼트를 구비한 능동 빔 전달시스템

Family Cites Families (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3586424A (en) * 1968-09-13 1971-06-22 American Optical Corp Monocular indirect ophthalmoscope
US3724930A (en) 1972-07-21 1973-04-03 Us Air Force Method of forming and cooling pinhole spatial filter for high power laser
US3841760A (en) * 1973-02-27 1974-10-15 D Guyton Zonal focus method for determining the amount of astigmatic correction for an optical system
JPS6025133B2 (ja) 1976-04-28 1985-06-17 旭光学工業株式会社 マニピユレタ−
US4191928A (en) 1978-01-11 1980-03-04 The United States Of America As Represented By The United States Department Of Energy Laser system using regenerative amplifier
US4208129A (en) * 1978-06-30 1980-06-17 The United States Of America As Represented By The Secretary Of The Air Force Sensitive laser spectroscopy measurement system
US4426155A (en) * 1981-10-08 1984-01-17 Monchalin Jean Pierre Method and apparatus for the interferometric wavelength measurement of frequency tunable C.W. lasers
US4401477A (en) 1982-05-17 1983-08-30 Battelle Development Corporation Laser shock processing
US4656433A (en) 1982-08-19 1987-04-07 Hughes Aircraft Company Laser amplifier buffer
US4539462A (en) 1983-01-24 1985-09-03 Westinghouse Electric Corp. Robotic laser beam delivery apparatus
US4623229A (en) 1983-09-29 1986-11-18 Photon Sources, Inc. Articulated laser arm
US4698479A (en) 1984-02-06 1987-10-06 Spectra-Physics, Inc. Beam delivery system for a CO2 laser
GB8420861D0 (en) 1984-08-16 1984-09-19 Atomic Energy Authority Uk Laser control system
US4621924A (en) 1984-12-17 1986-11-11 Lockheed Missiles & Space Company, Inc. Optical alignment apparatus
US4632553A (en) * 1985-02-25 1986-12-30 Nicolet Instrument Corporation Silicon beamsplitter
US4794222A (en) 1986-06-30 1988-12-27 Manabu Funayama Laser beam machining apparatus
US4908493A (en) 1988-05-31 1990-03-13 Midwest Research Institute Method and apparatus for optimizing the efficiency and quality of laser material processing
GB8813315D0 (en) 1988-06-06 1988-07-13 Serrano J P Beam delivery system
JPH02108489A (ja) 1988-10-17 1990-04-20 Fanuc Ltd 多関節型レーザロボットの手首機構
US4936649A (en) * 1989-01-25 1990-06-26 Lymer John D Damage evaluation system and method using optical fibers
US4937421A (en) 1989-07-03 1990-06-26 General Electric Company Laser peening system and method
US5022033A (en) 1989-10-30 1991-06-04 The United States Of America As Represented By The United States Department Of Energy Ring laser having an output at a single frequency
ATE124465T1 (de) 1990-01-11 1995-07-15 Battelle Memorial Institute Verbesserung von materialeigenschaften.
US5075893A (en) 1990-12-07 1991-12-24 Battelle Memorial Institute Unpolarized laser oscillators
US5142118A (en) 1991-05-14 1992-08-25 Progressive Tool & Industries Co. Laser welding unit
DE4129278A1 (de) 1991-09-03 1993-03-11 Weidmueller Interface Werkzeugkopf mit automatisch verstellbarer fokussierungsoptik
US5239408A (en) 1992-01-21 1993-08-24 Regents Of The University Of California High power, high beam quality regenerative amplifier
US5329350A (en) * 1992-05-21 1994-07-12 Photon, Inc. Measuring laser beam parameters using non-distorting attenuation and multiple simultaneous samples
JP2809959B2 (ja) * 1993-01-29 1998-10-15 株式会社ニデック レ−ザビ−ムによるアブレーション装置およびその方法
US5384803A (en) 1993-02-22 1995-01-24 Lai; Shui T. Laser wave mixing and harmonic generation of laser beams
US5449879A (en) 1993-10-07 1995-09-12 Laser Machining, Inc. Laser beam delivery system for heat treating work surfaces
EP0964067B1 (fr) 1993-12-07 2002-09-04 Toyota Jidosha Kabushiki Kaisha Procédé de traitement par chocs laser utilisant un film en matériau absorbant la lumière
JP3373638B2 (ja) 1994-03-09 2003-02-04 株式会社東芝 レーザーピーニング方法
US6215097B1 (en) 1994-12-22 2001-04-10 General Electric Company On the fly laser shock peening
JP3141715B2 (ja) 1994-12-22 2001-03-05 松下電器産業株式会社 レーザ加工方法
US5525429A (en) 1995-03-06 1996-06-11 General Electric Company Laser shock peening surface enhancement for gas turbine engine high strength rotor alloy repair
US5569018A (en) 1995-03-06 1996-10-29 General Electric Company Technique to prevent or divert cracks
FR2735056B1 (fr) 1995-06-09 1997-08-22 Bouygues Offshore Installation pour travailler une zone d'un tube au moyen d'un faisceau laser et application aux tubes d'une canalisation sur une barge de pose en mer ou de recuperation de cette canalisation.
US5689363A (en) 1995-06-12 1997-11-18 The Regents Of The University Of California Long-pulse-width narrow-bandwidth solid state laser
US5741559A (en) 1995-10-23 1998-04-21 Lsp Technologies, Inc. Laser peening process and apparatus
US5674328A (en) 1996-04-26 1997-10-07 General Electric Company Dry tape covered laser shock peening
US5674329A (en) 1996-04-26 1997-10-07 General Electric Company Adhesive tape covered laser shock peening
JPH09314361A (ja) * 1996-05-24 1997-12-09 Amada Co Ltd レーザーによる表面焼入れ方法
JP3380416B2 (ja) 1997-02-05 2003-02-24 本田技研工業株式会社 レーザ溶接装置
US5986234A (en) 1997-03-28 1999-11-16 The Regents Of The University Of California High removal rate laser-based coating removal system
DE69706827T2 (de) * 1997-05-02 2002-03-28 Agilent Technologies Inc., A Delaware Corp. Wellenlängenmessgerät und eine Einrichtung zur Regelung der Wellenlänge einer Lichtquelle
DE19743493C2 (de) * 1997-10-01 2001-02-22 Mueller Wirts Thomas Verfahren und Vorrichtung zur Laserfrequenzmessung und -Stabilisierung
US6064035A (en) 1997-12-30 2000-05-16 Lsp Technologies, Inc. Process chamber for laser peening
US6409718B1 (en) * 1998-02-03 2002-06-25 Lasersight Technologies, Inc. Device and method for correcting astigmatism by laser ablation
US6198069B1 (en) 1998-08-13 2001-03-06 The Regents Of The University Of California Laser beam temporal and spatial tailoring for laser shock processing
JP2000117480A (ja) 1998-10-15 2000-04-25 Fanuc Ltd レーザ加工機
US6259055B1 (en) 1998-10-26 2001-07-10 Lsp Technologies, Inc. Apodizers for laser peening systems
US6288358B1 (en) 1998-12-15 2001-09-11 Lsp Technologies, Inc. Mobile laser peening system
US6392192B1 (en) 1999-09-15 2002-05-21 W. A. Whitney Co. Real time control of laser beam characteristics in a laser-equipped machine tool
CN1228460C (zh) 1999-07-19 2005-11-23 加利福尼亚大学董事会 通过激光硬化进行金属的成型
KR100348883B1 (ko) * 1999-09-03 2002-08-17 엘지전자주식회사 비점수차 방지 광픽업 장치
JP3288671B2 (ja) * 2000-02-17 2002-06-04 科学技術振興事業団 試料の物理的性質の測定装置
JP2002038222A (ja) * 2000-07-27 2002-02-06 Toshiba Corp 残留応力改善方法
JP3383832B2 (ja) 2000-12-25 2003-03-10 川崎重工業株式会社 レーザ照射装置
US6657160B2 (en) 2001-01-25 2003-12-02 The Regents Of The University Of California Laser peening of components of thin cross-section
US6867390B2 (en) 2001-04-30 2005-03-15 Lsp Technologies, Inc Automated positioning of mobile laser peening head
US6528763B1 (en) 2001-04-30 2003-03-04 Lsp Technologies, Inc. Laser search peening for exfoliation corrosion detection
EP1207417B1 (fr) * 2001-05-22 2004-08-04 Agilent Technologies, Inc. (a Delaware corporation) Unité de mesure corrigée en polarisation
US7095497B2 (en) * 2001-06-27 2006-08-22 Canon Kabushiki Kaisha Beam splitting apparatus, transmittance measurement apparatus, and exposure apparatus
DE10255037A1 (de) * 2002-11-26 2004-06-09 Kuka Roboter Gmbh Verfahren und Vorrichtung zum Bearbeiten eines Werkstücks
US7880117B2 (en) * 2002-12-24 2011-02-01 Panasonic Corporation Method and apparatus of drilling high density submicron cavities using parallel laser beams
JP4494045B2 (ja) * 2003-03-11 2010-06-30 株式会社半導体エネルギー研究所 ビームホモジナイザ及びレーザ照射装置、並びに半導体装置の作製方法
JP2005028438A (ja) 2003-07-11 2005-02-03 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
US7109436B2 (en) 2003-08-29 2006-09-19 General Electric Company Laser shock peening target
US7435927B2 (en) * 2004-06-18 2008-10-14 Electron Scientific Industries, Inc. Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset
US7851725B2 (en) * 2004-11-17 2010-12-14 Metal Improvement Company Llc Active beam delivery system with image relay
US7750266B2 (en) * 2004-11-17 2010-07-06 Metal Improvement Company Llc Active beam delivery system for laser peening and laser peening method
JP4988160B2 (ja) * 2005-02-08 2012-08-01 日産自動車株式会社 レーザ溶接装置、レーザ溶接システム、およびレーザ溶接方法
FR2889669B1 (fr) * 2005-08-12 2007-11-02 Snecma Piece metallique traitee par mise en compression de sous couches. procede pour obtenir une telle piece.
US7626152B2 (en) 2006-08-16 2009-12-01 Raytheon Company Beam director and control system for a high energy laser within a conformal window
US20080110869A1 (en) 2006-11-15 2008-05-15 Button International Co., Ltd. Method of machining mold surface using laser
JP5159516B2 (ja) * 2008-08-27 2013-03-06 株式会社東芝 レーザ照射装置
JP5221254B2 (ja) * 2008-08-28 2013-06-26 株式会社ディスコ レーザー加工装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5382770A (en) * 1993-01-14 1995-01-17 Reliant Laser Corporation Mirror-based laser-processing system with visual tracking and position control of a moving laser spot
US20050056626A1 (en) * 2003-09-12 2005-03-17 Orbotech Ltd Multiple beam micro-machining system and method
KR20070086487A (ko) * 2004-11-17 2007-08-27 메탈 임프루브먼트 컴퍼니 엘엘시 공기를 통한 가변 광 경로 세그먼트를 구비한 능동 빔 전달시스템

Also Published As

Publication number Publication date
EP2558242A4 (fr) 2013-10-16
US20110253690A1 (en) 2011-10-20
JP2013525113A (ja) 2013-06-20
ES2586148T3 (es) 2016-10-11
CA2795993C (fr) 2017-05-30
WO2011129922A2 (fr) 2011-10-20
CA2795993A1 (fr) 2011-10-20
JP6046033B2 (ja) 2016-12-14
WO2011129921A2 (fr) 2011-10-20
US8810792B2 (en) 2014-08-19
WO2011129922A3 (fr) 2012-01-05
EP2558242A2 (fr) 2013-02-20
US20110255088A1 (en) 2011-10-20
EP2558242B1 (fr) 2016-05-11
US10072971B2 (en) 2018-09-11
SG184894A1 (en) 2012-11-29

Similar Documents

Publication Publication Date Title
WO2011129921A3 (fr) Système de diffusion de faisceau souple pour systèmes laser de grande puissance
WO2011017000A3 (fr) Système optique pour laser de chirurgie ophtalmique
WO2010033723A3 (fr) Usinage photonique à l'aide de réseaux de faisceaux dynamiques
WO2012082930A3 (fr) Réduction de la réflexion arrière dans des systèmes de micro-usinage au laser
TWI369723B (en) Multi laser system
WO2010059210A3 (fr) Systèmes et procédés d'acheminement d'un faisceau laser de pilotage dans une source lumineuse à euv
WO2007061997A3 (fr) Systeme, procede et dispositif d’orientation de faisceau grand angle, rapide et tres precise
WO2011156033A3 (fr) Source laser qui génère un faisceau de sortie changeant rapidement
WO2009055687A3 (fr) Dispositif de source d'énergie laser et procédé
WO2011017002A3 (fr) Système optique avec lentille mobile pour laser de chirurgie ophtalmique
TWI317821B (en) Systems and methods for generating laser light shaped as a line beam
WO2006078920A8 (fr) Systeme et procede de traitement de matiere a laser, precis, a grande vitesse
WO2009155280A3 (fr) Réduction des rétroréflexions dans des systèmes de traitement au laser
EP1886826A3 (fr) Procédé et dispositif destiné au marquage d'objets individuels
WO2008118781A3 (fr) Procédés, agencements et dispositif destinés à utiliser un laser à balayage de longueur d'onde utilisant un balayage angulaire et des procédures de dispersion
WO2006057856A3 (fr) Systeme d'emission de faisceau actif pour martelage au laser et procede de martelage au laser
WO2009023280A3 (fr) Procédé d'usinage laser utilisant un angle d'inclinaison variable
WO2011022547A3 (fr) Systèmes et procédés de réglage de faisceau angulaire pour systèmes lasers
WO2011091170A3 (fr) Homogénéisation d'un rayonnement couplé à des fibres en champ lointain
TW200942858A (en) Laser projection utilizing beam misalignment
WO2009136270A3 (fr) Appareil d'éclairage de scène et procédé de commande de l'orientation d'un faisceau de lumière émis par ledit appareil
WO2009007721A3 (fr) Appareil et procede pour un traitement au laser d'un materiau
WO2010047934A3 (fr) Procédés et systèmes de traitement du cancer en utilisant le rayonnement d’un faisceau externe
WO2009025261A1 (fr) Dispositif de balayage à multiples faisceaux
TW200726565A (en) Laser processing apparatus using laser beam splitting

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11769234

Country of ref document: EP

Kind code of ref document: A2

ENP Entry into the national phase

Ref document number: 2795993

Country of ref document: CA

ENP Entry into the national phase

Ref document number: 2013504895

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2011769234

Country of ref document: EP