WO2010079730A1

WO2010079730A1 - Ultrasonic flaw detector

Info

Publication number: WO2010079730A1
Application number: PCT/JP2010/000001
Authority: WO
Inventors: 上野順; 石川正武
Original assignee: Ueno Jun; Ishikawa Masatake
Priority date: 2009-01-08
Filing date: 2010-01-04
Publication date: 2010-07-15
Also published as: JP4327242B1; TW201033607A; JP2010160052A

Abstract

Provided is an ultrasonic flaw detector which has a simple configuration and a low cost, while correctly detecting and inspecting flaws of a cylindrical sputtering target. The ultrasonic flaw detector has: a probe which transmits and receives ultrasonic waves to and from the surface of the sputtering target; a probe shifting mechanism which linearly shifts the probe in the X direction and the Y direction within the horizontal plane with respect to the sputtering target; and a power transmitting mechanism, which converts the linear shift in the Y direction performed by the probe shifting mechanism into a rotational shift in the circumferential direction of the sputtering target and rotationally shifts the sputtering target.

Description

Ultrasonic flaw detector

The present invention relates to an ultrasonic flaw detection apparatus that performs flaw detection inspection of an inspection object having a cylindrical outer shape.

For example, in a manufacturing process of a semiconductor device, a sputtering apparatus that forms a film on a substrate is used. The sputtering apparatus has a sputtering target that emits desired atoms by collision with ionized gas or the like. This sputtering target is manufactured, for example, by bonding a plate-like target member to a backing plate with a bonding material.

By the way, at the time of the sputtering process in the above-described sputtering apparatus, the temperature of the target member rises due to ion collision or the like, and thus the target member needs to be cooled. For this reason, a normal cooling mechanism is provided in the backing plate.

For example, if there is a part where the bonding material is missing in the sputtering target, not only will it cause peeling, but even if it is cooled, the heat exchange between the backing plate and the target member will not be performed sufficiently, and the target in that part The member becomes hot and causes damage. For this reason, the backing plate and the target member are desired to be uniformly filled with a bonding material over the entire bonding surface.

For this reason, the sputtering target is normally inspected for the filling rate of the bonding material between the target member and the backing plate by using a nondestructive ultrasonic flaw detector during manufacture.

The ultrasonic flaw detection apparatus includes a probe that transmits ultrasonic waves and receives reflections thereof, a mechanism that moves the probes in the XY directions in a horizontal plane, and the like, and is a plate-like sputtering target placed in a liquid On the other hand, the probe is moved in the XY direction while transmitting an ultrasonic wave, and the entire surface of the sputtering target is scanned by the probe (see Patent Document 1).

Japanese Patent Publication No. 2004-132725

However, in recent years, cylindrical sputtering targets have become widespread, for example, for the production of solar cells. Since the cylindrical sputtering target cannot be inspected by the ultrasonic flaw detection apparatus as described above, the product may be shipped without inspecting the bonding material.

In addition, the development of an ultrasonic flaw detector capable of inspecting a cylindrical sputtering target is also underway, but the apparatus rotates the cylindrical sputtering target with a dedicated drive mechanism, for example, with respect to a fixed probe, Data on the surface of the sputtering target is acquired by a probe, and flaw detection on the entire surface of the sputtering target is detected by data processing. For this reason, the structure of the apparatus and the software configuration are complicated, and as a result, the apparatus is very expensive.

The present invention has been made in view of the above points, and an ultrasonic flaw detection apparatus having a simple configuration and a low cost while appropriately performing flaw detection inspection of a cylindrical inspection target such as a cylindrical sputtering target. Its purpose is to provide.

In order to achieve the above object, the present invention is an ultrasonic flaw detection apparatus that performs a flaw detection inspection of a cylindrical object to be inspected, and transmits ultrasonic waves to the surface of the inspection object and receives reflections thereof. A probe, a probe moving mechanism that linearly moves the probe relative to the object to be inspected in an axial direction and a radial direction in a horizontal plane, and rotation of the probe moving mechanism in the circumferential direction of the object to be inspected A power transmission mechanism that converts the movement into a rotational movement of the object to be inspected.

According to the present invention, since the linear movement in the radial direction of the probe moving mechanism is converted into the rotational movement in the circumferential direction of the object to be inspected and the object to be inspected is rotationally moved, a drive source for rotating the object to be inspected is necessary. In addition, an ultrasonic flaw detector with a simple configuration and low cost can be realized. In addition, since the driving of the probe moving mechanism that can move the probe in two directions in the horizontal plane is used, for example, an existing ultrasonic flaw detection apparatus that performs flaw detection inspection of a plate-shaped object to be inspected can be used. Therefore, an inexpensive ultrasonic flaw detector can be realized accordingly. Furthermore, it becomes possible to perform a flaw detection inspection of a plate-shaped inspection object using the ultrasonic flaw detection apparatus.

The probe movement mechanism includes an axial movement mechanism that holds the probe and moves the probe in the axial direction, and a radial movement mechanism that moves the axial movement mechanism in the radial direction, and the power transmission mechanism Is a connecting member that is connected to the axial movement mechanism and pushes the shaft of the object to be inspected as the axial movement mechanism moves in the radial direction, and the radial direction of the object to be inspected that is pressed by the connecting member And a rack and pinion mechanism that changes the linear movement to the rotational movement. In this case, the linear motion of the probe moving mechanism can be converted into the rotational motion of the object to be inspected with a simple mechanism. Further, since the rack and pinion mechanism is used, the rotational distance of the object to be inspected can be controlled accurately and strictly.

The gear of the rack and pinion mechanism is attached to the shaft of the object to be inspected, the rack is arranged toward the radial direction, and the diameter of the pitch circle of the gear is set to the same diameter as the object to be inspected. It may be. In this case, since the radial movement distance of the probe and the rotation distance on the surface of the object to be inspected are the same, for example, the one-way movement control of the probe in a plate-like ultrasonic flaw detector is directly used as the radial movement control. Can be used. As a result, it is possible to perform a flaw detection inspection of a cylindrical inspection object by using, for example, a control program for a flaw detection inspection of a plate-shaped inspection object as it is, thereby realizing a further inexpensive ultrasonic inspection apparatus.

The connecting member and the shaft of the object to be inspected may be connected by a universal joint.

The inspection object may be a sputtering target obtained by bonding a target member to a backing member with a bonding material.

According to the present invention, it is possible to realize an ultrasonic flaw detector with a simple configuration and at a low cost while appropriately performing flaw detection inspection of an inspection object having a cylindrical outer shape.

It is explanatory drawing of the longitudinal cross-section which shows the structure of an ultrasonic flaw detector. It is explanatory drawing when it sees from the plane of an ultrasonic flaw detector. It is explanatory drawing of a rack and pinion mechanism. It is sectional drawing of a sputtering target. It is explanatory drawing which shows the locus | trajectory of the movement of a probe when a sputtering target is expand | deployed. It is explanatory drawing which shows the universal joint which connects a connection member and the axis | shaft of a sputtering target.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory view of a longitudinal section showing an outline of the configuration of the ultrasonic flaw detector 1 according to the present embodiment, and FIG. 2 is an explanatory view when the ultrasonic flaw detector 1 is seen from a plane. In addition, in this specification and drawing, about the component which has the substantially same function structure, the duplicate description is abbreviate | omitted by attaching | subjecting the same code | symbol.

For example, as shown in FIG. 1, the ultrasonic flaw detector 1 includes a liquid tank 10 in which a liquid is stored, and an installation table in which a cylindrical sputtering target A as an object to be inspected is installed. 11, a probe 12 that transmits ultrasonic waves to the surface of the sputtering target A and receives reflections thereof, an axial direction (X direction) and a radial direction (Y shown in FIG. 2) in the horizontal plane with respect to the sputtering target A. A probe moving mechanism 13 that linearly moves in the direction), a power transmission mechanism 14 that rotates the sputtering target A by converting the linear movement in the Y direction of the probe moving mechanism 13 into a circumferential rotational movement of the sputtering target A, A control unit 15 and the like for controlling the driving of the probe 12 and the probe moving mechanism 13 are provided.

For example, the probe moving mechanism 13 has an X-direction moving mechanism 20 that holds the probe 12 and moves it in the X direction, and a Y-direction moving mechanism 21 that moves the X-direction moving mechanism 20 in the Y direction.

The X-direction moving mechanism 20 includes, for example, a slider 30 that holds the probe 12, a rail 31 that is attached to the slider 30 and extends in the X direction, a drive unit 32 such as a motor that drives the slider 30, and the like. The rail 31 is formed, for example, from one end portion in the X direction above the installation base 11 to the other end portion, so that the probe 12 extends from the outside of one end in the X direction of the sputtering target A to the outside of the other end. I can move.

For example, as shown in FIG. 2, the Y-direction moving mechanism 21 includes a rail 40 that holds the rail 31 of the X-direction moving mechanism 20 and extends in the Y direction, and a drive unit 41 that drives the rail 40 in the Y direction. Yes.

The rail 40 is formed, for example, from the vicinity of one end in the Y direction above the installation base 11 to the vicinity of the other end, so that the probe 12 can move at least from one end to the other end in the Y direction of a rack 61 described later. . For example, as shown in FIG. 1, the probe 12 can move in the vertical direction (Z direction) as a part of the slider 30 expands and contracts.

For example, the power transmission mechanism 14 is connected to the rail 31 of the X-direction moving mechanism 20 and presses the axis B of the sputtering target A as the rail 31 moves in the Y direction, and the sputtering target pressed by the connecting member 50. A rack and pinion mechanism 51 that changes the linear movement of A in the Y direction into a rotational movement is included.

A bearing 52 is attached to the axis B of the sputtering target A, and a connecting member 50 is connected to the bearing 52. The gear 60 of the rack and pinion mechanism 51 is fixed to the axis B of the sputtering target A. As shown in FIG. 2, the rack 61 that meshes with the gear 60 is installed on the installation table 11 in the Y direction. The probe 12 is positioned above the axis B of the sputtering target A that is positioned by the rack and pinion mechanism 51.

In the gear 60, for example, the diameter of the pitch circle P is set to be the same as the diameter of the sputtering target A as shown in FIG. Thereby, the moving distance (Δy in FIG. 3) of the gear 60 in the Y direction matches the rotational distance of the surface of the sputtering target A.

1 is configured by, for example, a computer and controls driving of the probe 12, the X-direction moving mechanism 20, the Y-direction moving mechanism 21, and the like by executing a stored control program. The reception result of the reflection of the ultrasonic wave by the probe 12 is output to the control unit 15, for example, and the control unit 15 calculates and outputs the flaw detection result on the entire surface of the sputtering target A. The control unit 15 has, for example, a display screen, and the flaw detection result on the entire surface of the sputtering target A is imaged and displayed. The image is displayed by planarizing the cylindrical surface of the sputtering target A, for example.

Next, the flaw detection inspection of the sputtering target A using the ultrasonic flaw detection apparatus 1 configured as described above will be described.

The sputtering target A is obtained by bonding a cylindrical target member C to the outer periphery of a cylindrical backing member E with a bonding material D as shown in FIG. The bonding material D is interposed on the entire joint surface between the inner peripheral surface of the cylindrical target member C and the outer peripheral surface of the backing member E. As the material of the target member C, Al, Cu, Mo, ITO, Si, AZO, or the like is used, and as the bonding material D, for example, In, Sn, resin, or the like is used. As the material of the backing member E, stainless steel (SUS) or Ti is used.

In the flaw detection inspection, first, as shown in FIG. 1, the shaft B is fixed to the axis of the sputtering target A, the gear 60 is attached to the shaft B, and then the shaft B is attached to the bearing 52. At this time, the gear 60 is placed on the rack 61 and meshes with the rack 61. As shown in FIG. 2, the sputtering target A is first arranged near one end in the Y direction of the rack 61 (upper side in FIG. 2).

Next, the liquid is stored in the liquid tank 10 and the sputtering target A is immersed. Thereafter, for example, as shown in FIG. 1, the probe 12 is positioned outside one end (on the left side in FIG. 1) on the axis of the sputtering target A. Here, FIG. 5 shows the locus of movement of the probe 12 on the surface of the sputtering target A in the flaw detection inspection described below. Then, the flaw detection inspection is started. First, while the probe 12 transmits an ultrasonic wave and receives the reflection, the X-direction moving mechanism 20 causes, for example, the one end side of the sputtering target A on the axis of the sputtering target A (FIG. 1, It moves from the left side of FIG. 5 to the other end side (right side of FIGS. 1 and 5). Thereby, it is detected whether the top of the sputtering target A is flawed, that is, whether or not the bonding material D is filled between the target member C and the banking member E. Since the probe 12 can detect flaws in a predetermined region having a width in the Y direction at a time, flaw detection in a band-like portion having a width near the top of the sputtering target A is detected by a single scan of the probe 12 in the X direction. The

Thereafter, the Y-direction moving mechanism 21 moves the X-direction moving mechanism 20 in the Y direction (downward in FIG. 2) by a predetermined distance, whereby the axis B is pushed in the Y direction via the connecting member 50, and the rack and pinion The sputtering target A is rotated in the Y direction by the mechanism 51. Thus, the flaw detection detection position by the probe 12 on the surface of the sputtering target A is shifted. As shown in FIG. 3, the rotation distance Δy on the surface of the sputtering target A at this time is the same as the movement distance Δy in the Y direction of the X direction moving mechanism 20. The predetermined distance Δy is determined by, for example, a single flaw detection detection width of the probe 12, and is set so that there is no gap between flaw detection detection positions adjacent in the Y direction.

Next, while the probe 12 emits an ultrasonic wave and receives its reflection, the X-direction moving mechanism 20 causes one end on the axis of the sputtering target A from the other end side (the right side in FIG. 1 and FIG. 5). Returned to the section side (left side in FIGS. 1 and 5). Next, the Y-direction moving mechanism 21 moves the X-direction moving mechanism 20 by a predetermined distance Δy in the Y direction, the axis B is pushed in the Y direction via the connecting member 50, and the sputtering target A is moved to Y by the rack and pinion mechanism 51. Rotated in the direction. After that, while the probe 12 transmits the ultrasonic wave again and receives the reflection, the other end of the sputtering target A from the one end side (the right side in FIGS. 1 and 5) on the axis of the sputtering target A by the X-direction moving mechanism 20. Move to the part side (left side in FIGS. 1 and 5). Thereafter, this is repeated. Thus, as shown in FIG. 5, the probe 12 is reciprocated in the X direction and the sputtering target A is rotated by the predetermined distance Δy in the Y direction. Inspection ends.

The reception results received in each scan of the probe 12 are respectively calculated in the control unit 15, and the flaw detection results on the entire surface of the sputtering target A are joined by joining the flaw detection results on the top of the sputtering target A by the scans. Is obtained. The flaw detection result is shown as a planar image in which the sputtering target A is developed, for example.

According to the above embodiment, since the linear movement in the Y direction of the probe moving mechanism 13 is converted into the rotational movement in the circumferential direction of the sputtering target A and the sputtering target A is rotated, the sputtering target A is separately rotated. An ultrasonic flaw detector 1 that does not require a drive source, has a simple configuration, and is inexpensive can be realized. In addition, since the driving of the probe moving mechanism 13 that moves the probe 12 in two directions in the horizontal plane is used, for example, an existing ultrasonic flaw detector that performs flaw detection on a plate-like sputtering target can be used. Therefore, an inexpensive ultrasonic flaw detector 1 can be realized accordingly. Furthermore, a flaw detection inspection of a plate-like sputtering target can be performed using the ultrasonic flaw detection apparatus 1.

The probe moving mechanism 13 includes an X direction moving mechanism 20 that holds the probe 12 and moves it in the X direction, and a Y direction moving mechanism 21 that moves the X direction moving mechanism 20 in the Y direction. Is connected to the X-direction moving mechanism 20 and pushes the axis B of the sputtering target A as the X-direction moving mechanism 20 moves in the Y direction, and the Y direction of the sputtering target A pushed by the connecting member 50. And a rack and pinion mechanism 51 for changing the linear movement to the rotational movement. Thereby, the linear motion of the probe moving mechanism 13 can be converted into the rotational motion of the sputtering target A with a simple configuration. Moreover, since the rack and pinion mechanism 51 is used, the rotational distance Δy of the sputtering target A can be accurately controlled. Furthermore, since the sputtering target A is rotated along the rack 61, it can be applied to sputtering targets A having various diameters.

The gear 60 of the rack and pinion mechanism 51 is attached to the axis B of the sputtering target A, the rack 61 is arranged in the Y direction, and the diameter of the pitch circle P of the gear 60 is set to the same diameter as the sputtering target A. Has been. As a result, the moving distance in the radial direction of the probe 12 and the rotational distance on the surface of the sputtering target A become the same. For example, the movement control in the Y direction of the probe in an ultrasonic flaw detector for a plate-like sputtering target is used as it is. Thus, the flaw detection inspection of the cylindrical sputtering target A can be performed. Thereby, since a control program etc. can be utilized as it is, for example, the cheaper ultrasonic flaw detector 1 is realizable.

In the above embodiment, the connecting member 50 and the axis B of the sputtering target A may be connected by a universal joint 70 as a universal joint. The universal joint 70 makes the connecting member 50 rotatable around the axis B, for example. In such a case, since play can be made between the axis B of the sputtering target A and the connecting member 50, for example, alignment when the axis B and the connecting member 50 are fixed becomes easy.

The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood. For example, in the above embodiment, the object to be inspected is the sputtering target A, but the present invention can also be applied to flaw detection inspection of other objects to be inspected.

DESCRIPTION OF SYMBOLS 1 Ultrasonic flaw detector 12 Probe 13 Probe moving mechanism 14 Power transmission mechanism 20 X direction moving mechanism 21 Y direction moving mechanism 50 Connecting member 51 Rack and pinion mechanism A Sputtering target

Claims

An ultrasonic flaw detection apparatus that performs flaw detection inspection on a cylindrical object to be inspected,
A probe that emits ultrasonic waves to the surface of an object to be inspected arranged with its axis oriented horizontally, and receives the reflection thereof;
A probe moving mechanism that linearly moves the probe in the axial direction and the radial direction of the test object in a horizontal plane with respect to the test object;
An ultrasonic flaw detection apparatus comprising: a power transmission mechanism that converts the linear movement of the probe moving mechanism in the radial direction into a rotational movement of the inspection object in the circumferential direction to rotate the inspection object.
The probe movement mechanism includes an axial movement mechanism that holds the probe and moves the probe in the axial direction, and a radial movement mechanism that moves the axial movement mechanism in the radial direction,
The power transmission mechanism is connected to the axial movement mechanism and connected to the inspection object pressed by the connection member, the connection member pressing the shaft of the inspection object as the axial movement mechanism moves in the radial direction. An ultrasonic flaw detection apparatus according to claim 1, further comprising: a rack and pinion mechanism that changes the linear movement of the radial direction in the radial direction into a rotational movement.
The gear of the rack and pinion mechanism is attached to the shaft of the object to be inspected, and the rack is arranged toward the radial direction,
The ultrasonic flaw detector according to claim 2, wherein a diameter of a pitch circle of the gear is set to the same diameter as that of the inspection object.
The ultrasonic flaw detector according to claim 2 or 3, wherein the connecting member and the shaft of the object to be inspected are connected by a universal joint.
The ultrasonic flaw detector according to any one of claims 1 to 3, wherein the object to be inspected is a sputtering target in which a target member is bonded to a backing member with a bonding material.