WO2011089939A1 - Procédé de fabrication de tête de jet d'encre - Google Patents

Procédé de fabrication de tête de jet d'encre Download PDF

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Publication number
WO2011089939A1
WO2011089939A1 PCT/JP2011/050225 JP2011050225W WO2011089939A1 WO 2011089939 A1 WO2011089939 A1 WO 2011089939A1 JP 2011050225 W JP2011050225 W JP 2011050225W WO 2011089939 A1 WO2011089939 A1 WO 2011089939A1
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WO
WIPO (PCT)
Prior art keywords
adhesive
ink
epoxy resin
compound
head
Prior art date
Application number
PCT/JP2011/050225
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English (en)
Japanese (ja)
Inventor
山田　晃久
平野　肇志
Original Assignee
コニカミノルタＩｊ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by コニカミノルタＩｊ株式会社 filed Critical コニカミノルタＩｊ株式会社
Priority to JP2011550873A priority Critical patent/JP5754378B2/ja
Priority to EP11734546.2A priority patent/EP2527151B1/fr
Publication of WO2011089939A1 publication Critical patent/WO2011089939A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/1433—Structure of nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/1609—Production of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14362—Assembling elements of heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection

Definitions

  • the present invention relates to a method for manufacturing an inkjet head, and more particularly to a method for manufacturing an inkjet head using an adhesive having both ultraviolet curable properties and thermosetting properties.
  • Liquid ejecting heads capable of ejecting liquid in the form of minute droplets have become widespread, for example, as ink jet heads used in ink jet printers that record images by ejecting ink droplets onto recording paper.
  • a method is used in which an electric current is supplied to an electric resistor disposed in a pressurizing chamber, and water in the ink is vaporized and expanded by the generated heat to apply pressure to the ink and discharge it.
  • a part of the flow path member constituting the pressurizing chamber is a piezoelectric body, or a piezoelectric body is installed in the flow path member, and the piezoelectric bodies corresponding to the plurality of nozzles are selectively driven, so that each piezoelectric body
  • a liquid is ejected from a nozzle by deforming a pressurizing chamber based on dynamic pressure.
  • the nozzle-to-nozzle spacing at a nozzle density of 180 dpi (dpi in the present invention represents the number of dots per 2.54 cm) is 140 ⁇ m.
  • the width of the pressure chamber is 70 ⁇ m. If the nozzle extends from the outer surface toward the pressure chamber side and the inner diameter on the pressure chamber side is 40 ⁇ m, the distance from the end of the partition wall to the nozzle is only 15 ⁇ m.
  • the viscosity of the adhesive will decrease due to this heating operation, so it will flow easily. Will flow into the nozzle part, and part of the nozzle part or, in the worst case, will block the entire region.
  • the ink resistance of the adhesive must be improved. For this purpose, it is effective to increase the glass transition point of the adhesive by heating it at a high temperature when curing the adhesive, but when the adhesive is heated to a high temperature, the viscosity tends to decrease and the nozzle part tends to be blocked. Increases more.
  • the surface of the flow path member may be uneven or dust may adhere to the nozzle plate.
  • An air gap without adhesive is generated between the path members, and the ink may leak through the gap.
  • the amount of adhesive applied is increased, the amount of adhesive that protrudes from the gap between the members increases, and the adhesive flows into the nozzle region. This eliminates the gap and eliminates the flow into the nozzle. It was difficult.
  • the flow path member and the nozzle plate are bonded with an adhesive containing a photocationic polymerization initiator and a specific thermal cationic polymerization initiator.
  • a method is disclosed in which an ink jet recording head is manufactured by irradiating ultraviolet rays to perform primary curing, and then heat-treating the portion that has not been exposed to light (see Patent Document 1). This can prevent the overflowing adhesive from flowing into the ink and improve the ink resistance.
  • epoxy resins containing both such a cationic photopolymerization initiator and a thermal cationic polymerization initiator still do not use the photopolymerization initiator.
  • the inhibition of the polymerization is not completely eliminated and the light is emitted, but the light is bent due to the flow of the adhesive. Moreover, since the sensitivity with respect to light is low, in order to stop the flow of an adhesive agent, light irradiation for a long time was required, and there was a problem that work efficiency was inferior.
  • the joining of the flow path member and the nozzle plate is performed by thinly applying an adhesive to the flow path member by transfer and positioning and placing the nozzle plate on the adhesive application surface. At that time, the gap between the adhesive and the nozzle plate is eliminated with time as the adhesive wets the nozzle plate.
  • Patent Document 1 has a slow clearance rate and has to be left for a long time until voids disappear, which has a problem in work efficiency.
  • Patent Document 2 describes that a one-pack type epoxy adhesive using a photocation polymerization initiator and a polyaddition type amine curing agent microcapsule together can be temporarily fixed by photocuring and then heat cured to improve adhesiveness.
  • durability to ink is insufficient when used in the manufacture of inkjet heads.
  • solvent ink or highly alkaline ink is ejected, high durability is required, but there is no description about durability against such highly corrosive ink.
  • an epoxy composition having a liquid epoxy resin containing a naphthalene-type liquid epoxy, an inorganic filler, a photocationic polymerization initiator, and a microencapsulated thermal polymerization initiator has a low temperature after irradiation with low-energy ultraviolet rays. It is described that it is cured only by heating. However, it is not described that curing is sufficiently advanced only by light irradiation.
  • the object of the present invention is that there is no gap in the adhesive at the part where the members are joined, the work efficiency is high, the adhesive does not flow into unnecessary parts, the bonding property is good, and the solvent resistance of the adhesive force is good.
  • Another object of the present invention is to provide a method for manufacturing an inkjet head.
  • a method for manufacturing an ink jet head comprising: a step of bonding a plurality of members; a step of irradiating light to a protruding portion of an adhesive; and a heating step.
  • thermosetting agent is a thermal anionic polymerization initiator.
  • the present invention there is no emission failure due to the adhesive flowing into the flow path, the working efficiency is high, the bonding property is good, the ink does not leak from the ink flow path due to peeling of the member and the adhesive, and the solvent ink In contrast, it was possible to provide a method for manufacturing an inkjet head having excellent durability.
  • the present inventor found that the step of adhering a plurality of members with an adhesive containing an epoxy resin, a photocationic polymerization initiator and a thermosetting agent resulted in an adhesive on one member.
  • the epoxy resin contains a novolac type epoxy resin
  • FIG. 1 is an exploded perspective view showing an example of an ink jet recording head
  • FIG. 2 is a rear view showing a rear surface of a head chip.
  • 1, 1 is a head chip
  • 2 is a nozzle plate bonded to the front surface of the head chip
  • 3 is a wiring substrate bonded to the rear surface of the head chip 1.
  • the surface on the side from which the liquid that hits the nozzle of the head chip 1 is discharged is referred to as “front surface”, and the opposite surface is referred to as “rear surface”.
  • the head chip 1 corresponds to a flow path member according to the present invention. In FIG. 1, the ink flow direction is from bottom to top.
  • the head chip 1 referred to in the present invention includes, for example, a flow path member 11 made of a piezoelectric body and pressure chambers (ink supply paths) 12 arranged alternately in parallel.
  • the shape of the pressure chamber 12 is such that both side walls are formed parallel to each other.
  • An outlet and an inlet of each pressure chamber 12 are arranged on the front surface and the rear surface of the head chip 1, respectively, and each pressure chamber 12 is a straight type whose size and shape are not substantially changed in the length direction from the inlet to the outlet.
  • each pressure chamber 12 has two pressure chamber rows.
  • Each pressure chamber row includes eight pressure chambers 12, but the number of pressure chambers 12 constituting the pressure chamber row in the head chip 1 is not limited at all.
  • the head chip 1 is formed by joining a piezoelectric body 101 having a plurality of grooves and a lid member 102. On the surface of the groove of the piezoelectric body 101, a drive electrode made of the metal layer 13 shown by oblique lines in FIG. 1 is formed.
  • the metal layer 13 is preferably covered with a transparent insulating layer for the purpose of preventing corrosion due to ink.
  • connection electrodes 14 (voltage application electrodes) drawn from the metal layer 13 of each pressure chamber 12 are formed.
  • the connection electrode 14 can be formed by vapor deposition or sputtering.
  • the nozzle plate 2 is provided with nozzles 21 at positions corresponding to the outlets of the pressure chambers 12 of the head chip 1, and is bonded to the front surface of the head chip 1 on which the connection electrodes 14 are formed using an adhesive. . Therefore, the inlet and outlet of each pressure chamber 12 and the nozzle 21 are linearly arranged.
  • the wiring board 3 is a plate-like member for connecting a wiring for applying a driving voltage from a driving circuit (not shown) to each metal layer 13 of the head chip 1.
  • the substrate used for the wiring substrate 3 includes a substrate made of a ceramic material such as non-polarized PZT, AlN-BN, and AlN, a substrate made of low thermal expansion plastic or glass, and a piezoelectric material used in the head chip 1.
  • a substrate obtained by depolarizing the same substrate material as the substrate material can be used.
  • a material having a difference in thermal expansion coefficient within ⁇ 3 ppm with respect to unpolarized PZT is selected.
  • the substrate constituting the wiring substrate 3 is not limited to a single plate, and a plurality of thin plate materials may be stacked to form a desired thickness.
  • the wiring substrate 3 has a larger area than the rear surface of the head chip 1 and extends in a direction (B direction in the drawing) orthogonal to the direction in which the pressure chambers 12 of the head chip 1 are arranged (pressure chamber row direction).
  • Each of the protruding ends is a wiring electrode 33 for connecting an FPC (not shown).
  • the wiring board 3 also protrudes greatly in the direction in which the pressure chambers 12 of the head chip 1 are arranged (direction A in the figure).
  • An opening 32 is formed through substantially at the center of the wiring board 3.
  • the opening 32 is formed in such a size that the opening on the inlet side of the total pressure chamber 12 facing the rear surface of the head chip 1 can be exposed.
  • a method for forming the opening 32 depending on the substrate material, a method of processing with a dicing saw, a method of processing with an ultrasonic processing machine, a method of molding and firing ceramics before sintering, a method of forming by sand blasting Etc. can be adopted.
  • Wiring electrodes 33 (voltage application electrodes) are formed on the surface of the wiring board 3 on the bonding surface side with the head chip 1 with the same number and pitch (W1 + W2) as the connection electrodes 14 formed on the rear surface of the head chip 1. Then, it extends from the peripheral edge of the opening 32 to the outer edge of the wiring board 3.
  • the wiring electrode 33 is electrically connected to each wiring formed in the FPC or the like when the FPC or the like is joined, and a drive voltage from the drive circuit is applied to the metal layer in the pressure chamber 12 via the connection electrode 14. 13 functions as an electrode for applying the voltage.
  • a dummy electrode 36 a that does not participate in driving is formed between the wiring chip 33 because the space between the head chip 1 and the wiring substrate 3 is sealed with an adhesive.
  • a positioning pattern 38 for positioning the head chip 1 is formed.
  • the positioning pattern 38 is fitted with a positioning pattern 39 formed on the rear surface of the head chip 1 at the time of joining to the head chip 1 and used when positioning the head chip 1.
  • connection electrodes 14 of the head chip 1 and the wiring board 3 are connected to each other.
  • the wiring electrodes 33 are aligned and overlapped so as to be electrically connected, and the adhesive is cured by heating and pressing at a predetermined temperature and a predetermined time.
  • the nozzle plate 2 on which the nozzles 21 are formed is bonded to the front surface of the head chip 1 with the adhesive. Thereby, an ink jet recording head is obtained.
  • the adhesive according to the present invention can be applied to the adhesion of a wiring board or the manifold to the head chip.
  • FIG. 3 is a cross-sectional view showing a state in which a nozzle plate and a head chip are bonded with an adhesive as an example of the present invention.
  • FIG. 3 shows the bonding of the head chip 1 in the ink jet recording head shown in FIG. 1 and the nozzle plate 2 joined to the front surface of the head chip 1 according to the present invention. The state joined by the agent is shown.
  • a desired amount of the adhesive 15 is applied to the surface of the head chip 1 to which the nozzle plate is bonded using a transfer method or the like.
  • an application quantity of an adhesive agent It is preferable that it is 1.0 micrometer or more and 25.0 micrometers or less as a wet film thickness when it provides. If the application amount of the adhesive is 1.0 ⁇ m or more, durability of adhesion between the head chip 1 and the nozzle plate 2 can be improved. Moreover, if it is 25.0 micrometers or less, the application amount of an adhesive agent will not become excessive, an adhesive overflow etc. can be prevented and the ooze to a nozzle area
  • the amount of adhesive applied is determined by subtracting the mass of the chip from the mass of the chip to which the adhesive has been applied, and dividing it by the specific gravity of the adhesive to obtain the capacity of the adhesive. It is calculated by dividing by.
  • the flow path member 11 may be made of any material, and examples thereof include a piezoelectric material and silicon.
  • the ink supply path including the flow path member is a piezoelectric body (piezoelectricity). It is preferable that it is comprised from ceramics.
  • any conventionally known piezoelectric ceramics can be used.
  • ceramics such as PZT and PLZT are mainly used for mixed microcrystals of PbOx, ZrOx, TiOx, softening agents or hard
  • a trace amount of a metal oxide known as an agent for example, an oxide containing Nb, Zn, Mg, Sn, Ni, La, Cr or the like is preferable.
  • PZT is lead zirconate titanate, which is preferable because it has a high packing density, a large piezoelectric constant, and good workability.
  • PZT becomes a collection of fine crystals in the form of dipoles in which atoms are displaced, one side is positive, and the other side is negative. These spontaneous polarizations are random in direction and cancel each other's polarity, so further polarization processing is required.
  • a PZT thin plate is sandwiched between electrodes, immersed in silicon oil, and polarized by applying a high electric field of about 10 to 35 kV / cm.
  • the piezoelectricity due to this polarization treatment generally disappears in PZT when a temperature higher than this is applied with a temperature around 200 ° C. as the Curie point.
  • At least one of the bonding surfaces of the head chip 1 and the nozzle plate 2 is subjected to acid treatment, plasma treatment or UV treatment.
  • a nozzle plate, a head chip and the like are placed in a vacuum chamber, and at least one selected from Ar, N 2 and O 2 or a mixed gas thereof is injected, and a plasma state is generated by an external electromagnetic field.
  • Fluorine hydrocarbon gas such as CF 4 may be used in order to improve the surface etching property.
  • the acid treatment can be performed by immersing the adhesive surface in an aqueous solution such as hydrochloric acid.
  • the UV treatment is a treatment for directly irradiating the nozzle plate or the flow path member with an ultraviolet light emitting lamp, and may be in an O 2 atmosphere in order to obtain a cleaning effect with ozone.
  • a minute groove for example, length: 3 mm, height: 360 ⁇ m, width: 70 ⁇ m
  • a pressure chamber (length: 3 mm, height: 360 ⁇ m, width: 70 ⁇ m) serving as an ink flow path is formed in the groove.
  • One end of the pressure chamber is connected to the ink storage unit via a manifold including a wiring board and a filter unit, and the other end is connected to an ink discharge port (nozzle plate).
  • the flow path member 11 forming the ink chamber has the metal layer 13 on the ink supply path surface side.
  • the metal layer 13 acts as a drive electrode for the flow path member (piezoelectric body).
  • the metal forming the metal layer includes Ni, Co, Cu, Al, Sn, Cr, etc. From the surface, it is preferable to use Al or Cu, but Ni is preferably used from the viewpoint of corrosion, strength, and cost. Alternatively, a laminated structure in which Au is further laminated on Al may be employed.
  • Examples of the formation of the metal layer 13 include a method of forming a metal film by a method using a vacuum apparatus such as an evaporation method, a sputtering method, a plating method, and a CVD (chemical vapor reaction method). It is particularly preferable to form by electroless plating. By electroless plating, a uniform and pinhole-free metal coating can be formed.
  • the thickness of the plating film is preferably in the range of 0.5 to 5 ⁇ m.
  • a material that can be ablated by laser light or a material that can be anisotropically etched is used.
  • a resin sheet such as polyimide, polyethylene terephthalate, polyamide, polysulfone, or silicon is preferably used.
  • polyimide that can withstand the high temperature applied when the ink-repellent layer is provided on the surface and can be precisely nozzle-processed by a laser.
  • Step of curing by irradiating light from the ink supply side of the flow path member After the nozzle plate 2 and the chip 1 are bonded with the adhesive 15, the adhesive is irradiated with light energy. The first curing process is performed.
  • the surface of the ink supply path 12 for light irradiation is formed of the metal layer 13.
  • the ink supply path 12 having such a metal surface, as shown in FIG. 3, the light was irradiated when irradiated from the irradiation light source from the direction indicated by the arrow A on the ink supply side.
  • the light reflected by the metal surface and attenuated until reaching the adhesive layer 15 located deeply is small, and light energy required for curing can be supplied.
  • a light source including an ultraviolet lamp that emits ultraviolet light in a specific wavelength region with stable exposure energy and a filter that transmits ultraviolet light of a specific wavelength is preferable.
  • an ultraviolet lamp a mercury lamp, a metal halide lamp, an excimer laser, an ultraviolet laser, a cold cathode tube, a hot cathode tube, a black light, an LED (light emitting diode) and the like can be applied, and in particular, a high pressure that emits ultraviolet light having a wavelength of 365 nm.
  • a mercury lamp is preferred.
  • Step 2) After the primary curing of the adhesive layer 15 is performed by light irradiation, thermal energy is applied to provide stronger adhesion. A secondary curing process is performed to cure the portion that was not exposed to light and to form an agent layer. By performing this heating step, the adhesive can reach the target solvent resistance.
  • the inkjet head moves relative to the non-recording medium while maintaining a narrow gap with the recording medium. If the non-recording medium has irregularities such as waviness, the nozzle plate may come into contact with the recording medium when the inkjet head moves. In particular, when the ink jet head is used for a long time and the used adhesive is swollen by the solvent of the ink, the nozzle plate may be peeled off by such contact. In order to improve such problems, it is effective to increase the adhesive force and to reduce the swelling of the adhesive when immersed in a solvent ink for a long period of time.
  • the heating temperature for curing the adhesive is appropriately selected depending on the type of the adhesive and in a range that does not affect the constituent members of the ink jet recording head, but the maximum temperature in the heating step is from 60 ° C. to 150 ° C. It is in the range of ° C.
  • a heating tool that can be heated by being pressed against an electric oven or an ink jet recording head is preferable, and examples thereof include a hot plate and a ribbon heater.
  • a means for cooling at least the piezoelectric body portion during the heat treatment it is preferable to use a means for circulating cold water through the aluminum block for cooling.
  • the temperature of the heating step is difficult to measure the temperature of the adhesive itself. Instead, the temperature of an oven or a pressure tool is measured and used instead.
  • the adhesive applied when manufacturing the inkjet recording head of the present invention contains an epoxy resin, a cationic photopolymerization initiator, and a thermosetting agent, the epoxy resin contains a novolac type epoxy resin, and the thermosetting agent It is characterized by being microencapsulated.
  • thermosetting agent examples include primary or secondary polyamines, thermal cationic polymerization initiators, thermal anionic polymerization initiators and the like for polyaddition or thermal polymerization of epoxy monomers. Cationic polymerization initiators and thermal anionic initiators are preferred, and thermal anionic polymerization initiators are more preferred.
  • thermosetting agent is expressed in mass parts with respect to 100 mass parts of the epoxy resin.
  • thermal cationic polymerization initiator boron trifluoride amine complex, sulfonium salt, aluminum complex and the like are used.
  • boron trifluoride amine complex is preferable, and the compound of the following general formula (I) is particularly preferable in that an adhesive cured product having high solvent resistance can be obtained.
  • R represents a hydrogen atom or an alkyl group, preferably a hydrogen atom.
  • R 1 , R 2 and R 3 each represents a hydrogen atom, an alkyl group, an alkoxy group, an aryloxy group or a halogen atom.
  • Examples of the alkyl group represented by R and R 1 to R 3 include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a tert-butyl group, an isobutyl group, a sec-butyl group, a pentyl group, and a tert group.
  • -Pentyl group hexyl group, 2-methylpentyl group, isohexyl group, heptyl group, isoheptyl group, 1-propylbutyl group, octyl group, 2-ethylhexyl group, isooctyl group, nonyl group, isononyl group, decyl group, isodecyl group , Undecyl group, dodecyl group and the like.
  • Examples of the alkoxy group represented by R 1 to R 3 include a methoxy group, an ethoxy group, an n-propoxy group, an iso-propoxy group, an n-butoxy group, a tert-butoxy group, and the like.
  • Examples of the group include a phenoxy group and a naphthyloxy group.
  • a halogen atom a chlorine atom, a bromine atom, a fluorine atom, etc. can be mentioned.
  • thermal cationic polymerization initiator represented by the general formula (I) according to the present invention will be shown, but the present invention is not limited only to these exemplified compounds.
  • Preferred thermal cationic polymerization initiators according to the present invention include complex compounds of the following aniline derivatives and boron trifluoride.
  • thermal cationic polymerization initiator represented by the general formula (I) is preferably added in an amount of 0.1 to 30 parts by mass, more preferably 0.5 to 5 parts by mass with respect to 100 parts by mass of the epoxy resin. is there.
  • thermal cationic polymerization initiators can be microencapsulated and added to the adhesive.
  • the addition amount of the microcapsules of the thermal cationic polymerization initiator is preferably 1 to 50 parts by mass, more preferably 2 to 25 parts by mass with respect to 100 parts by mass of the epoxy resin.
  • imidazoles As the thermal anionic polymerization initiator, imidazoles, tertiary amines and the like are used, and imidazoles are particularly preferably used.
  • Specific examples of imidazole include 1-methylimidazole, 1-benzyl-2-methylimidazole, 1,2-dimethylimidazole, 1-isobutyl-2-methylimidazole, 1-methyl-2-ethylimidazole, 1-ethyl.
  • Imidazole 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1- (2-hydroxy-3-phenoxypropyl) -2-ethyl-4-methylimidazole, 1- (2 -Hydroxy-3-phenoxypropyl) -2-methylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole and the like.
  • microencapsulated and added to the adhesive are microencapsulated and added to the adhesive.
  • microcapsules of the thermal anionic polymerization initiator examples include HXA-3932 (imidazole thermal polymerization initiator microencapsulated with MMA, average particle size 2 ⁇ m, manufactured by Asahi Kasei Chemicals Corporation), HX-3741 (imidazole thermal Polymerization initiator is microencapsulated with MMA, average particle size 5 ⁇ m, Asahi Kasei Chemicals Co., Ltd.), HX-3722 (Imidazole type thermal polymerization initiator is microencapsulated with MMA, average particle size 2 ⁇ m, Asahi Kasei Chemicals Co., Ltd.) Etc.) are commercially available.
  • HXA-3932 imidazole thermal polymerization initiator microencapsulated with MMA, average particle size 2 ⁇ m, manufactured by Asahi Kasei Chemicals Corporation
  • HX-3741 imidazole thermal Polymerization initiator is microencapsulated with MMA, average particle size 5 ⁇ m, Asahi Kase
  • thermal anionic polymerization initiator microcapsules are preferably added in an amount of 1 to 100 parts by weight, more preferably 10 to 80 parts by weight, based on 100 parts by weight of the epoxy resin.
  • photocationic polymerization initiator any known photoacid generator can be used as a photocationic polymerization initiator (photopolymerization initiator) for photopolymerizing a cationically polymerizable monomer.
  • a photoacid generator for example, a chemically amplified photoresist or a compound used for photocationic polymerization is used (edited by Organic Electronics Materials Research Group, “Organic Materials for Imaging”, Bunshin Publishing (1993), 187. See page 192).
  • B (C 6 F 5 ) 4 ⁇ , PF 6 ⁇ , AsF 6 ⁇ , SbF 6 ⁇ , and CF 3 SO 3 — salts of aromatic onium compounds such as diazonium, ammonium, iodonium, sulfonium, and phosphonium are listed.
  • sulfonates that generate sulfonic acid can be mentioned
  • halides that generate hydrogen halide can also be used
  • fourthly, iron allene complexes can be mentioned.
  • Examples include hexafluorophosphate, hexafluoroantimonate or pentafluorophenyl borate salt of diallyl iodonium or triallyl sulfonium, Irgacure-261 (manufactured by BASF Japan), SP-150, SP-170 (above, ADEKA) ), PI2074 and UVI-6992 (manufactured by Dow Chemical).
  • the photocationic polymerization initiator is preferably added in an amount of 0.1 to 10 parts by weight, more preferably 2 to 6 parts by weight, based on 100 parts by weight of the epoxy resin.
  • epoxy resin As an epoxy compound (epoxy resin) applicable to the adhesive according to the present invention, any of a monomer having an epoxy group and an oligomer thereof can be used. Specific examples include conventionally known aromatic epoxy compounds, alicyclic epoxy compounds, and aliphatic epoxy compounds. Hereinafter, the epoxy compound means a monomer or an oligomer thereof.
  • the epoxy compound preferably contains 70 to 99% by mass or more of an aromatic epoxy compound in the epoxy compound.
  • aromatic epoxy compound is a di- or polyglycidyl ether produced by the reaction of a polyhydric phenol having at least one aromatic nucleus or an alkylene oxide adduct thereof and epichlorohydrin.
  • the aromatic epoxy compound contains a novolak-type epoxy resin, and, for example, di- or polyglycidyl ether of bisphenol A or its polyalkylene oxide adduct, di- or polyglycidyl ether of hydrogenated bisphenol A or its polyalkylene oxide adduct, It can contain at least one of polyglycidyl ether and bisphenol F type epoxy resin.
  • examples of the polyalkylene oxide include polyethylene oxide and polypropylene oxide.
  • the epoxy resin is the aromatic epoxy compound.
  • the novolak epoxy resin is a compound having a plurality of glycidyl groups in one molecule produced by a reaction between a hydroxyl group of the novolak resin and epichlorohydrin.
  • the number of epoxy groups in one molecule has a distribution, and the average value varies depending on the synthesis conditions, but the average number of epoxy groups in one molecule is preferably 3 or more.
  • 5 to 50% by mass is preferably a novolac type epoxy resin. If 5% by mass or more is a novolac type epoxy resin, the void resolving property is excellent and high durability against ink is obtained, and if the novolac type epoxy resin is 50% by mass or less, the void resolving property is excellent. .
  • the reason why the void elimination is excellent is that by containing 5% or more novolak type epoxy, the dissolution of the microcapsules is suppressed, thereby preventing the increase in the viscosity of the adhesive. it is conceivable that.
  • the epoxy resin containing the said novolak-type epoxy resin contains an alicyclic epoxy compound further at the point from which a high photosensitivity is acquired.
  • cyclohexene oxide or cyclopentene obtained by epoxidizing a compound having at least one cycloalkane ring such as cyclohexene or cyclopentene ring with an appropriate oxidizing agent such as hydrogen peroxide or peracid.
  • An oxide containing compound is mentioned. Specific examples include (3,4-epoxycyclohexyl) methyl-3 ', 4'-epoxycyclohexylcarboxylate, bis- (2,3-epoxycyclopentyl) ether, and the like.
  • the addition amount of the alicyclic epoxy compound is preferably 1 to 50% by mass relative to the total epoxy resin. If it is 1% by mass or more, the photosensitivity is high and the inflow is suppressed by short-time irradiation, and the inflow is further prevented compared with the non-containing adhesive at the same irradiation amount. If it is 50% or less, high durability can be obtained.
  • the adhesive preferably contains a silane coupling agent from the viewpoint of improving the durability of the adhesive force.
  • silane coupling agent examples include ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldimethoxysilane, and ⁇ -glycid.
  • examples include xylpropylmethyldiethoxysilane.
  • the addition amount of the silane coupling agent is preferably 0.5 to 5 parts by mass with respect to 100 parts by mass of the epoxy resin. If it is 0.5 parts by mass or more, the durability of the adhesive force is excellent, and if it is 5 parts by mass or less, the increase in viscosity is small at room temperature storage and the pot life can be extended.
  • the ink-jet ink applicable when forming an image using the ink-jet recording apparatus equipped with the ink-jet recording head of the present invention is not particularly limited, and is a water-based ink-jet ink, a non-aqueous ink-jet ink, a wax ink, or an active curable ink-jet ink.
  • an inkjet ink having an organic solvent content of 50% or more and 100% or less of the total solvent Is for image formation using an ink-jet ink containing an organic solvent having a solubility parameter (SP value) of 16.0 or more and 21.0 or less with a resin component having a high solubility to 30% by mass or more and 100% or less of the total organic solvent. It is preferable to apply.
  • SP value solubility parameter
  • an inkjet recording method for various applications for example, outdoor signboards and electronic component manufacturing
  • an inkjet ink containing a solvent that dissolves vinyl chloride, which is a material of the image receiving sheet is used for an outdoor signboard.
  • a solvent having a high solubility in the resin is used for the inkjet ink. Even when such a resin-soluble solvent is used, it is necessary to maintain strength as an ink jet recording head.
  • the ink jet recording apparatus is preferably compatible with an ink jet ink in which 50% or more and 100% or less of the total solvent is composed of an organic solvent.
  • the solubility parameter (SP value) of the organic solvent referred to in the present invention is a value represented by the square root of the molecular aggregation energy. F. It can be calculated by the method described in Fedors, Polymer Engineering Science, 14, p147 (1974). The unit is (MPa) 1/2 and indicates a value at 25 ° C. Examples of the organic solvent having an SP value defined in the present invention include J.P. Brandup, E .; H. Also described in Immersu, “Polymer Handbook”, 3rd edition (John Wily & Sons) 1989, VII / 526-539.
  • organic solvents having a solubility parameter (SP value) of 16.0 (MPa) 1/2 or more and 21.0 (MPa) 1/2 or less are shown below, but are not limited to these exemplified compounds. .
  • SP value solubility parameter
  • the numerical value in a parenthesis represents SP value ((MPa) ⁇ 1/2 >).
  • the inkjet ink according to the present invention may contain various additives in addition to the organic solvent.
  • the ink according to the present invention can contain a color material, and as the color material, for example, a color material that forms yellow, magenta, cyan, black, blue, green, or red ink is preferably used.
  • a dye ink whose color material is a dye, or a pigment ink or a color material that forms a dispersion containing fine pigment particles that is insoluble in a solvent constituting the ink-jet ink.
  • the present invention can be applied to various ink-jet inks such as a dispersion ink made of a polymer dispersion.
  • microcapsule 1 Preparation of microcapsule 1
  • 100 parts by mass of bisphenol epoxy F type epoxy resin and 100 parts by mass of 2-methylimidazole were reacted in 200 parts by mass of a 1/1 mixed solvent of methanol and toluene at 80 ° C. for 3 hours, and then at 180 ° C. under reduced pressure.
  • the solvent was distilled off under reduced pressure to obtain a solid compound.
  • microcapsule curing agent preparation of microcapsule curing agent
  • MDI diphenylmethane diisocyanate
  • PZT lead zirconate titanate, thickness 700 ⁇ m, Curie temperature 210 ° C.
  • PZT thickness 150 ⁇ m, Curie temperature 210 ° C.
  • a groove having a depth of 300 ⁇ m and a width of 70 ⁇ m from the front surface is cut at a pitch of 140 ⁇ m over a length of 30 mm, and 512 pressure chambers A groove was formed.
  • a nickel layer having a thickness of 1 ⁇ m was formed on the surface of the groove by plating, and then the resist on the top of the pressure chamber wall and the resist on the back surface were peeled off together with the nickel plating layer on the resist.
  • a chip having a plurality of ink flow paths was formed by bonding a cover plate (depolarized PZT having a thickness of 700 ⁇ m) to the surface from which the resist at the top of the pressure chamber wall was peeled off.
  • the two chips were bonded so that the ink flow paths were parallel to each other so that the cover plate was on the outside, thereby forming a chip having two flow paths.
  • the chip manufactured in this way has drive walls and flow paths made of piezoelectric elements alternately arranged in parallel.
  • Each drive electrode was pulled out to the outer surface of the chip so that a wiring board for applying a drive voltage from the drive circuit could be connected to the drive electrode in each flow path. That is, after a resist was transferred to the rear surface of the cut surface and a pattern was formed by exposure and development, aluminum was evaporated and the resist was removed to form a lead electrode.
  • the wiring board was provided as a plate-like member for connecting a wiring for applying a driving voltage from a driving circuit (not shown) to each driving electrode of the head chip.
  • a glass plate was selected so that the difference in thermal expansion coefficient with the head chip was within ⁇ 1 ppm in order to suppress the occurrence of distortion of the head chip due to the difference in thermal expansion coefficient.
  • an opening was formed through almost the center of the wiring board. This opening was formed with a size that could expose the inlet side of all the channels of the head chip. By providing this opening, it is possible to look through all the driving walls, all the channels and all the driving electrodes of the head chip through this opening while the wiring substrate is bonded to the rear surface of the head chip.
  • wiring electrodes are formed on the surface of the wiring board on the bonding surface side with the head chip at the same number and pitch as the connection electrodes formed on the rear surface of the head chip, and extend to the wiring connection portions.
  • This wiring electrode is electrically connected to each wiring formed in the FPC when the FPC is joined, and the driving voltage supplied from the driving circuit via the FPC wiring is supplied to the channel via the connection electrode. It functions as an electrode for applying to the drive electrode.
  • the wiring board is aligned and bonded to the back surface of the chip with an anisotropic conductive adhesive so that each wiring electrode is electrically connected to each connection electrode of the chip and the opening exposes the entire flow path of the chip.
  • the wiring electrodes for FPC bonding are protected with a masking tape, and a protective film made of polyparaxylylene is formed on the pressure chamber surface including the drive electrode and the exposed portion of the cross section including the extraction electrode, thereby producing a head chip. did.
  • Adhesion of nozzle plate The following adhesive 1 was transferred and applied to the front surface of the produced head chip with a thickness of 5 ⁇ m. Next, while observing with an optical microscope, a nozzle plate (100 ⁇ m thick polyimide formed with a 30 ⁇ m diameter nozzle hole) was joined to a predetermined position on the surface of the head chip coated with the adhesive. Next, a high pressure mercury lamp was irradiated from the rear surface of the head chip at an irradiation amount of 5000 mJ / cm 2 at room temperature, and then the adhesive 1 was cured under the following curing condition 1.
  • the irradiation amount is measured by applying a light meter that measures 365 nm light to the front surface of the chip and irradiating a high-pressure mercury lamp from the rear surface of the chip as described above before applying the adhesive to the head chip.
  • the value obtained by dividing the amount of light by the aperture ratio of the chip (corresponding to the irradiation amount received by the nozzle plate when the nozzle plate is joined).
  • the FPC was bonded to the wiring electrode of the wiring board, and the common ink chamber was bonded to the rear surface of the wiring board to produce the inkjet recording head 1.
  • Ink was introduced from the common ink chamber into the pressure chamber of the chip through the opening of the wiring board, and the drive voltage could be applied from the external drive circuit through the FPC.
  • jER807 Bisphenol F type epoxy resin; manufactured by Japan Epoxy Resin
  • jER152 Novolac type epoxy resin; manufactured by Japan Epoxy Resin
  • UVI6992 photo cationic polymerization initiator; manufactured by Dow Chemical
  • Microcapsule 1 microcapsule type thermal anionic polymerization initiator 40 parts by mass (curing condition 1) It was put into an oven at 100 ° C. for 1 hour and cured by heating.
  • the adhesive was applied to the PET film with the thickness applied to the front surface of the head chip, and ultraviolet rays were irradiated from a high pressure mercury lamp while changing the time. The amount of irradiation was calculated from the minimum time when the stainless steel spatula was pressed and the tackiness disappeared.
  • Inkjet recording heads 2 to 24 were produced in the same manner as in the production of the inkjet recording head 1 except that the adhesive and coating thickness were changed as shown in Tables 1 and 2.
  • the inkjet recording head 24 was heated at 110 ° C. for 3 hours after irradiation with ultraviolet rays using the adhesive 21.
  • the epoxy resin, polymerization initiator and silane coupling agent used for adhesives 2 to 21 are shown below.
  • jER807 Bisphenol F type epoxy resin, manufactured by Japan Epoxy Resin Co., Ltd. jER828: Bisphenol A type epoxy resin, manufactured by Japan Epoxy Resin Co., Ltd. jER152: Phenol novolac epoxy resin, manufactured by Japan Epoxy Resin Co., Ltd. jER154: Phenol novolac epoxy resin EPICLON N-660 manufactured by Japan Epoxy Resin Co., Ltd .: Cresol novolac epoxy resin, Celoxide 2021: 3,4-epoxycyclohexenylmethyl-3 ′, 4′-epoxycyclohexene carboxylate manufactured by DIC Corporation, Daicel Chemical Industries, Ltd.
  • UVI6992 Photocationic polymerization initiator manufactured by Dow Chemical Co., Ltd.
  • Adekaoptomer SP-170 Photocationic polymerization initiator, manufactured by ADEKA Co., Ltd.
  • Adeka Opton P-77 thermal cationic polymerization initiator, (Ltd.) ADEKA manufactured microcapsules 1 (prepared in accordance with the above)
  • Microcapsule 2 prepared as above) 2-methylimidazole (thermal anionic polymerization initiator) Boron trifluoride aniline (thermal cationic polymerization initiator)
  • Silane coupling agent ⁇ -glycidoxypropyltrimethoxysilane The production of the head was evaluated according to the following evaluation criteria, and the results are shown in Table 3.
  • ⁇ Ink was emitted from all nozzles. All emission angles are within a range of ⁇ 1 degree. ⁇ : Ink was emitted from all nozzles. Some nozzles have an emission angle exceeding the range of ⁇ 1 degree. X: There is a nozzle that does not emit when the adhesive flows.
  • the adhesive of the present invention and the curing method are used for bonding the nozzle plate of the ink jet head, so that the nozzle plate is excellent in bonding property and the adhesive flows. It can be seen that there is no emission failure and the adhesion durability is excellent even when the solvent ink is used for a long time.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

La présente invention se rapporte à un procédé de fabrication d'une tête de jet d'encre, un processus de liaison d'une pluralité d'éléments à l'aide d'un adhésif contenant un agent thermodurcissable microcapsulé comprenant séquentiellement : une étape consistant à appliquer l'adhésif à l'un des éléments ; une étape consistant à relier les éléments ; une étape consistant à exposer la partie saillante de l'adhésif à la lumière ; et une étape de chauffage. Ainsi est produite la tête de jet d'encre, qui élimine une défaillance de jet due à l'écoulement de l'adhésif dans un canal, présente une efficacité élevée et des caractéristiques de liaison excellentes, élimine la fuite d'encre depuis un canal d'encre due au détachement mutuel des éléments et de l'adhésif, et présente une excellente durabilité également à une encre-solvant.
PCT/JP2011/050225 2010-01-22 2011-01-08 Procédé de fabrication de tête de jet d'encre WO2011089939A1 (fr)

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EP11734546.2A EP2527151B1 (fr) 2010-01-22 2011-01-08 Procédé de fabrication de tête de jet d'encre

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JP2015079603A (ja) * 2013-10-15 2015-04-23 デクセリアルズ株式会社 電気接続材料
CN111421958A (zh) * 2019-01-10 2020-07-17 东芝泰格有限公司 喷墨头、喷墨装置以及喷墨头的制造方法
JPWO2021084649A1 (fr) * 2019-10-30 2021-05-06

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JP2008149521A (ja) * 2006-12-15 2008-07-03 Canon Inc 液体吐出ヘッド及びその製造方法
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JP3986000B2 (ja) * 2002-02-21 2007-10-03 株式会社リコー インクジェットヘッド製造用エポキシ樹脂組成物及びインクジェットヘッド製造方法
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JP2008149521A (ja) * 2006-12-15 2008-07-03 Canon Inc 液体吐出ヘッド及びその製造方法
JP2009148965A (ja) * 2007-12-20 2009-07-09 Konica Minolta Holdings Inc インクジェット記録ヘッド

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Publication number Priority date Publication date Assignee Title
JP2015079603A (ja) * 2013-10-15 2015-04-23 デクセリアルズ株式会社 電気接続材料
US10154587B2 (en) 2013-10-15 2018-12-11 Dexerials Corporation Electrical connection material
CN111421958A (zh) * 2019-01-10 2020-07-17 东芝泰格有限公司 喷墨头、喷墨装置以及喷墨头的制造方法
JPWO2021084649A1 (fr) * 2019-10-30 2021-05-06
WO2021084649A1 (fr) * 2019-10-30 2021-05-06 コニカミノルタ株式会社 Tête à jet d'encre et procédé de production de tête à jet d'encre
CN114641396A (zh) * 2019-10-30 2022-06-17 柯尼卡美能达株式会社 喷墨头以及喷墨头的制造方法
JP7276490B2 (ja) 2019-10-30 2023-05-18 コニカミノルタ株式会社 インクジェットヘッド及びインクジェットヘッドの製造方法
CN114641396B (zh) * 2019-10-30 2024-03-08 柯尼卡美能达株式会社 喷墨头以及喷墨头的制造方法

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EP2527151A4 (fr) 2015-07-22

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