WO2010016371A1 - Circuit intégré, procédé de fabrication de circuits intégrés et dispositif de fabrication de circuits intégrés - Google Patents

Circuit intégré, procédé de fabrication de circuits intégrés et dispositif de fabrication de circuits intégrés Download PDF

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Publication number
WO2010016371A1
WO2010016371A1 PCT/JP2009/062880 JP2009062880W WO2010016371A1 WO 2010016371 A1 WO2010016371 A1 WO 2010016371A1 JP 2009062880 W JP2009062880 W JP 2009062880W WO 2010016371 A1 WO2010016371 A1 WO 2010016371A1
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WIPO (PCT)
Prior art keywords
microchip
substrate
peeling
hot plate
manufacturing
Prior art date
Application number
PCT/JP2009/062880
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English (en)
Japanese (ja)
Inventor
清水　直紀
Original Assignee
コニカミノルタオプト株式会社
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Priority to JP2010523820A priority Critical patent/JPWO2010016371A1/ja
Publication of WO2010016371A1 publication Critical patent/WO2010016371A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
    • B29C33/442—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles with mechanical ejector or drive means therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/005—Detaching the article from the joining tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/06—Fluid handling related problems
    • B01L2200/0689—Sealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0809—Geometry, shape and general structure rectangular shaped
    • B01L2300/0816—Cards, e.g. flat sample carriers usually with flow in two horizontal directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0887—Laminated structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/756—Microarticles, nanoarticles

Definitions

  • the present invention relates to a microchip, a microchip manufacturing method, and a microchip manufacturing apparatus.
  • Such a microchip has two substrates formed of resin or the like, and after fine processing is performed on at least one substrate, the two substrates are sandwiched between hot plates and bonded together. It is manufactured (for example, refer to Patent Document 1).
  • peeling of the joint surface changes the way the analysis sample flows and moves in the flow path and causes the analysis sample to leak, thus preventing such problems. From this viewpoint, strong and uniform bonding strength is required.
  • the surface of the hot plate and the contact surface of the substrate with the hot plate are formed in advance smoothly.
  • a method for preventing the sticking of the microchip to the hot plate a method of applying a release agent to the surface of the hot plate in advance can be considered, but even if such a method is simply used, bonding is possible. As a result of peeling off the applied release agent by repeating the work, the peeling effect may be reduced, sticking may occur, and productivity may be reduced.
  • An object of the present invention is to provide a microchip, a microchip manufacturing method, and a manufacturing apparatus that can prevent a decrease in productivity.
  • a method for manufacturing a microchip in which two substrates that are laminated and have a flow path formed inside are sandwiched between two hot plates facing each other and are heat-bonded.
  • the peeling step includes The method includes a step of peeling the substrate from the one hot plate by applying an external force to the substrate through a through hole formed in the thickness direction of the one hot plate.
  • the peeling step includes It is preferable to include a step of peeling the substrate from the one hot plate by inserting a rod-like protruding pin through the through hole and projecting it toward the other hot plate.
  • the peeling step includes It is preferable to include a step of peeling the substrate from the one hot plate by injecting air from the outside to the substrate through the through hole.
  • a method of manufacturing a microchip in which two substrates that are stacked and have a flow path formed inside are sandwiched between two hot plates facing each other and heat bonded.
  • the peeling step includes Including a step of peeling the substrate from the one hot plate by peeling off the side portion of the substrate from the one hot plate using an engaging member that engages with the side portion of the substrate.
  • the manufacturing method of the microchip of the present invention Before the joining step, it is preferable to have a coating step of applying a release agent that prevents the substrate from sticking to the two hot plates.
  • a microchip in a microchip, It is manufactured by the method for manufacturing a microchip of the present invention.
  • a microchip manufacturing apparatus that heat-bonds two substrates that are stacked and have a flow path formed inside thereof.
  • Two hot plates that are heated and bonded to each other with the two substrates sandwiched therebetween, Moving means for bringing the two hot plates into contact with and away from each other;
  • a peeling means for peeling off the substrate attached to one of the two hot plates from the hot plate;
  • the peeling means includes The substrate is separated from the one hot plate by applying an external force to the substrate through a through hole formed in the thickness direction of the one hot plate.
  • the peeling means includes It is preferable to have a rod-like protruding pin that is inserted into the through hole and protrudes toward the other hot plate to peel the substrate from the one hot plate.
  • the peeling means includes It is preferable to have a jetting means for peeling the substrate from the one hot plate by jetting air from the outside to the substrate through the through hole.
  • a microchip manufacturing apparatus that heat-bonds two substrates that are laminated to form a flow path on the inside, Two hot plates that are heated and bonded to each other with the two substrates sandwiched therebetween, Moving means for bringing the two hot plates into contact with and away from each other; A peeling means for peeling off the substrate attached to one of the two hot plates from the hot plate;
  • the peeling means includes An engaging member that engages a side of the substrate; Drive means for separating the engagement member from the one heat plate in a state of being engaged with the side portion of the substrate; The substrate is peeled from the one hot plate by peeling the side portion of the substrate from the one hot plate by the engaging member.
  • a release agent for preventing the substrate from sticking is applied to the two hot plates.
  • the substrate attached to the hot plate is peeled off from the hot plate, so that it is possible to prevent a decrease in productivity.
  • FIG. 4 is a cross-sectional view of the microchip according to the present invention, and is a cross-sectional view taken along the line IV-IV in FIG. It is a top view of the resin-made board
  • FIG. 1 is a top view of a microchip 1 according to the present invention
  • FIG. 2 is a sectional view taken along line IV-IV in FIG.
  • the microchip 1 includes two rectangular plate-like resin substrates 10 and 20 bonded to each other.
  • the resinous substrate 10 has linear flow channel grooves 12 and 13 formed on one surface (the upper surface in FIG. 2). Further, as shown in FIG. 3, through holes 14 penetrating in the thickness direction of the resin substrate 10 are respectively formed at both ends of the flow path grooves 12 and 13.
  • the other surface of the resin substrate 10 (the surface where the channel grooves 12 and 13 are not formed) is smooth. Further, the channel groove 12 and the channel groove 13 in the present embodiment are formed orthogonal to each other, but may be formed without being orthogonal to each other.
  • the resin substrate 20 is a member having a smooth surface, and is bonded to the formation surface of the flow path grooves 12 and 13 in the resin substrate 10.
  • the resin substrate 20 functions as a cover (cover) for the flow path grooves 12 and 13 and the through hole 14, and the fine flow path 15 is formed between the flow path grooves 12 of the resin substrate 10 and the flow path.
  • a fine channel 16 is formed between the groove 13 and the through hole 14 to form an opening 17.
  • the shape of the microchannels 15 and 16 (channel grooves 12 and 13) takes into consideration the fact that the amount of analysis sample and reagent used can be reduced, the fabrication accuracy of molds, transferability and mold release properties.
  • the width and depth are preferably in the range of 10 ⁇ m to 200 ⁇ m, but are not particularly limited, and may be determined according to the use of the microchip. And may be the same or different.
  • the cross-sectional shape of the microchannels 15 and 16 is a rectangular shape, but this shape is an example, and other shapes such as a circular shape may be used.
  • the opening 17 formed by the through hole 14 is connected to the fine flow paths 15 and 16. .
  • the opening 17 is a hole for introducing, storing, and discharging a gel, a sample, and a buffer solution, and is connected to a tube or nozzle provided in an analyzer (not shown). Thus, a gel, a sample, a buffer solution, or the like is introduced into or discharged from the fine channels 15 and 16.
  • the shape of the opening 17 (through hole 14) is not limited to a circular shape, and may be various other shapes such as a rectangular shape.
  • the inner diameter of the opening 17 (through hole 14) may be adjusted to the analysis method or the analysis apparatus, and is preferably about 2 mm, for example.
  • the shape of the resin substrates 10 and 20 may be any shape as long as it is easy to handle and analyze. For example, a shape such as a square, a rectangle, and a circle is preferable.
  • the size of the resin substrates 10 and 20 is preferably about 10 mm square to 200 mm square, and more preferably 10 mm square to 100 mm square.
  • the plate thickness of the resin substrate 10 on which the channel grooves 12 and 13 are formed is preferably about 0.2 mm to 5 mm, more preferably 0.5 mm to 2 mm in consideration of moldability.
  • the plate thickness of the resin substrate 20 functioning as a lid (cover) is preferably about 0.2 mm to 5 mm, more preferably 0.5 mm to 2 mm in consideration of moldability.
  • a film may be used as the resin substrate 20 instead of a plate member.
  • the thickness of the film is preferably 30 ⁇ m to 300 ⁇ m, and more preferably 50 ⁇ m to 150 ⁇ m.
  • resin is used as the material for the resin substrates 10 and 20.
  • this resin those having good moldability (transferability, releasability), high transparency, and low autofluorescence with respect to ultraviolet rays and visible light are preferable.
  • thermoplastic resins are used.
  • thermoplastic resin examples include polycarbonate, polymethyl methacrylate, polystyrene, polyacrylonitrile, polyvinyl chloride, polyethylene terephthalate, polyamide, polyvinyl acetate, polyvinylidene chloride, polypropylene, polyisoprene, polyethylene, polydimethylsiloxane, and cyclic polyolefin. Etc. are preferably used. It is particularly preferable to use polymethyl methacrylate and cyclic polyolefin.
  • the resin substrate 10 and the resin substrate 20 may be made of the same material or different materials.
  • thermosetting resin for the resin substrate 20 in which the channel groove is not formed, a thermosetting resin or an ultraviolet curable resin may be used in addition to the thermoplastic resin.
  • thermosetting resin polydimethylsiloxane is preferably used.
  • the resin substrate 10 on which the flow path grooves 12 and 13 are formed is preferably formed by an injection molding method or a press molding method, and the resin substrate 20 on which the flow path grooves are not formed is formed by an extrusion molding method. It may be produced by a method other than an injection molding method such as a T-die molding method, an inflation molding method, or a calendar molding method, or by an injection molding method.
  • FIG. 4 is a conceptual diagram showing a schematic configuration of a microchip manufacturing apparatus (hereinafter referred to as a manufacturing apparatus) 5.
  • a manufacturing apparatus a microchip manufacturing apparatus
  • the microchip 1 is shown in a simplified manner.
  • the manufacturing apparatus 5 peels the resin board 10 (or 20) from the two hot plates 51 and 52 disposed vertically opposite to each other and the hot plate 51 (or 52).
  • the peeling means 55 to be provided.
  • the hot plates 51 and 52 are plate-like members that are heat-bonded with the resin substrates 10 and 20 therebetween, and are moved in the contact / separation direction (vertical direction in the figure) by the moving means 53. .
  • the moving means 53 may move the hot plates 51 and 52, respectively, or only one of them.
  • a conventionally known apparatus can be used.
  • the resin substrate 10 is disposed on the upper side and the resin substrate 20 is disposed on the lower side between the hot plates 51 and 52, and the resin substrates 10 and 20 are sandwiched. This will be explained. Further, the microchip 1 heated and bonded by the hot plates 51 and 52 will be described as being attached to the hot plate 51 on the resin substrate 10 side.
  • a plurality of through holes 510 penetrating in the thickness direction are formed in the hot plate 51 disposed on the upper side. More specifically, these through holes 510 are provided in the hot plate 51 so as to open in a contact area with the end of the resin substrate 10 on the lower surface of the hot plate 51.
  • the inner side surfaces of the hot plates 51 and 52 are smooth at portions other than the through holes 510.
  • FIG. 4 a state is shown in which two through holes 510 are provided so as to open in the contact area with the two short side ends of the resin substrate 10 on the lower surface of the hot plate 51.
  • it may be provided so as to open in a contact area with the end portion on the long side, or may be provided so as to open in a contact area with the end portion on the short side and the long side. .
  • the peeling means 55 peels the resin substrate 10 from the hot plate 51 by applying an external force to the resin substrate 10 through the through hole 510 of the hot plate 51. It has rod-like protruding pins 511 inserted from the side opposite to the heat plate 52, and driving means 512 for reciprocating these protruding pins 511 in the axial direction so as to protrude from the lower surface of the heat plate 51. . It should be noted that the protrusion / disengagement operation of the protrusion pin 511 may be performed synchronously or separately and independently.
  • the protruding pin 511 is disposed only on the heat plate 51 side, but may be disposed on the heat plate 52 side or on both sides. It is determined as appropriate depending on which of the substrates 10 and 20 is attached to the hot plates 51 and 52. Usually, when the resin substrate is a film, since the film tends to stick to the hot plate, a configuration in which a pin configuration is arranged on the hot plate side on the film side is preferable.
  • substrates 10 at the time of peeling is an area
  • the deformation of the flow path shape due to the peeling operation can be prevented, and the shape of the through hole 510 is transferred to the film-like resin substrate 10 and the observation of the flow path is hindered. Can be prevented.
  • a release agent (not shown) for preventing the resin substrates 10 and 20 from sticking is applied to the inner side surfaces of the two hot plates 51 and 52 (the lower surface of the hot plate 51 and the upper surface of the hot plate 52).
  • a conventionally known release agent can be used as such a release agent.
  • the resin substrates 10 and 20 are stacked one above the other with the formation surfaces of the flow path grooves 12 and 13 in the resin substrate 10 facing inward (lower side), and disposed between the hot plates 51 and 52. To do.
  • the hot plates 51 and 52 are brought close to the moving means 53 so that the resin substrates 10 and 20 are sandwiched between the hot plates 51 and 52, and in this state, the resin substrates 10 and 20 are heated and bonded while being pressed (bonding). Process).
  • the bonding of the resin substrate 10 and the resin substrate 20 is performed by heat welding such as thermocompression bonding or heat lamination.
  • thermocompression bonding or heat laminating By applying thermocompression bonding or heat laminating to the resin substrates 10 and 20, the resin on the bonding surface of the resin substrates 10 and 20 is melted, and the resin substrate 10 and the resin substrate 20 are bonded to each other. Chip 1 is formed.
  • the heating temperature for example, a temperature of 70 ° C. to 200 ° C. can be used.
  • the hot plates 51 and 52 are separated from the moving means 53 (separating step). At this time, since the outer surface of the resin substrate 10 (surface opposite to the resin substrate 20) and the lower surface of the hot plate 51 are formed smoothly, the resin substrate 10 of the microchip 1 is the hot plate 51. Will be pasted on.
  • the protruding pin 511 is protruded from the through hole 510 toward the heat plate 52, and the resin substrate 10 (microchip 1) attached to the heat plate 51 is attached to the heat plate 51.
  • the microchip 1 is manufactured by peeling from the substrate (peeling step).
  • the resin substrate 10 attached to the hot plate 51 is peeled off from the hot plate 51. Can be prevented.
  • the microchip manufacturing apparatus 5 ⁇ / b> A includes a hot plate 51 ⁇ / b> A instead of the hot plate 51 and a peeling unit 55 ⁇ / b> A instead of the peeling unit 55.
  • the hot plate 51A has an air injection port 510A opened from the surface on the hot plate 52 side, that is, the lower surface.
  • air injection port 510A penetrates in the thickness direction of heat plate 51A so as to open in a contact area with the end of resin substrate 10 on the lower surface of heat plate 51A.
  • it may be bent from the lower surface toward the side end surface.
  • the peeling means 55A has an injection means 550 for injecting air from the upper surface side to the lower surface side (resin substrate 10 side) of the hot plate 51A via the air injection port 510A of the hot plate 51A.
  • an injection unit 550 a conventionally known injection device can be used.
  • the injection means 550 injects air from the air injection port 510A in the peeling step, so that the resin substrate 10 (microchip 1) attached to the hot plate 51A is attached to the hot plate. Since it can peel from 51A, the effect similar to the said embodiment can be acquired.
  • Modification (2) Next, a modification (2) of the microchip manufacturing apparatus according to the present invention will be described.
  • symbol is attached
  • substrate 20 is formed larger than the resin board
  • the microchip manufacturing apparatus 5 ⁇ / b> B includes a hot plate 51 ⁇ / b> B instead of the hot plate 51, and a peeling unit 55 ⁇ / b> B instead of the peeling unit 55.
  • the hot plate 51B is a flat plate member in which the through hole 510 is not provided.
  • the peeling means 55B includes an engaging member 500 that engages with a side portion of the resin substrate 20, and a driving means 501 that separates the engaging member 500 from the heat plate 51B in a state where the engaging member 500 is engaged with the side portion of the resin substrate 20.
  • the engaging member 500 is formed in a hook shape at the tip, and is engaged with the side portion of the resin substrate 20 at this hook-shaped portion.
  • the engaging member 500 may be engaged with the resin substrate 20 in other forms such as friction engagement.
  • the engaging member 500 may be engaged with the resin substrate 10 or may be engaged with both the resin substrates 10 and 20.
  • the resin adhered to the hot plate 51B by the driving means 501 peeling the side portion of the resin substrate 20 from the hot plate 51B via the engaging member 500 in the peeling process. Since the substrate-making substrate 20 (microchip 1) can be peeled from the hot plate 51B, the same effect as the above embodiment can be obtained.
  • the through hole 14 is formed in the resin substrate 10, but by forming the through hole in the resin substrate 20, an opening connected to the fine flow path is formed. May be.
  • the microchip 1 has been described as including the resin substrate 10 in which the non-formation surfaces of the flow path grooves 12 and 13 are smooth, but a resin substrate 40 as shown in FIG. It is good also as preparing for.
  • the resin substrate 40 is formed with flow channel grooves 12 and 13 on one surface, and a cylindrical protrusion 41 is provided around each through hole 14 on the other surface.
  • These protrusions 41 surround the through-holes 14 and protrude in the thickness direction of the resin substrate 40 and are fitted into tubes and nozzles of an analyzer (not shown) to introduce and discharge samples and the like. To do.
  • Such a protrusion 41 may have a cylindrical shape, or may have another shape such as a polygonal shape.
  • the concavo-convex member provided on the non-formation surface of the flow path grooves 12 and 13 in the resin substrate 40 is not limited to the protrusion 41, and for example, for controlling the flow of the sample flowing in the fine flow path. It may be a switch or a lens for collecting light from the analyzer.
  • the resin substrate 10 of the microchip 1 has been described as being attached to the hot plate 51 (51A, 51B), the resin substrate 20 may be attached to the hot plate 52.
  • the through hole 510 air injection port 510A
  • the peeling means 55 55A, 55B is arranged to peel the resin substrate 20 from the hot plate 52.

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  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Hematology (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Micromachines (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)

Abstract

L'invention concerne un procédé et un dispositif de fabrication de circuits intégrés, capables d’empêcher une diminution de la productivité. Dans le procédé de fabrication selon l’invention, un dispositif (5) de fabrication de circuits intégrés, au moyen duquel deux substrats (10, 20) en résine sont collés thermiquement, est muni de deux plaques chauffantes (51, 52) placées en vis-à-vis qui collent thermiquement les substrats (10, 20) en résine tout en prenant ceux-ci en sandwich entre elles, d’un moyen (53) de déplacement servant à éloigner ou à rapprocher les plaques chauffantes (51, 52) l’une de l’autre, et d’un moyen (55) de décollement du substrat (10) en résine collé à une plaque chauffante (51). Le moyen (55) de décollement décolle le substrat (10) en résine de la plaque chauffante (51) en appliquant une force extérieure au substrat (10) en résine par l’intermédiaire d’un trou débouchant (510) pratiqué dans le sens de l’épaisseur de la plaque chauffante (51).
PCT/JP2009/062880 2008-08-08 2009-07-16 Circuit intégré, procédé de fabrication de circuits intégrés et dispositif de fabrication de circuits intégrés WO2010016371A1 (fr)

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
JP2015153885A (ja) * 2014-02-13 2015-08-24 東京応化工業株式会社 貼付方法
FR3071763A1 (fr) * 2017-09-29 2019-04-05 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de fabrication d'une carte microfluidique

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JP2000302489A (ja) * 1999-04-09 2000-10-31 Canon Inc 加熱組立装置
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JP2001168410A (ja) * 1999-09-27 2001-06-22 Matsushita Electric Works Ltd 分極処理方法及びその装置
JP2006035547A (ja) * 2004-07-26 2006-02-09 Japan Steel Works Ltd:The 成形体の製造方法および装置
JP2006106229A (ja) * 2004-10-04 2006-04-20 Nippon Sheet Glass Co Ltd 透過型光学素子の製造方法および透過型光学素子
JP2006159805A (ja) * 2004-12-10 2006-06-22 Takei Jushi Seisakusho:Kk 溶着装置
JP2006187730A (ja) * 2005-01-06 2006-07-20 Nippon Filcon Co Ltd 樹脂製微小流路化学デバイスの製造方法並びに該製法により製造された樹脂製微小流路化学デバイス構造体

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Publication number Priority date Publication date Assignee Title
JPH07232378A (ja) * 1994-02-24 1995-09-05 Daihatsu Motor Co Ltd アスファルトシ−トをワ−クに接着する方法
JP2000302489A (ja) * 1999-04-09 2000-10-31 Canon Inc 加熱組立装置
JP2001038811A (ja) * 1999-07-30 2001-02-13 Shimadzu Corp 樹脂製部材の接合方法および樹脂製構造体
JP2001168410A (ja) * 1999-09-27 2001-06-22 Matsushita Electric Works Ltd 分極処理方法及びその装置
JP2006035547A (ja) * 2004-07-26 2006-02-09 Japan Steel Works Ltd:The 成形体の製造方法および装置
JP2006106229A (ja) * 2004-10-04 2006-04-20 Nippon Sheet Glass Co Ltd 透過型光学素子の製造方法および透過型光学素子
JP2006159805A (ja) * 2004-12-10 2006-06-22 Takei Jushi Seisakusho:Kk 溶着装置
JP2006187730A (ja) * 2005-01-06 2006-07-20 Nippon Filcon Co Ltd 樹脂製微小流路化学デバイスの製造方法並びに該製法により製造された樹脂製微小流路化学デバイス構造体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015153885A (ja) * 2014-02-13 2015-08-24 東京応化工業株式会社 貼付方法
FR3071763A1 (fr) * 2017-09-29 2019-04-05 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de fabrication d'une carte microfluidique

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