WO2011061029A3 - Siliziumschichten aus polymermodifizierten flüssigsilan-formulierungen - Google Patents

Siliziumschichten aus polymermodifizierten flüssigsilan-formulierungen Download PDF

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Publication number
WO2011061029A3
WO2011061029A3 PCT/EP2010/065598 EP2010065598W WO2011061029A3 WO 2011061029 A3 WO2011061029 A3 WO 2011061029A3 EP 2010065598 W EP2010065598 W EP 2010065598W WO 2011061029 A3 WO2011061029 A3 WO 2011061029A3
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WO
WIPO (PCT)
Prior art keywords
polymer
layers made
silicon layers
modified liquid
liquid silane
Prior art date
Application number
PCT/EP2010/065598
Other languages
English (en)
French (fr)
Other versions
WO2011061029A2 (de
Inventor
Bernhard STÜTZEL
Matthias Patz
Original Assignee
Evonik Degussa Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Evonik Degussa Gmbh filed Critical Evonik Degussa Gmbh
Priority to CN2010800520612A priority Critical patent/CN102597317A/zh
Priority to EP10768480A priority patent/EP2501840A2/de
Priority to US13/503,668 priority patent/US9096922B2/en
Priority to JP2012539251A priority patent/JP2013511579A/ja
Publication of WO2011061029A2 publication Critical patent/WO2011061029A2/de
Publication of WO2011061029A3 publication Critical patent/WO2011061029A3/de

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/16—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/122—Inorganic polymers, e.g. silanes, polysilazanes, polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/0242—Crystalline insulating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H01L21/02576—N-type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H01L21/02579—P-type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02623—Liquid deposition
    • H01L21/02628—Liquid deposition using solutions

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Toxicology (AREA)
  • Silicon Polymers (AREA)
  • Silicon Compounds (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Photovoltaic Devices (AREA)

Abstract

Die Erfindung betrifft eine Formulierung, die zumindest ein Silan und zumindest ein Kohlenstoff-Polymer in einem Lösungsmittel enthält, sowie die Herstellung einer Siliziumschicht auf einem Substrat, das mit einer solchen Formulierung beschichtet wird.
PCT/EP2010/065598 2009-11-18 2010-10-18 Siliziumschichten aus polymermodifizierten flüssigsilan-formulierungen WO2011061029A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2010800520612A CN102597317A (zh) 2009-11-18 2010-10-18 从聚合物改性的液体硅烷配制剂形成的硅涂层
EP10768480A EP2501840A2 (de) 2009-11-18 2010-10-18 Siliziumschichten aus polymermodifizierten flüssigsilan-formulierungen
US13/503,668 US9096922B2 (en) 2009-11-18 2010-10-18 Silicon layers formed from polymer-modified liquid silane formulations
JP2012539251A JP2013511579A (ja) 2009-11-18 2010-10-18 ポリマー変性された液状シラン調製物からなるシリコン層

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009053805A DE102009053805A1 (de) 2009-11-18 2009-11-18 Siliziumschichten aus polymermodifizierten Flüssigsilan-Formulierungen
DE102009053805.4 2009-11-18

Publications (2)

Publication Number Publication Date
WO2011061029A2 WO2011061029A2 (de) 2011-05-26
WO2011061029A3 true WO2011061029A3 (de) 2011-10-20

Family

ID=43901973

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/065598 WO2011061029A2 (de) 2009-11-18 2010-10-18 Siliziumschichten aus polymermodifizierten flüssigsilan-formulierungen

Country Status (8)

Country Link
US (1) US9096922B2 (de)
EP (1) EP2501840A2 (de)
JP (1) JP2013511579A (de)
KR (1) KR20120091223A (de)
CN (1) CN102597317A (de)
DE (1) DE102009053805A1 (de)
TW (1) TW201129636A (de)
WO (1) WO2011061029A2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2135844A1 (de) * 2008-06-17 2009-12-23 Evonik Degussa GmbH Verfahren zur Herstellung höherer Hydridosilane
DE102009002758A1 (de) 2009-04-30 2010-11-11 Evonik Degussa Gmbh Bandgap Tailoring von Solarzellen aus Flüssigsilan mittels Germanium-Zugabe
DE102009053818A1 (de) 2009-11-18 2011-05-19 Evonik Degussa Gmbh Dotierung von Siliciumschichten aus flüssigen Silanen für Elektronik- und Solar-Anwendungen
DE102009053806A1 (de) 2009-11-18 2011-05-19 Evonik Degussa Gmbh Verfahren zur Herstellung von Siliciumschichten
DE102010002405A1 (de) 2010-02-26 2011-09-01 Evonik Degussa Gmbh Verfahren zur Oligomerisierung von Hydridosilanen, die mit dem Verfahren herstellbaren Oligomerisate und ihre Verwendung
DE102010030696A1 (de) 2010-06-30 2012-01-05 Evonik Degussa Gmbh Modifizierung von Siliciumschichten aus Silan-haltigen Formulierungen
DE102010040231A1 (de) * 2010-09-03 2012-03-08 Evonik Degussa Gmbh p-Dotierte Siliciumschichten
DE102010041842A1 (de) 2010-10-01 2012-04-05 Evonik Degussa Gmbh Verfahren zur Herstellung höherer Hydridosilanverbindungen
DE102010062984A1 (de) 2010-12-14 2012-06-14 Evonik Degussa Gmbh Verfahren zur Herstellung höherer Halogen- und Hydridosilane
DE102010063823A1 (de) 2010-12-22 2012-06-28 Evonik Degussa Gmbh Verfahren zur Herstellung von Hydridosilanen
DE102012221669A1 (de) 2012-11-27 2014-05-28 Evonik Industries Ag Verfahren zum Herstellen kohlenstoffhaltiger Hydridosilane
WO2014145107A1 (en) * 2013-03-15 2014-09-18 Ndsu Research Foundation Silicon materials from the processing of liquid silanes and heteroatom additives

Citations (2)

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Publication number Priority date Publication date Assignee Title
EP1284306A2 (de) * 2001-08-14 2003-02-19 JSR Corporation Silanzusammensetzung, Verfahren zum Herstellen eines Siliziumfilms und einer Solarzelle
US20090155454A1 (en) * 2007-01-18 2009-06-18 Seiko Epson Corporation Higher order silane composition, method for manufacturing film-coated substrate, electro-optical device and electronic device

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JP3517934B2 (ja) 1994-03-24 2004-04-12 昭和電工株式会社 シリコン膜の形成方法
JP2000265116A (ja) * 1999-03-15 2000-09-26 Osaka Gas Co Ltd 耐熱コーティング材料
KR100412743B1 (ko) 1999-03-30 2003-12-31 세이코 엡슨 가부시키가이샤 박막 트랜지스터의 제조 방법
DE60128611T2 (de) * 2000-03-13 2008-01-31 Jsr Corp. Cyclosilan, eine flüssige Zusammensetzung und ein Verfahren zur Bildung eines Silicium-Films
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EP2135844A1 (de) 2008-06-17 2009-12-23 Evonik Degussa GmbH Verfahren zur Herstellung höherer Hydridosilane
DE102009002758A1 (de) 2009-04-30 2010-11-11 Evonik Degussa Gmbh Bandgap Tailoring von Solarzellen aus Flüssigsilan mittels Germanium-Zugabe
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Publication number Priority date Publication date Assignee Title
EP1284306A2 (de) * 2001-08-14 2003-02-19 JSR Corporation Silanzusammensetzung, Verfahren zum Herstellen eines Siliziumfilms und einer Solarzelle
US20090155454A1 (en) * 2007-01-18 2009-06-18 Seiko Epson Corporation Higher order silane composition, method for manufacturing film-coated substrate, electro-optical device and electronic device

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Also Published As

Publication number Publication date
TW201129636A (en) 2011-09-01
KR20120091223A (ko) 2012-08-17
CN102597317A (zh) 2012-07-18
EP2501840A2 (de) 2012-09-26
DE102009053805A1 (de) 2011-05-26
US20120205654A1 (en) 2012-08-16
WO2011061029A2 (de) 2011-05-26
US9096922B2 (en) 2015-08-04
JP2013511579A (ja) 2013-04-04

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