WO2010038563A1

WO2010038563A1 - Method for scribing substrate of fragile material

Info

Publication number: WO2010038563A1
Application number: PCT/JP2009/064705
Authority: WO
Inventors: 孝志川畑; 良太阪口; 健二村上
Original assignee: 三星ダイヤモンド工業株式会社
Priority date: 2008-09-30
Filing date: 2009-08-24
Publication date: 2010-04-08
Also published as: JP2010083015A; JP5171522B2; KR101256093B1; CN102099169A; CN102099169B; TW201012770A; TWI385134B; KR20110016492A

Abstract

Provided is a scribing method, wherein abnormal destruction or generation of burs due to poor cutting phenomenon do not tend to occur. A scribing method of a substrate (10) of fragile material comprises forming, in the surface of the substrate, an outline scribe line consisting of a closed curve constituting the outline of a product to be cut out, and forming an auxiliary scribe line for assisting division on the outside of the outline scribe line, wherein auxiliary scribe lines (12a-12d, 13a-13d) are directed in the tangential direction of outline scribe lines (11a-11c) and a non-scribe region having a distance of 2 mm or less is left between the auxiliary scribe line and the outline scribe line.

Description

Method for scribing a brittle material substrate

The present invention relates to a scribing method for a scribe line formed in advance on a substrate surface when a product is cut out from a brittle material substrate. The present invention is used, for example, in a scribing process when a region surrounded by a closed curve such as a circle or an ellipse is cut from a glass substrate.
Note that the brittle material here includes ceramics, single crystal silicon, a semiconductor wafer, sapphire, and the like in addition to a glass substrate.

Generally, when a product is cut out from a glass substrate or the like, a method using a scribing wheel (also called a cutter wheel) is widely used.
That is, first, a scribe line (a line-shaped crack having a depth not penetrating through the substrate) is formed by moving the scribing wheel while pressing along a scheduled cutting line including a product outline. Next, a force is applied to cause the substrate to be divided along the scribe line by applying a force to bend the substrate or applying a thermal stress by heating or cooling. Thus, the substrate is broken so that the cracks constituting the scribe line extend in the depth direction. As a result, a completely divided state is reached.

When the contour shape of the product to be cut out is a shape surrounded by a closed curve such as a circle or ellipse, depending on the product layout on the board, part of the product outline may be the edge of the board or the contour of the adjacent product. The entire product contour may form a closed curve in the substrate without touching.
In such a case, the scribe line formed on the substrate forms a scribe line along the contour of the product (referred to as a “scribe scribe line”) and assists in the separation of the end material region outside the scribe line for the contour. An auxiliary scribe line is formed.

This auxiliary scribe line is generated first when the outline scribe line to be cut is broken when the outline scribe line of the adjacent product or the deep crack that penetrates the substrate at the edge of the substrate is generated first. It is used to guide the deep cracks to the contour scribe line. Further, when the contour scribe line is broken, it is used for division when the peripheral edge material is divided and removed.

For example, an example is disclosed in which a single substrate is divided using a breaking line composed of a plurality of circular scribing lines and auxiliary scribe lines connecting them (see Patent Document 1). . According to this document, the auxiliary scribe line approaches the scribe line for contour from substantially the normal direction or the intersecting direction. And it is disclosed that it becomes easy to divide by advancing the crack from the initial crack formed at the substrate end and the presence of an auxiliary scribe line.

On the other hand, if the scribe line for contour and the auxiliary scribe line that form a closed curve intersect, if the auxiliary scribe line breaks down first, abnormal breakage occurs at the intersection, and not only the desired shape can be obtained, but also the plate glass It may be damaged and cannot be used. In order to prevent this, it is disclosed that a gap of about 2 mm is provided between the auxiliary scribe line for separation and the scribe line for contour that forms a closed curve (see Patent Document 2).

JP 2007-55072 A Japanese Patent No. 2926526

FIG. 6 is a diagram showing an example of the layout of the scribe line described in Patent Document 2. Here, when the disc R1 is cut out from the rectangular glass substrate 100, a circular contour scribe line 101 and four auxiliary scribe lines 102a to 102d arranged on the diagonal of the substrate are formed. At this time, if the auxiliary scribe lines 102a to 102d and the contour scribe line 101 directly intersect, abnormal destruction may occur near the intersection. Therefore, the auxiliary scribe lines 102a to 102d are stopped by about 2 mm before the gap. The portions 103a to 103d are provided to suppress abnormal destruction.

However, when a gap is provided between the contour scribe line and the auxiliary scribe line, an uncut phenomenon may occur. FIG. 7 is a diagram illustrating the remaining uncut phenomenon. Spike-shaped uncut portions 104a to 104d are generated at positions corresponding to the gap portions 103a to 103d in FIG.
Accordingly, an object of the present invention is to provide a scribing method in which abnormal destruction and thorns due to uncut phenomenon are less likely to occur.

In the present invention, the above-mentioned problem is solved by devising the positional relationship for forming the contour scribe line and the auxiliary scribe line. Until now, unless the auxiliary scribe line is directed in a direction crossing the outline scribe line, it has been considered difficult to reliably transmit a deep crack that causes a break from the auxiliary scribe line to the outline scribe line. In addition, it has been considered that if non-scribe regions (gap portions 103a to 103d in FIG. 6) are formed in a portion where the contour scribe line and the auxiliary scribe line approach each other, it becomes more difficult to transmit the crack. Therefore, no auxiliary scribe line in the tangential direction was formed. However, the present inventors have found that when the auxiliary scribe line is directed in the tangential direction, the crack is bent in the non-scribe region and reaches the contour scribe line without fail, and the crack can be transmitted to the contour scribe line.

Therefore, the scribing method of the present invention forms on the surface of the brittle material substrate a contour scribe line consisting of a closed curve that constitutes the contour of the product to be cut out, and also forms an auxiliary scribe line that assists the cutting outside the contour scribe line. The brittle material substrate scribing method is such that the auxiliary scribe line is directed in the tangential direction of the contour scribe line. Further, it is formed so as to leave a non-scribe region with a distance of 2 mm or less between the auxiliary scribe line and the outline scribe line.

According to the present invention, these scribe lines are formed so as to leave a non-scribe area of a distance of 2 mm or less between the auxiliary scribe line and the outline scribe line. No abnormal destruction occurs due to deep cracks that have progressed through. In addition, the deep crack that has traveled along the auxiliary scribe line is bent in the non-scribe area and reliably reaches the contour scribe line. In addition, since the auxiliary scribe line is oriented in the tangential direction of the contour scribe line, not only does the thorn-shaped uncut residue that occurs when the auxiliary scribe line is in the normal direction not only occur, but also almost cut off. Break without any remaining is possible.

In the above invention, at least two auxiliary scribe lines may be formed for one contour scribe line.
In this case, it is more preferable to form three or four auxiliary scribe lines around one contour scribe line.
According to the present invention, since the peripheral end material is divided into a plurality of parts, product separation from the substrate is facilitated.

In the above invention, a plurality of contour scribe lines are formed on the substrate in a state of being separated from each other, and the auxiliary scribe lines formed between adjacent contour scribe lines are auxiliary to the contour scribe lines on both sides. It may be shared as a scribe line.
According to the present invention, the number of scribe lines to be formed can be reduced by sharing the auxiliary scribe line.

In this case, the contour scribe lines are aligned and four auxiliary scribe lines are formed around each contour scribe line, and each auxiliary scribe line is arranged on two parallel straight lines. Also good.
According to the present invention, the scribing wheel can be linearly pressed against the substrate, and the auxiliary scribe line can be continuously formed only by temporarily retracting upward in the non-scribe region portion. It is possible to reduce labor and the processing time.

The figure which shows an example of the layout of the scribe line formed by the scribe method which is one Embodiment of this invention. The figure which shows an example of a scribing wheel. The figure which shows the crack formed in the contact vicinity when performing a break. The figure which shows an example of the layout of the scribe line formed by the scribing method which is other one Embodiment of this invention. The figure which shows an example of the layout of the scribe line formed by the scribing method which is other one Embodiment of this invention. The figure which shows the example of a layout of the conventional scribe line. The figure which shows the uncut phenomenon.

Hereinafter, an embodiment of the scribing method according to the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing an example of a layout of scribe lines formed when a plurality of circular products are cut out from a glass substrate, FIG. 1 (a) is an overall view thereof, and FIG. 1 (b) is a partially enlarged view thereof. is there. Moreover, FIG. 2 is a figure which shows an example of the scribing wheel used when forming a scribe line, FIG. 2 (a) is the front view, FIG.2 (b) is a figure which shows a use condition.

First, the scribing wheel used will be described. As the cutting edge of the scribing wheel, as shown in FIG. 2A, it is preferable to use a grooved scribing wheel SH in which the wheel surface is difficult to slide with respect to the substrate surface. By using the grooved scribing wheel, it becomes easy to form a scribe line for a contour having a closed curve in the substrate or to form a linear auxiliary scribe line having a start end and a terminal end in the substrate. As shown in FIG. 2B, the crack M formed in the substrate G when the grooved scribing wheel SH is used becomes deeper than when the grooveless scribing wheel is used. This is more preferable because the occurrence of uncut portions can be further reduced. Specifically, for example, Pennet (registered trademark) which is a grooved scribing wheel manufactured by Samsung Diamond Industrial Co., Ltd. can be used.

Next, the scribing method will be described. Here, as shown in FIG. 1, a scribe for cutting out three disks R1 to R3 from a strip-shaped glass substrate 10 will be described.
The layout of the discs R1 to R3 (products) is set in advance on the glass substrate 10. Here, in order to facilitate processing, a layout in which the discs R1 to R3 are arranged in a line is adopted. In order to further increase the number of discs to be cut out, a layout in which disc-like products are aligned vertically and horizontally on a substrate is set.

The scribing wheels SH (FIG. 2) are used to form the contour scribe lines 11a to 11c at the positions that are the contours of the disks R1 to R3 to be cut out.
Subsequently,

auxiliary scribe lines

12a, 12b, 12c, and 12d are formed on the line L1, and

auxiliary scribe lines

13a, 13b, 13c, and 13d are formed on the line L2. The lines L1 and L2 are parallel to each other and both form a tangent to the disks R1 to R3. That is, the line L1 is in contact with the contour scribe lines 11a to 11c at the contacts Ca1, Cb1, and Cc1, respectively, and the line L2 is in contact with the contour scribe lines 11a to 11c at the contacts Ca2, Cb2, and Cc2, respectively.

The auxiliary scribe lines 12a to 12d and 13a to 13d approach on the scribe lines L1 and L2 until the distance d from the contour scribe lines 11a to 11c is 2 mm or less (see FIG. 1B). The contact points Ca1, Cb1, Cc1, Ca2, Cb2, and Cc2 are necessarily separated from the contour scribe lines 11a to 11c.

When the auxiliary scribe line is actually formed, the scribing wheel SH is moved down along the lines L1 and L2 in a state where the scribing wheel SH is lowered and brought into pressure contact, and when approaching each contact, the scribing wheel SH is moved to the glass substrate 10. It is moved in a state where it is lifted and separated from the contact point, and when it is separated from the contact point again, it is lowered and moved in a state where it is brought into pressure contact.

After the scribing method and the auxiliary scribe line are formed by the above scribing method, the break is performed.
The break may be manually stressed to bend the substrate along the scribe line, or may be mechanically applied.

FIG. 3 is a diagram showing a crack formed in the vicinity of the contact when a break is performed. For example, cracks 15a and 15b bent from the

auxiliary scribe lines

13a and 13b are generated between the outline scribe line 11a and the

auxiliary scribe lines

13a and 13b, and these reach the outline scribe line 11a with certainty.

Then, the auxiliary scribe line 13a, the crack 15a, the contour scribe line 11a (part), the crack 15b, and the break line following the auxiliary scribe line 13b are formed, thereby generating thorn-like cutouts. Can be separated.
The auxiliary scribe line 12a, the contour scribe line 11a, and the auxiliary scribe line 12b are also formed with similar cracks, and can be separated without generating thorn-like uncut portions.
Further, the remaining part of the contour scribe line 11a can be separated without any problem as before.

As a result of the above, the disc R1 can be separated without causing abnormal destruction or uncut portions over the entire circumference of the contour scribe line 11a. The same applies to the other disks R2 and R3.

FIG. 4 is a diagram showing a scribing method according to another embodiment of the present invention. Here, scribe for cutting out one disc R1 from the glass substrate 20 will be described.
A contour scribe line 21 is formed at a position that is the contour of the disc R1 to be cut out.
Subsequently,

auxiliary scribe lines

22a, 22b, 22c, and 22d are formed. Each auxiliary scribe line is rotated by 90 degrees and is arranged in parallel with each edge of the substrate 20.

As shown in FIG. 1B, each auxiliary scribe line 22a to 22d approaches until the distance d from the contour scribe line 21 becomes 2 mm or less, but is formed so as to be separated from the contour scribe line 21. To do.
Also in this case, the disc R1 can be separated without causing abnormal breakage or uncut portions over the entire circumference of the contour scribe line 21 as in the above-described embodiment.

FIG. 5 is a diagram showing a scribing method according to still another embodiment. The scribe for cutting out one disc R1 from the glass substrate 30 will be described.
A contour scribe line 31 is formed at a position that is the contour of the disc R1 to be cut out.
Subsequently,

auxiliary scribe lines

32a, 32b, 32c, and 32d are formed. Each auxiliary scribe line is rotated by 90 degrees, but is arranged so as to be non-parallel to each edge of the substrate 20.

The auxiliary scribe lines 22 a to 22 d are formed so as to approach each other until the distance d from the contour scribe line 21 becomes 2 mm or less, but is separated from the contour scribe line 21.
Also in this case, similarly to FIG. 4, the disc R1 can be separated without causing abnormal breakage or uncut portions over the entire circumference of the contour scribe line 31.

The scribing method of the present invention can be used for scribing when a product product surrounded by a closed curve is cut out from a glass substrate or the like.

10 Glass substrates 11a to 11c Contour scribe lines 12a to 12d Auxiliary scribe lines 13a to 13d Auxiliary scribe lines

Claims

A method for scribing a brittle material substrate, in which a contour scribe line comprising a closed curve constituting the contour of a product to be cut is formed on the surface of the brittle material substrate, and an auxiliary scribe line is formed outside the contour scribe line to assist in the division. Because
The auxiliary scribe line is directed in a tangential direction of the contour scribe line;
Furthermore, the scribing method is characterized in that a non-scribe region having a distance of 2 mm or less is left between the auxiliary scribe line and the contour scribe line.
The scribing method according to claim 1, wherein at least two auxiliary scribe lines are formed for one contour scribe line.
A plurality of contour scribe lines are formed side by side in a state separated from each other on the substrate,
The scribe method according to claim 1, wherein auxiliary scribe lines formed between adjacent outline scribe lines are shared as auxiliary scribe lines for the outline scribe lines on both sides.
The contour scribe line is aligned, four auxiliary scribe lines are formed around each contour scribe line, and each auxiliary scribe line is arranged on two parallel straight lines. Scribe method.