WO2011040463A1 - 2次元通信用低誘電シートおよびその製造方法、通信用シート構造体 - Google Patents
2次元通信用低誘電シートおよびその製造方法、通信用シート構造体 Download PDFInfo
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- WO2011040463A1 WO2011040463A1 PCT/JP2010/066944 JP2010066944W WO2011040463A1 WO 2011040463 A1 WO2011040463 A1 WO 2011040463A1 JP 2010066944 W JP2010066944 W JP 2010066944W WO 2011040463 A1 WO2011040463 A1 WO 2011040463A1
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- Prior art keywords
- low dielectric
- dielectric sheet
- sheet
- dimensional communication
- communication
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- 239000010457 zeolite Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Chemical class 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B11/00—Communication cables or conductors
- H01B11/18—Coaxial cables; Analogous cables having more than one inner conductor within a common outer conductor
- H01B11/1834—Construction of the insulation between the conductors
- H01B11/1839—Construction of the insulation between the conductors of cellular structure
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B13/00—Transmission systems characterised by the medium used for transmission, not provided for in groups H04B3/00 - H04B11/00
-
- H04B5/48—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249976—Voids specified as closed
Definitions
- the present invention relates to a low-dielectric sheet for two-dimensional communication constituting a communication medium used for two-dimensional communication, a manufacturing method thereof, and a communication sheet structure using the low-dielectric sheet for two-dimensional communication.
- one-dimensional communication by connecting an ISDN line or a LAN cable, or three-dimensional communication using radio waves or infrared rays such as a wireless LAN is used.
- communication technology it is possible to connect to the Internet from anywhere and exchange information in a home or office.
- a communication sheet structure used for such two-dimensional communication a communication sheet structure composed of an upper layer (conductive layer) / middle layer (dielectric layer) / lower layer (electromagnetic wave shielding layer) has been proposed (patent) Reference 1 to 3).
- the middle layer has a dielectric loss tangent of 800 MHz to 5 GHz of 0.01 or less. If the dielectric tangent is exceeded, electromagnetic energy cannot be contained in the sheet, energy loss occurs, and communication performance is greatly reduced. It is described that.
- an object of the present invention is to provide a low dielectric sheet for two-dimensional communication that can be used for a two-dimensional communication sheet structure, a method for manufacturing the same, and a low dielectric sheet for two-dimensional communication.
- An object of the present invention is to provide a sheet structure for two-dimensional communication using the above.
- the present invention provides a low dielectric sheet for two-dimensional communication, characterized in that the density is 0.01 to 0.2 g / cm 3 and the dielectric constant is 1.6 or less.
- the low dielectric sheet for two-dimensional communication of the present invention further has a dielectric loss tangent of 0.01 or less.
- the low dielectric sheet for two-dimensional communication of the present invention preferably contains bubbles, and it is particularly preferable that the average cell diameter of the bubbles is 1 to 300 ⁇ m.
- the low-dielectric sheet for two-dimensional communication of the present invention is preferably formed from a thermoplastic resin composition, and in particular, the thermoplastic resin composition preferably includes at least a polyolefin resin.
- the low dielectric sheet for two-dimensional communication of the present invention has a conductive layer on at least one side.
- the low dielectric sheet for two-dimensional communication of the present invention preferably has a surface resistivity of the conductive layer of 1 ⁇ or less per 1 cm 2 and a thickness of the conductive layer of 0.1 mm or less. is there.
- the low dielectric sheet for two-dimensional communication according to the present invention preferably has a bending rigidity of 100 N ⁇ mm 2 or less.
- the communication sheet structure of the present invention is characterized by using the two-dimensional communication low dielectric sheet.
- the method for producing a low dielectric sheet for two-dimensional communication comprises a resin composition having a density of 0.01 to 0.2 g / cm 3 and a dielectric constant of 1.6 or less by foam molding. It is characterized by forming a foam.
- the high-pressure gas is preferably carbon dioxide or nitrogen, and a supercritical fluid is preferably used as the high-pressure gas.
- the low dielectric sheet for two-dimensional communication according to the present invention has a dielectric constant lower than before, the communication performance is greatly improved by using this for a two-dimensional communication sheet structure. Further, according to the method for producing a two-dimensional communication sheet of the present invention, it is possible to provide a low-dielectric sheet for two-dimensional communication having a low dielectric constant with a simple method.
- FIG. 1 is a view showing an embodiment of a communication sheet structure according to the present invention, in which (a) is a schematic sectional view thereof and (b) is a schematic top view thereof.
- the low-dielectric sheet for two-dimensional communication is characterized by a density of 0.01 to 0.2 g / cm 3 and a dielectric constant of 1.6 or less.
- a foamed sheet containing bubbles is preferable.
- the low dielectric sheet for two-dimensional communication of the present invention can be obtained from a resin composition containing at least a resin and, if necessary, powder particles, additives and the like.
- the resin composition that is a raw material of the low-dielectric sheet for two-dimensional communication is not particularly limited, but preferably contains a thermoplastic resin from the viewpoint of moldability (ease of foam production) and recyclability.
- the thermoplastic resin include polyolefin resins, polyvinyl chloride resins, polyester resins, polystyrene resins, polyvinyl acetate resins, acrylic resins, ABS resins, polyamide resins, and the like. These thermoplastic resins can be used alone or in combination of two or more. Among these thermoplastic resins, polyolefin resins are preferably used in terms of relatively low dielectric constant and dielectric loss tangent.
- the polyolefin resin is not particularly limited.
- low-density polyethylene medium-density polyethylene, high-density polyethylene, linear low-density polyethylene, polypropylene, a copolymer of ethylene and propylene, ethylene or propylene and other ⁇ - Copolymers with olefins (eg, butene-1, pentene-1, hexene-1, 4-methylpentene-1, etc.), ethylene and other ethylenically unsaturated monomers (eg, vinyl acetate, acrylic acid, Acrylic acid ester, methacrylic acid, methacrylic acid ester, vinyl alcohol, etc.) and the like.
- olefins eg, butene-1, pentene-1, hexene-1, 4-methylpentene-1, etc.
- ethylene and other ethylenically unsaturated monomers eg, vinyl acetate, acrylic acid, Acrylic acid ester, methacrylic acid,
- polyolefin resin can be used individually or in combination of 2 or more types.
- polyolefin resin is a copolymer
- the copolymer of any form of a random copolymer and a block copolymer may be sufficient.
- the polyolefin-based resin it is preferable to use a resin having a broad molecular weight distribution and having a shoulder on the high molecular weight side, a slightly cross-linked resin (a slightly cross-linked resin), a long-chain branched resin, or the like.
- a rubber component and / or a thermoplastic elastomer component may be used in the resin composition together with the thermoplastic resin.
- a rubber component and / or a thermoplastic elastomer component flexibility is imparted in the surface direction, and even when the communication sheet structure is formed, even if it is bent or wound into a roll, wrinkles are less likely to occur.
- the ratio of the rubber component and / or the thermoplastic elastomer component is not particularly limited.
- the ratio of the rubber component and / or the thermoplastic elastomer component is less than 1% by weight in the mixture of the thermoplastic resin and the rubber component and / or the thermoplastic elastomer component, the resin composition is used as a foam sheet.
- it exceeds 99% by weight gas is easily released during foaming, and it becomes difficult to obtain a highly foamable foam.
- the rubber component or the thermoplastic elastomer component is not particularly limited as long as it has rubber elasticity and is preferably foamable.
- natural rubber polyisobutylene, polyisoprene, chloroprene rubber, butyl rubber, nitrile butyl rubber, etc.
- Natural or synthetic rubbers Natural or synthetic rubbers; ethylene-propylene copolymers, ethylene-propylene-diene copolymers, ethylene-vinyl acetate copolymers, polybutenes, olefinic elastomers such as chlorinated polyethylene; styrene-butadiene-styrene copolymers, Styrene elastomers such as styrene-isoprene-styrene copolymers and hydrogenated products thereof; polyester elastomers; polyamide elastomers; various thermoplastic elastomers such as polyurethane elastomers. These rubber components or thermoplastic elastomer components can be used alone or in combination of two or more.
- these rubber components and thermoplastic elastomer components have a glass transition temperature of room temperature or lower (for example, 20 ° C. or lower), for example, a polyolefin resin foam having a rubber component or a thermoplastic elastomer component as a low dielectric sheet for two-dimensional communication
- room temperature or lower for example, 20 ° C. or lower
- an olefin-based elastomer can be suitably used as the rubber component and / or the thermoplastic elastomer component.
- the olefin elastomer usually has a structure in which the olefin resin component and the ethylene-propylene rubber are microphase-separated, and the compatibility with the polyolefin resin is good.
- the resin composition used for forming the low-dielectric sheet for two-dimensional communication is a foam
- powder particles are further included. That is, it is preferable that the resin composition used for foam molding includes a thermoplastic resin and powder particles.
- the powder particles can function as a foam nucleating agent during foam molding. Therefore, the resin foam of a favorable foaming state can be obtained by mix
- powder particles examples include clays such as talc, silica, alumina, zeolite, calcium carbonate, magnesium carbonate, barium sulfate, zinc oxide, titanium oxide, aluminum hydroxide, magnesium hydroxide, mica, montmorillonite, and carbon particles. Glass fiber, carbon tube, etc. can be used.
- the powder particles can be used alone or in combination of two or more.
- the blending amount of the powder particles is not particularly limited, but for example, 5 to 150 parts by weight, preferably 10 to 130 parts by weight, more preferably 20 to 120 parts by weight with respect to 100 parts by weight of the resin component (polymer component) in the resin composition. It can select suitably from the range of 120 weight part.
- the blending amount of the powder particles is less than 5 parts by weight with respect to 100 parts by weight of the resin component (polymer component), it becomes difficult to obtain a uniform foam, whereas when it exceeds 150 parts by weight, the resin composition As a result, there is a possibility that gas will be lost during foaming and the foaming characteristics may be impaired.
- the average particle diameter of the powder particles is not particularly limited, but is, for example, about 0.1 to 10 ⁇ m, preferably about 0.5 to 5 ⁇ m. If the average particle size of the powder particles is less than 0.1 ⁇ m, it may not function sufficiently as a nucleating agent, and if the average particle size exceeds 10 ⁇ m, it may cause outgassing during foam molding.
- the resin composition has a characteristic that it is easy to burn (of course, it is also a defect). Therefore, when it is required to impart flame retardancy to the low-dielectric sheet for two-dimensional communication in which the resin composition is used, powder particles having flame retardancy (for example, various powdery powders) are used as the powder particles. It is preferable to add a flame retardant. In addition, a flame retardant can be used with powder particles other than a flame retardant.
- an inorganic flame retardant is suitable.
- the inorganic flame retardant for example, a brominated flame retardant, a chlorinated flame retardant, a phosphorus flame retardant, an antimony flame retardant, etc. may be used.
- Non-halogen-non-antimony inorganics because they generate harmful gas components that are corrosive to equipment, and phosphorous flame retardants and antimony flame retardants are harmful and explosive.
- a flame retardant can be suitably used.
- the non-halogen-nonantimony inorganic flame retardant include hydrated metal compounds such as aluminum hydroxide, magnesium hydroxide, magnesium oxide / nickel oxide hydrate, magnesium oxide / zinc oxide hydrate, and the like. .
- the hydrated metal oxide may be surface treated.
- a flame retardant can be used individually or in combination of 2 or more types.
- the amount of the flame retardant used is not particularly limited, and can be appropriately selected from the range of 8 to 70% by weight, preferably 25 to 65% by weight, based on the total amount of the resin composition. If the amount of the flame retardant used is too small, the flame retardant effect is reduced. Conversely, if the amount is too large, it is difficult to obtain a highly foamed foam.
- the resin composition in the present invention may further contain an aliphatic compound.
- Aliphatic compounds have high crystallinity, and especially when added to polyolefin resins, they form a strong film on the resin surface, so that the resin wall surfaces forming the cells may prevent each other from blocking each other. Bubbles are less likely to collapse, and shape recovery is improved.
- the aliphatic compound at least one selected from fatty acids, fatty acid amides, and fatty acid metal soaps can be used. Those containing a highly polar functional group are not easily compatible with the polyolefin-based resin, and thus are easily deposited on the surface of the resin, so that the above effects are easily exhibited.
- the melting point of the aliphatic compound is 50 to 150 ° C., preferably 70 to 100 ° C. from the viewpoints of lowering the molding temperature, suppressing deterioration of the polyolefin resin composition, and imparting sublimation resistance. is there.
- the fatty acid preferably has about 18 to 38 carbon atoms (more preferably 18 to 22), and specific examples include stearic acid, behenic acid, 12-hydroxystearic acid and the like. Among these, behenic acid is particularly preferable.
- the fatty acid amide is preferably a fatty acid amide having a fatty acid moiety having about 18 to 38 carbon atoms (more preferably 18 to 22), and may be either monoamide or bisamide. Specific examples include stearic acid amide, oleic acid amide, erucic acid amide, methylene bis stearic acid amide, and ethylene bis stearic acid amide. Of these, erucic acid amide is particularly preferable.
- the fatty acid metal soap include aluminum, calcium, magnesium, lithium, barium, zinc and lead salts of the above fatty acids. As the aliphatic compound, fatty acid and fatty acid amide are particularly preferable.
- the content of the aliphatic compound is, for example, 1 to 20 parts by weight, preferably 5 to 15 parts by weight, more preferably 8 to 13 parts per 100 parts by weight of the resin component (polymer component) in the resin composition. Parts by weight.
- the content of the aliphatic compound is less than 1 part by weight, a sufficient amount of components do not precipitate on the resin surface, and it becomes difficult to obtain the effect of shape recovery.
- the amount exceeds 20 parts by weight the resin is plasticized and a sufficient pressure cannot be maintained in the extruder, and the content of the foaming agent such as carbon dioxide in the resin is reduced, so that a high expansion ratio is obtained. This makes it difficult to obtain a foam having a sufficient foam density.
- the resin composition used for the low-dielectric sheet for two-dimensional communication of the present invention may contain various additives as necessary.
- the kind of additive is not specifically limited,
- the various additives normally used for foam molding can be used.
- the addition amount of the additive can be appropriately selected within a range that does not impair the formation of bubbles and the like, and the addition amount used at the time of molding a normal thermoplastic resin can be adopted.
- the low dielectric sheet for two-dimensional communication of the present invention can be obtained by foam-molding the resin composition using the resin composition as a raw material to form a resin foam.
- a foamed sheet containing bubbles is suitable.
- the foam is preferably a foam sheet having a high expansion ratio (low density) containing a large amount of fine bubbles.
- a sheet made of a resin composition has a dielectric constant and a dielectric loss tangent derived from the material contained in the sheet, but by containing bubbles in this, the dielectric constant (1.00) and dielectric loss tangent (0.00) of air are increased. You can get closer. In order to increase the contribution of bubbles, the content may be increased, that is, the foaming ratio may be increased (density is decreased). On the other hand, simply reducing the density will lower the mechanical properties such as strength and flexibility of the sheet, so in order to maintain this, the foam has a small average cell diameter and contains many fine bubbles. The body is desirable. It is not easy to produce a low-density foam containing a large amount of such fine bubbles, and it is not known to use such a foam sheet as a low dielectric sheet for two-dimensional communication.
- the density of the low dielectric sheet for two-dimensional communication of the present invention is preferably 0.01 to 0.2 g / cm 3 , more preferably 0.015 to 0.15 g / cm 3 , and Particularly preferred is 02 to 0.1 g / cm 3 .
- the density of the foam exceeds 0.2 g / cm 3 , it may be difficult to obtain a low dielectric loss tangent or dielectric constant.
- the density is less than 0.01 g / cm 3 , the strength as a low dielectric sheet for two-dimensional communication is remarkably high. May decrease.
- the average cell diameter of the bubbles is preferably 1 to 300 ⁇ m, and preferably 2 to 200 ⁇ m. More preferred is 5 to 100 ⁇ m. If the average cell diameter exceeds 300 ⁇ m, shape retention (foam strength) may decrease. If the average cell diameter is less than 1 ⁇ m, sufficient porosity cannot be obtained, and it may be difficult to obtain a low dielectric loss tangent or dielectric constant. is there.
- the average cell diameter can be obtained by analyzing an enlarged image of the foam using image analysis software.
- the method for producing such a resin foam is not particularly limited, but as a foaming method, a resin composition is foamed using a high-pressure gas [after the high-pressure gas as a foaming agent is impregnated, the pressure is reduced (the pressure is reduced). It is preferred to use the (releasing) foaming method].
- a foaming method based on physical methods
- the residue of the foaming gas remains in the foam.
- the foaming method using a high-pressure gas can provide a clean foam free from such impurities. Furthermore, it is difficult to form a fine bubble structure in both the physical foaming method and the chemical foaming method, and in particular, it is said that it is extremely difficult to form a fine bubble of 100 ⁇ m or less.
- the high-pressure gas is not particularly limited as long as it is inert and can be impregnated into the resin composition.
- air inert gas [for example, carbon dioxide (carbon dioxide), nitrogen, helium, etc.], etc. Is mentioned.
- inert gas for example, carbon dioxide (carbon dioxide), nitrogen, helium, etc.
- these gases may be mixed and used.
- the inert gas can be preferably used from the viewpoint of the large amount of impregnation and the high impregnation rate, and carbon dioxide and nitrogen can be particularly preferably used among the inert gases.
- the high-pressure gas (particularly carbon dioxide) is preferably a fluid in a supercritical state.
- the solubility of the gas in the resin composition increases and high concentration can be mixed.
- the pressure drops suddenly after impregnation since it is possible to impregnate at a high concentration as described above, the generation of bubble nuclei increases, and the density of bubbles formed by the growth of the bubble nuclei has a porosity. Even if they are the same, they become larger, so that fine bubbles can be obtained.
- Carbon dioxide has a critical temperature of 31 ° C. and a critical pressure of 7.4 MPa.
- a resin foam After pre-molding the resin composition into an appropriate shape such as a sheet to obtain an unfoamed resin molded body (unfoamed molded product), It may be carried out in a batch system in which high pressure gas is impregnated and foamed by releasing pressure, and the resin composition is kneaded with high pressure gas under pressure, and simultaneously molded and released, and simultaneously molded and foamed. You may carry out by a continuous system. In this way, the pre-molded unfoamed resin molded body may be impregnated with an inert gas, or the molten resin composition is impregnated with an inert gas under pressure, and then molded during decompression. You may attach to.
- a resin composition containing a polyolefin resin is used as a single screw extruder, a twin screw extruder, or the like.
- the resin composition is uniformly kneaded using a kneader equipped with blades such as rollers, cams, kneaders, banbari molds, etc. Examples thereof include a method of press molding to a predetermined thickness using a method, a method of molding using an injection molding machine, and the like. What is necessary is just to shape
- the unfoamed resin foam thus obtained is placed in a pressure-resistant container (high-pressure container), high-pressure gas (for example, carbon dioxide) is injected (introduced), and the unfoamed resin molded body is impregnated with high-pressure gas.
- high-pressure gas for example, carbon dioxide
- Gas impregnation step release pressure when fully impregnated with high-pressure gas (usually up to atmospheric pressure), decompression step to generate bubble nuclei in polyolefin resin, in some cases (if necessary)
- a heating step of growing bubble nuclei by heating bubbles are formed in the polyolefin-based resin. Note that bubble nuclei may be grown at room temperature without providing a heating step.
- the high-pressure gas may be introduced continuously or discontinuously.
- a heating method for growing bubble nuclei a known or conventional method such as a water bath, an oil bath, a hot roll, a hot air oven, a far infrared ray, a near infrared ray, or a microwave can be employed.
- the unfoamed resin molded product is not limited to a sheet shape, and various shapes can be used depending on the application. Further, the unfoamed resin molded body can be produced by other molding methods besides extrusion molding, press molding, and injection molding.
- a resin composition containing a polyolefin resin is kneaded using an extruder such as a single screw extruder or a twin screw extruder, The pressure is released by injecting (introducing) carbon dioxide (such as carbon dioxide) and extruding the resin composition through a kneading impregnation step that sufficiently impregnates the polyolefin resin with a high-pressure gas, a die provided at the tip of the extruder, etc.
- carbon dioxide such as carbon dioxide
- a kneading impregnation step that sufficiently impregnates the polyolefin resin with a high-pressure gas, a die provided at the tip of the extruder, etc.
- a molding decompression step in which molding and foaming are performed simultaneously.
- a heating step of growing bubbles by heating may be provided.
- a polyolefin-type resin foam can be obtained by fixing a shape.
- the kneading impregnation step and the molding pressure reduction step can be performed using an injection molding machine or the like in addition to the extruder.
- the method of obtaining the polyolefin-type resin foam of sheet shape, prismatic shape, and other arbitrary shapes is just to select suitably the method of obtaining the polyolefin-type resin foam of sheet shape, prismatic shape, and other arbitrary shapes.
- the amount of high-pressure gas mixed is not particularly limited, but is, for example, about 2 to 10% by weight with respect to the total amount of the resin composition. What is necessary is just to mix suitably adjusting so that a desired density and expansion ratio may be obtained.
- the pressure when impregnating a non-foamed resin molded product or resin composition with a gas impregnation step in a batch method or a kneading impregnation step in a continuous method can be appropriately selected in consideration of the type of gas and operability.
- the pressure should be 3 MPa or more (for example, about 3 to 100 MPa), preferably 4 MPa or more (for example, about 4 to 100 MPa).
- the gas pressure is lower than 3 MPa, the bubble growth during foaming is remarkable, the bubble diameter becomes too large, and disadvantages such as a decrease in dielectric constant and dielectric loss tangent are likely to occur, which is not preferable.
- the temperature when impregnating the unfoamed resin molded product or the resin composition with the high-pressure gas in the gas impregnation step in the batch method or the kneading impregnation step in the continuous method varies depending on the type of the high-pressure gas or thermoplastic resin used, although it can be selected within a wide range, it is, for example, about 10 to 350 ° C. in consideration of operability and the like.
- the impregnation temperature when impregnating a sheet-like unfoamed resin molded article with a high-pressure gas is about 10 to 200 ° C. (preferably 40 to 200 ° C.).
- the temperature at which the high-pressure gas is injected into the resin composition and kneaded is generally about 60 to 350 ° C.
- the temperature during impregnation is preferably 32 ° C. or higher (particularly 40 ° C. or higher) in order to maintain a supercritical state.
- the decompression speed is not particularly limited, but is preferably about 5 to 300 MPa / s in order to obtain uniform fine bubbles.
- the heating temperature in the heating step is, for example, about 40 to 250 ° C. (preferably 60 to 250 ° C.).
- the foaming ratio of the resin foam thus obtained is not particularly limited, but is 5 times or more (for example, 5 to 50) from the viewpoint of obtaining a low dielectric sheet for two-dimensional communication having a low dielectric loss tangent and dielectric constant. It is preferably 15 times or more (for example, 15 to 40 times). If the expansion ratio is less than 5 times, it may be difficult to obtain a low dielectric loss tangent or dielectric constant, and if the expansion ratio exceeds 50 times, the strength of the foam may be significantly reduced.
- the expansion ratio of the polyolefin resin foam is calculated from the following formula.
- Foaming ratio (times) density in an unfoamed state (unfoamed resin molding) (g / cm 3 ) / density of foam (g / cm 3 )
- the density in the unfoamed state can be determined in the same manner as the density of the foam described above.
- the thickness of the resin foam is not particularly limited and is appropriately selected depending on the shape, form, etc. of the communication sheet structure, and is, for example, 0.5 to 5 mm, preferably 0.5 to 2 mm. .
- the foam of a resin composition as a low-dielectric sheet
- the gap of the die attached to the tip of the extruder is as narrow as possible (usually 0.1 to 1 mm)
- the resin composition extruded through a narrow gap must be foamed at a high magnification.
- the thickness of the foam has been limited to a thin one (for example, about 0.5 to 2 mm).
- a resin foam produced using a high-pressure gas can continuously obtain a foam having a final thickness of 0.5 to 5 mm.
- the cell structure is a closed cell structure, a semi-continuous semi-closed cell structure (a cell structure in which a closed cell structure and an open cell structure are mixed, and the ratio is not particularly limited.
- the closed cell structure part in the cell structure is preferably 40% or less, and the closed cell structure part is particularly preferably 30% or less.
- the thickness, density, expansion ratio, average cell diameter, etc. of the resin foam depend on the type of high-pressure gas, resin, etc. used, for example, operating conditions such as temperature, pressure, time in the gas impregnation step and kneading impregnation step, It can be adjusted by appropriately selecting and setting operating conditions such as a decompression speed, temperature, pressure, etc. in a decompression process or a molding decompression process, a heating temperature in a heating process after decompression or after molding decompression.
- the low dielectric sheet for two-dimensional communication of the present invention that can be obtained in this way is characterized by having a dielectric constant of 1.6 or less, preferably 1.4 or less, and 1.3 or less. More preferably, it is particularly preferably 1.2 or less (usually 1.0 or more).
- the dielectric constant can be a value measured by a cavity resonator perturbation method.
- the low dielectric sheet for two-dimensional communication of the present invention preferably has a dielectric loss tangent at a frequency of 1 GHz of 0.01 or less, more preferably 0.005 or less, and particularly preferably 0.002 or less. , 0.001 or less is very preferable (usually 0.000 or more).
- the dielectric loss tangent can be a value measured by a cavity resonator perturbation method.
- the shape of the low-dielectric sheet for two-dimensional communication of the present invention is not particularly limited, and an arbitrary shape can be selected, and examples thereof include a film shape, a sheet shape, a plate shape, and a prism shape. Further, the shape may include a bent shape such as a wound body shape, a bent shape, or a curved shape.
- the structure of the low dielectric sheet for two-dimensional communication is not particularly limited, and may be a single layer structure or a laminated structure.
- the low dielectric sheet for two-dimensional communication is preferably composed of a foam layer made of the resin foam. That is, the low-dielectric sheet for two-dimensional communication may be a single layer composed only of a foam layer made of the resin foam.
- a low dielectric sheet for two-dimensional communication having a single layer structure can be obtained by using the resin foam as a foam layer as it is, or by cutting the resin foam into a desired shape and thickness as required. it can.
- the low dielectric sheet for two-dimensional communication when the structure of the low dielectric sheet for two-dimensional communication is a laminated structure, the low dielectric sheet for two-dimensional communication may be configured by, for example, a laminated structure of a non-foamed layer made of the resin composition, It may be constituted by a laminated structure of a foam layer made of the resin foam, or may be constituted by a laminated structure of a non-foamed layer made of the resin composition and a foamed layer made of the resin foam, It is preferable that it is the structure containing the foaming layer which consists of the said resin foam.
- the total number of layers, the number of foamed layers made of resin foam, the number of non-foamed layers, the thickness of each layer, etc. are appropriately selected according to the application.
- the non-foamed layer is not particularly limited as long as it does not have a foam structure (cell structure) in the layer.
- the resin composition is formed into an appropriate shape (for example, a sheet shape, a film shape, etc.).
- the layer which consists of an unfoamed resin molding produced by (1) is mentioned.
- a non-foamed layer can be used individually or in combination of 2 or more types.
- the low dielectric sheet for two-dimensional communication of the present invention can be provided with an adhesive layer on one or both surfaces.
- the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer is not particularly limited.
- a urethane-based pressure-sensitive adhesive an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, a polyester-based pressure-sensitive adhesive, a polyamide-based pressure-sensitive adhesive,
- Known pressure-sensitive adhesives such as epoxy pressure-sensitive adhesives, vinyl alkyl ether pressure-sensitive adhesives, and fluorine-based pressure-sensitive adhesives can be used.
- acrylic adhesives and rubber adhesives are particularly preferable. These pressure-sensitive adhesives can be used alone or in combination of two or more.
- an adhesive is not specifically limited, For example, an emulsion type adhesive, a solvent-type adhesive, a hot-melt-type adhesive (hot melt type adhesive) etc. are mentioned.
- the pressure-sensitive adhesive layer may be either a single layer or a multilayer.
- the low dielectric sheet for two-dimensional communication of the present invention can be provided with a conductive layer in advance.
- the conductive layer can function as a component when constituting the communication sheet structure described later, and can be directly formed by plating copper, nickel or the like on at least one surface of the two-dimensional communication low dielectric sheet. it can. Alternatively, it may be formed by sticking a film-like one having copper, silver, aluminum, or the like deposited on the film surface, a metal foil such as copper foil or aluminum foil, etc., as a conductive layer to a low-dielectric sheet for two-dimensional communication. it can.
- the surface resistivity of the conductive layer is preferably 1 ⁇ or less per 1 cm 2 , more preferably 0.5 ⁇ or less, and particularly preferably 0.1 ⁇ or less.
- the thickness of the conductive layer is usually 0.1 mm or less, preferably 0.001 mm to 0.1 mm, more preferably 0.001 mm to 0.05 mm.
- the thickness of the low-dielectric sheet for two-dimensional communication is not particularly limited, and is appropriately selected according to the use, shape, form, etc. of the low-dielectric sheet for two-dimensional communication, and is, for example, 0.5 to 5 mm.
- the thickness is preferably 0.5 to 2 mm.
- Low dielectric sheet 2 dimensional communication of the invention preferably has a flexural rigidity is 100 N ⁇ mm 2 or less, more preferably 1 ⁇ 100 N ⁇ mm 2, in particular to be 1 ⁇ 50 N ⁇ mm 2 It is preferably 1 to 30 N ⁇ mm 2 .
- the bending rigidity is 100 N ⁇ mm 2 or less, the film is excellent in flexibility and can be molded in a roll shape.
- the communication sheet structure of the present invention includes the two-dimensional communication low dielectric sheet of the present invention as a part thereof, or is the two-dimensional communication low dielectric sheet itself.
- FIG. Fig.1 (a) is a schematic sectional drawing of the communication sheet structure 1 of this invention
- FIG.1 (b) is the top view.
- the insulating layer 5 is not shown.
- the low-dielectric sheet for two-dimensional communication of the present invention is provided as the dielectric material 2 on the conductive layer 4, and the conductive mesh 3 is provided thereon. Further, the insulating layer 5 is provided thereon.
- the conductive layer 4 is not particularly limited as long as it has electromagnetic wave shielding properties, but preferably has a surface resistivity of 1 ⁇ or less per 1 cm 2 . More preferably, it is 0.5 ⁇ or less. Most preferably, it is 0.1 ⁇ or less. As described above, the conductive layer 4 may be formed in advance on a low-dielectric sheet for two-dimensional communication, or a film-like one obtained by vapor-depositing copper, silver, aluminum or the like on a film surface, copper foil or aluminum foil. A metal foil or the like such as can be prepared and laminated. The thickness of the conductive layer 4 is usually 0.1 mm or less, preferably 0.001 mm to 0.1 mm, more preferably 0.001 mm to 0.05 mm.
- the conductive mesh 3 is formed in a lattice shape with a conductive material on the dielectric material 2 as shown in FIG.
- the conductive mesh 3 is shown as a grid, but it is sufficient that the conductive mesh 3 has a hole or mesh shape, such as a triangle, a quadrangle (for example, a square, a rectangle, a rhombus, a trapezoid, etc.) It may be circular (for example, a perfect circle, a circle close to a perfect circle, an elliptical shape, etc.).
- 1B shows a shape in which the conductive mesh 3 is buried in the dielectric material 2, it may be provided on the dielectric material 2.
- the conductive mesh 3 may be made of a conductive material, and may include a material including a metal such as copper, silver, aluminum, or nickel, or a material including carbon black.
- the insulating layer 5 is not particularly limited as long as it is an insulating film, and a conventionally known film such as a polyester film, a polyolefin film, a vinyl chloride film, or a polyurethane film can be used.
- These layers may be bonded by a conventionally known method, for example, a method of bonding with a hot melt resin, a method of bonding by providing a pressure-sensitive adhesive layer, and the like.
- the communication sheet structure of the present invention is a two-dimensional communication low dielectric sheet characterized in that the dielectric layer has a density of 0.01 to 0.2 g / cm 3 and a dielectric constant of 1.6 or less. Therefore, there is little energy loss, and communication performance can be greatly improved.
- Example 1 Polypropylene [200 ° C. melt flow rate (MFR): 0.35 g / 10 min] was kneaded at a temperature of 200 ° C. with a twin-screw kneader manufactured by Japan Steel Works (JSW), and then into a strand shape. Extruded, water-cooled, cut into pellets and molded.
- MFR melt flow rate
- the pellets were put into a single screw extruder manufactured by Nippon Steel Works, and carbon dioxide gas was injected in a 220 ° C. atmosphere at a pressure of 13 (12 after injection) MPa / cm 3 . Carbon dioxide gas was injected at a ratio of 9.5% by weight with respect to the total amount of the polymer. After sufficiently saturating the carbon dioxide gas, it was cooled to a temperature suitable for foaming of 170 ° C. and then extruded from a die to obtain a resin foam. This resin foam was sliced to obtain a low dielectric sheet for two-dimensional communication having a thickness of 1.0 mm.
- Example 2 Polypropylene [200 ° C. melt flow rate (MFR): 0.35 g / 10 min] 45 parts by weight, polyolefin elastomer [200 ° C. melt flow rate (MFR): 0.35 g / 10 min, JIS A hardness: 79 degrees] 45 2 parts by weight, 10 parts by weight of magnesium hydroxide, 10 parts by weight of carbon (trade name “Asahi # 35” manufactured by Asahi Carbon Co., Ltd.) and 10 parts by weight of stearic acid monoglyceride are biaxially kneaded by Japan Steel Works (JSW) After kneading at a temperature of 200 ° C. in a machine, it was extruded into a strand shape, cooled with water, cut into a pellet shape, and molded.
- JSW Japan Steel Works
- the pellets were put into a single screw extruder manufactured by Nippon Steel Works, and carbon dioxide gas was injected in a 220 ° C. atmosphere at a pressure of 13 (12 after injection) MPa / cm 3 . Carbon dioxide gas was injected at a ratio of 5.6% by weight with respect to the total amount of the resin composition. After sufficiently saturating the carbon dioxide gas, it was cooled to a temperature suitable for foaming of 170 ° C. and then extruded from a die to obtain a resin foam. This resin foam was sliced to obtain a low dielectric sheet for two-dimensional communication having a thickness of 1.0 mm.
- Example 3 Polypropylene [200 ° C. melt flow rate (MFR): 0.35 g / 10 min] 45 parts by weight, polyolefin elastomer [200 ° C. melt flow rate (MFR): 0.35 g / 10 min, JIS A hardness: 79 degrees] 45 2 parts by weight, magnesium hydroxide 120 parts by weight, carbon (trade name “Asahi # 35” manufactured by Asahi Carbon Co., Ltd.) 10 parts by weight, and stearic acid monoglyceride 10 parts by weight are manufactured by Nippon Steel Works (JSW) After kneading at a temperature of 200 ° C. in a machine, it was extruded into a strand shape, cooled with water, cut into a pellet shape, and molded.
- JSW Nippon Steel Works
- the pellets were put into a single screw extruder manufactured by Nippon Steel Works, and carbon dioxide gas was injected in a 220 ° C. atmosphere at a pressure of 13 (12 after injection) MPa / cm 3 . Carbon dioxide gas was injected at a rate of 6.3 wt% with respect to the total amount of the resin composition. After sufficiently saturating the carbon dioxide gas, it was cooled to a temperature suitable for foaming of 170 ° C. and then extruded from a die to obtain a resin foam. This resin foam was sliced to obtain a low dielectric sheet for two-dimensional communication having a thickness of 1.0 mm.
- Example 4 A two-dimensional communication low dielectric sheet having a thickness of 0.003 mm is formed on one side of the two-dimensional communication low dielectric sheet prepared in Example 2 by an electrolytic plating process, and a conductive layer is provided on one side. It was.
- Example 5 A two-dimensional communication low dielectric sheet prepared in Example 2 is laminated on one side with an acrylic pressure-sensitive adhesive (thickness: 30 ⁇ m), and a 30 ⁇ m thick aluminum vapor-deposited film is laminated on one side for two-dimensional communication use. A low dielectric sheet was obtained.
- the low-dielectric sheet for two-dimensional communication obtained in the examples and comparative examples was cut into a width of 2 mm and a length of 70 mm to obtain a sample for evaluation, and a cavity resonator perturbation method (Agilent Technology Vector Network Analyzer 8722A, Kanto Electronics Application Development) The value of the dielectric loss tangent at 1 GHz was observed by a cavity made from a cavity).
- the low-dielectric sheet for two-dimensional communication obtained in the examples and comparative examples was cut into a width of 2 mm and a length of 70 mm to obtain a sample for evaluation, and a cavity resonator perturbation method (Agilent Technology Vector Network Analyzer 8722A, Kanto Electronics Application Development) The value of the dielectric constant at 1 GHz was observed by a cavity made of a cavity).
- the surface resistivity was measured according to the double ring electrode method described in JIS K 6271.
- the device name “Digital Multimeter VOAC 7520” manufactured by Iwadori Measurement Co., Ltd. was used for measuring the resistance value.
- the bending elastic modulus E is a test piece according to JIS K7203 (1982). Length 100 mm ⁇ width 25 mm ⁇ thickness: thickness of plate-like foam (in the case where the plate-like foam is a laminated plate-like foam) The thickness of the plate-like foam including the laminated resin layer) was cut out from the plate-like foam and used for measurement. Next, the flexural modulus E and the dimensions were substituted into the following formula to calculate the flexural rigidity EI [N ⁇ mm 2 ]. Where E: flexural modulus [mPa], b: sample length [mm], and h: sample thickness [mm].
- the low dielectric sheet for two-dimensional communication obtained in the examples and comparative examples was wound around a roll having a diameter of 100 mm and a length of 300 mm, and the presence or absence of wrinkles was observed.
- the low dielectric sheet for two-dimensional communication of the example was excellent in dielectric constant and dielectric loss tangent. Further, according to the method for producing a low dielectric sheet for two-dimensional communication of the example, it was confirmed that a low dielectric sheet for two-dimensional communication having an excellent dielectric constant and dielectric loss tangent can be easily produced. In addition, it was confirmed that the low dielectric sheet for two-dimensional communication of the example has low bending rigidity and can be formed into a roll shape.
Abstract
Description
本発明の2次元通信用低誘電シートは、樹脂を少なくとも含有し、必要に応じてパウダー粒子や添加剤などを含有する樹脂組成物より得ることができる。2次元通信用低誘電シートの原料である樹脂組成物は特に限定されないが、成形性(発泡体の作りやすさ)、リサイクル性から熱可塑性樹脂を含むことが好ましい。熱可塑性樹脂としては、ポリオレフィン系樹脂、ポリ塩化ビニル系樹脂、ポリエステル系樹脂、ポリスチレン系樹脂、ポリ酢酸ビニル系樹脂、アクリル系樹脂、ABS系樹脂、ポリアミド系樹脂などが挙げられる。これらの熱可塑性樹脂は、単独で又は2種以上を組み合わせて用いることができる。これらの熱可塑性樹脂の中でも、誘電率及び誘電正接が比較的低い点でポリオレフィン系樹脂が好適に用いられる。
本発明の2次元通信用低誘電シートは、前記樹脂組成物を原料として、前記樹脂組成物を発泡成形し、樹脂発泡体を形成することで得ることができる。
密度(g/cm3)=試験片の質量/試験片の体積
発泡倍率(倍)=未発泡状態での密度(未発泡樹脂成形体)の密度(g/cm3)/発泡体の密度(g/cm3)
未発泡状態での密度は、前記した発泡体の密度と同様にして求めることができる。
このようにして得ることが出来る本発明の2次元通信用低誘電シートは、その誘電率が1.6以下であることを特徴とし、1.4以下であることが好ましく、1.3以下であることが更に好ましく、1.2以下であることが特に好ましい(通常、1.0以上)。誘電率を1.6以下とすることで誘電層でのエネルギー損失(誘電損失)が抑えられ、発熱やノイズを防ぎ、消費電力を抑えるという効果を奏する。なお本発明において誘電率は、空洞共振器摂動法により測定した値を用いることが出来る。
本発明の通信用シート構造体は、本発明の2次元通信用低誘電シートをその一部分として含んでいるか、もしくは2次元通信用低誘電シートそのものである。
ポリプロピレン[200℃のメルトフローレート(MFR):0.35g/10min] を、日本製鋼所(JSW)社製の二軸混錬機にて、200℃の温度で混錬した後、ストランド状に押出し、水冷後ペレット状に切断して成形した。
ポリプロピレン[200℃のメルトフローレート(MFR):0.35g/10min] 45重量部、ポリオレフィン系エラストマー[200℃のメルトフローレート(MFR):0.35g/10min、JIS A硬度:79度]45重量部、水酸化マグネシウム10重量部、カーボン(商品名「旭#35」旭カーボン社製)10重量部、及びステアリン酸モノグリセリド10重量部を、日本製鋼所(JSW)社製の二軸混錬機にて、200℃の温度で混錬した後、ストランド状に押出し、水冷後ペレット状に切断して成形した。
ポリプロピレン[200℃のメルトフローレート(MFR):0.35g/10min] 45重量部、ポリオレフィン系エラストマー[200℃のメルトフローレート(MFR):0.35g/10min、JIS A硬度:79度]45重量部、水酸化マグネシウム120重量部、カーボン(商品名「旭#35」旭カーボン社製)10重量部、及びステアリン酸モノグリセリド10重量部を、日本製鋼所(JSW)社製の二軸混錬機にて、200℃の温度で混錬した後、ストランド状に押出し、水冷後ペレット状に切断して成形した。
実施例2で作成した2次元通信用低誘電シートの片面に電解メッキ工程にて、厚さ0.003mmの銅めっき層を形成し、片面に導電層を有する2次元通信用低誘電シートを得た。
実施例2で作成した2次元通信用低誘電シートの片面にアクリル系粘着剤(厚さ:30μm)にて、厚さ30μmのアルミニウム蒸着フィルムを積層し、片面に導電層を有する2次元通信用低誘電シートを得た。
密度が0.4g/cm3、平均セル径が70μmであるポリウレタンを主成分とする発泡体をスライスして、厚さが1.0mmの2次元通信用低誘電シートを得た。
2次元通信用低誘電シートとして作成した樹脂発泡体および発泡前のペレット状成形体の密度は、該試験片の寸法をノギスで測定した後、電子天秤で質量を測定し、次式より求めた。
密度(g/cm3)=試験片の質量/試験片の体積
発泡倍率は発泡前のペレット状成形体の密度と、樹脂発泡体の密度から、次式より求めた。
発泡倍率(倍)=発泡前のペレット状の成形体の密度/樹脂発泡体の密度
デジタルマイクロスコープ(商品名「VH-8000」キーエンス株式会社製)により、発泡体気泡部の拡大画像を取り込み、画像解析ソフト(商品名「Win ROOF」三谷商事株式会社製)を用いて、画像解析することにより、任意の気泡400個の平均セル径(μm)を求めた。
実施例および比較例で得られた2次元通信用低誘電シートを幅2mm×長さ70mmに切断して評価用サンプルとし、空洞共振器摂動法(アジレントテクノロジー製ベクトルネットワークアナライザー8722A、関東電子応用開発製空洞共振器)によって、1GHzでの誘電正接の値を観測した。
実施例および比較例で得られた2次元通信用低誘電シートを幅2mm×長さ70mmに切断して評価用サンプルとし、空洞共振器摂動法(アジレントテクノロジー製ベクトルネットワークアナライザー8722A、関東電子応用開発製空洞共振器)によって、1GHzでの誘電率の値を観測した。
JIS K 6271に記載されている二重リング電極法に準じて、表面抵抗率を測定した。抵抗値の測定には、装置名「デジタル・マルチメータ VOAC7520」(岩通計測株式会社製)を使用した。
曲げ弾性率Eを、JIS K7203(1982)に準じて、試験片として、長さ100mm×幅25mm×厚さ:板状発泡体の厚さ(板状発泡体が積層板状発泡体の場合は積層された樹脂層を含めた板状発泡体の厚さ)のものを板状発泡体から切出して使用し、測定を行った。
次に、下記式に曲げ弾性率E、及び寸法を代入し曲げ剛性EI[N・mm2]を計算した。
ただし、E:曲げ弾性率[mPa]、b:サンプル長さ[mm]、h:サンプル厚み[mm]である。
実施例および比較例で得られた2次元通信用低誘電シートを、直径100mm及び長さ300mmのロールに巻き取り、シワの発生の有無を観測した。
2 誘電材料(2次元通信用低誘電シート)
3 導電メッシュ
4 導電層
5 絶縁層
Claims (15)
- 密度が0.01~0.2g/cm3であり、誘電率が1.6以下であることを特徴とする2次元通信用低誘電シート。
- 誘電正接が0.01以下であることを特徴とする請求項1に記載の2次元通信用低誘電シート。
- 気泡を含有することを特徴とする請求項1に記載の2次元通信用低誘電シート。
- 気泡の平均セル径が1~300μmであることを特徴とする請求項3に記載の2次元通信用低誘電シート。
- 熱可塑性樹脂組成物から形成されることを特徴とする請求項1に記載の2次元通信用低誘電シート。
- 前記熱可塑性樹脂組成物が少なくともポリオレフィン系樹脂を含むことを特徴とする請求項5に記載の2次元通信用低誘電シート。
- 少なくとも片面に導電層を有する請求項1に記載の2次元通信用低誘電シート。
- 前記導電層の表面抵抗率が1cm2あたり1Ω以下であることを特徴とする請求項7に記載の2次元通信用低誘電シート。
- 前記導電層の厚みが0.1mm以下であること特徴とする請求項7に記載の2次元通信用低誘電シート。
- 曲げ剛性が100N・mm2以下であることを特徴とする請求項1に記載の2次元通信用低誘電シート。
- 請求項1に記載の2次元通信用低誘電シートを用いた通信用シート構造体。
- 樹脂発泡体からなる2次元通信用低誘電シートの製造方法であって、樹脂組成物を発泡成形させて、密度が0.01~0.2g/cm3であり、誘電率が1.6以下である樹脂発泡体を形成することを特徴とする2次元通信用低誘電シートの製造方法。
- 樹脂組成物を高圧ガスを用いて発泡させる請求項12に記載の2次元通信用低誘電シートの製造方法。
- 高圧ガスが、二酸化炭素又は窒素である請求項13に記載の2次元通信用低誘電シートの製造方法。
- 高圧ガスが、超臨界流体である請求項13または14に記載の2次元通信用低誘電シートの製造方法。
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JP4878869B2 (ja) * | 2005-04-08 | 2012-02-15 | 日東電工株式会社 | 発泡部材、発泡部材積層体及び発泡部材が用いられた電気・電子機器類 |
JP5121243B2 (ja) * | 2006-03-30 | 2013-01-16 | Jsr株式会社 | ポリオレフィン系樹脂発泡体とその製造方法 |
JP5153110B2 (ja) * | 2006-10-02 | 2013-02-27 | 日東電工株式会社 | ポリオレフィン系樹脂発泡体とその製造方法 |
JP4908187B2 (ja) * | 2006-12-26 | 2012-04-04 | 帝人ファイバー株式会社 | 通信用シート構造体 |
JP2009093333A (ja) * | 2007-10-05 | 2009-04-30 | Toppan Forms Co Ltd | 非接触型データ受送信体 |
JP5260089B2 (ja) * | 2008-03-07 | 2013-08-14 | 帝人株式会社 | 通信用シート構造体およびそれを用いてなる天板を有する什器 |
-
2010
- 2010-09-28 JP JP2010216402A patent/JP2011097578A/ja active Pending
- 2010-09-29 KR KR20127010768A patent/KR20120103576A/ko not_active Application Discontinuation
- 2010-09-29 US US13/499,225 patent/US20120183760A1/en not_active Abandoned
- 2010-09-29 WO PCT/JP2010/066944 patent/WO2011040463A1/ja active Application Filing
- 2010-09-29 CN CN201080043986.0A patent/CN102549949B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH06126872A (ja) * | 1992-10-14 | 1994-05-10 | Asahi Chem Ind Co Ltd | フッ素樹脂複合フォームシート |
JP2008160615A (ja) * | 2006-12-26 | 2008-07-10 | Teijin Fibers Ltd | 通信用フレキシブルシート構造体 |
Also Published As
Publication number | Publication date |
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CN102549949B (zh) | 2015-08-26 |
JP2011097578A (ja) | 2011-05-12 |
KR20120103576A (ko) | 2012-09-19 |
US20120183760A1 (en) | 2012-07-19 |
CN102549949A (zh) | 2012-07-04 |
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