WO2011094941A1 - 用于制造环氧塑封压入式汽车整流二极管的模压装置 - Google Patents

用于制造环氧塑封压入式汽车整流二极管的模压装置 Download PDF

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Publication number
WO2011094941A1
WO2011094941A1 PCT/CN2010/070522 CN2010070522W WO2011094941A1 WO 2011094941 A1 WO2011094941 A1 WO 2011094941A1 CN 2010070522 W CN2010070522 W CN 2010070522W WO 2011094941 A1 WO2011094941 A1 WO 2011094941A1
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block
cavity
disposed
mold box
slider
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PCT/CN2010/070522
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English (en)
French (fr)
Inventor
曹榆
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昆山晨伊半导体有限公司
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Priority to PCT/CN2010/070522 priority Critical patent/WO2011094941A1/zh
Priority to CN201080003122.6A priority patent/CN102239554B/zh
Publication of WO2011094941A1 publication Critical patent/WO2011094941A1/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components

Definitions

  • This invention relates to a molding apparatus for manufacturing an epoxy-molded push-in type automotive rectifier diode, and more particularly to a method of manufacturing an epoxy-molded press-in type automotive rectifier diode.
  • Press-in automotive rectifier diodes are key components of automotive generators. By combining them into rectifier components, the AC power generated by the generator is converted to DC power. Due to the avalanche breakdown characteristics of the automotive rectifier diode, the fault voltage can be absorbed when the vehicle is broken, and the regulator is protected from damage. When the regulator is out of control, it can immediately break down, so that the generator does not generate electricity, acts as a fuse, protects the main controller in the vehicle from damage, and turns a vicious accident into a general fault.
  • the technical problem to be solved by the present invention is to provide a molding apparatus for a low-cost, high-reliability, push-in type automotive rectifier diode suitable for mass production.
  • the present invention provides a molding apparatus for manufacturing an epoxy plastic-molded push-in type automobile rectifier diode, comprising an elongated upper mold box and a lower mold box, characterized in that: the upper mold box is under The surface is provided with a first groove along the length direction, and the first groove is juxtaposed with the upper pressing block and the upper cavity block, and the top of the upper pressing block and the upper cavity block is in contact with the first spring;
  • the lower mold box has two step planes of a high plane and a low plane, and a second groove is disposed on the upper surface of the lower plane of the lower mold box in the longitudinal direction, and the upper pressure line block is respectively disposed in the second groove
  • the lower pressing block and the lower forming block corresponding to the upper cavity block, the loading strip is disposed above the lower mold box through the spacer, the lead of the core seat is horizontally disposed in the loading strip, and the base side of the core seat is disposed
  • the core seat pressing device comprises a " ⁇ " type slider disposed on an upper side of the lower mold box, and the upper mold box One side is provided with a locking block, the inner side of the locking block is a sloped surface, one end of the sliding block is adjacent to the bottom of the core seat, the shoulder of the sliding block is a sloped surface, and cooperates with the inclined surface of the locking block, the second spring One end is connected to the vertical inner surface of the slider, and the other end is connected to the vertical plane of the lower plane and the low plane of the lower mold box, and a stopper is arranged at one end of the lower plane of the lower mold box.
  • the foregoing molding apparatus for manufacturing an epoxy-molded push-in type automobile rectifier diode is characterized in that: the first springs are at least one and are disposed in parallel with each other.
  • the foregoing molding apparatus for manufacturing an epoxy-molded push-in type automobile rectifier diode is characterized in that: the second springs are at least one and are disposed in parallel with each other.
  • the above-mentioned molding device for manufacturing an epoxy plastic-pressed push-in type automobile rectifier diode is characterized in that: two sliding rails are respectively disposed at two ends of the slider, and a central sliding rail is disposed in a middle portion of the slider.
  • the invention discloses a molding device for manufacturing an epoxy plastic-pressed push-in type automobile rectifier diode, wherein a cavity is formed by a cavity strip of an upper mold box and a lower mold box, and then an epoxy molding compound is injected, and finally press molding, pressing lines
  • a cavity is formed by a cavity strip of an upper mold box and a lower mold box, and then an epoxy molding compound is injected, and finally press molding, pressing lines
  • the sealing of the lead end of the core seat is ensured, and the sealing of the base end of the core seat is ensured by the sliding of the slider, which has high reliability, low cost, simple process and is suitable for large-scale manufacturing.
  • FIG. 1 is a schematic view showing a mating structure of a carrier and a core holder of the present invention
  • FIG. 2 is a schematic structural view of a molding device of the present invention
  • FIG. 3 is a schematic structural view of a slider of the present invention.
  • Figure 4 is a schematic view showing the pressing state of the molding apparatus of the present invention.
  • the invention relates to a molding device for manufacturing an epoxy plastic-pressed push-in type automobile rectifier diode, comprising an elongated upper mold box 1 and a lower mold box 2, wherein a lower surface of the upper mold box 1 is provided with a first length along a length direction a groove in which the upper pressing block 3 and the upper cavity block 4 are juxtaposed, and the top of the upper pressing block 3 and the upper cavity block 4 are in contact with the first spring 5, and the upper mold box 1 is One side is provided with a locking block 12, and the inner side of the locking block 12 is a sloped surface; the lower mold box 2 has two step planes of a high plane and a low plane, and a surface along the high plane of the lower mold box 2
  • the second groove is disposed in the longitudinal direction, and the lower pressing block 6 and the lower cavity block 7 corresponding to the upper pressing block 3 and the upper cavity block 4 are respectively disposed in the second groove, and the loading strip 8 passes through the pad
  • the block 9 is disposed above the lower mold box 2, the lead
  • the first springs 5 are four and are arranged in parallel with each other.
  • the second springs 17 are four and are arranged in parallel with each other.
  • Side rails 15 are respectively disposed at two ends of the slider 11, and a center rail 16 is disposed in the middle of the slider 11.
  • the core lead diameter is ⁇ 1. 3mm.
  • the lead portion of the core seat can be sealed by pressing the line and pressing the line. Use the slider to press the large end of the core seat to seal the cavity.
  • the upper cavity and the upper bead can be adjusted in the up and down position by the first spring, and the floating structure can be used to prevent the lead from being crushed by the slider.
  • the manufacturing method of the epoxy plastic sealed push-in type automobile rectifier diode of the invention is:

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Description

技术领域
本发明涉及一种用于制造环氧塑封压入式汽车整流二极管的模压装置, 尤其 是涉及一种环氧塑封压入式汽车整流二极管的制造方法。
技术背景
压入式汽车整流二极管是汽车发电机的关键零部件, 通过组合成整流组件, 将发电机产生的交流电转换成直流电。 由于汽车整流二极管的雪崩击穿特性, 当汽车发生故障时即抛负载时能吸收故障电压, 保护调节器不受损伤。 在调节 器失控时它能立即击穿, 使发电机不发电, 起到保险丝的作用, 保护车内主控 器不受损伤, 把恶性事故化成一般故障。
现有压入式汽车整流二极管的制造方法, 都是釆用液态 "环氧灌封胶"
( Epoxy Pot t ing Adhes ive ) 灌封的方法封装汽车整流二极管, 这种方法制造 的压入式汽车整流二极管的密封性、 导热性、 可靠性均受到一定程度的限制, 且制造成本较高, 不适合大批量制造。
环氧灌封胶封装的步骤如下:
1.先将引线、 芯片、 焊片、 底座通过焊接组合在一起, 制成压入式汽车整 流二极管芯座;
2.在二极管芯座上套上塑料圈;
3.在塑料圈内灌装液态环氧灌封胶, 制成压入式汽车整流二极管。
早在 20世纪 70年代, 半导体器件就开始使用环氧塑料封装, 特别是伴随 着微电子技术以及微电子封装技术的发展, 环氧塑封料 ( Epoxy Molding Compound ) 以其高可靠性、 低成本、 制造工艺简单、 适合大规模生产等特点, 已占据整个微电子封装材料 97%以上的巿场。现在,已经广泛应用于半导体器件、 集成电路、 消费电子、 军事、 航空等各个封装领域。
压入式汽车整流二极管的发展也经过了几十年的时间, 由于其特殊的结构 设计, 至今仍釆用液态环氧灌封胶封装其产品, 使得制造成本相应较高, 大规 模生产受到限制, 产品可靠性只能维持在一定的水平上无法突破。
没有釆用环氧塑封技术制造压入式汽车整流二极管的原因有很多, 其中, 产品模压过程中芯片受到应力而导致产品失效以及可靠性降低是主要原因。 发明内容
本发明所要解决的技术问题是提供一种低成本、 高可靠性、 适合大规模生 产的压入式汽车整流二极管的模压装置。
为解决上述问题, 本发明提供了一种用于制造环氧塑封压入式汽车整流二 极管的模压装置, 包括长形的上模盒和下模盒, 其特征在于: 所述上模盒的下 表面沿长度方向设置有第一凹槽, 第一凹槽内并列嵌入上压线块和上型腔块, 所述上压线块和上型腔块的顶部与第一弹簧相接; 所述下模盒具有高平面和低 平面两个阶梯平面, 在所述下模盒的高平面上表面沿长度方向设置有第二凹槽, 在第二凹槽内设置有分别与上压线块和上型腔块相对应的下压线块和下型腔 块, 载料条通过垫块设置在下模盒上方, 芯座的引线水平设置于所述载料条内, 芯座的底座侧设置有芯座压紧装置, 上压线块和下压线块相对侧分别设置多个 直径与芯座引线直径相同的半圆形上压线条和下压线条, 在所述上型腔块和下 型腔块相对侧分别设置多个半圆形的上型腔条和下型腔条, 在所述下压线块上 部与下压线条垂直设置有进料槽, 从进料槽进入每个芯座处还设置有进料口。。
前述的用于制造环氧塑封压入式汽车整流二极管的模压装置, 其特征在于: 所述芯座压紧装置包括在下模盒的上方一侧设置的 "Π " 型滑块, 上模盒的一 侧设置有锁紧块, 所述锁紧块内侧面为斜面, 滑块的一端与芯座底部相邻, 滑 块的肩部为斜面, 并与锁紧块的斜面相配合, 第二弹簧一端与滑块竖直内表面 相接, 另一端与下模盒的高平面与低平面的垂直连接面相连接, 在下模盒的低 平面一端设置有档块。
前述的用于制造环氧塑封压入式汽车整流二极管的模压装置, 其特征在于: 所述第一弹簧至少为 1个, 且相互平行设置。
前述的用于制造环氧塑封压入式汽车整流二极管的模压装置, 其特征在于: 所述第二弹簧至少为 1个, 且相互平行设置。 前述的用于制造环氧塑封压入式汽车整流二极管的模压装置, 其特征在于: 所述滑块的两端分别设置侧滑轨, 并在滑块的中部设置一中心滑轨。
本发明所达到的有益效果:
本发明公开的用于制造环氧塑封压入式汽车整流二极管的模压装置, 釆用 上模盒和下模盒的型腔条形成空腔, 再注入环氧塑封料, 最后压制成型, 压线 条保证了芯座引线端的密封, 通过滑块挤压保证了芯座底座端的密封, 可靠性 高、 成本低、 工艺简单、 适合大规模制造。
附图说明
图 1为本发明的载料架与芯座配合结构示意图;
图 2为本发明的模压装置的结构示意图;
图 3为本发明的滑块结构示意图;
图 4为本发明的模压装置压紧状态示意图。
具体实施方式
下面结合附图对本发明作进一步的说明。
本发明一种用于制造环氧塑封压入式汽车整流二极管的模压装置, 包括长 形的上模盒 1和下模盒 2 , 所述上模盒 1的下表面沿长度方向设置有第一凹槽, 第一凹槽内并列嵌入上压线块 3和上型腔块 4 ,所述上压线块 3和上型腔块 4的 顶部与第一弹簧 5相接, 上模盒 1的一侧设置有锁紧块 12 , 所述锁紧块 12内侧 面为斜面; 所述下模盒 2 具有高平面和低平面两个阶梯平面, 在所述下模盒 2 的高平面上表面沿长度方向设置有第二凹槽, 在第二凹槽内设置有分别上压线 块 3和上型腔块 4相对应的下压线块 6和下型腔块 7 ,载料条 8通过垫块 9设置 在下模盒 2上方, 芯座 10的引线水平设置于所述载料条 8内, 在下模盒 2的上 方一侧设置有 "π " 型滑块 11 , 滑块 11的一端与芯座 10底部相邻, 滑块 11的 肩部为斜面, 并与锁紧块 12的斜面相配合, 第二弹簧 17—端与滑块 1 1竖直内 表面相接, 另一端与下模盒 2 的高平面与低平面的垂直连接面相连接, 在下模 盒 2的低平面一端设置有档块 1 3 , 上压线块和下压线块相对侧分别设置多个直 径与芯座引线直径相同的半圆形上压线条 3和下压线条 6 ,在所述上型腔块和下 型腔块相对侧分别设置多个直径是 11mm半圆形的上型腔条 4和下型腔条 7 , 在 所述下压线块上部与下压线条 6垂直设置有进料槽 14 ,从进料槽 14进入每个芯 座处还设置有进料口。 所述第一弹簧 5为 4个, 且相互平行设置。 所述第二弹 簧 17为 4个, 且相互平行设置。 所述滑块 11的两端分别设置侧滑轨 15 , 并在 滑块 11的中部设置一中心滑轨 16。 芯座引线直径为 Φ 1. 3mm。
通过上压线条和下压线条可使芯座的引线部分密封。 侧面用滑块压紧芯座的 大端, 将型腔密封。 上型腔与上压条通过第一弹簧可以调整上下位置, 釆用这 种浮动结构可以避免引线被滑块压伤。
本发明的环氧塑封压入式汽车整流二极管的制造方法为:
1 )通过一次焊接将一体化钉头引线、 芯片、 焊片、 底座组合在一起, 直接 制成汽车整流二极管芯座;
2 )在芯座的芯片部位包裹一层绝 保护胶;
3 )釆用料架, 预先将引线在料架上摆好;
4 ) 塑封时用料架将引线放在下模盒上;
5 ) 引线横放, 侧面用滑块压紧芯座的大端, 将型腔密封, 小端用压线条来 密封型腔;
6 ) 从进料槽注入环氧塑封料, 最后压制成型。
以上仅以最佳实施例对本发明做进一步的说明,然其并非对本发明的限定, 本发明的保护范围以表示在权利要求的内容为准。

Claims

权利 要 求 书
1. 一种用于制造环氧塑封压入式汽车整流二极管的模压装置, 包括长形的 上模盒( 1 ) 和下模盒( 2 ), 其特征在于: 所述上模盒( 1 ) 的下表面沿长度方 向设置有第一凹槽, 第一凹槽内并列嵌入上压线块和上型腔块, 所述上压线块 和上型腔块的顶部与第一弹簧 (5)相接; 所述下模盒(2) 具有高平面和低平 面两个阶梯平面, 在所述下模盒(2) 的高平面上表面沿长度方向设置有第二凹 槽, 在第二凹槽内设置有分别与上压线块和上型腔块相对应的下压线块和下型 腔块, 载料条(8) 通过垫块(9)设置在下模盒(2)上方, 芯座 (10) 的引线 水平设置于所述载料条(8) 内, 芯座 (10) 的底座侧设置有芯座压紧装置, 上 压线块和下压线块相对侧分别设置多个直径与芯座引线直径相同的半圆形上压 线条(3)和下压线条(6), 在所述上型腔块和下型腔块相对侧分别设置多个半 圆形的上型腔条(4) 和下型腔条(7), 在所述下压线块上部与下压线条(6) 垂直设置有进料槽 (14), 从进料槽(14)进入每个芯座处还设置有进料口。
2. 根据权利要求 1所述的用于制造环氧塑封压入式汽车整流二极管的模压 装置,其特征在于:所述芯座压紧装置包括在下模盒(2)的上方一侧设置的" π " 型滑块(11 ), 上模盒(1 ) 的一侧设置有锁紧块(12), 所述锁紧块(12) 内侧 面为斜面, 滑块(11 ) 的一端与芯座 (10)底部相邻, 滑块(11 ) 的肩部为斜 面, 并与锁紧块(I2) 的斜面相配合, 第二弹簧 (17) —端与滑块(11 ) 竖直 内表面相接, 另一端与下模盒(2) 的高平面与低平面的垂直连接面相连接, 在 下模盒(2) 的低平面一端设置有档块(13)。
3. 根据权利要求 2所述的用于制造环氧塑封压入式汽车整流二极管的模压 装置,其特征在于: 所述滑块(11 )的两端分别设置侧滑轨(15),并在滑块(11 ) 的中部设置一中心滑轨(16)。
4. 根据权利要求 1或 2所述的用于制造环氧塑封压入式汽车整流二极管的 模压装置, 其特征在于: 所述第一弹簧 (5) 至少为 1个, 且相互平行设置。
5. 根据权利要求 1或 2所述的用于制造环氧塑封压入式汽车整流二极管的 模压装置, 其特征在于: 所述第二弹簧 (17) 至少为 1个, 且相互平行设置。
PCT/CN2010/070522 2010-02-04 2010-02-04 用于制造环氧塑封压入式汽车整流二极管的模压装置 WO2011094941A1 (zh)

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CN201080003122.6A CN102239554B (zh) 2010-02-04 2010-02-04 用于制造环氧塑封压入式汽车整流二极管的模压装置

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