WO2011111029A1 - Procede de traitement d'un contact metallique realise sur un substrat - Google Patents
Procede de traitement d'un contact metallique realise sur un substrat Download PDFInfo
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- WO2011111029A1 WO2011111029A1 PCT/IB2011/051042 IB2011051042W WO2011111029A1 WO 2011111029 A1 WO2011111029 A1 WO 2011111029A1 IB 2011051042 W IB2011051042 W IB 2011051042W WO 2011111029 A1 WO2011111029 A1 WO 2011111029A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- laser
- metal
- contact
- metal contact
- substrate
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 86
- 239000002184 metal Substances 0.000 title claims abstract description 86
- 239000000758 substrate Substances 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000011282 treatment Methods 0.000 title description 4
- 239000002904 solvent Substances 0.000 claims abstract description 16
- 238000000151 deposition Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 239000000203 mixture Substances 0.000 claims abstract description 8
- 238000000137 annealing Methods 0.000 claims abstract description 7
- 238000011084 recovery Methods 0.000 claims description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 7
- 238000007650 screen-printing Methods 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000010410 layer Substances 0.000 description 12
- 239000002245 particle Substances 0.000 description 10
- 238000013532 laser treatment Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- 239000002344 surface layer Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
- H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a method of treating a metallic contact made on a substrate, a dielectric layer possibly being provided between the substrate and the metal.
- the method according to the invention can in particular find application during the manufacture of a photovoltaic cell.
- metal contacts are deposited on the front and rear face of the substrate in order to recover the electrons from the photoelectric effect generated in the substrate.
- a production method widely used in the photovoltaic industry comprises the following steps.
- a substrate for example p-doped silicon, is first cut to the desired dimensions.
- a chemical etching for example with alkaline, is then carried out.
- a texturizing step of the front face is performed to form an optical structure capable of trapping the photons of the incident light in the substrate to increase the efficiency of the cell. It may for example be pyramidal optical structures made by chemical etching with sodium hydroxide.
- a preliminary step may consist in carrying out an acid etching to neutralize the alkali residues and eliminate any impurities, the surfaces of the substrate to be clean before doping.
- n-type doping of the vertical edges is removed in order to isolate these edges. This is for example performed by plasma etching.
- a dielectric layer is then deposited full plate on the front face of the substrate to play the role of anti-reflection. This dielectric layer can be made with a vapor deposition of silicon nitride (NiS).
- a metal contact is then made on the front and rear faces of the substrate.
- a paste is deposited comprising an aluminum powder mixed with a solvent.
- This deposit is generally done by screen printing ("screen printing" according to the English terminology).
- the paste is deposited in a chosen pattern, in the form of a grid or a uniform layer.
- the dough is heated to remove the solvent and leave only the aluminum. Heating is generally carried out by baking at 100 ° C to 200 ° C to remove solvents and organic compounds.
- This metal pattern deposition technique is very advantageous in terms of costs and positioning of said pattern relative to the substrate.
- a final step of high temperature annealing of the substrate thus provided with the dielectric layer and the front and rear metal patterns is performed.
- Annealing is conventionally defined in metallurgy as a heat treatment whose temperature profile has at least one period at a temperature above the melting point of the material in question.
- This step makes it possible to form a metallic contact between said patterns and the substrate that can hold in time while eliminating the last non-metallic residues.
- This step is a delicate step because it requires controlling the thermal profile of the heating performed, depending on the nature and composition of the metal paste. In particular, a long annealing and / or at too high a temperature could degrade the photovoltaic cell, the contacts being able to cross the active zone of the cell.
- the metal pattern when the paste is dried, the metal pattern has a structure consisting of an agglomerate of particles, which does not promote the achievement of a low electrical resistance in the metal contact.
- An aluminum metal pattern 10 deposited on a silicon substrate 11 is for example shown in FIG. 1, in a sectional view with a scanning electron microscope.
- this agglomerate of particles is particularly sensitive to oxidation because this structure consisting of an agglomerate of particles has a large developed surface.
- An object of the invention is thus to increase the electrical conductance of a metallic contact made on a substrate, a dielectric layer possibly being provided between the substrate and the metallic pattern.
- Another object of the invention is to improve the stability of a metal contact against the oxidation phenomena, the contact of which the metallic part has been obtained with a paste formed from a mixture of a metal powder with a solvent.
- the invention provides a method for obtaining a metal contact on a substrate, comprising the following steps:
- step (b) heating the assembly thus formed in step (a) to evaporate the solvent
- the method according to the invention may provide other technical features of the invention, taken alone or in combination:
- step (a) is a screen printing step
- the thickness of the metallic pattern is at least 1 ⁇ ;
- the metallic contact is in the form of a grid
- the metallic contact is in the form of a layer
- the metallic contact comprises silver, aluminum or an alloy of silver and aluminum
- the method comprises a step of depositing a dielectric layer on the substrate, prior to step (a);
- the laser emits in the infrared range, for example at a wavelength of 1064 nm;
- the laser being a laser diode pumped laser
- the peak current emitted by the laser diode is between 20A and 30A, preferably between 25A and 28A;
- the laser emits pulses at a frequency of between 30 kHz and 60 kHz, preferably between 40 kHz and 60 kHz;
- the coverage rate of the surface of the metal contact between two taps is at least 95%, preferably at least 97%;
- the scanning speed of the laser is less than 10 m / s, for example between 1 m / s and 10 m / s;
- the laser emits pulses whose duration is between 1 ns and 1 ⁇ , for example between 100ns and 1 ps;
- the laser being a laser diode pumped, pulsed and emitting laser in the infrared range, this is implemented under the following conditions:
- the frequency of the taps is between 40 kHz and 60 kHz, where the coverage rate of the surface of the metal contact between two taps is greater than or equal to 97%, where the scanning speed of the laser at the surface of the metal contact is between 1m / s and 10m / s, preferably between 1m / s and 5m / s;
- the laser diode emits a peak current of between 25 A and 28 A.
- FIG. 1 shows, in a sectional view, a metal pattern obtained, in known manner, by depositing a metal paste formed from a mixture of a metal powder with a solvent;
- FIG. 2 represents a device for implementing the method according to the invention
- FIG. 3 represents, for a scanning speed of 1 m / s of the surface of the metal contact by the laser, the evolution of the square resistance of the metallic contact as a function of the repetition frequency of the pulses of light coming from the laser, for different rates of recovery of the surface of the metal contact impacted by two pulses;
- FIG. 4 represents, for a scanning speed of 3 m / s of the surface of the metal contact by the laser, the evolution of the square resistance of the metallic contact as a function of the frequency of repetition of the pulses of light coming from the laser, for different rates of recovery of the surface of the metal contact impacted by two pulses;
- FIG. 5 represents, for a scanning speed of 5 m / s of the surface of the metal contact by the laser, the evolution of the square resistance of the metallic contact as a function of the frequency of the pulses of light coming from the laser, for different rates of recovery of the surface of the metal contact impacted by two pulses;
- FIG. 6 comprises FIGS. 6 (a) and 6 (b), FIG. 6 (a) being a metallic aluminum pattern, according to a sectional view, obtained, in a known manner, by deposition of an aluminum paste. formed from a mixture of an aluminum powder with a solvent and FIG. 6 (b) being the metallic pattern of FIG. 6 (a) after treatment by the process according to the invention;
- FIG. 7 comprises FIGS. 7 (a) to 7 (c), which all represent an aluminum metallic pattern, according to a sectional view, obtained at the end of the process according to the invention, for different diode currents.
- the invention relates to a method for treating a metallic contact made on a substrate, wherein the contact has been obtained from the following steps (a), (b) and (c):
- step (b) heating the assembly thus formed in step (a) to evaporate the solvent
- Step (a) may be a screen printing step.
- the thickness of the metal pattern deposited during step (a) may be at least 1 ⁇ .
- the metallic pattern obtained at the end of steps (a) to (c) is an agglomerate of particles, as shown in FIG. 1. This porous metal pattern may also be described since there are gaps between the metal particles.
- the metallic pattern can be in the form of a grid or in the form of a layer.
- the metal pattern may include silver, aluminum or a silver and aluminum alloy.
- the nature of the metal used in the dough is chosen depending on the type of metal contact desired. Thus, for a photovoltaic cell, it is possible to envisage a metal back contact made of silver and aluminum alloy.
- a dielectric layer may be provided between the metallic pattern and the substrate,
- the method further comprises a step (d) during which the metal contact is heated by a laser at an energy density of between 0.5 J / cm 2 and 15 J / cm 2 .
- Figure 2 shows a diagram of a device for implementing step (d) of the method.
- the laser 1 used in this device for heating the metal contact can emit in the infrared range, for example at a wavelength of 1064 nm.
- This laser 1 may be a diode-pumped laser, such as an Nd: YAG laser emitting at 1064nm pumped at 808nm by a laser diode.
- the laser 1 presented above is a laser emitting in the infrared range. Indeed, this wavelength range is the most critical for metal contacts made on silicon substrates, since the silicon absorbs the infrared radiation and may be altered by this radiation (deformation by increasing the volume).
- the laser used could be a laser emitting in the ultraviolet range or in the visible range, (for example "green” at a wavelength of the order of 438 nm).
- the peak current emitted by the laser diode can be between 20A and 30A, preferably between 25A and 28A.
- the contact and the substrate may be damaged.
- a partial ablation and then detachment of the tear contact of the substrate underlying said contact is generally observed.
- an energy density of between 0.5 and 15 J / cm 2 can be obtained at the surface of the metal contact.
- the electrical resistance of the metal contact is thus substantially reduced without altering it.
- a metal contact permanently fixed to the substrate that is to say without risk of detachment of the contact and the substrate (blistering phenomenon).
- the laser 1 may moreover be a pulsed laser.
- the laser 1 can emit pulses at a repetition frequency of between 30 kHz and 60 kHz, preferably between 40 kHz and 60 kHz.
- This range of values of the repetition frequency promotes the reduction of the electrical resistance of the metal contact, without damaging the metal contact, the substrate or the connection between the two.
- the recovery rate of the surface of the metal contact between two taps is at least 95%, preferably at least 97%.
- One of the following recovery rates can be considered: 97%, 98% or 99%.
- recovery rate is meant the percentage of the surface of the contact which undergoes two successive passes of the laser along the scanning direction. It is therefore clear that these two passages are slightly offset, perpendicular to the scanning direction of the laser.
- a high recovery rate has the advantage of promoting a minimum energy density and decreases the electrical resistance of the metal contact.
- the scanning speed of the laser can be less than 10m / s, preferably between 1m / s and 10m / s.
- This speed range makes it possible to obtain an acceptable productivity on the industrial level while preserving the metallic contact and the substrate.
- the duration of eachroue can also be between 1ns and 1 ps.
- the device shown in FIG. 2 also comprises a lens 2 of focal length f.
- the rear face 12 of the rear contact 10 is disposed at the distance f from the lens, so that the lens 2 makes it possible to focus the laser beam on this rear face 12.
- Figures 3 to 5 all express on the ordinate the square resistance of the metal contact and, on the abscissa, the frequency of repetition of thearries.
- FIGS. 3 to 5 come from measurements carried out by the method known to those skilled in the art known as "four points" (or van der Pauw), the metal contact forming a thin layer.
- the thickness e of the metal contact is the same for all the tests performed, with or without laser treatment.
- the scanning speed of the laser on the surface of the metal contact was set at 1m / s and the peak current of the diode at 25A.
- This figure shows three curves showing the evolution of the square resistance obtained from the metal contact after laser treatment, as a function of the frequency of the pulses for different recovery rates of two pulses, namely 97%, 98% and 99%. %.
- a reference is represented in dashed lines in FIG.
- This reference is measured after obtaining a metal contact according to the method of the prior art, the metal of said contact being aluminum in connection with a silicon substrate, a dielectric layer being provided between the two.
- the reference metal contact has therefore undergone no laser treatment.
- the reference metal contact has in particular been subjected to steps (a) to (c), but not to step (d), unlike other tests performed.
- the square resistance of reference was measured at 10.5mu / square.
- the electrical resistance of the contact decreases with respect to the reference throughout the range of frequencies of the tested pulses, namely from 30 kHz to 60 kHz, and moreover, whatever the values of the recovery rate of %, 98% or 99%.
- the electrical resistance values obtained are between 5.1 and 8.7 m ⁇ / square, a decrease of between -51.4% and -17.1% relative to the reference value.
- the lowest resistance is obtained for a frequency of 30kHz and a recovery rate of 99%.
- the reference metal contact having undergone no laser treatment
- the reference is always shown in dashed lines in FIG. 4, its value being 10.5 m ⁇ / square.
- the electrical resistance of the contact decreases with respect to the reference throughout the frequency range of the tested pulses, namely from 30 kHz to 60 kHz, and moreover, whatever the values of the recovery rate of %, 98% or 99%.
- the electrical resistance values obtained are between 8.1 and 10.3 m ⁇ / square, a decrease of between -22.9% and -2% approximately relative to the reference value.
- the resistance of the metallic contact obtained with the tests shown in FIG. 4 is higher than that obtained with the tests shown in FIG.
- a coverage ratio of 99% is preferably chosen, which makes it possible to obtain the lowest resistances over the entire frequency range tested.
- the scanning speed of the laser on the surface of the metal contact was maintained at 5m / s and the peak current increased to 28A.
- Three curves are shown showing the evolution of the electrical resistance (square resistance) obtained from the metal contact after laser treatment, as a function of the repetition frequency of the pulses, between 40 kHz and 60 kHz, for different recovery rates of two pulses.
- the reference metal contact having undergone no laser treatment
- the reference is always shown in dashed lines in FIG. 5, its value being 10.5 mA / square.
- the laser is a laser diode pumped laser pulsed and emitting in the infrared range
- the skilled person can implement the following conditions to obtain an energy density between 0.5 J / cm 2 and 15J / cm 2 :
- the frequency of the pulses is between 40 kHz and 60 kHz
- the recovery rate of the surface of the metallic contact between two successive taps is greater than or equal to 97%
- the scanning speed of the laser on the surface of the metal contact is between 1m / s and 10m / s, preferably between 1m / s and 5m / s;
- the laser diode emits a peak current of between 25A and 28A
- the device used is set to the "100ns - 1 ⁇ " pulse duration position.
- the laser treatment has the effect of changing the agglomerate structure of particles into a structure that is more continuous than the particle agglomerate structure.
- Figure 6 which includes Figures 6 (a) and 6 (b), provides a first illustration of the interest of the invention.
- Fig. 6 (a) shows an aluminum metal pattern, according to a sectional view, obtained after the implementation of steps (a) to (c) of the method.
- This metallic pattern is formed of an agglomerate of porous particles. In other words, there are free spaces between the metal particles, these spaces favoring the surface oxidation of the metal particles.
- FIG. 6 (b) shows the same pattern 10, according to the same sectional view, after implementation of the laser treatment step (d) according to the invention. In the case in point, step (d) was carried out with a recovery rate of 95% and a diode current of 26A.
- the metal pattern 10 thus obtained has a densified surface layer 101, described as continuous since there is no longer any space allowing a gas to penetrate the heart of the metallic pattern.
- This surface layer is not formed of an agglomerate of particles.
- the size of the particles is generally greater than those of FIG. 6 (a).
- this densified surface layer which can be described as continuous, the metallic pattern.
- this continuous surface layer forms a barrier to outside air, which makes it possible to limit the oxidation phenomena over time and, consequently, to maintain good electrical conductance in use.
- Figure 7 which includes Figures 7 (a) to 7 (c), provides another illustration of the interest of the invention.
- the diode current used is 25A. It is respectively 26A and 27A in Figures 7 (b) and 7 (c).
- the thickness of the surface layer which can be described as continuous, increases with increasing diode current. It is thus understood that the more the diode current increases, the more the Energy density of the laser beam increases and the depth of the densified area increases.
- the treatment of the metal contact described above is advantageously used in the manufacture of photovoltaic cells.
- the laser described above is a pulsed laser emitting in the infrared range.
- a laser emitting a continuous light irrespective of the infrared, visible or ultraviolet domain, could however be envisaged.
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011800206969A CN102870509A (zh) | 2010-03-12 | 2011-03-11 | 形成在基板上的金属接触部的处理方法 |
US13/634,498 US20130095603A1 (en) | 2010-03-12 | 2011-03-11 | Method for the treatment of a metal contact formed on a substrate |
JP2012556640A JP5759490B2 (ja) | 2010-03-12 | 2011-03-11 | 基板上に形成される金属接点の処理のための方法 |
EP11722521A EP2545753A1 (fr) | 2010-03-12 | 2011-03-11 | Procede de traitement d'un contact metallique realise sur un substrat |
KR1020127026053A KR20130051924A (ko) | 2010-03-12 | 2011-03-11 | 기판 상에 형성되는 금속 접점 처리 방법 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1001007 | 2010-03-12 | ||
FR1001007A FR2957479B1 (fr) | 2010-03-12 | 2010-03-12 | Procede de traitement d'un contact metallique realise sur un substrat |
Publications (1)
Publication Number | Publication Date |
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WO2011111029A1 true WO2011111029A1 (fr) | 2011-09-15 |
Family
ID=42668766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/IB2011/051042 WO2011111029A1 (fr) | 2010-03-12 | 2011-03-11 | Procede de traitement d'un contact metallique realise sur un substrat |
Country Status (7)
Country | Link |
---|---|
US (1) | US20130095603A1 (fr) |
EP (1) | EP2545753A1 (fr) |
JP (1) | JP5759490B2 (fr) |
KR (1) | KR20130051924A (fr) |
CN (1) | CN102870509A (fr) |
FR (1) | FR2957479B1 (fr) |
WO (1) | WO2011111029A1 (fr) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013153293A1 (fr) * | 2012-04-11 | 2013-10-17 | Commissariat à l'Energie Atomique et aux Energies Alternatives | Procédé de réalisation d'une cellule photovoltaïque à hétérojonction |
WO2014054350A1 (fr) * | 2012-10-04 | 2014-04-10 | 信越化学工業株式会社 | Procédé de fabrication de cellule photovoltaïque |
WO2014065018A1 (fr) * | 2012-10-23 | 2014-05-01 | 富士電機株式会社 | Procédé de fabrication de dispositif à semi-conducteur |
JP2016518516A (ja) * | 2013-03-05 | 2016-06-23 | ローレンス リバモア ナショナル セキュリティー, エルエルシー | 高電力ダイオードに基づく付加製造のためのシステムおよび方法 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4931323A (en) * | 1987-12-10 | 1990-06-05 | Texas Instruments Incorporated | Thick film copper conductor patterning by laser |
US5132248A (en) * | 1988-05-31 | 1992-07-21 | The United States Of America As Represented By The United States Department Of Energy | Direct write with microelectronic circuit fabrication |
US5661041A (en) * | 1994-11-24 | 1997-08-26 | Murata Manufacturing Co., Ltd. | Conductive paste, solar cells with grid electrode made of the conductive paste, and fabrication method for silicon solar cells |
US20070019028A1 (en) * | 1998-09-30 | 2007-01-25 | Optomec Design Company | Laser processing for heat-sensitive mesoscale deposition of oxygen-sensitive materials |
DE102006040352B3 (de) * | 2006-08-29 | 2007-10-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Aufbringen von elektrischen Kontakten auf halbleitende Substrate, halbleitendes Substrat und Verwendung des Verfahrens |
US20100003021A1 (en) * | 2008-07-01 | 2010-01-07 | Weyerhaeuser Co. | Systems and methods for curing deposited material using feedback control |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3984209A (en) * | 1974-05-24 | 1976-10-05 | General Electric Company | Porous aluminum body |
US5538564A (en) * | 1994-03-18 | 1996-07-23 | Regents Of The University Of California | Three dimensional amorphous silicon/microcrystalline silicon solar cells |
US5822345A (en) * | 1996-07-08 | 1998-10-13 | Presstek, Inc. | Diode-pumped laser system and method |
DE10046170A1 (de) * | 2000-09-19 | 2002-04-04 | Fraunhofer Ges Forschung | Verfahren zur Herstellung eines Halbleiter-Metallkontaktes durch eine dielektrische Schicht |
WO2007101112A1 (fr) * | 2006-02-24 | 2007-09-07 | Uvtech Systems, Inc. | Procédé et appareil pour administration de rayonnement laser pulsé |
JP2009152222A (ja) * | 2006-10-27 | 2009-07-09 | Kyocera Corp | 太陽電池素子の製造方法 |
US20100275982A1 (en) * | 2007-09-04 | 2010-11-04 | Malcolm Abbott | Group iv nanoparticle junctions and devices therefrom |
US8426905B2 (en) * | 2007-10-01 | 2013-04-23 | Kovio, Inc. | Profile engineered, electrically active thin film devices |
KR100974221B1 (ko) * | 2008-04-17 | 2010-08-06 | 엘지전자 주식회사 | 레이저 어닐링을 이용한 태양전지의 선택적 에미터형성방법 및 이를 이용한 태양전지의 제조방법 |
US20100294349A1 (en) * | 2009-05-20 | 2010-11-25 | Uma Srinivasan | Back contact solar cells with effective and efficient designs and corresponding patterning processes |
-
2010
- 2010-03-12 FR FR1001007A patent/FR2957479B1/fr not_active Expired - Fee Related
-
2011
- 2011-03-11 CN CN2011800206969A patent/CN102870509A/zh active Pending
- 2011-03-11 EP EP11722521A patent/EP2545753A1/fr not_active Withdrawn
- 2011-03-11 WO PCT/IB2011/051042 patent/WO2011111029A1/fr active Application Filing
- 2011-03-11 JP JP2012556640A patent/JP5759490B2/ja not_active Expired - Fee Related
- 2011-03-11 KR KR1020127026053A patent/KR20130051924A/ko not_active Application Discontinuation
- 2011-03-11 US US13/634,498 patent/US20130095603A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4931323A (en) * | 1987-12-10 | 1990-06-05 | Texas Instruments Incorporated | Thick film copper conductor patterning by laser |
US5132248A (en) * | 1988-05-31 | 1992-07-21 | The United States Of America As Represented By The United States Department Of Energy | Direct write with microelectronic circuit fabrication |
US5661041A (en) * | 1994-11-24 | 1997-08-26 | Murata Manufacturing Co., Ltd. | Conductive paste, solar cells with grid electrode made of the conductive paste, and fabrication method for silicon solar cells |
US20070019028A1 (en) * | 1998-09-30 | 2007-01-25 | Optomec Design Company | Laser processing for heat-sensitive mesoscale deposition of oxygen-sensitive materials |
DE102006040352B3 (de) * | 2006-08-29 | 2007-10-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Aufbringen von elektrischen Kontakten auf halbleitende Substrate, halbleitendes Substrat und Verwendung des Verfahrens |
US20100003021A1 (en) * | 2008-07-01 | 2010-01-07 | Weyerhaeuser Co. | Systems and methods for curing deposited material using feedback control |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2989520A1 (fr) * | 2012-04-11 | 2013-10-18 | Commissariat Energie Atomique | Procede de realisation d'une cellule photovoltaique a heterojonction |
US9293608B2 (en) | 2012-04-11 | 2016-03-22 | Commissariat à l'Energie Atomique et aux Energies Alternatives | Method for producing a photovoltaic cell having a heterojunction |
WO2013153293A1 (fr) * | 2012-04-11 | 2013-10-17 | Commissariat à l'Energie Atomique et aux Energies Alternatives | Procédé de réalisation d'une cellule photovoltaïque à hétérojonction |
US9614117B2 (en) | 2012-10-04 | 2017-04-04 | Shin-Etsu Chemical Co., Ltd. | Solar cell manufacturing method |
WO2014054350A1 (fr) * | 2012-10-04 | 2014-04-10 | 信越化学工業株式会社 | Procédé de fabrication de cellule photovoltaïque |
KR101873563B1 (ko) * | 2012-10-04 | 2018-07-03 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 태양 전지 셀의 제조 방법 |
CN104704639A (zh) * | 2012-10-04 | 2015-06-10 | 信越化学工业株式会社 | 太阳能电池单元的制造方法 |
RU2636405C2 (ru) * | 2012-10-04 | 2017-11-23 | Син-Эцу Кемикал Ко., Лтд. | Способ изготовления солнечного элемента |
JPWO2014054350A1 (ja) * | 2012-10-04 | 2016-08-25 | 信越化学工業株式会社 | 太陽電池セルの製造方法 |
CN104704639B (zh) * | 2012-10-04 | 2017-02-22 | 信越化学工业株式会社 | 太阳能电池单元的制造方法 |
JPWO2014065018A1 (ja) * | 2012-10-23 | 2016-09-08 | 富士電機株式会社 | 半導体装置の製造方法 |
US9892919B2 (en) | 2012-10-23 | 2018-02-13 | Fuji Electric Co., Ltd. | Semiconductor device manufacturing method |
WO2014065018A1 (fr) * | 2012-10-23 | 2014-05-01 | 富士電機株式会社 | Procédé de fabrication de dispositif à semi-conducteur |
JP2016518516A (ja) * | 2013-03-05 | 2016-06-23 | ローレンス リバモア ナショナル セキュリティー, エルエルシー | 高電力ダイオードに基づく付加製造のためのシステムおよび方法 |
US9855625B2 (en) | 2013-03-05 | 2018-01-02 | Lawrence Livermore National Security, Llc | System and method for high power diode based additive manufacturing |
US10569363B2 (en) | 2013-03-05 | 2020-02-25 | Lawrence Livermore National Security, Llc | System and method for high power diode based additive manufacturing |
US11534865B2 (en) | 2013-03-05 | 2022-12-27 | Lawrence Livermore National Security, Llc | System and method for high power diode based additive manufacturing |
US10747033B2 (en) | 2016-01-29 | 2020-08-18 | Lawrence Livermore National Security, Llc | Cooler for optics transmitting high intensity light |
Also Published As
Publication number | Publication date |
---|---|
CN102870509A (zh) | 2013-01-09 |
JP2013526005A (ja) | 2013-06-20 |
JP5759490B2 (ja) | 2015-08-05 |
EP2545753A1 (fr) | 2013-01-16 |
US20130095603A1 (en) | 2013-04-18 |
KR20130051924A (ko) | 2013-05-21 |
FR2957479B1 (fr) | 2012-04-27 |
FR2957479A1 (fr) | 2011-09-16 |
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