WO2011041600A1 - Fabrication de mini-canaux à grand rapport d'aspect, à grande surface spécifique, et application de ces micro-canaux à des systèmes de refroidissement de liquide - Google Patents

Fabrication de mini-canaux à grand rapport d'aspect, à grande surface spécifique, et application de ces micro-canaux à des systèmes de refroidissement de liquide Download PDF

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Publication number
WO2011041600A1
WO2011041600A1 PCT/US2010/050990 US2010050990W WO2011041600A1 WO 2011041600 A1 WO2011041600 A1 WO 2011041600A1 US 2010050990 W US2010050990 W US 2010050990W WO 2011041600 A1 WO2011041600 A1 WO 2011041600A1
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WO
WIPO (PCT)
Prior art keywords
fins
heat exchanger
exchanger according
fin heat
stacked
Prior art date
Application number
PCT/US2010/050990
Other languages
English (en)
Inventor
Madhav Datta
Peng Zhou
Brandon Leong
Mark Mcmaster
Douglas E. Werner
Original Assignee
Cooligy Inc.
Choi, Hae-Won
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooligy Inc., Choi, Hae-Won filed Critical Cooligy Inc.
Publication of WO2011041600A1 publication Critical patent/WO2011041600A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/04—Fastening; Joining by brazing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • This invention relates to the field of heat exchangers. More particularly, this invention relates to a method of fabricating heat exchangers having high surface area, high aspect ratio minichannels and/or high aspect ratio microchannels, and their application in fluid cooling systems.
  • HSVRM High Surface to Volume Ratio Material
  • High aspect ratio channels are fabricated by anisotropic etching of silicon, which has found widespread use in micromachining and MEMS.
  • silicon has a low thermal conductivity relative to many other materials, and especially relative to true metals.
  • the present invention provides methods and apparatuses which achieve high heat transfer in a fluid cooling system, and which do so with a relatively small pressure drop across the system.
  • the present invention discloses high aspect ratio, high surface area structures applicable in micro-heat-exchangers for fluid cooling systems and cost effective methods for manufacturing the same.
  • fins used to construct mini-channels are fabricated with self-aligning features.
  • the self-aligning features allow the fins to be stacked within a heat exchanger cannister without bonding each fin, such that the cannister only needs to be heated once to bond the entire heat exchanger.
  • fins are fabricated with wall features to mix fluid passing through a mini-channel.
  • fins are fabricated with one or more passages, conduits or vents passing therethrough to reduce pressure drop in a heat exchanger.
  • fins are fabricated having both wall features and passages therethrough.
  • methods are employed to reduce pressure drop in a heat exchanger.
  • a unique geometry is provided to divert fluid flow paths in order to reduce pressure drop.
  • a manifold layer is used to divert fluid flow paths in order to minimize pressure drop.
  • the coupling of the microchannel fins to the spacers is provided by the use of a brazing material.
  • the brazing material is placed in contact with the microchannel fins and the structure and heated to above the melting temperature of the brazing material.
  • the step of coupling the microchannel fins to the structure is provided by thermal fusing.
  • Figure 1 A illustrates a schematic view of a fluid cooling system utilizing the heat exchanger with mini-channels.
  • Figure IB illustrates a schematic isometric view of a partially assembled heat exchanger according to some embodiments of the present invention.
  • Figure 2 A illustrates a schematic view of a high aspect ratio plate with a mask for etching according to some embodiments of the present invention.
  • Figure 2B illustrates a schematic view of an I-Beam fin fabricated through etching according to some embodiments of the present invention.
  • Figure 2C illustrates a schematic view of a stack of I-Beam fins to be used in a heat- exchanger according to some embodiments of the present invention.
  • Figure 2D illustrates a schematic view of a T-Beam fin fabricated through etching according to some embodiments of the present invention.
  • Figure 2E illustrates a schematic view of a stack of T-Beam fins to be used in a heat- exchanger according to some embodiments of the present invention.
  • Figure 3A is an exploded schematic view illustrating the parts which comprise the heat exchanger according to some embodiments of the present invention.
  • Figure 3B is a partially exploded schematic view illustrating a partially assembled cannister and lid according to some embodiments of the present invention.
  • Figure 3C illustrates a schematic view of a fully assembled heat exchanger positioned above a heat-producing surface according to some embodiments of the present invention.
  • Figure 4 illustrates an exemplary process for fabricating patterned fins by
  • Figure 5A illustrates a side view of a fin treated with a mask in preparation for the step of forming wall features on the fin.
  • Figure 5B illustrates a close-up side view of the surface of a fin treated with a fluid etchant, forming wall features on the fin.
  • Figure 5C illustrates a side view of a fin with wall features formed from etching.
  • Figure 6A illustrates an isometric view of an individual fin with rectangular wall features.
  • Figure 6B illustrates an isometric view of an individual fin with triangular wall features.
  • Figure 6C illustrates an isometric view of an individual fin with rounded wall features.
  • Figure 7A illustrates a schematic view of an example of a fin having angled wall features according to some embodiments of the present invention.
  • Figure 7B illustrates a schematic view of an example of a fin having angled wall features and straight wall features according to some embodiments of the present invention.
  • Figure 7C illustrates a schematic view of an example of a fin having angled wall features and an empty center according to some embodiments of the present invention.
  • Figure 7D illustrates a schematic view of an example of a fin having zig-zag wall features according to some embodiments of the present invention.
  • Figure 7E illustrates a schematic view of an example of a fin having sinusoidal wall features according to some embodiments of the present invention.
  • Figure 7F illustrates a schematic view of an example of a fin having Crosshatch wall features according to some embodiments of the present invention.
  • Figure 7G illustrates a schematic view of an example of adjacent complimentary fins having complimentary wall features according to some embodiments of the present invention.
  • Figure 7H illustrates a schematic view of an example of adjacent complimentary fins having complimentary wall features according to some embodiments of the present invention.
  • Figure 8A illustrates a schematic view of an example of a fin having of pin wall features according to some embodiments of the present invention.
  • Figure 8B is a schematic side view of a heat exchanger with fins having pin wall features forming a structured pseudo foam according to some embodiments of the present invention.
  • Figure 9A illustrates a schematic side view of a high aspect ratio, high surface area heat exchanger using mini-channels and a metal mesh between the mini-channels according to some embodiments of the present invention.
  • Figure 9B illustrates a schematic side view of a high surface area heat exchanger using a stack of metal mesh layers according to some embodiments of the present invention.
  • Figure 9C illustrates a schematic side view of a high surface area heat exchanger using an open-cell metal foam insert according to some embodiments of the present invention.
  • Figure 10A illustrates a schematic side view of a fin having pin wall features and vents passing therethrough.
  • Figure 10B illustrates a schematic side view of a stack of fins having pin wall features and vents passing therethrough.
  • Figure IOC illustrates a schematic isometric view of a heat exchanger with a stack of fins having pin wall features and vents passing therethrough.
  • Figure 11A illustrates a schematic isometric view of fins having conduits and a fin without a conduit used in heat exchangers according to some embodiments of the present invention.
  • Figure 11B illustrates a schematic isometric view of a heat exchanger with fins having apertures for reducing the path length of the fluid.
  • Figure 12 illustrates a schematic top view of a heat exchanger with a spine divider for reducing the path length of fluid.
  • Figure 13 illustrates a schematic top view of a heat exchanger with a spine divider and four quadrants for cooling multi-core integrated chips.
  • Figure 14 illustrates a schematic isometric view of a heat exchanger with a manifold layer for dividing the fluid for separate fluid paths.
  • FIG. 1A illustrates a schematic view of a fluid cooling system 199 according to some embodiments of the present invention.
  • the fluid cooling system 199 utilizes a heat exchanger 100 with internal mini-channels 150. As shown by directional arrows, fluid is pumped through the heat exchanger 100 and to a heat rejecter 140 by a pump 110, which is controlled by control module 120.
  • the heat exchanger 100 with high aspect ratio fins 150 transfers heat from a surface (not shown) to the fluid pumped through the fins of the heat exchanger. Heat exchange in such a fluid cooling system is improved by configuring the flowing fluid to be in contact with as much surface area as possible of the material that is designed to extract the heat from the surface.
  • heat exchanger with high surface area structures is therefore advantageous for developing an effective heat-exchanger.
  • the fabrication process be low cost in order to be competitive in consumer electronics markets. Therefore, it is an object of the invention to provide a low- cost fabrication process for producing heat exchangers which effectively cools a surface.
  • heat exchanger and the term cannister are synonymous and may be used interchangeably.
  • the heat exchanger is comprised of copper. In other embodiments of the present invention, the heat exchanger is comprised of aluminum. Furthermore, although specific examples of suitable construction materials are given, it will readily apparent to those having ordinary skill in the art that a number of materials are suitable for use in constructing the heat exchanger.
  • FIG. IB illustrates a schematic isometric view of a partially assembled heat exchanger 100 according to some embodiments of the present invention.
  • the heat exchanger 100 comprises a cannister 101, a thermal interface section 102, a block of mini-channels 105 and conduits 103 and 104.
  • the heat exchanger 100 is positioned on a surface (not shown) such that the interface section 102 is positioned directly on top of a heat-producing portion of the surface.
  • the heat exchanger 100 is thermally coupled to the heat-producing portion of the surface in order to transfer heat to the fluid flowing through the heat exchanger 100.
  • a Thermal Interface Material TIM
  • thermal grease maybe used to couple the heat exchanger 100 to the surface.
  • the block of channels 105 are positioned lengthwise in the cannister 101.
  • the individual fins 150 comprising the block of channels 105 are spaced very close together, but do not touch one another.
  • the size of the channels are preferably on the order of millimeters or micrometers.
  • a first method of making high aspect ratio mini-channels involves stacking individual high aspect ratio fins 150 having self-aligning features to form channels between successively stacked fins 150.
  • Figures 2A-2C illustrates the process of creating a block of mini-channels from individual high aspect ratio fins 150.
  • high aspect ratio plates 149 are formed into high aspect ratio fins.
  • separator patterns are built into high aspect ratio plates 149 through wet-etching or by mechanical means. The separator features serve as self-aligning features.
  • masks 148 are placed on high aspect ratio plates 149 and etched to create desired patterns.
  • Figure 2A illustrates a high aspect ratio plate 149 with a mask 148.
  • the high aspect ratio plate 149 undergoes wet-etching to remove material from the plate.
  • the end result of the etching process is a fin 150 with channels 151 and spacer elements 152.
  • the fin 150 is the shape of an I-Beam.
  • the spacer elements 152 allow a number of fins 150 to be stacked together without the danger that the stack will collapse.
  • the spacing between successively stacked fins 150 is uniform. This offers a manufacturer of mini-channel heat exchangers the ability to precisely control the width of the mini-channels depending on the desired application.
  • Figure 2C illustrates a stack of fins 150 to be used in a heat-exchanger.
  • any method of producing the fins 150 may be used, however, etching the fins 150 has distinct advantages over machining a work piece to the same parameters.
  • the etching process results in work pieces with extremely straight, clean surfaces. Any machining process will have the problems of deformation of the pieces and contamination of the pieces with dirt, oil, grease, cutting fluid, etc. Additionally, etching the work pieces is much less expensive than machine processes. Furthermore, the etching process allows the mini- channels to be produced with extremely fine features.
  • Figures 2D and 2E illustrate another embodiment of the present invention which utilizes a fin 150 in a T-shape with full length spacers 152 on the upper part of the fin and footers 153 at the lower corners of the fin 150.
  • the fin 150 is stacked in the same manner as in Figure 2C, except that fluid present in the channels in Figure 2E are in direct contact with the bottom surface of a heat exchanger (not shown).
  • the fins 150 are constructed with a conductive material
  • the embodiment described in Figure 2E having minimum thickness of the bottom plate in contact with the heat producing source provides minimum resistance to heat transfer. Therefore, the channels shown in Figure 2E are more effective than the channels shown in Figure 2C in transferring heat from a heat producing source (not shown) to a fluid medium in a fluid cooling system.
  • a brazing process is utilized to individually bond fins 150 and other pieces together to construct a heat exchanger.
  • Exemplary brazing processes include, but are not limited to, vacuum brazing, inert atmosphere brazing, and reducing atmosphere brazing.
  • vacuum brazing inert atmosphere brazing
  • reducing atmosphere brazing it is desirable to provide a method for the fabrication of a heat exchanger in which the parts only need to be heated once in order to braze all the parts.
  • the process becomes less expensive and less time-consuming. Therefore, it is desirable to use self-aligning fins which are able to stay in place while preparing the rest of the parts for heating.
  • FIG 3 A illustrates an exploded view of the parts which comprise the heat exchanger 100 according to some embodiments of the present invention.
  • the bottom part of a cannister 320 is selected to be placed on a heat producing surface (not shown).
  • the bottom part of the cannister 320 includes a thermal interface section 335 comprising a section of the floor of the bottom part of the cannister 320 which has a high thermal conductivity.
  • a layer of a brazing substance 330 is positioned within the bottom part of the cannister 320 to thermally couple a stack of fins 351 to the thermal interface section 335.
  • CuSil is used as a brazing substance 330.
  • the brazing substance has a portion of copper, a portion of nickle, a portion of tin, and a portion of phosphorous.
  • An example of a brazing substance that includes copper, nickel, tin, and phosphorous is CuproBrazeTM which has approximately 67% copper, approximately 7% nickel, approximately 9% tin, and approximately 7% phosphorous.
  • the brazing material is in the form of a paste, a foil, or a wire.
  • a second brazing substance 360 is lined on the top edge of the bottom part of the cannister 320 for brazing the lid 370 to the bottom part of the cannister 320.
  • CuSil is used as a second brazing substance 360.
  • the second brazing substance has a portion of copper, a portion of nickle, a portion of tin, and a portion of phosphorous, such as CuproBrazeTM.
  • the second brazing material is in the form of a paste, a foil, or a wire.
  • the lid 370 is coupled to the top of the bottom part of the cannister 320.
  • Figure 3B illustrates a partially assembled cannister 380 comprising a bottom part of a cannister 321 and lid 370. As shown, the fins 350 are positioned in the bottom part of a cannister 321 forming a block of mini-channels 390. After the lid 370 is attached to the bottom part of the cannister 321, the pieces are subjected to heat to bond the parts.
  • FIG 3C illustrates a fully assembled heat exchanger 300 according to some embodiments of the present invention.
  • the heat exchanger 300 is positioned over a heat producing surface 319. As shown, the heat producing surface 319 is an integrated chip. However, the heat exchanger 300 according to the present invention can be used to cool any heat-producing surface 319.
  • a Thermal Interface Material (TIM) 330 such as thermal grease is placed between the heat-exchanger 300 and the heat-producing surface 319.
  • TIM Thermal Interface Material
  • fins or plates with wall features increase the overall surface area of the mini-channel which allows more fluid to interact with the thermally conductive material. By increasing the liquid-to-plate interaction, more fluid is heated by the plates and the fluid is heated more evenly.
  • the wall features also provide a means to mix the fluid, resulting in an even more homogeneously heated fluid. Obtaining more homogeneously heated fluid results in better overall performance of the heat exchanger.
  • the wall features allow laminar flow mixing of the cooling fluid. In other embodiments of the present invention, the wall features cause turbulent flow therethrough.
  • FIG. 4 illustrates an exemplary process for fabricating patterned fins by photochemical etching.
  • a metal sheet is cleaned to remove grease and other surface contaminants.
  • photoresist is applied to both sides of the cleaned metal sheet.
  • the metal sheet with photoresist is exposed and patterned such that the photoresist forms a series of tabbed fins with desired patterns.
  • the metal sheet patterned with photoresist is exposed to an etchant, thereby forming an etched metal sheet including the series of tabbed fins with desired patterns.
  • Each patterned fin is separated from an adjacent fin on the etched metal sheet by one or more etched tabs in the etched metal sheet.
  • the etched metal sheet is rinsed and dried.
  • individual patterned fins are detached from the etched metal sheet by breaking the tabs.
  • Figure 5 A illustrates a side view of a fin 550 prepared to be etched with wall features (not shown) according to some embodiments of the present invention.
  • the fin 550 is masked with masks 560. Once masked, the fin 550 is exposed to an etchant.
  • Figure 5B illustrates a side view close-up of the etching process. As the surface 551 of the fin 550 is exposed to an etchant, fin material is removed in multiple directions (as indicated by the directional arrows). Finally, figure 5C illustrates the fin 550 after being exposed to the etchant with the masks 560 removed.
  • FIGS. 6A-6C illustrate isometric views of fins
  • Figure 6A illustrates a isometric view of a fin 650 with a substantially
  • FIG. 6A illustrates a isometric view of a fin 660 with substantially triangularly-shaped grooves 661.
  • the grooves 661 shown in Figure 6B are disposed on both sides of fin 660.
  • Figure 6C illustrates a isometric view of a fin 670 with substantially rounded grooves 671. Furthermore, the grooves 671 shown in Figure 6C are disposed on both sides of fin 670.
  • Figures 7A-7F illustrate examples of the wall features on the fins according to some embodiments of the present invention.
  • the wall features in Figures 7A-7F are channels formed into the fins 751-760.
  • a wet-etching technique is used to create the wall features, although any other process can equally be used.
  • the wall features can be protrusions.
  • Figure 7A illustrates an example of a fin 751 having diagonal wall features according to some embodiments of the present invention.
  • Figure 7B illustrates an example of a fin 752 having angled wall features and straight wall features according to some embodiments of the present invention.
  • Figure 7C illustrates an example of a fin 754 having angled wall features and a channel-less center according to some embodiments of the present invention.
  • Figure 7D illustrates an example of a fin 756 having zig-zag wall features according to some
  • Figure 7E illustrates an example of a fin 758 having sinusoidal wall features according to some embodiments of the present invention.
  • Figure 7F illustrates an example of a fin 760 having Crosshatch wall features according to some embodiments of the present invention.
  • Figure 7G and 7H illustrate adjacent fins 770 and 780 having complementary wall features according to some embodiments of the present invention.
  • Figure 7G illustrates an isometric view of fin 770 and fin 780 laid down on its side to show detail.
  • fin 770 as diagonal wall features 771 that slope from the upper left side of the fin 770 to the bottom right side of the fin 770 (decreasing gradient diagonal configuration).
  • Fin 780 has diagonal wall features 781 that, when the fin 780 is stood upright, slope from the lower left side of the fin 780 to the upper right side of the fin 780 (increasing gradient diagonal configuration).
  • Figure 7H illustrates an isometric view of fins 770 and 780 orientated such that a channel 775 is formed between them.
  • the slope of the wall features 771 and 781 crisscross to encourage turbulent flow within the channel 775 as the channel 775 is flooded with a fluid (not shown).
  • fins with pin protrusions are utilized.
  • Figures 8 A and 8B illustrate an example of pin wall features according to some embodiments of the present invention.
  • the fins with pin protrusions have vent features. These vent features will be described more thoroughly in the discussion of Figures 1 OA- IOC below.
  • Figure 8 A illustrates an example of a fin 850 having pin protrusion wall features according to some embodiments of the present invention.
  • the fin 850 has a number of right face protrusions 860 and left face protrusions 865.
  • the right face protrusions and the left face protrusions are slightly staggered, so that when two fins 850 are pushed together they are self-aligning and stack much like the fins with built in separators as described above.
  • Figure 8B illustrates a heat exchanger 801 according to some embodiments of the present invention with fins 850.
  • a layer of brazing material 830 is laid on the bottom surface of the cannister 800.
  • the brazing material 830 is CuSil.
  • the brazing material 830 has a portion of copper, a portion of nickle, a portion of tin, and a portion of phosphorous, such as
  • the brazing material 830 is in the form of a paste, a foil, or a wire.
  • the fins 850 with wall features 860 and 865 are then stacked to create a series of structured pseudo-foam conduits 870.
  • a brazing material 880 is placed around the top of cannister 800 and a lid 890 is placed over the cannister 800.
  • the brazing material 880 is CuSil.
  • the brazing material 880 has a portion of copper, a portion of nickle, a portion of tin, and a portion of phosphorous, such as
  • the brazing material 880 is in the form of a paste, a foil, or a wire.
  • the heat exchanger 801 is heated in a furnace to braze the pieces together. As explained above, it is desirable to braze the heat exchanger only once in order to conserve time and money.
  • FIGs 7A-8B provide an efficient way to provide a large surface area for heat transfer in a mini-channel heat exchanger. Another method of providing a greater surface area is through the use of porous structures between or in the place of mini-channels.
  • Figure 9A illustrates a side view of a high aspect ratio, high surface area heat exchanger 900 using mini-channels 950 and a metal mesh 960 between the mini-channels 950.
  • Figure 9B illustrates a side view of a high surface area heat exchanger 902 using a stack of metal mesh layers 960.
  • Figure 9C illustrates a side view of a high surface area heat exchanger 904 using an open-cell metal foam insert 980.
  • the pore diameter of the open-cell metal foam insert 980 ranges from one micron to one millimeter.
  • the use of high surface area, high aspect ratio mini-channels in the heat exchanger causes a large pressure drop between the inlet conduit and the outlet conduit of the heat exchanger. This high pressure drop results in additional technical challenges for the other components within the system, including the pumps, other heat exchangers, and the heat rejector.
  • FIG. 10A-14 illustrate novel methods and apparatuses for reducing pressure drop in the heat exchangers described herein according to some embodiments of the present invention. In all of the following examples, a reduction in pressure drop is achieved through dividing the fluid by providing alternate paths of fluid flow.
  • Figures 1 OA- IOC illustrate a pin- vent fin wall structure for dividing fluid flow in a heat exchanger according to some embodiments of the present invention.
  • Figure 10A illustrates a side view of a single fin 1050 with pin protrusions 1060 along its surface.
  • the fin 1050 also has vents 1070 which completely pass through the surface of the fin 1050.
  • the pin protrusions 1060 and the vents 1070 are formed on the fin 1050 through a wet-etching process.
  • Figure 10B illustrates an end view of a stack of fins 1050 with pin protrusions 1060 and vents 1070 (indicated with dashed lines) passing therethrough.
  • the fins 1050 are self-aligning in a similar way to the fins illustrated above. Therefore, a heat exchanger (not shown) can be fabricated using fins 1050 without the requirement that the fins 1050 be bonded to the cannister (not shown) individually, thus saving cost by eliminating steps in the fabrication process.
  • the narrow passages created between the fins 1050 when they are stacked together can result in a pressure drop over the length of the fin 1050. Including the vents 1070 in the fins 1050 gives the fluid an alternate path to flow, thereby reducing the pressure drop across the system.
  • Figure IOC illustrates a isometric view of the stack of fins 1050 having pin
  • Fluid is pumped between the fins 1050 and the fins 1050 absorb heat from the heating source. Fluid is mixed by the pin protrusions 1060 to achieve a more homogeneously mixed fluid. Furthermore, fluid traverses between rows of fins 1050 through the vents 1070 to further mix fluid and to alleviate the pressure in the heat exchanger.
  • Figures 1 1 A and 1 IB illustrates another embodiment of the present invention used to alleviate pressure drop in a heat exchanger 1 100 by diverting fluid through holes in mini- channels.
  • Figure 11A illustrates a schematic isometric view of a plurality of fins 1150 and a fin 1152 used in heat exchangers according to some embodiments of the present invention.
  • the fins 1150 have apertures (indicated with dashed lines 1151) to divide the fluid flow and one fin 1152 does not include an aperture and is used to block the passage of fluid.
  • the fins 1150 are included in a heat exchanger (Figure 1 IB, element 1100) and form a series of channels 1153.
  • the fins 1150 are made of a material with a high thermal conductivity so that when fluid flows through the channels 1 153, effective heat exchange occurs.
  • Figure 1 IB illustrates a schematic isometric view of a heat exchanger 1100 utilizing the fins with conduits 1150 (indicated with dashed lines 1151) and the fin 1152. Each fin 1150 and fin 1152 extend substantially across the heat exchanger 1100 in the X-direction.
  • Fluid is pumped into a reservoir 1115 in the heat exchanger 1 100 through conduit 1105 where it encounters the first of a series of fins 1150 with an aperture (not labeled). A portion of the fluid is forced through the aperture and some portion of fluid is pushed along the face of the fin 1150 towards each wall of the heat exchanger 1100, effectively dividing the fluid flow path by some amount. As such the pressure drop is reduced because the fluid only needs to be pushed along half the length of the fins 1150. Furthermore, since the system pressure is used to push the fluid in two directions, the velocity of fluid traveling through the channels 1153 is reduced. Therefore, the fluid moves at a slower pace through a shorter fluid path causing a more effective heat exchange between the fluid and the channel walls.
  • the channels 1153 formed by the fins 1150 become at least partially flooded and effectuate heat exchange with the fluid.
  • Heated fluid is forced out of the channels 1153 and forced into a reservoir 1120, and out of a conduit 1110.
  • the fins 1150 can be stacked with wall features of the types shown in Figures 7A-7E.
  • One or more apertures are introduced between the wall features.
  • only one aperture exists on the fins 1150.
  • multiple apertures exist along the fin 1150.
  • the number of apertures on each fin vary.
  • each fin has the same number of apertures.
  • the apertures are circular, however, the shape of the apertures can be selected from any shape.
  • the apertures are lined up, each centered on the fin 1150.
  • the apertures are staggered on the fins 1150.
  • the conduits 1105 and 1110 are situated either on the sides of the heat exchanger 1100, on the bottom of the heat exchanger 1100, or in a combination of the top, bottom or sides.
  • FIG 12 illustrates a top view of an alternative configuration for reducing the path length that fluid travels in a mini-channel heat exchanger 1200, thereby reducing pressure drop.
  • the heat exchanger 1200 includes an intake conduit 1205 leading to reservoir 1215, an output conduit 1210 drawing from reservoir 1220, walls 1252, fins 1250, and a vertical spine 1251. Fluid is pumped into the heat exchanger 1200 via the input conduit 1205 into the reservoir 1215. The fluid is split by the spine 1251. The spine 1251 also effectuates heat transfer from the heat source (not shown) to the fluid. In some embodiments, the spine 1251 can be configured with wall features. The spine 1251 forces the fluid into mini-channels 1253 formed by the fins 1250. The walls of the mini-channels 1253 transfer heat from the heat source (not shown) to the fluid. The heated fluid is then forced out of the channels 1253, into the reservoir 1220 and out of the output conduit 1210.
  • FIG. 13 illustrates an alternative embodiment of a heat exchanger with a spine 1351 and four quadrants I, ⁇ , ⁇ , and IV of heat exchange. Fluid is pumped into reservoir 1315 via input conduit 1305.
  • the spine 1351 divides the fluid into the four quadrants I, II, ⁇ , and IV.
  • Each quadrant is separated with walls 1352 and contains mini-channels 1353 formed by fins 1350. Heat exchange occurs in the mini-channels 1353 and the heated fluid recombines in the reservoir 1320 and is pumped out of the output conduit 1310.
  • each quadrant I, II, ⁇ , and IV is positioned above a separate heat source (not shown).
  • each quadrant I, ⁇ , ⁇ and TV is positioned above a specific zone of a single heat source (not shown).
  • the heat exchanger 1300 is used to cool the multiple heat zones associated with multi-core integrated chips.
  • the heat exchangers illustrated in Figures 1 1-13 all divide the fluid path internally, within the heat exchanger itself.
  • a manifold layer is positioned on top of the thermal interface section of the heat exchanger and is used to divide the fluid into separate fluid paths.
  • Figure 14 illustrates a cut-out isometric view of a heat exchanger 1400 with a manifold layer 1470 and an interface layer 1460.
  • the interface layer 1460 includes thermally conductive mini-channels 1465.
  • the manifold layer 1470 sits on top of the interface layer 1460 and supplies the interface layer 1460 with fluid for fluid cooling.
  • fluid (not shown) is pumped into the manifold layer 1470 of the heat exchanger 1400 via inlet conduit 1405.
  • a wall 1415 is preferentially included to impede the fluid flow and cause fluid to pool in the manifold layer 1470.
  • the pooled fluid drains through a narrow slit 1420 and into the interface layer 1460.
  • Draining fluid contacts the interface layer 1460 and is forced out both sides of the mini-channels 1465. As such, the fluid only interfaces with one-half the length of a mini-channel 1465, effectively reducing pressure drop in the heat exchanger 1400.
  • a single slit 1420 is shown as the conduit between the manifold level 1470 and the interface level 1460, it will be readily apparent to those ordinarily skilled in the art that multiple slits or openings in multiple locations and configurations are equally conceived.
  • the heat exchanger of the present invention effectively transfers heat from a surface through a conductive cannister, through mini-channel walls and into a fluid flowing therethrough.
  • the present invention also discloses providing the fins used in the mini- channels with wall features to mix fluid and provide alternative fluid paths to reduce pressure drop.
  • the present invention also discloses alternative methods of reducing pressure drop including providing unique geometries to divert fluid flow and providing the heat exchanger with a manifold layer.
  • the present invention also discloses cost-effective methods of fabricating the heat exchanger, mini-channels, fins with wall features and manifolds.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

La présente invention porte sur des procédés et dispositifs qui réalisent une grande transmission de chaleur dans un système de refroidissement de fluide et qui le font avec une faible perte de charge à travers le système. La présente invention porte sur l'utilisation de formations de paroi sur des ailettes d'un échangeur de chaleur utilisé pour refroidir un fluide dans un système de refroidissement de fluide. La présente invention porte aussi sur des structures à grand rapport d'aspect, à grande surface spécifique pouvant être appliquées à des micro-échangeurs de chaleur pour systèmes de refroidissement de fluide, et sur des procédés économiques de fabrication de ces mini-canaux.
PCT/US2010/050990 2009-09-30 2010-09-30 Fabrication de mini-canaux à grand rapport d'aspect, à grande surface spécifique, et application de ces micro-canaux à des systèmes de refroidissement de liquide WO2011041600A1 (fr)

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US12/571,265 2009-09-30
US12/571,265 US20110073292A1 (en) 2009-09-30 2009-09-30 Fabrication of high surface area, high aspect ratio mini-channels and their application in liquid cooling systems

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