WO2010101009A1 - Unité de lentilles, procédé d'alignement d'une unité de lentilles et d'un capteur, dispositif de capture d'images, procédé de fabrication du dispositif de capture d'images, et unité de lentilles minces - Google Patents

Unité de lentilles, procédé d'alignement d'une unité de lentilles et d'un capteur, dispositif de capture d'images, procédé de fabrication du dispositif de capture d'images, et unité de lentilles minces Download PDF

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Publication number
WO2010101009A1
WO2010101009A1 PCT/JP2010/051946 JP2010051946W WO2010101009A1 WO 2010101009 A1 WO2010101009 A1 WO 2010101009A1 JP 2010051946 W JP2010051946 W JP 2010051946W WO 2010101009 A1 WO2010101009 A1 WO 2010101009A1
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WO
WIPO (PCT)
Prior art keywords
lens
lens unit
wafer
optical axis
unit
Prior art date
Application number
PCT/JP2010/051946
Other languages
English (en)
Japanese (ja)
Inventor
東吾 寺本
Original Assignee
コニカミノルタオプト株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by コニカミノルタオプト株式会社 filed Critical コニカミノルタオプト株式会社
Publication of WO2010101009A1 publication Critical patent/WO2010101009A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present invention relates to a lens unit, a method for aligning a lens unit and a sensor, an imaging device using the same, and a method for manufacturing the imaging device.
  • such a wafer lens is obtained by stacking and bonding a plurality of wafer lens arrays, cutting them into individual pieces, and attaching them to the sensor to make it small and high inclusive of sensors. Attention is also paid to the fact that imaging units with resolving power can be mass-produced.
  • alignment of such a wafer lens is a big problem. Especially when laminating multiple wafer lens arrays, the accuracy of optical axis alignment of micro lenses formed on each wafer and the accuracy of aligning wafer lens units that have already been laminated, bonded and cut with sensors are lenses. Since the device itself is very small, high alignment accuracy on the order of several ⁇ m is required.
  • a technique for optical axis alignment of a compound lens in which a resin lens is formed on a base lens as in Patent Document 1 is known.
  • a glass member optical lens
  • axial misalignment between the optical lens and the resin member is performed. It is intended to prevent and suppress transmission eccentricity based on axial deviation. (See paragraphs 0023, 0076, etc.).
  • the sensor and the lens which are particularly problematic in the wafer lens, are all the points to match the optical axis on the object side and the oblique body side of a single lens to be formed.
  • a general wafer lens is separated into pieces by cutting (dicing). Therefore, when such a cut lens is aligned with the optical axis of the sensor, the optical axes may be displaced due to the accuracy of dicing.
  • the technique of Patent Document 1 cannot be applied to the alignment between the wafer lens and the sensor.
  • the wafer lens when used as one part of an electronic device such as a digital camera, the wafer lens is used in combination with a light receiving sensor that receives transmitted light. Even if they match, it is difficult to form a desired image if the optical axis is deviated from the light receiving sensor. Therefore, when manufacturing a wafer lens for electronic equipment, alignment of the optical axis of the wafer lens and the light receiving sensor is also an important issue.
  • a main object of the present invention is to identify a decentering direction of a wafer lens, and to easily and surely match the optical axes of a wafer lens and a light receiving sensor, a lens unit, an imaging device, and a manufacturing method of the imaging device Is to provide.
  • a lens unit having a rectangular shape in a plan view in which a plurality of wafer lenses each having a lens part formed thereon are stacked on a glass substrate,
  • the optical axis of the lens unit is decentered with respect to the center of the glass substrate on a portion of the surface of the molding unit excluding the lens unit of at least one wafer lens of the plurality of wafer lenses.
  • a lens unit is provided, which is provided with an eccentricity identification mark for indicating the direction of the lens.
  • a resin molded part is formed on a glass substrate, and the optical axis of a rectangular lens unit in plan view in which a plurality of wafer lenses each having a lens part formed thereon are laminated, and the transmitted light of each wafer lens is transmitted.
  • a sign is formed,
  • An alignment method is provided.
  • a sensor unit including a light receiving sensor that receives incident light transmitted through the lens unit, and an imaging device comprising: The optical axis of the lens unit is decentered with respect to the center of the glass substrate on the surface of the molded part of the wafer lens located closest to the object side of the lens unit or the molded part of the wafer lens located closest to the imaging device.
  • Eccentric identification mark is provided to indicate the direction
  • an imaging apparatus characterized in that an optical axis of the lens unit and an optical axis of the light receiving sensor substantially coincide with each other.
  • a molded part made of resin is formed on the first glass substrate, a plurality of lens parts formed in a part thereof, and formed on the surface of the molded part, with respect to the center of the first glass substrate
  • a first wafer lens array provided with an eccentricity identification mark for indicating a direction in which the optical axis of the lens unit is eccentric, and a plurality of resin lens units on the second glass substrate.
  • a second wafer lens array provided, a stacking process of the first wafer lens array and the second wafer lens array, bonding, cutting, and generating a lens unit;
  • a plurality of resin molded parts are formed on a glass substrate, and a plurality of wafer lens arrays in which a plurality of lens parts are formed are laminated, and each lens having a rectangular shape in plan view is obtained by dicing.
  • the wafer lens unit used by cutting out into the unit At the time of dicing, in any of the glass substrates, at least two orthogonal cutting lines that can be confirmed from the outside are provided, and in an apparatus that cuts out individual lens units with a predetermined dimension based on the lines, In consideration of the amount of blade wear during dicing, the dimension between the reference side surface of each lens unit cut out and the reference line provided on the glass substrate is always constant.
  • a wafer lens unit is provided.
  • a resin molded part is formed on a glass substrate, and the optical axis of a rectangular lens unit in plan view in which a plurality of wafer lenses each having a lens part formed thereon are laminated, and the transmitted light of each wafer lens is transmitted.
  • a positioning method for matching with a predetermined position of a light receiving sensor for receiving light An identification mark is formed at a corner sandwiched between two reference side surfaces cut out of individual lens units on the surface of the molding portion of at least one wafer lens of the plurality of wafer lenses, A temporary fixing step of temporarily fixing the light receiving sensor; And a moving step of moving the light receiving sensor so as to coincide with a predetermined position while confirming two reference side surfaces of the lens unit with the identification mark while the light receiving sensor is temporarily fixed.
  • An alignment method is provided.
  • the surface of the molded part of the wafer lens is provided with an eccentricity identification mark for indicating the direction in which the optical axis of the lens part is eccentric with respect to the center of the glass substrate.
  • the eccentric direction of the optical axis of the lens unit can be easily identified, and the optical axis of the lens unit can be reliably and easily aligned with the optical axis of the eccentric sensor.
  • FIG. 6 is a diagram for explaining a subsequent process of FIG. 5.
  • 3 is a cross-sectional view for explaining a schematic configuration of a molded part of the wafer lens according to Example 1.
  • FIG. It is sectional drawing which shows the modification of FIG. (A) It is sectional drawing which shows schematic structure of the imaging device concerning preferable Example 2 of this invention, (b) It is a schematic top view of the sensor unit in the said imaging device.
  • 6 is a plan view illustrating a schematic configuration of a lens unit according to Embodiment 2.
  • FIG. FIG. 6 is a bottom view illustrating a schematic configuration of a lens unit according to Example 2.
  • FIG. 10 is a diagram for schematically explaining steps of an optical axis alignment method according to Example 2; 6 is a plan view showing a schematic configuration of a jig used in Example 2.
  • FIG. 10 is a diagram for schematically explaining steps of an optical axis alignment method according to Example 2; It is drawing for demonstrating the process of FIG. It is drawing for demonstrating the process of FIG. It is a top view which shows the wafer before the dicing process concerning Example 3.
  • FIG. 10 is a plan view showing a cut state of a wafer lens array according to Example 3.
  • FIG. 10 is a drawing for schematically explaining one step of an optical axis alignment method according to Example 3;
  • an imaging apparatus 1 is mainly composed of a lens unit 3, a sensor unit 5, and a spacer 7.
  • the lens unit 3 and the sensor unit 5 are composed of the lens unit 3, the sensor unit 5, and the spacer 7. It has a configuration of being interposed by a spacer 7.
  • the lens unit 3 includes wafer lenses 10 and 20 and a cover package 30, and the wafer lenses 10 and 20 are covered with the cover package 30 in a state where the wafer lens 10 is laminated and bonded onto the wafer lens 20. Yes.
  • the wafer lens 10 has a glass substrate 12 having a flat plate shape.
  • a molding part 14 is formed on the upper part of the glass substrate 12, and a molding part 16 is formed on the lower part of the glass substrate 12.
  • a convex lens portion 14a having a convex shape is formed at a substantially central portion of the molded portion 14, and the molded portion 14 has an inclined portion 14b inclined upward from the convex lens portion 14a toward the outer peripheral portion.
  • a concave lens portion 16a having a concave shape is formed at a substantially central portion of the molded portion 16.
  • a peripheral portion 16b of the concave lens portion 16a is substantially flat.
  • the wafer lens 20 also has a glass substrate 22 having a flat plate shape, and formed portions 24 and 26 are formed on the upper and lower portions of the glass substrate 22, respectively.
  • a concave lens portion 24a having a concave shape is formed at a substantially central portion of the molded portion 24.
  • a peripheral portion 24b of the concave lens portion 24a is substantially flat.
  • a convex lens portion 26a having a convex shape is formed at a substantially central portion of the molding portion 26.
  • a peripheral portion 26b of the convex lens portion 26a is substantially flat.
  • the molding parts 14, 16, 24, 26 are light transmissive at the part where the photocurable resin is molded, and in particular, convex lens parts in the molding parts 14, 16, 24, 26 14a, the concave lens portion 16a, the concave lens portion 24a, and the convex lens portion 26a are lens effective portions that exhibit a lens function (optical function).
  • the convex lens portion 14a, the concave lens portion 16a, the concave lens portion 24a, and the convex lens portion 26a are concentric as shown in FIG. These lens portions are stacked vertically so that their optical axes PA coincide with each other.
  • the lens unit 3 on which the wafer lenses 10 and 20 are laminated is a plurality of wafers in which the above-described plurality of convex lens portions 14a and 26a and concave lens portions 16a and 24a are formed on the front and back surfaces of a glass substrate. After the lens arrays are stacked and joined, they are cut and separated into a rectangular shape in plan view.
  • the optical axis PA of the lens portion 14 a is located with respect to the center 12 ⁇ / b> A of the glass substrate 12 on the surface of the molded portion 14 of the wafer lens 10 except for the lens portion 14 a.
  • An eccentricity identification mark 14c is provided for indicating an eccentric direction.
  • the center of the sensor 40 is generally arranged on the package 50 of the sensor unit 5 in an eccentric manner as viewed from the end surfaces 50a and 50b serving as the reference of the package 50.
  • a wafer lens array is laminated.
  • the cutting position may be cut at a slightly eccentric position in advance so as to correspond to the eccentric sensor 40 portion.
  • the eccentricity seen from the end face 50a and the end face 50b mentioned here means that, for example, when there is an end face 50a and an end face 50c opposite to the end face 50a, the center of the sensor 40 is on the 50a side with respect to the midline of these end faces 50a, 50c.
  • the center of the sensor 40 is biased toward the 50b side with respect to the midline of these end surfaces 50, 50d. Or the case where it is biased to the 50d side.
  • the optical axis 40A of the sensor 40 when the optical axis 40A of the sensor 40 is eccentric with respect to the center 50A of the package 50 (H1 ⁇ H2, V1 ⁇ V2), as shown in FIG.
  • the optical axis PA of the lens portion 14a is also decentered from the center 12A of the glass substrate 12 and cut (H11 ⁇ H12, V11 ⁇ V12).
  • the lens portion 14a since the lens portion 14a is small, it may be difficult to determine which side is decentered and cut.
  • by displaying the eccentricity identification mark 14c When installing, there is an advantage that it is possible to prevent the wrong installation direction.
  • the eccentricity identification mark 14c is provided on the surface of the corner 12c formed by two adjacent side surfaces 12a and 12b among the four side surfaces forming the glass substrate 12.
  • the two adjacent side surfaces 12a and 12b are surfaces corresponding to the end surfaces 50a and 50b, respectively, which serve as a reference for alignment of the package 50 of the sensor unit 5. Therefore, when the lens unit 3 is aligned with the sensor unit 5, the sensor unit 5 is aligned by aligning the side surfaces 12a and 12b and the end surfaces 50a and 50b in parallel with the eccentricity identification mark 14c interposed therebetween. And the eccentric direction of the lens unit 3 can be easily matched.
  • the eccentricity identification mark 14c is formed in a concave shape so as to be recessed with respect to the surface of the molded part 14.
  • the eccentric identification mark 14c is preferably formed simultaneously with the molding of the lens portion 14a.
  • a molding die in which a convex portion corresponding to the eccentricity identification mark 14c is formed at a predetermined position of the molding die for molding the lens portion 14a may be used.
  • the eccentricity identification mark 14c is formed in a concave shape, but may be formed in a convex shape so as to protrude from the surface of the molding portion 14.
  • the eccentric identification mark 14c has a circular shape in plan view, this shape can also be changed as appropriate.
  • the cover package 30 has a bottomless box shape (the lower part is opened), and is composed of one top plate portion 32 and four side plate portions 34 each having a square shape. ing.
  • a circular opening 32 a is formed at the center of the top plate 32.
  • an eccentricity identification mark 35 is formed in a concave shape like the eccentricity identification mark 14c of the lens unit 3.
  • the eccentricity identification mark 35 is formed by a corner (an adjacent two side surfaces 30a and 30a) where the eccentricity identification mark 35 and the eccentricity identification mark 14c correspond to each other. It is arranged at the corner 30b). Therefore, the position of the eccentricity identification mark 14 c of the lens unit 3 covered by covering the cover package 30 can be seen from the outside by the eccentricity identification mark 35 of the cover package 30.
  • the eccentricity identification mark 35 may be convex or formed by printing or the like.
  • three notches 34a are formed in two side plate portions 34 adjacent to each other among the four side plate portions 34 (the corresponding portions are not formed in the remaining two side plate portions 34).
  • the sensor unit 5 mainly includes a sensor 40, a package 50, and a cover glass 60.
  • the sensor 40 is a light receiving sensor that receives light transmitted through the lens unit 3 and can photoelectrically convert the received light to output an electrical signal to an external device (not shown).
  • the package 50 has a bottomed box shape and is open at the top. As shown in FIG. 1B, a sensor 40 is disposed at a substantially central portion of the package 50.
  • the cover glass 60 is provided as a lid on the top of the package 50, and the sensor 40 is sealed in a space surrounded by the package 50 and the cover glass 60.
  • the spacer 7 is interposed between the molding portion 26 of the lens unit 3 and the cover glass 60 of the sensor unit 5, and a certain distance is provided between the lens unit 3 and the sensor unit 5. Is granted.
  • the spacer 7 has a rectangular frame shape, and two sides adjacent to each other among the four sides and the projections 7a are formed on the corners thereof.
  • the protrusion 7a protrudes outside the cover package 30, and more specifically, protrudes (exposes) from the notch 34a.
  • An IR cut filter 70 is provided inside the spacer 7.
  • the IR cut filter 70 is disposed above the cover glass 60 and shields infrared rays that are to enter the sensor 40.
  • the spacer 7 on which the IR cut filter 70 is mounted in advance is placed on the flat base 100.
  • the spacer 7 is positioned at a predetermined position.
  • an L-shaped jig 110 (only a part thereof is illustrated in FIG. 5).
  • each protrusion 7 a of the spacer 7 is brought into contact with the jig 110, and the spacer 7 is placed on the base 100 corresponding to the jig 110. Temporarily fix to.
  • the lens unit 3 is aligned with the spacer 7 by using a positioning jig 120 and bonded and fixed.
  • the lens unit 3 is previously covered with the cover package 30 so that the eccentricity identification mark 14c of the lens unit 3 and the eccentricity identification mark 35 of the cover package 30 face each other.
  • the jig 120 has a tapered shape with a tapered tip, and the jig 120 has a tapered portion 120a.
  • a suction part 120 b suction hole capable of sucking the lens unit 3 is formed at the center of the jig 120.
  • the jig 120 is movable in the front-rear and left-right directions (on a two-dimensional plane) and in the up-down direction (see arrows in FIGS. 5 and 6).
  • the jig 120 is disposed opposite to the molding portion 14 of the lens unit 3 so that the tapered portion 120a and the inclined portion 14b are brought into contact with each other.
  • the jig 120 is moved in the front-rear and left-right directions and the vertical direction, and the inclined portion of the lens unit 3 is brought into contact with the position of the jig 120.
  • the lens unit 3 is moved to a predetermined position of the spacer 7 by the adjusting action due to the contact, and the lens unit 3 is adhered and fixed to the spacer 7 at the predetermined position.
  • the lens unit 3 is adjusted to an appropriate position (predetermined position) corresponding to the position of the jig 120 on the spacer 7.
  • the protrusion 7a of the spacer 7 since the notch 34a is formed in the cover package 30 of the lens unit 3, the protrusion 7a of the spacer 7 remains in contact with the jig 110 while being exposed (projected) from the notch 34a. Retained. As a result, the protrusion 7a of the spacer 7 becomes a reference for temporary fixing, and the temporary fixing position of the spacer 7 is maintained.
  • the lens unit 3 may be bonded and fixed to the spacer 7 with the cover package 30 removed.
  • the eccentricity identification mark 14 c of the lens unit 3 and the eccentricity identification mark 35 of the cover package 30 face each other, and the notch 34 a of the cover package 30 is attached to the spacer 7.
  • the cover package 30 may be covered from above the wafer lenses 10 and 20 so as to be fitted to the protrusion 7a.
  • the spacer 7 (with the lens unit 3 bonded and fixed) is bonded and fixed to the sensor unit 5 in the same manner as the lens unit 3 is bonded and fixed to the spacer 7.
  • the sensor unit 5 is mounted on the base 100.
  • the base 100 has an L-shaped jig 130 for positioning the sensor unit 5 at a predetermined position on the base when viewed from the object side.
  • the end surfaces of the package 50 of the sensor unit 5 (the two adjacent end surfaces 50a and 50b) are brought into contact with the jig 130 to fix the sensor unit 5 as shown in FIG. Temporarily fix at a predetermined position C on the base 100 corresponding to the tool 130.
  • the spacer 7 is aligned with the sensor unit 5 by using the alignment jig 120 again, and is bonded and fixed.
  • the jig 120 is moved back and forth, left and right, and up and down.
  • the lens unit 3 is moved to a predetermined position corresponding to the sensor unit 5 (sensor 40), and the spacer 7 is bonded and fixed to the sensor unit 5 at the predetermined position.
  • the eccentricity identification mark 35 provided on the cover package 30 is used as an index, and the corner 30b (two side faces 30a, The lens unit 3 is moved to a predetermined position by the jig 120 with 30a) facing the corner of the jig 130 (see FIG. 16).
  • the spacer 7 is gradually pressed against the cover glass 60 as the jig 120 is lowered.
  • 14b is finely moved so as to be completely fitted to the tapered portion 120a of the jig 120, and the lens unit 3 is positioned on the sensor unit 5 at an appropriate position (predetermined position) according to the arrangement position of the jig 120, Thereby, the optical axis PA of the wafer lenses 10 and 20 of the lens unit 3 and the optical axis 40A of the sensor 40 of the sensor unit 5 coincide.
  • the spacer 7 may be adhered and fixed to the sensor unit 5 with the cover package 30 removed from the lens unit 3.
  • the eccentricity identification mark 14c provided on the lens unit 3 is used as an index, and the corner 12c (two side surfaces) provided with the eccentricity identification mark 14c is used. 12a, 12b) is directed to the corner of the jig 130 (see FIG. 16), and the lens unit 3 is moved to a predetermined position by the jig 120.
  • the cover package 30 is placed above the wafer lenses 10 and 20 so that the notch 34 a of the cover package 30 is fitted to the protrusion 7 a of the spacer 7. Cover it.
  • the eccentricity identification mark 14c is provided on the surface of the molded part 14 of the wafer lens 10 except for the lens part 14a. However, as shown in FIG. It is good also as what provides the eccentric identification mark 27 in the part except the lens part 26a among the surfaces. In this case, since the position of the eccentricity identification mark 27 can be seen from the back side even when the cover package 30 is covered, it is not necessary to provide the eccentricity identification mark 35 on the cover package 30.
  • the optical axis PA of the wafer lenses 10 and 20 is not necessarily the light of the sensor 40. It is not limited to what is aligned with the shaft 40A. That is, depending on the specifications of the imaging apparatus, the optical axis PA of the wafer lenses 10 and 20 may be aligned with a predetermined position that is shifted from the optical axis 40A of the sensor 40.
  • the optical axis 40A of the sensor 40 refers to the diagonal center of the effective pixel area that can actually be used for photographing by the imaging device in the pixel area of the light receiving sensor.
  • a photo-curing resin adhesive is applied in advance between them, and when the lens unit 3 is positioned, it is directed toward the application site. Light irradiation.
  • the optical axis PA of the wafer lenses 10 and 20 of the lens unit 3 and the optical axis 40A of the sensor 40 of the sensor unit 5 can be aligned via the spacer 7.
  • the lens unit 3 and the sensor unit 5 are positioned using the jig 130 and the jig 120, they may be positioned by the following method instead.
  • the corners 12c (two adjacent side surfaces 12a and 12b) provided with the eccentricity identification mark 14c face the corners of the jig 130, and the protrusions 7a of the spacer 7 abut on the jig 130, respectively.
  • the lens unit 3 is moved to the position using the jig 120. Then, the jig 120 may be lowered at that position, and the spacer 7 may be bonded and fixed to the sensor unit 5.
  • the lens unit 3 and the sensor unit 5 are positioned using the jig 130.
  • the projection 7a of the spacer 7 is brought into contact with the jig 130.
  • the portion with which the spacer projection 7a comes into contact is constituted by a jig separate from the jig 130. You may do it.
  • the inclined portion for bringing the positioning jig 120 into contact with the molding portion 14 of the wafer lens 10 disposed on the most object side among the wafer lenses 10 and 20 of the lens unit 3. 14b is formed, and the arrangement position of the lens unit 3 is positioned while the jig 120 is brought into contact with the inclined portion 14b with reference to the inclined portion 14b. Therefore, unlike the case where the optical axis PA of the wafer lens 10, 20 and the optical axis 40 A of the sensor 40 are aligned with respect to the cut surface (side surface) of the wafer lens 10, 20, the wafer lens 10, 20 is manufactured.
  • the optical axis PA of the wafer lenses 10 and 20 and the optical axis 40A of the sensor 40 can be made to coincide with each other without depending on the dicing accuracy.
  • the cover package 30 is provided with an eccentricity identification mark 35 corresponding to the eccentricity identification mark 14 c of the lens unit 3, and when the lens unit 3 is moved while being sucked by the jig 120, the eccentricity identification of the cover package 30 is performed. Since the spacer 7 is adhered and fixed to the sensor unit 5 using the mark 35 as an index, the eccentric direction of the optical axis PA of the lens unit 3 can be easily identified. Then, the optical axis PA of the lens unit 3 can be reliably and easily aligned with the optical axis 40A of the sensor 40 provided eccentrically with respect to the center 50A of the package 50.
  • the inclined part 14b is inclined upward from the convex lens part 14a toward the outer peripheral part, and the top part of the inclined part 14b is higher than the convex lens part 14a.
  • a molded part 14 as shown in FIG. 8 may be formed.
  • the inclined part 14b is inclined downward from the convex lens part 14a toward the outer peripheral part, and the inclined part 14b is lower than the convex lens part 14a.
  • the height (thickness) of the resin of the molding part 14 is determined by the height of the inclined part 14b and the height of the convex lens part 14a, but in the molding part 14 of FIG.
  • the height (thickness) of the resin of the molded portion 14 is determined by either the height of the convex lens portion 14a.
  • the configuration of FIG. 7 is more advantageous in reducing the thickness of the resin of the molded portion 14, and if the thickness of the resin is reduced, the amount of cure shrinkage of the resin during molding can be reduced. It is possible to form a highly effective lens effective portion having excellent properties.
  • the convex lens portion 14a is exposed and protrudes on the same plane, the convex lens portion 14a is likely to be scratched or damaged during handling or the like.
  • the convex lens portion 14a can be included at a height of 14b, and it is possible to effectively prevent the convex lens portion 14a from being damaged or damaged during handling.
  • Example 2 The second embodiment is mainly different from the first embodiment in the following points, and is otherwise the same as the first embodiment.
  • the inclined portion 14 b and the spacer 7 (including the IR cut filter 70) in the molding portion 14 of the wafer lens 10 are not provided.
  • a spacer portion 26 c is formed in the molding portion 26 of the wafer lens 20.
  • the spacer portion 26c includes an inner inclined portion 26d, an adhesive portion 26e, and an outer inclined portion 26f, and is higher than the thickness of the convex lens portion 26a.
  • the inner inclined portion 26d is inclined downward from the convex lens portion 26a toward the outer periphery.
  • the bonding portion 26 e is flat and serves as a bonding surface that is bonded to the cover glass 60 of the sensor unit 5.
  • the outer inclined portion 26f is inclined upward from the adhesive portion 26e toward the outer periphery.
  • the end surfaces (two end surfaces 50a and 50b) of the package 50 of the sensor unit 5 are brought into contact with the jig 130, and the sensor unit 5 is temporarily fixed at a predetermined position C. To do.
  • the lens unit 3 is aligned with the sensor unit 5 by using the alignment jig 150, and is bonded and fixed.
  • the lens unit 3 is previously covered with the cover package 30 so that the eccentricity identification mark 14c of the lens unit 3 and the eccentricity identification mark 35 of the cover package 30 face each other.
  • the jig 150 is a member having a circular shape when viewed from the object side, as in FIG. 1B, and the side surface 150 a is in contact with the inclined portion 26 f in the molding portion 26 of the wafer lens 20. Inclined as possible.
  • the sensor unit 5 is temporarily fixed with the two side surfaces 30 a and 30 a forming the corner 30 b provided with the eccentricity identification mark 35 of the cover package 30 facing the jig 150.
  • the lens unit 3 is placed on the top. Then, the spacer portion 26c in the molding portion 26 of the lens unit 3 is pressed toward the jig 150, and the lens unit 3 is bonded and fixed to the sensor unit 5 at the predetermined position.
  • the lens unit 3 is positioned at an appropriate position (predetermined position) by the jig 150 on the sensor unit 5 while the inclined portion 26f of the spacer portion 26c and the side surface 150a of the jig 150 are in contact with each other.
  • the optical axes PA of the wafer lenses 10, 20 coincide with the optical axis 40 A of the sensor 40 of the sensor unit 5.
  • a photo-curing resin adhesive is applied in advance between the bonding portion 26e of the molding portion 26 and the cover glass 60, and the lens unit 3 When positioning is performed, light may be irradiated toward the application site.
  • the optical axis PA of the wafer lenses 10 and 20 of the lens unit 3 and the optical axis 40A of the sensor 40 of the sensor unit 5 can be matched.
  • the lens unit 3 may be bonded and fixed to the sensor unit 5 with the cover package 30 removed from the lens unit 3.
  • the eccentricity identification mark 14c provided on the lens unit 3 is used as an index
  • the corner 12c (two side surfaces 12a and 12b) provided with the eccentricity identification mark 14c is a jig.
  • the lens unit 3 is moved to a predetermined position while facing the 150 side (see FIG. 14).
  • the cover package 30 may be covered from above the wafer lenses 10 and 20.
  • the lens unit 3 and the sensor unit 5 are bonded and fixed in this manner and then finally covered with the cover package 30, it is not necessary to provide the eccentricity identifying mark 35 on the cover package 30.
  • the eccentricity identification mark 14c is provided on the surface of the molded part 14 of the wafer lens 10 except for the lens part 14a. However, as shown in FIG. It is good also as what provides the eccentric identification mark 27 in the part except the lens part 26a among the surfaces. In this case, since the position of the eccentricity identification mark 27 can be seen from the back side even when the cover package 30 is covered, it is not necessary to provide the eccentricity identification mark 35 on the cover package 30.
  • the cover package 30 is provided with the eccentricity identification mark 35 corresponding to the eccentricity identification mark 14c of the lens unit 3, and the lens unit 3 is used as the sensor unit 5 with the eccentricity identification mark 35 as an index. Since the direction of eccentricity of the optical axis PA of the lens unit 3 can be easily identified, the lens unit 3 is attached to the optical axis 40A of the sensor 40 provided eccentric to the center 50A of the package 50. The optical axis PA can be aligned with certainty and easily aligned.
  • the wafer lens 20 may be omitted and the lens unit 3 may be configured by the wafer lens 10 and the cover package 30.
  • the wafer lens 10 may be omitted.
  • the lens unit 3 may be constituted by the wafer lens 20 and the cover package 30.
  • the optical axis PA of the wafer lenses 10 and 20 is not necessarily limited. It is not limited to what is aligned with the optical axis 40A of the sensor 40. That is, depending on the specifications of the imaging apparatus, the optical axis PA of the wafer lenses 10 and 20 may be aligned with a predetermined position that is shifted from the optical axis 40A of the sensor 40. (Example 3) For high-precision alignment between the sensor and the lens, which is a particular problem with wafer lenses, the general wafer lens is divided into pieces by cutting (dicing).
  • the optical axes are misaligned depending on the dicing accuracy when the optical axes are matched with each other.
  • FIG. 17 shows the wafer lens array W before dicing according to the present invention.
  • Two orthogonal straight lines m1 and m2, which are processing references, are provided in advance on the glass substrate outside the range that becomes a single lens unit by cutting.
  • the cutting reference lines m1 and m2 are shown by two lines orthogonal at the periphery, but are shown by four straight lines n1 to n4 orthogonal at the center as shown in FIG. 17B. May be. In this way, the actual length of the straight line becomes longer, and it is possible to adjust the parallelism with the rotation axis of the blade of the dicing more accurately.
  • FIG. 18 is used to explain blade wear, which is one of the problems during dicing.
  • the blade thickness gradually becomes thinner with processing.
  • the blade width changes in order to scrape the surface and bring new abrasive grains to the surface each time. Therefore, if the processing is continued in the same manner from the beginning, the outer diameter of the lens of the cut piece is increased by the amount that the blade width is thin as shown in FIG. 18C (L1 ⁇ L2).
  • symbol B1 indicates an initial blade
  • symbol B2 indicates a worn blade
  • 18A shows a part of the wafer lens array before cutting
  • FIG. 18B shows the individual wafer lens when it is cut by the initial blade B1
  • FIG. 18C shows wear. An individual wafer lens when cut by the blade B2 is shown.
  • the adjacent two surfaces 12a and 12b serving as the reference are specified in advance for the individual lens, and the distance LWv from the cutting reference line of the glass substrate to 12a and 12b, A method is proposed in which LWh is always processed to be constant regardless of blade wear.
  • the side surface Ba on one side of the blade is always aligned with the positions of LWv and LWh which are the reference for cutting.
  • the coordinates are returned to the origin, and correction is made so that there is no deviation from the cutting reference line.
  • the optical axis when the individual piece is first viewed from the top surface, even if the optical axis is at the center of the ⁇ diagonal line (rectangular diagonal line), the optical axis gradually deviates from the diagonal center.
  • an identification mark 14c is provided in advance in the corner 12c sandwiched between the reference side surfaces 12a and 12b. Therefore, even after cutting into individual pieces, the reference side surface can be easily identified by looking at the identification mark 14c, and the position of the optical axis PA can be known.
  • FIG. 19 shows a method of bonding and fixing the lens unit 3 thus cut out to the sensor unit 5 with the optical axis aligned.
  • the jig 120 is moved back and forth, left and right, and up and down.
  • the lens unit 3 is moved to a predetermined position corresponding to the sensor unit 5 (sensor 40), and the spacer 7 (adhered and fixed to the lower surface of the lens unit 3 in advance by a predetermined means) is detected at the predetermined position. Glue and fix to unit 5.
  • the two side surfaces 12 a and 12 b of the lens unit 3 are positioned so that the identification mark 14 c comes to the corner of the jig 130 with the cover package 30 removed.
  • the lens unit 3 is moved to a predetermined position by the jig 120 so as to contact the reference surfaces 130a and 130b of the jig 130 (see FIG. 19A).
  • the means for fixing the sensor unit to the jig 130 is the same as in the first and second embodiments, and is omitted here.
  • the processing method at the time of dicing is devised, and the position from the end surface of the lens unit 3 to the optical axis is made constant regardless of blade wear, so that the alignment with the sensor 40 can be performed with high accuracy. I showed that I can do it.
  • the wafer lens array is laminated, and then the individual lens units 3 are formed by dicing.
  • the wafer lens array is diced into individual wafer lenses.
  • a plurality of objects may be incorporated into the lens barrel to form a lens unit.
  • the identification mark 14c shown in the third embodiment is put in each wafer lens in advance, so that even after the wafer is separated into a single wafer lens, the identification mark 14c is combined and incorporated so that the light is not decentered. It is possible to align the axes.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Lens Barrels (AREA)

Abstract

La présente invention concerne une unité de lentilles, la direction de décentrage d'une lentille mince pouvant être identifiée, et l'axe optique de la lentille mince et celui d'un capteur de réception de lumière pouvant être mis en correspondance de façon simple et fiable. L'invention concerne également un dispositif de capture d'images, un procédé de fabrication du dispositif de capture d'images, et une unité de lentilles minces. Une unité de lentilles (3), qui comporte une pluralité de lentilles minces stratifiées (10) dont chacune comporte une section moule en résine (14) formée sur un substrat en verre (12) et une section lentille (14a) formée sur une partie de la section moule, et qui possède une forme rectangulaire dans la vue en plan, est dotée d'un indicateur d'identification de décentrage (14c) qui indique la direction dans laquelle l'axe optique (PA) de la section lentille (14a) est décentré par rapport au centre du substrat en verre (12), sur la surface de la section moule (14) de la lentille mince (10), à l'exception de la section lentille (14a).
PCT/JP2010/051946 2009-03-02 2010-02-10 Unité de lentilles, procédé d'alignement d'une unité de lentilles et d'un capteur, dispositif de capture d'images, procédé de fabrication du dispositif de capture d'images, et unité de lentilles minces WO2010101009A1 (fr)

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JP2009047836 2009-03-02

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Cited By (6)

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Publication number Priority date Publication date Assignee Title
JP2012123025A (ja) * 2010-12-06 2012-06-28 Sony Corp 電子カメラ
JP2013231879A (ja) * 2012-04-28 2013-11-14 Nidec Sankyo Corp レンズ駆動装置の製造方法、およびレンズ駆動装置
CN105301732A (zh) * 2014-06-20 2016-02-03 宁波舜宇光电信息有限公司 一种监控模组的偏心调整方法及装置
WO2019207739A1 (fr) * 2018-04-26 2019-10-31 オリンパス株式会社 Dispositif d'imagerie, endoscope et procédé de fabrication de dispositif d'imagerie
EP3851882A4 (fr) * 2018-10-24 2021-11-03 Ningbo Sunny Opotech Co., Ltd. Lentille optique, module de caméra, procédé d'assemblage de celui-ci, et équipement terminal correspondant
EP4044576A4 (fr) * 2019-10-29 2022-12-14 Ningbo Sunny Opotech Co., Ltd. Module de caméra, objectif avec marque et son procédé de fabrication, et procédé d'assemblage d'un module de caméra extra grand angle

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Publication number Priority date Publication date Assignee Title
JPH0441220A (ja) * 1990-06-06 1992-02-12 Daihatsu Motor Co Ltd プレス成形装置
JPH0547047A (ja) * 1991-08-12 1993-02-26 Canon Inc 光記録媒体用基板製造用スタンパー
JP2006309121A (ja) * 2005-03-30 2006-11-09 Fujinon Corp 位置決め構造
JP2007158751A (ja) * 2005-12-06 2007-06-21 Hitachi Maxell Ltd 撮像装置及びその製造方法
WO2008153102A1 (fr) * 2007-06-14 2008-12-18 Aji Co., Ltd. Procédé de moulage, procédé de production de lentille, appareil de moulage, procédé de production de poinçonneuse, appareil de production de gabarit, système de production de poinçonneuse et appareil de production de poinçonneuse

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0441220A (ja) * 1990-06-06 1992-02-12 Daihatsu Motor Co Ltd プレス成形装置
JPH0547047A (ja) * 1991-08-12 1993-02-26 Canon Inc 光記録媒体用基板製造用スタンパー
JP2006309121A (ja) * 2005-03-30 2006-11-09 Fujinon Corp 位置決め構造
JP2007158751A (ja) * 2005-12-06 2007-06-21 Hitachi Maxell Ltd 撮像装置及びその製造方法
WO2008153102A1 (fr) * 2007-06-14 2008-12-18 Aji Co., Ltd. Procédé de moulage, procédé de production de lentille, appareil de moulage, procédé de production de poinçonneuse, appareil de production de gabarit, système de production de poinçonneuse et appareil de production de poinçonneuse

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012123025A (ja) * 2010-12-06 2012-06-28 Sony Corp 電子カメラ
JP2013231879A (ja) * 2012-04-28 2013-11-14 Nidec Sankyo Corp レンズ駆動装置の製造方法、およびレンズ駆動装置
CN105301732A (zh) * 2014-06-20 2016-02-03 宁波舜宇光电信息有限公司 一种监控模组的偏心调整方法及装置
WO2019207739A1 (fr) * 2018-04-26 2019-10-31 オリンパス株式会社 Dispositif d'imagerie, endoscope et procédé de fabrication de dispositif d'imagerie
US11412113B2 (en) 2018-04-26 2022-08-09 Olympus Corporation Image pickup apparatus, endoscope, and manufacturing method of image pickup apparatus
EP3851882A4 (fr) * 2018-10-24 2021-11-03 Ningbo Sunny Opotech Co., Ltd. Lentille optique, module de caméra, procédé d'assemblage de celui-ci, et équipement terminal correspondant
EP4044576A4 (fr) * 2019-10-29 2022-12-14 Ningbo Sunny Opotech Co., Ltd. Module de caméra, objectif avec marque et son procédé de fabrication, et procédé d'assemblage d'un module de caméra extra grand angle

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