WO2010134890A1 - Système et procédé pour tester et gérer des modules de caméra - Google Patents

Système et procédé pour tester et gérer des modules de caméra Download PDF

Info

Publication number
WO2010134890A1
WO2010134890A1 PCT/SG2009/000180 SG2009000180W WO2010134890A1 WO 2010134890 A1 WO2010134890 A1 WO 2010134890A1 SG 2009000180 W SG2009000180 W SG 2009000180W WO 2010134890 A1 WO2010134890 A1 WO 2010134890A1
Authority
WO
WIPO (PCT)
Prior art keywords
camera module
camera
module
test
camera modules
Prior art date
Application number
PCT/SG2009/000180
Other languages
English (en)
Inventor
Chee Khiong Woo
Original Assignee
Esa Group Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esa Group Pte Ltd filed Critical Esa Group Pte Ltd
Priority to PCT/SG2009/000180 priority Critical patent/WO2010134890A1/fr
Publication of WO2010134890A1 publication Critical patent/WO2010134890A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N17/00—Diagnosis, testing or measuring for television systems or their details
    • H04N17/002—Diagnosis, testing or measuring for television systems or their details for television cameras
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present disclosure generally relates to the testing of camera modules, and the management or sorting of camera modules based on camera module test results. More particularly, the present disclosure describes various embodiments of camera module test systems and processes that can be configured to perform gang or matrix testing upon a plurality of camera modules.
  • FIG. 1 is a schematic illustration of a conventional camera module 10, which includes an image sensor 12 located within a housing 14; and a lens portion 16 housed within a barrel 18.
  • the barrel 18 can be attached to the housing 14, for example, by means of a screw assembly.
  • the lens portion 16 focuses an image of a subject onto the image sensor 12.
  • the image sensor 12 then converts the image received from the lens portion 16 into a set of electrical signals.
  • Existing camera module test systems and techniques have been devised based on the design of the conventional camera module 10. More particularly, existing camera module test systems test the electrical functionality of the image sensor 12 in association with testing and fine-tuning camera module optical characteristics. Specifically, the camera module 10 captures a test image, after which a set of test image characteristics are analyzed relative to intended or desired optical performance characteristics. The focus of the lens portion 16 with respect to the image sensor 12 is fine-tuned by adjusting the distance between the lens portion 16 and the image sensor 12 in an attempt to meet or satisfy the target optical performance characteristics. One way of adjusting the distance between the lens portion 16 and the image sensor 12 is by rotating the barrel 18 that is screw-joined to the housing 14. Recent evolution in camera module design has given rise to changes in camera module structural characteristics.
  • TSV Through Silicon Via
  • a camera module test system includes a camera module carrier having a plurality of module sites, the plurality of module sites carrying a plurality of camera modules, each camera module including an image sensor; a test head assembly having a plurality of electrical interfaces in signal communication with the plurality of camera modules carried by the camera module carrier; a test chart having an imaging test pattern; and a system control unit coupled to the test head assembly.
  • a camera module test process includes providing at least one camera module carrier loaded with a plurality of camera modules, each camera module within the plurality of camera modules having a width; establishing electrical signal transfer between a test head assembly and a first set of camera modules, the first set of camera modules including at least a first camera module and a second camera module within the plurality of camera modules; and electrically and optically testing the first set of camera modules.
  • FIG. 1 shows a representative camera module structure having a lens portion housed within a barrel
  • FIG. 2 shows a representative TSV-based camera module structure
  • FIG. 3 illustrates a representative system for testing and managing camera modules according to an embodiment of the disclosure
  • FIG. 4A shows a side view of a multi-module carrier structure (MMCS) according to an embodiment of the disclosure
  • FIG. 4B shows a plan view of an MMCS according to an embodiment of the disclosure
  • FIG. 4C shows a perspective view of an MMCS according to an embodiment of the disclosure
  • FIG. 5 illustrates a representative target chart according to an embodiment of the disclosure
  • FIG. 6A is a perspective illustration of a representative test head assembly according to an embodiment of the disclosure.
  • FIG. 6B is an underside plan view of a portion of a representative test head assembly according to an embodiment of the disclosure.
  • FIG. 7A is a block diagram of a representative System Control Unit (SCU) according to an embodiment of the disclosure.
  • SCU System Control Unit
  • FIG. 7B is a block diagram of a representative camera module test and management subsystem configuration according to an embodiment of the disclosure.
  • FIG. 8 is a flow diagram of a representative process for camera module array testing according to an embodiment of the disclosure.
  • FIG. 9 is a flow diagram of a representative camera module sorting and management process according to an embodiment of the disclosure. Detailed Description
  • Various embodiments of the present disclosure are directed toward structural and functional aspects of a camera module test and management system that enhances the efficiency and throughput of camera module transfer, test, and/or sorting or handling operations. Such operations are typically performed as part of a camera module manufacturing process.
  • multiple embodiments of camera module test and management system embodiments can include subsystems, devices, and/or structural elements that facilitate or enable the gang testing of camera modules that are carried by a precision carrier such as a precision plate structure.
  • FIG. 2 is a schematic illustration of a representative TSV-based camera module 100.
  • the TSV-based camera module 100 includes an image sensor 110 that is carried by a silicon substrate 120 (e.g., a portion of a Silicon wafer).
  • the silicon substrate 120 includes a set of openings or TSVs 130 that facilitate the establishment of electrical pathways for coupling or interfacing the image sensor 110 to camera module circuitry and/or external circuitry or devices.
  • the camera module 100 further includes a lens portion 140, which can be a unitary structure that is adhered or affixed to the Silicon substrate 120. In some embodiments, the lens portion 140 can be separated from the Silicon substrate 120 and can be supported by a spacer or lens holder.
  • the lens portion 140 can include an optical window and/or a wavelength filter (e.g., an infrared filter).
  • a wavelength filter e.g., an infrared filter.
  • Each element of the TSV- based camera module 100 can reside within a camera module carrier or housing 150. Relative to receiving or capturing optical signals that form a portion of an image, the general function of the image sensor 110 and the lens portion 140 remain analogous to their respective conventional counterparts.
  • the TSV-based camera module 100 can receive or capture an image that is incident upon a camera module image side 102.
  • the image side 102 can be a surface or plane that is parallel or generally parallel to a camera module surface that carries the image sensor 110 and/or an optical input side of the image sensor 110.
  • the TSV-based camera module 100 can couple to or interface with electrical circuitry that is external to the camera module 100 at a camera module electrical side 104.
  • the electrical side 104 can correspond to a camera module surface or plane upon which a circuit pattern and/or a set of electrical contacts reside.
  • a representative TSV-based camera module 100 is described in Published U.S. Patent Application No. 20080304821, entitled "Camera Module Package and Method of Manufacturing the Same," which is incorporated herein by reference in its entirety.
  • Systems, devices, techniques, and processes in accordance with various embodiments of the disclosure enable gang or matrix testing of one or more types of camera modules, for instance, TSV-based camera modules, 100, in contrast to prior camera module test systems and techniques.
  • Representative embodiments of the disclosure that are directed toward testing and managing TSV-based camera modules 100 and/or other types of camera modules in a manner that addresses one or more problems or limitations associated with prior camera module test systems and techniques are detailed below with reference to FIGs. 3 - 9.
  • TSV-based camera modules 100 are referred to hereafter as camera modules 100.
  • FIG. 3 is a schematic illustration of a representative camera module test and management system 200 according to an embodiment of the disclosure.
  • the system 200 includes at least one multi-camera-module carrier or multi-module carrying structure (MMCS) 300; a base platform, table, or plate 202; an input elevator 210; a transfer unit 220; at least one test table 230a, 230b; at least one target chart 240a, 240b; at least one test head assembly 250a, 250b; an output elevator 260; a buffer bay 270; a sorting unit 280; a sorting bay 290; and at least one sorting or reject / rework tray 292a-e.
  • the system 200 can further include a gantry assembly 400 having one or more structural supports, frames, towers, spans, arms, rails, and/or tracks.
  • the system 200 can additionally include a system control unit (SCU) 500, which manages or directs camera module array test operations; analyzes, characterizes, and maps camera module test data; and manages or directs camera module sorting / management operations.
  • SCU 500 is coupled to particular camera module test and/or management subsystems or devices by a link 502.
  • the link 502 can facilitate, for instance, SCU 500 communication with one or more of the transfer unit 220, a test table 230a, 230b, a test head assembly 250a, 250b, and the sorting unit 280, as further detailed below.
  • an MMCS 300 can be structured, shaped, and/or machined for carrying, holding, or receiving a plurality of camera modules 100 in particular locations, positions and/or orientations, in accordance with a set of precise spatial pitch and tolerance specifications.
  • a test table 230a, 230b and a test head assembly 250a, 250b can be structured and configured for testing a plurality of camera modules 100 that are carried by one or more portions of an MMCS 300.
  • the transfer unit 220 transports an MMCS 300 to a test table 230a, 230b to facilitate camera module gang testing, during which multiple camera modules 100 can be electrically and/or optically tested simultaneously or sequentially while remaining or residing upon or in the MMCS 300.
  • a test table 230a, 230b to facilitate camera module gang testing, during which multiple camera modules 100 can be electrically and/or optically tested simultaneously or sequentially while remaining or residing upon or in the MMCS 300.
  • Aspects of various embodiments of the disclosure facilitate in-carrier camera module testing, such that the removal of a camera module 100 from its carrying MMCS 300 is not required prior to testing.
  • An MMCS 300 can be structured to facilitate both camera module transport and camera module gang or array testing, as described in detail hereafter.
  • FIG. 4A is a side view
  • FIG. 4B is a plan view
  • FIG. 4C is a perspective view of a representative MMCS 300 according to an embodiment of the disclosure.
  • the MMCS 300 includes a support member 310 having an image side 312 and an electrical side 314.
  • the support member 310 includes a plurality of module sites 320, each of which includes a window 322 that is exposed to the support member's image side 312, and an electrical opening 324 that is exposed to the support member's electrical side 314.
  • a module site 320 is designed to carry, hold, or retain a camera module 100 at a precise position and in a predetermined orientation to facilitate electrical and optical camera module testing.
  • a module site 320 includes a module pocket, receptacle, or recess 330 that extends at least partially from the module site's electrical opening 324 toward the module site's window 322.
  • a module pocket 330 can carry a camera module 100 such that the camera module's optical side 102 and the module site's window 322 reside in parallel or generally parallel planes; and the camera module's electrical side 104 and the module site's electrical opening 324 reside in parallel or generally parallel planes.
  • the camera module's optical side 102 can receive optical signals that travel or propagate from a target chart 240a, 240b through the MMCS support member's window 322 to the camera module's image sensor 110. Additionally, the camera module's electrical side 104 remains exposed or accessible by way of the module site's electrical opening 324 to facilitate electrical signal communication between the camera module 100 and a test head assembly 250a, 250b.
  • the MMCS 300 by itself omits or does not provide for an electrical coupling between the camera module 100 and a separate electrical package or device (e.g., electrical circuitry or a device external to the camera module 100).
  • the MMCS is a leadless or socketless structure that itself omits, lacks, or excludes electrical leads and/or test sockets. Rather, in such embodiments the MMCS 300 serves as a precision carrier and holder for a plurality of camera modules 100.
  • a module pocket 330 is shaped and dimensioned to closely, very closely, or precisely match or mate with a camera module housing's x - y dimensions (e.g., length I 0 and width w c ), where x and y are orthogonal directions within a portion of an x - y plane that is parallel or generally parallel to the camera module's image side 102 and/or electrical side 104.
  • the module pocket 330 is further shaped and dimensioned to have a depth spanning at least a portion or substantial portion of the camera module housing's z dimension (e.g., height h c ), where z is a direction that is normal to the aforementioned x - y plane.
  • the module pocket 330 includes a plurality of walls 336 that extend from the module site's electrical opening 324 to a module pocket bottom surface, edge, or boundary 338.
  • a distance or gap between a module pocket length or width (e.g., as measured at the module pocket's bottom surface 338, or at the module site's electrical opening 324) and a respective camera module length or width can be between approximately 5 - 500 microns (e.g., between approximately 10 - 100 microns).
  • a distance or gap can be less than approximately 500 microns, or less than approximately 100 - 200 microns, or less than approximately 80 microns, or less than approximately 50 microns, or less than approximately 20 microns, or about 10 microns.
  • a distance or gap between an edge or boundary of a module site's electrical opening 324 and an edge or boundary of a camera module 100 carried by a corresponding module pocket 330 can be between approximately 2.5 - 250 microns, for instance, less than approximately 250 microns, or less than approximately 50 - 100 microns, or less than approximately 40 ' microns, or less than approximately 25 microns, or less than approximately 10 microns, or approximately 5 microns.
  • a distance or separation between a camera module 100 and a module pocket wall 336 at or proximate to the module pocket's bottom surface, edge, or boundary 338 can be approximately 10 - 40 microns, or approximately 15 - 25 microns.
  • a module pocket 338 can be sized or dimensioned to be slightly or very slightly larger than the width or dimension of a camera module 100 that the module pocket 338 is designed to carry.
  • module pockets 338 can have corresponding widths that exceed 10 millimeters by a predetermined small or very small amount.
  • Module pockets 338 can be precision machined or formed to exhibit dimensional consistency and corresponding tight dimensional tolerance.
  • each module site's electrical opening 324 has a length or width of approximately 10 millimeters (for instance, slightly greater than 10 millimeters (e.g., about 10.01 - 10.50 millimeters, or approximately 10.01 to 10.03 millimeters) to accommodate camera modules 100 having a width of 10 millimeters), with a tolerance of approximately 5 to 25 (e.g, 10 to 20) microns.
  • each module pocket 330 has a corresponding length or width of approximately 10 millimeters, with a tolerance of approximately 5 to 25 (e.g., 10 to 20) microns. Similar considerations to those described above apply to embodiments and representative implementations directed toward carrying camera modules 100 having another width or dimension (e.g.
  • a module site 320 can include one or more guide openings or recesses 326 that abut or adjoin particular module pocket locations or features.
  • a module site 320 can include four guide recesses 326, each of which extends a predetermined distance away from a module pocket corner along an angle of approximately 45 degrees.
  • one or more module pocket walls 336 can be contoured, tapered, or sloped along a portion of the module pocket's depth to facilitate the loading of a camera module 100 into the module pocket 330 (e.g., by way of a pick and place operation).
  • a module pocket's bottom surface 338 includes an image opening 332, which is shaped and dimensioned to be at least slightly larger than the surface or image capture area of the camera module's image sensor 110 to facilitate the unobstructed propagation of optical signals from a target chart 240a, 240b to the image sensor 110 relative to the camera module's field of view.
  • the module pocket's image opening 332 is approximately the same size as the module site's electrical opening 324. Additionally, the module pocket's image opening 332 can be at least slightly smaller than the module site's electrical opening 324.
  • a module site 320 can further include one or more tapered or contoured surfaces 340, which in several embodiments extend from the module site's window 322 towards or to the module pocket's image opening 332.
  • the tapered surfaces 340 can be angled or shaped in a manner that corresponds to a camera module's field of view, such that optical signals can propagate from a target chart 240a, 240b to the camera module's image sensor 110 in an unobstructed or generally unobstructed manner relative to the camera module's field of view.
  • Module sites 320 and/or module pockets 330 are separated from each other in accordance with a predetermined set of precise distances, such that camera modules 100 carried by an MMCS 300 reside at well, very well, or precisely defined MMCS positions or locations.
  • Module pockets 330 can be separated from each other in accordance with a predetermined x direction separation distance or pitch p x , and a predetermined y direction separation distance or pitch p y .
  • p x and p y can be equal or unequal to each other.
  • p x and p y can each be approximately w c millimeters, with a tolerance of approximately 8 - 12 microns (e.g., about 10 microns). In other embodiments or representative implementations, p x and/or p y can have a different tolerance (e.g., about 2.5 — 50 microns, or about 5 - 20 microns).
  • module pockets 330 can be spaced closer to or farther from each other. For instance, in certain embodiments, the module pockets can be immediately or nearly immediately adjacent to each other.
  • p x and p y are each at least slightly greater than 10 millimeters (e.g. at least about 10.5 to about 12.5 millimeters), with a tolerance of approximately 5 - 50 microns, or about 10 - 20 microns.
  • An x and/or a y direction module pocket separation distance or pitch (p x , p y ) corresponds to or matches a separation distance or pitch between electrical interface elements carried by a test head assembly 250a, 250b, as further detailed below.
  • a maximally occupied spatial organization of camera modules 100 that a test head assembly 250a, 250b can accommodate at one time can be defined as a camera module matrix or array 180.
  • a camera module array 180 is carried by a module site array 380 having a spatial organization that matches the spatial organization of the camera module array 180.
  • the size or dimension of a camera module array 180 thus determines the number of module site arrays 380 carried by an MMCS 300, which therefore determines a number of separate testing stages required to test all camera modules 100 in a maximally occupied MMCS 300.
  • MMCS 300 can be a multi-piece structure or segmented structure.
  • the MMCS support member 310 includes one or more precision plates 350 and a tray 360 that carries the precision plate(s) 350.
  • Each precision plate 350 includes a plurality of MMCS electrical openings 324 and corresponding module pockets 330; and the tray 360 includes a corresponding plurality of MMCS windows 332, in a manner identical or analogous to that shown in FIG. 4A.
  • an MMCS 300 can be a unitary, or a single piece structure.
  • One or more portions of an MMCS 300 e.g., the tray 360
  • JEDEC Joint Electronic Device Engineering Council
  • a precision plate 350 includes 72 module sites 330 that are organized as a 6 x 12 matrix or array; and a tray 360 can carry up to four precision plates 350. Such a tray 360 can therefore carry up to 288 camera modules 100.
  • a precision plate 350 can carry additional or fewer camera modules 100, which may be organized, arranged, or positioned in a differently dimensioned matrix or array. Additionally or alternatively, a tray 360 may have a different precision plate carrying capacity. Particular implementation details can depend upon camera module test and management system embodiment details or capabilities, industrial need, and/or technological evolution.
  • the MMCS 300 can include a set of mating elements, pins, guides, and/or securing structures or mechanisms 370 that retain the precision plate 350 in a predetermined position relative to the tray 360.
  • the precision plate 350 can include one or more openings, recesses, guides, handles, and/or other structural features that facilitate the removal or separation of the precision plate 350 from the tray 360, and precision plate transport independent of the tray 360.
  • a precision plate 350 can be separated from the tray 360 (e.g., by way of a robotic arm or jig) to facilitate loading of camera modules 100 into the precision plate's module pockets 330, after which the precision plate 350 can be returned to the tray 360 at a predetermined tray position.
  • a tray 360 can include one or more openings, guides, grooves, handles, and/or other structural features that facilitate the transport of the tray 360.
  • a tray 360 carrying a set of precision plates 350 loaded with an array or matrix of camera modules 100 can be carried to or removed from a test table 230a, 230b by the transport unit 220 to facilitate camera module test and management operations, as described in detail below.
  • the system's base plate 202 directly or indirectly carries, supports, or holds one or more portions of the input elevator 210; each test table 230a, 230b; each test head assembly 250a, 250b; each target chart 240a, 240b; the sorting bay 290; the output elevator 260; and the gantry assembly 400.
  • the input elevator 210 and the output elevator 260 can each include an elevator or a stacking device, which can lift or transfer one or more MMCS 300 into an MMCS access position.
  • the input elevator 210 and the output elevator 260 can also include a processing unit, a microcontroller, communication and/or control circuitry, a memory (e.g., a register set) and/or one or more status determination devices that indicate an extent to which an input elevator 210 and/or output elevator 260 is full, partially full or empty.
  • the input elevator 210 and/or the output elevator 260 can be at least partially suspended below the base plate 202. An opening in the base plate 202 can facilitate vertical elevator travel.
  • the gantry assembly 400 includes a first support arm 410 and a second support arm 412, each of which is mounted proximate to a separate end of the base plate 202 (e.g., approximately midway along the base plate's width w, and at opposite or approximately opposite ends of the base plate's length T), and each of which vertically extends above the base plate 202.
  • the gantry assembly 400 further includes a cross support 414 that resides above the base plate 202 and is mounted to the first and second support arms 410, 412.
  • the cross support 414 typically spans at least a substantial portion of the base plate's length /.
  • the gantry assembly 400 additionally includes a transport gantry arm 420 and a sorter gantry arm 430, each of which is positioned perpendicular to and beneath the gantry assembly's cross support 414, and above the base plate 202.
  • the cross support 414 can include a long linear actuator for motion in the X-axis direction
  • the transport gantry arm 420 and sorter gantry arm 430 can include linear actuators for motion in the Y-axis direction.
  • the transport gantry arm 420 carries the transfer unit 220, which can include an MMCS transfer device or assembly 222 that is coupled to a set of travel gantry motors, electromechanical or electromagnetic positioning devices, or robotic devices.
  • the transfer unit 220 can include a processing unit, a microcontroller, communication and/or control circuitry, a memory.
  • the transfer unit 220 can further include one or more optical positioning devices and/or machine vision devices (e.g., a photodiode, a photodetector, and/or a camera).
  • a first travel gantry positioning device can facilitate transfer unit movement along the transport gantry arm 420, and a second travel gantry positioning device can facilitate transport gantry arm movement along the gantry assembly's cross support 414.
  • the MMCS transfer assembly 222 can include a jig and/or an electromagnetic, electromechanical, or robotic assembly having a manipulation, gripping, grasping, or attachment device or mechanism that facilitates the selective retrieval of an MMCS 300 from the input elevator 210; the transfer of an MMCS 300 to and the removal of an MMCS 300 from a test table 230a, 230b; the transfer of an MMCS 300 to the buffer bay 270; and the transfer of an MMCS 300 to a sorting station or location such as an uppermost position upon the output elevator 260.
  • the sorter gantry arm 430 carries the sorting unit 280, which can include a set of sorter gantry motors, electromechanical or electromagnetic positioning devices, or robotic devices that are coupled to a camera module sorter 282.
  • the sorting unit 280 can additionally include a processing unit or microcontroller, communication and/or control circuitry, and a memory.
  • a first sorter gantry positioning device can facilitate movement of the sorting unit 280 along the sorting gantry arm 430
  • a second sorter gantry positioning device can facilitate sorter gantry arm movement along the gantry assembly's cross support 414.
  • the sorting unit 280 can include an electromechanical or robotic assembly having a selection, manipulation, gripping, grasping, or attachment device or mechanism to facilitate the identification and selective retrieval or unloading of a camera module 100 from an MMCS 300, and the selective loading of a camera module 100 into a reject / rework tray 292a-e.
  • a reject / rework tray 292a-e need not be a precision structure that provides precisely defined module pocket dimensions and pitch such as an MMCS 330.
  • the sorting unit 280 can selectively load particular camera modules 100 into specific reject / rework trays 292a-e, or leave camera modules 100 in an MMCS 300 based upon a sorting map that is generated by the SCU 500, as described in detail below.
  • the sorting unit 280 can additionally include one or more optical positioning or machine vision devices (e.g., a photodiode, a photodetector, and/or a camera) to facilitate camera module sorting and management operations.
  • a test table 230a, 230b can be an x - y - ⁇ or an x - y - z - ⁇ positioning device that includes a surface and/or a periphery or rim that is shaped and dimensioned to carry, receive, hold, or mate with an MMCS 300.
  • a test table 230a, 230b can include a set of electromechanical or electromagnetic positioning devices, and may additionally include a processing unit, a microcontroller, communication and/or control circuitry, and a memory.
  • a test table 230a, 230b can selectively adjust its x - y position; adjust its angular or rotational orientation ⁇ about a normal axis; and/or adjust its z position to facilitate 1) the establishment of electrical signal communication between a test head assembly 250a, 250b and a number of camera modules 100 in a camera module array 180 under consideration; and/or 2) MMCS movement (e.g., stepwise motion) over an x and/or y distance that corresponds to or matches the x and/or y dimension or span of an MMCS module site array 380.
  • MMCS movement e.g., stepwise motion
  • a test table 230a, 230b remains vertically stationery, and a test head assembly 250a, 250b can descend or travel downward toward the test table 230a, 230b to establish electrical couplings or electrical signal transfer between the test head assembly 250a, 250b and a number of camera modules 100 in a camera module array under consideration.
  • an x — y — z - ⁇ test table 230a, 230b can raise or lift an MMCS 300 toward a test head assembly 250a, 250b to facilitate the establishment of electrical couplings between a test head assembly 250a, 250b and an array of camera modules 100.
  • test table 230a, 230b can include one or more electromechanical, electromagnetic, robotic, and/or hydraulic lifting or positioning devices that are coupled to particular portions of the test table 230a, 230b (e.g., test table sides or corners).
  • a test table 230a, 230b includes an opening that is shaped and dimensioned to facilitate the unobstructed passage or propagation of optical signals from portions of a target chart 240a, 240b to one or more portions of an MMCS 300.
  • a test table opening can be shaped and dimensioned to have approximately the same area as an MMCS 300 itself, in which case the test table 230a, 230b can carry or support the MMCS 300 at an MMCS periphery, rim, or edge.
  • a test table opening can have approximately the same area as an MMCS module site array 380, that is, the number of MMCS module sites 320 that a test head assembly 250a, 250b can accommodate or access at a time during camera module gang testing operations.
  • FIG. 5 is a schematic illustration of a target chart 240a, 240b according to an embodiment of the disclosure. Relative to the description of embodiment aspects shown in FIG. 5, additional reference is made to FIG. 3 and FIGs. 4A - 4C.
  • a target chart 240a, 240b is carried, held, or suspended below the base plate 202 or test table opening at a distance or optical path length that corresponds to a camera module focal length or distance under camera module test conditions (e.g., when one or more camera modules 100 within a camera module array 180 and a test head assembly 250a, 250b are in electrical communication).
  • a target chart 240a, 240b is positioned approximately 30 to 80 centimeters beneath the image side 312 of an MMCS 300.
  • a target chart 240a, 240b can include a test pattern 242 that includes one or more test regions 244a-e (e.g., corresponding to a first through a fourth corner portion and a central portion of the target charts 240a, 240b), each with a predetermined area.
  • the target charts 240a, 240b facilitate the testing, analysis, and/or evaluation of camera module image capture characteristics in accordance with a set of desired or predetermined image capture performance criteria.
  • Image capture performance criteria can correspond to one or more of lens module focus, lens resolution, chromatic aberration, captured image distortion, captured image sharpness, color reproduction, and/or other optical performance characteristics.
  • a target chart can correspond to or be based upon an ISO 12233 Chart.
  • Other implementations can perform optical testing procedures using other types of target charts.
  • camera module testing can involve determining or analyzing image capture characteristics of one or more of VGA camera, multi Mega Pixel camera, and auto focus camera modules.
  • the system 200 additionally includes a light source 248a, 248b that illuminates a target chart 240a, 240b uniformly, such that optical signals forming a test image corresponding to a test pattern 242 can reflect off of or propagate from the target chart 240a, 240b to one or more camera modules 100 within a camera module array 180 under consideration
  • each light source 248a, 248b can include at least one high frequency fluorescent lamps of a predetermined wavelength.
  • Each of the high frequency fluorescent lamp is mounted underneath the base plate 202 and positioned above and proximately to a separate end of the target charts 240a, 240b in order to provide uniform illumination.
  • FIGs. 6A and 6B schematically illustrate a representative test head assembly 250a, 250b according to an embodiment of the disclosure. Relative to the description of embodiment aspects shown in FIGs. 6A and 6B, additional reference is made to FIG. 3 and FIGs. 4A - 4C.
  • a test head assembly 250a, 250b includes a housing 252 that carries (e.g., on a surface or an underside 254) an electrical interface array or matrix 254.
  • an electrical interface array 254 includes at least one, and typically multiple, electrical interfaces 256a-f.
  • Each electrical interface 256a-f can include a set of pins or probes 258 having a positional arrangement or spatial organization that corresponds to or matches a set of electrical coupling elements or electrical contacts carried by a camera module 100.
  • a test head assembly 250a, 250b can additionally include a processing unit, a microcontroller, communication and control circuitry, and a memory to facilitate communication with the SCU 500 and the performance of camera module testing operations by way of the electrical interface array 254.
  • Individual electrical interfaces 256a-f are spaced apart at a distance that matches or is equivalent to the separation between MMCS module pockets 330 to facilitate consistent electrical signal communication between electrical interfaces 256a-f and camera module circuitry.
  • the number of electrical interfaces 256a-f in an electrical interface array 254 indicates or determines 1) a size or dimension of a camera module array 180 that can be gang tested; and 2) an x and/or y distance increment over which a test table 230a, 230b can move or shift an MMCS 300 to facilitate the successive or sequential testing of camera module arrays 180.
  • Various embodiments of the system 200 include a set of communication links, lines or buses that facilitate signal transfer between particular subsystems or devices carried by the base plate 202, as well as signal exchange with the SCU 500.
  • Particular communication links can facilitate, for instance, communication between the transfer unit 220 and the input elevator 210, the output elevator 260, a test table 230a, 230b, and/or the SCU 500.
  • particular communication links can facilitate communication between a test head assembly 250a, 250b and the SCU 500, and/or the sorting unit 280 and the SCU.
  • FIG. 7A is a block diagram of a representative SCU 500 according to an embodiment of the disclosure. Relative to the description of embodiment aspects shown in FIG. 7, additional reference is made to FIG. 3.
  • the SCU 500 manages or directs camera module array test operations; camera module test result analysis and quantification operations; and camera module sorting / management operations.
  • the SCU 500 includes one or more of a processing unit 510; an input unit 520 coupled to an input device 522; a display unit 530 coupled to a display device 532; a data storage unit 540; a communication unit 550; a memory 560; and a signal transfer bus 580.
  • the SCU 500 can be a computer system (e.g., a desktop or laptop computer) or a computing device (e.g., an industrial control system) that is capable of executing stored program instructions that are directed toward communicating with particular camera module test and management system elements; analyzing, evaluating, and coding or scoring camera module test data; and generating sorting maps based upon camera module test data.
  • a computer system e.g., a desktop or laptop computer
  • a computing device e.g., an industrial control system
  • an input device 522 can include a keyboard and/or a mouse, and an input unit 520 can include one or more input device interfaces (e.g., a USB port).
  • a display device 532 can include, for instance, a flat panel display, and a display unit 530 can include one or more display device interfaces.
  • the data storage unit 540 can include a set of fixed and/or removable data storage devices as well as corresponding data storage media.
  • a data storage unit 540 can include, for instance, one or more of a disk drive, a CD-ROM drive, and a USB memory stick.
  • a data storage unit 540 and/or storage media corresponding thereto can store program instructions or program instruction sequences that, when executed, supervise or direct camera module test and/or sorting operations and/or analyze and map camera module test data in accordance with the present disclosure.
  • the communication unit 550 can include a set of communication interfaces that facilitate or enable control signal and data transfer between the SCU 500 and particular camera module test and management system elements.
  • the communication unit 550 can be coupled to one or more of the transfer unit 220, a test table 230, 230b, a test head assembly 250a, 250b, and the sorting unit 280 by way of a communication link 502.
  • the communication unit 550 can also be coupled to the input elevator 210 and the output elevator 260.
  • the communication unit 550 can include an IEEE-488 interface, a serial interface, a USB interface, and/or another type of interface.
  • the communication unit 550 can additionally include a network interface (e.g., an Ethernet interface) that can be coupled to a local area network (LAN), a wide area network (WAN), or the Internet.
  • the processing unit 510 can include a microprocessor or microcontroller that is capable of executing program instructions stored in the SCU's memory 560.
  • the memory 560 can include one or more types of Random Access Memory (RAM) and/ or Read-Only Memory (ROM). Memory resident program instructions or program instruction sequences include portions of an operating system 562.
  • memory resident program instructions or program instruction sequences can additionally include or correspond to one or more of an MMCS handling manager 570, a camera module array test manager 572, a test data analysis and mapping manager 574, and a camera module sorting manager 576, which can cooperatively facilitate or enable camera module test, sorting, and management operations as described in detail below with respect to FIGs. 8 and 9.
  • FIG. 7B is a block diagram of a representative camera module test and management subsystem configuration 590 according to an embodiment of the disclosure.
  • particular functionally related system elements or devices can be assigned or categorized as belonging to a given type of subsystem.
  • the SCU 500 can communicate with and coordinate the operation of one or more subsystems, such that a given subsystem can perform subsystem-specific functions independent of other subsystems, and separate subsystems can cooperatively interact during inter- subsystem operations.
  • Functionally related program instructions or program instructions sets can control or manage multiple subsystems of a given type, which can facilitate ease of system scalability and/or simplification of system or subsystem upgrade procedures.
  • a handling subsystem 592 can include the transfer unit 220, the input elevator 210, and the output elevator 260.
  • a test subsystem 594 can include each test table 230a, 230b and each test head assembly 250a, 250b.
  • a sorting subsystem can include the sorting unit 280.
  • the MMCS handling manager 570 can supervise the operation of the handling subsystem 592; the test manager 574, possibly in association with the data analysis and mapping manager 576, can supervise the operation of the test subsystem 594; and the sorting manager 576 can supervise the operation of the sorting unit 280.
  • handling manager 570, the test manager 572, the data mapping and analysis manager 574, and the sorting manager 576 appropriately coordinate inter-subsystem operations (e.g., the transfer unit's identification of an available test table 230a, 230b, followed by an MMCS transfer to the available test table 230a, 23Ob 5 followed by the initiation of camera module array test operations).
  • inter-subsystem operations e.g., the transfer unit's identification of an available test table 230a, 230b, followed by an MMCS transfer to the available test table 230a, 23Ob 5 followed by the initiation of camera module array test operations.
  • FIG. 8 is a flow diagram of a representative process 600 for camera module array testing according to an embodiment of the disclosure.
  • the process 600 includes a first process portion 602 in which a start command is generated and/or issued by the SCU 500 to one or more system elements, which can include the transfer unit 220.
  • a second process portion 604 involves selecting or retrieving (e.g., from the input elevator 210) a first or next MMCS 300 for testing.
  • a third process portion 606 involves transferring the selected MMCS 300 to and positioning the MMCS 300 upon a test table 230a, 230b.
  • a fourth process portion 610 involves identifying or selecting a first or next camera module array 180 for testing. If no prior camera module array 180 has been selected for the MMCS 300 under consideration, the fourth process portion 610 can include positioning the test table 230a, 230b at a predetermined test table x — y location to select a first camera module array 180 that is located at a corresponding predetermined MMCS x - y location.
  • the fourth process portion 610 can include moving, shifting, or stepping the test table 230a, 230b in an x and/or y direction over a distance that spans the size or spatial extent of a module site array 380 in which the camera module array resides.
  • the fourth process portion 610 can include moving, shifting, or stepping the test table 230a, 230b over or across multiple camera modules 100 carried by the MMCS 300.
  • a fifth process portion 612 involves facilitating, establishing, and/or verifying electrical signal transfer between a test head assembly 250a, 250b and at least a subset of camera modules 100 within the camera module array 180.
  • the fifth process portion 612 can involve vertically moving the test table 230a, 230b and/or the test head assembly 250a, 250b to reduce the distance between the camera module array 180 under consideration and the test head assembly's electrical interface array 254.
  • test table 230a, 230b and/or the test head assembly 250a, 250b make generally small, very small, or precise x, y, z, and/or ⁇ spatial positioning adjustments to facilitate or establish electrical signal transfer between each camera module 100 within the camera module array 180 and a corresponding test head assembly electrical interface 256a-f.
  • a sixth process portion 614 involves electrically testing each camera module 100 within the camera module array 180 under consideration, and storing electrical test data corresponding to the camera module array 180.
  • the electrical test data can be stored in a test head assembly memory, and/or within the SCU 500.
  • electrical testing can involve verifying the continuity of particular electrical signal paths (e.g., by way of impedance measurements) in each camera module 100.
  • a seventh process portion 616 involves optically testing each camera module 100 within the camera module array 180 under consideration, and storing optical test data corresponding to the camera module array 180.
  • Optical testing can involve triggering or executing an image capture operation in which each camera module's image sensor 110 receives and captures a test image, and generates an electronic analogue to the captured test image.
  • the optical test data can include or correspond to the electronic analogue of the captured test image.
  • the optical test data can be stored in a test head assembly memory, and/or within the SCU 500.
  • each camera module 100 within the camera module array 180 can be simultaneously subjected to electrical test operations; and each camera module 100 within the camera module array 180 can be simultaneously subjected to optical test operations. In other embodiments, particular subsets of camera modules 100 within the camera module array 180 can be electrically and/or optically tested in a simultaneous or sequential manner.
  • An eighth process portion 620 involves receiving or retrieving and analyzing electrical and optical test data corresponding to each camera module 100 within the camera module array 180 under consideration. Electrical and optical test data can be analyzed with respect to a predetermined set of desired camera module performance parameters or criteria.
  • the camera module performance criteria can define electrical and/or optical (e.g., lens module focusing ability) performance thresholds corresponding to pass, fail / reject, and possibly rework conditions.
  • a ninth process portion 630 involves associating a sort code with each camera module 100 in the camera module array 180 under consideration, and updating a sorting map that corresponds to the MMCS 300 under consideration.
  • the sorting map includes a MMCS position identifier (e.g., a reference to an MMCS x - y position) and a corresponding sort code that indicates whether a camera module 100 carried or located at the identified MMCS position passed or failed electrical and/or optical testing.
  • a sort code can also indicate whether a camera module 100 may be salvaged or reworked ' in the event that it failed electrical and/or optical testing.
  • a sorting map can additionally indicate a number of camera modules 100 that fell into a given soil code category (e.g., a number of camera modules 100 to which a "pass” sort code is assigned; a number of camera modules 100 to which a "fail” or “reject” sort code is assigned; and a number of camera modules 100 to which a "rework” sort code is assigned).
  • a given soil code category e.g., a number of camera modules 100 to which a "pass” sort code is assigned; a number of camera modules 100 to which a "fail” or “reject” sort code is assigned; and a number of camera modules 100 to which a "rework” sort code is assigned.
  • the fourth process portion 610 through the ninth process portion 630 can be defined as a single camera module array testing stage.
  • camera module gang or array testing involves multiple testing stages.
  • a total number of testing stages can be defined by the camera module carrying capacity of the MMCS 300 divided by number of camera modules 100, module sites 320, or electrical interfaces 256 in a camera module array 180, a module site array 380, or an electrical interface array 254, respectively.
  • MMCS 300 has a carrying capacity of 288 camera modules 100
  • an electrical interface array 254 has 6 electrical interfaces 256a-f
  • camera module testing operations for this MMCS implementation will be complete after a total of 48 testing stages.
  • the testing of camera modules on an array or gang basis in accordance with the present disclosure is significantly more efficient than prior approaches to camera module testing, in which camera modules 100 are successively transported and tested on an individual basis.
  • prior approaches to testing 288 camera modules would include 288 camera module transport operations and 288 camera module test operations, versus a single transport operation for all 288 camera modules and 48 testing stages in accordance with various embodiments of the disclosure.
  • a tenth process portion 640 involves determining whether another camera module array 180 within the MMCS 300 currently under consideration requires testing. If so, the process 600 can return to the fourth process portion 610.
  • an eleventh process portion 650 involves transferring or unloading the MMCS 300 from the test table 230a, 230b to an MMCS sorting station or location, or an MMCS buffer location in the event that an MMCS sorting location is unavailable (e.g., each MMCS sorting location is already occupied by an MMCS awaiting or undergoing sorting operations).
  • an MMCS sorting location can be a top or uppermost location upon the output elevator 260, and an MMCS buffer location can be a location within the buffer bay 270. Sorting operations can be performed upon camera modules 100 that are carried by an MMCS 300 that resides in an MMCS sorting location, as described in detail below with reference to FIG. 9.
  • a twelfth process portion 652 involves determining whether another MMCS 300 is available or ready for testing. If so, the process 600 can return to the second process portion; otherwise, a thirteenth process portion 654 involves waiting for an MMCS 300 or terminating.
  • FIG. 9 is a flow diagram of a representative camera module sorting and/or management process 700 according to an embodiment of the disclosure.
  • the process 700 includes a first process portion 702 in which a start command is generated and/or issued by the SCU 500 to one or more system elements, which can include the transfer unit 220.
  • the process 700 further includes a second process portion 710 that involves selecting a first or next MMCS 300 for sorting operations, and a third process portion 712 that involves accessing a sorting map corresponding to the selected MMCS 300 (e.g., by transferring one or more portions of the sorting map from the SCU 500 to the sorting unit 280).
  • a fourth process portion 714 involves determining whether one or more camera modules 100 carried by the selected MMCS 300 failed to meet at least one electrical and/or optical test criterion.
  • the fourth process portion 714 can involve, for instance, a determination of whether the sorting map includes one or more sort codes other than a sort code corresponding to an electrical and optical testing pass condition.
  • a fifth process portion 720 involves determining or selecting a first or next sort code for consideration, and a sixth process portion 722 involves the sorting unit's transfer of each camera module 100 to which the selected sort code has been assigned to an appropriate reject / rework tray 292a-e.
  • Reject / rework trays 292a-e can reside, for instance, in the sorting bay 290.
  • particular reject and/or rework trays 292a-e can correspond to an electrical failure reject condition, an optical failure reject condition, an electrical failure rework condition, an optical failure rework condition, and/or one or more other types of failure or rework conditions.
  • a seventh process portion 724 involves determining whether another reject and/or rework sort code in the sorting map requires consideration. If so, the process 700 can return to the fifth process portion 720.
  • an eighth process portion 730 involves shifting position of the selected MMCS 300 in the output elevator 260.
  • the eighth process portion 730 can include, for example, lowering an MMCS 300 from an uppermost location in the output elevator 260 to a lower output elevator location.
  • a ninth process portion 740 involves determining whether another MMCS 300 is ready for sorting. If so, the process 700 can return to the second process portion 710; otherwise, a tenth process portion 742 involves determining whether to terminate the process. If so, the process proceeds to the eleventh process portion 744 to end; otherwise, the process can return to the ninth process step 740 to check if there is another MMCS for sorting.
  • a system 200 can include a given number of transfer devices, positioning devices, testing devices (e.g., electrical interfaces 256a-f or electrical interface arrays or matrices 254), and/or sorting devices based upon camera module size or dimension, a number of camera modules 100 to be tested, an MMCS carrying capacity, electrical and/or optical test duration, and sorting speed.
  • transfer devices e.g., positioning devices, testing devices (e.g., electrical interfaces 256a-f or electrical interface arrays or matrices 254)
  • sorting devices based upon camera module size or dimension, a number of camera modules 100 to be tested, an MMCS carrying capacity, electrical and/or optical test duration, and sorting speed.
  • a given MMCS 300 can include a set of module pocket positioning structures or guides (e.g., differently dimensioned nested recesses or slots formed in a module pocket's bottom surface 338, and/or positioning members or pins) that facilitate the accommodation of camera modules 100 having different widths or dimensions (e.g., camera modules 100 having a width of approximately 10 mm, or 8 mm, and/or 4 mm).
  • portions of an MMCS 300 can include one or more electrical signal transfer pathways, leads, or structures that facilitate electrical coupling to camera modules 100.

Abstract

L'invention concerne divers systèmes et procédés d'essai de modules de caméra qui peuvent être configurés pour réaliser un essai en série ou de matrice sur une pluralité de modules de caméra. Dans un mode de réalisation, un système d'essai de modules de caméra comprend un support de modules de caméra portant une pluralité de modules de caméra, un ensemble de tête d'essai comprenant une pluralité d'interfaces électriques en communication par signaux avec la pluralité de modules de caméra portés par le support de modules de caméra pour réaliser l'essai des modules de caméra ; une mire de réglage comprenant une mire d'essai d'imagerie ; et une unité de contrôle de système couplée à l'ensemble de tête d'essai pour coordonner l'essai et la gestion des modules de caméra. Dans certains modes de réalisation, le système d'essai comprend en outre une unité de tri couplée à l'unité de contrôle du système ; et un jeu de plateaux de tri pour effectuer le tri et la gestion de la pluralité de modules de caméra.
PCT/SG2009/000180 2009-05-21 2009-05-21 Système et procédé pour tester et gérer des modules de caméra WO2010134890A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/SG2009/000180 WO2010134890A1 (fr) 2009-05-21 2009-05-21 Système et procédé pour tester et gérer des modules de caméra

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2009/000180 WO2010134890A1 (fr) 2009-05-21 2009-05-21 Système et procédé pour tester et gérer des modules de caméra

Publications (1)

Publication Number Publication Date
WO2010134890A1 true WO2010134890A1 (fr) 2010-11-25

Family

ID=43126393

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG2009/000180 WO2010134890A1 (fr) 2009-05-21 2009-05-21 Système et procédé pour tester et gérer des modules de caméra

Country Status (1)

Country Link
WO (1) WO2010134890A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104639937A (zh) * 2015-02-06 2015-05-20 苏州艾微视图像科技有限公司 摄像头的自动测试设备
JP2016515324A (ja) * 2013-02-25 2016-05-26 テラダイン・インコーポレーテッドＴｅｒａｄｙｎｅ Ｉｎｃｏｒｐｏｒａｔｅｄ マトリックス型試験ターゲット
WO2018196735A1 (fr) * 2017-04-26 2018-11-01 宁波舜宇光电信息有限公司 Procédé de mise en mémoire d'informations de module, procédé de recherche d'informations de module, dispositif de mise en mémoire d'informations de module et appareil de tests
CN108810324A (zh) * 2017-04-26 2018-11-13 宁波舜宇光电信息有限公司 测试数据处理装置、测试数据处理方法和测试设备
WO2018228481A1 (fr) * 2017-06-14 2018-12-20 宁波舜宇光电信息有限公司 Dispositif de test par lot de modules de caméra et système de test associé
CN110095932A (zh) * 2018-01-31 2019-08-06 格科微电子（上海）有限公司 摄像头模组的标准化测试方法
KR20190135527A (ko) * 2017-04-13 2019-12-06 울트라-디 코퍼라티에프 유.에이. 결합형 양방향 필터의 효율적인 구현

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080224721A1 (en) * 2005-12-12 2008-09-18 Optopac Co., Ltd. Apparatus, unit and method for testing image sensor packages
US20080288214A1 (en) * 2007-05-15 2008-11-20 Hon Hai Precision Industry Co., Ltd. System and method for testing a camera module
KR20080114324A (ko) * 2007-06-27 2008-12-31 엘지이노텍 주식회사 카메라 모듈, 이의 검사 장치 및 검사 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080224721A1 (en) * 2005-12-12 2008-09-18 Optopac Co., Ltd. Apparatus, unit and method for testing image sensor packages
US20080288214A1 (en) * 2007-05-15 2008-11-20 Hon Hai Precision Industry Co., Ltd. System and method for testing a camera module
KR20080114324A (ko) * 2007-06-27 2008-12-31 엘지이노텍 주식회사 카메라 모듈, 이의 검사 장치 및 검사 방법

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016515324A (ja) * 2013-02-25 2016-05-26 テラダイン・インコーポレーテッドＴｅｒａｄｙｎｅ Ｉｎｃｏｒｐｏｒａｔｅｄ マトリックス型試験ターゲット
CN104639937A (zh) * 2015-02-06 2015-05-20 苏州艾微视图像科技有限公司 摄像头的自动测试设备
KR102464876B1 (ko) 2017-04-13 2022-11-07 울트라-디 코퍼라티에프 유.에이. 결합형 양방향 필터의 효율적인 구현
KR20190135527A (ko) * 2017-04-13 2019-12-06 울트라-디 코퍼라티에프 유.에이. 결합형 양방향 필터의 효율적인 구현
KR20190132481A (ko) * 2017-04-26 2019-11-27 닝보 써니 오포테크 코., 엘티디. 점검 데이터 처리장치, 점검 데이터 처리방법과 점검기기
EP3618432A1 (fr) * 2017-04-26 2020-03-04 Ningbo Sunny Opotech Co., Ltd. Dispositif de traitement de données de test, procédé de traitement de données de test et appareil de test
WO2018196735A1 (fr) * 2017-04-26 2018-11-01 宁波舜宇光电信息有限公司 Procédé de mise en mémoire d'informations de module, procédé de recherche d'informations de module, dispositif de mise en mémoire d'informations de module et appareil de tests
KR102290098B1 (ko) 2017-04-26 2021-08-13 닝보 써니 오포테크 코., 엘티디. 점검 데이터 처리장치, 점검 데이터 처리방법과 점검기기
CN108810523A (zh) * 2017-04-26 2018-11-13 宁波舜宇光电信息有限公司 模组信息存储方法、模组信息检索方法、模组信息存储装置和测试设备
CN108810324A (zh) * 2017-04-26 2018-11-13 宁波舜宇光电信息有限公司 测试数据处理装置、测试数据处理方法和测试设备
KR20190137876A (ko) * 2017-04-26 2019-12-11 닝보 써니 오포테크 코., 엘티디. 모듈 정보 저장 방법, 모듈 정보 검색 방법, 모듈 정보 저장 장치 및 테스트 설비
KR102284288B1 (ko) 2017-04-26 2021-08-04 닝보 써니 오포테크 코., 엘티디. 모듈 정보 저장 방법, 모듈 정보 검색 방법, 모듈 정보 저장 장치 및 테스트 설비
CN108810523B (zh) * 2017-04-26 2020-04-03 宁波舜宇光电信息有限公司 模组信息存储方法、模组信息检索方法、模组信息存储装置和测试设备
EP3618432A4 (fr) * 2017-04-26 2020-05-13 Ningbo Sunny Opotech Co., Ltd. Dispositif de traitement de données de test, procédé de traitement de données de test et appareil de test
TWI716694B (zh) * 2017-06-14 2021-01-21 大陸商寧波舜宇光電信息有限公司 批量攝像模組測試設備及其測試系統
WO2018228481A1 (fr) * 2017-06-14 2018-12-20 宁波舜宇光电信息有限公司 Dispositif de test par lot de modules de caméra et système de test associé
CN109089107B (zh) * 2017-06-14 2021-12-24 宁波舜宇光电信息有限公司 批量摄像模组测试设备及其测试系统
CN109089107A (zh) * 2017-06-14 2018-12-25 宁波舜宇光电信息有限公司 批量摄像模组测试设备及其测试系统
CN110095932A (zh) * 2018-01-31 2019-08-06 格科微电子（上海）有限公司 摄像头模组的标准化测试方法

Similar Documents

Publication Publication Date Title
WO2010134890A1 (fr) Système et procédé pour tester et gérer des modules de caméra
JP3412114B2 (ja) Ｉｃ試験装置
KR102656451B1 (ko) 전자부품 테스트용 핸들러
KR100815490B1 (ko) 전자부품 시험장치
US7918641B2 (en) Handling mechanism of trays with which electronic parts are fed and inspection device of the electronic parts using the mechanism
JPH11297791A (ja) トレイ移送アーム及びこれを用いたトレイの移載装置、ｉｃ試験装置並びにトレイの取り廻し方法
US6415397B1 (en) Automated multi-PC-motherboard memory-module test system with robotic handler and in-transit visual inspection
CN107533102B (zh) 元件处理器
KR20100017827A (ko) 전자부품 시험장치
US20090314607A1 (en) Electronic device conveying method and electronic device handling apparatus
JPH11287842A (ja) Ｉｃ試験装置
TW201010918A (en) System for inspection of chips in tray and method for inspection thereof
CN1245899A (zh) 电子元件的测试方法和电子元件测试装置
JP5406480B2 (ja) プローブ方法及びプローブ用プログラム
WO2008120881A1 (fr) Système pour l'inspection visuelle d'un dispositif à semi-conducteurs
JPH112657A (ja) 複合ｉｃ試験装置
JP7426073B2 (ja) 半導体デバイスを試験するための機器および方法
CN116116732B (zh) 一种光模块自动测试设备及其检测方法
KR101508507B1 (ko) 비전검사장비의 픽커 유니트
KR100722644B1 (ko) 집적회로 시험장치
JP2000329809A (ja) 電子部品基板の試験装置および試験方法
US20060000083A1 (en) System and method for linked slot-level burn-in
KR20060008844A (ko) 모듈 아이씨(ｉｃ)의 외관검사 방법 및 그 장치
KR20200141959A (ko) 전자모듈 핸들러
KR20000053458A (ko) 전자부품기판의 시험장치

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09845012

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09845012

Country of ref document: EP

Kind code of ref document: A1