WO2011077476A1 - 表示装置とその製造方法 - Google Patents
表示装置とその製造方法 Download PDFInfo
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- WO2011077476A1 WO2011077476A1 PCT/JP2009/007082 JP2009007082W WO2011077476A1 WO 2011077476 A1 WO2011077476 A1 WO 2011077476A1 JP 2009007082 W JP2009007082 W JP 2009007082W WO 2011077476 A1 WO2011077476 A1 WO 2011077476A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/20—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the material in which the electroluminescent material is embedded
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
Definitions
- the present invention relates to a display device and a manufacturing method thereof, and more particularly to a display device including an organic light emitting layer and a manufacturing method thereof.
- each pixel portion includes an anode electrode and a cathode electrode, and an organic light emitting layer interposed therebetween.
- driving the display device holes are injected from the anode electrode, electrons are injected from the cathode electrode, and light is emitted by recombination of holes and electrons in the organic light emitting layer.
- the organic light emitting layers of adjacent pixel portions are partitioned by a bank made of an insulating material.
- the organic light emitting layer is formed, for example, by dropping ink containing an organic light emitting material in each region partitioned by the bank and drying the ink.
- Patent Document 1 describes a technique of providing a convex portion on the inner surface of the bank and thereby controlling the pinning position of the ink. That is, by adopting the technique proposed in Patent Document 1, it is possible to pin the convex portion where the pinning position is formed when the ink in one pixel portion is dropped. Uniformity can be ensured.
- the present invention has been made to solve the above-described problems, and provides a display device with less inhomogeneous luminance in the surface and a method of manufacturing the same, by making the film thickness of the organic light emitting layer uniform over the entire surface of the panel. For the purpose.
- a display device employs the following configuration.
- the display device is a device in which a plurality of pixel portions are arranged.
- Each pixel portion of the display device according to one embodiment of the present invention includes a first electrode and a second electrode, and an organic light emitting layer interposed between the first electrode and the second electrode.
- a plurality of banks are provided above the first electrode to partition the organic light emitting layer for each pixel portion.
- the plurality of pixel portions includes a first pixel portion positioned on the central portion side of the pixel array, and an end portion of the pixel array with respect to the first pixel portion.
- a plurality of banks including a first bank that divides an organic light emitting layer in the first pixel portion on an end side of the pixel array, and an organic in the first pixel portion.
- a second bank that partitions the light emitting layer on the center side of the pixel array, a third bank that partitions the organic light emitting layer in the second pixel section on the end side of the pixel array, and an organic light emitting layer in the second pixel section
- a fourth bank that is partitioned on the center side of the array.
- the side surface portion corresponding to the second pixel portion in the third bank has a different inclination angle from the side surface portion corresponding to the first pixel portion in the first bank. It is characterized by.
- a side surface corresponding to the second pixel portion in the third bank (hereinafter, referred to as “third side surface” for simplicity) is provided in the first bank. Since the inclination angle differs with respect to the side surface corresponding to one pixel portion (hereinafter referred to as “first side surface” for the sake of simplicity), the pinning position when ink is dropped at the time of manufacture is different.
- the third side surface portion and the first side surface portion are different. Specifically, when the inclination angle of the side surface portion is increased, the pinning height is increased, and when the inclination angle of the side surface portion is decreased, the pinning height is decreased.
- the film thickness of the organic light emitting layer after drying has an inverse relationship with the magnitude of the inclination angle of the side surface in the bank. Specifically, in the comparison between the third side surface portion and the first side surface portion, the film thickness of the organic light emitting layer corresponding to the relatively larger tilt angle tends to be reduced, and the smaller tilt angle is decreased. The thickness of the corresponding organic light emitting layer is about to increase.
- the thickness of the organic light-emitting layer is made uniform by changing the inclination angle of the side surface portion of the bank, thereby reducing luminance unevenness.
- FIG. 3 is a schematic cross-sectional view showing a pixel unit 100 in the display panel 10.
- FIG. 3 is a schematic plan view showing a bank 105 in the display panel 10.
- FIG. 3 is a schematic cross-sectional view showing the structure of banks 105a to 105f for each of pixel portions 100a to 100c in the display panel 10.
- (A) is a schematic cross-sectional view showing the pinning position when the taper angle of the bank side surface portion is small
- (b) is a schematic cross-sectional view showing the pinning position when the taper angle of the bank side surface portion is large
- (C) is a schematic cross-sectional view showing the state of the organic light emitting layer after drying when the taper angle of the bank side surface is small
- (d) is the organic after drying when the taper angle of the bank side surface is large. It is a schematic cross section which shows the state of a light emitting layer.
- FIG. 6 is a diagram showing the film thickness distribution of organic light emitting layers in Samples 1 to 3. It is a figure which shows the film thickness distribution of the organic light emitting layer in the samples 4 and 5.
- FIG. (A)-(c) is a schematic cross section which shows the principal part process in the manufacturing method of the display panel 10 in order.
- (A)-(c) is a schematic cross section which shows the principal part process in the manufacturing method of the display panel 10 in order.
- 10 is a schematic cross-sectional view showing main processes in a manufacturing method according to Modification 1.
- FIG. 14 is a schematic plan view showing a structure of a bank 305 included in a display panel 30 according to Modification 3.
- FIG. 14 is a schematic plan view showing a structure of a bank 305 included in a display panel 30 according to Modification 3.
- (A) is a schematic cross section which shows the organic light emitting layer in the display panel which concerns on a prior art
- (b) is a figure which shows the film thickness uniformity distribution of the organic light emitting layer for every area
- a display device is a device in which a plurality of pixel portions are arranged.
- Each pixel portion of the display device according to one embodiment of the present invention includes a first electrode and a second electrode, and an organic light emitting layer interposed between the first electrode and the second electrode.
- a plurality of banks are provided above the first electrode to partition the organic light emitting layer for each pixel portion.
- the plurality of pixel portions includes a first pixel portion positioned on the central portion side of the pixel array, and an end portion of the pixel array with respect to the first pixel portion.
- a plurality of banks including a first bank that divides an organic light emitting layer in the first pixel portion on an end side of the pixel array, and an organic in the first pixel portion.
- a second bank that partitions the light emitting layer on the center side of the pixel array, a third bank that partitions the organic light emitting layer in the second pixel section on the end side of the pixel array, and an organic light emitting layer in the second pixel section
- a fourth bank that is partitioned on the center side of the array.
- the third side surface portion is different in inclination angle from the first side surface portion.
- the third side surface portion has an inclination angle different from that of the first side surface portion, so that the pinning position when the ink is dropped at the time of manufacture is different from that of the third side surface portion. It will be different for one side part. Specifically, when the inclination angle of the side surface portion is increased, the pinning height is increased, and when the inclination angle of the side surface portion is decreased, the pinning height is decreased.
- the film thickness of the organic light emitting layer after drying has an inverse relationship with the magnitude of the inclination angle of the side surface in the bank. Specifically, in the comparison between the third side surface portion and the first side surface portion, the film thickness of the organic light emitting layer corresponding to the relatively larger tilt angle tends to be reduced, and the smaller tilt angle is decreased. The thickness of the corresponding organic light emitting layer is about to increase.
- the thickness of the organic light-emitting layer is made uniform by changing the inclination angle of the side surface portion of the bank, thereby reducing luminance unevenness.
- the display device in the above-described configuration, specifically, a configuration in which the third side surface portion has a large inclination angle with respect to the first side surface portion can be employed.
- the thickness of the organic light emitting layer in the portion corresponding to the outer peripheral side surface portion of the bank in the outer peripheral portion of the panel as shown in FIG. The phenomenon of thickening can be alleviated. Therefore, in the display device according to one embodiment of the present invention, the thickness of the organic light-emitting layer in the plurality of pixel portions can be uniform over the entire surface of the panel, and luminance unevenness can be reduced. It is.
- a side surface portion (hereinafter, referred to as a “second side surface portion” for simplicity) corresponding to the first pixel portion in the second bank.
- the configuration is such that the inclination angle is equal to the side surface portion corresponding to the second pixel portion in the fourth bank (hereinafter referred to as “fourth side surface portion” for simplicity).
- the thickness of the organic light emitting layer near the center of the panel (the thickness of the organic light emitting layer 906c at the left end in the X-axis direction)
- the thickness of the organic light emitting layer 906c at the left end in the X-axis direction There is no significant difference from the corresponding film thickness of the pixel portion in the central portion. For this reason, it becomes possible to maintain the film thickness of the organic light emitting layer in the corresponding part uniformly by making the inclination angle of both the second side part and the fourth side part equal.
- the first side surface portion is formed to have the same inclination angle with respect to the second side surface portion and the fourth side surface portion. Can be adopted.
- the thickness of the organic light emitting layer in the first pixel portion can be made uniform, and the organic layer of the second pixel portion can be compared with the thickness of the organic light emitting layer in the first pixel portion.
- the film thickness in the vicinity of the fourth side surface portion in the light emitting layer can also be made uniform.
- the inclination angle of the third side surface portion is in a range of 35 [°] or more and 40 [°] or less, and the inclination angle of the first side surface portion.
- the angle can be set within a range of 25 [°] to 30 [°]. If the third side surface portion and the first side surface portion are formed with an inclination angle in such a range, the film thickness of each organic light emitting layer is surely made uniform in the second pixel portion and the first pixel portion. can do.
- the inclination angle of the second side surface portion and the first side surface portion may be in the range of 25 ° to 30 °. As an example. If the second side surface portion and the first side surface portion are formed with an inclination angle in such a range, the film thickness of the organic light emitting layer in the first pixel portion can be made uniform as a whole.
- the “inclination angle” means each side surface portion of the bank and the underlying layer on which the bank is provided (the first electrode, the hole injection layer, the hole transport layer, and the hole injection transport layer) The angle formed by the top surface of
- a method for manufacturing a display device is a method for manufacturing a display device in which a plurality of pixel portions are arranged, and includes the following steps.
- a functional layer including a first electrode is formed on a substrate.
- a photosensitive resist material is laminated on the functional layer.
- the photosensitive resist material laminated in the execution of the second step is subjected to mask exposure and patterned to form a plurality of openings corresponding to a plurality of pixel portions, and between adjacent openings. A plurality of banks to be partitioned are formed.
- a 2nd electrode is formed above an organic light emitting layer.
- the plurality of openings include a first opening at a position corresponding to the central portion side of the pixel array, and a pixel with respect to the first opening.
- a second opening at a position corresponding to the end side of the array is included, and the plurality of banks includes a first bank partitioned on the end side of the pixel array with respect to the first opening, and a first bank The second bank defined on the center side of the pixel array with respect to the opening, the third bank defined on the edge side of the pixel array with respect to the second opening, and the pixel array relative to the second opening.
- a fourth bank that is partitioned on the center side.
- the inclination angle of the side surface portion (hereinafter referred to as “third side surface portion” for simplicity) corresponding to the second opening in the third bank, and the first bank in the first bank.
- Forming the first bank and the third bank so that the inclination angle of the side surface corresponding to one opening (hereinafter referred to as “first side surface” for simplicity) is different.
- the pinning position when ink is dropped during the manufacturing process is different between the third side surface portion and the first side surface portion, The film thickness of the light emitting layer is made uniform, and the luminance unevenness is reduced.
- the method for manufacturing a display device it is possible to make the thickness of the organic light emitting layer uniform over the entire surface of the panel, and to manufacture a display device with less unevenness of luminance in the surface.
- the inclination angle of the third side surface portion is larger than the inclination angle of the first side surface portion.
- a configuration in which the first bank and the third bank are formed can be employed.
- the organic light emitting layer is formed at a portion corresponding to the outer peripheral side surface portion of the bank in the outer peripheral portion of the panel as shown in FIG.
- the phenomenon that the film thickness increases can be alleviated, and the film thickness of the organic light emitting layer in the plurality of pixel portions can be made uniform over the entire surface of the panel, and a display device with less luminance unevenness is manufactured. Is possible.
- a side surface portion corresponding to the first opening in the second bank (hereinafter, for simplicity, “ And the inclination angle of the side surface corresponding to the second opening in the fourth bank (hereinafter referred to as “fourth side surface” for simplicity).
- the second bank and the fourth bank can be formed so as to be equal to each other.
- the inclination angle of the first side surface portion, the inclination angle of the second side surface portion, and the fourth side surface portion when the third step is performed in the above configuration, the inclination angle of the first side surface portion, the inclination angle of the second side surface portion, and the fourth side surface portion.
- a configuration in which the first bank, the second bank, and the fourth bank are formed so that the inclination angles of the first and second banks are equal to each other can be adopted.
- the film thickness of the organic light emitting layer in the first pixel unit is made uniform, and the organic light emission of the second pixel unit with respect to the film thickness of the organic light emitting layer in the first pixel unit. It is also possible to make uniform the film thickness in the vicinity of the fourth side surface part in the layer.
- the third side surface is inclined by the third side surface by the third step.
- the pinning position of the ink containing the organic light emitting material dropped into the first opening and the second opening is aligned, and then dried.
- the shape of the later organic light emitting layer can be made uniform. Therefore, by using the manufacturing method according to one embodiment of the present invention, variation in the shape of the organic light-emitting layer between pixels can be suppressed, and a display device with less luminance unevenness can be manufactured.
- the portion corresponding to the third side surface portion and the portion corresponding to the first side surface portion are photosensitive.
- a configuration in which the inclination angles are made different from each other by making the exposure amounts for exposing the photosensitive resist material different can be adopted.
- the 1st bank and the 3rd bank which have the 1st side part and the 3rd side part from which an inclination angle differs mutually can be formed.
- the exposure amount to the portion corresponding to the third side surface portion is set to the portion corresponding to the first side surface portion.
- a configuration in which the exposure amount is larger than the exposure amount can be employed.
- the third bank and the first bank can be formed in which the inclination angle of the third side surface portion is larger than the inclination angle of the first side surface portion.
- the light is related to the portion corresponding to the third side surface portion and the portion corresponding to the first side surface portion. It is possible to adopt a configuration in which the tilt angles are made different from each other by performing exposure using masks having different transmittances. Thereby, the 3rd bank and the 1st bank of the relation where the inclination angle of the 3rd side part differs from the inclination angle of the 1st side part can be formed.
- the light transmittance to the portion corresponding to the third side surface portion corresponds to the first side surface portion. It is possible to employ a configuration in which exposure is performed using a mask that is larger than the transmittance of light to the portion to be performed. As a result, the third bank and the first bank can be formed in which the inclination angle of the third side surface portion is larger than the inclination angle of the first side surface portion.
- a photosensitive resist material is used for a portion corresponding to the third side surface portion and a portion corresponding to the first side surface portion.
- the 3rd bank and the 1st bank of the relation where the inclination angle of the 3rd side part differs from the inclination angle of the 1st side part can be formed.
- the additional exposure processing target is a portion corresponding to the third side surface portion.
- a configuration can be employed. Thereby, the inclination-angle of a 3rd side part can be enlarged with respect to the inclination-angle of a 1st side part.
- the organic light emitting layers 906a and 906c are formed between banks 905 erected on a substrate 901.
- the organic light emitting layer 906c in the pixel portion at the outer peripheral portion of the panel tends to be less uniform in film thickness than the organic light emitting layer 906a in the pixel portion at the central portion of the panel.
- Parts indicated by alternate long and two short dashes lines D 1 and D 2 in FIG. 17B specifically, in the pixel portion located on the outer periphery of the panel, the surface of the organic light emitting layer becomes higher as it goes to the outer periphery of the panel. This inventor confirmed that it became.
- the horizontal axis indicates the distance from the outer peripheral edge
- the vertical axis indicates the degree of film thickness deviation.
- the present inventor presumed that the decrease in film thickness uniformity in the organic light-emitting layer was caused by non-uniform vapor concentration distribution during ink drying, as will be described below. did. Specifically, as shown in FIG. 18, the vapor concentration in the vicinity of the pixel portions 900b and 900c located on the outer periphery of the panel is lower than the vapor concentration in the vicinity of the pixel portion 900a located in the center of the panel. It has become.
- the evaporation rate from the dropped ink in the pixel portion 900a at the center of the panel is substantially uniform.
- the surface profile L 0 of the ink 9060C has a shape raised pixel central portion.
- the evaporation rate is faster at the outer peripheral portion of the panel as described above, so it is considered formally that the surface profile L 1 changes to a lower one at the outer peripheral portion side.
- the solvent moves as indicated by the solid line arrow inside the ink 9061c in the middle of drying.
- the solvent moves so as to compensate for the evaporated amount (moves so as to minimize the surface free energy), and the solute (organic light emitting material) moves as the solvent moves. Therefore, as shown in FIG. 19 (c), in the pixel portion of the panel outer periphery, the surface profile L 2 is the organic light emitting layer 906c which raised the more outer is formed.
- the present inventor relates to an organic light-emitting display device, and the film thickness of the organic light-emitting layer is uniform due to the non-uniformity of the vapor concentration distribution during ink drying on the outer peripheral side and the central side of the panel. I got the inference that the gender declines.
- the inventor makes the pinning position on the bank side surface of the ink different by changing the inclination angle of the bank side surface in the panel surface, and as a result, the film thickness of the organic light emitting layer is made uniform. I found a technical feature.
- the display device 1 includes a display panel unit 10 and a drive control unit 20 connected to the display panel unit 10.
- the display panel unit 10 is an organic EL panel using an electroluminescence phenomenon of an organic material, and a plurality of organic EL elements are arranged and configured.
- the drive control unit 20 includes four drive circuits 21 to 24 and a control circuit 25.
- the arrangement of the drive control unit 20 with respect to the display panel unit 10 is not limited to this.
- the configuration of the display panel 10 will be described with reference to FIG.
- the display panel 10 according to the present embodiment employs a top emission type organic EL panel as an example, and emits organic light having one of red (R), green (G), and blue (B).
- a plurality of pixel portions 100 including layers are arranged and configured in a matrix, but in FIG. 2, one pixel portion 100 is extracted and drawn.
- the display panel 10 includes an anode electrode 102 formed on a TFT substrate 101 (hereinafter simply referred to as “substrate”) 101, and an electrode coating layer on the anode electrode 102. 103 and a hole injecting and transporting layer 104 are sequentially laminated. Note that the anode electrode 102 and the electrode coating layer 103 are formed in a state of being separated for each pixel unit 100.
- a hole injecting and transporting layer 104 is formed on the electrode coating layer 103, and a bank 105 made of an insulating material and partitioning each pixel unit 100 is erected thereon.
- An organic light emitting layer 106 is formed in a region partitioned by the bank 105 in each pixel unit 100, and an electron injection layer 107, a cathode electrode 108, and a sealing layer 109 are sequentially stacked thereon. .
- the substrate 101 is, for example, alkali-free glass, soda glass, non-fluorescent glass, phosphate glass, boric acid glass, quartz, acrylic resin, styrene resin, polycarbonate resin, epoxy resin, polyethylene, polyester, silicone resin. Or an insulating material such as alumina.
- the anode electrode 102 is composed of a single layer made of a conductive material or a laminate in which a plurality of layers are laminated.
- a conductive material for example, Ag (silver), APC (silver, palladium, copper alloy), ARA ( Silver, rubidium, gold alloy), MoCr (molybdenum and chromium alloy), NiCr (nickel and chromium alloy), etc. are used.
- the top emission type as in the present embodiment, it is preferably formed of a highly reflective material.
- Electrode coating layer 103 is formed using, for example, ITO (indium tin oxide), and covers the upper surface of the anode electrode 102 in the Z-axis direction.
- ITO indium tin oxide
- the hole injecting and transporting layer 104 is a layer made of an oxide such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), iridium (Ir), for example. It is.
- the hole injecting and transporting layer 104 made of such a metal oxide has a function of injecting and transporting holes to and from the organic light emitting layer 106 in a stable manner or assisting the generation of holes, and has a large work function. Have.
- the hole injection / transport layer 104 is made of an oxide of a transition metal, a plurality of levels can be obtained by taking a plurality of oxidation numbers. As a result, hole injection is facilitated and driven. The voltage can be reduced.
- the hole injecting and transporting layer 104 can be formed by using PEDOT (mixture of polythiophene and polystyrene sulfonic acid) or the like in addition to the metal oxide as described above.
- PEDOT mixture of polythiophene and polystyrene sulfonic acid
- the bank 105 is made of an organic material such as resin and has an insulating property. Examples of the organic material used for forming the bank 105 include acrylic resin, polyimide resin, and novolac type phenol resin. The bank 105 preferably has organic solvent resistance.
- the bank 105 is formed by an etching process, a baking process, or the like, it is preferable that the bank 105 be formed of a highly resistant material that does not excessively deform or alter the process.
- the side surface portion can be treated with fluorine.
- a material having a resistivity of 10 5 [ ⁇ ⁇ cm] or more and having water repellency can be used as the insulating material used for forming the bank 105. This is because when a material having a resistivity of 10 5 [ ⁇ ⁇ cm] or less is used, a leakage current between the anode electrode 102 and the cathode electrode 108 or a leakage current between adjacent pixel portions 100 is generated. This is because various problems such as an increase in power consumption are caused.
- the bank 105 When the bank 105 is formed using a hydrophilic material, the difference in affinity / water repellency between the side surface of the bank 105 and the surface of the hole injecting and transporting layer 104 is reduced, and the organic light emitting layer 106 is formed. This is because it becomes difficult to selectively hold the ink containing the organic substance in the opening of the bank 105.
- the structure of the bank 105 not only a single layer structure as shown in FIG. 2 but also a multilayer structure of two or more layers can be adopted.
- the above materials can be combined for each layer, and an inorganic material and an organic material can be used for each layer.
- Organic light emitting layer 106 has a function of emitting light by generating an excited state by recombination of holes injected from the anode electrode 102 and electrons injected from the cathode electrode 108.
- As a material used for forming the organic light emitting layer 106 it is necessary to use a light emitting organic material that can be formed by a wet printing method.
- Electron injection layer 107 has a function of transporting electrons injected from the cathode electrode 108 to the organic light emitting layer 106, and is preferably formed of, for example, barium, phthalocyanine, lithium fluoride, or a combination thereof.
- the cathode electrode 108 is made of, for example, ITO or IZO (indium zinc oxide). In the case of the top emission type display panel 10, it is preferably formed of a light transmissive material. About light transmittance, it is preferable that the transmittance is 80% or more.
- the cathode electrode 108 As a material used for forming the cathode electrode 108, in addition to the above, for example, a structure in which a layer containing an alkali metal, an alkaline earth metal, or a halide thereof and a layer containing silver are laminated in this order is used. You can also.
- the layer containing silver may be formed of silver alone, or may be formed of a silver alloy.
- a highly transparent refractive index adjusting layer can be provided on the silver-containing layer.
- the sealing layer 109 has a function of suppressing exposure of the organic light emitting layer 106 or the like to moisture or air, and is made of, for example, a material such as SiN (silicon nitride) or SiON (silicon oxynitride). It is formed using. In the case of the top emission type display panel 10, it is preferably formed of a light transmissive material.
- each of the banks 105 extends in the Y-axis direction, and partitions between adjacent pixel units 100 in the X-axis direction.
- the pixel unit 100 is formed so that the light emission color is different for each region partitioned by the bank 105.
- FIG. 4 is a schematic cross-sectional view of the display panel 10 in FIG. 1 cut along the AA ′ cross-section.
- a pixel portion 100 a located in the center portion and a pixel portion located in the outer peripheral portion (a pixel portion located at an array end portion among a plurality of arranged pixel portions) 100 b. , 100c, and banks 105a to 105f are arranged on both sides of each pixel unit 100a, 100b, 100c.
- the side surface portions 105aa and 105ba and the surface 104a of the hole injecting and transporting layer 104 which is the base layer form angles ⁇ a and ⁇ b, respectively.
- the side portions 105ca to 105fa and the surface 104a of the hole injection transport layer 104 form angles ⁇ c to ⁇ f, respectively.
- the angles ⁇ a to ⁇ f satisfy the relationships shown by the following equations.
- the angle of inclination of the side surface of the bank 105x (the angle formed between the side surface and the surface of the hole injecting and transporting layer 104) is an angle ⁇ x
- the inclination angle of the side surface portion of the bank 105y (the angle formed between the side surface portion and the surface of the hole injection transport layer 104) is the angle ⁇ y.
- the angle ⁇ x and the angle ⁇ y satisfy the following relationship.
- Hy> Hx As shown in FIG. 5C, when the ink 1060x is dried, the central portion of the pixel portion of the formed organic light emitting layer 106x is caused by the relatively low height Hx of the pinning position Px. The thickness rises and the film thickness becomes the thickness Tx.
- the organic light emitting layer 106y is formed in the center of the pixel portion due to the relatively high height Hy at the pinning position Py.
- the portion is recessed and the film thickness becomes the thickness Ty.
- the thickness Tx and the thickness Ty satisfy the following relationship.
- the pinning position is higher in Sample 3 and Sample 4 where the taper angle is larger than the thickness distribution of Sample 2.
- the horizontal axis indicates the horizontal direction
- the vertical axis indicates the height direction.
- the anode electrode 102 and the electrode covering layer 103 are formed corresponding to the planned areas for forming the pixel portions 100a, 100c,. Laminate sequentially. Then, a hole injecting and transporting layer 104 is laminated and formed so as to cover the entire surface.
- the anode electrode 102 is formed by, for example, forming an Ag thin film using a sputtering method or a vacuum deposition method, and then patterning the Ag thin film using a photolithography method.
- the electrode coating layer 103 is formed, for example, by forming an ITO thin film on the surface of the anode electrode 102 using a sputtering method and patterning the ITO thin film using a photolithography method or the like.
- a metal film is formed on the surface of the substrate 101 including the surface of the electrode coating layer 103 by using a sputtering method or the like. Thereafter, the formed metal film is oxidized to form the hole injecting and transporting layer 104.
- a bank material layer 1050 is formed so as to cover the hole injection transport layer 104 by using, for example, a spin coat method.
- a photosensitive resist material is used for the formation of the bank material layer 1050.
- an insulating organic material such as an acrylic resin, a polyimide resin, or a novolac phenol resin is used. it can.
- a mask 501 provided with openings 501a and 501c is provided above the bank material layer 1050 at a location where a bank is to be formed. In this state, exposure is performed through the openings 501a and 501c of the mask 501.
- the width Wa of the opening 501a of the mask 501 is the banks 105a and 105b to be formed (see FIG. 4). ) Is defined by points Pa1 and Pa2 at the lower end of the side surface portion.
- the width Wc1 of the mask opening 501a is such that the upper end point Pc1 and the skirt of the side portion of the banks 105e and 105f (see FIG. 4) to be formed. This is defined by the point Pc2.
- a mask 502 in which openings 502c are respectively provided at locations corresponding to the side surface portion 105fa (see FIG. 4) of the bank 105f is provided above the bank material layer 1050. Arrange. In this state, the second exposure is executed through the opening 502c of the mask 502.
- the width Wc2 of the opening 502c in the mask 502 is defined by the lower end point Pc3 and the upper end point Pc1 of the side surfaces of the banks 105e and 105f to be formed.
- the side surface portion 105fa of the bank 105f has a larger inclination angle than the side surface portions 105aa and 105ba of the banks 105a and 105b, and the side surface portion 105ea of the bank 105e corresponds to the side surfaces 105aa and 105b of the banks 105a and 105b. It becomes equal to the inclination angle of 105ba.
- ink containing an organic light emitting material is dropped into the openings partitioned by the banks 105a, 105b, 105e, 105f,.
- the organic light emitting layers 106a and 106c are formed by drying the ink.
- the display panel 10 is formed by sequentially stacking the electron injection layer 107, the cathode electrode 108, the sealing layer 109, and the like.
- the inclination angles ⁇ c and ⁇ f of the side surface portions 105ca and 105fa are set larger. For this reason, the pixel portion 100a and the pixel portions 100b and 100c have different pinning positions when ink is dropped at the time of manufacture.
- the heights of the ink pinning positions corresponding to the banks 105c and 105f having the large inclination angles ⁇ c and ⁇ f are higher than the heights of the ink pinning positions corresponding to the banks 105a and 105b having the small inclination angles ⁇ a and ⁇ b. Get higher.
- the inclination angles ⁇ d and ⁇ e of the side surfaces 105da and 105ea in the banks 105d and 105e are equal to the inclination angles ⁇ a and ⁇ b of the side surfaces 105aa and 105ba in the banks 105a and 105b. For this reason, the film thickness of the organic light emitting layer 106 corresponding to each part is equal in the panel.
- the display panel 10 has an effect that the thickness of the organic light emitting layer 106 after drying is uniform in the pixel portions 100a, 100b, and 100c, and luminance unevenness is small.
- the inclination angles are made equal in a range where the difference in luminance efficiency (luminance unevenness) between the pixel portions 100a, 100b, 100c,. It means that.
- Modification 1 of the method for manufacturing the display device 1 will be described with reference to FIG. FIG. 11 shows steps corresponding to the steps shown in FIGS. 9C to 10A.
- a mask 503 is disposed thereon.
- the mask 503 is provided with light transmitting portions 503a, 503c1, 503c2,.
- Each of the light transmitting portions 503a, 503c1, 503c2,... Is provided corresponding to a location where the banks 105a to 105f,.
- the width Wa of the light transmitting portion 503a in the region corresponding to the pixel portion 100a is the point at the lower end of the banks 105a and 105b (see FIG. 4) to be formed. It is defined by Pa1 and Pa2.
- the width Wc2 of the light transmitting portion 503c1 in the region corresponding to the pixel portion 100c is defined by the lower end point Pc2 and the upper end point Pc1 of the banks 105e and 105f (see FIG. 4) to be formed.
- the light transmitting portion 503c2 is defined by points Pc3 and Pc1 at the lower ends of the banks 105e and 105f (see FIG. 4) to be formed.
- the mask 503 is configured using a mask such as a halftone, and the light transmittances of the light transmitting portions 503a and 503c1 and the light transmitting portion 503c2 are different. Specifically, the light transmittance of the light transmitting portion 503c2 is larger than the light transmittance of the light transmitting portions 503a and 503c1.
- Banks 105a, 105b, 105e, and 105f as shown in FIG. 10B are formed by performing exposure / development in a state where the mask 503 having the above-described configuration is arranged and then baking. Can do. That is, in the portion exposed through the light transmitting portion 503c2 in which the light transmittance is set to be large, the above [Expression 1] and [Expression 2] are shown as compared with the portions exposed through the other light transmitting portions 503a and 503c1. As in the relationship, the inclination angle of the side wall surface increases.
- the display device 1 can also be manufactured by the manufacturing method as described above.
- a mask 504 is disposed thereon.
- the mask 504 is provided with openings 504a, 504c,... Corresponding to the locations where the bank 105 is to be formed.
- Openings 504a provided at locations where banks 105a and 105b (see FIG. 4) are to be formed corresponding to the pixel portion 100a have the same width as the openings 501a of the mask 501 used in the manufacturing method of the above embodiment. It is formed with.
- the width Wc3 of the opening 504c provided at a location where the banks 105e and 105f (see FIG. 4) are to be formed corresponding to the pixel portion 100c is a portion surrounded by a two-dot chain line in FIG. As shown in FIG. 5, the width is set to be larger than the width defined by the points Pc2 and Pc3 at the lower ends of the banks 105e and 105f. Specifically, the width is increased at a location where the inclination angle is to be increased.
- the first exposure / development is performed with the mask 504 having the configuration shown in FIG. As a result, as shown in FIG. 12B, bank material layers 1051a, 1051b, 1051e, and 1051f remain at locations corresponding to the openings 504a and 504c.
- a mask 505 is disposed thereabove.
- an opening 505c is provided only in a portion corresponding to a side surface portion of the banks 105a to 105f,.
- Banks 105a, 105b, 105e, 105f,... As shown in FIG. 13B can be formed by performing the second exposure / development with the mask 505 disposed and then baking.
- the display device 1 can be manufactured by performing the same steps as in the above-described embodiment and the like.
- the inclination angle of the bank side surface portion to be formed increases as the exposure amount increases. Specifically, when the exposure amount is 200 [mJ] and the exposure / development is performed, the inclination angle of the bank side surface portion is 23 [°], whereas the exposure amount is 300 [mJ]. The inclination angle of the bank side surface formed when developed is 38 [°]. This result is also shown in AFM (Atomic Force Microscope) shown in FIG.
- the inclination angle of the bank side surface portion to be formed is 50 [°]. This corresponds to the manufacturing method according to the second modification and is considered to be effective for increasing the inclination angle of the bank side surface.
- a horizontal axis shows a horizontal direction and a vertical axis
- shaft shows a height direction.
- each configuration as an example is adopted in order to easily understand the configuration and the operation / effect of the present invention.
- the present invention except for essential parts, It is not limited to the said form.
- the configuration in which the anode electrode 102 is disposed on the lower side in the Z-axis direction with respect to the organic light emitting layer 106 is adopted as an example.
- a configuration in which the cathode electrode 108 is disposed on the lower side in the Z-axis direction may be employed.
- the cathode electrode 108 When the cathode electrode 108 is arranged on the lower side in the Z-axis direction with respect to the organic light emitting layer 106, a top emission structure is formed. Therefore, the cathode electrode 108 is used as a reflective electrode layer, and the electrode coating layer 103 is formed thereon. The structure which forms is adopted.
- the specific external shape of the display device 1 is not shown, but it can be a part of the system as shown in FIG.
- the organic EL display device does not require a backlight like a liquid crystal display device, and is therefore suitable for thinning, and exhibits excellent characteristics from the viewpoint of system design.
- the so-called line bank structure as shown in FIG. 3 is adopted as the form of the bank 105, but the bank 105 extends in the Y-axis direction as shown in FIG.
- the display panel 30 can also be configured by using a pixel bank 305 including a bank element 305a and a bank element 305b extending in the X-axis direction.
- the inclination angle of the side wall portion on the outer side in the X-axis direction and the Y-axis direction with respect to the pixel portion 300 on the outer peripheral portion of the panel is increased.
- the effect similar to the above can be obtained.
- the inclination of the side wall portion indicated by the arrows B 1 and B 3 The angle may be made larger than the inclination angle of the side wall portion indicated by arrows B 2 and B 4 .
- the inclination angle of the side wall part outside the bank formed in a panel outer peripheral part was made larger than the inclination angle of the bank side part corresponding to a panel center part.
- this relationship can be appropriately changed according to the flow of vapor (vapor concentration) in the drying process related to the formation of the organic light emitting layer during production.
- the flow of vapor during ink drying is in the direction from the outer periphery of the panel toward the center of the panel, this corresponds to the location where the thickness of the organic light emitting layer increases.
- the inclination angle of the bank side surface portion may be increased. Thereby, the film thickness of an organic light emitting layer can be made uniform, and the brightness nonuniformity in the whole panel can be reduced.
- the light emission colors (red, green, and blue) in the pixel portion are not distinguished, but the characteristics of the ink including the organic light emitting material change according to the light emission color.
- the inclination angle of the corresponding bank side surface portion can be defined according to the ink characteristics of each emission color.
- the region for which the inclination angle of the bank side surface portion is to be increased can be appropriately determined according to the manufacturing process, the panel size, and the like. For example, 0.5% to It is considered desirable to target a pixel portion of about [%] (for example, 1 [%]). This is because the variation in the thickness of the organic light emitting layer in the display device according to the prior art shown in FIG.
- the present invention is useful for realizing a display device with little luminance unevenness and high image quality performance.
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Abstract
Description
本発明の一態様に係る表示装置は、複数の画素部が配列されてなる装置である。本発明の一態様に係る表示装置の各画素部は、第1電極および第2電極と、第1電極と第2電極との間に介挿された有機発光層とを有し構成されており、第1電極の上方において、有機発光層を画素部ごとに区画する複数のバンクが設けられている。
以下では、本発明を実施するための形態の一例について、図面を参酌しながら説明する。
本発明者は、(背景技術)において記載した有機発光表示装置に関し、鋭意研究の結果、次のような知見を得た。
本実施の形態に係る表示装置1の全体構成について、図1を用い説明する。
表示パネル10の構成について、図2を用い説明する。なお、本実施の形態に係る表示パネル10は、一例として、トップエミッション型の有機ELパネルを採用し、赤(R)、緑(G)、青(B)の何れか発光色を有する有機発光層を備える複数の画素部100がマトリクス状に配置され構成されているが、図2では、一つの画素部100を抜き出して描いている。
基板101は、例えば、無アルカリガラス、ソーダガラス、無蛍光ガラス、燐酸系ガラス、硼酸系ガラス、石英、アクリル系樹脂、スチレン系樹脂、ポリカーボネート系樹脂、エポキシ系樹脂、ポリエチレン、ポリエステル、シリコーン系樹脂、又はアルミナ等の絶縁性材料をベースとして形成されている。
アノード電極102は、導電性材料からなる単層、あるいは複数の層が積層されてなる積層体から構成されており、例えば、Ag(銀)、APC(銀、パラジウム、銅の合金)、ARA(銀、ルビジウム、金の合金)、MoCr(モリブデンとクロムの合金)、NiCr(ニッケルとクロムの合金)などを用い形成されている。なお、本実施の形態のように、トップエミッション型の場合には、高反射性の材料で形成されていることが好ましい。
電極被覆層103は、例えば、ITO(酸化インジウムスズ)を用い形成されており、アノード電極102のZ軸方向上部の表面を被覆する。
ホール注入輸送層104は、例えば、銀(Ag)、モリブデン(Mo)、クロム(Cr)、バナジウム(V)、タングステン(W)、ニッケル(Ni)、イリジウム(Ir)などの酸化物からなる層である。このような酸化金属からなるホール注入輸送層104は、ホールを安定的に、またはホールの生成を補助して、有機発光層106に対しホールを注入および輸送する機能を有し、大きな仕事関数を有する。
バンク105は、樹脂等の有機材料で形成されており絶縁性を有する。バンク105の形成に用いる有機材料の例としては、アクリル系樹脂、ポリイミド系樹脂、ノボラック型フェノール樹脂等があげられる。そして、バンク105は、有機溶剤耐性を有することが好ましい。
有機発光層106は、アノード電極102から注入されたホールと、カソード電極108から注入された電子とが再結合されることにより励起状態が生成され発光する機能を有する。有機発光層106の形成に用いる材料は、湿式印刷法を用い製膜できる発光性の有機材料を用いることが必要である。
電子注入層107は、カソード電極108から注入された電子を有機発光層106へ輸送する機能を有し、例えば、バリウム、フタロシアニン、フッ化リチウム、あるいはこれらの組み合わせで形成されることが好ましい。
カソード電極108は、例えば、ITO、IZO(酸化インジウム亜鉛)などで形成される。トップエミッション型の表示パネル10の場合においては、光透過性の材料で形成されることが好ましい。光透過性については、透過率が80[%]以上とすることが好ましい。
封止層109は、有機発光層106などが水分に晒されたり、空気に晒されたりすることを抑制する機能を有し、例えば、SiN(窒化シリコン)、SiON(酸窒化シリコン)などの材料を用い形成される。トップエミッション型の表示パネル10の場合においては、光透過性の材料で形成されることが好ましい。
図3に示すように、本実施の形態に係る表示パネル10では、一例としてライン状のバンク105を採用している。具体的には、バンク105は、各々がY軸方向に延伸形成され、X軸方向において隣接する画素部100間を区画している。そして、画素部100は、バンク105により区画された領域ごとに、発光色が異なるように形成されている。
領域ごとのバンク105の構成について、図4を用い説明する。なお、図4は、図1における表示パネル10をA-A'断面で切断し、模式化した断面図である。
[数2] θc>θa
[数3] θa=θb=θd=θe
なお、本実施の形態では、角度θa,θb,θd,θeを25[°]以上30[°]以下の範囲内の角度とし、角度θc,θfを35[°]以上40[°]以下の範囲内の角度とする。
バンク105における側面部の傾斜角度θと有機発光層106の膜厚との関係について、図5および図6を用い説明する。なお、図5では、画素部の構造を模式的に描いている。
各バンク105x,105yで区画された開口部に有機発光材料を含むインク1060x,1060yを滴下すると、各ピンニング位置Px,Pyの高さHx,Hyが次のような関係となる。
図5(c)に示すように、インク1060xを乾燥させると、ピンニング位置Pxの高さHxが相対的に低いことに起因して、形成される有機発光層106xでは、画素部の中央部分が盛り上がり、その膜厚が厚みTxとなる。
上記の関係を図6に纏めて示す。図6に示すように、バンク105の傾斜角度(テーパ角)θを小さくすれば、ピンニング高さHが低くなり、結果的に得られる有機発光層106の膜厚Tが厚くなる。逆に、バンク105の傾斜角度(テーパ角)θを大きくすれば、ピンニング高さHが高くなり、結果的に得られる有機発光層106の膜厚Tが薄くなる。
本実施の形態に係る表示パネル10の製造方法について、図9および図10を用い、特徴となる部分を説明する。なお、以下で説明を省略する製造工程については、従来技術として提案されている種々の工程を採用することが可能である。
図4に示すように、本実施の形態に係る表示装置1の表示パネル10では、画素部100b,100cにおけるバンク105c,105fにおいて、その各側面部105ca,105faの傾斜角度θc,θfが、画素部100aのバンク105a,105bの各側面部105aa,105baの傾斜角度θa,θbよりも大きく設定されている。このため、画素部100aと画素部100b,100cとでは、その製造時におけるインクを滴下した際のピンニング位置が、互いに異なることになる。具体的には、傾斜角度θc,θfが大きいバンク105c,105fに対応するインクのピンニング位置の高さは、傾斜角度θa,θbが小さいバンク105a,105bに対応するインクのピンニング位置の高さよりも高くなる。
次に、図11を用い、表示装置1の製造方法の変形例1について説明する。図11は、図9(c)から図10(a)に示す工程に対応する工程を示す。
次に、図12および図13を用い、表示装置1の製造方法の変形例2について説明する。図12および図13は、図9(c)から図10(b)に示す工程に対応する工程を示す。
上記実施の形態および変形例1,2に係る各製造方法について、具体例を以って形成後のバンク形状について検証を行った。その結果について、図14を用い説明する。
上記実施の形態および変形例1,2では、本発明の構成および作用・効果を分かりやすく説明するために一例としての各構成を採用するものであり、本発明は、本質的な部分を除き、上記形態に限定されるものではない。例えば、上記実施の形態では、図2に示すように、有機発光層106に対し、そのZ軸方向下側にアノード電極102が配されている構成を一例として採用したが、本発明は、これに限らず有機発光層106に対し、そのZ軸方向下側にカソード電極108が配されているような構成を採用することもできる。
10,30.表示パネル
20.駆動制御部
21~24.駆動回路
25.制御回路
100,100a~100c,300.画素部
101.基板
102.アノード電極
103.電極被覆層
104.ホール注入層
105,105a~105f,105x,105y,305.バンク
106,106a,106c,106x,106y.有機発光層
107.電子注入層
108.カソード電極
109.封止層
501~505.露光マスク
1050,1051a,1051b,1051e,1051f.バンク材料層
1060x,1060y.インク
Claims (18)
- 複数の画素部が配列されてなる表示装置であって、
各画素部は、第1電極および第2電極と、前記第1電極と前記第2電極との間に介挿された有機発光層とを有し構成されており、
前記第1電極の上方には、前記有機発光層を前記画素部ごとに区画する複数のバンクが立設されており、
前記複数の画素部には、前記配列の中央部側に位置する第1画素部と、当該第1画素部に対して、前記配列の端部側に位置する第2画素部とが含まれており、
前記複数のバンクには、前記第1画素部における前記有機発光層を前記配列の端部側で区画する第1バンクと、前記第1画素部における前記有機発光層を前記配列の中央部側で区画する第2バンクと、前記第2画素部における前記有機発光層を前記配列の端部側で区画する第3バンクと、前記第2画素部における前記有機発光層を前記配列の中央部側で区画する第4バンクとが含まれており、
前記第3バンクにおける前記第2画素部に対応する側面部は、前記第1バンクにおける前記第1画素部に対応する側面部に対し、その傾斜角度が異なる
ことを特徴とする表示装置。 - 前記第3バンクにおける前記側面部は、前記第1バンクにおける前記側面部に対し、その傾斜角度が大きい
ことを特徴とする請求項1に記載の表示装置。 - 前記第2バンクにおける前記第1画素部に対応する側面部は、前記第4バンクにおける前記第2画素部に対応する側面部に対し、その傾斜角度が等しくなるよう形成されている
ことを特徴とする請求項2に記載の表示装置。 - 前記第1バンクにおける前記側面部は、前記第2バンクにおける前記第1画素部に対応する側面部、および前記第4バンクにおける前記第2画素部に対応する側面部に対し、その傾斜角度が等しくなるように形成されている
ことを特徴とする請求項2に記載の表示装置。 - 前記第3バンクにおける前記側面部は、前記傾斜角度が35°以上40°以下の範囲内であり、
前記第1バンクにおける前記側面部は、前記傾斜角度が25°以上30°以下の範囲内である
ことを特徴とする請求項1に記載の表示装置。 - 前記第2バンクにおける前記第1画素部に対応する側面部、および前記第1バンクにおける前記側面部は、前記傾斜角度が25°以上30°以下の範囲内である
ことを特徴とする請求項5に記載の表示装置。 - 前記傾斜角度は、前記バンクにおける各側面部と、前記バンクが設けられている下地層の上面とがなす角度である
ことを特徴とする請求項1に記載の表示装置。 - 複数の画素部が配列されてなる表示装置の製造方法であって、
基板上に、第1電極を含む機能層を形成する第1工程と、
前記機能層の上に、感光性レジスト材料を積層する第2工程と、
前記積層された感光性レジスト材料をマスク露光してパターニングすることにより、複数の画素部に対応する複数の開口部を形成するとともに、隣接する前記開口部間を区画する複数のバンクを形成する第3工程と、
前記複数の開口部のそれぞれに対して、有機発光材料を含むインクを滴下して乾燥させ、有機発光層を形成する第4工程と、
前記有機発光層の上方に、第2電極を形成する第5工程と、
を有し、
前記複数の開口部には、前記配列の中央部側に位置する第1開口部と、当該第1開口部に対して、前記配列の端部側に位置する第2開口部とが含まれており、
前記複数のバンクには、前記第1開口部に対し、前記配列の端部側で区画する第1バンクと、前記第1開口部に対し、前記配列の中央部側で区画する第2バンクと、前記第2開口部に対し、前記配列の端部側で区画する第3バンクと、前記第2開口部に対し、前記配列の中央部側で区画する第4バンクとが含まれており、
前記第3工程では、第3バンクにおける前記第2開口部に対応する側面部の傾斜角度と、前記第1バンクにおける前記第1開口部に対応する側面部の傾斜角度とが異なるように、前記第1バンクおよび前記第3バンクの形成を行う
ことを特徴とする表示装置の製造方法。 - 前記第3工程では、第3バンクにおける前記側面部の傾斜角度が、前記第1バンクにおける前記側面部の傾斜角度よりも大きくなるように、前記前記第1バンクおよび前記第3バンクの形成を行う
ことを特徴とする請求項8に記載の表示装置の製造方法。 - 前記第3工程では、前記第2バンクにおける前記第1開口部に対応する側面部の傾斜角度と、前記第4バンクにおける前記第2開口部に対応する側面部の傾斜角度とが等しくなるように、前記第2バンクおよび前記第4バンクの形成を行う
ことを特徴とする請求項9に記載の表示装置の製造方法。 - 前記第3工程では、前記第1バンクにおける前記側面部の傾斜角度と、前記第2バンクにおける前記第1開口部に対応する側面部の傾斜角度、および前記第4バンクにおける前記第2開口部に対応する側面部の傾斜角度とが等しくなるように、前記第1バンクおよび前記第2バンクおよび前記第4バンクの形成を行う
ことを特徴とする請求項10に記載の表示装置の製造方法。 - 前記第4工程では、
前記第3工程の実行により、前記第3バンクにおける前記側面部の傾斜角度が、前記第1バンクにおける前記側面部の傾斜角度よりも大きくなるように、前記第1バンクおよび前記第3バンクを形成することにより、前記第1開口部および前記第2開口部に滴下された前記インクのピンニング位置を合わせ、以って、乾燥後の前記有機発光層の形状を揃える
ことを特徴とする請求項11に記載の表示装置の製造方法。 - 前記第3工程では、前記感光性レジスト材料の露光に関し、前記第3バンクの前記側面部に相当する部分への露光量と、前記第1バンクの前記側面部に相当する部分への露光量とを、互いに異ならせることにより、前記傾斜角度を互いに異ならせる
ことを特徴とする請求項8に記載の表示装置の製造方法。 - 前記第3工程では、前記第3バンクの前記側面部に相当する部分への露光量を、前記第1バンクの前記側面部に相当する部分への露光量よりも大きくする
ことを特徴とする請求項13に記載の表示装置の製造方法。 - 前記第3工程では、前記感光性レジスト材料の露光に関し、前記第3バンクの前記側面部に相当する部分への光の透過率と、前記第1バンクの前記側面部に相当する部分への光の透過率とが、互いに異なるマスクを用いることにより、前記傾斜角度を互いに異ならせる
ことを特徴とする請求項8に記載の表示装置の製造方法。 - 前記第3工程では、前記第3バンクの前記側面部に相当する部分への光の透過率が、前記第1バンクの前記側面部に相当する部分への光の透過率よりも大きいマスクを用いて露光する
ことを特徴とする請求項15に記載の表示装置の製造方法。 - 前記第3工程では、前記第3バンクの前記側面部に相当する部分と、前記第1バンクの前記側面部に相当する部分とに関し、前記感光性レジスト材料を露光して現像した後、前記第3バンクの前記側面部に相当する部分または前記第1バンクの前記側面部に相当する部分の一方に対して、露光処理を追加して行うことにより、前記傾斜角度を互いに異ならせる
ことを特徴とする請求項8に記載の表示装置の製造方法。 - 前記第3工程において、前記第3バンクの前記側面部に相当する部分に対して、前記露光処理を追加して行う
ことを特徴とする請求項17に記載の表示装置の製造方法。
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US8546821B2 (en) | 2013-10-01 |
JP5574112B2 (ja) | 2014-08-20 |
US20110198623A1 (en) | 2011-08-18 |
CN102165592A (zh) | 2011-08-24 |
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