WO2011108113A1 - 有機elパネル及びその製造方法 - Google Patents
有機elパネル及びその製造方法 Download PDFInfo
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- WO2011108113A1 WO2011108113A1 PCT/JP2010/053660 JP2010053660W WO2011108113A1 WO 2011108113 A1 WO2011108113 A1 WO 2011108113A1 JP 2010053660 W JP2010053660 W JP 2010053660W WO 2011108113 A1 WO2011108113 A1 WO 2011108113A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
- H10K59/1795—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
Definitions
- the present invention relates to an organic EL panel and a manufacturing method thereof.
- An organic EL panel is a self-luminous panel in which one or a plurality of organic EL elements are arranged on a substrate, and is used for various applications such as display and illumination.
- the organic EL element has a laminated structure including a lower electrode, an organic layer including a light emitting layer, and an upper electrode in this order from the substrate side.
- One of the lower electrode and the upper electrode serves as an anode and the other serves as a cathode.
- the wiring electrode When the electrical resistance of the wiring electrode is high, the length of the wiring electrode varies depending on the position of the organic EL element arranged on the substrate, and thus there is a problem that luminance unevenness occurs for each element due to a voltage drop due to a current flowing through the wiring electrode. . In order to cope with this, it is necessary to reduce the electrical resistance of the wiring electrode, and the wiring electrode has a metal oxide layer having high adhesion to the glass substrate and a metal or alloy such as Al, Ag having low electrical resistance. Is laminated (see Patent Document 1 below).
- the wiring electrode formed on the substrate of the organic EL panel includes a cathode wiring for conducting with the cathode and an anode wiring for conducting with the anode. These wiring electrodes are patterned on the substrate together with the lower electrode which is a component of the organic EL element before the organic layer is formed. Before the organic layer is formed, the pattern of the wiring electrode is It exists on the substrate as an independent pattern. In this way, when static electricity is charged to the wiring electrode pattern that exists independently on the substrate, the charged static electricity flows into the element side when the organic layer is formed or after the laminated structure of the organic EL element is formed, There is a problem that adversely affects the organic layer and device structure. In addition, when aligning a metal mask used when forming an organic layer, there is a problem in that charging to the wiring electrode is difficult to align.
- the present invention is an example of a problem to deal with such a problem. That is, for the purpose of the present invention, it is possible to prevent static electricity charged on the wiring electrodes patterned on the substrate in the manufacturing stage of the organic EL panel from adversely affecting the organic layer and the element structure of the organic EL element. is there.
- the organic EL panel and the manufacturing method thereof according to the present invention include at least the configurations according to the following independent claims.
- An organic EL panel in which at least one organic EL element is formed on a substrate, wherein the organic EL element has a laminated structure in which an organic layer including a light emitting layer is disposed between an anode and a cathode. Is formed with a light emitting region in which the organic EL element is formed and a wiring region in which a wiring electrode is formed which is drawn out from the light emitting region and is electrically connected to the anode or the cathode of the organic EL element.
- An organic EL panel characterized in that the planar end shape on the side has an R-shaped portion with rounded corners.
- FIG. 4A is a plan view of the entire organic EL panel
- FIG. 4B is a cross-sectional view taken along the line AA
- FIG. 4C shows a conventional example.
- FIG. 1 is an explanatory view showing an organic EL panel according to an embodiment of the present invention.
- FIG. 4A is a plan view of the entire organic EL panel
- FIG. 4B is a cross-sectional view taken along the line AA
- the organic EL panel 100 is obtained by forming at least one organic EL element 1 on a substrate 10.
- the organic EL element 1 is formed by sequentially laminating a lower electrode 11, an organic layer 12 having a light emitting layer, and an upper electrode 13 from the substrate 10 side, and one of the lower electrode 11 and the upper electrode 13 is a cathode and the other is an anode. And a laminated structure in which the organic layer 12 is disposed between the cathode and the anode.
- the lower electrode 11, the organic layer 12, and the upper electrode 13 are laminated directly on the substrate 10, but other layers for functional or film thickness control are interposed between the layers. Also good.
- the substrate 10 has translucency
- the lower electrode 11 has translucency
- the upper electrode 13 has light reflectivity
- a method of emitting light from the substrate 10 side bottom emission method
- the upper electrode 13 side has translucency and the lower electrode side has light reflectivity
- a method of emitting light from the upper electrode 13 side top emission method
- Both the lower electrode 11 and the upper electrode 13 may be translucent so that light is extracted from both sides (dual emission method).
- the organic EL element 1 holes are injected / transported from the anode side to the organic layer 12 and electrons are injected / transported from the cathode side to the organic layer 12 by the voltage applied between the lower electrode 11 and the upper electrode 13. As a result, holes and electrons recombine in the light emitting layer to emit light. Therefore, the light emission luminance is determined by the current flowing between the anode and the cathode.
- the organic EL panel 100 including a plurality of organic EL elements 1 includes an insulating film 14 in order to ensure electrical insulation between the plurality of lower electrodes 11.
- the lower electrode 11 is patterned in a stripe shape and includes an insulating film 14 that defines a light emitting portion 15 on the lower electrode 11.
- the organic EL panel 100 has a sealing structure in which a sealing substrate 20 is bonded to a substrate 10 as shown in FIG.
- the light emitting region 100A is formed in a sealing region covered with the sealing substrate 20, and the wiring region 100B is formed outside the light emitting region 100A.
- the wiring electrode 30 in the wiring region 100 ⁇ / b> B is divided into one that conducts with the lower electrode 11 and one that conducts with the upper electrode 13.
- the wiring electrode 30 that is electrically connected to the lower electrode 11 can be formed continuously with the lower electrode 11.
- the wiring electrode 30 that is electrically connected to the upper electrode 13 connects the wiring electrode 30 formed on the substrate 10 and the upper electrode 13 during or after the formation of the upper electrode 13.
- the wiring electrode 30 has an R-shaped portion 30R in which the planar end shape on the organic EL element 1 side has rounded corners (see FIG. 1C).
- the outer peripheral edge of the R-shaped portion 30R is formed in an arc shape in the illustrated example, but is not necessarily in an arc shape, and may be a curved shape having an arbitrary shape in which a plurality of curvatures are combined.
- a high effect can be obtained by providing the R-shaped portion 30 ⁇ / b> R at all ends of the wiring electrode 30, but a desired effect can also be obtained by providing the R-shaped portion 30 ⁇ / b> R at a part of the ends of the wiring electrode 30.
- the wiring electrode 30 provided with the R-shaped portion 30R is not limited to either the anode wiring or the cathode wiring, and one or both of them can be targeted.
- the electrostatic charging of the wiring electrode 30 may occur at any stage after the wiring electrode 30 is formed on the substrate 10, before or after the organic layer 12 is formed, and before or after the sealing region is formed. In each stage, static electricity removal (static elimination) of the wiring electrode 30 may not be performed effectively.
- static electricity removal static elimination
- the R-shaped portion 30R at the end of the wiring electrode 30 on the organic EL element 1 side, even if the wiring electrode 30 is charged, the adverse effect of static electricity on the organic layer 12 and the organic EL element 1 is adversely affected. Can be minimized.
- FIG. 2 shows a configuration example and a conventional example of the wiring electrode 30 used in the organic EL panel 100 according to the embodiment of the present invention.
- FIG. 6A shows the configuration shown in FIG. 1C described above, and an R-shaped portion 30R is provided at the end portion on the organic EL element 1 side (light emitting region side). Since the R-shaped portion 30R is provided for the purpose of preventing electric charges from concentrating at the end portion, it is preferably provided on both the left and right sides. In the example shown in the figure, the R-shaped portion 30R has a symmetrical shape, but it does not necessarily have to be a symmetrical shape.
- an R-shaped portion 30R similar to that shown in FIG. 5A is provided at the end of the organic EL element 1 side (light emitting region side).
- a charge discharge portion 30S is provided at the end opposite to the first side (substrate edge side).
- the charge discharging portion 30S has a function of discharging charges charged in the wiring electrode 30 to the outside from the wiring electrode 30, and the charge discharging portion 30S is provided at the end opposite to the end where the R-shaped portion 30R is formed.
- the planar shape of the end portion of the wiring electrode 30 is sharpened toward the end edge side of the substrate 10, as shown in FIG. According to this, the electric charge charged in the wiring electrode 30 can be easily concentrated on the tip of the sharp end portion, so that the electric charge can be prevented from concentrating on the opposite end portion.
- FIG. 5C shows an example in which the R-shaped portion 30R and the charge discharging portion 30S are not provided at the end of the wiring electrode 30, and in this case, when the wiring electrode 30 is charged with static electricity, the corner of the end is shown. Concentration of charges is likely to occur in the portion, and there is a concern that charges flow from there to the organic EL element 1 side.
- FIG. 3 is an explanatory view showing another form of the charge discharging portion in the organic EL panel according to the embodiment of the present invention.
- the organic EL element 1 having the light emitting portion 15 is formed at the intersecting portion of the lower electrode 11 arranged in a stripe shape and the upper electrode 13 arranged in a stripe shape so as to intersect therewith.
- the wiring electrode 30 is formed on the substrate 10 in the wiring region 100B outside the light emitting region 100A in which the organic EL element 1 is formed, and the end portion on which the R-shaped portion 30R on the organic EL element 1 side is formed is an upper part. It is connected to the electrode 13, and the end opposite to the electrode 13 is formed toward the edge of the substrate 10.
- the charge discharge portion is formed by a conductive pattern 40 formed close to the end of the wiring electrode 30 opposite to the organic EL element 1 side.
- the conductive pattern 40 is an electric resistance at the end of the wiring electrode 30. It is formed of a material having a lower electrical resistance. Even with such a charge discharge portion, when the wiring electrode 30 is electrostatically charged, the charge is drawn toward the low resistance conductive pattern 40 side, so that the opposite end portion (the end on the organic EL element 1 side). Part) can be prevented from concentrating charges.
- the distance d2 between the end of the wiring electrode 30 opposite to the organic EL element 1 side and the conductive pattern 40 is set to be the distance between the end of the wiring electrode 30 on the organic EL element 1 side and the organic EL element 1 closest thereto.
- FIG. 4 and 5 are explanatory views showing an organic EL panel according to another embodiment of the present invention (FIG. 4 is an overall plan view, and FIG. 5 is an enlarged view of a portion M in FIG. 4).
- the large-sized panel 100m can be divided to obtain individual organic EL panels 100, and a plurality of panel formation regions S1, S2, and a plurality of organic EL panels 100 are simultaneously formed on the large-sized substrate 10m. S3 and S4.
- a first wiring electrode 30 1 , a second wiring electrode 30 2 , and a conductive pattern 40 are formed on the large substrate 10m.
- First wiring electrode 30 1 is formed over a plurality of panels forming region is intended to conduct one of the anode and the cathode of the organic EL element 1, it is formed continuously with the lower electrode 11 in the example shown ing.
- the second wiring electrode 30 2 is formed in each panel forming region, there shall be conducted to the other of the anode and cathode of the organic EL element 1, in the illustrated example is formed to conduct to the upper electrode 13.
- the conductive pattern 40 is formed outside the panel formation regions S1 to S4 on the large substrate 10m, and is formed so as to be electrically connected to the first wiring electrode 30 1 and the second wiring electrode 30 2 .
- the first wiring electrode 30 1 and the second wiring electrode 30 2 are formed in order to discharge static electricity charged to the outside of the panel formation regions S1 to S4.
- the first wiring electrode 30 1 and the second wiring electrode 30 2 is in a state of conduction with the conductive pattern 40, as shown in FIG. 3, the first wiring electrode 30 1 and the The end of the second wiring electrode 30 2 and the conductive pattern 40 may be close to each other, and the charges charged in the first wiring electrode 30 1 and the second wiring electrode 30 2 easily flow into the conductive pattern 40 side. It only has to be in form.
- a sealing substrate 20 for sealing the organic EL element 1 is attached to each of the panel forming regions S1 to S4, and a sealing region P is formed inside thereof.
- the sealing region P is formed inside the adhesive layer.
- the second wiring electrode 30 2 has an R-shaped portion 30R formed at the end portion on the organic EL element 1 side as in the above-described embodiment, and the organic EL element 1 of the second wiring electrode 30 2 is formed.
- the end opposite to the conductive pattern 40 is electrically connected to or close to the conductive pattern 40.
- the first wiring electrode 30 1 is divided in divide portion 30n in the sealing region P.
- FIG. 6 shows a modification of the example shown in FIG.
- the organic EL device 1 of the second wiring electrode 30 2 to form a charge-emitting portion 30S showing the opposite end portion of in the pointed shape in FIG. 2 (b), the charge-emitting portion 30S Is placed close to the conductive pattern 40 for discharging electric charges.
- the electrostatic charge charged in the second wiring electrode 302 can be more reliably separated from the organic EL element 1 side.
- a method for manufacturing the organic EL panel shown in FIGS. 4 to 6 will be described.
- a second wiring electrode 30 2 formed for each of the panel formation regions S1 to S4, and a conductive pattern 40 for discharging electric charges that is conductive or close to the first wiring electrode 30 1 and the second wiring electrode 30 2 is formed.
- the first wiring electrode 30 1 , the second wiring electrode 30 2 , and the conductive pattern 40 are patterned by a photolithography process after a conductive material is formed on the large substrate 10m. Since the first wiring electrode 30 1 is intended to be formed continuously with the lower electrode 11, a low electrical resistance of the metal film on the lead wiring portion after forming the transparent conductive film (such as ITO) (Al, Ag, etc. ) And a pattern is formed in a stripe shape.
- the second wiring electrode 30 2 is formed with the R-shaped portion 30R and the charge discharging portion 30S at the end at the same time as the stripe-shaped pattern, and the end opposite to the organic EL element 1 is electrically connected to the conductive pattern 40 Or close.
- the conductive pattern 40 is formed of Al or Ag having a low electrical resistance, and is formed simultaneously with the first wiring electrode 30 1 and the second wiring electrode 30 2 .
- the organic EL element 1 is formed in each panel formation region S1 to S4.
- a partition pattern for separating the insulating film 14 or the upper electrode 13 shown in FIG. 1 is formed on the lower electrode 11, and an organic layer 12 including a light emitting layer is formed in the opening of the light emitting portion 15 on the lower electrode 11. Further, an upper electrode 13 is formed. When the upper electrode 13 is formed, the upper electrode 13 and the second wiring electrode 30 2 are connected.
- a sealing region P for sealing the organic EL element 1 is formed for each of the panel formation regions S1 to S4.
- the sealing region P is formed inside the adhesive layer that bonds the large substrate 10m and the sealing substrate 20 together.
- the fourth step to divide the first wiring electrodes 30 1 for each panel forming area in the sealing region P.
- portions to form a divide portion 30n near the boundary of the panel formation region opposite to the first wiring electrode 30 1 of the drawing wiring in the sealing region P the first to separate wire wiring electrode 30 1.
- Laser light is used for this division, and the laser light irradiated through the transparent large-sized substrate 10m and the sealing substrate 20 is moved along the dividing line Ld to form the divided portions 30n arranged linearly.
- the large-sized substrate 10m is divided into the panel formation regions S1 to S4 to form individual organic EL panels 100.
- the large-sized substrate 10m is cut along the cutting line Ct shown in FIGS. 4 to 6 with a cutting machine, and individual organic EL panels 100 are obtained.
- the first wiring electrode 30 1 and the second wiring electrode 30 2 are separated from the conductive pattern 40, and the lead wiring side of the first wiring electrode 30 1 is cut together with the large substrate 10m. .
- the substrate 10 is formed of a base material that can support the organic EL element 1 such as glass, plastic, or a metal having an insulating material layer formed on the surface thereof.
- the transparent conductive film forming the lower electrode 11 is made of transparent metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), zinc oxide-based transparent conductive film, SnO 2 -based transparent conductive film, and titanium dioxide-based transparent conductive film.
- first wiring electrodes 30 1 lead-out wiring portion and the second wiring portion 30 2 or the conductive pattern 40 silver is a low electrical resistance metal (Ag) or a silver alloy, aluminum (Al) or an aluminum alloy Etc. can be used.
- the insulating film 14 is provided in order to ensure insulation of each of the patterned lower electrodes 11, and a material such as polyimide resin, acrylic resin, silicon oxide, silicon nitride is used.
- the insulating film 14 is formed by forming a pattern on the entire surface of the light emitting region 100A on the substrate 10 on which the lower electrode 11 is formed, and then forming an opening of the light emitting portion 15 on the lower electrode 11. Specifically, a film is formed on the substrate 10 on which the lower electrode 11 is formed by a spin coating method so as to have a predetermined coating thickness, and exposure processing and development processing are performed using an exposure mask, whereby the light emitting unit 15 is formed. A layer of the insulating film 14 having the opening pattern shape is formed.
- the insulating film 14 is formed so as to fill the space between the patterns of the lower electrode 11 and partially cover the side end portion thereof, and is formed in a lattice shape. As a result, the light emitting portion 15 is opened on the lower electrode 11 and the region is insulated and partitioned by the insulating film 14.
- the partition walls are striped in the direction intersecting the lower electrode 11 in order to form the pattern of the upper electrode 13 without using a mask or the like, or to completely electrically insulate the adjacent upper electrode 13 from each other. It is formed.
- an insulating material such as a photosensitive resin is spin-coated on the substrate 10 or the insulating film 14 so as to be thicker than the total thickness of the organic layer 12 and the upper electrode 13 forming the organic EL element 1.
- ultraviolet light or the like is irradiated on the photosensitive resin film through a photomask having a stripe pattern intersecting with the lower electrode 11, resulting from a difference in exposure amount in the thickness direction of the layer.
- a partition wall having a downward tapered surface is formed.
- the organic layer 12 has a laminated structure of light emitting functional layers including the light emitting layer 12A.
- a hole injection layer, a hole are sequentially formed from the anode side.
- a transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and the like are selectively formed.
- a vacuum deposition method or the like is used as a dry film formation, and coating or various printing methods are used as a wet film formation.
- NPB N, N-di (naphtalence) -N, N-dipheneyl-benzidene
- This hole transport layer has a function of transporting holes injected from the anode to the light emitting layer.
- the hole transport layer may be a single layer or a stack of two or more layers.
- the hole transport layer is not formed by a single material, but a single layer may be formed by a plurality of materials, and a guest material having a high charge donating (accepting) property may be formed on a host material having a high charge transport capability. Doping may be performed.
- red (R), green (G), and blue (B) light-emitting layers are formed in respective film formation regions by using a resistance heating vapor deposition method using a coating mask.
- red (R) an organic material that emits red light such as a styryl dye such as DCM1 (4- (dicyanomethylene) -2-methyl-6- (4′-dimethylaminostyryl) -4H-pyran) is used.
- An organic material that emits green light such as an aluminum quinolinol complex (Alq 3 ) is used as green (G).
- an organic material emitting blue light such as a distyryl derivative or a triazole derivative is used.
- a distyryl derivative or a triazole derivative is used.
- other materials or a host-guest layer structure may be used, and the light emission form may be a fluorescent light emitting material or a phosphorescent light emitting material.
- the electron transport layer formed on the light emitting layer is formed by using various materials such as an aluminum quinolinol complex (Alq 3 ) by various film forming methods such as resistance heating vapor deposition.
- the electron transport layer has a function of transporting electrons injected from the cathode to the light emitting layer.
- This electron transport layer may have a multilayer structure in which only one layer is stacked or two or more layers are stacked.
- the electron transport layer may be formed of a plurality of materials instead of a single material, and a guest material having a high charge donating (accepting) property may be formed on a host material having a high charge transport capability. It may be formed by doping.
- a material (metal, metal oxide, metal fluoride, alloy, etc.) having a work function smaller than that of the anode (for example, 4 eV or less) is used.
- metal films such as aluminum (Al), indium (In), magnesium (Mg), amorphous semiconductors such as doped polyaniline and doped polyphenylene vinylene, Cr 2 O 3 , NiO , Oxides such as Mn 2 O 5 can be used.
- a single layer structure made of a metal material, a laminated structure such as LiO 2 / Al, or the like can be adopted.
- the sealing substrate 20 can be a plate-like member or container-like member made of metal, glass, plastic, or the like.
- a glass sealing substrate 20 formed with a recess for sealing by processing such as press molding, etching, or blasting.
- the sealing region P can be formed between the substrate 10 and a substrate made of glass (which may be plastic) using flat glass.
- thermosetting type a chemical curing type (mixed with two liquids), a light (ultraviolet) curing type, or the like
- acrylic resin an epoxy resin, or a polyester is used as a material.
- Polyolefin or the like can be used.
- the static electricity charged on the wiring electrodes 30 (30 1 , 30 2 ) patterned on the substrate 10 in the manufacturing stage of the organic EL panel 100 becomes the organic EL panel.
- An adverse effect on the organic layer 12 and the element structure of the element 1 can be suppressed.
- the wiring electrode It is possible to prevent the electric charge accumulated in 30 from concentrating on the end portion on the organic EL element 1 side, thereby preventing the electric charge from flowing into the organic EL element 1.
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Abstract
Description
また、有機層の成膜時に使用するメタルマスクのアライメントを行う場合、配線電極への帯電がアライメントし難くなるなどの悪影響を及ぼす問題がある。
Claims (7)
- 基板上に少なくも一つの有機EL素子を形成した有機ELパネルであって、
前記有機EL素子は、陽極と陰極間に発光層を含む有機層を配置した積層構造を有し、
前記基板上には前記有機EL素子が形成された発光領域と該発光領域から引き出され前記有機EL素子の陽極又は陰極と導通する配線電極が形成された配線領域が形成され、
前記配線電極は、前記有機EL素子側の平面的な端部形状が角部を丸めたR状部を有していることを特徴とする有機ELパネル。 - 前記配線電極の前記有機EL素子側とは逆側の端部には、前記配線電極に帯電した電荷を放出する電荷放出部が形成されていることを特徴とする請求項1記載の有機ELパネル。
- 前記電荷放出部は、前記配線電極の端部に形成され、当該端部の平面形状が前記基板の端縁側に向けた尖鋭状になっていることを特徴とする請求項2記載の有機ELパネル。
- 前記電荷放出部は、前記配線電極の前記有機EL素子側とは逆側の端部に近接して形成された導電パターンによって形成され、当該導電パターンは前記配線電極の端部の電気抵抗より低い電気抵抗の材料によって形成されていることを特徴とする請求項2記載の有機ELパネル。
- 前記配線電極の前記有機EL素子側とは逆側の端部と前記導電パターンとの距離が、前記配線電極の前記有機EL素子側の端部とこれに直近の有機EL素子との距離より狭いことを特徴とする請求項4に記載の有機ELパネル。
- 前記発光領域を封止する封止領域が形成され、
前記封止領域から前記配線領域以外の前記基板の端部に延びる配線電極を備え、
当該配線電極が前記封止領域内で分断されていることを特徴とする請求項1~5のいずれかに記載の有機ELパネル。 - 基板上に少なくも一つの有機EL素子を形成した有機ELパネルの製造方法であって、
複数の有機ELパネルを同時形成する複数のパネル形成領域を有する大判基板上に、複数のパネル形成領域に渡って前記有機EL素子の陽極と陰極の一方に導通する第1の配線電極、前記パネル形成領域毎に形成され前記有機EL素子の陽極と陰極の他方に導通する第2の配線電極、前記第1の配線電極及び第2の配線電極に導通又は近接する電荷放出用の導電パターンを形成する工程と、
前記パネル形成領域に有機EL素子を形成する工程と、
前記パネル形成領域毎に前記有機EL素子を封止する封止領域を形成する工程と、
前記封止領域内で前記第1の配線電極を前記パネル形成領域毎に分断する工程と、
前記大判基板を前記パネル形成領域毎に分割して個別の有機ELパネルを形成する工程を有し、
前記第2の配線電極は、前記有機EL素子側の端部にR状部を形成すると共に、前記第2の配線電極の前記有機EL素子側とは逆側の端部を前記導電パターンに導通又は近接させることを特徴とする有機ELパネルの製造方法。
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US13/581,569 US9082736B2 (en) | 2010-03-05 | 2010-03-05 | Organic EL panel and method of manufacturing the same |
PCT/JP2010/053660 WO2011108113A1 (ja) | 2010-03-05 | 2010-03-05 | 有機elパネル及びその製造方法 |
JP2012502948A JP5638599B2 (ja) | 2010-03-05 | 2010-03-05 | 有機elパネル及びその製造方法 |
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JP2014203525A (ja) * | 2013-04-01 | 2014-10-27 | パイオニア株式会社 | 接合構造および発光装置 |
WO2018198979A1 (ja) * | 2017-04-26 | 2018-11-01 | 住友化学株式会社 | 電極付き基板、積層基板及び有機デバイスの製造方法 |
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Also Published As
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US9082736B2 (en) | 2015-07-14 |
JPWO2011108113A1 (ja) | 2013-06-20 |
US20120319570A1 (en) | 2012-12-20 |
JP5638599B2 (ja) | 2014-12-10 |
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