CN107442947A - The application method of partition tools and partition tools - Google Patents
The application method of partition tools and partition tools Download PDFInfo
- Publication number
- CN107442947A CN107442947A CN201710280586.5A CN201710280586A CN107442947A CN 107442947 A CN107442947 A CN 107442947A CN 201710280586 A CN201710280586 A CN 201710280586A CN 107442947 A CN107442947 A CN 107442947A
- Authority
- CN
- China
- Prior art keywords
- pressing component
- starting point
- outside
- segmentation
- partition tools
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B27/00—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for
- B25B27/02—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for for connecting objects by press fit or detaching same
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/06—Severing by using heat
- B26F3/16—Severing by using heat by radiation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Toxicology (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Abstract
The application method of partition tools and partition tools is provided, the plate object annularly formed with segmentation starting point is divided into inner side and outer side, had：Inner side pressing component, it on the inside of the segmentation starting point that is annularly formed to pressing；Outside pressing component, it on the outside of the segmentation starting point that is annularly formed to pressing；And connecting member, it links inner side pressing component and outside pressing component, inner side pressing component is movably installed relative to connecting member, the front end of inner side pressing component is exerted a force so as to more prominent to pressing direction than the front end of outside pressing component under non-pressed state, and the application method of partition tools comprises at least：Flexible strip arranges process, and the plate object annularly formed with segmentation starting point is disposed on flexible strip；And segmentation process, while using inner side pressing component to carrying out pressing on the inside of the segmentation starting point that is annularly formed on plate object while being pressed using outside pressing component outside and splitting plate object.
Description
Technical field
The present invention relates to the application method of partition tools He the partition tools, the partition tools will be annularly formed with segmentation
The plate object of starting point is divided into inner side and outer side.
Background technology
Divided by segmentation preset lines and on front formed with multiple devices such as IC, LSI, LED, SAW device, power device
Chip each device is divided into by the segmentation starting point formed by laser processing device, each device for splitting to obtain is answered
(for example, referring to patent document 1 in the electronic equipments such as mobile phone, personal computer, ligthing paraphernalia.).
Also, cut out the portion of circle in glass, sapphire, lithium tantalate (LT), lithium niobate (LN), carborundum from tabular etc.
In the case of part, the laser processing device that can annularly form segmentation starting point is used.
As the laser processing device, following several types be present：As shown in above-mentioned patent document 1, irradiation pair
There is the laser beam of absorbefacient wavelength in machined object and implement ablation so as to form the type of segmentation starting point；Will be right
The focal point in machined object with the laser beam of the wavelength of permeability is positioned at the inside of machined object and is irradiated simultaneously
Implement modification layer and form processing so as to form the type of segmentation starting point (with reference to patent document 2.)；And will have for machined object
The focal point for having the laser beam of the wavelength of permeability be positioned at desired position and implement to be formed from front to the back side by thin
Hole and around the pore noncrystalline form shield tunnel processing so as to formed segmentation starting point type (for example, referring to special
Sharp document 3.).
Particularly when form segmentation starting point as the ring-type of segmentation starting point on the substrates such as glass plate and by the segmentation
In the case of the inner side and outer side separation of point, preferably using the shield tunnel formed with the fragile layer from front to the back side as segmentation
Starting point.
Patent document 1：Japanese Unexamined Patent Publication 10-305420 publications
Patent document 2：No. 3408805 publications of Japanese Patent Publication No.
Patent document 3：Japanese Unexamined Patent Publication 2014-221483 publications
But even in order to cut out circle part and the segmentation starting point of ring-type is formed so as to enter by shield tunnel
In the case of row separation, because the inner side and outer side curve-like of the segmentation starting point of the ring-type is close to, so it is difficult to efficiently and reliable
The handwork, it is necessary to dependent on experienced operator is split on ground to both, the problem of processing efficiency is relatively low be present.
The content of the invention
The present invention is to complete in view of the above fact, and its main technical task is, there is provided partition tools and this point
The application method of instrument is cut, the partition tools can be carried out reliably and efficiently to the plate object annularly formed with segmentation starting point
Segmentation.
In order to solve above-mentioned main technical task, according to the present invention, there is provided a kind of partition tools, will annularly formed with
The plate object of segmentation starting point is divided into inner side and outer side, wherein, the partition tools have：Inner side pressing component, it is to annular in shape
Pressed on the inside of the segmentation starting point of formation；Outside pressing component, the outside of its segmentation starting point to annularly being formed are carried out
Pressing；And connecting member, its by the inner side pressing component and the link of outside pressing component, the inner side pressing component relative to
The connecting member is movably installed, the front end of the inner side pressing component exerted a force so as under non-pressed state than on the outside of this
The front end of pressing component is prominent to pressing direction.
The inner side pressing component can also be configured to relative to the connecting member to be exerted a force by extensible member to pressing direction
Mode install, the outside pressing component can also be configured to 4 are equipped in periphery centered on the inner side pressing component.
And then can also be configured to that multiple inner side pressing components are installed according to the interval of regulation relative to connecting member, and with
The inner side pressing component is accordingly provided with multiple outside pressing components.
Also, according to the present invention, there is provided the application method of partition tools, use above-mentioned partition tools, the partition tools
Application method comprise at least following process：Flexible strip arranges process, and the plate object annularly formed with segmentation starting point is matched somebody with somebody
It is located on flexible strip；And segmentation process, while using the inner side pressing component to annularly forming the segmentation on plate object
Pressed on the inside of starting point, while being entered using the outside pressing component to being pressed on the outside of segmentation starting point to plate object
Row segmentation, can also by pressing component on the inside of this and this on the outside of pressing component pressed when, flexible strip is extended
And implement the segmentation process.
According to the application method of the partition tools of the present invention and the partition tools, the partition tools are configured to have：Inner side
Pressing component, it on the inside of the segmentation starting point that is annularly formed to pressing；Outside pressing component, it is to annularly forming
Pressed on the outside of segmentation starting point；And connecting member, it links the inner side pressing component and the outside pressing component, should
Inner side pressing component is movably installed relative to the connecting member, and the front end of the inner side pressing component is exerted a force so as to non-
It is more prominent to pressing direction than the front end of the outside pressing component under pressed state, thus, make inner side pressing component first and ring-type
Split the interior side contacts of starting point and pressed, and then segmentation starting point of the outside pressing component to the ring-type can be made by pressing
The region in outside pressed, the segmentation starting point acting shear stress to ring-type and to the plate of the segmentation starting point formed with ring-type
The region of the inner side of shape thing and the region in outside carry out reliable Ground Split.
Brief description of the drawings
Fig. 1 (a) and (b) is according to the present invention and the exploded view and overall perspective view of the partition tools of composition.
Fig. 2 is the process for illustrating to form segmentation starting point on the plate object split by partition tools of the invention
Explanation figure.
Fig. 3 (a), (b), (c) and (d) is the explanation figure for illustrating the method using partition tools in the present invention.
Fig. 4 (a) and (b) is to show according to the present invention and the figure of the other embodiment of composition.
Label declaration
1：Partition tools；2：Connecting member；3：Outside pressing component；4：Inner side pressing component；7：Helical spring；8：It is fixed
Part；9：Hold part；10、100：Glass plate (plate object)；20：Laser light irradiation unit；30、30′：Flexible strip.
Embodiment
Hereinafter, the partition tools and the application method of the partition tools that are formed according to the present invention are said referring to the drawings
It is bright.
In order to which the construction of the partition tools 1 to the present invention illustrates and shows each STRUCTURE DECOMPOSITION and in Fig. 1 (a)
Go out.Partition tools 1 substantially include：Connecting member 2, its top view are formed as rectangular shape, are equipped with its lower face side outer
Side pressing component 3；The inner side pressing component 4 of column, it is arranged in the insertion hole portion 2a at the center for being formed at the connecting member 2
And it is retained as free to advance or retreat；And part 9 is held, it is disposed in the upper surface side of connecting member 2 and is formed as gate shape.
The outside pressing component 3 is disposed in 4 angles of the lower face side of connecting member 2 respectively, and they are to tabular described later
The exterior lateral area of thing is pressed.Also, on inner side pressing component 4, the spiral shell as extensible member is installed in axle portion 41
Spring 7 is revolved, the rearward end of axle portion 41 is inserted from lower face side relative to the insertion hole portion 2a for being formed at connecting member 2, at this
The upper surface side of connecting member 2 makes the internal thread part 81 of fixed component 8 and is formed at the external thread part of the rearward end of the axle portion 41
42 screw togather.By such composition, outside pressing component 3 and inner side pressing component 4 link by connecting member 2.Due to solid
Determine part 8 external diameter be set to it is bigger than the internal diameter for penetrating hole portion 2a, so the fixed component 8 be used as on the inside of pressing component 4
Retaining member and play function ((b) of reference picture 1.).
In inner side, formed with press section 43, the press section 43 is formed as diameter than axle portion 41 greatly for the front of pressing component 4,
The inside region of the segmentation starting point of annular in shape formation of the press section 43 to plate object described later presses.By being formed as straight
The big press section 43 in diameter ratio shaft portion 41 and the lower surface of connecting member 2 keep helical spring 7, and the helical spring 7 serves pair
The function that inner side pressing component 4 exerts a force towards lower side in figure.Non-pressed state in partition tools 1 without pressing plate object
Under, the lower end of inner side pressing component 4 is that the lower end of press section 43 is configured to protrude downwards than the lower end of outside pressing component 3.
And then the size of the preferably lower surface (press surface) of the press section 43 is set to be formed as circular than plate object described later
It is slightly smaller to split the area of the inside region of starting point, it is bad in order to not produce segmentation, it is preferably excessively not small.In addition, in order to not in structure
Glass plate, sapphire plate into the plate object as divided body etc. are upper to produce damage, rupture etc., outside pressing component 3, inner side
Pressing component 4 is preferably made up of allyl resin etc..
Illustrate to be formed the Laser Processing of segmentation starting point using Fig. 2, the segmentation starting point is used for from the segmentation using the present invention
The plate object 10 being made up of glass plate that instrument is split cuts out a diameter of 25mm central portion.Plate shown in Fig. 2 (a)
Shape thing 10 is the square that each side is 50mm, and its thickness is 1mm.On forming the laser processing device of segmentation starting point, such as can
Enough known laser processing devices using disclosed in above-mentioned patent document 3, but due to not being the main of the composition present invention
Part, so eliminating explanation to its overall structure.In addition, plate object and the central portion that is cut out as machined object
Size is not limited to that, can arbitrarily be set.
When implementing to laser machine to plate object 10, plate object 10 is positioned in laser processing device and (eliminates entirety
Figure.) holding unit (not shown) on and carry out holding fixation.The laser processing device has laser light irradiation unit 20,
Laser light irradiation unit 20 has the concentrator 22 for including collector lens (not shown) that laser beam is irradiated to machined object.
The holding unit can relative to concentrator 22 in figure X-direction, relatively move in Y direction, can not only be in X-axis side
Point-blank moved on to, Y direction, additionally it is possible to the movement in X-direction, Y direction is combined and makes the holding unit
Moved in a manner of the track for depicting ring-type, the movement can be made to be combined with the irradiation of laser beam and form ring-type
Split starting point.In addition, by the way that the information of process data is stored in control unit (not shown) in advance, the laser processing device
The segmentation starting point of arbitrary shape can be formed on plate object.
As illustrated, first, before the segmentation starting point 10a of ring-type is formed, make holding unit in X-direction, Y direction
On point-blank move and form linear segmentation according to the direction at right angles intersected at the segmentation starting point 10a of ring-type center
Starting point 10b.After linear segmentation starting point 10b is formd, then while making holding unit by X-direction, Y direction
In the horizontal plane of formation by depict it is round in a manner of move, irradiate laser beam on one side, form the segmentation starting point 10a of ring-type.By
This, linear segmentation starting point 10b is centered on the segmentation starting point 10a of ring-type by the segmentation starting point 10a exterior lateral area fourth class
Divide and complete Laser Processing.
In addition, above-mentioned Laser Processing for example performs according to following such processing conditions, the Laser Processing be by for
The focal point that machined object has the laser beam of the wavelength of permeability is positioned at desired position and formed from front to the back side
, the processing of the shield tunnel as frangible portion formed by pore and around the noncrystalline of the pore.
Plate object：Square that each side is 50mm, thickness 1mm
Wavelength：1030nm
Average output：3W
Repetition rate：50kHz
Pulse width：10ps
Spot diameter：φ10μm
The refractive index of numerical aperture/glass plate of collector lens：0.05~0.2
Process feed speed：The 500mm/ seconds
Shield tunnel：The pore that 1 μm of φ, 10 μm of φ noncrystalline
There can be the tabular of segmentation starting point 10a, 10b by implementing above-mentioned Laser Processing to obtain the formation shown in Fig. 2
Thing 10.
After the plate object 10 formed with segmentation starting point 10a, 10b has been obtained, as shown in Fig. 3 (a), by plate object 10
It is positioned on flexible strip 30 (flexible strip arranging process).In addition, in Fig. 3 (a), for the ease of to by inner side pressing component 4
Situation about being positioned on plate object 10 illustrates, the state that a part for connecting member 2 and outside pressing component 3 is cut
Show, and the outside area pressed 52 pressed by outside pressing component 3 is represented using oblique line.Also, the flexible strip 30
Thickness is 1~3mm or so and has retractility, and the plate object for being set as to make to be pressed from top suitably sinks.
After plate object 10 is positioned on flexible strip 30, operator is the handle part that hold above-mentioned partition tools 1
Part 9 and ring-type that the press section 43 of the inner side pressing component 4 of partition tools 1 is positioned to plate object 10 is split in starting point 10a
Side area pressed 50, and then 4 outside pressing components 3 are respectively positioned at by linear segmentation starting point 10b quarterings segmentation
The outside area pressed 52 of the Outboard Sections formed.Now, because the press section 43 of inner side pressing component 4 is under non-pressed state
Front end than outside pressing component 3 protrudes downwards, so the press section 43 of the inner side pressing component 4 is prior to outside pressing component
3 front end and ((b) of reference picture 3 is abutted with plate object 10.).
Operator is being present in the inner side area pressed 50 at the center of plate object 10 while press section 43 is pushed, while supporting
The anti-elastic force as the helical spring 7 of extensible member and be pressed further into, so as to the segmentation of outside pressing component 3 and plate object 10
Starting point 10a outside area pressed 52 abuts.In outside, pressing component 3 abuts it with the outside area pressed 52 of plate object 10
Afterwards, partition tools 1 are further pressed into downwards.It is about 1~3mm that the flexible strip 30 of above-mentioned plate object 10, which is placed with, by thickness
And show the raw material such as the polyurethane of flexibility and form, the segmentation starting point 10a of the ring-type pressed portion 43 of inner side area pressed 50
Press and outside area pressed 52 is pressed and sunk in flexible strip 30 by outside pressing component 3.Now, the four of flexible strip 30
Towards outer expandable, the situation of being close to that the inner and outer at starting point 10a is split during segmentation is relaxed, will not at angle
Produce defect etc. at the segmentation starting point 10a of the partitioning boundary as plate object 10 and complete segmentation process ((c) of reference picture 3,
(d) desired central portion can), be cut.
In the present embodiment, the example that 1 central portion is cut out from 1 plate object is shown, but the present invention and not only
It is limited to this.Hereinafter, the one side of one side reference picture 4 shows other embodiments.
As shown in Fig. 4 (a), 4 segmentation starting points of ring-type are formed on the plate object 100 being made up of 1 glass material
100a and linear segmentation starting point 100b, 100c, can cut out 4 central portions.The top view of plate object 100 is formed as
Square, each side are formed as 100mm, and the diameter of central portion is same with above-mentioned embodiment to be set to 25mm.Using swash
Optical machining device on plate object 100 formed with：The segmentation starting point 100a of 4 ring-types；Linear segmentation starting point 100b, they
Formed according in the vertical direction in the center in the circular region formed by the segmentation starting point 100a of ring-type；Linear segmentation
Starting point 100c, they are at the center of the plate object 100 vertically so as to by 4 region even partitions.And then in the embodiment party
In formula, as shown in Fig. 4 (b), preparation makes the partition tools 1 in 4 above-mentioned embodiments adjacent and has carried out even junction configuration
Partition tools 1 '.In addition, the structure of the partition tools 1 ' is substantially identical with above-mentioned partition tools 1, to playing identical function
Position identical numerically plus " ' " and omit detail explanation.Hereinafter, to using partition tools 1 ' from plate object
100 methods for being partitioned into central portion illustrate.
The plate object 100 for foring above-mentioned segmentation starting point is positioned in and scratched according to what the size of the plate object 100 prepared
On property piece 30 '.Also, same with above-mentioned embodiment after plate object 100 is positioned on flexible strip 30 ', operator
The press section 43 ' that hold handle part part 9 ' and will be formed in the leading section of inner side pressing component 4 ' is positioned at point of 4 ring-types
Cut starting point 100a inside region 50 '.Due to press section 43 ' be set under non-pressed state than outside pressing component 3 ' to
Lower section protrudes, so the press section 43 ' abuts prior to outside pressing component 3 ' with plate object 100.Operator is while make pressing
Portion 43 ' abutted with the segmentation starting point 100a of ring-type while resist the elastic force of helical spring 7 ' and by partition tools 1 ' further downwards
Side's press-in, so that outside pressing component 3 ' abuts with the area pressed 52 ' around the segmentation starting point 100a for being formed at ring-type,
The exterior lateral area that will be around the segmentation starting point 100a of ring-type is pressed into downwards, is starting point by tabular to split starting point 100a~100c
Thing 100 is split and cuts out central portion.
In addition, shown in such as Fig. 3 (a) using segmentation starting point 10a of 1 ring-type as split starting point and from 1 plate object
In the case that 10 cut out central portion, the lower surface entire surface of outside pressing component 3 is set to be supported with splitting starting point 10a exterior lateral area
Connect, but in the other embodiment shown in Fig. 4, the region of adjacent multiple exterior lateral areas on plate object 100 will be spanned
Area pressed 52 ' is set to, the region is pressed using 1 outside pressing component 3 '.Thus, partition tools 1 ' utilize 9
Outside pressing component 3 ' is pressed the area pressed 52 ' of plate object 100, can simultaneously be split and cut out 4 circles
Part.
In addition, the present invention is not limited in two above-mentioned embodiments, for example, can will from the segmentation of 1 plate object and
The number of the central portion cut out is set as 6, the arbitrary numbers such as 9.Also, in two above-mentioned embodiments, make
For the segmentation starting point of ring-type, the segmentation starting point for cutting out circular part is shown, it is not limited to this, such as can make
Split starting point for ellipse, as long as it is annularly shaped, then do not limit.And then in the above-described embodiment, show arranging
Hold part and be made for the example that partition tools are pressed into by dealer from top to plate object, it is not limited to this, can also set
To give up holding part and web being installed on stamping machine etc. so as to be mechanically pressed into.Particularly cut out from plate object
In the case of multiple endless members, it is effectively to install web on stamping machine.Also, it is formed at inner side pressing component
The press section of leading section can also be configured to size according to the endless member cut out, shape is changed.
Also, in the above-described embodiment, employed as the Laser Processing for forming segmentation starting point by for being processed
The focal point that thing has the laser beam of the wavelength of permeability be positioned at desired position and formed it is from front to the back side, by thin
The processing for the shield tunnel as frangible portion that hole and noncrystalline around the pore are formed, but the present invention is not limited to this,
Can also be that the focal point of the laser beam of the wavelength for machined object with permeability is positioned to the rule inside plate object
Fixed position and be irradiated so as to internally form the Laser Processing for modifying layer as frangible portion.In this case, such as
Following processing conditions can be set to.
Wavelength：1342nm
Average output：0.18W
Repetition rate：80kHz
Spot diameter：φ1μm
Process feed speed：The 180mm/ seconds
In addition, in the case where forming modification layer and being used as segmentation starting point, in order to become more fragile segmentation starting point,
Focal point position can also be changed in the depth direction on one side along segmentation starting point preset lines while repeatedly being laser machined.And
And in the above-described embodiment, show by being pressed around segmentation starting point of 4 outside pressing components to ring-type
Example, but the present invention is not limited to this.For example, it is also possible to risen according to by the segmentation of the ring-type of the plate object 10 shown in Fig. 2
The mode in two regions or 3 regions is divided on the outside of point 10a to form segmentation starting point 10b, and outside pressing component is set
For two or 3.
Claims (6)
1. a kind of partition tools, the plate object annularly formed with segmentation starting point is divided into inner side and outer side, wherein,
The partition tools have：
Inner side pressing component, it on the inside of the segmentation starting point that is annularly formed to pressing；
Outside pressing component, it on the outside of the segmentation starting point that is annularly formed to pressing；And
Connecting member, it links the inner side pressing component and the outside pressing component,
The inner side pressing component is movably installed relative to the connecting member, the front end of the inner side pressing component exerted a force with
Just it is more prominent to pressing direction than the front end of pressing component on the outside of this under non-pressed state.
2. partition tools according to claim 1, wherein,
The inner side pressing component is installed relative to the connecting member in a manner of being exerted a force by extensible member to pressing direction.
3. partition tools according to claim 1 or 2, wherein,
The outside pressing component is equipped with 4 in periphery centered on the inner side pressing component.
4. partition tools according to claim 1 or 2, wherein,
Multiple inner side pressing components are installed according to the interval of regulation relative to connecting member, and with the inner side pressing component
Multiple outside pressing components are accordingly installed.
5. a kind of application method of partition tools, the partition tools described in any one in usage right requirement 1~4, wherein,
The application method of the partition tools comprises at least following process：
Flexible strip arranges process, and the plate object annularly formed with segmentation starting point is disposed on flexible strip；And
Segmentation process, while being carried out using the inner side of segmentation starting point of the inner side pressing component to annularly being formed on plate object
Pressing, while being split using the outside pressing component to being pressed on the outside of segmentation starting point to plate object.
6. the application method of partition tools according to claim 5, wherein,
When pressing component is pressed on the outside of by pressing component on the inside of this and this, flexible strip is extended and implements this point
Cut process.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016094297A JP6665020B2 (en) | 2016-05-10 | 2016-05-10 | Split tools and how to use them |
| JP2016-094297 | 2016-05-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107442947A true CN107442947A (en) | 2017-12-08 |
| CN107442947B CN107442947B (en) | 2020-11-24 |
Family
ID=60321401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710280586.5A Active CN107442947B (en) | 2016-05-10 | 2017-04-26 | Segmentation tool and method of using segmentation tool |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6665020B2 (en) |
| KR (1) | KR102177675B1 (en) |
| CN (1) | CN107442947B (en) |
| TW (1) | TWI695749B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7151350B2 (en) | 2017-10-19 | 2022-10-12 | 株式会社デンソー | spark plug for internal combustion engine |
| JP2023023236A (en) | 2021-08-04 | 2023-02-16 | 株式会社ディスコ | Chip manufacturing method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6028390B2 (en) * | 1979-06-01 | 1985-07-04 | 三菱電機株式会社 | How to punch out semiconductor wafers |
| CN101910075A (en) * | 2008-03-25 | 2010-12-08 | 日本电气硝子株式会社 | Glass plate breaking method and glass plate breaking device |
| CN102099169A (en) * | 2008-09-30 | 2011-06-15 | 三星钻石工业股份有限公司 | Kawabata takashi,sakaguchi ryota,murakami kenji |
| CN102729346A (en) * | 2011-04-06 | 2012-10-17 | 三星钻石工业股份有限公司 | Breaking device |
| CN102910808A (en) * | 2011-08-01 | 2013-02-06 | 塔工程有限公司 | Disconnect device using a disconnect plate |
| CN203866194U (en) * | 2014-03-21 | 2014-10-08 | 芜湖东旭光电科技有限公司 | Prepressing mechanism of liquid crystal glass substrate base material breaking device |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10305420A (en) | 1997-03-04 | 1998-11-17 | Ngk Insulators Ltd | Method for fabricating matrix made up of oxide single crystal and method for manufacturing functional device |
| JPH1134184A (en) * | 1997-07-15 | 1999-02-09 | Zenshindou Kogyo Kk | Paper-ware punching machine |
| JP3408805B2 (en) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | Cutting origin region forming method and workpiece cutting method |
| JP4512307B2 (en) * | 2002-03-14 | 2010-07-28 | 日本ダイスチール株式会社 | Stripping device female mold and stripping device |
| JP5054933B2 (en) * | 2006-05-23 | 2012-10-24 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
| NL2001481C2 (en) * | 2008-04-14 | 2009-10-15 | Tuinbouw Tech Atelier Tta B V | Device and method for perforating tough and / or sticky and / or elastic sheet material. |
| KR20100059210A (en) * | 2008-11-26 | 2010-06-04 | 주식회사 탑 엔지니어링 | Apparatus and method for separating glass panel |
| JP5573105B2 (en) * | 2009-11-02 | 2014-08-20 | 三菱マテリアル株式会社 | Split body manufacturing apparatus and manufacturing method |
| JP2013215934A (en) * | 2012-04-05 | 2013-10-24 | Asahi Glass Co Ltd | Cutting device and cutting method of brittle plate |
| JP6151557B2 (en) | 2013-05-13 | 2017-06-21 | 株式会社ディスコ | Laser processing method |
| JP2015174113A (en) * | 2014-03-14 | 2015-10-05 | 三菱自動車工業株式会社 | Press device |
-
2016
- 2016-05-10 JP JP2016094297A patent/JP6665020B2/en active Active
-
2017
- 2017-03-30 TW TW106110730A patent/TWI695749B/en active
- 2017-04-21 KR KR1020170051672A patent/KR102177675B1/en active IP Right Grant
- 2017-04-26 CN CN201710280586.5A patent/CN107442947B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6028390B2 (en) * | 1979-06-01 | 1985-07-04 | 三菱電機株式会社 | How to punch out semiconductor wafers |
| CN101910075A (en) * | 2008-03-25 | 2010-12-08 | 日本电气硝子株式会社 | Glass plate breaking method and glass plate breaking device |
| CN102099169A (en) * | 2008-09-30 | 2011-06-15 | 三星钻石工业股份有限公司 | Kawabata takashi,sakaguchi ryota,murakami kenji |
| CN102729346A (en) * | 2011-04-06 | 2012-10-17 | 三星钻石工业股份有限公司 | Breaking device |
| CN102910808A (en) * | 2011-08-01 | 2013-02-06 | 塔工程有限公司 | Disconnect device using a disconnect plate |
| CN203866194U (en) * | 2014-03-21 | 2014-10-08 | 芜湖东旭光电科技有限公司 | Prepressing mechanism of liquid crystal glass substrate base material breaking device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017202589A (en) | 2017-11-16 |
| KR20170126792A (en) | 2017-11-20 |
| TW201739555A (en) | 2017-11-16 |
| CN107442947B (en) | 2020-11-24 |
| JP6665020B2 (en) | 2020-03-13 |
| KR102177675B1 (en) | 2020-11-11 |
| TWI695749B (en) | 2020-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE102006053898B4 (en) | Laser processing device and laser processing method | |
| CN103299401B (en) | Laser processing | |
| DE3734656C2 (en) | Method and device for producing lenses or similarly shaped objects by means of laser radiation | |
| DE102016212316A1 (en) | Polycrystalline SIC WAFER MANUFACTURING PROCESS | |
| TWI568525B (en) | Laser processing method | |
| CN101279403B (en) | Laser processing method | |
| TW201700250A (en) | Wafer producing method | |
| DE102015217288A1 (en) | SiC ingot cutting process | |
| EP1240529B1 (en) | Method for producing micromechanical structures | |
| US20060124618A1 (en) | Method and device for processing inside of transparent material | |
| TW201700249A (en) | Wafer producing method | |
| DE112014001676T5 (en) | LASER PROCESSING DEVICE AND LASER PROCESSING METHOD | |
| TWI673239B (en) | Micropore array and manufacturing method thereof | |
| DE112014001688T5 (en) | Laser processing device and laser processing method | |
| DE102017214738A1 (en) | Method for producing a SiC wafer | |
| CN107442947A (en) | The application method of partition tools and partition tools | |
| KR20130088750A (en) | Laser processing method | |
| DE112014001653T5 (en) | Laser processing device and laser processing method | |
| DE102018206303B4 (en) | Method for processing a wafer | |
| JP2019006625A (en) | Method of manufacturing microhole array | |
| DE102018205019B4 (en) | LASER PROCESSING PROCESS OF A WAFER | |
| DE112021000747T5 (en) | Laser processing device and laser processing method | |
| KR101621375B1 (en) | Method for forming through-hole in substrate | |
| CN108575054A (en) | For manufacturing the jig of light sensation module, the manufacturing method of method and circuit board | |
| CN110520967A (en) | Method for cutting processing target |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |