CN102099169A - Kawabata takashi,sakaguchi ryota,murakami kenji - Google Patents

Kawabata takashi,sakaguchi ryota,murakami kenji Download PDF

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Publication number
CN102099169A
CN102099169A CN2009801285566A CN200980128556A CN102099169A CN 102099169 A CN102099169 A CN 102099169A CN 2009801285566 A CN2009801285566 A CN 2009801285566A CN 200980128556 A CN200980128556 A CN 200980128556A CN 102099169 A CN102099169 A CN 102099169A
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CN
China
Prior art keywords
line
profile
auxiliary
auxiliary line
substrate
Prior art date
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Granted
Application number
CN2009801285566A
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Chinese (zh)
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CN102099169B (en
Inventor
川畑孝志
阪口良太
村上健二
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication of CN102099169A publication Critical patent/CN102099169A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04Cutting or splitting in curves, especially for making spectacle lenses
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • C03B33/105Details of cutting or scoring means, e.g. tips
    • C03B33/107Wheel design, e.g. materials, construction, shape

Abstract

Provided is a scribing method, wherein abnormal destruction or generation of burs due to poor cutting phenomenon do not tend to occur. A scribing method of a substrate (10) of fragile material comprises forming, in the surface of the substrate, an outline scribe line consisting of a closed curve constituting the outline of a product to be cut out, and forming an auxiliary scribe line for assisting division on the outside of the outline scribe line, wherein auxiliary scribe lines (12a-12d, 13a-13d) are directed in the tangential direction of outline scribe lines (11a-11c) and a non-scribe region having a distance of 2 mm or less is left between the auxiliary scribe line and the outline scribe line.

Description

The rose method of brittle substrate
Technical field
The present invention relates to a kind ofly when brittle substrate cuts out product, be pre-formed the rose method of the line on real estate.The present invention for example be used for from glass substrate cut out the whole week by as circle or oval closed curve surround regional the time delineation processing.
In addition, fragile material herein also comprises pottery, monocrystalline silicon, semiconductor wafer, sapphire etc. except that glass substrate.
Background technology
Usually, when cutting out product from glass substrate etc., use the method for scribe wheel (being also referred to as break bar) extensively to be utilized.
That is, at first, the disjunction preset lines one side crimping scribe wheel that the edge comprises the outline line of product simultaneously moves it, and forms line (the wire slight crack that does not run through the degree of depth of substrate) thus.Next applies the power that makes curved substrate or applies the thermal stress that is produced by heating or cooling and gives the power of carrying out disjunction along line.Thus, make the slight crack that consists of line stretch and make the substrate fracture towards depth direction.Its result reaches the state of complete disjunction.
When the contour shape of the product that will cut out is served as reasons the shape that surrounds such as circular or oval-shaped closed curve, layout according to the product on the substrate, sometimes the part of the profile of product does not contact with the profile of the product of edge of substrate or adjacency, and the whole profile of product forms closed curve in substrate.
In such cases, be formed at line on the substrate and form line along the profile of product (be called profile with line), and be positioned at profile and form with the sapwood zone in the outside of line the auxiliary line of auxiliary disjunction.
This auxiliary line be when with respect to the profile of wanting disjunction with line, when the darker slight crack that runs through substrate produces earlier with line or edge of substrate place and ruptures at the profile of adjacency product, till the darker slight crack that is used for producing earlier guides so far profile to use to rule.In addition, when this profile during with the line fracture, this auxiliary line is used to cut apart and cuts apart purposes when removing on every side sapwood.
For example, disclosing has in a substrate, utilize comprise form many circular profiles with line, and the auxiliary line of binding between them cut off the example (with reference to patent documentation 1) that line carries out disjunction.According to this document, with line, make auxiliary line approaching from the direction of roughly normal direction or intersection with respect to profile.And, disclose to have from the initial be full of cracks that is formed at edge of substrate and make the be full of cracks development, and make disjunction become easy because having auxiliary the line.
On the other hand, intersect with line and auxiliary line if form the profile of closed curve, when the damage of auxiliary line develops earlier, produce abnormal damage at this intersection point place so, exist not only can't to obtain desired shape, and the damaged and situation about can't use of plate glass.For the anti-situation of planting here, disclosing has at separatory auxiliary line and the profile that forms closed curve with crack (with reference to patent documentation 2) between arranging about 2mm between ruling.
The prior art document
Patent documentation
Patent documentation 1: the Japan Patent spy opens the 2007-55072 communique
Patent documentation 2: No. 2926526 communique of Japan Patent
Summary of the invention
Fig. 6 is the figure of an example of the layout of the line put down in writing in the patent documentation 2 of expression.Herein, when cutting out plectane R1 from square glass substrate 100, the conglobate profile of shape is with line 101 and be configured in four auxiliary line 102a~102d on the diagonal of substrate.At this moment, if auxiliary line 102a~102d directly intersects with line 101 with profile, might near intersection point, produce abnormal damage so, therefore so that the mode that auxiliary line 102a~102d stops before about profile is with the 2mm of line 101 arranges gap portion 103a~103d, thus the inhibition abnormal damage.
But, when between profile is with line and auxiliary line, being provided with the gap, produce the cutting residual phenomena sometimes.Fig. 7 is the figure of the cutting residual phenomena that produces of expression.On position, produce the cutting residual fraction 104a~104d of thorn-like corresponding to gap portion 103a~103d of Fig. 6.
Therefore, the object of the present invention is to provide a kind of difficult generation abnormal damage to reach by the rose method that cuts the caused thorn of residual phenomena.
The present invention forms profile with ruling and assisting the position relation of line to solve described problem by studying intensively.Up to now, it is generally acknowledged if auxiliary line not on the direction of intersecting with line with profile towards profile with line, be difficult to so to cause that the darker slight crack of fracture positively is passed to profile with ruling from auxiliary line.And, it is generally acknowledged that if form non-scored area at profile with line and the part of assisting line to be close (be that gap portion 103a~103d), the transmission of slight crack becomes more and more difficult so among Fig. 6.Therefore, do not formed the auxiliary line of tangential direction.But the present inventor finds when making auxiliary line towards tangential direction, positively arrives profile after the slight crack bending with line in non-scored area, and slight crack can be passed to profile with ruling.
Therefore, rose method of the present invention is to form the profile of closed curve of the profile that comprises the product that formation will cut out on the surface of brittle substrate with line, and form the rose method of the brittle substrate of the auxiliary line of assisting disjunction at profile with the outside of line, and assist line towards the tangential direction of profile with line.In addition, to form these line in the mode of assisting line and profile with the non-scored area of the distance below the residual 2mm between ruling.
According to the present invention, to form these line in the mode of assisting line and profile with the non-scored area of the distance below the residual 2mm between ruling, therefore when fracture, can not produce by making the caused unusual damage of darker slight crack that auxiliary line is preceding and then form.And, make the auxiliary darker slight crack front and then that form of ruling after non-scored area bending, positively arrive profile with till ruling.In addition, assisting rules uses the tangential direction of line towards profile owing to make, and the cutting of the thorn-like when therefore not only no longer generation is scribed ss normal direction as assisting is residual, and can realize almost not having the residual fracture of cutting.
In described invention, also can form two auxiliary line at least with respect to a profile with line.
In the case, more preferably assist line with forming three or four around ruling at a profile.
According to the present invention and since will around sapwood be divided into polylith, therefore products of separated becomes easy from the substrate.
In addition, in described invention, many profiles are formed on the described substrate with the state of mutual isolation side by side with line, and the profile that is formed at adjacency is shared with the auxiliary line of ruling as the profile at both sides with the auxiliary line between the line.
According to the present invention,, can reduce the bar number of formed line by shared auxiliary line.
In the case, also can assist line at each profile with forming four around ruling, and each auxiliary line is configured on two parallel straight lines with profile with the line alignment arrangements.
According to the present invention, as long as scribe wheel is moved with respect to the crimping of substrate orthoscopic ground, and the part of non-scored area temporarily towards above keep out of the way, just form auxiliary line serially, therefore can reduce the operation of processing, and can shorten process time.
Description of drawings
Fig. 1 is the figure of an example of the layout of the expression formed line of rose method that utilizes an example of the present invention.
Fig. 2 is the figure of an example of expression scribe wheel.
Fig. 3 is expression is formed near the slight crack of contact when rupturing figure.
Fig. 4 is the figure of an example of the layout of the expression formed line of rose method that utilizes another example of the present invention.
Fig. 5 is the figure of an example of the layout of the expression formed line of rose method that utilizes another example of the present invention.
Fig. 6 is the figure of the layout example of the previous line of expression.
Fig. 7 is the figure of expression cutting residual phenomena.
[explanation of symbol]
10 glass substrates
11a~11c profile is with ruling
The auxiliary line of 12a~12d
The auxiliary line of 13a~13d
The specific embodiment
Below, use a graphic example to rose method of the present invention to describe.Fig. 1 is the figure of expression one example of the layout of formed line when glass substrate cuts out a plurality of circular product, and Fig. 1 (a) is its overall diagram, and Fig. 1 (b) is a partial enlarged drawing.In addition, Fig. 2 is the figure that expression forms an example of employed scribe wheel when ruling, and Fig. 2 (a) is its front elevation, and Fig. 2 (b) is the figure of expression user mode.
At first, employed scribe wheel is described.The point of a knife of scribe wheel preferably uses the scribe wheel SH of wheel face with respect to the trough of belt of the difficult slip of real estate shown in Fig. 2 (a).By using the scribe wheel of trough of belt, in substrate, form easily the profile that comprises closed curve is positioned at the linearity of substrate with line or formation top and terminal auxiliary line.In addition, shown in Fig. 2 (b), when using the scribe wheel SH of trough of belt, it is darker when using the scribe wheel of slotless to be formed at slight crack M on the substrate G.Can further reduce the residual generation of cutting thus, so more preferably.Particularly, for example can use the scribe wheel of the trough of belt of Samsung diamond industry (Mitsuboshi Diamond Industrial) limited company manufacturing is Penett (registration mark).
Secondly, rose method is described.Herein, as shown in Figure 1, the delineation that is used for cutting out from the glass substrate 10 of band shape three plectane R1~R3 is described.
On glass substrate 10, set the layout of plectane R1~R3 (product) in advance., become easily herein, be set at and make plectane R1~R3 be arranged in the layout of row for making processing.In addition, during the quantity of the plectane that will cut out when the further increase of wish, set the layout that discoideus PRODUCTS FIELD ground is arranged at substrate.
In the position of the profile that becomes the plectane R1~R3 that desires to cut out, use scribe wheel SH (Fig. 2) to form profile line 11a~11c.
Then, online L1 goes up and forms auxiliary line 12a, 12b, 12c, 12d, and online L2 goes up and forms auxiliary line 13a, 13b, 13c, 13d.Line L1, L2 are parallel to each other, and all form the tangent line of plectane R1~R3.That is, line L1 is connected with line 11a~11c with profile by contact Ca1, Cb1, Cc1 respectively, and line L2 passes through respectively contact Ca2, Cb2, Cc2 and is connected with the 11a~11c that rules with profile.
Each auxiliary line 12a~12d, 13a~13d are close on line L1, L2, until the distance profile with the line 11a~11c become below the 2mm apart from d till (with reference to Fig. 1 (b)), but make each auxiliary line 12a~12d, 13a~13d must be, thereby to form each auxiliary line with mode that profile separates with line 11a~11c away from each contact Ca1, Cb1, Cc1, Ca2, Cb2, Cc2.
When reality forms auxiliary line, form successively as follows auxiliary line: on glass substrate 10, scribe wheel SH is moved with state L1 along the line, the L2 of the also crimping that descends, the state that scribe wheel SH is left to rise from glass substrate 10 moves, when scribe wheel SH makes during again away from contact it to descend and state of crimping moves.
Form profile with after line and assisting line by above rose method, rupture.
Fracture can by manually giving the stress that makes curved substrate along line, also can mechanically be given this stress.
Fig. 3 is expression is formed near the slight crack of contact when rupturing figure.For example at profile with between line 11a and auxiliary line 13a, the 13b, produce from slight crack 15a, the 15b of auxiliary line 13a, 13b bending, and these slight cracks positively arrive profile with the 11a that rules.
And, forming with auxiliary line 13a, slight crack 15a, profile with line 11a (part), slight crack 15b, the geosutures of assisting the 13b that rules to link to each other, the cutting that can not produce thus thorn-like is residual and separate.
With line 11a, auxiliary line 12b, also form identical slight crack about auxiliary line 12a, profile, thereby it is residual and separate not produce the cutting of thorn-like.
In addition, about profile with the line 11a residual fraction, can with similarly separate without problems up to now.
According to above result, can spread all over profile and not produce unusual damage with whole week of line 11a or cut residual and separate plectane R1.Other plectanes R2, R3 are also identical.
Fig. 4 is the figure of the rose method of expression another example of the present invention.Herein, the delineation that is used for cutting out from glass substrate 20 a plectane R1 is described.
On the position of the profile that becomes the plectane R1 that desires to cut out, form profile with ruling 21.
Then, form auxiliary line 22a, 22b, 22c, 22d.Each auxiliary line becomes the relation of each 90-degree rotation, and disposes abreast with the limit of respectively holding of substrate 20 respectively.
Each auxiliary line 22a~22d is close as shown in Fig. 1 (b), until apart from profile with line 21 become below the 2mm apart from d till, but to form with 21 modes of separating of line with profile.
In the case, also can with described example similarly, spread all over profile and do not produce abnormal damage with line whole week of 21 or cut residual and separate plectane R1.
Fig. 5 is the figure of the rose method of another example of expression.The delineation that is used for cutting out from glass substrate 30 a plectane R1 is described.
On the position of the profile that becomes the plectane R1 that desires to cut out, form profile with ruling 31.
Then, form auxiliary line 32a, 32b, 32c, 32d.Each auxiliary line becomes the relation of each 90-degree rotation, but is not parallel configuration with the limit of respectively holding of substrate 20 respectively.
Each auxiliary line 22a~22d is close, until apart from profile with line 21 become below the 2mm apart from d till, but to form with 21 modes of separating of line with profile.
In the case, also can with Fig. 4 similarly, spread all over profile and do not produce abnormal damage with line whole week of 31 or cut residual and separate plectane R1.
[utilizability on the industry]
Delineation processing when delineation method of the present invention can be used for cutting out the product that is surrounded by closed curve from glass substrate etc.

Claims (4)

1. rose method, it is to form the profile of closed curve of the profile that comprises the product that formation will cut out on the surface of brittle substrate with line, and form the rose method of brittle substrate of the auxiliary line of auxiliary disjunction at described profile with the outside of line, it is characterized in that:
The tangential direction that described auxiliary line is rule towards described profile usefulness,
In addition, the mode with the non-scored area of the distance below the residual 2mm between described auxiliary line and described profile are with line forms these line.
2. rose method according to claim 1 is characterized in that: with line, form at least two auxiliary line with respect to a profile.
3. rose method according to claim 1 is characterized in that: many profiles are formed on the described substrate side by side with the state of line with mutual isolation, and
The profile that is formed at adjacency is to share with the auxiliary line of line as the profile for both sides with the auxiliary line between the line.
4. rose method according to claim 3 is characterized in that: profile with the line alignment arrangements, is assisted line at each profile with forming four around ruling, and each auxiliary line is configured on two parallel straight lines.
CN200980128556.6A 2008-09-30 2009-08-24 The method for breaking of brittle substrate Expired - Fee Related CN102099169B (en)

Applications Claiming Priority (3)

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JP2008-254933 2008-09-30
JP2008254933A JP5171522B2 (en) 2008-09-30 2008-09-30 Method for scribing a brittle material substrate
PCT/JP2009/064705 WO2010038563A1 (en) 2008-09-30 2009-08-24 Method for scribing substrate of fragile material

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CN102099169A true CN102099169A (en) 2011-06-15
CN102099169B CN102099169B (en) 2016-02-03

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KR (1) KR101256093B1 (en)
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TW (1) TWI385134B (en)
WO (1) WO2010038563A1 (en)

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CN105189379A (en) * 2013-06-27 2015-12-23 日本电气硝子株式会社 Method for scribing tempered glass sheet
CN106316090A (en) * 2016-08-18 2017-01-11 武汉市楚源光电有限公司 Method for cutting ultra-thin tempered glass by laser
CN107442947A (en) * 2016-05-10 2017-12-08 株式会社迪思科 The application method of partition tools and partition tools
CN109421164A (en) * 2017-08-31 2019-03-05 三星钻石工业股份有限公司 Hold material separation method
CN109421176A (en) * 2017-08-31 2019-03-05 三星钻石工业股份有限公司 Hold material separation method
CN109715570A (en) * 2016-10-14 2019-05-03 日本电气硝子株式会社 The manufacturing method of glass plate
CN114929636A (en) * 2020-01-08 2022-08-19 日本电气硝子株式会社 Method for manufacturing glass plate

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KR20150123845A (en) 2013-02-25 2015-11-04 코닝 인코포레이티드 Methods of Manufacturing a Thin Glass Pane
JP6011476B2 (en) * 2013-06-27 2016-10-19 日本電気硝子株式会社 Scribing method of tempered glass sheet
JP5988043B2 (en) * 2013-06-27 2016-09-07 日本電気硝子株式会社 Scribing method of tempered glass sheet
JP6589358B2 (en) * 2015-04-30 2019-10-16 三星ダイヤモンド工業株式会社 Method for dividing brittle material substrate
KR20210149304A (en) 2020-06-02 2021-12-09 한국미쯔보시다이아몬드공업(주) Compass type scribe device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54149720A (en) * 1978-05-16 1979-11-24 Nippon Sheet Glass Co Ltd Closed curved contour line cutting of glass plate
JPH05330838A (en) * 1991-12-02 1993-12-14 Sato Kazuo Method for cutting work out of planar articles, such as glass
JP2926526B2 (en) * 1992-07-21 1999-07-28 和郎 佐藤 Cutting method for plate-shaped brittle material
JPH11263632A (en) * 1998-03-16 1999-09-28 Beldex:Kk Scribing method and apparatus therefor as well as disk for memory medium
CN1708381A (en) * 2002-10-29 2005-12-14 三星钻石工业股份有限公司 Method and device for scribing fragile material substrate
JP2007055072A (en) * 2005-08-24 2007-03-08 Lemi Ltd Method and apparatus for high-frequency heating/cutting based on dielectric loss of brittle material

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004217492A (en) * 2003-01-17 2004-08-05 Murakami Corp Method of cutting out glass plate
JP5330838B2 (en) * 2009-01-19 2013-10-30 新日鉄住金エンジニアリング株式会社 Combustion burner for combustible gas generated from waste gasification

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54149720A (en) * 1978-05-16 1979-11-24 Nippon Sheet Glass Co Ltd Closed curved contour line cutting of glass plate
JPH05330838A (en) * 1991-12-02 1993-12-14 Sato Kazuo Method for cutting work out of planar articles, such as glass
JP2926526B2 (en) * 1992-07-21 1999-07-28 和郎 佐藤 Cutting method for plate-shaped brittle material
JPH11263632A (en) * 1998-03-16 1999-09-28 Beldex:Kk Scribing method and apparatus therefor as well as disk for memory medium
CN1708381A (en) * 2002-10-29 2005-12-14 三星钻石工业股份有限公司 Method and device for scribing fragile material substrate
JP2007055072A (en) * 2005-08-24 2007-03-08 Lemi Ltd Method and apparatus for high-frequency heating/cutting based on dielectric loss of brittle material

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105189379A (en) * 2013-06-27 2015-12-23 日本电气硝子株式会社 Method for scribing tempered glass sheet
US20160115068A1 (en) * 2013-06-27 2016-04-28 Nippon Electric Glass Co., Ltd. Method for scribing tempered glass sheet
CN107442947A (en) * 2016-05-10 2017-12-08 株式会社迪思科 The application method of partition tools and partition tools
CN106316090A (en) * 2016-08-18 2017-01-11 武汉市楚源光电有限公司 Method for cutting ultra-thin tempered glass by laser
CN109715570A (en) * 2016-10-14 2019-05-03 日本电气硝子株式会社 The manufacturing method of glass plate
CN109715570B (en) * 2016-10-14 2021-09-28 日本电气硝子株式会社 Method for manufacturing glass plate
CN109421164A (en) * 2017-08-31 2019-03-05 三星钻石工业股份有限公司 Hold material separation method
CN109421176A (en) * 2017-08-31 2019-03-05 三星钻石工业股份有限公司 Hold material separation method
CN114929636A (en) * 2020-01-08 2022-08-19 日本电气硝子株式会社 Method for manufacturing glass plate

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TW201012770A (en) 2010-04-01
WO2010038563A1 (en) 2010-04-08
JP2010083015A (en) 2010-04-15
TWI385134B (en) 2013-02-11
CN102099169B (en) 2016-02-03
KR20110016492A (en) 2011-02-17
KR101256093B1 (en) 2013-04-23
JP5171522B2 (en) 2013-03-27

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