Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
• • A—HUMAN NECESSITIES
  • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
  • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
  • A47J36/00—Parts, details or accessories of cooking-vessels
  • A47J36/02—Selection of specific materials, e.g. heavy bottoms with copper inlay or with insulating inlay
• • A—HUMAN NECESSITIES
  • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
  • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
  • A47J36/00—Parts, details or accessories of cooking-vessels
  • A47J36/02—Selection of specific materials, e.g. heavy bottoms with copper inlay or with insulating inlay
  • A47J36/025—Vessels with non-stick features, e.g. coatings
• • A—HUMAN NECESSITIES
  • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
  • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
  • A47J36/00—Parts, details or accessories of cooking-vessels
  • A47J36/02—Selection of specific materials, e.g. heavy bottoms with copper inlay or with insulating inlay
  • A47J36/04—Selection of specific materials, e.g. heavy bottoms with copper inlay or with insulating inlay the materials being non-metallic
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/0021—Reactive sputtering or evaporation
  • C23C14/0036—Reactive sputtering
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/02—Pretreatment of the material to be coated
  • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
  • C23C14/025—Metallic sublayers
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
  • C23C14/0641—Nitrides
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
  • C23C14/24—Vacuum evaporation
  • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
  • C23C14/34—Sputtering
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
  • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
  • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
  • C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
  • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
  • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
  • C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
  • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
  • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
  • C23C28/40—Coatings including alternating layers following a pattern, a periodic or defined repetition
  • C23C28/42—Coatings including alternating layers following a pattern, a periodic or defined repetition characterized by the composition of the alternating layers
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/12—All metal or with adjacent metals
  • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
  • Y10T428/12771—Transition metal-base component
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
  • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
  • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
  • Y10T428/2495—Thickness [relative or absolute]
  • Y10T428/24967—Absolute thicknesses specified
  • Y10T428/24975—No layer or component greater than 5 mils thick
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
  • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
  • Y10T428/264—Up to 3 mils
  • Y10T428/265—1 mil or less

Definitions

• the invention relates generally to metal articles, and more particularly to a metal article having a multilayer coating, and to methods of making such metal articles.
• the invention relates generally to a plain copper foodware article having stick resistance properties and good heat conductivity like pure copper, and more particularly to a plain copper foodware article having a multilayer, durable, stick resistant, ceramic coating, and to a method of making such foodware articles.
• Cookware can be made using a variety of base materials, including cast iron, aluminum, clad aluminum, stainless steel and clad stainless steel, and clad copper.
• Seasoned cast iron cookware has a tough, abrasion resistant surface.
• cast iron is subject to rusting, and it must be cleaned carefully to avoid damage to the cookware surface.
• acid in foods can cause leaching of the iron from the surface, which can lead to health problems in some cases.
• Copper cookware has excellent heat transfer properties. However, it is easily scratched because it is much softer than other cookware materials, such as cast iron or stainless steel. Copper also oxidizes readily, which leads to tarnishing. Copper can be polished to remove the tarnish, but it requires substantial effort to maintain the surface finish. Furthermore, copper ions can leach into foods.
• Aluminum cookware has excellent heat transfer properties. However, aluminum is also subject to leaching of ions. One way to reduce this problem is to coat the surface of the aluminum. Anodized aluminum is coated with aluminum oxide. The oxide layer makes it much harder than untreated aluminum. (Untreated aluminum has a thin layer of aluminum oxide from reaction with oxygen in the air.) However, food will generally stick to anodized aluminum cookware unless oil is used in cooking. In addition, anodized aluminum cookware is not dishwasher-safe, as it can be discolored or corroded by typical automatic dishwashing products.
• Aluminum can also be treated by thermal spraying to prevent leaching. However, this process produces a rough surface, and food will generally stick to the surface unless it is treated.
• Stainless steel cookware is widely used. It is known for its strength and durability. Stainless steel is relatively easy to clean, and it holds its shine better than copper. However, food is more likely stick to stainless steel than to seasoned cast iron. Overheating, cooking with salt water, or letting the pan "cook dry” causes discoloration of the surface. In addition, although it is typically quite low, leaching of ions, such as iron, chromium, manganese, and nickel, can also be a concern with stainless steel. In addition, stainless steel is a poor heat conductor. The thermal conductivity of stainless steel at 225 0 C is only 19 W/mK, while, at the same temperature, copper is 398 W/mK and aluminum is 250 W/mK. Thus, copper has the heat transfer about 20 times higher than stainless steel..
• the performance of stainless steel cookware is largely determined by how well the pan spreads heat, thereby reducing or eliminating "hot spots".
• an aluminum or copper disc can be added to the bottom of the pan using brazing or impact bonding (the side wall is stainless steel). Although the heat conductivity is improved, the heat distribution of the entire pan is uneven. Further, if the user cooks the food with prolonged overheating, or the pan boils dry, the disc can be separated from the pan.
• clad stainless steel As the base material of the cookware. Clad material is made of stainless steel and aluminum or copper sandwiched together. These pans conduct heat evenly up the side walls instead of just on the bottom. The clad stainless steel cookware heats quickly, but also cools rapidly because the copper or aluminum core is a good conductor of heat and cold. For example, as shown in Fig.
• a clad stainless steel pan 5 made of a 5-ply material with a total thickness of 1.87 mm can have an interior 304 stainless steel layer (0.336 mm) 10, an aluminum layer (0.140 mm) 15, a copper core (0.940 mm) 20, an aluminum layer (0.140 mm) 25, and an exterior 430 stainless steel layer (0.31 mm) 30.
• One example of a 3-ply material with a total thickness of 2.71 mm includes an interior 304 stainless steel layer (0.394 mm), an aluminum core (1.930 mm), and an exterior 430 stainless steel layer (0.386 mm).
• the heat conductivity of clad stainless steel is a combination of the poor conductivity of the stainless steel layers, which are about 28-35% of total thickness, and the good conductivity of aluminum, or copper.
• 3-ply and 5-ply stainless steel cookware have the same disadvantages as normal stainless steel cookware: discoloration and scratching of the cooking surface.
• the cookware can be easily scorched when cooking at high temperature, and cleaning the scorched interior surface takes a lot of time.
• the interior stainless steel surface layer can be removed during scrubbing.
• a 5-ply skillet will last only about 7-8 months because the copper-core becomes exposed.
• a pan 40 made of a clad copper material with a total thickness of 2.2 mm can have an interior 304 stainless steel layer (0.4 mm) 45, an aluminum layer (0.3 mm) 50, and an exterior layer of copper (1.5 mm) 55.
• the stainless steel layer is reduced to 18% of the total.
• the resultant heat conductivity of clad copper cookware is better than that of either 3-ply or 5-ply clad stainless steel cookware.
• the interior stainless steel surface has the same problems as other stainless steel cookware: discoloration/scorching and scratching.
• the exterior copper surface can readily oxidize. Maintaining the copper surface finish requires substantial effort, as discussed above.
• Perfluorocarbon coatings provide a non-stick surface, but they are easily scratched. Even though current perfluorocarbon coatings are tougher than their predecessors, they are still fairly easy to scratch. When the surface is scratched or nicked, flakes of the perfluorocarbon coating can get into the food being cooked. This flaking is objectionable to many people, despite the fact that perfluorocarbon flakes are not known to pose a health risk.
• the perfluorocarbon polymers are safe at normal cooking temperatures, they can be damaged at high temperatures and may give off toxic fumes.
• U.S. Patent No. 5,447,803 describes the deposition of a layer of titanium and a layer of titanium nitride.
• the titanium nitride coating has high hardness, and a gold color.
• the titanium nitride coating can be oxidized or nitrided to stabilize the color, but these oxide or nitride coatings are thin and can still be scratched, resulting in possible discoloration of the pan.
• U.S. Patent No. 6,197,438 describes the use of a thick layer (about 2 to 50 microns) of chromium nitride or aluminum nitride as a primer or topcoat layer to achieve scratch resistance and non-stick properties.
• a decorative or functional top coat layer such as silicon nitride, alumina, or diamond-like carbon can be added.
• Ceramic coated foodware based on a plasma-sprayed aluminum alloy substrate is also disclosed.
• U.S. Patent No. 6,360,423 describes the deposition of a zirconium nitride coating on cookware. The surface must be polished to a high surface smoothness before the zirconium nitride layer is deposited in order to obtain a stick resistant coating. Although the zirconium nitride coating does not need to be oxidized or nitrided to stabilize the color, zirconium nitride can be discolored in varying degrees by overheating or by salty-based foods.
• U.S. Patent Nos. 6,906,295, and 7,462,375 describe foodware articles having a multilayer, ceramic coating which is stick resistant, scratch resistant, thermally stable, corrosion resistant, and color stable.
• the foodware article includes a metal foodware article having an inner food-contacting surface and an outer surface. There is a bonding layer deposited on the food-contacting surface, which is typically a metl layer. A layer of (Ti,Al,Cr)N is deposited adjacent to the bonding layer. The coating can optionally include alternating layers of CrN, and (Ti,Al,Cr)N.
• the present invention meets that need by providing a copper foodware article having a multilayer, stick resistant, tarnish-free coating.
• the copper foodware article includes a copper substrate; a base coating deposited on a first surface of the copper substrate comprising: a combination cathodic arc and sputtered bonding layer comprising a material selected from metals, alloys of metals, or combinations thereof; and a ceramic coating deposited adjacent to the base coating, the ceramic coating comprising a PVD nitride or carbonitride layer.
• Another aspect of the invention is a metal article with a multilayer, stick resistant, tarnish-free ceramic coating.
• the metal article includes a metal substrate; a base coating deposited on a first surface of the metal substrate comprising: a combination cathodic arc and sputtered bonding layer comprising a material selected from metals, alloys of metals, or combinations thereof; and a ceramic coating deposited adjacent to the base coating, the ceramic coating comprising a PVD nitride or carbonitride layer.
• Another aspect of the invention is a method of making a metal article having a multilayer, stick resistant, tarnish-free coating.
• the method includes providing a metal substrate; depositing a base coating on a first surface of the metal substrate comprising: depositing a combination cathodic arc and sputtered bonding layer using a combination of a cathodic arc process and a sputtering process, wherein the combination cathodic arc and sputtered bonding layer is made of a material selected from metals, alloys, or combinations thereof; and depositing a ceramic coating adjacent to the base coating comprising depositing a PVD nitride or carbonitride layer using a PVD process.
• nitride or carbonitride layers I mean nitride or carbonitride alloys.
• the nitrides and carbonitrides will generally be one or elements from Groups 4, 5, and 6 of the periodic table, Al, or B.
• the nitrides or carbonitrides will contain at least one of Ti, Al, Cr, Zr, Nb, V, Mo, or B.
• Nitrides and carbonitrides include, but are not limited to TiN, CrN, NbN, ZrN, BN, AlCrN, TiAlN, (Ti,Al,Cr)N, (Al,Cr,X)N, and TiCN, CrCN, ZrCN, BCN, AlCrCN, TiAlCN, (Ti,Al,Cr)CN, (Al,Cr,X)CN.
• I mean nitride or carbonitride alloys of aluminum, and chromium with an additional element.
• X will generally be one or elements from Groups 4, 5, and 6 of the periodic table, or B.
• X is typically one of Ti, Zr, Nb, V, Mo, or B.
• Nitride and carbonitride alloys of aluminum, chromium, and an additional element include, but are not limited to a superlattice structured coating of aluminum X nitride, and chromium nitride or other combinations.
• Nitride alloys of titanium, aluminum, and chromium include, but are not limited to a superlattice structured coating of titanium aluminum nitride, and chromium nitride.
• Carbonitride alloys of titanium, aluminum, and chromium include, but are not limited to a superlattice structured coating of titanium aluminum carbonitride, and chromium carbonitride.
• biocompatible I mean the coating must meet the biocompatibility test conducted according to ISOl 0993-1.
• biocompatible coatings include, but are not limited to TiN, CrN, TiN/TiCN, AlTiN, TiAlN, ZrN, (Ti,Al,Cr)N.
• plain copper I mean copper without any cladding layers
• deposited adjacent to I mean deposited next to, but not necessarily directly on, the previous layer. It could be deposited directly on the previous layer, or there could be one or more intervening layers between layers deposited adjacent to one another.
• Fig. 1 is a cross-section of a pan made of 5-ply clad stainless steel.
• Fig. 2 is a cross-section of a pan made of clad copper.
• Fig. 3 is a cross-section of one embodiment of the article of the present invention.
• Fig. 4 is a cross-section of another embodiment of the article of the present invention.
• Fig. 5 is a cross-section of another embodiment of a pan made according to the present invention.
• Fig. 6 is a schematic diagram of a deposition chamber useful in the present invention.
• the present invention is particularly designed for coating soft and porous substrates like copper and aluminum by depositing multi layer ceramic coatings.
• the multilayer ceramic coating includes a base coating and a ceramic coating.
• the base coating and the ceramic coating have different functions.
• the base coating provides good strength of adhesion to the substrate material and good corrosion resistance.
• the ceramic coating provides the functionality desired, such as good durability, stick resistance or non- stick performance, tarnish-free, and thermally stable properties.
• Non-ferrous materials like copper and aluminum are soft and porous. Corrosion is major concern with these materials. Therefore, a thick, dense, and smooth base coating deposited on the substrate is needed.
• Sputtering processes are better than cathodic arc processes in terms of providing good corrosion resistance.
• Sputtering processes including, but not limited to, DC sputtering, reactive sputtering, or magnetron sputtering, can be precisely controlled by the defined coating parameters, such as bias voltage and suitable device, to produce a smooth, dense film.
• the cathodic arc generates macro-particles, so-called droplets, which can interrupt a dense film, resulting in inferior corrosion resistance.
• the cathodic arc process bombards the substrate with high energy metal ions that can penetrate into substrate, resulting in good strength of adhesion to the substrate.
• the coating can be used on other articles as well. Examples include, but are not limited to decorative articles, plumbing fixtures, hardware, and the like.
• ⁇ means cookware, food preparation pieces including cutlery and other manual food processing pieces (such as colanders, strainers, and the like), food serving pieces (such as plates, bowls, and the like), and utensils for eating food.
• colanders such as colanders, strainers, and the like
• food serving pieces such as plates, bowls, and the like
• utensils for eating food.
• cookware I mean pots and pans for stovetop cooking, bakeware, griddles, grills, cooking utensils (such as spoons, spatulas, and the like), and food preparation devices that are used to cook food (such as electric frying pans, rice cookers, and the like).
• stick resistant I mean that the foodware article at least has stick resistant properties; it may have non-stick properties as well.
• Fig. 3 shows a cross-section of one embodiment 100 of the article of the present invention.
• the metal substrate 105 has a first surface 110 and a second surface 115.
• the metal substrate can be various materials, including, but not limited to steel, stainless steel, plain copper, aluminum, clad aluminum, cast iron, clad materials, magnalium alloy, and alloys and combinations thereof.
• the metal substrate can be a solid metal or a solid alloy, or it can be a clad material, such as a multilayer structure having a metal surface. Examples of multilayer structures, include, but are not limited to, stainless steel-clad aluminum or copper, aluminum having a plasma sprayed stainless steel coating, or metal outer layers surrounding non-metallic core materials, such as graphite.
• the total thickness of the base coating is typically between about 2 and about 20 microns, while the total thickness of the ceramic coating is generally between about 1 to about 20 microns.
• the base coating 120 includes a combination cathodic arc and sputtered bonding layer 130.
• This combination layer is deposited using a combination of a cathodic arc process and a sputtering process operated at the same time.
• the combination layer increases the strength of adhesion of the base coating while reducing the possibility of disturbing corrosion resistance.
• the combination cathodic arc and sputtered layer can comprise metals, alloys of metals, or combinations thereof. In the sputtering process used to make the layer, metals and metal alloys can be used.
• Suitable metals and metal alloys include, but are not limited to, titanium, chromium, zirconium, niobium, and hafnium, as well as various types of stainless steel, such as 304 or 316, TiAl, and AlCr.
• metals and metal alloys can be used.
• Suitable metals and metal alloys include, but are not limited to, titanium, chromium, zirconium, niobium, and hafnium. Desirably, pure metals are used for the cathodic arc process because they allow better penetration into the substrate.
• the total deposit from the cathodic arc targets (one or more) is in the range of about 5 to about 40% of the total deposit from the combination of the cathodic arc targets and the sputtering targets (one or more).
• the base coating 120 can be a single layer, if desired. Alternatively, it include one or more additional layers, as shown in Fig. 3 for example.
• the additional layers can include one or more additional combination layers, and/or one or more sputtered layers, and/or one or more cathodic arc layers.
• the base coating 120 includes a sputtered layer 135, which is deposited by a sputtering process adjacent to the combination cathodic arc and sputtered bonding layer.
• a sputtered layer 135, which is deposited by a sputtering process adjacent to the combination cathodic arc and sputtered bonding layer metals and metal alloys can be used. Suitable metals and metal alloys include, but are not limited to, titanium, chromium, zirconium, niobium, and hafnium, as well as various types of stainless steel, such as 304 or 316, TiAl, and AlCr.
• the second combination layer is made using the same general processes and materials as the first combination layer. However, the processes and material for the two layers do not have to be the identical (e.g., the first combination layer could use different metals than the second, and/or use different types of sputtering processes or cathodic arc processes).
• Suitable sputtering processes for either the sputtering process in the combination layer or the sputtered layer include, but are not limited to, reactive sputtering, DC sputtering, and magnetron sputtering. Additional alternating layers of sputtered layers and combination layers can be deposited, if desired.
• the top layer of the base coating can be a combination cathodic arc and sputtered bonding layer, if desired.
• the sputtered layer is thicker than the combination layer in the base coating. Alternating layers of sputtered layers and combination layers can also increase the hardness and toughness of the base coating that serves as a foundation for the multilayer ceramic coating.
• the 125 can be one or more layers. At least one of the layers is a PVD nitride or carbonitride.
• the PVD nitride or carbonitride layer 145 is deposited adjacent to the base coating 120.
• the PVD nitride or carbonitride layer provides a tarnish-fee surface that has excellent durability and thermal stability.
• Suitable materials for the nitride or carbonitride alloy include, but are not limited to, TiN, CrN, NbN, ZrN, BN, AlCrN, TiAlN,
• Ti,Al,Cr N , (Al, Cr, X)N, and TiCN, CrCN, ZrCN, BCN, AlCrCN, TiAlCN, (Al,Cr, X)CN.
• X includes, but is not limited to, one of Ti, Zr, Nb, V, Mo, or B.
• the PVD nitride or carbonitride layer is desirably made of a biocompatible material. This allows the article to be used for foodware and the like. There can be additional nitride or carbonitride layers, if desired, as described below.
• the composition of the various PVD nitride or carbonitride layers can be the same, or it can be different for different layers, if desired.
• the amounts of Ti, Al, and Cr can vary among the layers.
• different elements can be used, such as (Ti,Al,Cr)N and (Zr,Al,Cr)N.
• the composition can be varied by altering the number and type of targets being used for each layer, as is well-known in the art.
• PVD nitride layer is (Ti,Al,Cr)N.
• a smooth (Ti,Al,Cr)N layer possesses the characteristics of a non-reactive surface, resulting in at least stick resistant performance, and often non-stick performance.
• the superlattice concept, (Ti,Al)N/CrN, system can be utilized to produce a (Ti,Al,Cr)N coating suitable for application to a substrate, such as a foodware article.
• a coating of alternating (Ti,Al,Cr)N/CrN layers is desirable because it further improves the toughness of the multilayer coating. This allows drawing a metal sheet with a thin multilayer coating without cracking the coating in the forming process.
• a first layer of (Ti,Al,Cr)N 145 is deposited adjacent to the base coating 120.
• the first (Ti,Al,Cr)N layer 145 provides a strong, scratch resistant, stick resistant, thermally stable base layer.
• the first (Ti,Al,Cr)N layer is shown as being deposited on the base coating in this embodiment, there could be one or more intervening layers between the base coating 120 and the first (Ti,Al,Cr)N layer 145, if desired.
• the first (Ti,Al,Cr)N layer 145 is typically in the range of from about 0.1 to about 1.5 microns thick.
• first layer of chromium nitride 150 deposited adjacent to the first (Ti,Al,Cr)N layer 145.
• first chromium nitride layer 150 is shown as being deposited on the first (Ti,Al,Cr)N layer 145 in this embodiment, there could be one or more intervening layers between the first (Ti,Al,Cr)N layer 145 and the first chromium nitride layer 150, if desired.
• the first chromium nitride layer 150 is generally less than about 2 microns thick. In the event the upper layers are penetrated, the first chromium nitride layer provides corrosion resistance and oxidation resistance.
• a second layer of (Ti,Al,Cr)N 155 can optionally be deposited on the first chromium nitride layer 150.
• the second (Ti,Al,Cr)N layer is generally less than about 10 microns thick.
• Additional alternating layers of chromium nitride and (Ti,Al,Cr)N can be deposited, if desired.
• Each layer of (Ti,Al,Cr)N and chromium nitride is typically in the range of from 0.1 to about 2.0 microns. Thinner layers are desirable because the mechanical and corrosion resistance of the multilayer coating is improved.
• the (Ti,Al,Cr)N layer has high corrosion resistance and passes the 96 hr ASTM B 368-97 test, a copper accelerated acetic acid-salt spray test, which is a severe test for corrosion resistance.
• Cookware having a multilayer (Ti,Al,Cr)N coating is suitable for cooking both acidic and salty-based foods without discoloration.
• the cookware can be used at any high cooking temperatures without worrying about damaging the cookware.
• the (Ti,Al,Cr)N coating is much harder than (Ti 5 Al)N and CrN, resulting in high abrasion resistance.
• the (Ti,Al,Cr)N layer combines extreme hardness and high corrosion resistance, making the cooking surface of the cookware scratch resistant, stick resistant, and durable. It eliminates the problem of ions leaching from the base material of the cookware.
• the (Ti,Al,Cr)N layer is generally the top layer of the multilayer coating.
• One or more layers of the ceramic coating are deposited using a physical vapor deposition process, such as evaporation, sputtering, cathodic arc, or ion beam.
• a physical vapor deposition process such as evaporation, sputtering, cathodic arc, or ion beam.
• Fig. 4 shows a cross-section of another embodiment of a metal article of the present invention.
• a metal substrate 205 having a first surface 210 and a second surface 215.
• a base coating 220 is deposited on the first surface 210 and a ceramic coating 225 deposited adjacent to the base coating 220.
• the base coating 220 has a combination cathodic arc and sputtered bonding layer 230, a sputtered layer 235, and a second combination cathodic arc and sputtered bonding layer 240.
• Layer 280 can be a metal layer such as a Cr layer, deposited by a cathodic arc process.
• Fig. 5 shows a cross-section of another embodiment of a pan of the present invention.
• a metal substrate 305 having a first surface 310 and a second surface 315.
• Base coatings 320 and ceramic coatings 325 are deposited on both sides 310 and 315 of the substrate 305.
• the foodware article can be formed first and then coated, or a flat metal sheet can be coated and then formed into the pan. The process will be described for coating a preformed pan.
• the plain copper pan can be polished before deposition to create a smooth surface.
• Buffing or grinding compound or another polishing medium as is known to those in the art, can be used.
• the surface should be as smooth as possible, generally less than about 20 micro inches measured perpendicular to the concentric ground line on the surface, or less than about 16 micro inches, and typically in the range of about 10 to about 16 micron inches, although it is not necessary to achieve an ultra-bright surface finish, such as about 2 to about 4 micron inches.
• the plain copper pans are then thoroughly cleaned and dried to remove any grease, polish residual, loose and embedded particles, oxides salt residual, or other foreign material.
• a typical cleaning would involve an aqueous cleaning system in conjunction with ultrasonic cleaning.
• cathodic arc deposition and sputtering deposition can be operated separately or can be operated together at the same time in the same vacuum chamber, depending on the layer being deposited. Both the cathodic arc cathodes and sputtering cathodes can have their own desired targets with metal or alloy.
• This coating chamber can carry out the method in accordance with the invention, including the vacuum pumping system, gas-supplying system, parts holder, planetary rotation system, power sources and various electrical systems, which are required to perform the desired steps.
• Fig. 6 is a diagram of an example of a deposition chamber 400 which can be used in the practice of one embodiment of the present invention. It is a multi-cathode system, including a cathodic arc system and a sputtering system. Appropriate cathodic arc cathodes 415 are placed in the chamber as shown in Fig. 6. For example, compressed powder metal target of 50% titanuim/50% aluminum (at) can be used, along with compressed powder metal targets of pure chromium. Appropriate rectangular sputtering cathodes 420 are placed in the same chamber. For example, stainless steel target or titanium target can be used.
• the number and the type of cathodic arc cathodes and sputtering cathodes, as well as the material of the targets used, will depend on the size of the chamber and the coating being deposited.
• the pans 405, for example plain copper pans, are loaded into a suitable fixture, and placed in the planetary 410 with the desired rotation. All pans can be rotated during deposition as shown. The individual pans 405 can also be rotated, if desired.
• the chamber is pumped down to a pressure of about 10 3 Pa.
• the pans are heated to a temperature in the range of about 35O 0 F to about 450 0 F, depending on the type of material the pan is made of.
• a glow discharge is created by biasing the pan with a negative voltage of about 800 to about 1200V to micro-clean the pan.
• the combination bonding layer of the base coating is a mixed layer deposited by the sputtering process and the cathodic arc process operated at the same time.
• the sputtering of the targets for example, titanium, chromium, or stainless steel, is accomplished by bombardment with high - energy ions of the rare gas argon at a bias voltage of the substrate of about 200 to about 500 V and a vacuum level controlled at about 0.3 to about 1.0 Pa.
• the emitted atoms from the sputtering targets are deposited on the substrate, forming a smooth, dense film.
• the sputtering parameters can be precisely controlled based on a variable sputtering system, as is well known in the art.
• targets for the cathodic arc process for example chromium, or titanium
• targets for the cathodic arc process are stroked by a high current, low voltage arc in same argon atmosphere and vacuum level, resulting in a plasma jet containing high level of ionization multiply charged ions, neutral particles, clusters and macro-particles.
• the high energetic ions (Cr+, Ti+) can penetrate into the substrate to a depth that provides good strength of adhesion to the substrate.
• the deposits from the sputtering and cathodic arc processes become superimposed in the combination bonding layer.
• the combination bonding layer contains more condensed atoms from the sputtering process than condensed ions from the cathodic arc process, producing a smooth, dense combination layer with good adhesion to the substrate.
• the amount of deposit from the cathodic arc process should be sufficient to provide the desired adhesion strength while limiting the negative effect of the macro-particles on the smooth bonding layer.
• the deposit from the cathodic arc process is up to about 40% of the entire deposit for the combination layer.
• the thickness of the combination layer is generally in the range of about 0.1 to about 3.0 micron.
• One layer of the base coating deposited adjacent to the combination layer is a sputtered layer. It can be made by turning off all of the targets for the cathodic arc process. The sputtering can be carried on continuously using the same operating parameters as for the combination layer, if desired.
• the thickness of the first sputtered layer is typically between about 0.1 and about 3 microns.
• Another layer of the base coating is another combination layer deposited adjacent to the first layer.
• the combination layer is made using a sputtering process and a cathodic arc process as discussed above.
• the thickness of the second combination layer of base coating is generally about 0.1 to about 3 microns.
• a functional ceramic coating for example, (Ti, Al, Cr)N, is deposited by a cathodic arc process.
• a metal layer for example Cr, can be deposited adjacent to the base coating when all the sputtering targets are turned off.
• the pan is bombarded with ions (Cr+) at a bias voltage of about 600 to about 1000V at a vacuum level of about 10 "2 Pa.
• the metal layer can have a thickness of less than about 1 micron.
• Ti, Al, Cr titanium
• the applied voltage is about 80 to about 200V at a vacuum level of about 0.4 to about 1.5 Pa.
• the TiAl cathodes are turned off, while the Cr cathodes remain on to deposit a layer of chromium nitride at a bias voltage of about 80 to about 200V and a vacuum level of about 0.4 to about 1.5 Pa.
• the TiAl cathodes are then turned back on to deposit another layer of (Ti, Al, Cr)N. This procedure can be repeated to deposit as many layers of chromium nitride and (Ti, Al, Cr)N as desired.
• the deposition temperature can be raised up to about 600 0 F to about 900 0 F at the end of deposition, depending on the material the pan is made of.
• the pan can be given a final polish using Jeweler Rouge, diamond compound or another polishing medium, as is known to those skilled in the art, to achieve a surface that is free of embedded particulate and coating residuals.
• composition of the various (Ti, Al, Cr)N layers can be the same, or it can be different for different layers, if desired.
• the composition can be varied by altering the number and type of targets being used for each layer, as is well-known in the art.
• the number of Cr targets is desirably greater than or equal to the number of TiAl targets used in depositing the (Ti, Al, Cr)N layer, so as to balance all of the combined physical properties (i.e., stick resistance, oxidation resistance, toughness, color stability, etc.) of the coating.
• the (Ti, Al, Cr)N coating shows slight discoloration in cooking salty-based foods, although the resultant (Ti, Al, Cr)N coating is still well suited for use as a stick resistant coating.
• the discoloration may not be desirable for cosmetic reasons for some uses, it may not be a problem for other uses. It can be easily removed using Bar KeepersTM cleaner or a few drops of lemon juice.
• the copper pan shown in Fig. 5 can be constructed from a plain copper material with a total thickness of 1.4 mm coated with the coating of this invention at the thickness under 30 microns (on one side). With such thin coating (0.003 mm) compared to the total thickness of 1.4 mm of copper material, the effects of the coating on the thermal conductivity of the pan can be neglected. Therefore, PCP (Plain Copper PVD) cookware has the same thermal conductivity as pure copper, which is a unique feature.
• Table 1 compares the hardness of the coating of present invention with the interior layer of 304 stainless steel in 3-ply and 5-ply clad stainless steel cookware. The hardness of the coating of the present invention is approximately 5-7 times harder than the interior layer of 304 stainless steel. Consequently, the durability of the cooking surface of PCP cookware is about 5-7 times better than the cooking surface of 3-ply or 5-ply clad stainless steel, which is another unique feature of PCP cookware.
• PCP cookware exhibits excellent thermal stability.
• PCP cookware can withstand temperatures up to about 700 0 C as a result of the functional multilayer coating of (Ti,Al,Cr)N. In normal cooking, the cooking temperature is typically under about 300 0 C.
• a comparison between a PCP copper pan and a 5-ply clad stainless pan was conducted by heating both pans at 350 0 C for 15 minutes. The PCP pan showed no color change, maintaining the original shiny surface over the entire surface.
• the 5-Ply clad pan showed discoloration or scorching (brown color), over the entire surface, which is an indication that stainless steel is not heat resistant during cooking at high temperatures.
• Another unique feature of PCP cookware is its good corrosion resistance; it is tarnish-free. It is well known that copper material tarnishes easily.
• the plain copper cookware coated with the coating of present invention is tarnish-free.
• the mulitlayer ceramic coating included a base coating that was about 3-5 microns.
• the base coating was a combination cathodic arc and sputtered layer made from Cr, Ti, and stainless steel (0.2- 0.4 microns), a sputtered layer of Ti and stainless steel (0.3-0.5 microns), followed by 4 pairs of alternating combination cathodic arc and sputtered layers , and sputtered layers, made from the same compositions as the previous layers.
• the top layer of the base coating was a combination cathodic arc and sputtered layer.
• the ceramic coating was about 5-6 microns, and included 6 pairs of alternating superlattice (Ti,Al,Cr)N and CrN, followed by (Ti,Al,Cr)N as the top coating.
• the total coating thickness, including the base coating and the ceramic coating was about 10-12 microns (one side).
• the same multilayer ceramic coating was on the outside of the pan.
• the PCP pans were tested and compared to 5-ply stainless steel cookware (5-ply clad), and clad copper cookware (Cu clad).
• Table 2 provides the results of the comparison of 10 in. PCP pans with 10 in. 5-ply clad pans. The same food was cooked in each pan. The pans were evaluated for preheat time, cooking time, whether the food stuck to the pan, and ease of cleaning.
• the PCP pan had a shorter preheating time, and the total cooking time is almost 2 minutes shorter than the 5-ply clad pan, even at a lower heat setting. In addition, the steak did not stick to the PCP pan.
• the PCP pan heated faster, and cooked faster than the 5-ply pan, even at low heat setting. There was no discoloration or scorching during cooking for the PCP pan. The cooking surface of the 5-ply clad pan scorched badly. The scorched surface was difficult to clean using a normal consumer cleaning method. Cleaning with an industrial scotch pad showed scratches all over, and 304 layer of material can be removed if scrubbing is forced. Scrubbing the cooking surface of the PCP pan using the industrial scotch pad did not cause scratching.
• the PCP pan cooked faster than the 5-ply clad pan.
• the trout browned better in the PCP pan, and it was easy to clean.
• the 5-ply clad pan needed some scrubbing to clean.
• the meat was seared in the pan, then the pan was placed in the oven at 350 0 F for 10 minutes. It took 35 seconds for the PCP pan to sear the filet mignon to obtain the desired browning, while it took one minute in the 5-ply clad for same browning. Then both pans were put into the oven.
• the filet mignon cooked in the PCP pan had more juices because the PCP pan sears quicker, trapping in juices and moisture, and the meat tastes better.
• the filet mignon cooked in the 5-ply clad pan was slightly dry. The 5-ply clad pan was scorched during cooking and required scrubbing the surface, causing many scratches.
• the chicken stir-fried in the PCP pan did not stick because the PCP pan was very hot due to the excellent heat conductivity of the pan.
• the PCP pan seared the meat quickly so that the meat did not stick.
• the 5-ply clad pan was not as hot as the PCP pan due to its inferior heat conductivity, and the meat stuck badly.
• the 5-ply clad pan was scorched all over, and was difficult to clean.
• the pan needed to be soaked in hot water for hours before scrubbing the surface.
• pans Both pans were sprayed with same amount cooking oil.
• the pans were heated, and most of the oil was wiped off with a paper towel.
• the egg was dropped when the oil began steaming.
• the egg fried in the PCP pan did not stick.
• Table 3 shows the comparison of 10 in. PCP pans with 10 in. clad copper pans.
• Clad copper cookware is known to have the best heat conductivity in existing cookware. The same food was cooked in both pans. The pans were evaluated for preheat time, cooking time, whether the food stuck to the pan, and ease of cleaning.
• the PCP pan heated up faster, and the meat had better browning color.
• Examples 1 and 2 demonstrate the unique features of PCP cookware.
• the PCP pan has excellent heat conductivity, resulting in good cooking performance, as compared to the 5-ply clad stainless steel pan or the clad copper pan, which have lower heat conductivity.
• the unique features come from the multilayer coating that enables the use of soft, plain copper as the base material for cookware.
• the PCP cookware has high heat conductivity due to the use of copper. As a result, the pan heats incredibly quickly and evenly, also cools very rapidly. In addition, lower heat settings can be used while still maintaining excellent cooking.
• the multilayer coating is 5-7 times harder than that of 304 stainless steel. Therefore, PCP copper cookware is much more durable than 3-ply and 5-ply clad stainless cookware and copper clad cookware.
• the coating provides excellent scratch resistance, allowing the use of abrasive scotch grit without scratching.
• the cookware is safe for metal utensils, easy to clean, and has a long life.
• the cookware has excellent corrosion resistance and is tarnish-free. It can withstand high temperatures up to about 700 0 C. It is safe to use with salty or acidic-based food. It is dishwasher safe.
• PCP cookware has heat conductivity which is the same as pure copper, good corrosion resistance, high durability, excellent cooking properties, and easy cleaning. A long lasting, new plain copper cookware without tarnish becomes reality from this invention.

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• 2009
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