WO2010021286A1 - 接続端子、コネクタ、ソケットおよび半導体パッケージ - Google Patents

接続端子、コネクタ、ソケットおよび半導体パッケージ Download PDF

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Publication number
WO2010021286A1
WO2010021286A1 PCT/JP2009/064261 JP2009064261W WO2010021286A1 WO 2010021286 A1 WO2010021286 A1 WO 2010021286A1 JP 2009064261 W JP2009064261 W JP 2009064261W WO 2010021286 A1 WO2010021286 A1 WO 2010021286A1
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WIPO (PCT)
Prior art keywords
connection terminal
base
contact
contact portion
base portion
Prior art date
Application number
PCT/JP2009/064261
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English (en)
French (fr)
Japanese (ja)
Inventor
貴広 藤井
雄亮 寺田
修司 安藤
浩嗣 石川
Original Assignee
日本発條株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日本発條株式会社 filed Critical 日本発條株式会社
Priority to JP2010525674A priority Critical patent/JP5374510B2/ja
Publication of WO2010021286A1 publication Critical patent/WO2010021286A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a connection terminal and a connector, socket, and semiconductor package provided with the connection terminal.
  • JP 2004-319209 A JP 2001-85131 A Japanese Patent Laid-Open No. 2002-231401 Japanese Patent No. 3847227
  • the leaf spring described in Patent Document 4 can realize a narrow pitch while securing a stroke due to a load by narrowing the width of the spring and increasing the length of the spring. Because of the structure having contact points, mechanical wear tends to occur, and there is a problem in durability.
  • the present invention has been made in view of the above, and can provide a connection terminal, a connector, a socket, and a semiconductor package that can achieve a narrow pitch while ensuring a stroke due to a load, and have excellent durability. With the goal.
  • connection terminal is a connection terminal that is formed using a conductive material and electrically connects two different circuit structures, and has a flat plate shape.
  • a base portion of the base portion a first contact portion that rises from the surface of the base portion and deforms according to a load applied from the outside, and a surface opposite to the surface of the base portion on which the first contact portion rises
  • a second contact portion that extends from the surface of the substrate and deforms according to a load applied from the outside.
  • the first contact portion extends to the first base end portion that extends while curving in a direction away from the base portion, and the first base end portion.
  • a first distal end portion that extends while curving in a direction opposite to the first base end portion, and the second contact portion extends while curving in a direction away from the base portion. It has a 2nd base end part and the 2nd tip part which extends while curving to the 2nd base end part and curving to the side opposite to the 2nd base end part, It is characterized by the above-mentioned.
  • the base portion has an opening penetrating in the thickness direction, and the first contact portion extends from a part of an edge of the opening portion.
  • the second contact portion extends from a portion of the edge of the opening that is different from the portion where the first contact portion extends.
  • connection terminal according to the present invention is the above-described invention, wherein the opening is not based on the shape of the first and second contact portions that change according to a load, and the first and second contact portions are the bases. It is characterized by having a shape that always includes a region projected onto the surface of the part.
  • connection terminal according to the present invention is characterized in that, in the above invention, the first and second contact portions are formed by plastic working.
  • the base part is integrated with the first contact part
  • the first base part is integrated with the second contact part
  • the first base part A second base part to which a part of each other is fixed
  • the first and second base parts are at least a boundary part between the surfaces facing each other and the first and second contact parts. It is characterized in that the surfaces not including each are fixed.
  • connection terminal according to the present invention has the same shape as the first partial connection terminal, the first partial connection terminal including the first contact portion and the first base portion, and the second contact. And a second partial connection terminal comprising the second base portion.
  • connection terminal In the connection terminal according to the present invention, the first partial connection terminal and the second partial connection terminal are in a mirror image target positional relationship.
  • connection terminal in the above invention, the first contact portion and the second contact portion are adjacent to each other, and the base portion is connected to the first contact portion and the second contact portion. It is characterized by having a slit between the part connected to.
  • connection terminal according to the present invention is characterized in that, in the above invention, the two-dimensional region obtained by projecting the connection terminal onto a plane passing through the surface of the base portion has an axisymmetric shape. .
  • the first and second contact portions extend from portions separated from each other.
  • connection terminal In the connection terminal according to the present invention, the two-dimensional region obtained by projecting the connection terminal onto a plane passing through the surface of the base portion has a point-symmetric shape. .
  • the connector according to the present invention includes a plurality of connection terminals described in the above invention, wherein the surfaces of the base portions included in each connection terminal are arranged to pass through the same plane.
  • a socket according to the present invention is a socket for mounting a semiconductor package, and is characterized by including the connector described in the above invention.
  • a semiconductor package according to the present invention includes the connector described in the above invention.
  • the flat base portion, the first contact portion rising from the surface of the base portion and extending in accordance with a load applied from the outside, and the first contact portion among the surfaces of the base portion are
  • the first contact portion and the second contact portion are independently deformed because the second contact portion extends from the surface opposite to the rising surface and extends in accordance with a load applied from the outside.
  • the stroke can be secured.
  • FIG. 1 is a perspective view showing a configuration of a connection terminal according to Embodiment 1 of the present invention.
  • FIG. 2 is a side view in the direction of arrow A in FIG.
  • FIG. 3 is a perspective view showing the configuration of the socket according to Embodiment 1 of the present invention.
  • FIG. 4 is a diagram illustrating a configuration of a connector (part) according to the first embodiment of the present invention.
  • FIG. 5 is a diagram showing an adhesion portion between a partial connection terminal and a connection terminal support film constituting the connection terminal according to Embodiment 1 of the present invention.
  • FIG. 6 is a diagram showing a state before the semiconductor package is mounted on the socket according to the first embodiment of the present invention.
  • FIG. 1 is a perspective view showing a configuration of a connection terminal according to Embodiment 1 of the present invention.
  • FIG. 2 is a side view in the direction of arrow A in FIG.
  • FIG. 3 is a perspective view showing the configuration of the socket according to
  • FIG. 7 is a diagram showing a state after the semiconductor package is mounted on the socket according to the first embodiment of the present invention.
  • FIG. 8 is a diagram illustrating load characteristics when a part of the base portion of the partial connection terminal constituting the connection terminal according to Embodiment 1 of the present invention is not fixed.
  • FIG. 9 is a diagram showing load characteristics when the base portion of the partial connection terminal constituting the connection terminal according to Embodiment 1 of the present invention is completely fixed.
  • FIG. 10 is a diagram showing a configuration of a semiconductor package to which the connection terminal according to Embodiment 1 of the present invention is applied.
  • FIG. 11 is a perspective view showing a configuration of a connection terminal according to Embodiment 2 of the present invention.
  • 12 is a side view in the direction of arrow B in FIG.
  • FIG. 13 is a plan view showing the configuration of the connection terminal according to Embodiment 2 of the present invention.
  • FIG. 14 is a diagram showing a configuration of a connector (part) according to the second embodiment of the present invention.
  • FIG. 15 is a diagram showing an adhesion portion between the connection terminal and the connection terminal support film according to Embodiment 2 of the present invention.
  • FIG. 16 is a plan view showing the configuration of the connection terminal according to Embodiment 3 of the present invention. 17 is a side view in the direction of arrow C in FIG.
  • FIG. 18 is a plan view showing the configuration of the connection terminal according to Embodiment 3 of the present invention.
  • FIG. 19 is a diagram showing a configuration of a connector (part) according to the third embodiment of the present invention.
  • FIG. 20 is a diagram showing an adhesion portion between the connection terminal and the connection terminal support film according to Embodiment 3 of the present invention.
  • FIG. 1 is a diagram showing a configuration of a connection terminal according to Embodiment 1 of the present invention.
  • FIG. 2 is a side view in the direction of arrow A in FIG.
  • the connection terminal 1 shown in FIGS. 1 and 2 includes two partial connection terminals 2 that have the same shape as each other and are partially fixed to each other.
  • the connection terminal 1 has a mirror image shape with respect to one plane.
  • the partial connection terminal 2 includes a flat base portion 21 provided with an opening 20 penetrating in the plate thickness direction, and a contact portion that rises from the surface of the base portion 21 and extends in accordance with a load applied from the outside. 22.
  • the contact portion 22 extends from the part of the edge of the opening 20 in a direction away from the base portion 21 while extending in a strip shape, and is connected to the base end portion 22a and is opposite to the base end portion 22a.
  • a distal end portion 22b extending in a tapered band shape while being curved to the side.
  • the two partial connection terminals 2 are bonded to each other by the solder 3 so that the surfaces of the base portions that do not include the boundary portion with the base end portion 22a of the contact portion 22 are bonded to each other. Therefore, one of the two partial connection terminals 2 is a first partial connection terminal, and the other is a second partial connection terminal.
  • the base portion 21 and the contact portion 22 of the partial connection terminal 2 that is the first partial connection terminal are the first base portion and the first contact portion, respectively, and the base portion 21 of the partial connection terminal that is the second partial connection terminal and
  • the contact portions 22 are a second base portion and a second contact portion, respectively.
  • the partial connection terminal 2 is formed using a conductive material such as a copper alloy such as copper or phosphor bronze, nickel, a nickel alloy, spring steel, or stainless steel. Note that the surface of these conductive materials may be plated with nickel, gold, or the like.
  • the partial connection terminal 2 is formed by, for example, etching a single flat plate to shape a portion of the contact portion 22 and then subjecting the shaped portion of the contact portion 22 to plastic processing such as press molding. Is done.
  • FIG. 3 is a diagram showing a configuration of a socket which is an application example of the connection terminal 1 having the above configuration.
  • a socket 100 shown in the figure electrically connects between a semiconductor package 200 such as LGA or BGA and a printed circuit board 300.
  • the socket 100 is a sheet-like connector 101 in which a plurality of connection terminals are arranged in an array, a housing member 102 that is provided around the connector 101 and that is attached with the electrode surface of the semiconductor package 200 as a bottom surface, and is attached to the housing member 102.
  • a frame member 103 that fixes the semiconductor package 200 by applying a predetermined load. At four corners of the frame member 103, holes for inserting the screw members 104 are provided. The screw member 104 inserted through the hole of the frame member 103 is screwed into the mounting hole 105 of the corresponding housing member 102.
  • FIG. 4 is a diagram showing the configuration of the connector 101 (part).
  • the connector 101 shown in FIG. 1 has a plurality of connection terminals 1 arranged in an array so that the surface of each base portion 21 passes on the same plane, and a part of the surface of each base portion 21 is made of polyimide or the like. It is covered with a connection terminal support film 111 made of an insulating material. For this reason, two connection terminal support films 111 are provided on the upper surface side and the lower surface side.
  • a plurality of flat plates each serving as the partial connection terminals 2 are arranged in an array on the film to be the connection terminal support film 111 and attached with an adhesive, and then each flat plate is etched.
  • the mold is formed into a predetermined shape by the above method, and the portion to be the contact portion 22 is bent and raised by press working or the like.
  • FIG. 5 is a diagram showing a configuration in the vicinity of an adhesive portion between the partial connection terminal 2 and the connection terminal support film 111, and corresponds to a plan view of one partial connection terminal 2 as viewed from the upper surface of FIG.
  • An adhesive portion G shown in FIG. 5 is a portion where the connection terminal support film 111 covers the base portion 21.
  • the area of the opening 111 a of the connection terminal support film 111 is larger than the area of the opening 20.
  • the opening 111 a is formed so as not to cover a portion that acts as a spring in the partial connection terminal 2 (near the boundary portion between the contact portion 22 and the base end portion 22 a).
  • the opening 20 has a shape that always includes a region in which the contact portion 22 is projected onto the surface of the base portion 21, regardless of the shape of the contact portion 22 that changes according to the load. For this reason, even if the contact portion 22 changes in shape due to an external load, the contact portion 22 does not hit the base portion 21.
  • the connector 101 is joined. Is formed.
  • the formed connector 101 is installed inside the housing member 102 in a state in which the surface of the printed circuit board 300 and the surface of the connection terminal support film 111 are substantially parallel.
  • FIG. 6 is a view showing a state before the semiconductor package 200 is attached to the socket 100.
  • the adhesive which affixes the connection terminal support film 111 and the partial connection terminal 2 is thin, description of the adhesive is abbreviate
  • FIG. 6 when the semiconductor package 200 descends and comes into contact with the contact portion 22 of the partial connection terminal 2 located above, a load is applied to the two partial connection terminals 2.
  • a load starts to be applied to the partial connection terminal 2
  • the tip end portion of the contact portion 22 gradually approaches the base portion 21 while being deformed, and the contact portion 22 is in a state of lying on the base portion 21.
  • a portion of the base portion 21 that is not fixed to the other base portion 21 by the solder 3 is curved in a direction away from the other base portion 21.
  • the contact portion 22 of one partial contact terminal 2 contacts the electrode 201 of the semiconductor package 200
  • the contact portion 22 of the other partial contact terminal 2 contacts the electrode 301 of the printed circuit board 300.
  • a part of the connection terminal support film 111 is slightly deformed following the movement of the partial connection terminal 2 in the vicinity of the base end portion 22 a of the contact portion 22.
  • FIG. 7 is a view showing a state in which the semiconductor package 200 is attached to the socket 100. In this state, the load applied to the connection terminal 1 is maximized, and a stable contact load and contact resistance can be ensured.
  • the electrodes of the semiconductor package 200 are not limited to a planar shape like the electrode 201, but may be spherical like a BGA.
  • FIG. 8 is a diagram showing the relationship between the stroke of the partial connection terminal 2 and the load when the semiconductor package 200 is removed after the semiconductor package 200 is once attached to the socket 100.
  • the relationship between the stroke of the partial connection terminal 2 and the load is a quadratic curve. This means that the non-linear effect is large in the partial connection terminal 2 in which only a part of the base portion 21 is fixed.
  • Such a load characteristic is due to the fact that the spring constant of the contact portion 22 also changes as the load changes.
  • FIG. 9 is a diagram showing a relationship between stroke loads when the entire surface of the base portion 21 of the partial connection terminal 2 is fixed by the solder 3 as a comparative example of FIG.
  • the base portion 21 is completely fixed, the base portion 21 is not deformed even if a load is applied to the partial connection terminals 2. For this reason, the load applied to the partial connection terminal 2 is applied to the contact portion 22.
  • the stroke is increased by the same amount as that of the curve L1
  • the stroke does not decrease immediately, and the stroke starts to decrease after the load is reduced to some extent (curve L2).
  • the entire base portion 21 of the partial connection terminal 2 is not fixed, but a part thereof is appropriately selected and fixed, so that the load characteristics are hardly changed even when used repeatedly. And durability can be improved.
  • connection terminal 1 can also be applied as various semiconductor devices other than the socket 100.
  • FIG. 10 is a perspective view illustrating a configuration of a semiconductor package to which the connection terminal 1 is applied.
  • a plurality of connection terminals 1 are arranged in an array so that the surfaces of the base portions 21 pass on the same plane, and a part of the surface of each base portion 21 is connected to the connection terminals. It includes a connector 401 covered with a support film 411, a base material 402 on which the connector 401 is placed, and a screw member 403 that fixes a peripheral portion of the connector 401 to the base material 402. Also in the semiconductor package 400 having such a configuration, the same effect as that of the socket 100 can be obtained.
  • connection terminal 1 having a mirror image shape is formed by joining the two partial connection terminals 2 having the same shape with the solder 3.
  • the contact portion 22 is deformed independently. Therefore, a sufficient stroke can be ensured even when the connection terminal is downsized to cope with a narrow pitch.
  • the base portion 21 and the contact portion 22 have a composite spring action, and the load applied from the outside can be dispersed by the base portion 21 and the contact portion 22. Therefore, durability against a load applied from the outside is improved, it is possible to repeatedly use it, and a stroke range in which no settling occurs can be expanded. As a result, even if a device or substrate to be touched is warped or waved, and there is a variation in mounting height, it can be absorbed, and mounting can be performed easily and at low cost.
  • the degree of freedom in spring design is high, it is possible to realize a connection with sufficient stress and to improve durability.
  • the only part related to contact is the contact part where the two contact parts 22 come into contact with the contact object, and therefore mechanical wear. Is less likely to occur and the spring characteristics are less likely to deteriorate. In addition, since there are few contact locations, the contact resistance can be reduced.
  • FIG. 11 is a diagram showing the configuration of the connection terminal according to Embodiment 2 of the present invention.
  • 12 is a side view in the direction of arrow B in FIG.
  • FIG. 13 is a view of the connection terminal according to the second embodiment as viewed from above.
  • the connection terminal 4 shown in FIGS. 11 to 13 has a flat base portion 41 provided with an opening 40 penetrating in the plate thickness direction, and extends from the surface of the base portion 41 so as to respond to a load applied from the outside.
  • a first contact portion 42 that deforms in response to the second contact, a second contact that rises from the surface of the base portion 41 opposite to the surface on which the first contact portion 42 rises and extends in response to a load applied from the outside.
  • the connection terminal 4 is formed using the same material as the partial connection terminal 2 described in the first embodiment.
  • the first contact portion 42 includes a first base end portion 42a that extends in a band shape while curving in a direction away from a part of the edge of the opening 40 with respect to the base portion 41 (upward in FIG. 12), and a first base It has a first distal end portion 42b extending in a tapered band while being curved to the opposite side to the first base end portion 42a.
  • the second contact portion 43 is away from the portion of the edge of the opening 40 that is different from the portion where the first contact portion 42 extends, away from the first base end portion 42a with respect to the base portion 41 (FIG. 12).
  • a second base end portion 43a extending in a strip shape while being curved downward
  • a second base end portion 43a extending in a taper strip shape while curving toward the opposite side of the second base end portion 43a. 2 tip portions 43b.
  • the first contact part 42 and the second contact part 43 are adjacent to each other.
  • a narrow belt-like shape is formed between a portion of the base portion 41 that is continuous with the first contact portion 42 (the first base end portion 42a) and a portion that is continuous with the second contact portion 43 (the second base end portion 43a).
  • a slit 41s penetrating the base portion 41 is provided. Instead of providing the slit 41 s, a slit that does not penetrate the base portion 41 from between a portion continuous with the first contact portion 42 and a portion continuous with the second contact portion 43 may be provided. As shown in FIG.
  • the two-dimensional region obtained by projecting the connection terminal 4 onto the plane passing through the surface of the base portion 41 has the center of the slit 41 s along the penetration direction of the slit 41 s on the plane.
  • the line is symmetrical with respect to the straight line passing through.
  • the opening 40 is a region obtained by projecting the first contact portion 42 and the second contact portion 43 onto the surface of the base portion 41 regardless of the shapes of the first contact portion 42 and the second contact portion 43 that change according to the load.
  • the shape is always included. For this reason, even if the first contact portion 42 and the second contact portion 43 change in shape due to an external load, they do not hit the base portion 41.
  • FIG. 14 is a diagram showing a configuration of a connector (part) according to the second embodiment.
  • a connector 501 shown in FIG. 1 has a plurality of connection terminals 4 arranged in an array so that the surfaces of the base portions 41 pass on the same plane, and a part of one surface of each base portion 41 is polyimide. It is covered with a connection terminal support film 511 made of an insulating material such as.
  • connection terminals 4 When the connector 501 is formed, a plurality of flat plates each serving as the connection terminals 4 are arranged in an array on the film serving as the connection terminal support film 511 and attached with an adhesive, and then each flat plate is subjected to chemical etching or the like.
  • the mold is formed into a predetermined shape by a technique, and the portions that become the first contact portion 42 and the second contact portion 43 are bent and raised by pressing or the like.
  • FIG. 15 is a view showing an adhesive portion between the connection terminal 4 and the connection terminal support film 511, and corresponds to a plan view of one connection terminal 4 as viewed from the upper surface of FIG.
  • the area of the opening 511 a of the connection terminal support film 511 is larger than the area of the opening 40.
  • the opening 511a is formed so as not to cover a portion (a boundary portion between the first base end portion 42a and the second base end portion 43a) that acts as a spring in the connection terminal 4, and the covering portion is an adhesive portion.
  • the connector 501 having the above configuration is applied as a socket or a terminal of a semiconductor package as in the first embodiment.
  • the configuration of the socket excluding the connector 501 is the same as that of the socket 100 shown in FIG.
  • a connector corresponding to the connector 401 of the semiconductor package 400 shown in FIG. 10 can be formed by using the connection terminals 4.
  • each of them is a part of the edge of the opening 40 of the base portion 41 and extends from the adjacent portions to the base portion 41 in different directions. Since the first contact portion 42 and the second contact portion 43 that can be deformed by an external load are provided, the first contact portion 42 and the second contact portion 43 are independently deformed to ensure a stroke. be able to. Further, since the first contact portion 42 and the second contact portion 43 do not need to have a contact point, wear due to repeated use does not occur. Therefore, it is possible to reduce the pitch while securing the stroke range, and it is possible to provide a connection terminal, a connector, a socket, and a semiconductor package that are excellent in durability.
  • FIG. 16 is a diagram illustrating a configuration of a connection terminal according to Embodiment 3 of the present invention.
  • 17 is a side view in the direction of arrow C in FIG.
  • FIG. 18 is a view of the connection terminal according to the third embodiment as viewed from above.
  • the connection terminal 5 shown in FIGS. 16 to 18 has a flat plate-like base portion 51 provided with an opening 50 penetrating in the plate thickness direction, and extends from the surface of the base portion 51 and is applied to a load applied from the outside.
  • the connection terminal 5 is formed using the same material as the partial connection terminal 2 described in the first embodiment.
  • the first contact portion 52 includes a first base end portion 52a extending in a band shape while curving in a direction away from a part of the edge of the opening 50 with respect to the base portion 51 (upward in FIG. 17), and a first base It has a first distal end portion 52b that extends in a tapered band shape while being curved to the opposite side to the first proximal end portion 52a.
  • the second contact portion 53 extends away from the portion of the edge of the opening 50 that is different from the portion where the first contact portion 52 extends, away from the first base end portion 52a with respect to the base portion 51 (FIG. 17).
  • a second base end portion 53a extending in a belt shape while curving downward
  • a second base end portion 53a extending in a taper strip shape while curving toward the opposite side of the second base end portion 53a. 2 tip portions 53b.
  • the first contact portion 52 and the second contact portion 53 extend from portions of the inner edge of the opening 50 that are separated from each other. As shown in FIG. 18, the two-dimensional region obtained by projecting the connection terminal 5 onto a plane passing through the surface of the base portion 51 has a point-symmetric shape with respect to the center of the connection terminal 5 on the plane. Eggplant.
  • the opening 50 is a region obtained by projecting the first contact portion 52 and the second contact portion 53 onto the surface of the base portion 51 regardless of the shapes of the first contact portion 52 and the second contact portion 53 that change according to the load.
  • the shape is always included. For this reason, even if the first contact portion 52 and the second contact portion 53 change in shape due to an external load, they do not hit the base portion 51.
  • FIG. 19 is a diagram showing a configuration of a connector (part) according to the third embodiment.
  • the connector 601 shown in FIG. 1 has a plurality of connection terminals 5 arranged in an array so that the surfaces of the base portions 51 pass on the same plane, and a part of one surface of each base portion 51 is polyimide. It is covered with a connection terminal support film 611 made of an insulating material such as.
  • the connector 601 can be formed in the same manner as the connector 501 according to the second embodiment.
  • FIG. 20 is a diagram showing an adhesive portion between the connection terminal 5 and the connection terminal support film 611, and corresponds to a plan view of one connection terminal 5 as viewed from the upper surface of FIG.
  • the opening 611 a of the connection terminal support film 611 is larger than the area of the opening 50. Further, the opening 611a is formed so as not to cover a portion (a boundary portion between the first base end portion 52a and the second base end portion 53a) that acts as a spring in the connection terminal 5, and the covering portion is an adhesive portion. G.
  • the connector 601 having the above configuration can be applied to a socket or a semiconductor package as in the first and second embodiments.
  • each of them is a part of the edge of the opening 50 of the base portion 51 and extends from a portion that is separated from each other to the base portion 51 in different directions.
  • the first contact portion 52 and the second contact portion 53 that can be deformed by an external load are provided, the first contact portion 52 and the second contact portion 53 are independently deformed to ensure a stroke. be able to.
  • the first contact portion 52 and the second contact portion 53 do not need to have a contact point, wear due to repeated use does not occur. Therefore, it is possible to reduce the pitch while securing the stroke range, and it is possible to provide a connection terminal, a connector, a socket, and a semiconductor package that are excellent in durability.
  • Embodiments 1 to 3 have been described in detail as the best mode for carrying out the present invention, but the present invention should not be limited by these embodiments.
  • the connection terminal which concerns on this invention the base part does not need to have an opening part.
  • the number of the contact parts with which the connection terminal which concerns on this invention is provided may be two or more.
  • the present invention can include various embodiments and the like not described herein, and various design changes and the like can be made without departing from the technical idea specified by the claims. It is possible to apply.
  • the present invention is suitable as a connection terminal provided in various semiconductor connectors and semiconductor packages.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Connecting Device With Holders (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
PCT/JP2009/064261 2008-08-22 2009-08-12 接続端子、コネクタ、ソケットおよび半導体パッケージ WO2010021286A1 (ja)

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JP2010525674A JP5374510B2 (ja) 2008-08-22 2009-08-12 接続端子、コネクタ、ソケットおよび半導体パッケージ

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JP2008214374 2008-08-22
JP2008-214374 2008-08-22

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011228215A (ja) * 2010-04-22 2011-11-10 Nhk Spring Co Ltd 接続端子、コネクタ、ソケットおよび半導体パッケージ
JP2015032583A (ja) * 2013-07-31 2015-02-16 ハイパータック ソシエテ アノニム 基板とデバイスとの間の接触部材及び当該接触部材を備えた電気コネクタ
WO2015129900A1 (ja) * 2014-02-28 2015-09-03 日本発條株式会社 ばね部材および押圧ユニット
JP2016059237A (ja) * 2014-09-12 2016-04-21 株式会社デンソー 電力変換装置

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TWI584543B (zh) * 2013-12-12 2017-05-21 欣興電子股份有限公司 連接器與其製作方法
JP2019200872A (ja) 2018-05-15 2019-11-21 モレックス エルエルシー コネクタ

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JP2011228215A (ja) * 2010-04-22 2011-11-10 Nhk Spring Co Ltd 接続端子、コネクタ、ソケットおよび半導体パッケージ
JP2015032583A (ja) * 2013-07-31 2015-02-16 ハイパータック ソシエテ アノニム 基板とデバイスとの間の接触部材及び当該接触部材を備えた電気コネクタ
WO2015129900A1 (ja) * 2014-02-28 2015-09-03 日本発條株式会社 ばね部材および押圧ユニット
JPWO2015129900A1 (ja) * 2014-02-28 2017-03-30 日本発條株式会社 ばね部材および押圧ユニット
JP2016059237A (ja) * 2014-09-12 2016-04-21 株式会社デンソー 電力変換装置

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