WO2011074848A2 - 플라즈마 아크토치의 위치조절장치 - Google Patents
플라즈마 아크토치의 위치조절장치 Download PDFInfo
- Publication number
- WO2011074848A2 WO2011074848A2 PCT/KR2010/008918 KR2010008918W WO2011074848A2 WO 2011074848 A2 WO2011074848 A2 WO 2011074848A2 KR 2010008918 W KR2010008918 W KR 2010008918W WO 2011074848 A2 WO2011074848 A2 WO 2011074848A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plasma arc
- arc torch
- motor
- silicon
- torch
- Prior art date
Links
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 55
- 239000010703 silicon Substances 0.000 claims abstract description 55
- 230000003028 elevating effect Effects 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 11
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 52
- 238000002844 melting Methods 0.000 abstract description 9
- 230000008018 melting Effects 0.000 abstract description 9
- 238000009749 continuous casting Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 4
- 238000005266 casting Methods 0.000 abstract description 3
- 239000007787 solid Substances 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 17
- 239000002994 raw material Substances 0.000 description 17
- 239000002184 metal Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 5
- 230000006698 induction Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 239000003517 fume Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/26—Plasma torches
- H05H1/32—Plasma torches using an arc
- H05H1/44—Plasma torches using an arc using more than one torch
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K10/00—Welding or cutting by means of a plasma
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K10/00—Welding or cutting by means of a plasma
- B23K10/006—Control circuits therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K10/00—Welding or cutting by means of a plasma
- B23K10/02—Plasma welding
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
- H01L31/182—Special manufacturing methods for polycrystalline Si, e.g. Si ribbon, poly Si ingots, thin films of polycrystalline Si
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/26—Plasma torches
- H05H1/32—Plasma torches using an arc
- H05H1/34—Details, e.g. electrodes, nozzles
- H05H1/38—Guiding or centering of electrodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/546—Polycrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- Another object of the present invention is to arrange the plasma arc torch so that the raw material can be uniformly heated, and to adjust the position of the arc torch with a simple operation.
- FIG. 3 is a block diagram showing a heating area of the surface of the molten silicon in accordance with a conventional embodiment.
- Figure 4 is a block diagram showing the heating area of the surface of the molten silicon in accordance with an embodiment of the present invention.
- the rotating device 30 for rotating the plasma arc torch 18 will be described with reference to FIG. 2.
- a driving belt 34 which is rotated by receiving power from the rotary motor 32;
- the drive belt 34 is wound to include a rotating plate 36 that rotates in conjunction with the rotation of the drive belt 34.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Silicon Compounds (AREA)
- Furnace Details (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims (8)
- 실리콘 용탕에 대해 플라즈마 아크토치를 승강시키는 승강장치와;상기 실리콘 용탕에 대해 플라즈마 아크토치를 원주방향으로 회전시키는 회전장치와;상기 실리콘 용탕에 대해 플라즈마 아크토치의 각도를 조절하는 각도조절장치를 포함하고,상기 플라즈마 아크토치는 다수개가 방사형으로 배치됨을 특징으로 하는 플라즈마 아크토치의 위치조절장치.
- 제 1 항에 있어서, 상기 승강장치는,승강모터와;상기 승강모터에 연결되어 동력을 전달하는 구동기어와;상기 구동기어에 맞물려 회전되는 스크류잭과;상기 스크류잭에 연결되어 상기 스크류잭의 회전에 연동하여 승강되는 승강플레이트를 포함하는 것을 특징으로 하는 플라즈마 아크토치의 위치조절장치.
- 제 1 항 또는 제 2 항에 있어서, 상기 회전장치는,회전모터와;상기 회전모터로부터 동력을 전달받아 회전되는 구동벨트와;상기 구동벨트가 감아져 상기 구동벨트의 회전에 연동하여 회전되는 회전플레이트를 포함하는 것을 특징으로 하는 플라즈마 아크토치의 위치조절장치.
- 제 1 항에 있어서, 상기 각도조절장치는,각도조절모터와;상기 각도조절모터에서 전달된 동력을 직선운동으로 변환시키는 캠기어와;상기 캠기어의 회전에 연동하여 직경방향으로 이동이 가능하고, 상기 플라즈마 아크토치의 회전이 가능하도록 연결되는 토치 연결부재를 포함하는 것을 특징으로 하는 플라즈마 아크토치의 위치조절장치.
- 제 4 항에 있어서,상기 플라즈마 아크토치의 회전중심이 되고, 상기 회전플레이트에 고정되는 고정부를 더 포함하는 것을 특징으로 하는 플라즈마 아크토치의 위치조절장치.
- 제 4 항에 있어서,상기 각도조절모터의 모터축에는 베벨기어가 구비되어 상기 캠기어로 동력을 전달함을 특징으로 하는 플라즈마 아크토치의 위치조절장치.
- 제 6 항에 있어서,상기 토치 연결부재에는 상기 캠기어에 형성된 캠슬릿에 삽입되는 삽입핀이 구비됨을 특징으로 하는 플라즈마 아크토치의 위치조절장치.
- 제 1 항에 있어서,상기 플라즈마 아크토치는 4개가 원주방향을 따라 90도의 간격으로 배치됨을 특징으로 하는 플라즈마 아크토치의 위치조절장치.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012541962A JP5563097B2 (ja) | 2009-12-16 | 2010-12-14 | プラズマアークトーチの位置調節装置 |
US13/510,889 US8912463B2 (en) | 2009-12-16 | 2010-12-14 | Plasma arc torch positioning apparatus |
CN201080055193.0A CN102639760B (zh) | 2009-12-16 | 2010-12-14 | 等离子电弧焊炬的位置调节装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2009-0125556 | 2009-12-16 | ||
KR1020090125556A KR101581046B1 (ko) | 2009-12-16 | 2009-12-16 | 플라즈마 아크토치의 위치조절장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011074848A2 true WO2011074848A2 (ko) | 2011-06-23 |
WO2011074848A3 WO2011074848A3 (ko) | 2011-11-10 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2010/008918 WO2011074848A2 (ko) | 2009-12-16 | 2010-12-14 | 플라즈마 아크토치의 위치조절장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8912463B2 (ko) |
JP (1) | JP5563097B2 (ko) |
KR (1) | KR101581046B1 (ko) |
CN (1) | CN102639760B (ko) |
WO (1) | WO2011074848A2 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102623929B1 (ko) | 2021-10-20 | 2024-01-11 | 주식회사 에이치지에스 | 플라즈마 설비의 레벨링 장치 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11241168A (ja) * | 1998-02-26 | 1999-09-07 | Komatsu Ltd | 表面処理装置並びにアーク放電による表面処理装置および方法 |
JP2001019594A (ja) * | 1999-07-01 | 2001-01-23 | Sumitomo Sitix Of Amagasaki Inc | シリコン連続鋳造方法 |
JP2001019593A (ja) * | 1999-07-01 | 2001-01-23 | Sumitomo Sitix Of Amagasaki Inc | シリコン連続鋳造方法 |
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JPH08176690A (ja) * | 1994-12-22 | 1996-07-09 | Nippon Steel Corp | プラズマアークによる溶融金属の加熱装置 |
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-
2009
- 2009-12-16 KR KR1020090125556A patent/KR101581046B1/ko not_active IP Right Cessation
-
2010
- 2010-12-14 WO PCT/KR2010/008918 patent/WO2011074848A2/ko active Application Filing
- 2010-12-14 US US13/510,889 patent/US8912463B2/en not_active Expired - Fee Related
- 2010-12-14 JP JP2012541962A patent/JP5563097B2/ja not_active Expired - Fee Related
- 2010-12-14 CN CN201080055193.0A patent/CN102639760B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11241168A (ja) * | 1998-02-26 | 1999-09-07 | Komatsu Ltd | 表面処理装置並びにアーク放電による表面処理装置および方法 |
JP2001019594A (ja) * | 1999-07-01 | 2001-01-23 | Sumitomo Sitix Of Amagasaki Inc | シリコン連続鋳造方法 |
JP2001019593A (ja) * | 1999-07-01 | 2001-01-23 | Sumitomo Sitix Of Amagasaki Inc | シリコン連続鋳造方法 |
Also Published As
Publication number | Publication date |
---|---|
US8912463B2 (en) | 2014-12-16 |
WO2011074848A3 (ko) | 2011-11-10 |
KR20110068548A (ko) | 2011-06-22 |
JP5563097B2 (ja) | 2014-07-30 |
CN102639760B (zh) | 2015-04-29 |
US20120241438A1 (en) | 2012-09-27 |
JP2013512413A (ja) | 2013-04-11 |
KR101581046B1 (ko) | 2015-12-30 |
CN102639760A (zh) | 2012-08-15 |
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