WO2011077891A1 - Procédé de fabrication d'un boîtier creux - Google Patents

Procédé de fabrication d'un boîtier creux Download PDF

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Publication number
WO2011077891A1
WO2011077891A1 PCT/JP2010/070967 JP2010070967W WO2011077891A1 WO 2011077891 A1 WO2011077891 A1 WO 2011077891A1 JP 2010070967 W JP2010070967 W JP 2010070967W WO 2011077891 A1 WO2011077891 A1 WO 2011077891A1
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WO
WIPO (PCT)
Prior art keywords
holding member
photocurable resin
terminal
recess
hollow package
Prior art date
Application number
PCT/JP2010/070967
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English (en)
Japanese (ja)
Inventor
和則 井上
剛 横山
一宏 松本
Original Assignee
太陽誘電株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 太陽誘電株式会社 filed Critical 太陽誘電株式会社
Publication of WO2011077891A1 publication Critical patent/WO2011077891A1/fr

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's

Definitions

  • the present disclosure relates to a method for manufacturing a hollow package.
  • the acoustic wave element is used for a filter element or an oscillator of a television receiver (hereinafter abbreviated as TV), a video tape recorder (hereinafter abbreviated as VTR), a DVD (Digital Versatile Disc) recorder, a cellular phone, or the like. Yes.
  • TV television receiver
  • VTR video tape recorder
  • DVD Digital Versatile Disc
  • SAW Surface acoustic wave Device
  • SAW devices are widely used in various circuits for processing radio signals in a frequency band of 45 MHz to 2 GHz, for example.
  • Examples of the circuit provided with the SAW device include a transmission bandpass filter circuit, a reception bandpass filter circuit, a local transmission filter circuit, an antenna duplexer, an intermediate frequency filter circuit, and an FM modulator.
  • circuits including SAW devices are often modularized together with other circuits, and surface-mountable and low-profile SAW devices are required. I came. At the same time, it is required to ensure sufficient airtight reliability of the SAW device.
  • Patent Document 1 discloses a manufacturing method in which a melting resin is placed on a piezoelectric substrate, a spacer and an upper plate are placed thereon, and the melting resin is dissolved and removed to form a hollow structure.
  • Patent Document 2 discloses a manufacturing method in which a structural element structure disposed on a substrate is surrounded by a frame, covered with an auxiliary film, and covered with a reactive resin layer.
  • Patent Document 3 discloses a method of manufacturing a surface acoustic wave device which is formed by forming a frame with a resin film on the circuit or surface acoustic wave element side and bonding them together.
  • Patent Document 4 discloses a method of manufacturing a surface acoustic wave device which is formed by forming a frame with a photosensitive resin on the circuit or surface acoustic wave device side and bonding them together.
  • the method for manufacturing a hollow package disclosed in the present application is a method for manufacturing a hollow package in which a device including a vibration element and a terminal electrically connected to the vibration element is packaged to have a hollow structure.
  • a holding member that is capable of transmitting light that cures the photocurable resin, has a convex portion formed at a position corresponding to the terminal in the device, and has a concave portion formed at a position corresponding to the vibration element.
  • the method for manufacturing a hollow package disclosed in the present application is a method for manufacturing a hollow package in which a device including a vibration element and a terminal electrically connected to the vibration element is packaged to have a hollow structure.
  • the first concave portion is formed at a position corresponding to the vibration element, and the second concave portion is formed at a position corresponding to the terminal in the device.
  • FIG. Sectional drawing which shows the manufacturing process of the hollow package concerning Example 1.
  • FIG. Sectional drawing which shows the manufacturing process of the hollow package concerning Example 1.
  • FIG. Sectional drawing which shows the manufacturing process of the hollow package concerning Example 1.
  • FIG. Sectional drawing which shows the manufacturing process of the hollow package concerning Example 1.
  • FIG. Sectional drawing which shows the manufacturing process of the hollow package concerning Example 1.
  • FIG. Sectional drawing which shows the manufacturing process of the hollow package concerning Example 1.
  • FIG. Sectional drawing which shows the manufacturing process of the cover concerning Example 1.
  • FIG. Sectional drawing which shows the manufacturing process of the cover concerning Example 1.
  • FIG. Sectional drawing which shows the manufacturing process of the cover concerning Example 1.
  • FIG. Sectional drawing which shows the manufacturing process of the cover concerning Example 1.
  • FIG. Sectional drawing which shows the manufacturing process of the cover concerning Example 1.
  • FIG. Sectional drawing which shows the manufacturing process of the cover concerning Example 1.
  • FIG. Sectional drawing which shows the manufacturing process of the cover concerning Example 1.
  • FIG. Sectional drawing which shows the manufacturing process of the cover concerning Example 1.
  • FIG. Sectional drawing which shows the manufacturing process of the cover concerning Example 1.
  • FIG. Sectional drawing which shows the manufacturing process of the cover concerning Example 1.
  • FIG. Sectional drawing which shows the manufacturing process of the cover concerning Example 1.
  • FIG. Sectional drawing which shows the manufacturing process of the cover concerning Example 1.
  • FIG. Sectional drawing which shows the manufacturing process of the hollow package concerning Example 2.
  • FIG. Sectional drawing which shows the manufacturing process of the hollow package concerning Example 2.
  • a method for manufacturing a hollow package is a method for manufacturing a hollow package in which a device including a vibration element and a terminal electrically connected to the vibration element is packaged so as to have a hollow structure.
  • Preparing a holding member capable of transmitting light that cures the functional resin, forming a convex portion at a position corresponding to the terminal in the device, and forming a concave portion at a position corresponding to the vibration element; and the holding A step of applying the photocurable resin to a member; a step of bonding the holding member and the device in a posture in which the vibration element is positioned in the recess; and irradiating the photocurable resin with light.
  • the method includes a step of curing the photocurable resin, a step of peeling the holding member from the photocurable resin, and a step of exposing the terminal.
  • the thickness of the photocurable resin applied in the applying step is larger than the thickness of the photocurable resin of the terminal portion bonded in the bonding step, and the step of exposing the terminal includes
  • the method can include a process of etching the photo-curing resin to a thickness greater than that of the photo-curing resin of the terminal portion to expose the terminal portion.
  • the holding member includes a step of applying a first mask material to a position overlapping the terminal portion on a substrate member that transmits at least ultraviolet rays, etching the substrate member, and forming the convex portion.
  • the holding member is a substrate member that transmits at least ultraviolet rays, a step of applying a mask material to a position overlapping the terminal portion, etching the substrate member, and forming the concave portion and the convex portion. It can be set as the method prepared including the process of forming, the process of removing the said mask material, and the process of apply
  • a method for manufacturing a hollow package is a method for manufacturing a hollow package in which a device including a vibration element and a terminal electrically connected to the vibration element is packaged so as to have a hollow structure.
  • a holding member is prepared which is capable of transmitting light for curing the functional resin, has a first recess formed at a position corresponding to the vibration element, and has a second recess formed at a position corresponding to the terminal in the device.
  • a step of applying the photocurable resin to the holding member; and the holding element in a posture in which the vibration element is located in the first recess and the terminal and the second recess are in contact with each other.
  • the depth of the second recess may be deeper than the depth of the first recess.
  • the roughness of the inner surface of the second recess is higher than the roughness of a portion of the holding member that is in contact with the ultraviolet curable resin, excluding the second recess. be able to.
  • the photo-curable resin may be an ultraviolet curable resin.
  • FIG. 1 is a perspective view of a hollow package.
  • FIG. 2 is a cross-sectional view taken along the line ZZ in FIG.
  • the hollow package shown in FIGS. 1 and 2 is an example of a hollow package that can be manufactured by the manufacturing method according to the present embodiment.
  • the hollow package according to the present embodiment has a configuration in which the acoustic wave element is covered with a cover having a hollow structure, but the drawing of the cover is omitted in FIG. 1 in order to clearly illustrate the structure of the acoustic wave element. is doing.
  • the surface acoustic wave device is taken as an example of the surface acoustic wave device of the present embodiment.
  • the acoustic wave element shown in FIGS. 1 and 2 includes a cover 2, a substrate 3, a vibration element 4, terminal parts 5 and 6, and a wiring part 7.
  • the vibration element 4 is, for example, a comb-shaped electrode.
  • the terminal portions 5 and 6 are at least partially exposed from the cover 2 and can receive or output electrical signals.
  • the wiring part 7 electrically connects the vibration element 4 and the terminal parts 5 and 6.
  • the cover 2 has a substantially dome-shaped bulge in which at least the vibration element 4 can be contained.
  • the cover 2 can be formed of resin.
  • the cover 2 is fixed in close contact with the substrate 3 and the like, and a space 8 is formed between the cover 2 and the substrate 3 by a substantially dome-shaped bulge.
  • the cover 2 hermetically seals at least the vibration element 4.
  • FIG. 3A is a cross-sectional view of the cover holding member 1.
  • a cover holding member 1 shown in FIG. 3A is prepared.
  • the cover holding member 1 should just be formed with the material which can permeate
  • a recess 1 a is formed at a location corresponding to the vibration element 4 formed on the surface of the substrate 3 to be joined in a later step.
  • the cover holding member 1 has convex portions 1 b and 1 c formed at locations corresponding to the terminal portions 5 and 6 formed on the surface of the substrate 3.
  • the cover holding member 1 is preferably subjected to a mold release treatment on the surface including the concave portion 1a, the convex portions 1b and 1c.
  • the mold release process is a process for facilitating peeling of the ultraviolet curable resin applied in a later step.
  • the mold release process is preferably a process of coating the surface of the cover holding member 1 with, for example, a fluororesin.
  • an ultraviolet curable resin 2a before being cured is applied to the surface side including the concave portions 1a, the convex portions 1b and 1c of the cover holding member 1.
  • the ultraviolet curable resin 2a may be at least a material that can be used for packaging.
  • the cover holding member 1 coated with the ultraviolet curable resin 2a and the wafer 10 are joined (see arrow A).
  • Wafer 10 has vibration element 4, wiring portion 7, and terminal portions 5 and 6 on the surface of substrate 3.
  • the concave portion 1a of the cover holding member 1 covers the vibration element 4, the position of the convex portion 1b matches the position of the terminal portion 5, and the position of the convex portion 1c and the terminal portion. Alignment is performed so that the position 6 matches.
  • FIG. 3D shows a state where the cover holding member 1 and the wafer 10 are joined. At this time, if the cover holding member 1 and the wafer 10 are joined in a nitrogen atmosphere, it is desirable that the ultraviolet curable resin is easily cured.
  • ultraviolet light (see arrow B) is irradiated from the cover holding member 1 side to cure the ultraviolet curable resin 2a.
  • the cured ultraviolet curable resin 2a is referred to as a cover 2.
  • an ultraviolet light source an LED light source (Light-Emitting-Diode) is used, so that it can be cured without transferring heat to the workpiece side, and there is no problem such as warpage of the wafer 10.
  • the cover holding member 1 is peeled from the cover 2.
  • the part which overlaps with the terminal parts 5 and 6 in the cover 2 is opened, and the terminal parts 5 and 6 are exposed.
  • the cover 2 (ultraviolet curable resin 2a) located above the terminal portions 5 and 6 is thinned by the convex portions 1b and 1c of the cover holding member 1, the cover 2 (ultraviolet curable resin 2a) is attached.
  • the terminal portions 5 and 6 can be easily exposed from the cover 2 simply by etching uniformly by a method such as O 2 ashing.
  • a hollow package having the space 8 between the wafer 10 and the cover 2 can be produced.
  • 4A to 4G are cross-sectional views showing the manufacturing process of the cover holding member 1 described above.
  • photosensitive resist 12 is applied to the surface of the plate-shaped (unprocessed) cover holding member 11 shown in FIG. 4A.
  • the resist 12 is subjected to exposure processing, development processing, and post-baking processing to correspond to the terminal portions 5 and 6 (see FIG. 1 and the like) in the cover holding member 1.
  • the cover holding member 11 is wet-etched with hydrofluoric acid to form convex portions 11b and 11c. That is, the portion not masked by the resist 12 is etched, and the portion masked by the resist 12 remains in a convex shape.
  • the resist 12 is removed, and the resist 13 is applied and patterned again.
  • the patterning shape of the resist 13 is a shape in which a portion corresponding to the vibration element 4 (see FIG. 1 and the like) is opened (see the opening 11d).
  • the resist 12 applied in the step shown in FIG. 4B is temporarily removed and then the resist 13 is applied again in the step shown in FIG. 4E.
  • the resist 13 is removed without removing the resist 12. It may be applied.
  • the cover holding member 11 is wet etched using hydrofluoric acid.
  • the recessed part 11a can be formed.
  • the depth D1 of the concave portion 11a (in this embodiment, the depth from the top surface of the convex portion 11b to the bottom surface of the concave portion 11a) is a depth necessary to secure the vibration space of the vibration element 4 of the acoustic wave device. That's fine.
  • the depth D1 is preferably about 20 to 30 ⁇ m, for example.
  • the recess 11a having such a depth D1 can be formed by general wet etching.
  • FIGS. 5A to 5E are cross-sectional views showing another method for producing the cover holding member.
  • a resist 22 is applied to the surface of the plate-like (unprocessed) cover holding member 21 shown in FIG. 5A.
  • the resist 22 is patterned so as to form an opening 22a at a location corresponding to the vibration element 4 (see FIG. 1 and the like).
  • the cover holding member 21 is etched.
  • the etching was wet etching using hydrofluoric acid.
  • the recess 21 a can be formed in the cover holding member 21.
  • the resist 22 is removed, and a resist 23 having a light shielding component is applied and patterned on the convex portions 21b and 21c adjacent to the concave portion 21a. Thereby, the convex parts 21b and 21c which have light-shielding property can be formed.
  • the cover holding member 21 shown in FIG. 5E is coated with the resist 23 having a light shielding component on the convex portions 21b and 21c, the terminal portion 5 and the terminal portion 5 and even if the ultraviolet ray is irradiated in the ultraviolet curing step at the time of manufacturing the hollow package.
  • the ultraviolet curable resin 2a on 6 (see FIG. 1 etc.) is not cured. Therefore, the uncured resin on the terminal portions 5 and 6 can be easily removed with a solvent or the like.
  • FIGS. 6A to 6F are cross-sectional views illustrating the method for manufacturing the hollow package according to the second embodiment.
  • FIG. 6A is a cross-sectional view of the cover holding member 31.
  • the cover holding member 31 only needs to be formed of a material that can transmit at least ultraviolet rays, and can be formed of transparent glass, transparent resin, or the like.
  • the cover holding member 31 has a recess 31a formed at a location corresponding to the vibration element 4 (see FIG. 1 and the like) formed on the surface of the substrate 3 to be joined in a later step.
  • the cover holding member 31 has recesses 31b and 31c formed at locations corresponding to the terminal portions 5 and 6 (see FIG. 1 and the like).
  • the depth D12 of the recesses 31b and 31c is preferably deeper than the depth D11 of the recess 31a.
  • the recesses 31b and 31c are processed so that the roughness of the surface (inner surface) is higher than the roughness of the portion of the cover holding member 31 that is in contact with the ultraviolet curable resin 32 except for the recesses 31b and 31c. It is preferable to do. As a result, the ultraviolet curable resin 32a adhering to the surfaces of the recesses 31b and 31c adheres to the surfaces of the recesses 31b and 31c. Therefore, when removing the cover holding member 31, the UV curable resin 32a in the recesses 31b and 31c is removed. can do.
  • an ultraviolet curable resin 32a before being cured is applied to the surface side including the recesses 31a, 31b and 31c of the cover holding member 31.
  • the ultraviolet curable resin 32a may be at least a material that can be used for packaging.
  • the cover holding member 31 coated with the ultraviolet curable resin 32a and the wafer 10 are joined (see arrow A).
  • Wafer 10 has vibration element 4, wiring portion 7, and terminal portions 5 and 6 on the surface of substrate 3.
  • the concave portion 31 a of the cover holding member 31 covers the vibration element 4, the position of the concave portion 31 b matches the position of the terminal portion 5, and the position of the concave portion 31 c matches the position of the terminal portion 6. Align so that the position matches.
  • FIG. 6D shows a state where the cover holding member 31 and the wafer 10 are joined. At this time, if the cover holding member 31 and the wafer 10 are bonded in a nitrogen atmosphere, it is desirable that the ultraviolet curable resin is easily cured.
  • ultraviolet light (see arrow B) is irradiated from the cover holding member 31 side to cure the ultraviolet curable resin 32a.
  • the cured ultraviolet curable resin 32 a is used as the cover 32.
  • an ultraviolet light source an LED light source (Light-Emitting-Diode) is used, so that it can be cured without transferring heat to the workpiece side, and there is no problem such as warpage of the wafer 10.
  • the cover holding member 31 is peeled from the cover 32.
  • the depth D12 of the recesses 31b and 31c is made deeper than the depth D11 of the recess 31a, and the roughness of the surface (inner surface) of the recesses 31b and 31c is greater than the roughness of the portions other than the recesses 31b and 31c. Therefore, the ultraviolet curable resin 32 a (part of the cover 32) applied in the recesses 31 b and 31 c of the cover holding member 31 is removed together with the cover holding member 31. Therefore, when the cover holding member 31 is peeled off, the openings 32b and 32c are formed in the cover 32, and the terminal portions 5 and 6 can be exposed.
  • the terminal portions 5 and 6 are preliminarily made of gold. (Au) or solder bumps may be formed.
  • 7A to 7H are cross-sectional views illustrating a method for manufacturing the cover holding member 31 according to the second embodiment.
  • a resist 41 having photosensitivity is applied to the surface of the plate-shaped (unprocessed) cover holding member 31 shown in FIG. 7A as shown in FIG. 7B.
  • the resist 41 is subjected to an exposure process, a development process, and a post-bake process to mask only portions corresponding to the terminal portions 5 and 6 (see FIG. 1 and the like). .
  • the cover holding member 31 is wet etched with hydrofluoric acid to form a recess 31a. That is, when the etching process is performed on the cover holding member 31, a portion not masked by the resist 41 is removed, and a portion masked by the resist 41 remains in a convex shape.
  • the surface of the cover holding member 31 is laminated with a sandblast photosensitive dry film 42, and openings corresponding to the terminal portions 5 and 6 of the acoustic wave device are opened using an exposure development process. (Openings 42a and 42b are formed).
  • sand blasting is performed to form recesses 31b and 31c in the cover holding member 31.
  • the sandblasting process is preferable because the removal amount of the cover holding member 31 can be increased (that is, deeply removed) compared to the wet etching process.
  • the sandblast treatment is preferable because the roughness of the surface subjected to the treatment can be made higher than the roughness of the surface not subjected to the treatment.
  • the cover holding member 31 having the recesses 31a, 31b, and 31c can be manufactured.
  • a frame as disclosed in Japanese Patent Publication No. 2003-523082, Japanese Patent No. 3196893, or Japanese Patent No. 3225906 is not required, so that the manufacturing cost can be reduced. Can do.
  • a light shielding layer may be printed on the inner surfaces of the recesses 31b and 31c in the cover holding member 31.
  • the ultraviolet curable resin 32a when the ultraviolet curable resin 32a is irradiated with ultraviolet rays and cured, the ultraviolet curable resin 32a applied in the recesses 31b and 31c is hard to be cured. Therefore, when the cover holding member 31 is peeled from the wafer 10, the ultraviolet curable resin 32a (uncured resin) in the recesses 31b and 31c is replaced with the ultraviolet curable resin 32a (cured resin) outside the recesses 31b and 31c. Therefore, the probability that the ultraviolet curable resin 32a remains on the terminal portions 5 and 6 after the cover holding member 31 is peeled can be reduced.
  • the cover holding members 1 and 31 are formed of glass in the present embodiment, they can be formed of resin as well as glass.
  • a mold having a protrusion corresponding to the recess is formed in the mold and pressed against the resin cover holding member while being heated and pressurized.
  • a recess can be formed.
  • the cover holding members 1 and 31 are formed of a resin, if the polyethylene terephthalate (hereinafter referred to as PET) is used, the cover holding members 1 and 31 can be covered with the covers 2 and 32 (ultraviolet curing) without performing mold release treatment.
  • the resin 2a, 32a) can be easily peeled off.
  • the hollow package of the acoustic wave element has been described, but the parts to be packaged are not limited to the acoustic wave element.
  • the first embodiment includes the step of removing the ultraviolet curable resin 2 a covering the terminal portions 5 and 6, but the ultraviolet rays on the terminal portions 5 and 6 when the cover holding member 1 is peeled from the wafer 10. If the cured resin 2a can be peeled off at the same time, this step is unnecessary.
  • the step of removing the ultraviolet curable resin 2a covering the terminal portions 5 and 6 is included.
  • the cover holding member 1 is bonded to the wafer 10
  • the convex portions 1b and 1c and the terminal are connected.
  • the cover holding member 1 is pressed in the direction indicated by the arrow A until the portions 5 and 6 are in contact with each other to bulge out the ultraviolet curable resin 2a.
  • the ultraviolet curable resin 2a is placed on the terminal portions 5 and 6 If is not left, this step is unnecessary.
  • the cover holding member 1 is employed to mold the cover 2, but it is only necessary that the cover holding member 1 is formed of a material that transmits at least ultraviolet rays, and it is not essential to be transparent.
  • the covers 2 and 32 are made of an ultraviolet curable resin.
  • the cover is not limited to a resin that is cured by irradiating ultraviolet rays, but at least a resin that is cured by irradiating light (photocurable resin). I just need it.
  • cover holding members 1 and 31 in the present embodiment are examples of the holding member of the present invention.
  • the covers 2 and 32 and the ultraviolet curable resins 2a and 32a in the present embodiment are examples of the photocurable resin of the present invention.
  • the vibration element 4 in the present embodiment is an example of the vibration element of the present invention.
  • Terminals 5 and 6 in this embodiment are examples of the terminal of the present invention.
  • the acoustic wave element and wafer 10 in the present embodiment are an example of the device of the present invention.
  • the present invention is useful for a method for manufacturing a hollow package.

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

Cette invention se rapporte à un procédé de fabrication d'un boîtier creux avec lequel il est possible d'empêcher une détérioration des propriétés du dispositif due à des substances résiduelles qui adhèrent au dispositif de vibrations au cours de la fabrication du boîtier creux, le procédé de fabrication comprenant : une étape consistant à préparer un composant de retenue à travers lequel peut passer une lumière destinée à durcir une résine photodurcissable et qui présente des saillies formées à des positions qui correspondent aux bornes du dispositif et un évidement formé dans une position qui correspond au dispositif de vibrations (4); une étape consistant à revêtir le composant de retenue avec la résine photodurcissable; une étape consistant à joindre le composant de retenue et le dispositif dans une orientation telle que le dispositif de vibrations (4) se situe à l'intérieur de l'évidement; une étape de durcissement de la résine photodurcissable en l'éclairant avec une lumière; une étape consistant à retirer par pelage le composant de retenue de la résine photodurcissable; et une étape consistant à exposer les bornes. Dans le procédé mentionné ci-dessus, le dispositif est couvert d'une couverture (2) (la résine photodurcissable) qui présente un évidement et par conséquent, des substances ont moins de chance d'adhérer au dispositif de vibrations (4) au cours de la fabrication. Ainsi, il est possible de fabriquer un boîtier creux sans détériorer les propriétés du dispositif de vibrations (4).
PCT/JP2010/070967 2009-12-21 2010-11-25 Procédé de fabrication d'un boîtier creux WO2011077891A1 (fr)

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JP2009-289309 2009-12-21
JP2009289309A JP5339625B2 (ja) 2009-12-21 2009-12-21 中空パッケージの製造方法

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WO2011077891A1 true WO2011077891A1 (fr) 2011-06-30

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JP2014007727A (ja) * 2011-08-22 2014-01-16 Kyocera Corp 弾性波装置および電子部品

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JP6787797B2 (ja) * 2017-01-19 2020-11-18 新日本無線株式会社 電子デバイスの製造方法

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JP2005198085A (ja) * 2004-01-08 2005-07-21 Hitachi Media Electoronics Co Ltd 表面弾性波デバイスの製造方法及びその方法で製造された表面弾性波デバイス
JP2007300058A (ja) * 2006-04-03 2007-11-15 Denso Corp カバーキャップの取付構造
JP2009026880A (ja) * 2007-07-18 2009-02-05 Denso Corp 半導体装置の製造方法

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JP2004253937A (ja) * 2003-02-19 2004-09-09 Toyo Commun Equip Co Ltd 弾性表面波フィルタとその製造方法
US8384272B2 (en) * 2008-01-30 2013-02-26 Kyocera Corporation Acoustic wave device and method for production of same

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JP2002232108A (ja) * 2001-02-01 2002-08-16 Tdk Corp 電子部品保護用キャップおよびその製造方法ならびに電子装置およびその製造方法
JP2005198085A (ja) * 2004-01-08 2005-07-21 Hitachi Media Electoronics Co Ltd 表面弾性波デバイスの製造方法及びその方法で製造された表面弾性波デバイス
JP2007300058A (ja) * 2006-04-03 2007-11-15 Denso Corp カバーキャップの取付構造
JP2009026880A (ja) * 2007-07-18 2009-02-05 Denso Corp 半導体装置の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014007727A (ja) * 2011-08-22 2014-01-16 Kyocera Corp 弾性波装置および電子部品

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