WO2011045994A1 - Structure de connexion de carte imprimée souple et dispositif d'affichage - Google Patents

Structure de connexion de carte imprimée souple et dispositif d'affichage Download PDF

Info

Publication number
WO2011045994A1
WO2011045994A1 PCT/JP2010/065488 JP2010065488W WO2011045994A1 WO 2011045994 A1 WO2011045994 A1 WO 2011045994A1 JP 2010065488 W JP2010065488 W JP 2010065488W WO 2011045994 A1 WO2011045994 A1 WO 2011045994A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible wiring
wiring board
hole
connection structure
connection
Prior art date
Application number
PCT/JP2010/065488
Other languages
English (en)
Japanese (ja)
Inventor
浩 川口
功夫 梶間
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to US13/501,146 priority Critical patent/US20120195024A1/en
Publication of WO2011045994A1 publication Critical patent/WO2011045994A1/fr

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • H05K3/363Assembling flexible printed circuits with other printed circuits by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/048Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709Staggered pads, lands or terminals; Parallel conductors in different planes

Definitions

  • the present invention relates to a flexible wiring board connection structure and a display device.
  • a display device typified by a portable terminal device such as a mobile phone or a PDA, a display of a television, a personal computer, and the like includes a large number of electronic components, and these electronic components are electrically connected to each other by a wiring circuit board or the like. Connected. In recent years, with the progress of thinning and miniaturization of display devices, attempts have been made to make the space for accommodating the printed circuit board as small as possible, and in order to realize this, folding and folding can be performed freely. A flexible wiring board is employed (Patent Document 1).
  • Patent Document 1 discloses a connection structure between flexible wiring boards. Specifically, it is a board connection structure in which a flexible board is inserted into an insertion hole provided in a fixed board having a wiring pattern and is fixed by soldering, and the flexible board sequentially reaches the rear in the insertion direction. An inclined portion formed with a size larger than the opening width of the insertion hole, an attachment portion formed behind the inclined portion and formed with a size smaller than the opening width of the insertion hole, and positioned behind the attachment portion.
  • a flexible board comprising: a stopper part formed to have a dimension larger than the opening width of the insertion hole; and the engagement part is engaged with the insertion hole of the fixed board, and the wiring patterns of the two boards are fixed by soldering.
  • a connection structure is disclosed.
  • Patent Document 1 as a fixing method other than tape or the like, the flexible wiring board is fixed to the insertion hole of the fixed board.
  • the stress is directly applied to the soldering portion. Concentration can cause cracks in the solder, resulting in poor connection.
  • the present invention has been made based on the above circumstances, and has an object of providing a connection structure for a flexible wiring board that has a simple configuration, is inexpensive, and has excellent connection reliability. Yes. Another object of the present invention is to provide a display device having such a connection structure.
  • a flexible wiring board connection structure of the present invention is a connection structure between a first flexible wiring board and a second flexible wiring board, and the first flexible wiring board includes a first structure.
  • a through hole and a second through hole are formed, and the second flexible wiring board is inserted from the first surface side of the first flexible wiring board to the second surface side with respect to the first through hole.
  • the second flexible wiring board inserted into the second surface side of the first flexible wiring board is connected to the first flexible wiring board through the second through hole. It is characterized by being soldered from the first surface side of the substrate.
  • connection structure two through holes are provided, the second flexible wiring board is inserted into the first through hole, and the inserted second flexible wiring board is inserted into the first flexible wiring via the second through hole. Since stress is applied to the second flexible wiring board because it is connected to the board, stress may concentrate on the first through hole, which is the part into which the board is inserted, but the second through hole, which is the soldering part. Since stress is difficult to concentrate, cracks and the like are not generated in the solder portion, and connection failure is unlikely to occur. Therefore, there is no need for measures such as attaching a fixing tape, and there is no increase in cost due to the simple configuration in which two through holes are provided in the substrate.
  • the first flexible wiring board has a first side terminal at least on the first surface side
  • the second flexible wiring board has a second side terminal at least on the first surface side.
  • the second side terminal is arranged to face the second surface side of the first flexible wiring board, and the first flexible wiring board through the second through hole. It can be soldered to the side terminals.
  • the first side terminal of the first flexible wiring board is connected to the second side terminal of the second flexible wiring board. It can be superimposed.
  • the second flexible wiring board is formed with respect to the first through hole if the first side terminal overlaps the second side terminal. Since the alignment is completed by inserting the, the operation for the alignment becomes extremely simple.
  • the first through holes may be arranged in a staggered pattern on the first flexible wiring board, and the second side terminals may be arranged in a staggered pattern on the second flexible wiring board. It can. With respect to the terminals having such a staggered arrangement, it is possible to easily perform alignment related to connection.
  • the first through hole may have a hole width that is substantially the same as the substrate width of the second flexible wiring board. In this way, by making the hole width and the substrate width substantially coincide with each other, it is possible to realize the alignment related to the connection by inserting the second flexible wiring board into the first through hole.
  • the second flexible wiring board may be provided with a protrusion that restricts insertion of the second flexible wiring board into the first through hole by a predetermined amount. By providing such protrusions, the amount of insertion is restricted, and alignment in the insertion direction is easily realized.
  • the second flexible wiring board is formed with a protrusion protruding in the width direction of the second flexible wiring board, and the width of the board constituting the second flexible wiring board including the protrusion is the first flexible wiring board. It can be larger than the hole width of the through hole.
  • soldering land is formed on the protrusion, and the first through-hole of the first flexible wiring board is soldered to a position overlapping the protrusion of the second flexible wiring board inserted through the first through-hole. Lands are formed, and these soldering lands can be fixed by soldering. In this case, in addition to the solder connection in the second through-hole, since the connection fixing at the soldering land portion is performed in a reinforcing manner, even when an external stress is applied to any of the substrates, the stress is applied to the solder connection portion. This makes it difficult for defects such as cracks to occur in the solder portion.
  • the solder connection may be performed by bridging at least a part of the second insertion hole.
  • the solder connection is made in such a way that at least a part of the second insertion hole is bridged in this way, the connection is made at both ends of the hole (that is, at two locations), so that the solder connection itself can be strengthened. It becomes.
  • a display device of the present invention is a display device including a touch panel, and includes a main control unit that performs display control, a touch panel control unit that performs control of the touch panel, and the main control.
  • the connection between the flexible wiring boards related to touch panel control and display control is realized by the above connection structure, poor connection is unlikely to occur, and a highly reliable display device is provided at low cost. It becomes possible.
  • the display device of the present invention is a display device including a backlight, and includes a main control unit that performs display control, a backlight control unit that performs control of the backlight, A first flexible wiring board derived from the main control unit, and a second flexible wiring board derived from the backlight control unit, the first flexible wiring board and the second flexible wiring board, They are connected by the connection structure described above.
  • a display device having a backlight if the connection between the flexible wiring boards related to backlight control and display control is realized by the above connection structure, poor connection is unlikely to occur, and a highly reliable display device is inexpensive. It becomes possible to provide.
  • the main control unit can control display of the liquid crystal panel.
  • the demand for thinning is high, and it can be possible to contribute to further thinning by adopting the connection structure of the flexible wiring board as in the present invention.
  • connection structure for a flexible wiring board that has a simple configuration, is inexpensive, and has excellent connection reliability.
  • present invention can provide a display device having such a connection structure.
  • FIG. 1 is a block diagram illustrating a schematic configuration of a liquid crystal display device according to an embodiment of the present invention.
  • the top view which shows the connection structure of the flexible wiring board with which the liquid crystal display device of FIG. 1 is provided.
  • Sectional drawing which shows the connection structure of the flexible wiring board with which the liquid crystal display device of FIG. 1 is provided.
  • action about the connection structure of the flexible wiring board with which the liquid crystal display device of FIG. 1 is provided.
  • the top view which shows the 1st modification about the connection structure of a flexible wiring board.
  • FIG. 8 is an AA cross-sectional view of the connection structure of FIG. 7.
  • FIG. 1 The figure for demonstrating an effect
  • the top view which shows the 3rd modification about the connection structure of a flexible wiring board.
  • Sectional drawing which shows a comparative example about the connection structure of a flexible wiring board.
  • Sectional drawing which shows a comparative example about the connection structure of a flexible wiring board.
  • the present embodiment shows an example of a liquid crystal display device (display device) 1, and the liquid crystal display device 1 includes a liquid crystal panel 11, a backlight 12, and a touch panel 13, for example, a mobile phone or the like. This is applied to a small display device.
  • the liquid crystal panel 11 is formed by sandwiching a liquid crystal layer between a pair of substrates.
  • the voltage applied to the liquid crystal layer is controlled for each pixel by an external main control unit 10, and display control is performed based on the control. Has been done.
  • the liquid crystal panel 11 and the main control unit 10 are connected by a main flexible wiring board 40 and can be folded and accommodated.
  • the liquid crystal display device 1 constitutes a small display device such as a mobile phone monitor. It is suitable for.
  • the backlight 12 supplies illumination light for display to the liquid crystal panel 11, and power supply for dimming is controlled by an external backlight control unit 20.
  • the backlight 12 and the backlight control unit 20 are connected by the flexible wiring board 22, and the backlight control unit 20 is also connected to the main flexible wiring board 40 via the backlight flexible wiring board 50. It is possible to send and receive signals to and from.
  • the flexible wiring boards 22 and 50 can be folded and housed in the display device in the same manner as the main flexible wiring board 40.
  • the touch panel 13 is an input device, and is formed of a transparent panel that senses coordinates.
  • the touch panel 13 is placed on a display surface and pointed with a touch pen, a finger, or the like to input data.
  • the input data is transmitted to the touch panel control unit 30, and display information displayed on the liquid crystal panel 11 is determined based on the data.
  • the touch panel 13 and the touch panel control unit 30 are connected by the flexible wiring board 32, and the touch panel control unit 30 is also connected to the main flexible wiring board 40 via the touch panel flexible wiring board 60. Signals can be transmitted and received.
  • the flexible wiring boards 32 and 60 can be folded and accommodated in the same manner as the main flexible wiring board 40.
  • the flexible wiring boards are connected to each other, and specifically, the connection is realized by solder connection.
  • the connection structure between the flexible wiring boards included in the liquid crystal display device 1 will be described in detail.
  • the flexible wiring boards 22 and 32, the main flexible wiring board 40, the backlight flexible wiring board 50, the touch panel flexible wiring board 60, and the like are employed.
  • flexible wiring boards are connected to each other, and signal transmission / reception between the control units 10, 20, and 30 is enabled.
  • 2 to 4 exemplify the connection structure with the flexible wiring board 50 (60).
  • the main flexible wiring board 40 and the flexible wiring board 50 (60) are connected by a solder part 90.
  • the main flexible wiring board 40 is formed with two through holes 45, 46, of which the flexible wiring board 50 (60) is inserted into the first through hole 45, and the flexible wiring board 50 is inserted into the second through hole 46. (60) is solder-connected to the main flexible wiring board 40.
  • connection terminals (first side terminals) 42 used for connection to the flexible wiring board 50 (60) are formed on the surface (first surface) 48 side of the board 41.
  • the flexible wiring board 50 (60) has a connection terminal (second side) provided for connection with the main flexible wiring board 40 on the front surface (first surface) 58 (68) side of the substrate 51 (61). Terminal) 52 (62) is formed.
  • the flexible wiring board 50 (60) is inserted into the first through-hole 45 from the front surface 48 side to the back surface (second surface) 49 side of the main flexible wiring board 40.
  • the back surface (second surface) side of the flexible wiring board 50 (60) is denoted by reference numeral 59 (69).
  • the connection terminal 42 has a linear shape and is divided by the second through hole 46.
  • the inserted flexible wiring board 50 (60) has a front end portion (inserted portion) 51a (61a) and a rear end portion 51b (61b) at the front end side with the first through hole 45 as a boundary.
  • tip part 51a (61a) of the flexible wiring board 50 (60) has the connection terminal 52 (62) formed in the surface 48 side through the 2nd through-hole 46, and the surface of the main flexible wiring board 40
  • the connection terminal 42 on the 48 side is soldered. That is, the connection terminal 42 and the connection terminal 52 (62) are soldered from the surface 48 side of the main flexible wiring board 40 through the second through hole 46.
  • the flexible wiring board 50 (60) When performing this solder connection, as shown in FIG. 4, the flexible wiring board 50 (60) is inserted into the first through hole 45, and the tip 51 a (61 a) is connected to the back surface 49 of the main flexible wiring board 40. By guiding to the side, the connection terminal 52 (62) faces the back surface 49. Then, the flexible wiring board 50 (60) is inserted until the connection terminal 52 (62) faces the second through hole 46 of the main flexible wiring board 40, and the positions of the flexible wiring boards 40 and 50 (60) are aligned. Do.
  • the flexible wiring board 50 (60) is positioned with respect to the first through-hole 45 by inserting the flexible wiring board 50 (60) into the first through-hole 45, and both the flexible wiring boards 40, 50 (60) is not misaligned.
  • the hole width of the first through hole 45 is substantially the same as the substrate width of the flexible wiring board 50 (60)
  • the positional deviation is extremely unlikely to occur.
  • connection terminal 42 of the main flexible wiring board 40 is inserted into the first through hole 45 in this manner (the state where both the flexible wiring boards 40 and 50 (60) are aligned).
  • connection terminal 52 (62) of the flexible wiring board 50 (60) are overlapped in a plan view of the board.
  • the connection terminal 42 of the main flexible wiring board 40 is linearly divided by the second through hole 46
  • the connection terminal of the flexible wiring board 50 (60) exposed from the second through hole 46. 52 (62) is located on the same straight line as the connection terminal 42 of the main flexible wiring board 40.
  • the connection terminals 42 and 52 (62) on the same straight line are soldered from the front surface 48 side of the main flexible wiring board 40 through the second through hole 46 in this manner, so that FIG. 1 to FIG.
  • the connection structure shown in 3 will be provided.
  • solder connection is performed by bridging at least a part of the second insertion hole 46. That is, it is performed across the connection terminals 42 of the main flexible wiring board 40 divided by the second through holes 46.
  • liquid crystal display device 1 As described above, the liquid crystal display device 1 according to the present embodiment and the connection structure of the flexible wiring board included in the liquid crystal display device 1 have been described.
  • connection structure two through holes are provided in the main flexible wiring board 40, the flexible wiring board 50 (60) is inserted into the first through hole 45, and the inserted flexible wiring board 50 (60) is passed through the second through hole.
  • the main flexible wiring board 40 is connected via the hole 46. Therefore, when a stress is applied to the flexible wiring board 50 (60), the stress can be concentrated in the first through hole 45, which is a portion where the substrate is inserted, but the stress is applied to the second through hole 46, which is a soldered portion. Since it is difficult to concentrate, cracks or the like do not occur in the solder portion, and connection failure is unlikely to occur. As a result, there is no need for measures such as affixing a fixing tape for connection, and the main flexible wiring board 40 has a simple configuration in which two through holes are provided.
  • the main flexible wiring board 40 has a connection terminal 42 at least on the surface 48 side
  • the flexible wiring board 50 (60) has a connection terminal 52 (62) on at least the surface 58 side.
  • 52 (62) is arranged facing the back surface 49 side of the main flexible wiring board 40 and is soldered to the connection terminals 42 of the main flexible wiring board 40 through the second through holes 46.
  • the flexible wiring board 50 (60) is inserted through the first through hole 45, and the connection terminal 52 (62) and the connection terminal 42 are connected by soldering via the second through hole 46.
  • connection terminal 42 of the main flexible wiring board 40 is connected to the connection terminal 52 (62) of the flexible wiring board 50 (60).
  • the connection terminal 42 is configured to overlap the connection terminal 52 (62).
  • the first through hole 45 has a hole width substantially the same as the substrate width of the flexible wiring board 50 (60). Therefore, it is possible to realize the alignment related to the connection by inserting the flexible wiring board 50 (60) into the first through hole 45.
  • the solder part 90 is formed in a form of bridging at least a part of the second insertion hole 46.
  • the connection is made at both ends of the hole (that is, at two locations), and the solder connection itself is strengthened. That is, as shown in FIG. 11, when the substrates 140 and 150 are simply overlapped and soldered by the solder part 190, the connection is made at one end, and the need to fix the connection with the double-sided tape 161 arises.
  • FIG. 12 when one through hole 245 is provided in the first flexible wiring board 240 and the second flexible wiring board 250 is inserted therethrough and soldered by the solder portion 290 at the insertion portion.
  • the connection is made at one end, and the connection reliability is low.
  • the flexible wiring board 50 (60) is provided with a protrusion. Specifically, a protrusion 53 (63) protruding in the width direction is formed at the end in the width direction of the substrate 51 (61). The width of the flexible wiring board 50 (60) including the protrusion 53 (63) is made larger than the hole width of the first through hole 45.
  • the insertion amount of the flexible wiring board 50 (60) with respect to the first through hole 45 of the main flexible wiring board 40 is restricted, and alignment in the insertion direction is easily realized. It will be.
  • connection terminals 42 of the main flexible wiring board 40 are arranged in a staggered manner in the plan view of the board 41, and similarly the first through holes 46 are also flat. It is arranged in a staggered pattern. Also, in the flexible wiring board 50 (60), the connection terminals 52 (62) are arranged in a staggered manner in a plan view.
  • connection terminals 42 and 52 (62) are arranged in a staggered manner, by adopting a connection structure similar to that of the above-described embodiment, alignment for connection can be easily performed. In other words, alignment is often difficult with staggered connection terminals, but by adopting the connection structure of this embodiment, alignment between substrates can be reliably performed even in a staggered arrangement. is there.
  • solder bridges are hardly generated and leaks are hardly generated.
  • a protrusion 53 (63) is provided on the flexible wiring board 50 (60), and the protrusion 53 (63) is soldered.
  • the attachment land 53a (63a) is formed, and the first through hole 45 of the main flexible wiring board 40 overlaps with the protrusion 53 (63) of the flexible wiring board 50 (60) inserted through the first through hole 45.
  • the soldering lands 47 are formed on the soldering lands 47, and the soldering lands 53 a (63 a) and 47 are fixed to each other by a solder portion 95.
  • connection fixing at the soldering land portion is performed in a reinforcing manner, so that even when an external stress is applied to any of the substrates 40, 50 (60).
  • stress it is difficult for stress to be applied to the solder connection portion, and it is difficult for defects such as cracks to occur in the solder portion.
  • connection structure of the main flexible wiring board 40 and the backlight flexible wiring board 50 and the main flexible wiring board 40 and the touch panel flexible wiring board 60 has been described, but the present invention also applies to other flexible wiring boards.
  • the connection structure of the invention can be adopted.
  • the connection structure of the present invention can be adopted between these boards.
  • a display device applied to a mobile phone has been described.
  • any display device such as a display device applied to a computer monitor or a display device applied to a television receiver may be used.
  • the connection structure of the flexible wiring board of the present invention can be employed.
  • SYMBOLS 1 Liquid crystal display device (display apparatus), 10 ... Main control part, 11 ... Liquid crystal panel (display panel), 12 ... Back light, 13 ... Touch panel, 20 ... Back light control part, 30 ... Touch panel control part, 40 ... Main Flexible wiring substrate (first flexible wiring substrate), 41... Substrate, 42 .. connection terminal (first side terminal), 45... First through hole, 46. First surface), 49 ... Back surface (second surface), 50 ... Backlight flexible wiring substrate (second flexible wiring substrate), 51 ... Substrate, 51a ... Front end portion (inserted portion), 51b ... Rear end portion ( (Not inserted part), 52 ... connection terminal (second side terminal), 53 ... projection, 53a ...
  • soldering land 58 ... front surface (first surface), 59 ... back surface (second surface), 60 ... touch panel frame Sibling wiring board (second flexible wiring board), 61... Board, 61a... Tip portion (inserted portion), 61b .. rear end portion (not inserted portion), 62 .. connection terminal (second side terminal), 63 ... Projection, 63a ... Soldering land, 68 ... Front surface (first surface), 69 ... Back surface (second surface), 90 ... Solder part, 95 ... Solder part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne une structure de connexion de carte imprimée souple offrant une configuration simple, un coût réduit et une meilleure fiabilité des connexions. La structure de connexion est une structure connectant une première carte imprimée souple (40) et une seconde carte imprimée souple (50) et caractérisée en ce qu'un premier trou traversant (45) et un second trou traversant (46) sont ménagés dans la première carte imprimée souple (40), la seconde carte imprimée souple (50) étant insérée dans le premier trou traversant (45) entre le côté de la première surface (48) de la première carte imprimée souple (40) et le côté de la seconde surface (49) de celle-ci. La seconde carte imprimée souple (50), insérée jusqu'au côté de la seconde surface (49) de la première carte imprimée souple (40), est soudée sur la première carte imprimée souple (40) à partir du côté de la première surface (48) de celle-ci (40), en passant par le second trou traversant (46).
PCT/JP2010/065488 2009-10-14 2010-09-09 Structure de connexion de carte imprimée souple et dispositif d'affichage WO2011045994A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/501,146 US20120195024A1 (en) 2009-10-14 2010-09-09 Flexible circuit board connection structure and display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-237486 2009-10-14
JP2009237486 2009-10-14

Publications (1)

Publication Number Publication Date
WO2011045994A1 true WO2011045994A1 (fr) 2011-04-21

Family

ID=43876048

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/065488 WO2011045994A1 (fr) 2009-10-14 2010-09-09 Structure de connexion de carte imprimée souple et dispositif d'affichage

Country Status (2)

Country Link
US (1) US20120195024A1 (fr)
WO (1) WO2011045994A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107197601A (zh) * 2017-07-15 2017-09-22 深圳市宝盛自动化设备有限公司 一种背光fpc自动对位机构
US10134966B2 (en) 2015-02-27 2018-11-20 Nichia Corporation Light emitting device
CN114501840A (zh) * 2020-10-26 2022-05-13 鹏鼎控股(深圳)股份有限公司 电路板组件的制作方法及电路板组件

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8851356B1 (en) 2008-02-14 2014-10-07 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method
US10334735B2 (en) 2008-02-14 2019-06-25 Metrospec Technology, L.L.C. LED lighting systems and methods
US8007286B1 (en) 2008-03-18 2011-08-30 Metrospec Technology, Llc Circuit boards interconnected by overlapping plated through holes portions
US8143631B2 (en) 2008-03-06 2012-03-27 Metrospec Technology Llc Layered structure for use with high power light emitting diode systems
US8410720B2 (en) 2008-04-07 2013-04-02 Metrospec Technology, LLC. Solid state lighting circuit and controls
KR102050067B1 (ko) * 2013-02-25 2019-11-29 삼성디스플레이 주식회사 표시 장치
JP2014192476A (ja) * 2013-03-28 2014-10-06 Fujitsu Ltd プリント基板の半田実装方法及び半田実装構造
JP6197342B2 (ja) * 2013-04-10 2017-09-20 株式会社デンソーウェーブ ケーブル接続構造
CA2913667A1 (fr) 2013-05-28 2014-12-04 Chemometec A/S Cytometre a formation d'images
CN105572988B (zh) * 2014-11-04 2019-07-16 株式会社日本显示器 显示装置
US9748723B2 (en) * 2014-12-12 2017-08-29 Peter Sussman Solder-less board-to-wire connector
KR20160110861A (ko) 2015-03-13 2016-09-22 삼성디스플레이 주식회사 연성 회로 기판 및 이를 포함하는 표시 장치
US10849200B2 (en) 2018-09-28 2020-11-24 Metrospec Technology, L.L.C. Solid state lighting circuit with current bias and method of controlling thereof
US11428393B2 (en) * 2019-12-20 2022-08-30 Lumileds Llc Flexible LEDs strips with staggered interconnects

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327072U (fr) * 1986-08-07 1988-02-22
JPH01179461U (fr) * 1988-06-07 1989-12-22
JPH04116176U (ja) * 1991-03-29 1992-10-16 日本ビクター株式会社 フレキシブルプリント配線板の接続構造
JPH09214086A (ja) * 1996-02-05 1997-08-15 Canon Inc 回路基板相互の接続構造
JP2006018179A (ja) * 2004-07-05 2006-01-19 Sharp Corp 液晶表示モジュール及び液晶表示装置
JP2009188127A (ja) * 2008-02-05 2009-08-20 Sony Corp フレキシブル回路基板及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6538207B1 (en) * 2002-01-18 2003-03-25 Agilent Technologies, Inc. Strain relief structures for lead connections
TWI298989B (en) * 2005-12-01 2008-07-11 Au Optronics Corp Circuit board module and forming ethod thereof
JP2009086077A (ja) * 2007-09-28 2009-04-23 Hitachi Displays Ltd タッチパネルを搭載した液晶表示装置及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327072U (fr) * 1986-08-07 1988-02-22
JPH01179461U (fr) * 1988-06-07 1989-12-22
JPH04116176U (ja) * 1991-03-29 1992-10-16 日本ビクター株式会社 フレキシブルプリント配線板の接続構造
JPH09214086A (ja) * 1996-02-05 1997-08-15 Canon Inc 回路基板相互の接続構造
JP2006018179A (ja) * 2004-07-05 2006-01-19 Sharp Corp 液晶表示モジュール及び液晶表示装置
JP2009188127A (ja) * 2008-02-05 2009-08-20 Sony Corp フレキシブル回路基板及びその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10134966B2 (en) 2015-02-27 2018-11-20 Nichia Corporation Light emitting device
US10847695B2 (en) 2015-02-27 2020-11-24 Nichia Corporation Light emitting device
US11271145B2 (en) 2015-02-27 2022-03-08 Nichia Corporation Light emitting device
CN107197601A (zh) * 2017-07-15 2017-09-22 深圳市宝盛自动化设备有限公司 一种背光fpc自动对位机构
CN114501840A (zh) * 2020-10-26 2022-05-13 鹏鼎控股(深圳)股份有限公司 电路板组件的制作方法及电路板组件

Also Published As

Publication number Publication date
US20120195024A1 (en) 2012-08-02

Similar Documents

Publication Publication Date Title
WO2011045994A1 (fr) Structure de connexion de carte imprimée souple et dispositif d'affichage
TWI476738B (zh) 軟性顯示面板及其組裝方法
US7090506B2 (en) Signal transmission device having flexible printed circuit boards
US7070422B1 (en) Flexible circuit board
KR100745255B1 (ko) 회로 필름 및 이를 구비한 표시 장치
US20070126971A1 (en) Dual-display device with rigid-flex printed board having bonded connection means
JP2008187174A (ja) 印刷回路基板、及びそれを有する表示パネルアセンブリ
CN113301713A (zh) 印制电路板、柔性电路板、显示面板以及制作方法
JP2008294114A (ja) フレキシブルプリント基板及び液晶表示装置
JP2008145753A (ja) 表示装置
KR20140073935A (ko) 디스플레이 모듈
CN102006726B (zh) 复合式电路板装置及制造方法
JP2001109391A (ja) 接続用基板及びこの接続用基板を用いた平面表示装置の実装方法
TWI413463B (zh) 複合式電路板裝置及製造方法
JP2008233358A (ja) 液晶表示装置
JP2007199464A (ja) 表示装置及びフレキシブルプリント配線板
JP2001091968A (ja) 電気光学装置及び電子機器
CN202514165U (zh) 柔性印刷线路板
CN215734997U (zh) 印制电路板、柔性电路板以及显示面板
JP5937415B2 (ja) 液晶表示モジュール
CN115311949B (zh) 绑定结构、显示模组和电子设备
JP2000194278A (ja) 電気回路装置
WO2012133750A1 (fr) Structure de connexion pour cartes de circuits imprimés souples
JP2009075498A (ja) 電気光学装置及び電子機器
TWI387419B (zh) 電性連接裝置、包含該電性連接裝置之電子裝置及電子產品

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10823262

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 13501146

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10823262

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP