WO2010076121A1 - Système d'éclairage à base de diodes del - Google Patents

Système d'éclairage à base de diodes del Download PDF

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Publication number
WO2010076121A1
WO2010076121A1 PCT/EP2009/066461 EP2009066461W WO2010076121A1 WO 2010076121 A1 WO2010076121 A1 WO 2010076121A1 EP 2009066461 W EP2009066461 W EP 2009066461W WO 2010076121 A1 WO2010076121 A1 WO 2010076121A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
light
conducting element
emitting diode
housing
Prior art date
Application number
PCT/EP2009/066461
Other languages
German (de)
English (en)
Inventor
Frank Werz
Stefan Stauch
Original Assignee
Poly-Tech Service Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Poly-Tech Service Gmbh filed Critical Poly-Tech Service Gmbh
Priority to EP09799576.5A priority Critical patent/EP2376829B1/fr
Publication of WO2010076121A1 publication Critical patent/WO2010076121A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/10—Pendants, arms, or standards; Fixing lighting devices to pendants, arms, or standards
    • F21V21/116—Fixing lighting devices to arms or standards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/08—Lighting devices intended for fixed installation with a standard
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10—Outdoor lighting
    • F21W2131/103—Outdoor lighting of streets or roads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a luminaire for outdoor lighting comprising at least one light-emitting diode array and a housing, wherein the light-emitting diode array has a plurality of light-emitting diodes which are surface-mounted on a single support, wherein the light
  • diodes having a diode element and an associated therewith element with a luminophore, wherein the diode element and the associated therewith element are arranged so that the light generated in operation by the diode element excites the luminophore, wherein the light emitting diode array is disposed in the housing, wherein the Housing is completed and has a substantially transparent portion and with a disposed in the housing heat conducting element,
  • Exterior lighting can be used, for example, for roads, parking lots, parking garages, tunnels and underpasses, mines, parks, gardens, sidewalks, squares and, more generally, outside of buildings.
  • LEDs are dimmable, which allows further savings by adjusting the brightness.
  • Another advantage is the fast turn-on and turn-off without warm-up times. It is also advantageous that the color of the light can be easily selected by using different diodes. Also, the generation of white light is possible by the actually colored light of a light emitting diode, which is even a narrow spectral
  • ! 5 bandwidth can be converted with a luminophore into other wavelengths.
  • the luminophore is illuminated with either a blue or an ultraviolet light emitting diode and converts the irradiation wavelengths by luminescence into longer wavelengths. With a suitable choice of the luminophore produces white light.
  • Suitable materials for the luminophore are, for example, yttrium-aluminum-garnet (YAG) doped with cerium or a novel material containing an alkaline-earth orthosilicate and preferably activated with europium. The latter material is described in EP 1 347 517.
  • red, green and blue LEDs can also be used in light-emitting diodes whose interaction produces white light.
  • a light-emitting diode can have different emission characteristics.
  • the chip of a light emitting diode first radiates in all directions in its environment. Typically, reflectors are placed around the chip to focus the light in a preferred direction.
  • the opening angle of a light-emitting diode describes the angular range over which the light exits the light-emitting diode. Outside the opening angle, the light emitting diode emits no light. If it is a white-light LED, between the chip and the plastic lens of the Lumi-
  • the lens can also be omitted, whereby the properties of the luminophore and the nature of its embedding or its geometry determine the radiation characteristics. Basically, the luminophore emits diffuse light. For example, if the lumi- nophor is buried, the wall of the depression limits the opening angle.
  • the luminophore may be free-standing and elevated in relation to its surroundings, whereby a particularly large opening angle is achieved, since the luminophore can still radiate practically in the plane of the surface into which it is embedded.
  • carrier plate can be inserted and soldered on the back of the carrier plate.
  • Various designs are known, for example mushroom lights, post-top luminaires, sheet lights, whip lights or rope suspension lights.
  • Object of the present invention is compared to this prior art, a lighting i ⁇ ment body for outdoor lighting, which has a very compact light-emitting element, so that a lamp equipped with it can be made very compact and yet has a high light output.
  • this object is achieved with a luminaire for outdoor lighting with S5 at least one light-emitting diode array and a housing, wherein the light-emitting diode array comprises a plurality of light-emitting diodes which are surface-mounted on a single carrier, wherein the light-emitting diodes comprise a diode element and an element associated therewith with a luminophore wherein the diode element and the element associated therewith are arranged so that - -
  • the light generated in operation by the diode element excites the luminophore
  • the light emitting diode array is disposed in the housing, wherein the housing is closed and has a substantially transparent portion, and with a heat conducting element arranged in the housing, wherein the carrier of the light emitting diode array thermally conductive with a Befest Trentsab- 5 section of the heat-conducting element is connected, solved.
  • SMD LEDs have the great advantage that the chip can be arranged near the bottom inside the housing of the SMD LED, which is a
  • the carrier itself may be made of aluminum, or other highly conductive metals, such as copper; However, there are also known versions with a plastic board. A thermally even better version of the
  • a lighting fixture according to the invention with surface-mounted light-emitting diodes has the advantage that it can be made compact even by the compact light-emitting diode array. Due to these small dimensions, it is possible to use a lighting fixture according to the invention to replace lighting fixtures in existing outdoor lighting.
  • a grid dimension in the light-emitting diode array is smaller than 5.6 mm. This ensures that a high luminance of the LED array is achieved. This in turn requires small dimensions.
  • the emission characteristic of the light emitting diodes is substantially influenced by the luminophore. This makes it possible to easily emit white light with a large opening angle.
  • the carrier of the light emitting diode array is thermally conductively connected to a mounting portion of the heat conducting element.
  • the heat-conducting element consists of several sections.
  • the first S5 section serves to absorb the heat from the carrier of the LED array and forward it to the other sections.
  • At least one of the further sections is thermally conductive with other elements for heat dissipation or directly with a heat sink in combination.
  • Heat sink absorbs the heat generated by the light emitting diode array so that the light emitting diode array itself does not overheat.
  • the elements 5 of the lighting fixture arranged inside the housing can withstand external influences such as rain or dust. Electrical and electronic components are protected from moisture even when exposed.
  • the transparent section lets the light escape from the housing.
  • the disadvantage of such a closed housing is that the heat generated can not be readily dissipated into the environment. 0
  • the heat-conducting element has at least one cooling section arranged in the housing.
  • This cooling section of the heat conduction element conducts the heat, which is introduced in the fastening section in FIG. 5, the heat conducting element, in the direction of a heat sink, whereby the section has a cooling effect on the light emitting diode array.
  • This portion of the heat conducting element is disposed within the housing to dissipate the heat from the mounting portion, which is also located within the housing.
  • the cooling section can advantageously have at least one surface-enlarging element, in particular at least one cooling rib and / or at least one cooling bore, and release heat to the air in the interior of the housing, and / or at least one recess for improving the heat conduction in the longitudinal direction of the heat-conducting element, in particular at least one heat transport bore in the longitudinal direction of the heat conducting element included.
  • a cooling section can transmit the heat emitted by the light emitting diode array (s) to the air located within the lighting fixture.
  • This is in turn connected to the inner surfaces of the housing in combination, which advantageously has a low conductivity to the outside and, for example, advantageously be made of aluminum.
  • the air in the interior of the lighting fixture can transmit the heat generated by the light-emitting diode fields via convection to the insides of the housing. Cooling fins or cooling holes on the heat-conducting element increase the contact area and thus the thermal transition between the heat-conducting element and the air. This transfers the heat more effectively to the air within the lighting fixture.
  • S5 surrounds the heat-conducting, the inner surface, which receives the heat from the air again, is significantly larger, so that can be dispensed with in one embodiment, measures to increase the thermally effective surface.
  • a fan is arranged in the housing, the heat transfer by forcibly circulating the - -
  • the surface-enlarging element can be embodied integrally with the heat-conducting element or be a separate element attached thereto.
  • the cooling section can also achieve a cooling effect by heat conduction to one or more heat sinks outside the lighting fixture.
  • the cooling section can consist of thermally highly conductive material.
  • the heat transfer can be improved by one or more internal recesses, which extend substantially in the transport direction of the heat to be dissipated by the heat conducting element, in particular bores or cylindrical recesses, in which the heat is transported faster by a medium flowing therethrough.
  • the medium may be a gas, for example air, or a liquid, for example water with an antifreeze, or alcohol or other liquid, e.g.
  • the bores can be connected at their ends for the overflow of medium from one bore to another bore, so as to provide a circuit in which the cooling medium can circulate and so by passive, or by forced with a pump or a fan Convection to dissipate heat.
  • An amount of water can also be used to increase the heat capacity of the heat-conducting element with little increase in weight, since water has a low specific gravity and a very high heat capacity.
  • the usability of the heat capacity is described below.
  • the recess for improving the heat transport can also use the principle of a heat pipe! 5 (heat pipe).
  • a liquid medium evaporates or evaporates at a point to be cooled within the recess, which is advantageous for the present invention in or near the attachment portion, and is reflected in a cooler place down. This is generally in the direction of the heat sink, which ultimately absorbs the heat, whereby the heat transfer can be significantly improved.
  • the return transport of the medium to the point to be cooled is effected i ⁇ by capillary force along wick elements or on the surface of the wall of the recess, which is advantageously structured in the transport direction, and / or by gravity.
  • the recess is advantageously sealed tight to hold the media therein.
  • a prefabricated, sealed heat pipe can be introduced into a recess for improving the heat transport. This is advantageous at least at the point to be cooled with S5 good thermal transition to the wall of the recess.
  • the heat-conducting element has two cooling sections, which are arranged such that the fastening section extends between the cooling sections. - -
  • the cooling sections By arranging the cooling sections around the attachment section, the heat is better dissipated since it can propagate in two directions toward a heat sink.
  • this arrangement enables the light-emitting diode array to be fastened centrally on the heat-conducting element, whereby it can also be arranged centrally in a lamp. This in turn means more freedom in the design of elements for influencing the illumination around the light-emitting diode array.
  • the heat-conducting element is advantageously designed in several pieces, wherein preferably the attachment section and a cooling section form separate parts.
  • the advantage is that the junction between the light emitting diode array and the portion with the mounting portion need not be disconnected while installed in the lamp. This may be due to circumstances when changing, e.g. Working at great heights on a slightly unstable aerial work platform, possibly even in cold weather, and due to the small size of the LED field fasteners.
  • a lamp base or a lamp cover which dissipates heat by solid conduction from the housing, for example into a mast or to the ambient air, can also be a part with a cooling section of the heat-conducting element due to its cooling function.
  • the attachment portion portion may additionally include cooling portions located on the portion.
  • the cross section of the fastening section is a polygon, preferably a quadrangle or a triangle and particularly preferably an equilateral triangle, wherein at least one light-emitting diode array is thermally conductively connected to one, several or each of the side faces of the fastening section.
  • Carrier of the LED array can rest flat. This ensures a good heat transfer between the carrier in the first part of the heat conducting element.
  • Another advantage is that the lighting fixture can be adapted to the lighting situation by the design as a regular or irregular polygon. For example, is the opening angle
  • an isosceles or irregular triangle can be used as a cross section for the first part of the heat conduction element, one or more light emitting diode arrays being applied to two of the three sides
  • 0 become.
  • For targeted stronger illumination of several angular directions and quadrangles or pentagons can be used and by setting the angle in the respective polygons the emission characteristics are determined.
  • the cross-section of the attachment portion is a pentagon, with only three of the side surfaces of the attachment portion being connected to light-emitting diode arrays.
  • a pentagon in particular as an irregular pentagon
  • the three surfaces are perpendicular to each other and the two other surfaces are at an acute angle to each other and at an obtuse angle to the first three surfaces.
  • the obtuse angles are advantageously the same size.
  • On the middle of the three mutually perpendicular surfaces and the two surfaces at an acute angle to each other is advantageously arranged in each case a light-emitting diode array.
  • the pentagon is arranged in the lamp so that the two light emitting diode arrays, which are arranged on the pointed surfaces, illuminate the street, and the third of the light emitting diode fields illuminated the walkway and possibly existing buildings. It is also possible to use cross-sections with polygons of even higher order i ⁇ than five in order to make the illumination even more targeted.
  • the polygonal design of the first part of the heat-conducting element therefore makes it possible in a simple manner to adapt the emission characteristic of a lighting fixture to the place of use.
  • the polygonal cross-section of the first part of the heat-conducting element be constant over at least the length or the width of a light-emitting diode array.
  • the surfaces on which the light-emitting diode arrays are arranged may be inclined to the longitudinal axis of the heat-conducting element, that is, for example, the surfaces of the mounting portion may be a truncated tetrahedron - -
  • the thermally conductive connection between the first part of the 5 padsleitelements and the light-emitting diode array is preferably realized by pressing the carrier to the first guide element and advantageously improved by the introduction of thermal paste in the connection point.
  • the first part of the heat-conducting element of the lighting fixture for external lighting has a continuous hole in the longitudinal direction.
  • Such a through hole offers the possibility of attaching the first part of the heat-conducting element by plugging on this hole to a counterpart. If the hole is located substantially in the center of the profile, heat flow from the LED panels to the heat sink or sinks is only marginally impeded, provided that they are at one or both ends in the longitudinal direction of the first part of the heat conducting element.
  • the lighting fixture for outdoor lighting has a lamp base, wherein, starting from the lamp base, a rod-shaped holding element extends for receiving the heat-conducting element.
  • the heat-conducting element can be plugged onto the rod-shaped retaining element.
  • Such a connection offers the advantage that the heat-conducting element with the light-emitting diode array can be easily separated from the lamp base, in particular if it is a mushroom lamp or a pole lamp.
  • the lid can be removed, the optional existing attachment of the heat conduction on the rod or the lamp base or on a further element of the lamp can be solved and the first portion of the heat conducting element with the light emitting diode arrays are removed from the lamp.
  • the lamp base is designed so that the axial end face of the first part of the heat-conducting element rests on a mating surface on the lamp base and is pressed against it.
  • the cover or a further part of the heat-conducting element can be pressed against the opposite end of the first part of the heat-conducting element on the axial surface.
  • the axial surfaces and the peripheral surfaces or the inner surface of the bore can be used as contact surfaces for a good heat transfer.
  • S5 elements are advantageously formed in a corresponding area as a geometrically matching counterpart to the corresponding contact surface.
  • thermal compound is introduced into the joints.
  • the heat-conducting element can also be attached to the ends of a - -
  • Clamping pin are pressed, which is arranged in a bore across the lamp base and overhangs.
  • the first part of the heat-conducting element can also have one or more holes in the transverse direction. They can serve for fastening the first part of the heat-conducting element to a lamp base or to other parts of the lamp.
  • the arrangement in the transverse direction has the advantage that with bulbs that are to be opened at the periphery, such as arc lamps, which are attached to a curved mast, a simpler replacement of the first part of the heat conducting is possible.
  • the lamp base can be part of the heat-conducting element, which has a cooling section.
  • the rod-shaped retaining element has a threaded section at its end remote from the lamp base.
  • the lamp base engages through the housing and has on the outside a receptacle for a mast.
  • the lamp base and / or the heat-conducting element consists essentially of metal, preferably of aluminum.
  • the first part of the heat-conducting element or the lamp base is ensured.
  • Aluminum can be used for a particularly good cost / benefit ratio S5 since the thermal conductivity is comparatively high compared to the price per volume.
  • the dimensions of the first part of the heat conducting element or the lamp base can be smaller compared to other metals, since the thermal conductivity is higher.
  • a further embodiment of the lighting fixture for external lighting is designed such that the heat-conducting element is thermally conductive with an element outside the housing, preferably with a lampshade or a mast, which in turn is thermally connected to a heat sink 5 outside the housing or even represents such connected is.
  • the elements or components mentioned serve to couple the heat flow from the light-emitting diode array to a heat sink.
  • Heat sinks may be, for example, the ambient air, a large part of the building or the ground. In this way, the light-emitting diode array is also
  • connection of said elements to the ambient air can be improved by increasing the surface area.
  • cooling fins may be arranged on the respective elements, which advantageously extend vertically, in order to allow a better passing of the air through thermal convection.
  • a good thermal connection is achieved, for example, by a heat sink, which consists of solid material, as large as possible in direct contact with the heat-conducting element.
  • a surface of the heat-conducting element can be pressed against a surface of the heat sink.
  • a thermal paste can be introduced into the connection point. If the heat sink is gaseous, for example the ambient air, then a thermally good conductive coupling can be realized, for example, by cooling fins, which communicate with the ambient air over an enlarged area.
  • the large outer surfaces of a mast or a lid in itself can already represent a good coupling.
  • the mast can thus emit heat both into the ground and to the ambient air.
  • a thermal transition to a heat sink enables only this mode by absorbing the heat received the heat capacity during the time in which no operation takes place, can flow to the heat sink. If the heat capacity of the heat conducting element is low compared to the derived heat S5 ge per operating cycle, the thermal transition to the heat sink ensures that the heat generated by the diode array can be dissipated to the heat sink without significant buffering, so that the heat sink LED field not overheated.
  • An operating cycle is typically a duty cycle during one night.
  • the heat capacity of the heat-conducting element is chosen such that it can absorb the heat emitted by the light-emitting diode field of an operating cycle minus the heat flowing away during the operating cycle, wherein the temperature of the light-emitting diode array during operation is the permissible temperature does not exceed.
  • heat capacity of an element is calculated from the specific heat capacity, which is material dependent, multiplied by the volume of the element
  • the heat that absorbs such a heat capacity is determined by the heat capacity multiplied by the temperature difference that undergoes the heat capacity.
  • the heat that emits the light-emitting diode array during an operating cycle can be calculated by a person skilled in the art by multiplying the power loss of the light-emitting diode array by the operating time.
  • the heat-conducting element may be made of a material
  • the lighting fixture illuminates a reflector element.
  • a reflector element can influence the emission characteristic of a luminaire. It is advantageously positioned and shaped in such a way that the desired emission characteristic is produced, for example, it reflects upward emitted light downwards in the direction of a road.
  • the desired emission characteristic can be designed, for example, annular and be arranged above one or more light-emitting diode arrays.
  • the heat dissipation from the light-emitting diode array i ⁇ is dimensioned to be thermally conductive such that the heat flow from the light-emitting diode field produces at most a temperature difference between one or more heat sinks and the light-emitting diode array, through which the light-emitting diode array does not exceed a permissible maximum temperature.
  • thermal resistance of an element is calculated from the thermal S5 conductivity of the material making up the element multiplied by the cross section of the element divided by the length of the element. If these quantities are not constant, it can be integrated to calculate the thermal resistance. Alternatively, for a high accuracy calculation, a finite element simulation of the thermal behavior - -
  • the cross section of the heat conducting element can be increased transversely to the direction of the heat flow, the length can be reduced in the direction of the heat flow, or a thermally more conductive material can be used.
  • the heat sink represents the environment. This has the egg
  • the temperature of the heat sink is considered to be that in the permissible
  • the temperature that the heat sink has on a warm summer night is set at the maximum operating temperature.
  • the permissible temperature of the LED field is determined by the thermal capacity of the diodes.
  • the permissible temperature is determined by the manufacturer of the light-emitting diodes or the light-emitting diode array used and can be, for example, 70 ° C.
  • the individual thermal resistances of the parts of the heat-conducting element from the light-emitting diode array to the heat sink are advantageously designed in such a way that the heat dissipation via the respective thermal resistances produces at most temperature differences between the light-emitting diode array and the respective heat sinks, which lead to that the permissible temperature at the LED field is not exceeded.
  • a thermal resistance must be designed accordingly, but the fulfillment of the criterion that the permissible temperature at the LED array is not exceeded, can
  • ! 5 can be achieved by designing several or all of the thermal resistances.
  • the types of design the heat during the operating cycle in the heat conduction between stored or derive the heat through the heat conduction in a heat sink, flow into each other, as always both effects occur simultaneously.
  • heat will flow into the heat capacity when the heat is applied, with heat also being dissipated from the heat-conducting element into a heat sink.
  • An integrated design thus takes into account both effects.
  • the heat capacity of the heat-conducting element can therefore be chosen smaller at the same temperature conditions corresponding to the amount of heat that is emitted from the heat-conducting element by heat dissipation to a heat sink.
  • S5 heat capacity can be adjusted to each other in such a way that the permissible temperature of the LED field is not exceeded.
  • the lighting fixture for external lighting comprises a plurality of light-emitting diode arrays, preferably three light-emitting diode arrays.
  • light-emitting diode arrays which typically have an opening angle of 120 °, all-round illumination can be achieved with only three 5 light-emitting diode arrays.
  • the light-emitting diode arrays are advantageously arranged in this case at an angle of 60 ° to each other.
  • the housing for a lighting fixture for outdoor lighting is dustproof and watertight, and preferably at least IP 54 dustproof and waterproof.
  • the degree of protection IP 54 means 5 protection against splashes of water on all sides and protection against dust deposits. Such protection can be achieved by a design of the housing with seals or sealant at the points where touch parts of the housing. Alternatively, the tightness can be achieved without seals by a high manufacturing quality and good fits.
  • the light emitting diode array and the first part of the heat conducting element are advantageously made so compact that existing other types of light sources, for example the filaments of sodium vapor lamps or mercury vapor lamps, can be replaced by them.
  • the dimensions of the first part of the heat-conducting element with the light-emitting diode field do not exceed the corresponding dimensions of the luminous body to be replaced.
  • the lamp base of a lighting fixture according to the invention is designed so that an existing base or lamp base for a luminous element can be exchanged for a lamp base according to the invention.
  • the attachment points of the lamp base are designed so that for fastening the fastening means can be used, which are also used for fastening the base to be replaced. It can also be used only parts of the fastening means, for example, only holes through the lamp housing or other parts of the lamp.
  • FIG. 1 shows a cross section of a mushroom lamp according to the prior art, - -
  • FIG. 2 shows a cross-section of a mushroom lamp according to an embodiment of the invention
  • FIGS. 3A to 3C are cross sections through the heat conducting element shown in FIG. 2 with a pentagonal cross section
  • FIGS. 4A to 4C show cross sections through the heat conducting element shown in FIG. 2 with a fastening section with a triangular cross section.
  • FIG. 1 shows a cross section of a prior art mushroom lamp 100.
  • the mushroom lamp 100 consists of a lamp base 101, a luminous means carrier 102 which carries a lighting means 103, for example a light bulb, a neon tube or a mercury or sodium vapor lamp, a cover 104, a screen 105 which surrounds the illuminant carrier 102 and a transformer 106, which is arranged in the illuminant carrier 102.
  • the lid 104 is with a
  • the screen 105 is transparent so that the illuminant can illuminate the surroundings of the mushroom lamp all around.
  • the illuminant carrier 102 is inserted into the lamp base 101 and secured with a stud screw 108.
  • the lamp base 101 also carries the screen 105.
  • FIG. 2 shows a cross-section through a mushroom lamp 200 according to the invention, which is modified by a heat-conducting element 202 and a light-emitting diode array 203 according to the invention.
  • the lamp base 201 of the embodiment of the present invention is identical to the prior art lamp base 201, as well as the lampshade 205 and the lid 204.
  • the heat conducting element 202 is arranged according to the invention.
  • the heat-conducting element 202 consists of a lower section 221, which is designed as a heat sink, a middle section 220, which carries three light-emitting diode arrays 203 as the fastening section, and an upper section 222, which is likewise designed as a heat sink.
  • By the heat conducting element 202 extends a bore 312 in the longitudinal direction, through which a tube 211 is inserted.
  • S5 211 is fixed in the lamp base 201 with a stud 208.
  • the leitelement 202 is pulled by a thread at the end of the tube 211, which faces the cover 204, and a nut 210 against a dowel pin 209 which is inserted through a bore which extends transversely through a directed to the heat conduction member, and projects from it ,
  • the heat-conducting element is - -
  • the tube 211 protrudes into a receptacle 207 on the inside of the lid 204 and thus ensures the alignment of the heat-conducting element 202 in the mushroom lamp 200.
  • the heat conduction member 202 can be easily removed from the mushroom lamp by removing the cover, the nut 210 unscrewed and 5, the heat conduction from the tube 211 is pulled up.
  • the installation can be done in the same simple way in reverse order.
  • the light-emitting diode array 203 is screwed onto the middle section 220 of the heat-conducting element 202.
  • a transformer 206 is angeord- 0 net, which supplies the light emitting diode arrays with electrical energy from the customary low-voltage network.
  • FIG. 3A shows a substantially square cross-section through the upper section 322 of the heat-conducting element 202. In the middle of the cross section, the through-hole 312 is arranged. On all four sides of the upper portion 322 of the cherriesleitelements cooling fins 313 are arranged.
  • FIG. 3B shows a cross section of the heat-conducting element 202 in its middle section 220, 320.
  • the heat-conducting element 202 has a pentagonal cross-section.
  • the formation of the cross section as an irregular pentagon with the said occupancy of the sides with light-emitting diode arrays has the advantage that the emission characteristic of the lamp is favorably influenced for outdoor lighting.
  • the two light-emitting diode arrays on the sides 317 and i ⁇ 318 serve to illuminate a street, the angles being chosen so that the main emission direction from the individual LED array is oblique toward the street and further illuminates it in comparison to all-round all-round illumination.
  • the LED field on page 314 illuminates the walkway and buildings behind.
  • FIG. 3C shows a cross-section of the heat-conducting element in its lower section 321.
  • the through hole 312 is arranged in the middle of the cross section.
  • Three of the sides of the substantially rectangular cross section are formed as cooling fins 319.
  • a transformer 306 is fixed to the lower portion 321 of the heat conducting member 302.
  • Figure 4A shows a substantially square cross section through the upper portion 422 of the primaleitelements 202. In the middle of the cross section, the through hole 412 is arranged. On all four sides of the upper portion 422 of the primaleitelements cooling fins 413 are arranged.
  • FIG. 4B shows a cross section of the heat-conducting element 202 in its middle section 220, 420.
  • the heat-conducting element 202 has a triangular cross-section. This is an equilateral triangle, with the three sides 414, 417 and 418 connected by equal angles of 60 ° each.
  • the pages have the same length and each carry a light emitting diode
  • the through hole 412 is arranged approximately at the centroid.
  • the formation of the cross-section as an equilateral triangle with the above-mentioned occupancy of the sides with LED fields has the advantage that the emission of the luminaire despite the onset of only three light-emitting diode fields completely unobstructed radiation when the LED array has an opening angle of at least 120 ° , This allows a uniform ring-around lighting can be realized.
  • FIG. 4C shows a cross section of the heat-conducting element in its lower section 421. ! 5 In the middle of the cross section, the through hole 412 is arranged. Three of the sides of the substantially rectangular cross section are formed as cooling fins 419. On the fourth side, a transformer 406 is fixed to the lower portion 421 of the heat conduction member 202.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention concerne un éclairage extérieur amélioré. L'objectif de la présente invention est de créer un corps d'éclairage d'extérieur comprenant un élément émetteur de lumière très compact, si bien qu'une lampe qui en est équipée peut être très compacte tout en fournissant une puissance lumineuse élevée. Cet objectif est atteint par un corps d'éclairage d'extérieur comportant au moins un réseau de diodes luminescentes (203) et un boîtier (201). Le réseau de diodes luminescentes comprend une pluralité de diodes luminescentes montées en surface sur un seul support. Les diodes luminescentes comprennent un élément de diode et un élément avec luminophore qui lui associé. L'élément de diode et l'élément qui lui est associé sont agencés de manière que la lumière produite en service par l'élément de diode excite le luminophore. Le réseau de diodes luminescentes est monté dans le boîtier qui est fermé et comprend une section essentiellement transparente. Le corps d'éclairage comprend en outre un élément thermoconducteur placé dans le boîtier. Le support du réseau de diodes luminescentes est relié de manière thermiquement conductrice avec un segment de fixation de l'élément thermoconducteur.
PCT/EP2009/066461 2008-12-17 2009-12-04 Système d'éclairage à base de diodes del WO2010076121A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP09799576.5A EP2376829B1 (fr) 2008-12-17 2009-12-04 Système d'éclairage à base de diodes del

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008062413A DE102008062413A1 (de) 2008-12-17 2008-12-17 LED-basiertes Beleuchtungssystem
DE102008062413.6 2008-12-17

Publications (1)

Publication Number Publication Date
WO2010076121A1 true WO2010076121A1 (fr) 2010-07-08

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EP (1) EP2376829B1 (fr)
DE (2) DE102008062413A1 (fr)
WO (1) WO2010076121A1 (fr)

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DE102010015210A1 (de) * 2009-11-20 2011-07-21 LIC Langmatz GmbH, 82467 Leuchte
DE102011101610B3 (de) * 2011-05-13 2012-08-30 Langmatz Gmbh Leuchte
DE102011103605B4 (de) 2011-06-08 2015-09-10 Cooper Crouse-Hinds Gmbh Kühlsystem und led-basierte leuchte, beinhaltend selbiges
DE102011077415A1 (de) * 2011-06-10 2012-12-13 Trilux Gmbh & Co. Kg Außenleuchte mit Befestigungsvorrichtung zur Wärmeabfuhr
DE102013201955B4 (de) * 2013-02-06 2017-02-16 Osram Gmbh Halbleiter-Leuchtvorrichtung mit Wärmerohr
DE202013105401U1 (de) * 2013-11-27 2015-03-02 Bhs-Pro Gmbh Aufsatzleuchte

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JP2003100111A (ja) * 2001-09-27 2003-04-04 Matsushita Ecology Systems Co Ltd 街灯装置及び照明装置
US20040095777A1 (en) * 2002-11-19 2004-05-20 Automatic Power, Inc. High flux LED lighting device
WO2005025932A2 (fr) * 2003-09-08 2005-03-24 Schefenacker Vision Systems Usa Inc. Appareil et procede de montage et de reglage de phares del
US20060002125A1 (en) * 2004-07-01 2006-01-05 Samsung Electro-Mechanics Co., Ltd. Light emitting diode module for automobile headlights and automobile headlight having the same
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US20080158856A1 (en) * 2006-12-28 2008-07-03 Yu-Nung Shen Light-emitting device with a long lifespan

Also Published As

Publication number Publication date
EP2376829B1 (fr) 2013-10-23
EP2376829A1 (fr) 2011-10-19
DE202008017960U1 (de) 2011-02-10
DE102008062413A1 (de) 2010-07-01

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