WO2011129325A1 - Bobine supraconductrice et procédé de fabrication associé - Google Patents

Bobine supraconductrice et procédé de fabrication associé Download PDF

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Publication number
WO2011129325A1
WO2011129325A1 PCT/JP2011/059078 JP2011059078W WO2011129325A1 WO 2011129325 A1 WO2011129325 A1 WO 2011129325A1 JP 2011059078 W JP2011059078 W JP 2011059078W WO 2011129325 A1 WO2011129325 A1 WO 2011129325A1
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layer
superconducting
superconducting wire
adhesive layer
superconducting coil
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PCT/JP2011/059078
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English (en)
Japanese (ja)
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真司 藤田
正志 原口
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株式会社フジクラ
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F6/00—Superconducting magnets; Superconducting coils
    • H01F6/06—Coils, e.g. winding, insulating, terminating or casing arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
    • H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
    • H01B12/06—Films or wires on bases or cores
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
    • Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment

Definitions

  • the present invention relates to a superconducting coil and a method for manufacturing a superconducting coil.
  • Superconducting coils are used in various applications such as magnetic resonance imaging equipment (MRI) or superconducting magnetic energy storage equipment (SMES).
  • metallic superconductors such as NbTi have been widely used as superconducting wires constituting superconducting coils.
  • bismuth superconductors such as Bi 2 Sr 2 CaCu 2 O 8 + ⁇ (Bi2212) and Bi 2 Sr 2 Ca 2 Cu 3 O 10 + ⁇ (Bi2223), or REBa 2 Cu 3 O 7- ⁇ (RE123, RE: Development of oxide high-temperature superconducting wires using rare earth-based superconductors represented by rare earth elements is progressing. Since this oxide high-temperature superconducting wire has a critical temperature higher than that of metal superconducting wires, it can be used at higher temperatures, and development of application to coils and the like is also progressing.
  • One of the manufacturing processes of an oxide superconducting coil is an impregnation process in which a superconducting wire is fixed and the coil is integrated.
  • a vacuum impregnation method using an epoxy resin for example, see Patent Document 1
  • a thermosetting resin is bonded to the glass fiber to prepare a semi-cured glass tape made of a thermosetting resin, and this glass tape is wound together with the superconducting wire, and the glass tape and the superconducting wire are heated.
  • a method of integrating is disclosed.
  • JP 2001-189226 A Japanese Patent Laid-Open No. 11-168008
  • the present invention has been made in view of such a conventional situation, and is capable of suppressing deterioration that occurs when a superconducting wire is used at a low temperature and having a good current density, and a method for manufacturing a superconducting coil.
  • the purpose is to provide.
  • a superconducting coil according to the first aspect of the present invention includes a base material, an intermediate layer provided on the base material, an oxide superconducting layer provided on the intermediate layer, and the oxidation
  • a superconducting wire comprising a metal layer provided on the superconducting layer, an adhesive layer, and a buffer layer disposed between the adhesive layer and the metal layer of the superconducting wire, wherein the superconducting wire is It is formed so as to be wound through an adhesive layer.
  • it is preferable that a plurality of buffer layers are disposed between the adhesive layer and the metal layer of the superconducting wire.
  • the superconducting coil according to the first aspect of the present invention includes an inner adhesive layer provided at a position close to the superconducting wire, and an outer adhesive layer provided at a position further away from the superconducting wire than the inner adhesive layer. It is preferable.
  • the adhesive layer is preferably a layer obtained by curing a semi-cured thermosetting resin.
  • the buffer layer is preferably an insulating layer.
  • the insulating layer is preferably made of a polyimide tape.
  • the buffer layer is preferably a stabilization layer.
  • the stabilizing layer is preferably made of copper or a nichrome alloy.
  • the oxide superconducting layer includes REBa 2 Cu 3 O y (wherein RE represents a rare earth element, and 6.5 ⁇ y ⁇ 7.1) or (wherein, n is 2 or 3.) Bi 2 Sr 2 Ca n-1 Cu n O 4 + 2n + ⁇ is preferably made of composed oxide superconductor composition.
  • a polyimide tape or a tape in which a semi-cured thermosetting resin is laminated on one side or both sides of the polyimide tape is wrapped around the superconducting wire. It is preferable.
  • the method of manufacturing a superconducting coil according to the second aspect of the present invention includes a base material, an intermediate layer provided on the base material, an oxide superconducting layer provided on the intermediate layer, and an oxide superconducting layer. A superconducting wire provided with the formed metal layer is prepared, and the superconducting wire is wound so that a buffer layer is disposed between the adhesive layer and the metal layer of the superconducting wire.
  • a polyimide tape or a tape in which a semi-cured thermosetting resin is laminated on one or both sides of the polyimide tape is wrapped around the superconducting wire. It is preferable.
  • a tape with an adhesive layer in which a semi-cured thermosetting resin is formed on one or both surfaces of the tape-shaped buffer layer is prepared, and the adhesive layer is attached. It is preferable to wind a tape around the superconducting wire.
  • the superconducting wire is loaded at a low temperature due to the difference in thermal shrinkage between the adhesive layer and the superconducting wire. Stress is reduced by the buffer layer. Therefore, it is possible to effectively suppress deterioration of superconducting characteristics due to this stress. Further, by preparing a laminated tape integrated by laminating a buffer layer and an adhesive layer, and using a coated superconducting wire formed by winding this laminated tape around the superconducting wire, a coated superconducting wire is obtained. Since the thickness can be reduced, a decrease in the current density of the superconducting coil can be effectively suppressed. In particular, when a prepreg is used as the adhesive layer and a resin tape such as polyimide is used as the buffer layer, the above effect can be obtained.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of a superconducting coil according to the present invention and an example of a superconducting coil device using the superconducting coil.
  • FIG. 2A is a schematic perspective view showing an example of a coated superconducting wire provided in the superconducting coil shown in FIG. 2B is a schematic perspective view showing an example of a superconducting wire provided in the superconducting coil shown in FIG.
  • the superconducting coil A of this embodiment is formed by winding a tape-shaped superconducting wire 10 around a cylindrical winding frame 2 via a buffer layer 20 and an adhesive layer 30.
  • the reel 2 is provided with flange portions 2a and 2a at both ends thereof.
  • a buffer layer 20, an adhesive layer 30, and a buffer layer 20 are arranged in this order between the superconducting wires 10 of each turn adjacent to the radial direction of the winding frame 2.
  • the coil device S shown in FIG. 1 has a configuration in which the superconducting wire 10 is wound around the outer peripheral surface of the winding frame 2 so as to have the required number of layers.
  • the superconducting wire 10 used in the superconducting coil A of the present embodiment includes an intermediate layer 12, an oxide superconducting layer 13, and a metal layer 14 on a long tape-like base material 11. It has the structure laminated
  • the base material 11 a base material that can be used as a normal superconducting wire is used.
  • the shape of the substrate 11 is preferably a long plate shape or a sheet shape.
  • a material made of a heat-resistant metal is preferable.
  • heat resistant metals an alloy is preferable, and a nickel (Ni) alloy or a copper (Cu) alloy is more preferable.
  • Hastelloy registered trademark, manufactured by Haynes Co., Ltd.
  • Hastelloy is preferable if it is a commercial product, and has a different amount of components such as molybdenum (Mo), chromium (Cr), iron (Fe), cobalt (Co), etc.
  • the thickness of the substrate 11 may be appropriately adjusted according to the purpose, and is usually preferably 10 to 500 ⁇ m, and more preferably 20 to 200 ⁇ m. If the thickness of the base material 11 is 10 ⁇ m or more, the strength required for the superconducting wire 10 can be obtained, but if the thickness is 20 ⁇ m or more, this strength is further improved, which is preferable. On the other hand, if the thickness of the substrate 11 is 500 ⁇ m or less, the critical current density required for the superconducting wire 10 can be obtained, but it is preferable to make this thickness 200 ⁇ m or less because the critical current density can be further improved. .
  • the intermediate layer 12 controls the crystal orientation of the oxide superconducting layer 13 and prevents the metal element in the base material 11 from diffusing into the oxide superconducting layer 13.
  • the intermediate layer 12 functions as a buffer layer that alleviates the difference in physical properties (thermal expansion coefficient, lattice constant, etc.) between the base material 11 and the oxide superconducting layer 13.
  • the material of the intermediate layer 12 is preferably a metal oxide whose physical characteristics show intermediate values between the substrate 11 and the oxide superconducting layer 13.
  • preferred materials for the intermediate layer 12 are Gd 2 Zr 2 O 7 , MgO, ZrO 2 —Y 2 O 3 (YSZ), SrTiO 3 , CeO 2 , Y 2 O 3 , Al 2 O 3 , Gd 2.
  • the intermediate layer 12 may be a single layer or a plurality of layers.
  • the layer made of the metal oxide preferably has crystal orientation, and in the case of a plurality of layers, the outermost layer (layer adjacent to the oxide superconducting layer 13). Preferably have at least crystal orientation.
  • the intermediate layer 12 may have a multi-layer structure in which a cap layer is further laminated on the metal oxide layer.
  • the cap layer has a function of controlling the orientation of the oxide superconducting layer 13 and a function of preventing the elements constituting the oxide superconducting layer 13 from diffusing into the intermediate layer 12, or the oxide superconducting layer 13. It has a function of suppressing the reaction of the gas used when laminating with the intermediate layer 12.
  • the orientation of the cap layer is controlled by the metal oxide layer.
  • the cap layer is epitaxially grown on the surface of the metal oxide layer, and then undergoes a process of grain growth (overgrowth) in the lateral direction (plane direction), and crystal grains are selectively grown in the in-plane direction.
  • the formed layer is preferable.
  • Such a cap layer has a higher degree of in-plane orientation than the metal oxide layer.
  • the material of the cap layer is not particularly limited as long as it can exhibit the above functions, but specific examples of preferable materials are CeO 2 , Y 2 O 3 , Al 2 O 3 , Gd 2 O 3 , Zr. 2 O 3 , Ho 2 O 3 , Nd 2 O 3 and the like.
  • the cap layer may include a Ce—M—O-based oxide in which part of Ce is substituted with another metal atom or metal ion.
  • the thickness of the intermediate layer 12 may be appropriately adjusted according to the purpose, but is usually 0.1 to 5 ⁇ m.
  • the thickness of the cap layer is usually 0.1 to 1.5 ⁇ m.
  • the intermediate layer 12 is formed by physical vapor deposition such as sputtering, vacuum vapor deposition, laser vapor deposition, electron beam vapor deposition, ion beam assisted sputtering (hereinafter abbreviated as IBAD method), chemical vapor deposition (CVD), or the like.
  • IBAD method ion beam assisted sputtering
  • CVD chemical vapor deposition
  • the metal oxide layer formed by the IBAD method is preferable in that the crystal orientation is high and the effect of controlling the crystal orientation of the oxide superconducting layer 13 or the cap layer is high.
  • the IBAD method is a method of orienting crystal axes by irradiating an ion beam at a predetermined angle with respect to a crystal deposition surface when depositing a metal oxide.
  • an argon (Ar) ion beam is used as the ion beam.
  • the intermediate layer 12 made of Gd 2 Zr 2 O 7 , MgO or ZrO 2 —Y 2 O 3 (YSZ) can reduce the value of ⁇ (FWHM: full width at half maximum), which is an index representing the degree of orientation in the IBAD method. Therefore, it is particularly suitable.
  • a bed layer may be interposed between the intermediate layer 12 and the base material 11 as necessary.
  • the bed layer has high heat resistance and reduces interfacial reactivity between the intermediate layer 12 and the substrate 11.
  • This bed layer is also used to obtain the orientation of the film (intermediate layer 12) disposed thereon.
  • Such a bed layer is made of, for example, yttria (Y 2 O 3 ), silicon nitride (Si 3 N 4 ), aluminum oxide (Al 2 O 3 , also referred to as “alumina”), or the like.
  • This bed layer is formed on the substrate 11 by a film forming method such as sputtering, and has a thickness of 10 to 200 nm, for example.
  • a structure in which a diffusion preventing layer is interposed between the base material 11 and the bed layer may be used.
  • the diffusion preventing layer prevents the constituent elements of the base material 11 from diffusing into the bed layer.
  • This diffusion prevention layer is made of silicon nitride (Si 3 N 4 ), aluminum oxide (Al 2 O 3 ), or a rare earth metal oxide, and has a thickness of, for example, 10 to 400 nm. Since the crystallinity of the diffusion preventing layer is not limited, it may be formed by a film forming method such as a normal sputtering method.
  • the diffusion preventing layer between the base material 11 and the bed layer, it is possible to effectively diffuse a part of the constituent elements of the base material 11 into the oxide superconducting layer 13 through the bed layer. Can be suppressed.
  • the base material 11 is necessarily heated or heat-treated, and as a result, the base material 11 receives a thermal history. .
  • a diffusion prevention layer as mentioned above, it can suppress effectively that a part of component element of the base material 11 diffuses into the oxide superconducting layer 13 via a bed layer.
  • An example of a case where a diffusion preventing layer is interposed between the base material 11 and the bed layer includes a combination using Al 2 O 3 as the diffusion preventing layer and Y 2 O 3 as the bed layer.
  • a material including an oxide superconductor having a generally known composition can be widely applied.
  • REBa 2 Cu 3 O y (wherein RE represents a rare earth element such as Y, La, Nd, Sm, Er, Gd, etc., and 6.5 ⁇ y ⁇ 7.1) or Bi.
  • a material containing an oxide superconductor represented by a composition of 2 Sr 2 Ca n-1 Cu n O 4 + 2n + ⁇ (where n is 2 or 3) can be used.
  • the oxide superconducting layer 13 is formed by a physical vapor deposition method such as sputtering, vacuum vapor deposition, laser vapor deposition, electron beam vapor deposition, chemical vapor deposition (CVD), or the like; coating pyrolysis (MOD), etc. It can be laminated on the layer 12, and it is particularly preferable to use a laser vapor deposition method.
  • the oxide superconducting layer 13 has a thickness of about 0.5 to 5 ⁇ m and preferably a uniform thickness.
  • the metal layer 14 functions as a current bypass when a partial region of the oxide superconducting layer 13 attempts to transition to the normal conducting state, thereby stabilizing the state of the oxide superconducting layer 13 and generating heat. This suppresses burning of the oxide superconducting layer 13.
  • the metal layer 14 is preferably a metal having good conductivity, and specifically includes a metal made of silver or a silver alloy.
  • the structure of the metal layer 14 may be a single layer structure or a laminated structure of two or more layers.
  • the thickness of the metal layer 14 is preferably 1 to 30 ⁇ m. By setting the thickness of the metal layer 14 to 1 ⁇ m or more, a higher effect of stabilizing the oxide superconducting layer 13 can be obtained.
  • the superconducting wire 10 can be thinned.
  • the metal layer 14 can be laminated
  • the superconducting wire 10 having such a configuration is provided with a buffer layer 20 so as to cover the outer peripheral surface, and further, an adhesive layer 30 is provided on the outer peripheral surface of the buffer layer 20.
  • a coated superconducting wire 1 is formed. By winding the coated superconducting wire 1 around the winding frame 2, a superconducting coil A as shown in FIG. 1 can be formed.
  • the buffer layer 20 is provided between the superconducting wire 10 and the adhesive layer 30.
  • the thermal shrinkage rate of the adhesive layer 30 is different from the thermal shrinkage rate of the superconducting wire 10. Accordingly, stress is applied to the superconducting wire 10. Due to this stress, the characteristics of the superconducting wire 10 are deteriorated.
  • the buffer layer 20 is preferably an insulating layer or a stabilization layer.
  • the insulating layer that is the buffer layer 20 is made of an insulating resin.
  • the material for the insulating layer include polyimide resin, polyamide resin, epoxy resin, acrylic resin, phenol resin, melamine resin, polyester resin, silicon resin, silicon resin, alkyd resin, and vinyl resin.
  • the thickness of the insulating layer is not particularly limited and can be adjusted as appropriate. However, it is possible to effectively suppress the thermal contraction due to the low temperature of the adhesive layer 30 from affecting the superconducting wire 10 and to reduce the current density as much as possible. In order to suppress it, the thickness of the insulating layer is preferably 25 to 50 ⁇ m.
  • the formation method for example, the method of apply
  • the structure of the insulating layer that is the buffer layer 20 it is preferable to use a structure formed by winding a polyimide tape obtained by processing a polyimide resin into a tape shape around the superconducting wire 10.
  • the buffer layer 20 can be manufactured inexpensively and easily, and the effect of suppressing deterioration of the superconducting wire 10 is also high.
  • the superconducting wire 10 adjacent in the radial direction of the superconducting coil A can be insulated in addition to the above-described effects.
  • the material of the stabilization layer that is the buffer layer 20 examples include materials made of metal such as copper, Cu—Zn alloy, Cu—Ni alloy, Ni—Cr alloy, nickel, and stainless steel. This material is inexpensive and preferable.
  • the thickness of the stabilization layer is not particularly limited and can be adjusted as appropriate. However, since the thermal contraction of the adhesive layer 30 at a low temperature on the superconducting wire 10 can be effectively suppressed, the stabilization layer The thickness is preferably 10 to 300 ⁇ m.
  • the stabilization layer may be formed by a known method. For example, the stabilization layer may be formed by sputtering, or a tape-shaped metal may be provided around the superconducting wire 10 via solder.
  • the periphery of the superconducting wire 10 may be covered with a metal by a plating method.
  • solder material Sn-based materials (Sn—Cu based, Sn—Ag based, Sn—Ag—Cu based, etc.) can be used. Even when a stabilization layer is provided as the buffer layer 20, the above-described effect of suppressing the deterioration of the characteristics of the superconducting wire 10 due to the low temperature or the effect of suppressing the decrease of the current density can be obtained.
  • the stabilizing layer functions as a bypass path along with the metal layer 14 through which the current flowing through the oxide superconducting layer 13 is commutated. Thereby, a higher effect of stabilizing the state of the oxide superconducting layer 13 can be obtained.
  • the adhesive layer 30 has adhesiveness to the buffer layer 20. After the adhesive layer 30 is wound around the winding frame 2 together with the superconducting wire 10, the adhesive layer 30 is cured by heating, the winding structure of the superconducting wire 10 is fixed, and the superconducting coil A is formed. If such a forming method can be realized, the type of the adhesive layer 30 is not particularly limited. Specifically, the structure of the adhesive layer 30 includes a structure formed of a thermosetting resin, and the state of the coated superconducting wire 1 before being wound around the winding frame 2 is a semi-cured heat. A curable resin is preferred.
  • thermosetting resin that forms the adhesive layer 30 is not particularly limited as long as it is a resin that is cured by heating, and examples thereof include an epoxy resin, a phenol resin, an alkyd resin, a polyimide resin, and a silicon resin.
  • the adhesive layer 30 is more preferably a so-called prepreg which is made semi-cured by drying after impregnating the thermosetting resin with paper or cloth. By using a prepreg as the adhesive layer 30, the handling property at the time of winding the superconducting wire 10 (coated superconducting wire 1) is further improved.
  • the thickness of the adhesive layer 30 is not particularly limited and can be adjusted as appropriate. However, while suppressing the decrease in current density as much as possible while firmly fixing each superconducting wire 10 that is wound and adjacent in the radial direction of the winding frame 2.
  • the thickness of the adhesive layer 30 is preferably 5 to 100 ⁇ m.
  • the formation method of the contact bonding layer 30 is not specifically limited. For example, a method in which a semi-cured thermosetting resin is formed by applying a thermosetting resin to the superconducting wire 10 on which the buffer layer 20 is formed is dried. Moreover, the method of coat
  • the adhesive layer 30 can be formed.
  • the winding structure of the superconducting wire 10 is fixed and formed by winding the coated superconducting wire 1 around the winding frame 2 and curing the adhesive layer 30 by heating.
  • the heating temperature and time at this time can be appropriately changed depending on the type or thickness of the thermosetting resin constituting the adhesive layer 30.
  • the heating temperature is 120 to 150 ° C. and the heating time is about 2 to 3 hours. is there. Under such conditions, the superconducting coil A in which the winding structure of the superconducting wire 10 is firmly fixed can be formed.
  • the buffer layer 20 is directed to the superconducting wire 10 in a laminate (laminated body) integrated by stacking the buffer layer 20 and the adhesive layer 30.
  • a laminate laminate
  • a semi-cured thermosetting resin adheresive layer 30
  • a prepreg is formed on one surface of a tape (buffer layer 20) formed of a resin such as polyimide.
  • a laminated body hereinafter sometimes referred to as “buffer layer tape T with an adhesive layer”.
  • a polyimide tape with a prepreg in which a prepreg containing an epoxy resin is provided on one surface of a tape formed of a polyimide resin.
  • FIGS. 3A and 3B As a method for providing such a buffer layer tape T with an adhesive layer around the superconducting wire 10, specifically, a method shown in FIGS. 3A and 3B can be cited.
  • the buffer layer with the adhesive layer is halved (1/2 L) of the width L for each winding so that the buffer layer 20 faces the superconducting wire 10 and the adhesive layer 30 faces the outside.
  • the buffer layer tape T with an adhesive layer having a width L is wound around the superconducting wire 10 so that the layer tapes T overlap each other (hereinafter, this method may be referred to as “1/2 wrap winding”).
  • the buffer layer tape T with the adhesive layer is formed in a spiral shape on the superconducting wire 10 so that the buffer layer tapes T overlap each other.
  • the buffer layer 20 and the adhesive layer 30 can be easily provided on the superconducting wire 10 by winding the buffer layer tape T with the adhesive layer around the outer periphery of the superconducting wire 10 by this 1/2 wrap winding.
  • the buffer layer tape T with the adhesive layer is overlapped by 1/2 L each time it is wound, so that the effect of suppressing the deterioration of characteristics that occurs when the coated superconducting wire 1 is used at a low temperature, and the superconducting wire 10 Insulation, adhesion, and airtightness can be further improved as compared with the configuration shown in FIG. 2A.
  • the buffer layer tape T with the adhesive layer is wound around the superconducting wire 10 by 1/2 wrapping and wound around the winding frame 2
  • the buffer layer 20 the adhesive layer 30, the buffer layer 20, and the adhesive A four-layer structure in which the layers 30 are provided in this order is formed around the superconducting wire 10.
  • the buffer layer tape T with an adhesive layer having a width L is not overlapped for each winding so that the buffer layer 20 faces the superconducting wire 10 and the adhesive layer 30 faces the outside.
  • a buffer layer tape T with an adhesive layer having a width L is wound around the superconducting wire 10 (hereinafter, this method may be referred to as “butt wrap winding”).
  • the buffer layer tape T with the adhesive layer is spirally formed on the superconducting wire 10 so that the buffer layer tapes T do not overlap and the side surfaces of the adjacent buffer layer tapes T are in contact with each other. Formed.
  • the buffer layer 20 and the adhesive layer 30 can be easily provided on the superconducting wire 10 by winding the buffer layer tape T with the adhesive layer around the outer periphery of the superconducting wire 10 by this butt wrapping. Furthermore, since the buffer layer tape T with an adhesive layer having a width L is wound so as not to overlap each time it is wound, the coated superconducting wire 1 can be thinned. Furthermore, in addition to the effect of suppressing deterioration of characteristics when the coated superconducting wire 1 is used at a low temperature, and the insulation and adhesiveness of the superconducting wire 10, the effect of suppressing the decrease in the current density of the superconducting coil A, It is improved compared with the case where the conventional glass tape is used.
  • the superconducting coil A of this embodiment has a configuration in which a buffer layer 20 is provided around the superconducting wire 10 and an adhesive layer 30 is provided around the buffer layer 20. For this reason, it can suppress effectively that a stress is applied to the superconducting wire 10 by shrinkage
  • the coated superconducting wire 1 formed by winding a laminated tape integrated by laminating the buffer layer 20 and the adhesive layer 30 is formed on the winding frame 2 and the superconducting wire 10.
  • the superconducting coil A has a configuration in which a prepreg is used as the adhesive layer 30 and a resin tape such as polyimide is used as the buffer layer 20, the coated superconducting wire 1 is thinned, and the current density is effectively reduced. Can be suppressed.
  • the coated superconducting wire 1 having a configuration in which the buffer layer 20 is provided around the superconducting wire 10 and the adhesive layer 30 is provided around the buffer layer 20 is provided on the reel 2.
  • the superconducting coil A formed by being wound around is described.
  • the present invention is not limited to this.
  • the superconducting wire 10 is wound around the winding frame 2 via the adhesive layer 30, and the buffer layer 20 is interposed between the adhesive layer 30 and the metal layer 14 of the superconducting wire 10. Any superconducting coil A may be used. Therefore, a superconducting coil can be formed using a coated superconducting wire having another configuration and structure.
  • second to ninth embodiments of the present invention will be described.
  • the configuration of the coated superconducting wire is different from that of the first embodiment described above, but the same configuration is adopted for the superconducting wire and the superconducting coil which are the other parts. Therefore, in the following description, the configuration of the coated superconducting wire will be mainly described, and description of other parts will be omitted. Moreover, in the following embodiment, the same code
  • FIG. 4A is a schematic cross-sectional view of a coated superconducting wire 1B used in the superconducting coil according to the second embodiment of the present invention.
  • the coated superconducting wire 1B of the present embodiment has a configuration in which the second buffer layer 22, the first buffer layer 21, and the adhesive layer 31 are provided in this order around the superconducting wire 10.
  • the 1st buffer layer 21 and the contact bonding layer 31 are integrated by laminating
  • resin tape T 1 with a single-sided adhesive layer examples include the same material as that of the buffer layer 20 of the first embodiment.
  • a resin tape such as polyimide is wound around the superconducting wire 10, and then the adhesive layer 31 faces outward on the superconducting wire 10 around which the resin tape is wound. how to wind the used single-sided adhesive layer with the resin tape T 1 in.
  • the tape winding method described above or the number of tapes used is the same as in the first embodiment.
  • the coated superconducting wire 1B of the present embodiment has a configuration in which the superconducting wire 10 is further covered with a second buffer layer 22 in addition to the configuration of the first embodiment. Accordingly, even when the adhesive layer 31 contracts due to use at a low temperature, the superconducting wire 10 is stressed due to the contraction and the characteristics of the superconducting wire 10 are deteriorated in the case of the first embodiment. It can suppress even more effectively than. Therefore, in the superconducting coil of the present embodiment, in addition to the effects of the first embodiment, even when a larger stress is applied to the superconducting wire 10 than in the case of the first embodiment, it is possible to prevent deterioration of the characteristics of the superconducting wire 10. .
  • FIG. 4B is a schematic cross-sectional view of a coated superconducting wire 1C used in the superconducting coil of the third embodiment of the present invention.
  • the coated superconducting wire 1C of this embodiment has a configuration in which a second buffer layer 22, an adhesive layer 31, a first buffer layer 21, and an adhesive layer 31 are provided in this order around the superconducting wire 10.
  • the two adhesive layers 31 and the first buffer layer 21 are integrated by being laminated, that is, the adhesive layers 31 and 31 such as prepregs on both surfaces of the first buffer layer 21 such as polyimide.
  • Is formed from a resin tape T 2 hereinafter sometimes referred to as “resin tape T 2 with a double-sided adhesive layer”).
  • the second buffer layer 22 is the same as the second buffer layer 22 of the second embodiment.
  • the two adhesive layers 31 are an inner adhesive layer provided at a position close to the superconducting wire 10 and an outer adhesive layer provided at a position farther from the superconducting wire 10 than the inner adhesive layer.
  • one inner adhesive layer is provided between the outer adhesive layer and the superconducting wire 10, but a plurality of inner adhesive layers may be provided.
  • a resin tape such as polyimide is wound around the superconducting wire 10
  • the superconducting wire 10 around which the resin tape is wound is wrapped around the resin tape T 2 with a double-sided adhesive layer. A method of further winding is formed.
  • the structure of the coated superconducting wire 1C of the present embodiment includes a resin tape in which the second buffer layer 22 and the adhesive layer 31 are laminated, and the first buffer layer 21 and the adhesive layer.
  • the structure using the resin tape on which 31 is laminated may be used.
  • As the structure of a resin tape shown in single-sided adhesive layer with the resin tape T 1 of the aforementioned second embodiment structure is employed. In the present embodiment, it may be formed by winding two such resin tapes. The tape winding method described above or the number of tapes used is the same as in the first embodiment.
  • the coated superconducting wire 1C of the present embodiment has a configuration in which the superconducting wire 10 is further covered with the second buffer layer 22 and the adhesive layer 31 in addition to the configuration of the first embodiment. Thereby, in addition to the effect of 1st Embodiment, the airtightness or insulation of the superconducting wire 10 can be improved further.
  • FIG. 4C is a schematic cross-sectional view of a coated superconducting wire 1D used in the superconducting coil according to the fourth embodiment of the present invention.
  • the third buffer layer 23 is laminated on the upper surface 10a of the metal layer 14 of the superconducting wire 10.
  • the 1st buffer layer 21 and the contact bonding layer 31 are provided in this order around the laminated body comprised by the superconducting wire 10 and the 3rd buffer layer 23.
  • the first buffer layer 21 and adhesive layer 31 are integrated by stacking, to form a single-sided adhesive layer with the resin tape T 1.
  • Examples of the material of the third buffer layer 23 include the same material as that of the stabilization layer that is the buffer layer 20 of the first embodiment.
  • a stabilization layer (third buffer layer 23) is laminated on the metal layer 14 of the superconducting wire 10 by bonding a metal tape made of copper or the like with solder.
  • the single-sided adhesive layer-attached resin tape T 1 is wound around the superconducting wire 10 and the third buffer layer 23 so that the adhesive layer 31 faces outward.
  • the tape winding method described above or the number of tapes used is the same as in the first embodiment.
  • the superconducting wire 10 usually has a width of about 5 to 10 mm and a thickness of about 100 to 200 ⁇ m. Therefore, when a stress is applied to the superconducting wire 10, the influence of the stress generated from the side surface of the superconducting wire 10 is small. On the other hand, since the upper surface of the superconducting wire 10 occupies a large area in the wire and is close to the oxide superconducting layer 13, the influence of the stress applied from the upper surface of the superconducting wire 10 is increased. Therefore, as in this embodiment, the use of the configuration in which the third buffer layer 23 is further provided on the upper surface (the upper surface of the metal layer) 10a of the superconducting wire 10 causes the adhesive layer 31 to contract due to use at a low temperature.
  • the stress applied to the superconducting wire 10 and the deterioration of the characteristics of the superconducting wire 10 can be suppressed more effectively than in the case of the first embodiment. Therefore, in the superconducting coil of the present embodiment, in addition to the effects of the first embodiment, even when a larger stress is applied to the superconducting wire 10 than in the case of the first embodiment, the deterioration of the characteristics of the superconducting wire 10 can be suppressed. .
  • FIG. 4D is a schematic cross-sectional view of a coated superconducting wire 1E used in the superconducting coil according to the fifth embodiment of the present invention.
  • the third buffer layer 23 is laminated on the upper surface 10a of the metal layer 14 of the superconducting wire 10.
  • an adhesive layer 31, a first buffer layer 21, and an adhesive layer 31 are provided in this order around the laminate formed by the superconducting wire 10 and the third buffer layer 23.
  • the coated superconducting wire 1E of the present embodiment has a configuration in which an adhesive layer 31 is provided around the laminate formed by the superconducting wire 10 and the third buffer layer 23 in addition to the configuration of the fourth embodiment. .
  • the adhesive layer 31 touches the side surface of the superconducting wire 10.
  • the third buffer layer 23 that is small and provided on the upper surface can suppress the influence of stress on the superconducting wire 10. Therefore, the superconducting coil of the present embodiment can achieve the same effects as the superconducting coil A of the fourth embodiment.
  • surroundings of the superconducting wire 10 and the 3rd buffer layer 23 are covered with the contact bonding layer 31, the insulation or airtightness of the superconducting wire 10 is improved rather than the case of 4th Embodiment.
  • FIG. 5A is a schematic cross-sectional view of a coated superconducting wire 1F used in a superconducting coil according to a sixth embodiment of the present invention.
  • a third buffer layer 23 is provided on the upper surface (upper surface of the metal layer 14) 10a of the superconducting wire 10. It has a configuration. Therefore, in addition to the effects of the second embodiment, even when the adhesive layer 31 contracts when used at a low temperature, the superconducting wire 10 is stressed and the characteristics of the superconducting wire 10 deteriorate. Further, it can be suppressed more effectively than in the case of the second embodiment.
  • FIG. 5B is a schematic cross-sectional view of a coated superconducting wire 1G used in the superconducting coil according to the seventh embodiment of the present invention.
  • the coated superconducting wire 1G of the present embodiment has a configuration in which a third buffer layer 23 is provided on the upper surface (upper surface of the metal layer 14) 10a of the superconducting wire 10 in addition to the configuration of the coated superconducting wire 1C of the third embodiment.
  • a third buffer layer 23 is provided on the upper surface (upper surface of the metal layer 14) 10a of the superconducting wire 10 in addition to the configuration of the coated superconducting wire 1C of the third embodiment.
  • FIG. 5C is a schematic cross-sectional view of a coated superconducting wire 1H used for the superconducting coil of the eighth embodiment of the present invention.
  • the second buffer layer 22 is provided around the superconducting wire 10, and the adhesive layer 31, the first buffer layer 21, and the adhesive layer 31 are formed on the upper surface of the second buffer layer 22.
  • the first buffer layer 21 and the two adhesive layers 31, 31 are a resin tape T 2 with a double-sided adhesive layer integrated by laminating a plurality of layers. Is formed.
  • the material of the second buffer layer 22 examples include the same material as that of the buffer layer 20 of the first embodiment.
  • the method of forming the coating superconducting wire 1H for example, the second buffer layer 22 is formed by winding a resin tape such as polyimide superconducting wire 10, then, a double-sided adhesive layer with the resin tape T 2, the second It is provided on the upper surface of the buffer layer 22 along the longitudinal direction of the wire (hereinafter sometimes referred to as “longitudinal attachment”). Even if the configuration in which the adhesive layer 31 is provided only on the upper surface of the superconducting wire 10 as in this embodiment, when the coated superconducting wire 1H is wound concentrically around the winding frame 2, it is adjacent in the radial direction of the winding frame 2.
  • An adhesive layer 31 is disposed between the superconducting wires 10 that perform. Therefore, by hardening the plurality of superconducting wires 1 adjacent to each other in the radial direction of the winding frame 2 by heating, each superconducting wire 10 can be fixed and a superconducting coil can be formed.
  • the superconducting coil of the present embodiment is formed from the coated superconducting wire 1H that is made thinner than the coated superconducting wire constituting the superconducting coils of the first to seventh embodiments, so that the effect of the first embodiment is achieved.
  • the current density can be further prevented from lowering than in the first embodiment.
  • FIG. 5D is a schematic cross-sectional view of a coated superconducting wire 1J used in the superconducting coil according to the ninth embodiment of the present invention.
  • the coated superconducting wire 1J of the present embodiment has a configuration in which a third buffer layer 23 is provided on the upper surface (upper surface of the metal layer 14) 10a of the superconducting wire 10 in addition to the configuration of the coated superconducting wire 1H of the eighth embodiment.
  • a third buffer layer 23 is provided on the upper surface (upper surface of the metal layer 14) 10a of the superconducting wire 10 in addition to the configuration of the coated superconducting wire 1H of the eighth embodiment.
  • each part constituting the superconducting coil is an example, and can be appropriately changed without departing from the scope of the present invention.
  • a 1.0 ⁇ m thick GdBa 2 Cu 3 O 7 (oxide superconducting layer) is formed on the Ce 2 O layer by a PLD method, and a 10 ⁇ m silver layer (metal layer) is formed on the oxide superconducting layer by a sputtering method.
  • a superconducting wire was produced by forming.
  • Example 1 A buffer layer (stabilization layer) was formed by laminating a 0.1 mm-thick copper tape on the silver layer (metal layer) of the superconducting wire produced above through solder. Next, a tape in which two polyimide tapes (12.5 ⁇ m thick) were stacked on the laminate formed by the superconducting wire and the buffer layer was wound by butt wrapping as shown in FIG. 3B. Next, a coated superconducting wire having a structure shown in FIG. 5D was produced by laminating (vertically attaching) a double-sided adhesive layer resin tape along the longitudinal direction of the wire on the laminate around which the tape was wound.
  • Example 1 In the double-sided adhesive layer resin tape, epoxy resin prepregs each having a thickness of 5.75 ⁇ m are laminated on both sides of a polyimide tape (12.5 ⁇ m thickness).
  • ⁇ Such a structure of Example 1 is indicated by “ ⁇ ” in “Example 1” of Table 1.
  • the obtained coated superconducting wire was concentrically wound around a cylindrical winding frame a plurality of times to produce a superconducting coil having an inner diameter of 70 mm and an outer diameter of 71 mm.
  • the superconducting coil was cooled in liquid nitrogen, and the critical current value (Ic0) was measured under a self-magnetic field. Then, after heating the same superconducting coil at 150 ° C.
  • the critical current value (Ic) was measured in liquid nitrogen under a self-magnetic field. . Further, the superconducting coil of Example 1 was evaluated based on a value (Ic / Ic0) obtained by dividing the critical current value (Ic) by the critical current value (Ic0). The measured value of the critical current value in Example 1 is shown on the right side of Table 1.
  • Example 2 to 21 and Comparative Examples 1 and 2 In Examples 2 to 21 and Comparative Examples 1 and 2, the same superconducting wire as the superconducting wire in Example 1 was used, and a superconducting coil was formed in the same manner as in Example 1.
  • the structures of “stabilizing layer”, “buffer layer (1)”, and “buffer layer (2) + adhesive layer” in Examples 2 to 21 and Comparative Examples 1 and 2 are shown in Table 1 as “ ⁇ ".
  • the measurement values of the critical current values in Examples 2 to 21 and Comparative Examples 1 and 2 are shown on the right side of Table 1.
  • the critical current values Ic0 and Ic were measured by the same measurement method as in Example 1, and the measurement was performed.
  • the superconducting coils of Examples 2 to 21 and Comparative Examples 1 and 2 were evaluated.
  • Examples 9,10,17,18, the configuration shown in FIG. 4A is.
  • Examples 5,6,13,14, the configuration shown in FIG. 4B (Example 5 and 13, with double-sided adhesive layer resin tape T 2 are stacked in double configuration) it is.
  • Example 20 has a structure as shown in FIG. 4C (structure-sided adhesive layer resin tape T 1 is stacked in a double).
  • Example 19 has a structure as shown in FIG. 4D (configuration with double-sided adhesive layer resin tape T 2 are stacked double).
  • Examples 7,8,15,16, the configuration shown in FIG. 5A (Example 7, 15, the one-sided adhesive layer resin tape T 1 is stacked in a double structure) is.
  • Example 2 the configuration shown in FIG. 5B (Example 2, 11 is with double-sided adhesive layer resin tape T 2 are stacked in double configuration) it is.
  • Example 4 has the configuration shown in FIG. 5C.
  • Example 21 is a coated superconducting wire having the configuration shown in FIG. 2A (a configuration in which buffer layer tapes T with adhesive layers are laminated in a double layer). In Comparative Example 1, a glass cloth prepreg tape was used.
  • Table 1 shows the total thickness of the buffer layer and the adhesive layer in each of the coated superconducting wires of Examples 1 to 21 and Comparative Examples 1 and 2. Also, Ic / Ic0 of each superconducting coil is calculated, and a superconducting coil whose value is greater than 0.9 is used when the adhesive layer is cured by heating (after fixing the superconducting wire) and is used at a low temperature. It was determined that the deterioration of the characteristics of the sample was suppressed, and was shown as “good” in Table 1. The determination results are also shown in Table 1.
  • the superconducting coil of the present invention it is possible to obtain an oxide superconducting coil that can suppress deterioration that occurs when a superconducting wire is used in a low temperature region and that has a good current density.
  • a Superconducting coil 1 (1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H, 1J) Coated superconducting wire 2 Winding frame 10 Superconducting wire 11 Base material 12 Intermediate layer 13 Oxide superconducting layer 14 Metal layer 20 Buffer layer 21 First buffer layer 22 Second buffer layer 23 Third buffer layer 30... Adhesive layer

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Abstract

L'invention concerne une bobine supraconductrice comprenant : un matériau de fil supraconducteur (10) constitué d'un substrat (11), d'une couche intermédiaire (12) disposée sur le substrat (11), d'une couche supraconductrice d'oxyde (13) disposée sur la couche intermédiaire (12) et d'une couche métallique (14) disposée sur la couche supraconductrice d'oxyde (13) ; une couche adhésive (30) ; et des couches tampons (20, 21, 22, 23) disposées entre la couche adhésive (30) et la couche métallique (14) du matériau de fil supraconducteur (10). La bobine supraconductrice selon l'invention est formée de sorte que le matériau de fil supraconducteur s'enroule autour de la couche adhésive (30).
PCT/JP2011/059078 2010-04-16 2011-04-12 Bobine supraconductrice et procédé de fabrication associé WO2011129325A1 (fr)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7471534B1 (ja) 2023-05-10 2024-04-19 三菱電機株式会社 高温超電導線及び超電導コイル

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JPS58105A (ja) * 1981-06-25 1983-01-05 Furukawa Electric Co Ltd:The 超電導コイルの製造方法
JPS6022304A (ja) * 1983-07-18 1985-02-04 Hitachi Ltd 巻線用超電導線材
JPH07235227A (ja) * 1993-12-28 1995-09-05 Furukawa Electric Co Ltd:The 超電導ケーブルおよび超電導コイル
JP2005011702A (ja) * 2003-06-19 2005-01-13 Fujikura Ltd 超電導テープ線材及びその製造装置並びにその製造方法
JP2007012582A (ja) * 2005-05-30 2007-01-18 Internatl Superconductivity Technology Center Ｒｅ系酸化物超電導線材の接合方法
JP2008140905A (ja) * 2006-11-30 2008-06-19 Sumitomo Electric Ind Ltd 超電導コイル
JP2011108918A (ja) * 2009-11-19 2011-06-02 Fujikura Ltd 超電導コイル

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58105A (ja) * 1981-06-25 1983-01-05 Furukawa Electric Co Ltd:The 超電導コイルの製造方法
JPS6022304A (ja) * 1983-07-18 1985-02-04 Hitachi Ltd 巻線用超電導線材
JPH07235227A (ja) * 1993-12-28 1995-09-05 Furukawa Electric Co Ltd:The 超電導ケーブルおよび超電導コイル
JP2005011702A (ja) * 2003-06-19 2005-01-13 Fujikura Ltd 超電導テープ線材及びその製造装置並びにその製造方法
JP2007012582A (ja) * 2005-05-30 2007-01-18 Internatl Superconductivity Technology Center Ｒｅ系酸化物超電導線材の接合方法
JP2008140905A (ja) * 2006-11-30 2008-06-19 Sumitomo Electric Ind Ltd 超電導コイル
JP2011108918A (ja) * 2009-11-19 2011-06-02 Fujikura Ltd 超電導コイル

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7471534B1 (ja) 2023-05-10 2024-04-19 三菱電機株式会社 高温超電導線及び超電導コイル

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