WO2010061434A1 - 発光素子パッケージ用基板の製造方法および発光素子パッケージ - Google Patents
発光素子パッケージ用基板の製造方法および発光素子パッケージ Download PDFInfo
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- WO2010061434A1 WO2010061434A1 PCT/JP2008/071341 JP2008071341W WO2010061434A1 WO 2010061434 A1 WO2010061434 A1 WO 2010061434A1 JP 2008071341 W JP2008071341 W JP 2008071341W WO 2010061434 A1 WO2010061434 A1 WO 2010061434A1
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
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- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
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- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Abstract
Description
前記発光素子の実装位置下方に、熱伝導性フィラーを含む樹脂から構成された1.0W/mK以上の熱伝導率を有する絶縁層と、
前記絶縁層の内部に配置される当該金属肉厚部を有する金属層と、を備え、
前記金属肉厚部の頂部に熱伝導性マスク部が設けられていることを特徴とする。
発光素子の実装位置下方に形成される金属肉厚部を備える発光素子パッケージ用基板の製造方法であって、
熱伝導性フィラーを含む樹脂から構成された1.0W/mK以上の熱伝導率を有する絶縁接着剤および金属層部材を有する積層体と、熱伝導性マスク部が設けられた金属肉厚部を有する金属層部材とを、積層一体化する積層工程を有することを特徴とする。
2 金属肉厚部
3 表面電極部
4 発光素子
7 封止樹脂
21 金属層
22 熱伝導性マスク部
24 積層体
25 積層体(基板部材)
30a、30b ロール
次に、以上のような本発明の発光素子パッケージ用基板の好適な製造方法について図3を用いて説明する。図3に示すように、熱伝導性マスク部22を頂部に設けた金属肉厚部2が形成された長尺状の金属層21を巻き取った金属層ロール体211を準備する。幅方向サイズ、金属肉厚部2の配置等は、適宜設定される。金属肉厚部2をフォトリソグラフィ法によるエッチングにより形成し、熱伝導性マスク部22は、そのエッチング用レジストとして用いられたものそのものである。
(1)前述の実施形態では、フェイスアップ型の発光素子を搭載する例を示したが、本発明では、一対の電極を底面に備えるフェイスダウン型の発光素子を搭載してもよい。その場合、ソルダ接合を行うこと等によって、ワイヤボンディング等を不要にできる場合がある。また、発光素子の表面と裏面とに電極を有する場合には、ワイヤボンディング等を1本にすることが可能である。
Claims (5)
- 発光素子の実装位置下方に形成される金属肉厚部を備える発光素子パッケージ用基板であって、
前記発光素子の実装位置下方に、熱伝導性フィラーを含む樹脂から構成された1.0W/mK以上の熱伝導率を有する絶縁層と、
前記絶縁層の内部に配置される当該金属肉厚部を有する金属層と、を備え、
前記金属肉厚部の頂部に熱伝導性マスク部が設けられている発光素子パッケージ用基板。 - 発光素子の実装位置下方に形成される金属肉厚部を備える発光素子パッケージ用基板の製造方法であって、
熱伝導性フィラーを含む樹脂から構成された1.0W/mK以上の熱伝導率を有する絶縁接着剤および金属層部材を有する積層体と、熱伝導性マスク部が設けられた金属肉厚部を有する金属層部材とを、積層一体化する積層工程を有する発光素子パッケージ用基板の製造方法。 - 前記絶縁接着剤および金属層部材を有する積層体、および/または、熱伝導性マスク部が設けられた金属肉厚部を有する金属層部材が、予めロール状である請求項2に記載の発光素子パッケージ用基板の製造方法。
- 前記請求項1の発光素子パッケージ用基板を用いた発光素子パッケージ。
- 前記請求項2または3で製造された発光素子パッケージ用基板を用いた発光素子パッケージ。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2008/071341 WO2010061434A1 (ja) | 2008-11-25 | 2008-11-25 | 発光素子パッケージ用基板の製造方法および発光素子パッケージ |
CN200880132076.2A CN102224604A (zh) | 2008-11-25 | 2008-11-25 | 发光元件封装用基板的制造方法及发光元件封装体 |
KR1020117012568A KR20110094298A (ko) | 2008-11-25 | 2008-11-25 | 발광 소자 패키지용 기판의 제조 방법 및 발광 소자 패키지 |
DE112008004171T DE112008004171T5 (de) | 2008-11-25 | 2008-11-25 | Verfahren zum Herstellen von Substraten für eine Baugruppe mit lichtemittierendem Element sowie Baugruppe mit lichtemittierendem Element unter Verwendung eines derartigen Substrats |
US13/131,257 US20110284914A1 (en) | 2008-11-25 | 2008-11-25 | Method for manufacturing substrate for light emitting element package, and light emitting element package |
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PCT/JP2008/071341 WO2010061434A1 (ja) | 2008-11-25 | 2008-11-25 | 発光素子パッケージ用基板の製造方法および発光素子パッケージ |
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WO2010061434A1 true WO2010061434A1 (ja) | 2010-06-03 |
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US (1) | US20110284914A1 (ja) |
KR (1) | KR20110094298A (ja) |
CN (1) | CN102224604A (ja) |
DE (1) | DE112008004171T5 (ja) |
WO (1) | WO2010061434A1 (ja) |
Cited By (2)
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JPWO2014021427A1 (ja) * | 2012-08-02 | 2016-07-21 | 学校法人早稲田大学 | 金属ベースプリント配線板 |
US20220386461A1 (en) * | 2021-05-28 | 2022-12-01 | Ibiden Co., Ltd. | Wiring substrate and method for manufacturing wiring substrate |
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CN102498327B (zh) * | 2009-06-15 | 2015-09-23 | 夏普株式会社 | 发光模块、照明装置、显示装置以及电视接收装置 |
JP4681071B1 (ja) * | 2009-12-17 | 2011-05-11 | 株式会社スズデン | 照明器具 |
CN102804430B (zh) * | 2010-01-19 | 2015-11-25 | Lg伊诺特有限公司 | 封装结构及其制造方法 |
US9698563B2 (en) * | 2010-11-03 | 2017-07-04 | 3M Innovative Properties Company | Flexible LED device and method of making |
KR101181224B1 (ko) * | 2011-03-29 | 2012-09-10 | 성균관대학교산학협력단 | Led 패키지 및 그 제조방법 |
KR101976436B1 (ko) * | 2012-04-12 | 2019-05-09 | 엘지이노텍 주식회사 | 기판, 발광 모듈 및 조명 시스템 |
CN103268914A (zh) * | 2013-05-27 | 2013-08-28 | 北京半导体照明科技促进中心 | Led封装基板及制作工艺 |
KR101548223B1 (ko) * | 2013-10-11 | 2015-08-31 | (주)포인트엔지니어링 | 방열 물질이 내재된 칩 실장 기판용 방열체 제조 방법 |
JP6303949B2 (ja) * | 2013-11-29 | 2018-04-04 | 日亜化学工業株式会社 | 発光装置及び照明器具 |
JP6501075B2 (ja) * | 2016-02-24 | 2019-04-17 | パナソニックIpマネジメント株式会社 | 樹脂構造体とその構造体を用いた電子部品及び電子機器 |
JP2017199803A (ja) * | 2016-04-27 | 2017-11-02 | 日立マクセル株式会社 | 三次元成形回路部品 |
JP7029223B2 (ja) * | 2016-07-13 | 2022-03-03 | ローム株式会社 | 半導体発光装置 |
KR20200085082A (ko) * | 2019-01-04 | 2020-07-14 | 서울반도체 주식회사 | 발광 다이오드 패키지 |
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2008
- 2008-11-25 US US13/131,257 patent/US20110284914A1/en not_active Abandoned
- 2008-11-25 CN CN200880132076.2A patent/CN102224604A/zh active Pending
- 2008-11-25 KR KR1020117012568A patent/KR20110094298A/ko active IP Right Grant
- 2008-11-25 WO PCT/JP2008/071341 patent/WO2010061434A1/ja active Application Filing
- 2008-11-25 DE DE112008004171T patent/DE112008004171T5/de not_active Withdrawn
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---|---|---|---|---|
JPWO2014021427A1 (ja) * | 2012-08-02 | 2016-07-21 | 学校法人早稲田大学 | 金属ベースプリント配線板 |
US20220386461A1 (en) * | 2021-05-28 | 2022-12-01 | Ibiden Co., Ltd. | Wiring substrate and method for manufacturing wiring substrate |
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DE112008004171T5 (de) | 2012-08-23 |
KR20110094298A (ko) | 2011-08-23 |
CN102224604A (zh) | 2011-10-19 |
US20110284914A1 (en) | 2011-11-24 |
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