CN101852908B - 晶圆级镜头模组阵列 - Google Patents
晶圆级镜头模组阵列 Download PDFInfo
- Publication number
- CN101852908B CN101852908B CN200910301190XA CN200910301190A CN101852908B CN 101852908 B CN101852908 B CN 101852908B CN 200910301190X A CN200910301190X A CN 200910301190XA CN 200910301190 A CN200910301190 A CN 200910301190A CN 101852908 B CN101852908 B CN 101852908B
- Authority
- CN
- China
- Prior art keywords
- aligning structure
- array
- wafer
- aligning
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003491 array Methods 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 16
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- 125000006850 spacer group Chemical group 0.000 abstract 2
- 239000003292 glue Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0075—Arrays characterized by non-optical structures, e.g. having integrated holding or alignment means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/1469—Assemblies, i.e. hybrid integration
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lens Barrels (AREA)
- Optical Elements Other Than Lenses (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910301190XA CN101852908B (zh) | 2009-03-30 | 2009-03-30 | 晶圆级镜头模组阵列 |
US12/576,333 US7969656B2 (en) | 2009-03-30 | 2009-10-09 | Wafer level lens module array with spacer array |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910301190XA CN101852908B (zh) | 2009-03-30 | 2009-03-30 | 晶圆级镜头模组阵列 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101852908A CN101852908A (zh) | 2010-10-06 |
CN101852908B true CN101852908B (zh) | 2013-03-27 |
Family
ID=42783904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910301190XA Expired - Fee Related CN101852908B (zh) | 2009-03-30 | 2009-03-30 | 晶圆级镜头模组阵列 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7969656B2 (zh) |
CN (1) | CN101852908B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102540383B (zh) * | 2010-12-16 | 2016-03-09 | 鸿富锦精密工业(深圳)有限公司 | 镜头模组制造方法 |
JP2013007969A (ja) * | 2011-06-27 | 2013-01-10 | Sharp Corp | 撮像レンズ、レンズアレイ、撮像レンズの製造方法、および撮像モジュール |
CN103901574B (zh) * | 2012-12-27 | 2017-06-23 | 奇景光电股份有限公司 | 晶片级装置以及晶片级镜头模块 |
US9625684B2 (en) | 2013-05-09 | 2017-04-18 | Google Technology Holdings LLC | Lens laminate and method |
CN103676066B (zh) * | 2013-12-06 | 2016-08-24 | 瑞声声学科技(苏州)有限公司 | 镜头及其制造方法 |
CN205826947U (zh) * | 2016-05-27 | 2016-12-21 | 瑞声声学科技(苏州)有限公司 | 镜头 |
WO2021147097A1 (zh) * | 2020-01-23 | 2021-07-29 | 杭州芯格微电子有限公司 | 相机模块 |
CN112882175B (zh) * | 2021-01-20 | 2022-04-29 | 拾斛科技(南京)有限公司 | 晶圆级镜头模组阵列组装结构、镜头模组及其生产方法 |
EP4332642A1 (en) * | 2022-08-29 | 2024-03-06 | Schott Ag | Structured substrate, method for manufacturing the structured substrate, and use of the structured substrate |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6324010B1 (en) * | 1999-07-19 | 2001-11-27 | Eastman Kodak Company | Optical assembly and a method for manufacturing lens systems |
CN1467524A (zh) * | 2002-06-27 | 2004-01-14 | 奥林巴斯光学工业株式会社 | 摄像透镜单元和摄像装置及其制造方法 |
CN101191885A (zh) * | 2006-11-24 | 2008-06-04 | 鸿富锦精密工业(深圳)有限公司 | 阵列式相机模组 |
CN101339284A (zh) * | 2007-07-06 | 2009-01-07 | 精工爱普生株式会社 | 透镜阵列、行头、以及使用它们的图像形成装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8259395B2 (en) * | 2009-01-15 | 2012-09-04 | Kabushiki Kaisha Toshiba | Erect life-size lens array |
-
2009
- 2009-03-30 CN CN200910301190XA patent/CN101852908B/zh not_active Expired - Fee Related
- 2009-10-09 US US12/576,333 patent/US7969656B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6324010B1 (en) * | 1999-07-19 | 2001-11-27 | Eastman Kodak Company | Optical assembly and a method for manufacturing lens systems |
CN1467524A (zh) * | 2002-06-27 | 2004-01-14 | 奥林巴斯光学工业株式会社 | 摄像透镜单元和摄像装置及其制造方法 |
CN101191885A (zh) * | 2006-11-24 | 2008-06-04 | 鸿富锦精密工业(深圳)有限公司 | 阵列式相机模组 |
CN101339284A (zh) * | 2007-07-06 | 2009-01-07 | 精工爱普生株式会社 | 透镜阵列、行头、以及使用它们的图像形成装置 |
Non-Patent Citations (1)
Title |
---|
JP特开2003-195008A 2003.07.09 |
Also Published As
Publication number | Publication date |
---|---|
US20100246000A1 (en) | 2010-09-30 |
CN101852908A (zh) | 2010-10-06 |
US7969656B2 (en) | 2011-06-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SANYING ULTRA-PRECISION PHOTOELECTRIC (JINCHENG) C Free format text: FORMER OWNER: HONGFUJIN PRECISE INDUSTRY (SHENZHEN) CO., LTD. Effective date: 20130507 Free format text: FORMER OWNER: HONGFUJIN PRECISE INDUSTRY CO., LTD. Effective date: 20130507 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518109 SHENZHEN, GUANGDONG PROVINCE TO: 048026 JINCHENG, SHAANXI PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130507 Address after: 048026 No. 1216 orchid Road, Jincheng Economic Development Zone, Shanxi, China Patentee after: Sanyingchao Precision Photoelectric (Jincheng) Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Patentee before: Hon Hai Precision Industry Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130327 Termination date: 20170330 |
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CF01 | Termination of patent right due to non-payment of annual fee |