TWI695749B - Split tool, and method of using split tool - Google Patents
Split tool, and method of using split tool Download PDFInfo
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- TWI695749B TWI695749B TW106110730A TW106110730A TWI695749B TW I695749 B TWI695749 B TW I695749B TW 106110730 A TW106110730 A TW 106110730A TW 106110730 A TW106110730 A TW 106110730A TW I695749 B TWI695749 B TW I695749B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B27/00—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for
- B25B27/02—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for for connecting objects by press fit or detaching same
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/06—Severing by using heat
- B26F3/16—Severing by using heat by radiation
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- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Abstract
本發明的課題為提供一種能夠將分割起點已環狀地形成之板狀物確實且有效率地分割之分割工具、及使用該分割工具的方法。解決手段為依據本發明,可提供一種分割工具、及分割工具的使用方法,該分割工具是將分割之起點已環狀地形成之板狀物分割成內側與外側,且具備按壓已環狀地形成之分割起點的內側之內側按壓構件、按壓已環狀地形成之分割起點的外側之外側按壓構件、及連結該內側按壓構件與該外側按壓構件之連結構件,該內側按壓構件是相對於該連結構件而進退自如地裝設,且被賦與勢能成該內側按壓構件的前端於非按壓狀態下會比該外側按壓構件的前端更朝按壓方向突出,該分割工具的使用方法至少是由可撓性片材配設步驟和分割步驟所構成,該可撓性片材配設步驟是將分割之起點已環狀地形成之板狀物配設在可撓性片材上,該分割步驟是一邊以該內側按壓構件按壓於板狀物上已環狀地形成之分割起點的內側,一邊以該外側按壓構件按壓外側來進行分割。An object of the present invention is to provide a segmentation tool capable of reliably and efficiently dividing a plate-shaped object whose segmentation starting point has been formed in a ring shape, and a method of using the segmentation tool. According to the present invention, the solution means can provide a splitting tool and a method of using the splitting tool. The splitting tool divides a plate-like object formed from the starting point of the division into an inner side and an outer side, The inner inner pressing member forming the divided starting point, the outer outer pressing member pressing the divided starting point formed annularly, and the connecting member connecting the inner pressing member and the outer pressing member, the inner pressing member is opposite to the The connecting member is installed to move forward and backward freely, and the potential energy is applied so that the front end of the inner pressing member will protrude more in the pressing direction than the front end of the outer pressing member in the non-pressing state. The flexible sheet arranging step and the dividing step are constituted by arranging a plate-like object having a ring-shaped starting point divided on the flexible sheet, and the dividing step is While pressing the inner pressing member against the inner side of the divided starting point formed on the plate-like object, the outer pressing member presses the outer side to divide.
Description
發明領域 本發明是有關於一種將分割起點已環狀地形成之板狀物分割成內側與外側的分割工具、及該分割工具的使用方法。Field of the Invention The present invention relates to a dividing tool for dividing a plate-like object whose division starting point has been formed into an inside and an outside, and a method of using the dividing tool.
發明背景 藉由分割預定線來區劃而在正面上形成有IC、LSI、LED、SAW元件、功率元件等的複數個元件的晶圓,是藉由以雷射加工裝置所形成之分割起點而分割成一個個的元件,並且被利用在手機、個人電腦、照明器具等的電氣機器上(參照例如專利文獻1)。BACKGROUND OF THE INVENTION A wafer in which a plurality of devices such as IC, LSI, LED, SAW device, and power device are formed on the front side by dividing a predetermined line is divided by a division starting point formed by a laser processing device It is an individual component and is used in electrical equipment such as mobile phones, personal computers, and lighting fixtures (see, for example, Patent Document 1).
又,在從板狀的玻璃、藍寶石、鉭酸鋰(LT)、鈮酸鋰(LN)、碳化矽等之中切出圓形的構件之情況下,可使用能夠將分割起點環狀地形成的雷射加工裝置。In addition, when a circular member is cut out of plate-shaped glass, sapphire, lithium tantalate (LT), lithium niobate (LN), silicon carbide, or the like, it is possible to use a ring-shaped starting point Laser processing device.
作為該雷射加工裝置而存在的有下述類型:如上述專利文獻1所示,照射對於被加工物具有吸收性之波長的雷射光線來施行燒蝕加工以形成分割起點之類型的裝置、將對於被加工物具有穿透性之波長的雷射光線之聚光點定位在被加工物之內部來照射,以施行改質層形成加工並形成分割起點之類型的裝置(參照2)、與進一步將對於被加工物具有穿透性之波長的雷射光線之聚光點定位在所需位置上,並施行從正面至到達背面形成由細孔及圍繞該細孔的非晶質所構成的潛盾型通孔之加工,來形成分割起點之類型的裝置(參照例如專利文獻3)。As the laser processing apparatus, there are the following types: as shown in the above-mentioned
特別是,相對於玻璃板等之基板而形成作為分割起點的環狀的分割起點來將該分割起點的內側與外側分離的情況下,宜將形成有從正面至到達背面之脆弱層之潛盾型通孔作為分割起點。 先前技術文獻 專利文獻In particular, when forming a ring-shaped dividing starting point as a dividing starting point with respect to a substrate such as a glass plate and separating the inner side and the outer side of the dividing starting point, it is preferable to form a shield with a fragile layer from the front to the back The through hole is used as the starting point of division. Prior Art Literature Patent Literature
專利文獻1:日本專利特開平10-305420號公報 專利文獻2 :日本專利特許第3408805號公報 專利文獻3:日本專利特開2014-221483號公報Patent Document 1: Japanese Patent Laid-Open No. 10-305420 Patent Document 2: Japanese Patent Laid-Open No. 3408805 Patent Document 3: Japanese Patent Laid-Open No. 2014-221483
發明概要 發明欲解決之課題 然而,假使是藉由潛盾型通孔來形成用來切出圓形之零件的環狀之分割起點而分離的情形下,由於該環狀之分割起點的內側與外側是成曲線狀地密合,所以要將兩者有效率且確實地分割是困難的,必須依賴熟練人員的手工作業,而有加工效率較差的問題。SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION However, in the case where a ring-shaped dividing starting point for cutting out a circular part is formed by a shield-type through hole and is separated, since the inside of the ring dividing starting point is different from The outside is closely curved, so it is difficult to divide the two efficiently and surely. It must rely on the manual work of skilled personnel, and there is a problem of poor processing efficiency.
本發明是有鑒於上述事實而作成的發明,其主要的技術課題是提供一種能夠將分割起點已環狀地形成之板狀物確實且有效率地分割之分割工具、及使用該分割工具的方法。 用以解決課題之手段The present invention is made in view of the above facts, and its main technical problem is to provide a dividing tool capable of reliably and efficiently dividing a plate-like object having a divided starting point and a method of using the dividing tool . Means to solve the problem
為了解決上述主要的技術課題,根據本發明,可提供一種分割工具,其為將分割之起點已環狀地形成之板狀物分割成內側與外側的分割工具,並具備:內側按壓構件,按壓已環狀地形成之分割起點的內側;外側按壓構件,按壓已環狀地形成之分割起點的外側;及連結構件,連結該內側按壓構件和該外側按壓構件,該內側按壓構件是相對於該連結構件進退自如地裝設,且被賦與勢能成該內側按壓構件的前端在非按壓狀態下會比該外側按壓構件的前端更朝按壓方向突出。In order to solve the above-mentioned main technical problems, according to the present invention, there can be provided a dividing tool which divides a plate-like object having a ring-shaped starting point into an inner side and an outer side, and includes: an inner pressing member that presses The inner side of the divided starting point that has been formed annularly; the outer pressing member that presses the outer side of the divided starting point that has been formed annularly; and the connecting member that connects the inner pressing member and the outer pressing member, the inner pressing member is relative to the The connecting member is installed so as to move forward and backward, and the potential energy is applied so that the front end of the inner pressing member protrudes in the pressing direction more than the front end of the outer pressing member in the non-pressing state.
也可以構成為該內側按壓構件是藉由伸縮構件而相對於該連結構件朝按壓方向被賦與勢能而裝設,也可以構成為該外側按壓構件是將該內側按壓構件作為中心而在外側配設4個。此外,也可以構成為將該內側按壓構件相對於連結構件而以預定之間隔裝設複數個,並且將該外側按壓構件對應於該內側按壓構件而裝設複數個。It may be configured that the inner pressing member is provided with potential energy in the pressing direction with respect to the connecting member by a telescopic member, or the outer pressing member may be configured on the outer side with the inner pressing member as the
又,依據本發明,可提供一種分割工具的使用方法,其為上述之分割工具的使用方法,且至少是由以下步驟所構成: 可撓性片材配設步驟,將分割之起點已環狀地形成之板狀物配設在可撓性片材上;及 分割步驟,一邊以該內側按壓構件按壓於板狀物上已環狀地形成之分割起點的內側,一邊以該外側按壓構件按壓外側來進行分割, 且也可以做成該分割步驟是在以該內側按壓構件及該外側按壓構件進行的按壓時,擴張可撓性片材而實施。 發明效果In addition, according to the present invention, a method for using a dividing tool can be provided, which is the above-mentioned method for using a dividing tool, and is composed of at least the following steps: a flexible sheet disposing step, the starting point of the dividing has been looped The plate-like material formed on the ground is arranged on the flexible sheet; and the dividing step is to press the outer pressing member while pressing the inner pressing member against the inner side of the divided starting point formed on the plate-like object Splitting is performed on the outer side, and the splitting step may be performed by expanding the flexible sheet during pressing by the inner pressing member and the outer pressing member. Invention effect
依據本發明之分割工具、及使用該分割工具的方法,是構成為該分割工具具備按壓已環狀地形成之分割起點的內側之內側按壓構件、按壓已環狀地形成之分割起點的外側之外側按壓構件、與連結該內側按壓構件和該外側按壓構件之連結構件,該內側按壓構件是相對於該連結構件而進退自如地裝設,且被賦與勢能成該內側按壓構件的前端於非按壓狀態下會比該外側按壓構件的前端更朝按壓方向突出,藉此,會使內側按壓構件先接觸於環狀之分割起點的內側並按壓,進而可以藉由按壓而使外側按壓構件按壓該環狀之分割起點的外側之區域,而使剪切應力作用在環狀的分割起點上,以確實地分割形成有環狀的分割起點之板狀物的內側之區域與外側之區域。According to the splitting tool of the present invention, and a method of using the splitting tool, the splitting tool is configured to include an inner pressing member that presses the inside of the divided starting point that has been circularly formed, and that presses the outer side of the dividing starting point that has been circularly formed An outer pressing member and a connecting member connecting the inner pressing member and the outer pressing member, the inner pressing member is movably installed with respect to the connecting member, and is endowed with potential energy such that the front end of the inner pressing member is In the pressing state, it will protrude more in the pressing direction than the front end of the outer pressing member, whereby the inner pressing member first contacts the inside of the ring-shaped dividing start point and presses, and then the outer pressing member can be pressed by pressing The area outside the ring-shaped division starting point causes shear stress to act on the ring-shaped division starting point to reliably divide the inner area and the outer area of the plate-shaped object formed with the ring-shaped division starting point.
用以實施發明之形態 以下,參照附圖來說明根據本發明而構成的分割工具、及該分割工具的使用方法。Modes for Carrying Out the Invention Hereinafter, a dividing tool constructed according to the present invention and a method of using the dividing tool will be described with reference to the drawings.
圖1(a)中是將用來說明本發明之分割工具1的構造之各個構成分解而顯示。分割工具1在平面視角下是形成為矩形,且大致是由於下表面側配設有外側按壓構件3的連結構件2、裝設在形成於該連結構件2的中心之貫通孔部2a中且進退自如地被保持的柱狀之內側按壓構件4、與配設在連結構件2的上表面側且形成為門型形狀的把持構件9所構成。In FIG. 1(a), each structure for explaining the structure of the dividing
該外側按壓構件3是在連結構件2的下表面側之4個角落各自配設,以按壓後述之板狀物之外側區域。又,內側按壓構件4,在軸部41裝設有作為伸縮構件的線圈彈簧7上,並將後端部從下表面側相對於形成在連結構件2之貫通孔部2a插入,而在該連結構件2的上表面側使固定構件8之母螺紋部81與形成於該軸部41之後端部的公螺紋部42相螺合。藉由這樣的構成,可將外側按壓構件3與內側按壓構件4透過連結構件2而連結。由於固定構件8是將其外徑設定得比貫通孔部2a的內徑更大,所以可作為內側按壓構件4之防脫構成而起作用(參照圖1(b))。The outer pressing
內側按壓構件4的前端側上形成有直徑形成得比軸部41更大的按壓部43,並且可按壓後述之板狀物之已環狀地形成的分割起點的內側區域。線圈彈簧7是保持在形成有比軸部41更大之直徑的按壓部43、和連結構件2的下表面之間,並且發揮將內側按壓構件4朝向圖中下方側賦與勢能的功能。在分割工具1為未按壓板狀物的非按壓狀態下,是構成為內側按壓構件4的下端(亦即按壓部43的下端)比外側按壓構件3的下端更朝下方突出。此外,較理想的是,將該按壓部43的下表面(按壓面)的大小設定得比後述之板狀物之形成為圓形的分割起點的內側區域之面積稍微小,且為了不使其產生分割不良,也不宜太小。再者,較理想的是,外側按壓構件3、內側按壓構件4是以丙烯酸酯樹脂(acrylic resin)等所構成,以避免在作為被分割體之構成板狀物的玻璃板、藍寶石板等上產生損傷、破損等。A
關於從可藉由本發明之分割工具來分割之由玻璃板所構成之板狀物10中形成用於切出直徑25mm的圓形構件之分割起點的雷射加工,使用圖2來說明。圖2(a)所示之板狀物10是一邊為50mm的正方形,且其厚度為1mm。針對形成分割起點的雷射加工裝置,雖然可以使用例如上述之專利文獻3所揭示之習知的雷射加工裝置,但由於並未構成本發明的主要部分,所以關於其全體構成將省略說明。再者,作為被加工物之板狀物、切出之圓形構件的尺寸並不限定於此,而是可任意地設定的。The laser processing for forming a division starting point for cutting out a circular member having a diameter of 25 mm from the plate-
對板狀物10施行雷射加工之時,是相對於雷射加工裝置(省略全體圖)之圖未示的保持設備而將板狀物10載置並保持固定。該雷射加工裝置具備有雷射光線照射設備20,且雷射光線照射設備20具備有可對被加工物照射雷射光線之包含圖未示的聚光透鏡的聚光器22。該保持設備是形成為可使其相對於聚光器22,在圖中X軸方向、Y軸方向上相對地移動,且不僅使其在X軸方向、Y軸方向上直線地移動,還能夠組合對X軸方向、Y軸方向的移動,而使該保持設備移動成描畫環狀的軌道,並與雷射光線之照射相組合而變得可形成環狀的分割起點。再者,該雷射加工裝置能夠藉由使其在圖未示之控制設備中預先儲存加工資料之資訊,而可相對於板狀物形成任意形狀的分割起點。When laser processing is performed on the plate-
如圖所示,首先,在形成環狀的分割起點10a之前,使保持設備在X軸方向、Y軸方向上直線地移動,以在環狀之分割起點10a的中心直角地交叉的方向上形成直線狀的分割起點10b。已形成有直線狀的分割起點10b之後,接著使保持設備以在X軸方向、Y軸方向所形成之水平面內畫圓的方式一邊移動一邊照射雷射光線,而形成環狀的分割起點10a。藉此,將雷射加工執行成使直線的分割起點10b以環狀的分割起點10a作為中心,而將其外側區域形成4等分。As shown in the figure, first, before forming the ring-shaped
再者,上述雷射加工是以例如以下的加工條件來實行的加工,且為下述之加工:將對於被加工物具有穿透性之波長的雷射光線之聚光點定位在所需位置上而從正面至到達背面,形成由細孔及圍繞該細孔的非晶質所構成之作為脆弱部的潛盾型通孔。 板狀物 :1邊為50mm之正方形,厚度為1mm 波長 :1030nm 平均輸出 :3W 重複頻率 :50kHz 脈衝寬度 :10ps 光斑直徑 :φ10μm 聚光透鏡之數值孔徑/玻璃板之折射率:0.05~0.2 加工進給速度 :500mm/秒 潛盾型通孔 :φ1μm之細孔,φ10μm之非晶質In addition, the above-mentioned laser processing is processing performed under the following processing conditions, for example, and the processing is as follows: positioning the condensing point of laser light of a wavelength having a penetrability to the workpiece at a desired position From the front side to the back side, a shield-type through hole is formed as a fragile part composed of fine holes and amorphous material surrounding the fine holes. Plate was: edge length of 50mm square and a thickness of 1mm wavelength: 1030nm Average output: 3W repetition frequency: 50kHz Pulse width: 10ps spot diameter: numerical aperture of the condenser lens φ10μm / glass plate of refractive index: 0.05 to 0.2 Processing Feeding speed: 500mm/s sub-shield type through hole: 500mm/sec sub-shield type through hole: φ1μm pore, φ10μm amorphous
藉由實施上述之雷射加工,就能夠得到形成有如圖2所示之分割起點10a、10b的板狀物10。By performing the laser processing described above, it is possible to obtain the plate-
已得到形成有分割之起點10a、10b的板狀物10之後,如圖3(a)所示,將板狀物10載置於可撓性片材30上(可撓性片材配設步驟)。再者,在圖3(a)中,為了便於說明將內側按壓構件4定位在板狀物10上的情況,是以將連結構件2及外側按壓構件3的一部分切除了的狀態來顯示,並且以斜線來顯示被外側按壓構件3所按壓之外側按壓區域52。又,該可撓性片材30是1~3mm左右之厚度且具有伸縮性,並設定為可使從上方被按壓的板狀物形成適當沈入。After obtaining the plate-
將板狀物10載置在可撓性片材30上之後,讓作業人員握持上述之分割工具1的把持構件9,將分割工具1的內側按壓構件4的按壓部43定位在板狀物10的環狀分割起點10a的內側按壓區域50上,進而將4個外側按壓構件3各自定位在以直線狀之分割起點10b所分割為4個的外側部分的外側按壓區域52上。此時,內側按壓構件4的按壓部43,由於在非按壓狀態下是比外側按壓構件3的前端更朝下方突出,所以會比外側按壓構件3的前端更先抵接於板狀物10(參照圖3(b))。After placing the plate-
作業人員一邊讓按壓部43壓住存在於板狀物10之中心的內側按壓區域50,一邊對抗作為伸縮構件之線圈彈簧7之彈性力而進一步壓入,藉此使外側按壓構件3抵接於板狀物10的分割起點10a的外側按壓區域52。在外側按壓構件3已抵接於板狀物10的外側按壓區域52之後,進一步將分割工具1朝下方壓入。載置上述之板狀物10的可撓性片材30,是由厚度為約1~3mm的胺甲酸乙酯(urethane)等的展示可撓性之素材所構成,並且一邊將環狀的分割起點10a的內側按壓區域50以按壓部43按壓,一邊將外側按壓區域52以外側按壓構件3按壓來朝可撓性片材30沈入。此時,可撓性片材30是形成為四個角落朝向外側擴張,以緩和在分割的過程中分割起點10a中的內側與外側的密合狀況,而能夠在不使其在板狀物10之成為分割之交界的分割起點10a上產生缺損等的情形下,完成分割步驟(參照圖3(c)、(d)),且切下所期望的圓形構件。The operator presses the
在本實施形態中,雖然是顯示從1片板狀物來切出1個圓形構件之例,但是本發明並不限定於此。參照著圖4並在以下顯示其他的實施形態。In this embodiment, although an example is shown in which one circular member is cut out from one plate-shaped object, the present invention is not limited to this. Referring to FIG. 4, other embodiments are shown below.
如圖4(a)所示,可以在由1片玻璃材所構成之板狀物100上形成環狀的4個分割起點100a、直線狀的分割起點100b、100c,以切出4個圓形構件。該板狀物100在平面視角上是形成正方形,且以1邊為100mm來形成,並將圓形構件與上述實施形態同樣地以直徑為25mm來進行設定。於板狀物100上,是使用雷射加工裝置來形成下述的分割起點:4個環狀的分割起點100a、在環狀的分割起點100a所形成的圓形的區域之中心正交的方向上形成的直線狀的分割起點100b、和在該板狀物100的中心正交成分割該4個區域的直線狀的分割起點100c。此外,在該實施形態中,如圖4(b)所示,準備分割工具1’, 該分割工具1’是形成為使其將4個上述之實施形態中的分割工具1相鄰而連結之形狀。再者,該分割工具1’的構成,與上述之分割工具1基本上是共通的,針對可發揮相同的功能的部位會對相同的數字附上’,並省略對其詳細內容的說明。以下,針對使用分割工具1’來從板狀物100中分割出圓形構件的方法進行說明。As shown in FIG. 4(a), a ring-shaped four divided
將形成有上述之分割起點的板狀物100,載置在配合該板狀物100的尺寸而準備的可撓性片材30’上。並且,已將板狀物100載置在可撓性片材30’上之後,與上述之實施形態同樣地,讓作業人員握持把持構件9’,將形成在內側按壓構件4’的前端部之按壓部43’,定位在4個環狀的分割起點100a的內側區域50’上。由於按壓部43’是設定成於非按壓狀態下會比外側按壓構件3’更朝下方突出,所以會比外側按壓構件3’更先抵接於板狀物100。作業人員是一邊使按壓部43’抵接在環狀的分割起點100a一邊對抗線圈彈簧7’之彈性力而進一步將分割工具1’朝下方壓入,藉此使外側按壓構件3’抵接於形成在環狀的分割起點100a之周圍的按壓區域52’,並且將圍繞環狀的分割起點100a之外側區域朝下方壓入,而以分割起點100a~100c作為起點來分割板狀物100,並切出圓形構件。The plate-
再者,如圖3(a)所示,從1片板狀物10中將1個環狀的分割起點10a作為分割起點而切出圓形構件的情況下,是使外側按壓構件3的下表面全面抵接於分割起點10a的外側區域,而在如圖4所示之其他的實施形態中,是形成為將在板狀物100中跨越於相鄰的複數個外側區域的區域設為按壓區域52’,並以1個外側按壓構件3’來按壓該區域。藉此,分割工具1’會以9個外側按壓構件3’來按壓板狀物100的按壓區域52’,而變得可將4個圓形構件同時地分割並切出。In addition, as shown in FIG. 3( a ), when a circular member is cut out from one plate-shaped
再者,本發明並不限定於上述之二個實施形態,也可以將例如從1個板狀物中分割並切出之圓形構件的數量等設為6個、9個等,而設定為任意的數量。又,在上述之二個實施形態中,雖然作為環狀的分割起點而顯示的是用於切出圓形之構件的分割起點,但是並不限定於此,也可以做成例如楕圓形的分割起點,只要是環狀的,其形狀就不限定。此外,在上述實施形態中,雖然所顯示的是配設把持構件,讓作業人員從上方將分割工具壓入板狀物之例,但是並不限定於此,也可以廢除把持構件,並將連結板安裝到加壓(press)機械等上,而設定為以機械方式壓入。特別是要從板狀物中切出多數個環狀構件的情形下,安裝於加壓機械之作法是有效的。並且,也能夠將形成在內側按壓構件的前端部的按壓部做成可配合要切出的環狀構件之大小、形狀而更換之構成。In addition, the present invention is not limited to the above-mentioned two embodiments, and the number of circular members divided and cut out from one plate-like object may be set to 6, 9, etc., for example. Any number. In addition, in the above two embodiments, although the segmentation starting point for cutting out the circle is shown as the segmentation starting point of the ring, it is not limited to this, and may also be made of, for example The division starting point is not limited as long as it is circular. In addition, in the above-mentioned embodiment, although shown is an example in which a holding member is provided to allow an operator to press the dividing tool into the plate from above, but it is not limited to this, and the holding member may be abolished and connected The board is attached to a press machine or the like, and is set to be pressed in mechanically. In particular, when a large number of ring-shaped members are to be cut out of a plate-like object, it is effective to install them on a press machine. Also, the pressing portion formed at the front end portion of the inner pressing member can be configured to be replaceable in accordance with the size and shape of the ring-shaped member to be cut.
又,在上述實施形態中,雖然作為形成分割起點的雷射加工而採用的加工是,將對於被加工物具有穿透性之波長的雷射光線之聚光點定位在所需位置而從正面至到達背面,形成由細孔及圍繞該細孔的非晶質所構成的作為脆弱部之潛盾型通孔,但是本發明並不限定於此,也可以是藉由將對於被加工物具有穿透性之波長的雷射光線之聚光點定位在板狀物內部之預定位置來照射,以在內部形成作為脆弱部之改質層的雷射加工。該情況可以設成例如以下之形式的加工條件。 波長 :1342nm 平均輸出 :0.18W 重複頻率 :80kHz 光斑直徑 :φ1μm 加工進給速度 :180mm/秒In addition, in the above-mentioned embodiment, although the processing used as the laser processing for forming the division starting point is to position the condensing point of the laser light of a wavelength having a penetrability to the workpiece to be positioned at a desired position from the front Until the back surface is reached, a shield-type through-hole is formed as a fragile portion composed of fine holes and amorphous material surrounding the fine holes, but the present invention is not limited to this, but it can also be achieved by The condensing point of the laser light of the penetrating wavelength is positioned at a predetermined position inside the plate-like object to irradiate, so as to form a laser processing of a modified layer as a fragile part inside. This situation can be set to processing conditions such as the following. Wavelength: 1342nm average output: 0.18W repetition frequency: 80kHz spot diameter: φ1μm processing feed rate: 180mm/sec
再者,作為分割起點而形成改質層的情況下,為了做成更脆弱的分割起點,也可以做成沿著分割起點預定線,在深度方向上變更聚光點位置並且進行複數次雷射加工。又,在上述實施形態中,雖然所顯示的是以4個外側按壓構件來按壓環狀的分割起點的周圍的例子,但是本發明並不限定於此。也可作做成將分割起點10b形成為例如將圖2所示之板狀物10的環狀的分割起點10a的外側分割成2個區域、或3個區域,而將外側按壓構件設成2個、或3個。Furthermore, in the case where the modified layer is formed as the starting point of division, in order to make a more fragile starting point of division, it may be possible to change the position of the condensing point in the depth direction along the predetermined line of the starting point of division and perform multiple lasers Processing. In addition, in the above-mentioned embodiment, although the example in which four outer pressing members press the circumference of the ring-shaped division starting point is shown, the present invention is not limited to this. For example, the
1、1’‧‧‧分割工具10a、10b、100a、100b、100c‧‧‧分割起點10、100‧‧‧玻璃板(板狀物)2‧‧‧連結構件2a‧‧‧貫通孔部20‧‧‧雷射光線照射設備22‧‧‧聚光器3、3’‧‧‧外側按壓構件30、30’‧‧‧可撓性片材4、4’‧‧‧內側按壓構件41‧‧‧軸部42‧‧‧公螺紋部43、43’‧‧‧按壓部50‧‧‧內側按壓區域52‧‧‧外側按壓區域7、7’‧‧‧線圈彈簧8‧‧‧固定構件81‧‧‧母螺紋部9、9’‧‧‧把持構件50’‧‧‧內側區域52’‧‧‧按壓區域X、Y‧‧‧方向1, 1'‧‧‧
圖1(a)、(b)是依照本發明而構成之分割工具的分解圖、及全體立體圖。 圖2是用於說明在藉由本發明之分割工具所分割之板狀物上形成分割起點之步驟的說明圖。 圖3(a)~(d)是用於說明在本發明使用分割工具之方法的說明圖。 圖4(a)、(b)是顯示依照本發明而構成的其他實施形態之圖。1(a) and (b) are an exploded view and an overall perspective view of a dividing tool constructed in accordance with the present invention. FIG. 2 is an explanatory diagram for explaining a step of forming a division starting point on a plate-shaped object divided by the division tool of the present invention. 3(a) to (d) are explanatory diagrams for explaining a method of using a dividing tool in the present invention. 4(a) and (b) are diagrams showing other embodiments constructed in accordance with the present invention.
1‧‧‧分割工具 1‧‧‧ Segmentation tool
2‧‧‧連結構件 2‧‧‧Connecting member
2a‧‧‧貫通孔部 2a‧‧‧Through hole
3‧‧‧外側按壓構件 3‧‧‧Outside pressing member
4‧‧‧內側按壓構件 4‧‧‧Inside pressing member
41‧‧‧軸部 41‧‧‧Shaft
42‧‧‧公螺紋部 42‧‧‧Male thread part
43‧‧‧按壓部 43‧‧‧Pressing part
7‧‧‧線圈彈簧 7‧‧‧coil spring
8‧‧‧固定構件 8‧‧‧Fixed member
81‧‧‧母螺紋部 81‧‧‧Female thread part
9‧‧‧把持構件 9‧‧‧ holding component
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JP5171522B2 (en) * | 2008-09-30 | 2013-03-27 | 三星ダイヤモンド工業株式会社 | Method for scribing a brittle material substrate |
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JPS55162241A (en) * | 1979-06-01 | 1980-12-17 | Mitsubishi Electric Corp | Semiconductor wafer punching method |
JPH1134184A (en) * | 1997-07-15 | 1999-02-09 | Zenshindou Kogyo Kk | Paper-ware punching machine |
JP2003334794A (en) * | 2002-03-14 | 2003-11-25 | Nippon Die Steel Kk | Female die of stripping device and stripping device |
JP2011093286A (en) * | 2009-11-02 | 2011-05-12 | Mitsubishi Materials Corp | Device and method for manufacturing divided body |
JP2013215934A (en) * | 2012-04-05 | 2013-10-24 | Asahi Glass Co Ltd | Cutting device and cutting method of brittle plate |
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JP2017202589A (en) | 2017-11-16 |
KR20170126792A (en) | 2017-11-20 |
CN107442947A (en) | 2017-12-08 |
TW201739555A (en) | 2017-11-16 |
CN107442947B (en) | 2020-11-24 |
JP6665020B2 (en) | 2020-03-13 |
KR102177675B1 (en) | 2020-11-11 |
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