WO2011089747A1 - 電子モジュール及び通信機 - Google Patents
電子モジュール及び通信機 Download PDFInfo
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- WO2011089747A1 WO2011089747A1 PCT/JP2010/061978 JP2010061978W WO2011089747A1 WO 2011089747 A1 WO2011089747 A1 WO 2011089747A1 JP 2010061978 W JP2010061978 W JP 2010061978W WO 2011089747 A1 WO2011089747 A1 WO 2011089747A1
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- insulating layer
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/703—Networks using bulk acoustic wave devices
- H03H9/706—Duplexers
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
Definitions
- the present invention relates to an electronic module and a communication device including the same.
- the present invention includes an electronic module including a mounting substrate on which an electronic component is mounted on one main surface, and a part of the other main surface of the mounting substrate covered with an insulating layer, and a communication device including the same About.
- Patent Document 1 describes an example of such an electronic module.
- FIG. 12 is a schematic cross-sectional view of the electronic module described in Patent Document 1.
- the electronic module 100 includes a semiconductor element 101, which is a kind of electronic component, and a substrate 102 on which the semiconductor element 101 is mounted on one main surface 102a.
- a plurality of electrodes 103 connected to the semiconductor element 101 are formed on the other main surface 102 b of the substrate 102.
- the plurality of electrodes 103 include a ground electrode connected to a ground potential and a signal electrode related to signal input / output.
- a solder resist layer 104 is formed on the main surface 102b of the substrate 102.
- the solder resist layer 104 covers the peripheral edge of all the electrodes 103. This prevents the plurality of electrodes 103 from being short-circuited.
- a solder ball 105 is formed on each of the plurality of electrodes 103.
- the present invention has been made in view of such a point, and an object thereof is to provide an electronic module having excellent electrical characteristics.
- the electronic module according to the present invention includes an electronic component, a mounting board, a signal electrode, a ground electrode, and an insulating layer.
- the electronic component has a signal terminal and a ground terminal.
- the mounting substrate has first and second main surfaces. An electronic component is mounted on the first main surface of the mounting substrate.
- the signal electrode is formed on the second main surface of the mounting substrate.
- the signal electrode is connected to the signal terminal.
- the ground electrode is formed on the second main surface of the mounting substrate.
- the ground electrode is connected to the ground terminal.
- the insulating layer is formed so as to cover a part of the second main surface of the mounting substrate.
- the insulating layer is formed so as not to cover the end of the signal electrode facing the ground electrode.
- the insulating layer is formed separately from the end of the signal electrode facing the ground electrode.
- interval between a signal electrode and a ground electrode can be enlarged more. Therefore, the capacitance generated between the signal electrode and the ground electrode can be further reduced. Therefore, it is possible to more effectively suppress the signal from being transmitted from the signal electrode to the ground electrode via the capacitance generated between the signal electrode and the ground electrode. As a result, the electrical characteristics of the electronic module can be further improved.
- the ground electrode is formed so that an end portion of the ground electrode facing the signal electrode is covered with an insulating layer. According to this configuration, the ground electrode can be enlarged. Therefore, the ground of the electronic module can be strengthened.
- the insulating layer is formed so as to cover at least a part of the end of the signal electrode not facing the ground electrode.
- the insulating layer is provided so that a plurality of portions exposed from the insulating layer of the ground electrode are formed. That is, in this configuration, a plurality of ground electrodes are integrally formed. Therefore, the ground can be further strengthened. Further, the parasitic impedance between the ground electrode and the ground potential can be reduced.
- the mounting substrate is made of resin or ceramic.
- the insulating layer is made of resin or ceramic.
- the electronic component is a filter having an input terminal and an output terminal as signal terminals.
- the communication device according to the present invention is equipped with the electronic module according to the present invention.
- the insulating layer is formed so as not to cover the end of the signal electrode facing the ground electrode. For this reason, since it is not necessary to form a large signal electrode in consideration of the formation accuracy of the insulating layer, the interval between the signal electrode and the ground electrode can be increased. Therefore, the magnitude of the capacitance generated between the signal electrode and the ground electrode can be reduced. Therefore, it is possible to suppress a signal from being transmitted from the signal electrode to the ground electrode via the capacitance generated between the signal electrode and the ground electrode. As a result, the electrical characteristics of the electronic module can be enhanced.
- FIG. 1 is a schematic circuit diagram of a communication device according to an embodiment of the present invention.
- FIG. 2 is a schematic side view of a duplexer module according to an embodiment of the present invention.
- FIG. 3 is a schematic plan view of a second main surface of the printed wiring board in the duplexer module according to the embodiment of the present invention.
- FIG. 4 is a schematic plan view of a second main surface of the printed wiring board in the duplexer module according to the comparative example.
- FIG. 5 is a graph illustrating pass characteristics of the transmission-side filter unit of the duplexer module according to the embodiment and pass characteristics of the transmission-side filter unit of the duplexer module according to the comparative example.
- FIG. 1 is a schematic circuit diagram of a communication device according to an embodiment of the present invention.
- FIG. 2 is a schematic side view of a duplexer module according to an embodiment of the present invention.
- FIG. 3 is a schematic plan view of a second main surface of the printed wiring board in the duplexer
- FIG. 6 is a graph illustrating pass characteristics of the reception-side filter unit of the duplexer module according to the embodiment and pass characteristics of the reception-side filter unit of the duplexer module according to the comparative example.
- FIG. 7 is a graph illustrating the isolation characteristics of the duplexer module according to the embodiment and the isolation characteristics of the duplexer module according to the comparative example.
- FIG. 8 is a graph illustrating a VSWR at the transmission side signal terminal of the duplexer module according to the embodiment and a VSWR at the transmission side signal terminal of the duplexer module according to the comparative example.
- FIG. 9 is a graph showing VSWRs at the first and second reception-side signal terminals of the duplexer module according to the embodiment and VSWR at the first and second reception-side signal terminals of the duplexer module according to the comparative example.
- FIG. 10 is a graph illustrating a VSWR at the antenna terminal of the duplexer module according to the embodiment and a VSWR at the antenna terminal of the duplexer module according to the comparative example.
- FIG. 11 is a schematic plan view of a second main surface of the printed wiring board in the duplexer module according to the first modification.
- FIG. 12 is a schematic cross-sectional view of an electronic module described in Patent Document 1.
- the communication device 1 shown in FIG. 1 as an example.
- the communication device 1 is merely an example.
- the communication device according to the present invention is not limited to the communication device 1.
- the electronic module according to the present invention is not limited to the duplexer module 2 mounted on the communication device 1.
- FIG. 1 is a schematic circuit diagram of the communication device 1 of the present embodiment.
- a duplexer module 2 as an electronic module is mounted on the communication device 1.
- the communication device 1 includes an RF (Radio Frequency) circuit.
- the duplexer module 2 is provided in this RF circuit.
- the duplexer module 2 is a communication device 1 that simultaneously receives and transmits signals in a communication device 1 that is a mobile phone that supports a CDMA (Code Division Multiple Access) method such as UMTS (Universal Mobile Telecommunications System). It is used for the RF circuit.
- the duplexer module 2 is a duplexer module corresponding to UMTS-BAND2.
- the transmission frequency band (Tx band) is 1850 MHz to 1910 MHz
- the reception frequency band (Rx band) is 1930 MHz to 1990 MHz.
- the duplexer module 2 includes an antenna terminal 11, a transmission side signal terminal 12, and first and second reception side signal terminals 13a and 13b.
- a reception-side filter unit 20 is connected between the antenna terminal 11 and the first and second reception-side signal terminals 13a and 13b.
- the reception-side filter unit 20 is a balanced filter unit having a balanced-unbalanced conversion function.
- the reception-side filter unit 20 is configured by a longitudinally coupled resonator type acoustic wave filter unit.
- a transmission-side filter unit 30 is connected between the antenna terminal 11 and the transmission-side signal terminal 12.
- the transmission-side filter unit 30 is configured by a ladder-type elastic wave filter unit.
- the transmission side filter unit 30 includes a plurality of series arm resonators S1 to S4 connected in series between the antenna terminal 11 and the transmission side signal terminal 12.
- a series arm 31 is constituted by the plurality of series arm resonators S1 to S4.
- Parallel arm resonators P1 to P3 are connected between the series arm 31 and the ground potential.
- These parallel arm resonators P1 to P3 constitute parallel arms 32 to 34.
- a second inductor L2 is connected between the parallel arm resonators P1 and P2 and the ground potential.
- a third inductor L3 is connected between the parallel arm resonator P3 and the ground potential.
- connection point 22 between the connection point 21 between the transmission side filter unit 30 and the reception side filter unit 20 and the antenna terminal 11.
- a first inductor L1 for impedance matching is connected between the connection point 22 and the ground potential.
- FIG. 2 is a schematic side view of the duplexer module 2 according to the present embodiment.
- the duplexer module 2 includes an electronic component 40 and a printed wiring board 60 made of resin as a mounting board on which the electronic component 40 is mounted.
- a printed wiring board 60 made of resin
- the printed wiring board 60 may be made of ceramic.
- the electronic component 40 includes a filter chip 41 and a ceramic substrate 42 on which the filter chip 41 is flip-chip mounted.
- the filter chip 41 is sealed with a sealing resin 43 provided on the ceramic substrate 42.
- the filter chip 41 may be a boundary acoustic wave filter chip using a boundary acoustic wave, a surface acoustic wave filter chip using a surface acoustic wave, or a bulk using a bulk acoustic wave.
- An elastic wave filter chip may be used.
- the electronic component 40 At least a part of the transmission side filter unit 30 and the reception side filter unit 20 is formed.
- signal terminals 14a to 14d shown in FIG. 1 and a plurality of ground terminals for connecting the transmission-side filter unit 30, the reception-side filter unit 20, and the like to the ground potential are formed.
- the signal terminal 14 a is an output signal terminal of the transmission filter unit 30 and an input signal terminal of the reception filter unit 20.
- the signal terminal 14 b is an input signal terminal of the transmission side filter unit 30.
- the signal terminals 14 c and 14 d are first and second output balanced signal terminals of the reception-side filter unit 20.
- FIG. 3 is a schematic plan view of the second main surface 60 b of the printed wiring board 60.
- FIG. 3 is a view showing a state seen through from the upper surface of the duplexer module 2.
- signal electrodes 62a to 62d connected to the signal terminals 14a to 14d are formed.
- the signal electrode 62 a is connected to a signal terminal 14 a (see FIG. 1) that is an output signal terminal of the transmission filter unit 30 and an input signal terminal of the reception filter unit 20.
- the signal electrode 62b is connected to a signal terminal 14b (see FIG. 1) that is an input signal terminal of the transmission-side filter unit 30.
- the signal electrode 62c is connected to a signal terminal 14c (see FIG. 1) that is a first output balanced signal terminal of the reception-side filter unit 20.
- the signal electrode 62d is connected to a signal terminal 14d (see FIG. 1) that is a second output balanced signal terminal of the reception-side filter unit 20. That is, the signal electrode 62 a is the antenna terminal 11.
- the signal electrode 62 b is the transmission side signal terminal 12.
- the signal electrode 62c is the first receiving signal terminal 13a.
- the signal electrode 62d is the second reception-side signal terminal 13b.
- one ground electrode 63 connected to the plurality of ground terminals of the electronic component 40 is formed.
- a printed wiring board 60 as a mounting board has first and second main surfaces 60a and 60b.
- the electronic component 40 is mounted on the first main surface 60 a of the printed wiring board 60.
- An insulating layer 61 is formed on the second main surface 60b of the printed wiring board 60 so as to cover a part of the second main surface 60b.
- the insulating layer 61 is not particularly limited as long as it is a layer made of an insulating material.
- the insulating layer 61 may be made of resin or ceramic. In the present embodiment, specifically, the insulating layer 61 is formed of a resist resin.
- the shaded portion indicates the portion where the insulating layer 61 is formed.
- the insulating layer 61 is formed so as not to cover the end portions 62a1, 62b1, 62c1, and 62d1 of the signal electrodes 62a to 62d facing the ground electrode 63. More specifically, the insulating layer 61 is formed separately from the end portions 62a1, 62b1, 62c1, and 62d1 of the signal electrodes 62a to 62d facing the ground electrode 63. On the other hand, the insulating layer 61 is formed so as to cover the end portions 63a to 63d of the ground electrode 63 facing the signal electrodes 62a to 62d.
- the ground electrode 63 is formed so that the end portions 63 a to 63 d of the ground electrode 63 facing the signal electrodes 62 a to 62 d are covered with the insulating layer 61.
- the insulating layer 61 is provided so that a plurality of ground terminal portions, which are portions exposed from the insulating layer 61 in the ground electrode 63, are formed.
- ground terminal portions 64a to 64e are formed. That is, in the present embodiment, the plurality of ground terminal portions 64 a to 64 e are constituted by one ground electrode 63.
- FIG. 4 shows a schematic plan view of the second main surface of the printed wiring board in the duplexer module according to the comparative example.
- FIG. 4 is a diagram illustrating a state seen through from the upper surface of the duplexer module according to the comparative example.
- members having substantially the same functions as those of the present embodiment are also referred to by common symbols in the comparative example.
- the insulating layer 61-1 has ends 62a1-1, 62b1-1, 62c1-1, 62d1 where the insulating layer 61-1 faces the ground electrode 63 of the signal electrodes 62a-1 to 62d-1.
- This embodiment differs from the present embodiment in that it is formed so as to cover -1.
- FIG. 5 shows the pass characteristic of the transmission side filter unit 30 of the duplexer module 2 according to the present embodiment and the pass characteristic of the transmission side filter unit of the duplexer module according to the comparative example.
- the duplexer module 2 has a larger attenuation than the duplexer module according to the comparative example.
- the smallest attenuation is 43.0 dB
- the smallest attenuation is 41.
- the minimum attenuation in the reception frequency band (1930 MHz to 1990 MHz) was 1.3 dB larger in this embodiment than in the comparative example.
- FIG. 6 shows the pass characteristic of the reception-side filter unit 20 of the duplexer module 2 according to the present embodiment and the pass characteristic of the reception-side filter unit of the duplexer module according to the comparative example.
- the duplexer module 2 has a larger attenuation than the duplexer module according to the comparative example.
- the smallest attenuation is 53.3 dB in the duplexer module 2 according to the present embodiment, and the smallest attenuation is 51 in the duplexer module according to the comparative example.
- 0.0 dB and in this embodiment, the smallest attenuation in the transmission frequency band (1850 MHz to 1910 MHz) was 2.3 dB larger than in the comparative example.
- FIG. 7 shows the isolation characteristics of the duplexer module 2 according to the present embodiment and the isolation characteristics of the duplexer module according to the comparative example.
- the isolation characteristic shown in FIG. 7 is an isolation characteristic between the transmission-side signal terminal 12 and the first and second reception-side signal terminals 13a and 13b.
- the present embodiment has better isolation characteristics than the comparative example in both the reception frequency band (1930 MHz to 1990 MHz) and the transmission frequency band (1850 MHz to 1910 MHz).
- the smallest attenuation in the transmission frequency band (1850 MHz to 1910 MHz) is 56.5 dB in the present embodiment and 52.5 dB in the comparative example, and this embodiment is the comparative example.
- the smallest attenuation in the transmission frequency band was 4.0 dB larger.
- the smallest attenuation in the reception frequency band (1930 MHz to 1990 MHz) is 48.9 dB in the present embodiment, and 46.6 dB in the comparative example, and the present embodiment is more preferable than the comparative example.
- the smallest attenuation in the reception frequency band was 2.3 dB larger.
- FIG. 8 shows a voltage standing wave ratio (VSWR: Voltage Standing Wave Ratio) at the transmission-side signal terminal 12 of the duplexer module 2 according to the present embodiment, and a VSWR at the transmission-side signal terminal of the duplexer module according to the comparative example.
- FIG. 9 shows the VSWR at the first and second reception side signal terminals 13a and 13b of the duplexer module 2 according to the present embodiment, and the VSWR at the first and second reception side signal terminals of the duplexer module according to the comparative example.
- FIG. 10 shows a VSWR at the antenna terminal 11 of the duplexer module 2 according to the present embodiment and a VSWR at the antenna terminal of the duplexer module according to the comparative example.
- the VSWR at any of the transmission side signal terminal 12, the first and second reception side signal terminals 13a and 13b, and the antenna terminal 11 is better than the comparative example.
- the maximum value of the VSWR in the transmission frequency band (1850 MHz to 1910 MHz) is 1.49 at the transmission side signal terminal 12.
- the maximum value of VSWR in the transmission frequency band (1850 MHz to 1910 MHz) at the transmission side signal terminal was 1.69.
- the maximum value of the VSWR in the reception frequency band (1930 MHz to 1990 MHz) is 1.38 at the first and second reception-side signal terminals 13a and 13b.
- the maximum value of the VSWR in the reception frequency band (1930 MHz to 1990 MHz) at the reception-side signal terminal was 1.56. As shown in FIG.
- the maximum value of the VSWR in the reception frequency band (1930 MHz to 1990 MHz) at the antenna terminal 11 is 1.38, whereas the comparative example In the duplexer module according to the above, the maximum value of VSWR in the reception frequency band (1930 MHz to 1990 MHz) at the antenna terminal was 1.56.
- the insulating layer 61 made of resin or ceramic is generally formed by printing and then curing an insulating material. For this reason, when forming the insulating layer 61, it is necessary to consider printing position shift of the insulating material, shrinkage of the insulating material during curing, and the like. Therefore, as can be seen from the comparison between FIG. 3 and FIG. 4, the end portions 62a1-1 to 62d1-1 of the signal electrodes 62a-1 to 62d-1 are covered with the insulating layer 61-1, as in the comparative example.
- the signal electrodes 62a-1 to 62d-1 need to be formed large in consideration of the above-described displacement and contraction.
- the length of each side of the signal electrodes 62a-1 to 62d-1 is made 100 ⁇ m or more larger than the signal electrodes 62a-1 to 62d-1 of the present embodiment shown in FIG.
- the distance between the signal electrodes 62a-1 to 62d-1 and the ground electrode 63 is shortened. Therefore, in the comparative example, the capacitance generated between the signal electrodes 62a-1 to 62d-1 and the ground electrode 63 is increased. Therefore, the signal transmitted through this capacitance increases. As a result, the attenuation amount outside the pass band of the transmission side filter unit and the reception side filter unit is reduced, or the isolation characteristic is deteriorated.
- the higher the frequency band used the greater the influence of capacitance. Therefore, the influence is particularly great in a duplexer module corresponding to UMTS-BAND2, and electrical characteristics such as out-of-band attenuation and isolation characteristics are deteriorated.
- the signal electrode 62a when the insulating layer 61 is formed so as not to cover the end portions 62a1, 62b1, 62c1, 62d1 of the signal electrodes 62a to 62d facing the ground electrode 63 as in the present embodiment, the signal electrode 62a. It is not necessary to form a large ⁇ 62d. Therefore, the distance between the signal electrodes 62a to 62d and the ground electrode 63 can be increased. Therefore, the capacitance generated between the signal electrodes 62a to 62d and the ground electrode 63 can be reduced. Therefore, the amount of attenuation outside the passband of the transmission side filter unit and the reception side filter unit can be increased, the isolation characteristic can be improved, and a more favorable VSWR characteristic can be obtained. That is, good electrical characteristics can be realized.
- the duplexer module 2 of the present embodiment has an advantage over the duplexer module of the comparative example in addition to the above points.
- the printed wiring board 60 as the mounting board is made of resin and the insulating layer 61 is made of a resist resin, the surface flatness of the signal electrodes 62a to 62d and the ground electrode 63 is high. The connection stability can be improved.
- the resist resin is thermally cured after printing the resist resin.
- the resin printed wiring board 60 is deformed due to the shrinkage of the resist resin, and is formed on the printed wiring board 60 and the second main surface 60b.
- the flatness of the signal electrodes 62a to 62d and the ground electrode 63 decreases.
- the degree of deformation of the printed wiring board 60 due to the shrinkage of the resist resin decreases as the area of the insulating layer 61 decreases.
- the insulating layer 61 is formed so as not to cover the end portions 62a1, 62b1, 62c1, and 62d1 facing the ground electrode 63 of the signal electrodes 62a to 62d.
- the area of is small. Therefore, the degree of deformation of the printed wiring board 60 due to the shrinkage of the resist resin in the step of thermosetting the resist resin can be reduced. Therefore, the flatness of the signal electrodes 62a to 62d and the ground electrode 63 can be kept high.
- the duplexer module 2 of the present embodiment has higher measurement stability than the duplexer module of the comparative example by using a measuring device that uses an anisotropic conductive rubber as a connection terminal, using an anisotropic conductive rubber (Anisotropic Conductive Rubber). Can be done.
- the anisotropic conductive rubber is used when measuring the electrical characteristics in the characteristic selection process of the defective product in the manufacturing process of the electronic module whose terminal is an LGA (Land Grid Array) type. May be used.
- an anisotropic conductive rubber made of silicon rubber and a metal pin and an electronic module are arranged on the measurement jig, and pressure is applied from the upper surface side of the electronic module.
- the silicon rubber constituting the anisotropic conductive rubber is pressurized and contracted via the electronic module, and the measurement jig and the electronic are connected via a metal pin embedded in the silicon rubber. Conduction is made by physical contact with the module terminals.
- the peripheral portions of all the electrodes formed on the second main surface of the printed wiring board are covered with an insulating layer.
- the surface of an electrode is located in the recessed part of an insulating layer. Therefore, in order to achieve conduction between each electrode and the measuring jig, the silicon rubber must be deformed by the thickness of the insulating layer.
- the peripheral portions of the signal electrodes 62 a to 62 d formed on the second main surface 60 b of the printed wiring board 60 are not covered with the insulating layer 61. That is, the signal electrodes 62a to 62d and the insulating layer 61 are formed apart from each other. Therefore, as compared with the comparative example, the degree of deformation of the silicon rubber necessary for the conduction between the signal electrodes 62a to 62d and the measuring jig may be smaller than that of the comparative example. For this reason, measurement stability improves.
- ground terminal portions 64a to 64e are integrally formed as the ground electrode 63, even one of the ground terminal portions 64a to 64e that are exposed portions of the ground electrode 63 is electrically connected to the measurement jig. do it. Therefore, measurement stability is further improved.
- FIG. 11 is a schematic plan view of the second main surface 60b of the printed wiring board 60 in the duplexer module according to the first modification.
- FIG. 11 is a diagram illustrating a state seen through from the upper surface of the duplexer module according to the first modification.
- the present invention is not limited to this configuration.
- the insulating layer 61 is formed so as to cover at least a part of the end portions 62a2, 62b2, 62c2, and 62d2 of the signal electrodes 62a to 62d that are not opposed to the ground electrode 63. May be. That is, the insulating layer 61 is formed so as to cover the ends of the signal electrodes 62a to 62d that are not opposed to any other electrode.
- the insulating layer 61 is formed so as to cover the portion of the signal electrodes 62a to 62d located on the peripheral portion of the printed wiring board 60. In this way, when the duplexer module 2 is mounted on the RF circuit of the communication device 1, the signal electrodes 62a to 62d are effectively prevented from being peeled off due to thermal stress.
- the end portions 62a1 to 62d1 of the signal electrodes 62a to 62d are not covered with the insulating layer 61, so that, as in the above embodiment, the electrical characteristics are improved, the electrode flatness is improved, Each effect of improving the measurement stability of electrical measurement is exhibited.
- the mounting substrate may be made of ceramic.
- the insulating layer may also be made of ceramic.
- the type of the electronic component is not particularly limited.
- Electronic modules include multiple duplexers, multiple high-frequency filters, triplexers, etc., duplexers, triplexers and high-frequency filters, duplexers, triplexers and power amplifiers May be installed.
- the electronic component may be a capacitor, an inductor, a semiconductor element, or the like.
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Abstract
Description
図11は、第1の変形例に係るデュプレクサモジュールにおけるプリント配線基板60の第2の主面60bの略図的平面図である。なお、図11は、第1の変形例に係るデュプレクサモジュールの上面から透視した状態を示した図である。
上記実施形態では、実装基板としてのプリント配線基板が樹脂製である場合について説明した。但し、実装基板は、セラミック製であってもよい。また、絶縁層もセラミック製であってもよい。
2…デュプレクサモジュール
11…アンテナ端子
12…送信側信号端子
13a…第1の受信側信号端子
13b…第2の受信側信号端子
14a~14d…信号端子
20…受信側フィルタ部
21,22…接続点
30…送信側フィルタ部
31…直列腕
32~34…並列腕
40…電子部品
40a…電子部品の裏面
41…フィルタチップ
42…セラミック基板
43…封止樹脂
60…プリント配線基板
60a…プリント配線基板の第1の主面
60b…プリント配線基板の第2の主面
61…絶縁層
62a~62d…信号電極
62a1~62d1…信号電極のグラウンド電極と対向している端部
62a1-1~62d1-1…端部
62a2~62d2…信号電極のグラウンド電極と対向していない端部
63…グラウンド電極
63a~63d…グラウンド電極の信号電極と対向している端部
64a~64e…グラウンド端子部
P1~P3…並列腕共振子
S1~S4…直列腕共振子
L1…第1のインダクタ
L2…第2のインダクタ
L3…第3のインダクタ
Claims (9)
- 信号端子と、グラウンド端子とを有する電子部品と、
第1及び第2の主面を有し、前記電子部品が前記第1の主面に実装されている実装基板と、
前記実装基板の前記第2の主面上に形成されており前記信号端子に接続されている信号電極と、
前記実装基板の前記第2の主面上に形成されており前記グラウンド端子に接続されているグラウンド電極と、
前記実装基板の前記第2の主面の一部を覆うように形成されている絶縁層とを備え、
前記絶縁層は、前記信号電極の前記グラウンド電極と対向している端部を覆わないように形成されている、電子モジュール。 - 前記絶縁層は、前記信号電極の前記グラウンド電極と対向している端部から隔離して形成されている、請求項1に記載の電子モジュール。
- 前記グラウンド電極は、前記グラウンド電極の前記信号電極と対向している端部が前記絶縁層により覆われるように形成されている、請求項1または2に記載の電子モジュール。
- 前記絶縁層は、前記信号電極の前記グラウンド電極と対向していない端部の少なくとも一部の上を覆うように形成されている、請求項1~3のいずれか一項に記載の電子モジュール。
- 前記絶縁層は、前記グラウンド電極の前記絶縁層から露出している部分が複数形成されるように設けられている、請求項1~4のいずれか一項に記載の電子モジュール。
- 前記実装基板は、樹脂製またはセラミック製である、請求項1~5のいずれか一項に記載の電子モジュール。
- 前記絶縁層は、樹脂製またはセラミック製である、請求項1~6のいずれか一項に記載の電子モジュール。
- 前記電子部品は、前記信号端子として入力端子と出力端子とを有するフィルタである、請求項1~7のいずれか一項に記載の電子モジュール。
- 請求項1~8のいずれか一項に記載の電子モジュールを搭載した通信機。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2011550786A JP5382141B2 (ja) | 2010-01-25 | 2010-07-15 | 電子モジュール及び通信機 |
CN201080061982.5A CN102714491B (zh) | 2010-01-25 | 2010-07-15 | 电子模块及通信机 |
DE112010005175T DE112010005175T5 (de) | 2010-01-25 | 2010-07-15 | Elektronisches Modul und Kommunikationsvorrichtung |
US13/556,570 US8797759B2 (en) | 2010-01-25 | 2012-07-24 | Electronic module and communication apparatus |
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JP2010-013203 | 2010-01-25 | ||
JP2010013203 | 2010-01-25 |
Related Child Applications (1)
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US13/556,570 Continuation US8797759B2 (en) | 2010-01-25 | 2012-07-24 | Electronic module and communication apparatus |
Publications (1)
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WO2011089747A1 true WO2011089747A1 (ja) | 2011-07-28 |
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PCT/JP2010/061978 WO2011089747A1 (ja) | 2010-01-25 | 2010-07-15 | 電子モジュール及び通信機 |
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US (1) | US8797759B2 (ja) |
JP (1) | JP5382141B2 (ja) |
CN (1) | CN102714491B (ja) |
DE (1) | DE112010005175T5 (ja) |
WO (1) | WO2011089747A1 (ja) |
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DE102014226545A1 (de) | 2014-12-19 | 2016-06-23 | Bayerische Motoren Werke Aktiengesellschaft | Kraftfahrzeug mit einem kryogenen Druckbehälter und Verfahren zum Betanken eines kryogenen Druckbehälters eines Kraftfahrzeuges |
TWI698008B (zh) * | 2018-08-31 | 2020-07-01 | 英屬開曼群島商鳳凰先驅股份有限公司 | 具能量轉換功能之集積化驅動模組及其製造方法 |
Citations (5)
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JPH04121780U (ja) * | 1991-04-19 | 1992-10-30 | 富士写真フイルム株式会社 | プリント基板 |
JPH11145605A (ja) * | 1997-11-10 | 1999-05-28 | Matsushita Electric Ind Co Ltd | プリント配線板 |
JP2003087094A (ja) * | 2001-07-02 | 2003-03-20 | Toshiba Corp | 弾性表面波装置及びその製造方法 |
JP2006211620A (ja) * | 2005-01-31 | 2006-08-10 | Tdk Corp | フィルタ及びデュプレクサ |
JP2007059533A (ja) * | 2005-08-23 | 2007-03-08 | Murata Mfg Co Ltd | 回路モジュール |
Family Cites Families (6)
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JP2002043368A (ja) | 2000-07-25 | 2002-02-08 | Toshiba Corp | 電気回路装置とその製造方法 |
TW575949B (en) * | 2001-02-06 | 2004-02-11 | Hitachi Ltd | Mixed integrated circuit device, its manufacturing method and electronic apparatus |
EP1249934B1 (en) * | 2001-04-09 | 2013-07-31 | Murata Manufacturing Co., Ltd. | Surface acoustic wave apparatus and communications unit |
JP2003249747A (ja) | 2002-02-25 | 2003-09-05 | Toshiba Corp | プリント基板設計方法、プリント基板配線cad装置、プリント基板 |
JP4254248B2 (ja) * | 2002-04-05 | 2009-04-15 | 株式会社村田製作所 | 電子装置 |
JP3963862B2 (ja) * | 2003-05-20 | 2007-08-22 | 富士通メディアデバイス株式会社 | 弾性表面波フィルタ及びそれを有する分波器 |
-
2010
- 2010-07-15 DE DE112010005175T patent/DE112010005175T5/de not_active Withdrawn
- 2010-07-15 JP JP2011550786A patent/JP5382141B2/ja active Active
- 2010-07-15 WO PCT/JP2010/061978 patent/WO2011089747A1/ja active Application Filing
- 2010-07-15 CN CN201080061982.5A patent/CN102714491B/zh active Active
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2012
- 2012-07-24 US US13/556,570 patent/US8797759B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04121780U (ja) * | 1991-04-19 | 1992-10-30 | 富士写真フイルム株式会社 | プリント基板 |
JPH11145605A (ja) * | 1997-11-10 | 1999-05-28 | Matsushita Electric Ind Co Ltd | プリント配線板 |
JP2003087094A (ja) * | 2001-07-02 | 2003-03-20 | Toshiba Corp | 弾性表面波装置及びその製造方法 |
JP2006211620A (ja) * | 2005-01-31 | 2006-08-10 | Tdk Corp | フィルタ及びデュプレクサ |
JP2007059533A (ja) * | 2005-08-23 | 2007-03-08 | Murata Mfg Co Ltd | 回路モジュール |
Also Published As
Publication number | Publication date |
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US20120287589A1 (en) | 2012-11-15 |
CN102714491B (zh) | 2015-02-18 |
JP5382141B2 (ja) | 2014-01-08 |
CN102714491A (zh) | 2012-10-03 |
US8797759B2 (en) | 2014-08-05 |
JPWO2011089747A1 (ja) | 2013-05-20 |
DE112010005175T5 (de) | 2012-10-31 |
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