WO2011046292A3 - 다공성 질화물 반도체 상의 고품질 비극성/반극성 반도체 소자 및 그 제조 방법 - Google Patents
다공성 질화물 반도체 상의 고품질 비극성/반극성 반도체 소자 및 그 제조 방법 Download PDFInfo
- Publication number
- WO2011046292A3 WO2011046292A3 PCT/KR2010/005764 KR2010005764W WO2011046292A3 WO 2011046292 A3 WO2011046292 A3 WO 2011046292A3 KR 2010005764 W KR2010005764 W KR 2010005764W WO 2011046292 A3 WO2011046292 A3 WO 2011046292A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- nitride semiconductor
- semiconductor device
- layer
- semipolar
- semiconductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
- H10F71/1278—The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising nitrides, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/124—Active materials comprising only Group III-V materials, e.g. GaAs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/815—Bodies having stress relaxation structures, e.g. buffer layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/12—Pendeo epitaxial lateral overgrowth [ELOG], e.g. for growing GaN based blue laser diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/0213—Sapphire, quartz or diamond based substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3202—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth
- H01S5/32025—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth non-polar orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3202—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth
- H01S5/320275—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth semi-polar orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/544—Solar cells from Group III-V materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010800466035A CN102598317A (zh) | 2009-10-16 | 2010-08-27 | 多孔氮化物半导体上的高品质非极性/半极性半导体器件及其制造方法 |
| US13/502,241 US9153737B2 (en) | 2009-10-16 | 2010-08-27 | High-quality non-polar/semi-polar semiconductor device on porous nitride semiconductor and manufacturing method thereof |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090098521A KR101082788B1 (ko) | 2009-10-16 | 2009-10-16 | 다공성 질화물 반도체 상의 고품질 비극성/반극성 반도체 소자 및 그 제조 방법 |
| KR10-2009-0098521 | 2009-10-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2011046292A2 WO2011046292A2 (ko) | 2011-04-21 |
| WO2011046292A3 true WO2011046292A3 (ko) | 2011-06-30 |
Family
ID=43876653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2010/005764 Ceased WO2011046292A2 (ko) | 2009-10-16 | 2010-08-27 | 다공성 질화물 반도체 상의 고품질 비극성/반극성 반도체 소자 및 그 제조 방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9153737B2 (ko) |
| KR (1) | KR101082788B1 (ko) |
| CN (1) | CN102598317A (ko) |
| WO (1) | WO2011046292A2 (ko) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011094391A1 (en) | 2010-01-27 | 2011-08-04 | Yale University | Conductivity based selective etch for gan devices and applications thereof |
| US9558954B2 (en) * | 2010-04-22 | 2017-01-31 | Luminus Devices, Inc. | Selective wet etching and textured surface planarization processes |
| KR101393624B1 (ko) * | 2012-01-27 | 2014-05-12 | 한국광기술원 | 적층결함이 제거된 반분극 질화물 소자의 제조방법 |
| KR102116152B1 (ko) * | 2012-03-19 | 2020-05-28 | 루미리즈 홀딩 비.브이. | 실리콘 기판 상에서 성장하는 발광 장치 |
| KR101391960B1 (ko) * | 2012-05-07 | 2014-05-12 | 한국산업기술대학교산학협력단 | 저결함 질화물 반도체층을 갖는 고품질 반도체 소자용 기판의 제조 방법 |
| WO2014004261A1 (en) | 2012-06-28 | 2014-01-03 | Yale University | Lateral electrochemical etching of iii-nitride materials for microfabrication |
| KR101317106B1 (ko) * | 2012-08-20 | 2013-10-11 | 전북대학교산학협력단 | 오믹 컨택 제조방법 및 이에 의하여 제조된 오믹 컨택 |
| KR101372352B1 (ko) * | 2012-09-07 | 2014-03-12 | 전북대학교산학협력단 | p-GaN 오믹 전극 제조방법 및 이에 의하여 제조된 p-GaN 오믹 전극 |
| KR101355086B1 (ko) * | 2012-12-18 | 2014-01-27 | 한국광기술원 | 나노 필러 구조를 이용한 반극성 질화물층의 제조방법 |
| CN104218128B (zh) * | 2013-05-31 | 2018-12-14 | 晶元光电股份有限公司 | 具有高效率反射结构的发光元件 |
| TW201530806A (zh) * | 2014-01-29 | 2015-08-01 | Rigidcrystal Technology Co Ltd | 發光元件 |
| JP6160501B2 (ja) * | 2014-02-12 | 2017-07-12 | 豊田合成株式会社 | 半導体装置の製造方法 |
| US11095096B2 (en) | 2014-04-16 | 2021-08-17 | Yale University | Method for a GaN vertical microcavity surface emitting laser (VCSEL) |
| EP3201952B1 (en) | 2014-09-30 | 2023-03-29 | Yale University | A method for gan vertical microcavity surface emitting laser |
| US11018231B2 (en) | 2014-12-01 | 2021-05-25 | Yale University | Method to make buried, highly conductive p-type III-nitride layers |
| US10554017B2 (en) * | 2015-05-19 | 2020-02-04 | Yale University | Method and device concerning III-nitride edge emitting laser diode of high confinement factor with lattice matched cladding layer |
| CN109148654B (zh) * | 2018-08-30 | 2020-04-07 | 芜湖德豪润达光电科技有限公司 | 非极性面ⅲ族氮化物外延结构及其制备方法 |
| WO2020095179A1 (en) * | 2018-11-05 | 2020-05-14 | King Abdullah University Of Science And Technology | Optoelectronic semiconductor device |
| CN113745361A (zh) * | 2021-07-20 | 2021-12-03 | 五邑大学 | 一种多孔GaN窄带紫外光电二极管及其制备方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001223165A (ja) * | 2000-02-10 | 2001-08-17 | Hitachi Cable Ltd | 窒化物半導体及びその製造方法 |
| JP2002050586A (ja) * | 2000-08-03 | 2002-02-15 | Hitachi Cable Ltd | 半導体結晶の製造方法 |
| JP2005085851A (ja) * | 2003-09-05 | 2005-03-31 | Hitachi Cable Ltd | 窒化物系化合物半導体発光素子の製造方法 |
| KR20050035565A (ko) * | 2003-10-13 | 2005-04-19 | 삼성전기주식회사 | 실리콘 기판 상에 형성된 질화물 반도체 및 그 제조 방법 |
| JP2007250611A (ja) * | 2006-03-14 | 2007-09-27 | Stanley Electric Co Ltd | 窒化物半導体発光素子およびその製造方法 |
| KR20070095181A (ko) * | 2006-03-20 | 2007-09-28 | 삼성전기주식회사 | Ⅲ족 질화물 반도체 박막 및 ⅲ족 질화물 반도체 발광소자 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4176003A (en) * | 1978-02-22 | 1979-11-27 | Ncr Corporation | Method for enhancing the adhesion of photoresist to polysilicon |
| JP2964941B2 (ja) * | 1996-01-12 | 1999-10-18 | 日本電気株式会社 | 光デバイスの製造方法及び実装構造 |
| KR100580751B1 (ko) * | 2004-12-23 | 2006-05-15 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
| KR100695117B1 (ko) | 2005-10-25 | 2007-03-14 | 삼성코닝 주식회사 | GaN 제조방법 |
| JP5250856B2 (ja) * | 2006-06-13 | 2013-07-31 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体発光素子の製造方法 |
| CN101054723A (zh) | 2007-02-07 | 2007-10-17 | 深圳市淼浩高新科技开发有限公司 | 一种r面蓝宝石晶体的生长方法 |
| JP5165264B2 (ja) * | 2007-03-22 | 2013-03-21 | 浜松ホトニクス株式会社 | 窒化物半導体基板 |
| US8118934B2 (en) * | 2007-09-26 | 2012-02-21 | Wang Nang Wang | Non-polar III-V nitride material and production method |
| KR101226077B1 (ko) * | 2007-11-27 | 2013-01-24 | 삼성전자주식회사 | 측벽 스페이서 형성 방법 및 이를 이용한 반도체 소자의제조 방법 |
-
2009
- 2009-10-16 KR KR1020090098521A patent/KR101082788B1/ko not_active Expired - Fee Related
-
2010
- 2010-08-27 WO PCT/KR2010/005764 patent/WO2011046292A2/ko not_active Ceased
- 2010-08-27 US US13/502,241 patent/US9153737B2/en not_active Expired - Fee Related
- 2010-08-27 CN CN2010800466035A patent/CN102598317A/zh active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001223165A (ja) * | 2000-02-10 | 2001-08-17 | Hitachi Cable Ltd | 窒化物半導体及びその製造方法 |
| JP2002050586A (ja) * | 2000-08-03 | 2002-02-15 | Hitachi Cable Ltd | 半導体結晶の製造方法 |
| JP2005085851A (ja) * | 2003-09-05 | 2005-03-31 | Hitachi Cable Ltd | 窒化物系化合物半導体発光素子の製造方法 |
| KR20050035565A (ko) * | 2003-10-13 | 2005-04-19 | 삼성전기주식회사 | 실리콘 기판 상에 형성된 질화물 반도체 및 그 제조 방법 |
| JP2007250611A (ja) * | 2006-03-14 | 2007-09-27 | Stanley Electric Co Ltd | 窒化物半導体発光素子およびその製造方法 |
| KR20070095181A (ko) * | 2006-03-20 | 2007-09-28 | 삼성전기주식회사 | Ⅲ족 질화물 반도체 박막 및 ⅲ족 질화물 반도체 발광소자 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011046292A2 (ko) | 2011-04-21 |
| KR101082788B1 (ko) | 2011-11-14 |
| US20120205665A1 (en) | 2012-08-16 |
| KR20110041611A (ko) | 2011-04-22 |
| CN102598317A (zh) | 2012-07-18 |
| US9153737B2 (en) | 2015-10-06 |
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