WO2011008039A2 - Bande adhésive thermofusible et procédé de production correspondant, procédé pour connecter un équipement électronique au moyen de cette bande adhésive et dispositif de connexion associé, et équipement électronique de ce type - Google Patents

Bande adhésive thermofusible et procédé de production correspondant, procédé pour connecter un équipement électronique au moyen de cette bande adhésive et dispositif de connexion associé, et équipement électronique de ce type Download PDF

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Publication number
WO2011008039A2
WO2011008039A2 PCT/KR2010/004630 KR2010004630W WO2011008039A2 WO 2011008039 A2 WO2011008039 A2 WO 2011008039A2 KR 2010004630 W KR2010004630 W KR 2010004630W WO 2011008039 A2 WO2011008039 A2 WO 2011008039A2
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WO
WIPO (PCT)
Prior art keywords
heat
adhesive layer
adhesive
high frequency
tape
Prior art date
Application number
PCT/KR2010/004630
Other languages
English (en)
Korean (ko)
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WO2011008039A3 (fr
Inventor
박성식
정묘선
Original Assignee
(주)새티스
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Priority claimed from KR1020100041298A external-priority patent/KR20110007569A/ko
Application filed by (주)새티스 filed Critical (주)새티스
Publication of WO2011008039A2 publication Critical patent/WO2011008039A2/fr
Publication of WO2011008039A3 publication Critical patent/WO2011008039A3/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/31—Heat sealable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content

Definitions

  • the present invention relates to a heat-sealing tape which can be used for various materials and can provide high adhesion reliability, and that can be melt-bonded by a frequency, in particular high frequency, and a method of manufacturing the same.
  • the present invention relates to a fusion tape and a method for manufacturing the same, which are provided in the conductive foil, and wherein the heat-adhesive adhesive layer is melted by heating of the conductor when applying high frequency.
  • Adhesive tapes are widely used for packaging, bonding, surface protection, masking, etc. of articles in various industries.
  • adhesive tapes comprise an adhesive and a base film to achieve the desired performance.
  • Examples of such adhesive tapes include pressure-sensitive adhesive tapes and heat fusion tapes.
  • Pressure-sensitive adhesive tapes are the most commonly used adhesive tapes and published pressure-sensitive adhesive tapes are described below.
  • Korean Patent Publication No. 195-0703036 discloses a pressure-sensitive adhesive latex having an alkali dispersibility in drying such as a copolymer of n-butyl acrylate, methacrylic acid and hydroxyethyl acrylate, and n-butyl acrylate-based air.
  • a water-insoluble and adhesive latex composition comprising an alkali non-dispersible adhesive and optionally one or more tackifiers under conditions such as coalescing latex, and upon drying, a process for preparing a pressure-sensitive adhesive label therefrom; and The use of the composition is disclosed.
  • Korean Patent Publication No. 2005-0044290 discloses a pressure-sensitive adhesive composition comprising a copolymer and an isocyanate compound without a substantial amount of a halogen compound, wherein the copolymer is selected from the group consisting of ethyl acetate, acetone, methyl ethyl ketone and methyl isobutyl ketone.
  • Korean Laid-Open Patent Publication No. 2008-0113427 discloses thermally conductive decompression obtained by adding a flame retardant thermally conductive inorganic compound and expanded graphite powder to an adhesive and / or pressure-sensitive adhesive composition mainly containing one or more materials selected from rubber, elastomer and resin.
  • An adhesive composition and a thermally conductive pressure-sensitive adhesive sheet-like molded article are disclosed.
  • the heat-sealing tape is mainly used for a metal material which is difficult to use the pressure-sensitive adhesive tape, and comprises a curing agent or an ultraviolet curing agent.
  • the above-mentioned pressure-sensitive adhesive tape is the adhesive tape most commonly used for the adhesion of materials. Recently, in order to realize a slim display and a wide display screen, high adhesion reliability is required even for a narrow adhesive surface, but a conventional pressure-sensitive adhesive tape has a problem in that it cannot satisfy such a condition due to the limitation of adhesion.
  • the conventional heat-sealed tape including a curing agent has the advantage that can provide a high adhesive reliability, but there is a problem that can be used only when some or all of the adherend is a metal.
  • the present invention has been proposed to solve the problems of the prior art as described above, and can be used in various materials and fields.
  • a flange of an injection frame equipped with a window for protecting a display in an electronic device such as a mobile phone is narrow and thermally conductive. It is an object of the present invention to provide a sufficient bonding strength by introducing a heat-sealing tape even when the existing heat-sealing tape cannot be used due to a low degree, and to provide an excellent workability and high mass-produced heat-sealing tape and a method of manufacturing the same. .
  • the present invention is to introduce a release paper roll to a part or all of the heat-adhesive adhesive layer arranged on one side or both sides of the conductor, in particular the conductive aluminum foil (foil) to improve productivity, transportability, storage properties, joining workability
  • An object of the present invention is to provide a heat-sealed tape and a method of manufacturing the same.
  • an object of the present invention is to provide a heat-sealed tape having a hollow portion formed in accordance with a shape of a junction portion of a bonding object, a shape of a junction portion of an electronic device, and more particularly, a shape of a frame portion of a mobile phone, and a method of manufacturing the same. .
  • the heat-sealed tape according to the present invention is
  • a heat sealable adhesive layer arranged on one or both surfaces of the conductor
  • the heat-adhesive adhesive layer is melted by the heating of the conductor when applying a high frequency.
  • a release paper is attached to the heat-adhesive adhesive layer, and a hollow part is provided on the conductor and the heat-adhesive adhesive layer.
  • the manufacturing method of the heat-sealed tape according to the present invention is made by pressing a heat-sealing adhesive layer arranged on one side or both sides of the conductor.
  • a heat-sealing tape including a first heat-adhesive adhesive layer in contact with the first component, a conductor in contact with the first heat-adhesive adhesive layer, and a second heat-adhesive adhesive layer in contact with the conductor and the second component.
  • the conductive material is heated by applying a high frequency to melt the first and second heat-adhesive adhesive layers of the heat-sealed tape, thereby joining the first part and the second part.
  • a release paper is attached to the first or second heat sealing adhesive layer of the heat sealing tape, or both, and the first part is an injection frame, and the second It is preferable that a component is a window, and a hollow part is provided in the said conductor and the said heat-adhesive adhesive layer.
  • the conductor is heated by applying a high frequency to melt the first and second heat-adhesive adhesive layers of the heat-sealed tape to join the first and second parts.
  • a release paper is attached to the first or second heat-sealing adhesive layer of the heat-sealing tape, or both of them, and the first row is attached to the first part.
  • a first bonding step of applying and pressing high frequency in the state where the adhesive adhesive layer is in contact with each other, and then applying the high frequency in the state where the second part is in contact with the second heat adhesive adhesive layer, and then applying the high frequency It is preferable that the second bonding step to be bonded.
  • the bonding apparatus of the electronic device using the heat-sealing tape according to the present invention is the first and second components that need to be mutually bonded
  • a heat-sealing tape comprising a first heat-adhesive adhesive layer in contact with the first component, a conductor in contact with the first heat-adhesive adhesive layer, and a second heat-adhesive adhesive layer in contact with the conductor and the second component.
  • a high frequency generator having a coil for heating the conductor by applying a high frequency, a first or second heat sealable adhesive layer of the heat-sealed tape melted by the heated conductor, and a first part or a second And a pressurizing device for pressurizing the component.
  • the first and second parts requiring mutual bonding are bonded to each other using a heat-sealing tape composed of a first heat-adhesive adhesive layer in contact with the first part and a second heat-adhesive adhesive layer in contact with the second part.
  • the first component or the second component, or both of them is provided with a conductor in contact with the first heat sealable adhesive layer or the second heat sealable adhesive layer, and heats the conductor by applying a high frequency wave. It is made by melting the first and second heat-sealing adhesive layer of the heat-sealing tape to join the first part and the second part,
  • a release paper is attached to the first or second heat-sealing adhesive layer of the heat-sealing tape, or both of them.
  • a heat-sealed tape consisting of a first heat-adhesive adhesive layer in contact with the first part, a second heat-adhesive adhesive layer in contact with the second part,
  • the first component or the second component, or both of them, is provided with a conductor in contact with the first heat sealable adhesive layer or the second heat sealable adhesive layer,
  • a high frequency generator having a coil for heating the conductor by applying a high frequency, a first or second heat sealable adhesive layer of the heat-sealed tape melted by the heated conductor, and a first part or a second It comprises a pressurizing device for pressurizing the parts.
  • the heat-sealed tape and the manufacturing method thereof according to the present invention may be used in various materials and fields.
  • the flange of the injection frame having a window for protecting the display in an electronic device such as a mobile phone is narrow and has a thermal conductivity.
  • Low heat-sealing tape can be used to provide sufficient bonding force even when the existing heat-sealing tape cannot be used, and it has excellent workability and high productivity, and heat arranged on one or both sides of the conductive aluminum foil.
  • the release paper roll is introduced into a part or all of the adhesive adhesive layer to improve productivity, transportability, storage properties, and bonding workability.
  • the shape of the bonded part of the object to be bonded is limited, and the shape of the bonded part of the electronic device is more limited. Workability can be improved by forming a hollow part in accordance with the shape of the frame joint portion of the telephone.
  • FIG. 1 is a schematic view of a heat-sealed tape according to the present invention.
  • Figure 2 is a schematic diagram of a method for producing a thermal fusion tape according to the present invention.
  • Figure 3 is a schematic diagram of a heat-sealed tape for bonding of the insert injection mobile phone frame according to the present invention.
  • FIG. 4 is a view related to the bonding of the frame and the window of the cellular phone according to the present invention.
  • FIG. 5 is a view related to the joining of an insert injection cellular phone frame and a window according to the invention.
  • FIG. 6 is a perspective view of a bonding apparatus for an electronic device using a heat-sealed tape according to the present invention.
  • Figure 7 is a schematic diagram relating to the bonding process using a bonding apparatus according to the present invention.
  • the same reference numerals in particular, the tens and ones digits, or the same digits, tens, ones, and alphabets refer to members having the same or similar functions, and unless otherwise specified, each member in the figures The member referred to by the reference numeral may be regarded as a member conforming to these criteria.
  • the heat-sealed tape T of the present invention is a conductive aluminum foil at the center ( It has a structure in which the foil (T3) is arranged, and the heat-sealable adhesive layer (T1) (T2) is arranged on both sides thereof.
  • the embodiment in which the heat-adhesive adhesive layer is introduced only on one surface of the aluminum foil is not excluded.
  • the conductive aluminum foil is generated by the induction current (the law of Fleming's left-hand and Faraday's electromagnetic induction) when applying a frequency, especially high frequency, the price competitiveness, productivity, applicability and
  • the aluminum foil is preferably aluminum foil, and aluminum of high purity may be used, or aluminum intentionally containing other components or naturally containing impurities may be used. Alternatively, however, it may be replaced by a sheet made of a mixture of a metal such as copper, iron, SUS, or a conductive material (granular or powdery), in particular, a synthetic resin sheet.
  • the thickness of such conductive foils is preferably between 6 and 340 ⁇ m,
  • the thickness is less than 6 ⁇ m, it is difficult to control the degree of heating when applying high frequency, which may cause carbonization or combustion problems, and it is not possible to appropriately control the heat-adhesive adhesive layer applied on both sides.
  • the thickness is greater than 340 ⁇ m, the amount of energy consumed for heat generation is unnecessarily increased when the product is manufactured with a heat-sealed tape, the deformation is difficult, and the workability is reduced, and the weight of the product increases, making management difficult.
  • the thickness exceeds 340 ⁇ m, it is hardly considered to be an aluminum foil or a thin plate, and it is difficult to produce a roll in the form of a plate.
  • the heat-sealing tape (T) according to the present invention is attached to the heat-adhesive adhesive layer (T1) (T2) on each of one side or both sides of the aluminum foil (T3).
  • the heat sealable adhesive layer (T1) (T2) is formed on the aluminum foil (T3) and is melted when applying a high frequency to serve to bond the material to be bonded, that is, the object to be bonded to each other.
  • the expression 'melt' in relation to the heat-adhesive adhesive layer is used to provide a constant adhesive force after the resin constituting the heat-adhesive adhesive layer is attached to the bonding object (or the adherend) by providing adhesion through a change in physical properties.
  • such a heat sealable adhesive layer may be made of, for example, a mixture of phenol and butadiene acrylonitrile rubber (NBR), and may be made of various other materials.
  • NBR butadiene acrylonitrile rubber
  • the heat sealable adhesive layer (T1) (T2) may be attached to both surfaces of the aluminum foil (T3) using the heat-sealing method, but is not limited thereto.
  • the thickness of the heat sealable adhesive layer is, for example, preferably 10 to 300 ⁇ m, wherein the heat sealable adhesive layer has a thickness of less than 10 ⁇ m.
  • the thickness of the heat sealable adhesive layer may be variously selected depending on the type of the material and the bonding object.
  • Butadiene acrylonitrile rubber was cut to a suitable size, for example less than 1 cubic centimeter, for proper mixing, then mixed with phenol and melted (other solvents available) and mixed.
  • the mixture of the phenol and butadiene acrylonitrile rubber mixed in this way was applied thinly on a moving paper using a discharge port (T Die) for spraying with heat. After applying the mixture on the release paper and dried at room temperature to form a heat sealable adhesive layer to a thickness of 20 ⁇ m.
  • a conventional coater may be used in consideration of the mass productivity of the heat sealable adhesive layer.
  • the heat release adhesive layer is applied to the release paper while the release paper is continuously passed through the coater's knife, and then the oven is applied. It can be dried while passing to form a heat sealable adhesive layer.
  • the drum-shaped metal roller was heated to 80-130 degreeC or less. Between the heated rollers and the additional rollers for compression, an aluminum foil having a thickness of 18 ⁇ m and a heat-adhesive adhesive layer applied on the release paper were faced to each other so that the two materials melted by heat and pressure.
  • the lamination of the heat-adhesive adhesive layer and the aluminum foil may be performed by applying only pressure without heating in consideration of productivity and safety.
  • the heat-adhesive adhesive layer applied on the release paper on one surface of the aluminum foil After attaching the heat-adhesive adhesive layer applied on the release paper on one surface of the aluminum foil, the heat-adhesive adhesive layer applied on the opposite side of the product is further applied in the manner described above to apply the heat-adhesive adhesive layer on both sides.
  • a heat fusion tape according to the present invention was prepared.
  • a separate feed roller (Rc) (Ra) (Rb) in which aluminum foil (T3) and a heat-sealable adhesive layer (T1) (T2) are respectively wound in a sheet form is prepared. It is fed by unwinding continuously and passed through two rollers to press together.
  • the two rollers are composed of a heating roller (R1) and a pressure roller (R2) to be laminated together by applying heat together with pressure, and then rolled up to the winding roller (R3) to mass-produce.
  • the first heat-adhesive adhesive layer may be attached to one surface of the aluminum foil, and the second heat-adhesive adhesive layer may be attached to the other surface of the aluminum foil at a time difference, and the release paper may also be manufactured from the supply roller. It can be supplied and attached to the first or second heat sealable adhesive layer, or both.
  • This process is performed while the aluminum foil (T3) and the heat sealable adhesive layer (T1) (T2) is attached,
  • the aluminum foil or the heat-sealable adhesive layer member, or both, may be preliminarily processed and heated and joined in a later step.
  • heat-sealed tape T shown in FIGS. 1B and 2C, aluminum foil T3 and heat-adhesive adhesive layer T1 and T2 are bonded to each other, and the shape of the joint portion of the bonding object is limited. It has a hollow part (Ta) in accordance with the shape of the junction part of the electronic device, more specifically, the frame junction part of the mobile phone.
  • the hollow part may be formed in various ways through a post-processing (punching, etc.) process before, during, or after lamination of the aluminum foil T3 and the heat sealable adhesive layer (T1) (T2).
  • the release paper T4 is coupled to the second heat sealable adhesive layer T2, and the release paper T4 has a through hole T4a for gripping, in particular, a hole T4a for jig insertion for workability. .
  • the release paper (T4) is used as is the release paper used in the process of producing a heat-adhesive adhesive layer before lamination with aluminum foil in the manufacturing method of the heat-sealed tape described above with respect to FIG.
  • the release paper at the time of manufacturing the first heat-adhesive adhesive layer may be removed, and may be another separate release paper, particularly a light-transmissive release paper, which is later attached to the heat-adhesive adhesive layer.
  • the release paper T4 may be attached to a part or all of the heat sealable adhesive layer, and basically the release paper T4 serves to protect the heat sealable adhesive layer T1 and T2, and the high frequency heating for the bonding object. It is used after peeling in advance in the bonding process. Release paper in the present invention can be used to purchase a commercially available to suit the purpose.
  • the total thickness of the heat-sealed tape using the high frequency according to the present invention is preferably 26 to 500 ⁇ m except for the thickness of the release paper when used for bonding the frame and the display protection window in an electronic device, especially a mobile phone.
  • thermosealing tape (T) can be used in the bonding process of the object to be bonded, specifically the electronic device, more specifically the mobile phone,
  • the heat-sealed tape T according to the present invention may be used after being processed in the same shape as that of the joint part of the injection frame E1, that is, the adhesive surface, and is processed (hollow part Ta).
  • the bonding process may be performed by arranging the heat-sealed tape T having a heat-sealing tape T on a portion to which the screen protection injection frame E1 is to be bonded on the display, that is, the flange E1a, which is a bonding portion, and applying a high frequency wave.
  • the heat-sealed tape T unlike a heat-sealed tape including a conventional curing agent or ultraviolet curing agent, generates heat to the aluminum foil T3 by applying a high frequency in the bonding process to heat-bond the adhesive layer T1 ( It is used in the bonding process by melting T2).
  • the bonding process using the heat-sealing tape using the high frequency of the present invention may be performed by applying a high frequency in the range of 10 to 1000 kHz, but is not limited thereto. Therefore, the protection range should be interpreted even when various frequency bands are applied.
  • the bonding device (B) consists of a high frequency generator (B1) and the pressurizing device (B2), the high frequency generator (B1) is a high frequency generating coil (B1a) (or work coil)
  • the coil has a shape similar to the shape of the joint, that is, the flange E1a of the frame E1.
  • the pressurizing device B2 presses the support frame B2c on which the electronic device, in particular, the frame E1 of the cellular phone E is placed, and presses the frame E1 and the window E2 positioned on the support frame.
  • a pressure plate B2a which is connected to a plunger B2b which is mechanically operated by pneumatic, hydraulic pressure, or a motor.
  • the size and shape of the pressure plate should be the same as the joint portion of at least two joining objects, and may be variously modified in consideration of manufacturing convenience.
  • the lower portion of the support frame (B2c) is a manual means consisting of a level gauge (both analog type or digital type) and a manual lifting means (screw, hydraulic or pneumatic cylinder, etc.), a horizontal sensor and a lifting means (electric plunger) Etc.) may be provided with a horizontal adjusting means (B2d) consisting of automatic means consisting of.
  • the horizontal adjusting means helps to increase the bonding quality by allowing the pressure by the pressure plate of the pressure device to be uniformly transmitted throughout the bonding object and the heat-sealing tape.
  • the bonding apparatus B may perform cooling means (air cooling or water cooling, etc.) for forced cooling of some or all of the high frequency generator B1, the pressure plate B2a, and the electronic device E.
  • cooling means air cooling or water cooling, etc.
  • the cooling means B3 for the high frequency generator B1 is provided with the water tank B3a, the cooling water circulation pump B3b, and the circulation pipe B3c.
  • the circulation pipe (B3c) is extended to the lower side of the support frame (B2c) of the pressurizing device (B2) to enable the cooling of the frame placed on the support frame, pump (B3b) or solenoid provided on the circulation pipe It is preferable to allow the cooling water to circulate after the heat-bonding adhesive layer melt bonding by high frequency application by controlling on / off of the valve B3d or both.
  • the heat-sealed resin for the heat-adhesive adhesive layer (T1) (T2) of the heat-sealing tape (T) is generally a resin that generates adhesive force by heat and pressure, and melts by heat without chemical change to generate adhesive force.
  • the thermosetting resin of the thermoplastic resin system, and the thermosetting resin which hardens by the action of the curing agent contained in the resin when heat is applied to generate an adhesive force is generally a resin that generates adhesive force by heat and pressure, and melts by heat without chemical change to generate adhesive force.
  • thermosetting resins can be used, or thermoplastic resins (which can be relatively low-temperature fused, so there is little problem of damage to the adherend).
  • the pressurized state of the pressurizing device (B2) is preferably maintained for a certain time again through the melting process of the heat-sealable adhesive layer from the initial bonding, to ensure the time to stabilize the adhesive resin is cured.
  • the heat-sealed tape (T) has a hollow (Ta), the jig (2) in the second heat-adhesive adhesive layer (T2) J, see Fig. 7 and 6) Release paper (T4) formed with a through hole (T4a) for fixing, in particular, a light-transmissive release paper for bonding position confirmation by the naked eye is combined.
  • the heat-sealing tape T is seated on the flange E1a of the frame E1, which is the first part placed on the support frame B2c (with the jig J) of the pressurizing device B2, and the plunger B2b. ) Is lowered and pressed by the pressure plate B2a so that the first heat-adhesive adhesive layer T1 of the heat-sealing tape T is brought into close contact with the flange E1a of the frame E1, and the high frequency is applied.
  • the frame E1a which is one component, is subjected to a first joining step such that the frame E1a is bonded to the first heat sealable adhesive layer T1.
  • the pressure plate B2a is lowered again so that the edge of the window E2 is in close contact with the second heat-adhesive adhesive layer T2, and high frequency is applied again to bond the second component window and the second heat-adhesive adhesive layer to each other.
  • the second joining step is performed.
  • the first bonding step is a form in which release paper is attached to the first heat sealable adhesive layer (not shown) while leaving the release paper T4 in the second heat sealable adhesive layer T2 of the heat sealing tape according to the present invention. This release paper should be removed before the ramen operation.
  • the first thermally adhesive adhesive layer T2 having no release paper is first attached to an adherend (especially an electronic device, that is, a flange of an injection frame of a mobile phone).
  • the purpose of the first bonding step is to accurately fix the heat-sealing tape and to remove the release paper, and the adhesive force expressed at this time is lower than that of the final second bonding step, so that the frame as an adherend when removing the release paper (E1) ) And the heat-sealing tape (T) is enough to not be separated from each other, so it corresponds to a kind of 'temporary bonding' step.
  • release paper T4 is left in the second heat-adhesive adhesive layer T2 is that when both release papers are removed, only the heat-sealing tape T having a hollow portion Ta (in the form of a thin strip) remains. This is because it is difficult to maintain the circular shape in the bonding process, so that defects are likely to occur.
  • the heat-sealing tape T on which the release paper T4 is not removed is placed on the offset flange E1a of the frame E1, which is the first component of the mobile phone, which is the electronic device E.
  • the high frequency generator B1 is operated by pressing the pressure plate B2a of the pressurizing device B2 and applying high pressure to the work coil B1a, the high frequency flowing to the work coil generates a low frequency wave.
  • the electromagnetic wave is induced to the metal layer in the heat-sealing tape T, that is, the conductive aluminum foil T3, to generate a current.
  • the induced current causes heat generation by generating resistance to a metal material (mainly surface-oriented).
  • the heat-conducting conductive aluminum foil (T3) melts the heat-sealing resin forming a heat-sealable adhesive layer to make it sticky.
  • the natural adhesive strength of the heat-sealed tape (T) is expressed, and when the high frequency supply is stopped, the heat generation is stopped, and when the heat generation is stopped, the remaining heat (remaining heat) is divided with the frame E1 as the adherend and cooled. If necessary, a separate cooling device may be required to increase productivity).
  • the pressing plate B2a of the pressurizing device B2 is kept in a pressed state for several seconds to be cooled in this way, and the pressing plate is raised at a time when sufficient cooling is performed.
  • the release paper (T4) can be easily peeled off. This is because the adhesive force between the first heat-adhesive adhesive layer T10 and the frame E1 is greater than the adhesive force between the second heat-adhesive adhesive layer T2 and the release paper T4, which is inherent in the release paper.
  • the second joining step is a process corresponding to a kind of 'main joining' step because the final bonding of the thermal fusion tape and the joining object is perfectly completed.
  • the second component After the release paper T4 attached to the second adhesive layer is removed, the second component is brought into contact with the second adhesive layer, and the output of the high frequency generator B1 is increased or the high frequency application time is increased in the first bonding step.
  • the heating time In order to increase the heating time by increasing the elongation, and when forming a heat-sealable adhesive layer of the thermosetting resin to activate the curing agent to cure at about 160 °C.
  • the specific second bonding step is to contact the second adherend window E2 (using acrylic or tempered glass) with the second heat-adhesive adhesive layer T2 of the heat-sealed tape T from which the release paper T4 is removed.
  • the pressurizing device B2 is operated to pressurize the pressurizing plate B2a, and then the high frequency generator B1 is operated to flow high frequency to the work coil B1a to conduct the conductive aluminum foil T3 of the heat-sealed tape T. Heat).
  • the electronic device manufactured according to the heat-sealing tape according to the present invention and the method for joining the electronic device using the same basically the first and second parts that need to be mutually bonded, and the heat-sealed between the first and second parts Tapes,
  • the heat-sealing tape is a first heat-sealable adhesive layer in contact with the first part, an aluminum foil in contact with the first heat-adhesive adhesive layer, and a second heat-sealable adhesive layer in contact with the aluminum foil and the second part. Is done.
  • the aluminum foil is heated by applying a high frequency to melt the first and second heat-sealing adhesive layers of the heat-sealing tape to bond the first and second parts. do.
  • the first heat sealability of the flange E1a of the frame E1, which is the first component of the mobile phone E, and the heat-sealed tape T The window E2, which is bonded to the adhesive layer T1 and protects the display E3, is in contact with the second heat-adhesive adhesive layer T2 of the heat-sealed tape T.
  • a conductive foil heated by high frequency in particular an aluminum foil T3, is located.
  • unexplained reference numeral 'E4' is a buffer pad E4 for protecting the display E3.
  • the frame E1 is made as small as possible while the display E3 is enlarged.
  • the width of the flange serving as a bezel is very narrow.
  • At least one of the two objects to be bonded must be provided with a high thermal conductivity member, particularly a metal member, at the joint.
  • the high frequency bonding method and the bonding apparatus according to the present invention can be applied to the insert injection frame of the electronic device.
  • the insert injection frame of an electronic device especially a mobile phone, has a flange E1a as a conductor C (especially a SUS material), and the other body part is made of a synthetic resin (for example, a PC). Material).
  • the window is also attached to such a frame, it is preferable to utilize the bonding apparatus B using the high frequency generator B1 according to the present invention.
  • the buffer pad E4 In the case of the window of the cellular phone E, the buffer pad E4 must be hidden in addition to the flange E1a of the frame E1, so that the translucent (especially transparent) window is provided with the flange E1a by introducing the printing unit E2a at the edge.
  • the pad E4 should be hidden, and no damage should occur to such a print due to the adhesive means.
  • the present invention may utilize the aforementioned high frequency bonding method and its bonding apparatus.
  • the method involves first and second parts requiring inter-bonding, namely insert injection frame E1 and window E2 as can be seen in FIG.
  • the bonding is performed using a heat-sealing tape T ′ having first and second heat-adhesive adhesive layers T1 and T2 on both surfaces thereof.
  • a base layer T3a is provided between two heat-adhesive adhesive layers T1 and T2, which may be made of a nonwoven fabric or other fabric, or various synthetic resins.
  • a heat fusion tape composed of a single heat fusion adhesive layer produced through a coater or a T-die may be employed.
  • the first component or the second component, or both, should be provided with a conductor at the contact portion with the first heat sealable adhesive layer or the second heat sealable adhesive layer.
  • the inner flange (E1a) is made of metal, patent SUS material.
  • FIG. 3 [a] is a cross-sectional view, [b] is an exploded perspective view of a release paper and a tape, [c] is a perspective view of the bonding), FIGS. 5, 6 and 7, the specific bonding method is as follows. Same as
  • the heat-sealed tape T ' also has a hollow portion Ta in accordance with the shape of the flange E1a, and a release paper T4 having a through hole T4a formed therein for fixing the jig in the second heat-adhesive adhesive layer T2,
  • the light-transmissive release paper is combined to check the bonding position with the naked eye.
  • the heat-sealed tape T ' is seated on the flange E1a of the frame E1, which is a first part placed on the support frame B2c of the pressurizing device B2, and the plunger B2b is lowered to press the plate ( B2a) to apply the high frequency to the conductor C in a state where the first heat-adhesive adhesive layer T1 of the heat-sealing tape T 'is brought into close contact with the flange E1a of the frame E1.
  • the frame E1a is subjected to a first bonding step such that the frame E1a is bonded to the first heat sealable adhesive layer T1.
  • the pressing plate B2a of the pressurizing device B2 is lifted and the release paper T4 is removed. Then, the second part of the window E2 is seated on the flange E1a of the frame E1, thereby printing the edge of the window. In the state where E2a) is in contact with the second heat-adhesive adhesive layer T2, the pressure plate B2a is lowered again so that the edge of the window E2 is in close contact with the second heat-adhesive adhesive layer T2. Is subjected to a second bonding step of bonding the second component window and the second heat-adhesive adhesive layer to each other.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

L'invention concerne une bande adhésive thermofusible pouvant être utilisée sur divers matériaux et pouvant permettre d'obtenir une fiabilité d'adhérence élevée, laquelle bande adhésive peut être fondue puis collée au moyen d'une fréquence et plus particulièrement d'ondes haute fréquence. L'invention concerne également un procédé de production correspondant. Plus spécifiquement, l'invention concerne: une bande adhésive comprenant une couche adhésive thermofusible présentant un corps électroconducteur et plus particulièrement une feuille d'aluminium conductrice, laquelle permet d'obtenir une force adhésive lorsque la couche thermofusible est fondue par chauffage du corps électroconducteur par application d'une haute fréquence. L'invention concerne également un procédé de production correspondant. La bande adhésive thermofusible selon l'invention comprend: un corps électroconducteur et une couche adhésive thermofusible disposée sur une ou sur les deux surfaces de la feuille d'aluminium.
PCT/KR2010/004630 2009-07-16 2010-07-16 Bande adhésive thermofusible et procédé de production correspondant, procédé pour connecter un équipement électronique au moyen de cette bande adhésive et dispositif de connexion associé, et équipement électronique de ce type WO2011008039A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20090065110 2009-07-16
KR10-2009-0065110 2009-07-16
KR10-2010-0041298 2010-05-03
KR1020100041298A KR20110007569A (ko) 2009-07-16 2010-05-03 열융착테이프 및 그 제조방법, 이를 이용한 전자기기의 접합방법 및 이를 위한 접합장치, 그리고 그 전자기기

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WO2011008039A2 true WO2011008039A2 (fr) 2011-01-20
WO2011008039A3 WO2011008039A3 (fr) 2011-06-16

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105398180A (zh) * 2015-10-20 2016-03-16 薛敬哲 一种瓦楞纸板生产方法及装置
CN107512067A (zh) * 2017-07-31 2017-12-26 平湖市新保纺织科技有限公司 一种新型热熔复合机

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Publication number Priority date Publication date Assignee Title
US4499145A (en) * 1982-04-19 1985-02-12 Sumitomo Bakelite Company Limited Metal-clad laminate and process for producing the same
JP2001262085A (ja) * 2000-03-15 2001-09-26 Konishi Co Ltd 誘導加熱接着シート
JP2002371253A (ja) * 2001-06-15 2002-12-26 Konishi Co Ltd 誘導加熱接着テープ
US20040241402A1 (en) * 2001-08-08 2004-12-02 Kohichiro Kawate Batch electrically connecting sheet
EP1548081A2 (fr) * 1998-03-17 2005-06-29 Ameritherm, Inc. compositions à activation RF utilisées dans l'adhésion, la liaison et le revêtement
KR20050113937A (ko) * 2004-05-31 2005-12-05 주식회사 엘지화학 점착 방열시트

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4499145A (en) * 1982-04-19 1985-02-12 Sumitomo Bakelite Company Limited Metal-clad laminate and process for producing the same
EP1548081A2 (fr) * 1998-03-17 2005-06-29 Ameritherm, Inc. compositions à activation RF utilisées dans l'adhésion, la liaison et le revêtement
JP2001262085A (ja) * 2000-03-15 2001-09-26 Konishi Co Ltd 誘導加熱接着シート
JP2002371253A (ja) * 2001-06-15 2002-12-26 Konishi Co Ltd 誘導加熱接着テープ
US20040241402A1 (en) * 2001-08-08 2004-12-02 Kohichiro Kawate Batch electrically connecting sheet
KR20050113937A (ko) * 2004-05-31 2005-12-05 주식회사 엘지화학 점착 방열시트

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105398180A (zh) * 2015-10-20 2016-03-16 薛敬哲 一种瓦楞纸板生产方法及装置
CN107512067A (zh) * 2017-07-31 2017-12-26 平湖市新保纺织科技有限公司 一种新型热熔复合机
CN107512067B (zh) * 2017-07-31 2024-05-07 平湖市新保纺织科技有限公司 一种新型热熔复合机

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