WO2011020727A1 - Apparatus and method for a sub microscopic and optically variable image carrying device - Google Patents

Apparatus and method for a sub microscopic and optically variable image carrying device Download PDF

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Publication number
WO2011020727A1
WO2011020727A1 PCT/EP2010/061532 EP2010061532W WO2011020727A1 WO 2011020727 A1 WO2011020727 A1 WO 2011020727A1 EP 2010061532 W EP2010061532 W EP 2010061532W WO 2011020727 A1 WO2011020727 A1 WO 2011020727A1
Authority
WO
WIPO (PCT)
Prior art keywords
optically variable
variable image
embossing
optically
belt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2010/061532
Other languages
English (en)
French (fr)
Inventor
Michelle Richert
David R. Boswell
Mark Robert Dicker
Alexander Stuck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Priority to US13/391,079 priority Critical patent/US9310676B2/en
Priority to JP2012525123A priority patent/JP5627684B2/ja
Priority to EP10741946.7A priority patent/EP2467755B1/en
Priority to AU2010285107A priority patent/AU2010285107A1/en
Publication of WO2011020727A1 publication Critical patent/WO2011020727A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/14—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of indefinite length
    • B29C39/148—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of indefinite length characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • B29C59/046—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts for layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0866—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation
    • B29C2035/0877—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation using electron radiation, e.g. beta-rays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds

Definitions

  • WO2005051675 is directed to a method for forming a holographic diffraction grating on a substrate comprising the steps of: a) applying a curable compound to at least a portion of the substrate; b) contacting at least a portion of the curable compound with diffraction grating forming means; c) curing the curable compound and d) depositing a metallic ink on at least a portion of the cured compound.
  • the embossing apparatus includes a flexible substrate, a coating unit for depositing a curable composition and an embossing drum that includes an optically transparent cylinder including the optically transparent fluoropolymer material carrying the optically variable image (OVI) to be applied.
  • OVI optically variable image
  • Said materials are characterized by a high tensile strength at break, resistance to tear and penetration, excellent resistance against UV and weathering, high degree of transparency, self-cleaning, optimal resistance to chemicals, resistant to temperature extremes (from -200 0 C to +150 0 C - short time up to 230 0 C), flame retardant, and outstanding separating quality.
  • the at present most preferred fluoropolymer is NOWOFOL ET 6235.
  • Teflon FEP 160 DuPont Fluoropolymers; a FEP (Perfluoroethylene Propylene Copolymer) plastic material
  • FEP Perfluoroethylene Propylene Copolymer
  • An alkylbenzene or the like for example may be used as a solvent of a low boiling temperature.
  • solvents are ethoxypropanol, methylethylketon, me- thoxypropylacetate, diacetonalcohol etc.
  • polyunsaturated compounds of relatively high molecular mass examples include acrylated epoxy resins, polyesters containing acrylate-, vinyl ether- or epoxy-groups, and also polyurethanes and polyethers.
  • unsaturated oligomers are unsatu- rated polyester resins, which are usually prepared from maleic acid, phthalic acid and one or more diols and have molecular weights of from about 500 to 3000.
  • a mono- or multi-functional ethylenically unsaturated compound, or mixtures of several of said compounds can be included in the above composition up to 70 % by weight based on the solid portion of the composition.
  • R55, R56, R57, R58 and R59 independently of one another are hydrogen, unsubstituted Ci- Ci2-alkyl or Ci-Ci2-alkyl substituted by OH, Ci-C4-alkoxy, phenyl, naphthyl, halogen or CN; wherein the alkyl chain optionally is interrupted by one or more oxygen atoms; or R55, R56, R57, R58 and R59 independently of one another are Ci-C4-alkoxy, Ci-C4-alkythio or NR52R53, R52 and R53 independently of one another are hydrogen, unsubstituted Ci-Ci2-alkyl or Ci- Ci2-alkyl substituted by OH or SH wherein the alkyl chain optionally is interrupted by one to four oxygen atoms; or R52 and R53 independently of one another are C2-Ci2-alkenyl, cyclopentyl, cyclohexyl, benzyl or phenyl; and
  • the photopolymerizable compositions generally comprise 0.05 to 20 % by weight, preferably 0.01 to 10 % by weight, in particular 0.01 to 8 % by weight of the photoinitiator, based on the solid composition.
  • the amount refers to the sum of all photoinitiators added, if mix- tures of initiators are employed.
  • the photopolymerisable mixtures can comprise various additives.
  • additives include thermal inhibitors, light stabilisers, optical brighteners, fillers and pigments, as well as white and coloured pigments, dyes, antistatics, adhesion promoters, wetting agents, flow auxiliaries, lubricants, waxes, anti-adhesive agents, dis- persants, emulsifiers, anti-oxidants; fillers, e.g.
  • copolymers are copolymers of methyl methacrylate/methacrylic acid, copolymers of benzyl methacrylate/methacrylic acid, copolymers of methyl methacrylate/ethyl acry- late/methacrylic acid, copolymers of benzyl methacrylate/methacrylic acid/styrene, copolymers of benzyl methacrylate/methacrylic acid/hydroxyethyl methacrylate, copolymers of methyl methacrylate/butyl methacrylate/methacrylic acid/styrene, copolymers of methyl methacrylate/benzyl methacrylate/methacrylic acid/hydroxyphenyl methacrylate.
  • compositions comprise as polymerizable component, for example, resins and compounds that can be cationically polymerised by alkyl- or aryl-containing cations or by protons.
  • polymerizable component for example, resins and compounds that can be cationically polymerised by alkyl- or aryl-containing cations or by protons.
  • examples thereof include cyclic ethers, especially epoxides and oxetanes, and also vinyl ethers and hydroxy-containing compounds. Lactone compounds and cyclic thio- ethers as well as vinyl thioethers can also be used.
  • Further examples include aminoplastics or phenolic resole resins. These are especially melamine, urea, epoxy, phenolic, acrylic, polyester and alkyd resins, but especially mixtures of acrylic, polyester or alkyd resins with a melamine resin.
  • HELOXY Modifier 62 p-tert-butylphenyl glycidyl ethers, e.g. HELOXY Modifier 65, poly- functional glycidyl ethers, such as diglycidyl ethers of 1 ,4-butanediol, e.g. HELOXY Modifier 67, diglycidyl ethers of neopentyl glycol, e.g. HELOXY Modifier 68, diglycidyl ethers of cyclohexanedimethanol, e.g. HELOXY Modifier 107, trimethylolethane triglycidyl ethers, e.g.
  • polymerizable component examples include polyglycidyl ethers and poly( ⁇ - methylglycidyl) ethers obtainable by the reaction of a compound containing at least two free alcoholic and/or phenolic hydroxy groups per molecule with the appropriate epichlorohydrin under alkaline conditions, or alternatively in the presence of an acid catalyst with subse- quent alkali treatment. Mixtures of different polyols may also be used.
  • They can also be prepared from mononuclear phenols, such as resorcinol and hydroquinone, and polynuclear phenols, such as bis(4-hydroxyphenyl)methane, 4,4-dihydroxydiphenyl, bis(4- hydroxyphenyl)sulphone, 1 , 1 ,2,2-tetrakis(4-hydroxyphenyl)ethane, 2,2-bis(4- hydroxyphenyl)-propane (bisphenol A) and 2,2-bis(3,5-dibromo-4-hydroxyphenyl)propane.
  • mononuclear phenols such as resorcinol and hydroquinone
  • polynuclear phenols such as bis(4-hydroxyphenyl)methane, 4,4-dihydroxydiphenyl, bis(4- hydroxyphenyl)sulphone, 1 , 1 ,2,2-tetrakis(4-hydroxyphenyl)ethane, 2,2-bis(4-
  • the properties of the binder can vary widely.
  • One possible variation for example depending upon the intended use of the composition, is the use of mixtures of different epoxy compounds and the addition of flexibilisers and reactive diluents.
  • vinyl ethers suitable for use in the compositions according to the invention include triethylene glycol divinyl ether, 1 ,4-cyclohexanedimethanol divinyl ether, 4- hydroxybutyl vinyl ether, the propenyl ether of propylene carbonate, dodecyl vinyl ether, tert-butyl vinyl ether, tert-amyl vinyl ether, cyclohexyl vinyl ether, 2-ethylhexyl vinyl ether, ethylene glycol monovinyl ether, butanediol monovinyl ether, hexanediol monovinyl ether, 1 ,4-cyclohexanedimethanol monovinyl ether, diethylene glycol monovinyl ether, ethylene glycol divinyl ether, ethylene glycol butylvinyl ether, butane-1 ,4-diol divinyl ether, hexanediol divinyl ether,
  • Examples of compounds Z-A are compounds of formula (I), in which
  • R104 and R106 together form a C2-C6-alkylene bridge that is unsubstituted or substituted by one ore more Ci-C4-alkyl groups; or
  • a preferred UV curable varnish comprises [(1-methyl-1 ,2- ethanediyl)bis[oxy(methyl-2,1-ethanediyl)] diacrylate (1 - 20%), poly(oxy-1 ,2-ethanediyl), ⁇ - hydroxy-[(1-oxo-2-propen-1-yl)oxy]-, ether with 2-ethyl-2-(hydroxymethyl)-1 ,3-propanediol (3:1) (10 - 50%), oligo[2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone] (1 - 5%), oxybis(methyl-2,1-ethanediyl) diacrylate (30 - 45%)].
  • photoinitiators such as, for example, 4-phenylbenzophenone and Esacure KIP 150, are present in an amount of 0.5-10 %. The amount of all components sums up to 100 % (

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  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Printing Methods (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Holo Graphy (AREA)
PCT/EP2010/061532 2009-08-21 2010-08-09 Apparatus and method for a sub microscopic and optically variable image carrying device Ceased WO2011020727A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US13/391,079 US9310676B2 (en) 2009-08-21 2010-08-09 Apparatus and method for a sub microscopic and optically variable image carrying device
JP2012525123A JP5627684B2 (ja) 2009-08-21 2010-08-09 超顕微鏡的及び光学的可変像を有するデバイスのための装置及び方法
EP10741946.7A EP2467755B1 (en) 2009-08-21 2010-08-09 Method for a sub microscopic and optically variable image carrying device
AU2010285107A AU2010285107A1 (en) 2009-08-21 2010-08-09 Apparatus and method for a sub microscopic and optically variable image carrying device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP09168389 2009-08-21
EP09168389.6 2009-08-21

Publications (1)

Publication Number Publication Date
WO2011020727A1 true WO2011020727A1 (en) 2011-02-24

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Application Number Title Priority Date Filing Date
PCT/EP2010/061532 Ceased WO2011020727A1 (en) 2009-08-21 2010-08-09 Apparatus and method for a sub microscopic and optically variable image carrying device

Country Status (5)

Country Link
US (1) US9310676B2 (enExample)
EP (1) EP2467755B1 (enExample)
JP (1) JP5627684B2 (enExample)
AU (1) AU2010285107A1 (enExample)
WO (1) WO2011020727A1 (enExample)

Cited By (14)

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DE102011088154A1 (de) * 2011-12-09 2013-06-13 CFC Europe GmbH Schichtförmiges Produkt, insbesondere zur Verstärkung von optischen Effekten, und Verfahren zu seiner Herstellung
JP2014056975A (ja) * 2012-09-13 2014-03-27 Hitachi Chemical Co Ltd パターンを有する樹脂層を製造する方法
US20140196845A1 (en) * 2011-08-30 2014-07-17 Soken Chemical & Engineering Co., Ltd. Bonding Method of Resin Mold and Roll-to-Roll Continuous Mold Composition Produced by Using the Bonding Method
US20140322380A1 (en) * 2013-04-30 2014-10-30 Thomas Nathaniel Tombs Digital embossing device
CN104303104A (zh) * 2012-02-22 2015-01-21 佳能纳米技术公司 大面积压印光刻
US8993219B2 (en) 2011-06-21 2015-03-31 Basf Se Printing diffraction gratings on paper and board
US9310766B2 (en) 2010-09-29 2016-04-12 Basf Se Security element
EP2641730A3 (en) * 2012-03-23 2016-09-07 ORAFOL Americas Inc. Methods for fabricating a retroreflector tooling and retroreflective microstructures and devices thereof
WO2017088964A3 (de) * 2015-11-27 2017-07-20 Giesecke & Devrient Gmbh Prägeverfahren zum prägen von mikro- oder nanostrukturen
CN108290438A (zh) * 2015-11-27 2018-07-17 捷德货币技术有限责任公司 用于压印微米或纳米结构的压印设备
WO2020020479A1 (de) * 2018-07-25 2020-01-30 Giesecke+Devrient Currency Technology Gmbh Verwendung einer durch strahlung härtbaren lackzusammensetzung, verfahren zur herstellung von mikrooptischen bzw. nanooptischen strukturen, mikrooptische bzw. nanooptische struktur und datenträger
CN114621664A (zh) * 2022-04-26 2022-06-14 武汉华工图像技术开发有限公司 超耐候色层涂料及超耐候色层、超耐候塑料烫金膜及其制备方法
EP3687828B1 (en) 2017-09-29 2022-08-10 De La Rue International Limited Security device and method of manufacture thereof
AU2017371109B2 (en) * 2016-12-09 2022-12-08 Sicpa Holding Sa Low energy curing offset and letterpress printing inks and printing process

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FR2949988B1 (fr) * 2009-09-17 2011-10-07 Phenix Systems Procede de realisation d'un objet par traitement laser a partir d'au moins deux materiaux pulverulents differents et installation correspondante
PL2504400T3 (pl) 2009-11-27 2018-02-28 Basf Se Kompozycje powłokowe do elementów zabezpieczających i hologramów
US9057001B2 (en) * 2012-11-02 2015-06-16 Rockwell Automation Technologies, Inc. Transparent non-stick coating composition, method and apparatus
JP6185758B2 (ja) * 2013-05-31 2017-08-23 株式会社ミマキエンジニアリング 印刷装置及び印刷方法
EP3359386A1 (en) * 2015-10-09 2018-08-15 Ashok Chaturvedi A process of incorporating embossed visual effect / security feature on a flexible substrate and substrate / package made therefrom
CN105385283A (zh) * 2015-11-24 2016-03-09 安徽省金盾涂料有限责任公司 一种电动三轮车用水性金属烤漆
CN105602773B (zh) * 2016-02-17 2018-08-03 茗燕生物科技(上海)有限公司 洗衣片智能化生产系统
US10788670B2 (en) * 2016-07-01 2020-09-29 Intel Corporation Method to manufacture lens having embedded holographic optical element for near eye display
JP6418215B2 (ja) * 2016-09-21 2018-11-07 カシオ計算機株式会社 表示装置、立体画像形成システム、表示プログラム、及び画像形成プログラム
PL3551468T3 (pl) * 2016-12-09 2021-03-08 Sicpa Holding Sa Sieciowane niskoenergetycznie tusze do druku offsetowego i typograficznego i sposób drukowania
JP2022550833A (ja) 2019-10-03 2022-12-05 スリーエム イノベイティブ プロパティズ カンパニー フリーラジカル媒介硬化によるシリコーンエラストマー
MX2023000585A (es) * 2020-07-16 2023-04-14 Bixby Int Corporation Micrograbado.
JP7744938B2 (ja) * 2021-01-29 2025-09-26 富士フイルム株式会社 インプリントパターン形成用組成物、硬化物、インプリントパターンの製造方法、デバイス及びデバイスの製造方法

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