WO2010087433A1 - Appareil de contrôle de trou débouchant - Google Patents

Appareil de contrôle de trou débouchant Download PDF

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Publication number
WO2010087433A1
WO2010087433A1 PCT/JP2010/051217 JP2010051217W WO2010087433A1 WO 2010087433 A1 WO2010087433 A1 WO 2010087433A1 JP 2010051217 W JP2010051217 W JP 2010051217W WO 2010087433 A1 WO2010087433 A1 WO 2010087433A1
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WO
WIPO (PCT)
Prior art keywords
pad
labeling
area
hole
image
Prior art date
Application number
PCT/JP2010/051217
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English (en)
Japanese (ja)
Inventor
昌年 笹井
Original Assignee
株式会社メガトレード
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Filing date
Publication date
Application filed by 株式会社メガトレード filed Critical 株式会社メガトレード
Priority to CN2010800062506A priority Critical patent/CN102301225A/zh
Publication of WO2010087433A1 publication Critical patent/WO2010087433A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10024—Color image
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]

Definitions

  • the present invention relates to a through-hole inspection apparatus capable of inspecting the position of a through-hole formed in a pad of a printed circuit board.
  • a through hole for mounting an electronic component is formed in a pad of a printed circuit board. Since the through hole is formed in a process different from the formation of the pad, the position of the through hole may be shifted from the center of the pad. Therefore, various inspection apparatuses that can accurately inspect the formation position of the through hole have been proposed (Patent Documents 1 to 4).
  • Patent Document 1 discloses a method of counting the number of through-holes and inspecting whether the number matches the reference number. According to such a method, when the through hole is blocked, it can be detected as defective.
  • Patent Document 2 discloses an inspection apparatus that can inspect even through-hole diameters in addition to detecting clogging of through-holes.
  • Patent Document 3 discloses a method in which an image of a pad or a through hole is thinned, and an end point is found to detect a position shift of the through hole as shown in FIG. Yes.
  • a method for example, when the through hole protrudes from the pad, the edge of the pad is cut by the through hole, so that a plurality of end points are generated in the thinned line (the lower diagram in FIG. 10).
  • the through hole protrudes from the pad
  • the edge of the pad is cut by the through hole, so that a plurality of end points are generated in the thinned line (the lower diagram in FIG. 10).
  • Patent Document 4 the image of a pad or a through hole is binarized, and as shown in FIG. 11, the image is divided into eight directions and edges are extracted to determine the through hole formation state.
  • An inspection apparatus that can be used is disclosed. According to such a method, even if an error occurs during the thinning process of Patent Document 3, it is possible to reliably detect the displacement of the through hole without generating the noise. Become.
  • Patent Document 1 and Patent Document 2 is for determining the number of through holes and the size of the hole diameter, even if the formation position of the through hole protrudes from the pad, If the number of holes and the hole diameter match, this cannot be judged as defective.
  • the present invention has been made paying attention to the above-described problem, and an object thereof is to provide a through-hole inspection apparatus capable of accurately inspecting through-hole misalignment without extracting an edge.
  • the present invention provides an image acquisition means for acquiring a surface image of a printed circuit board in a through hole inspection apparatus for inspecting a formation state of a through hole provided in a pad of the printed circuit board, A region extraction unit that extracts an image of an inspection region including a pad from a surface image, a binarization processing unit that generates a binarization map from the extracted image, and a labeling process based on the binarization map And labeling means for counting the number of labeling areas other than the pads based on the information subjected to the labeling process, and determining means for determining that the position is shifted when the number of the labeling areas is equal to or less than a predetermined number. It is intended to be provided.
  • the through hole region and the labeling region other than the pad are connected to form one, thereby shifting the through hole. Can be detected.
  • the through hole is within the pad, there are two labeling areas for the through hole in the pad and two labeling areas outside the pad, so it is determined that the through hole is within the pad. Will be able to.
  • the pad RGB information corresponding to the pad area and the exclusion RGB information corresponding to the area other than the pad are set in advance, and the pad RGB information and the exclusion RGB information area are inflated and processed. An image of the inspection area is extracted from the image.
  • the labeling area other than the pad in contact with the outer boundary of the inspection area is removed, and then the number of labeling areas other than the pad is counted. If the number is equal to or less than the predetermined value, it is determined that the position is shifted.
  • the image acquisition means for acquiring the surface image of the printed circuit board, the area extraction means for extracting the image of the inspection area including the pad from the surface image, and binarization from the extracted image A binarization processing unit that generates a map, a labeling unit that executes a labeling process based on the binarized map, and counts the number of labeling regions other than the pads based on the information that has been labeled, When the number of areas is equal to or less than the predetermined number, the determination means for determining that the position is shifted is provided. Therefore, when the through hole is formed beyond the edge of the pad, the through hole area and the pad The number of labeling regions other than is connected to be one, thereby detecting the displacement of the through hole. On the other hand, if the through hole is within the pad, there are two labeling areas for the through hole in the pad and two labeling areas outside the pad, so it is determined that the through hole is within the pad. Will be able to.
  • the figure which shows the binarization map by which the binarization process in the form was carried out
  • the figure which shows the outline of a labeling process in the same form The figure which shows the image and the determination process which were labeled in the same form
  • the figure which shows the flowchart which shows the setting process in the form The figure which shows the flowchart which shows the inspection process in the form
  • the figure which shows the inspection method of the through hole of the conventional example The figure which shows the inspection method of the through hole of the conventional example
  • the inspection apparatus 1 can inspect whether or not a through hole 84 is accurately contained in a pad 81 formed on a printed circuit board.
  • the surface image is acquired from the substrate 8, and an image of the inspection region 9 at the position where the pad 81 is present is extracted.
  • binarization processing is performed on the area of the pad 81 and the other area in the inspection area 9 (the area of the pad 81 is “0”, and the other area is “1”).
  • the binarization process is performed, and it is possible to inspect whether or not the through hole 84 protrudes from the pad 81 based on the number of labeling regions other than the pad.
  • the configuration of the inspection apparatus 1 will be described in detail based on the functional block diagram in FIG.
  • the image acquisition means 2 acquires the surface image from the printed circuit board 8 to be inspected.
  • the surface image may be acquired by a gray scale.
  • the area of the pad 81 where the metal is exposed as shown in FIG.
  • the brightness of the region 81R (region between the broken line and solid line) where the resist 83 is applied on the pad 81 and the region 82R (region outside the solid line) where the resist 83 is applied directly on the substrate 82 The difference between the values is not clear, and the image of the pad 81 cannot be accurately extracted only with the luminance values of 256 gradations.
  • the surface image of the printed circuit board 8 is preferably acquired by a color image.
  • the surface image of the printed circuit board 8 is acquired by the image acquisition means 2
  • light is emitted from an illumination device arranged obliquely above the printed circuit board 8, and the reflected light is reflected on the line sensor or the Obtained by area sensor.
  • the area extracting means 3 extracts an image of the inspection area 9 of the pad 81 which is the inspection area 9 from the acquired surface image of the printed circuit board 8.
  • the coordinate position where the pad 81 exists is set in advance by the setting means 4.
  • pad RGB pixel information to be extracted from the image and excluded RGB pixel information to be positively excluded therefrom are set.
  • the coordinate position of the pad 81 is set based on the CAD data used at the time of designing the printed circuit board 8, and all the pads 81 are included around the coordinate position.
  • a proper inspection area 9 is set.
  • the shape of the inspection area 9 may be a rectangular shape such as a square or a rectangle, or may be a circular shape.
  • all pads 81 and through holes 84 to be inspected are included.
  • the pad RGB information indicates RGB luminance information for extracting the pad 81 from the surface image, and is set based on the image acquired from the pad 81 of the reference printed circuit board 8.
  • the RGB luminance values are expanded by a certain width so as to include these luminance values.
  • one pixel or a rectangular area of the pad 81 is set with the mouse from the surface image of the reference printed circuit board 8, and then the luminance value of the designated pixel (if the rectangular area is set, the rectangle is set.
  • 120- ⁇ 1 ⁇ R ⁇ 200 + ⁇ 2, 60- ⁇ 1 ⁇ G ⁇ 150 + ⁇ 2, 60- ⁇ 1 ⁇ B ⁇ 80 + ⁇ 2, etc. see FIG. 2).
  • the excluded RGB information is a set of RGB luminance values to be positively excluded from the surface image.
  • the excluded RGB information is set to a base color close to the pad color, a resist color on the substrate 82, or the like.
  • the RGB luminance values are expanded by a certain width so as to include these luminance values (see FIG. 2). That is, after setting one pixel or a rectangular area from the surface image of the printed circuit board 8 serving as a reference with the mouse, the luminance value of the designated pixel (if a rectangular area is set, all the pixels in the rectangular area are set). (Brightness value).
  • the pad RGB information and the excluded RGB information are inflated as described above, there is a possibility that the area 31 indicating the pad RGB information and the area 32 indicating the excluded RGB information overlap as shown in FIG. In such a case, the pixels included in the excluded RGB information area 32 are first removed from the inspection area 9, and then the pixels included in the pad RGB information area 31 are extracted. On the other hand, if the pixels included in the excluded RGB information are excluded after the pixels belonging to the pad RGB information are extracted, the extracted images are the same as a result.
  • the binarization processing means 5 performs binarization processing based on the image of the inspection area 9 extracted in this way, and generates a binarization map as shown in FIG. 4 or FIG.
  • “0” is set for pixels extracted as pad RGB colors in the inspection area 9
  • “1” is set for pixels excluded as removed RGB colors other than pads.
  • the labeling means 6 executes a labeling process for each block of bit values “0” and “1” based on the binarization map thus binarized.
  • labeling means that a code is assigned to each block of binarized bit values.
  • an area other than the pad 81 that is, an area to which “1” is assigned).
  • a label is assigned to each lump.
  • FIG. 6 shows an example of this labeling process.
  • reference numeral 93 denotes a target pixel
  • reference numeral 94 denotes a surrounding reference pixel.
  • the label “1” is assigned to the target pixel 93. Assigned.
  • a map labeled in the same manner from the upper left to the lower right pixels of the inspection area 9 is generated.
  • the boundary portion 91 of the inspection area 9 is relatively easy to generate noise as compared with the central portion. For example, as shown in FIG. 4, there is a scratch or a wiring pattern near the inspection area 9. As shown in FIG. 4B, there is a possibility that the region of the bit value “1” may be divided into the inner side and the outer side due to the scratch or the like.
  • the determination means 7 removes the labeling region 92 in contact with the boundary portion 91 of the inspection region 9 from the images thus labeled, and counts the number of labeling regions after the removal. That is, as shown in FIG. 5A, when the through hole 84 is formed inside the pad 81 without any other wiring pattern or scratch in the inspection area 9, the labeling area outside the pad 81 is formed. 92 and a labeling region 92 inside the pad 81 exist, and there are a total of two labeling regions (FIG. 7A). At this time, if the labeling region 92 in contact with the boundary portion 91 of the inspection region 9 is removed, only one labeling region 92 in the region of the pad 81 remains.
  • the number of labeling regions after the boundary portion removal is only “1”. Further, as shown in FIG. 4A, when the resist region 82R on the base material 82 is divided by other wiring patterns or scratches of the inspection region 9, the number of labeling regions is “3”. However, since the labeling area outside the pad is in contact with the boundary portion 91 of the inspection area 9, the number of labeling areas is “1”.
  • the determination means 7 removes the labeling area 92 in contact with the boundary portion 91 of the inspection area 9 and counts the number of labeling areas thereafter, and if the number is “0”, it is “positional deviation”. judge.
  • the reference printed circuit board 8 is prepared in advance and the surface image is acquired (step S1).
  • the printed circuit board 8 serving as a reference another inspection device 1 or one determined to be non-defective by visual inspection is used, and the acquired surface image is displayed on the display (step S2).
  • setting of the coordinate position of the pad 81 is received from the operator by CAD data or a screen operation with the mouse (step S3), and the coordinate position and the size of the rectangular area including the pad 81 are stored (step S4).
  • the metal exposed part of the pad 81 and the resist 83 application area on the pad 81 are displayed.
  • the selection of a pixel is accepted, and the RGB information of the pixel is stored as pad RGB information (step S5).
  • selection is accepted for a pixel of a color to be positively excluded in a portion other than the pad 81, and the RGB information of the pixel is stored as excluded RGB information (step S6).
  • a color that is easily mistaken for the pad color is set as the exclusion color.
  • each information is inflated and memorize
  • a surface image is acquired from the printed circuit board 8 that is the inspection object (step T1), and the image is stored in the image memory. Then, the inspection area 9 is extracted from the surface image based on the coordinate position of the pad 81 stored in advance (step T2), and the pixels included in the excluded RGB information subjected to the inflating process from the image of the inspection area 9 Is removed (step T3). At this time, pixels corresponding to the color of the substrate 82 itself, pixels corresponding to the color of the resist 83 applied on the substrate 82, and the like are removed.
  • the pixels belonging to the pad RGB information after the inflating process are extracted (step T4).
  • the metal color of the pad 81 or the resist on the pad 81 is extracted. Extract only the pixels included in the color. By performing such processing, only the image corresponding to the area of the pad 81 remains as the image of the inspection area 9, and the other images are removed.
  • step T5 the image of the area of the pad 81 extracted in this way is binarized to generate a binarized map.
  • the area other than the pad 81 is set to “1”, and the area of the pad 81 is set to “0”.
  • the resist 83 region of the base material 82 and the through hole 84 portion are “1”, and the exposed metal portion of the pad 81 and the resist coating region 81R of the pad 81 are “0”. It becomes.
  • step T6 labeling processing is performed from the binarized map generated in this way.
  • a labeling process is executed for the area other than the pad 81, and a label is attached to each pixel cluster to which “1” is added in the binarization map.
  • the through hole 84 is formed in the pad 81 by this process, as shown in FIG. 7, the label “1” portion of the through hole 84 portion and the label “ Two labeling regions 92 exist in the portion “2”.
  • the through hole 84 protrudes from the boundary portion of the pad 81, there is only one labeling region 92.
  • the displacement of the through hole 84 is determined based on the map after the labeling process.
  • the labeling region 92 that is in contact with the boundary portion 91 of the inspection region 9 is removed (step T7), and the number of labeling regions 92 remaining there is counted.
  • the through hole 84 is formed in the pad 81, the number of the labeling areas after removing the labeling area 92 in contact with the boundary portion 91 of the inspection area 9 is “1” (through holes in the pad 81.
  • the through hole 84 protrudes from the pad 81, the through hole 84 and the outer region are integrated, and the number of labeling regions becomes “0”.
  • step T9 the determination means 7 determines that the position is misaligned.
  • step T10 the result is output.
  • the image acquisition unit 2 that acquires the surface image of the printed circuit board 8 and the inspection region 9 including the pad 81 based on the coordinate position of the pad 81, the pad RGB information, the excluded RGB information, and the like.
  • Area extraction means 3 for extracting the image of the image
  • binarization processing means 5 for generating a binarization map from the image of the inspection area 9, and labeling processing for areas other than the pad 81 based on the binarization map. Since the labeling means 6 to be executed is included and the number of labeling regions 92 other than the pad 81 is counted and the number is smaller than a predetermined value, it is determined that the position is misaligned. It can be determined whether or not the through hole 84 is formed beyond 81a.
  • the inspection area 9 is extracted in this way, the image of the inspection area 9 is extracted by expanding the areas of the pad RGB information and the excluded RGB information, so that the inspection area 9 of the pad 81 is extracted with a color image.
  • the labeling region 92 in contact with the boundary portion 91 of the inspection region 9 is removed, and then the number of labeling regions other than the pad 81 is “0”. ”Is determined to be“ positional misalignment ”. Therefore, as shown in FIG. 4, even if there are scratches or other wiring patterns in the inspection area 9, it is divided by the scratches. It is possible to accurately inspect the displacement by removing the labeled region 92.
  • the positional deviation of the through hole 84 is detected by the number of labeling regions.
  • the through hole 84 is formed inside the pad 81, the area of the inner labeling region 92 is detected. Based on the above, the diameter of the through hole 84 may be inspected at the same time.
  • the excluded pixels are excluded first based on the excluded RGB information, and then the pixels corresponding to the pad 81 are extracted based on the pad RGB information. However, based on only the pad RGB information. Thus, pixels corresponding to the pad 81 may be extracted.
  • the present invention can inspect the displacement of the through hole formed in the pad of the printed circuit board on which no electronic component is mounted.

Abstract

L'invention a pour objet de contrôler avec précision le décalage de position d'un trou débouchant sans extraction des bords. Dans le cas du contrôle de l'état de formation d'un trou débouchant (84) dans une plage (81), les positions en coordonnées de la plage (81), les informations RGB de la plage et les informations RGB d'exclusion sont préalablement spécifiées. Ensuite, sur la base de l'image de surface obtenue à partir d'une carte imprimée (8), l'image d'une région (9) de contrôle est extraite à l'aide des positions en coordonnées, des informations RGB de la plage et des informations RGB d'exclusion. L'image de la région (9) de contrôle extraite est binarisée et, sur la base de la carte binarisée, un traitement d'étiquetage est exécuté sur les régions autres que la plage (81). Une région (92) d'étiquetage en contact avec la partie frontalière (91) de la région (9) de contrôle est ensuite éliminée, on compte le nombre de régions (92) d'étiquetage après élimination et, lorsque le nombre vaut 1, il est déterminé qu'il n'existe pas de décalage de position ; lorsque le nombre vaut 0, il est déterminé qu'il existe un décalage de position.
PCT/JP2010/051217 2009-01-31 2010-01-29 Appareil de contrôle de trou débouchant WO2010087433A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010800062506A CN102301225A (zh) 2009-01-31 2010-01-29 通孔检查装置

Applications Claiming Priority (2)

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JP2009-021023 2009-01-31
JP2009021023A JP5234639B2 (ja) 2009-01-31 2009-01-31 スルーホールの検査装置

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CN114250438A (zh) * 2022-01-26 2022-03-29 福建华佳彩有限公司 一种掩膜板及其圆形开孔偏移量测方法
WO2023124579A1 (fr) * 2021-12-29 2023-07-06 广东利元亨智能装备股份有限公司 Procédé et appareil pour la détermination d'une zone d'inspection de qualité de cordon de soudure, ordinateur et support de stockage
CN117571721A (zh) * 2024-01-15 2024-02-20 北京兆维智能装备有限公司 一种电路板焊盘表面缺陷检测方法、装置及存储介质

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CN114250438A (zh) * 2022-01-26 2022-03-29 福建华佳彩有限公司 一种掩膜板及其圆形开孔偏移量测方法
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CN117571721B (zh) * 2024-01-15 2024-04-05 北京兆维智能装备有限公司 一种电路板焊盘表面缺陷检测方法、装置及存储介质

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JP5234639B2 (ja) 2013-07-10
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