WO2013118447A1 - Appareil de manipulation de fluides et son procédé de fabrication - Google Patents

Appareil de manipulation de fluides et son procédé de fabrication Download PDF

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Publication number
WO2013118447A1
WO2013118447A1 PCT/JP2013/000420 JP2013000420W WO2013118447A1 WO 2013118447 A1 WO2013118447 A1 WO 2013118447A1 JP 2013000420 W JP2013000420 W JP 2013000420W WO 2013118447 A1 WO2013118447 A1 WO 2013118447A1
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WO
WIPO (PCT)
Prior art keywords
resin substrate
adhesive layer
pet film
resin
polyethylene terephthalate
Prior art date
Application number
PCT/JP2013/000420
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English (en)
Japanese (ja)
Inventor
健 北本
Original Assignee
株式会社エンプラス
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Filing date
Publication date
Application filed by 株式会社エンプラス filed Critical 株式会社エンプラス
Publication of WO2013118447A1 publication Critical patent/WO2013118447A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4835—Heat curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B29C66/712—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined the composition of one of the parts to be joined being different from the composition of the other part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7311—Thermal properties
    • B29C66/73117—Tg, i.e. glass transition temperature
    • B29C66/73118—Tg, i.e. glass transition temperature of different glass transition temperature, i.e. the glass transition temperature of one of the parts to be joined being different from the glass transition temperature of the other part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
    • B29C66/91411—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
    • B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
    • B29C66/91931—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined
    • B29C66/91935—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined lower than said fusion temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
    • B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
    • B29C66/91941—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to Tg, i.e. the glass transition temperature, of the material of one of the parts to be joined
    • B29C66/91943—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to Tg, i.e. the glass transition temperature, of the material of one of the parts to be joined higher than said glass transition temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
    • B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
    • B29C66/91941—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to Tg, i.e. the glass transition temperature, of the material of one of the parts to be joined
    • B29C66/91945—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to Tg, i.e. the glass transition temperature, of the material of one of the parts to be joined lower than said glass transition temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0809—Geometry, shape and general structure rectangular shaped
    • B01L2300/0816—Cards, e.g. flat sample carriers usually with flow in two horizontal directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0861—Configuration of multiple channels and/or chambers in a single devices
    • B01L2300/0877—Flow chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0887—Laminated structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/756—Microarticles, nanoarticles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/032—Gluing

Definitions

  • the present invention relates to a fluid handling apparatus used for analysis and processing of a liquid sample and a manufacturing method thereof.
  • microanalysis systems have been used in the scientific field or medical field such as biochemistry and analytical chemistry in order to perform analysis of trace amounts of substances such as proteins and nucleic acids (for example, DNA) with high accuracy and high speed.
  • a micro-channel chip having a structure in which two resin substrates are bonded together with an adhesive has been proposed as a micro-channel chip (fluid handling device) used in a micro-analysis system (see, for example, Patent Document 1).
  • a first resin substrate having a groove formed on one surface, a second resin substrate disposed on a surface of the first resin substrate on which a groove is formed, a first resin substrate, A microchannel chip having an adhesive layer that bonds two resin substrates is disclosed.
  • acrylic resin substrates having the same thickness are used as the first resin substrate and the second resin substrate.
  • acrylic resin substrates having the same thickness are used as the first resin substrate and the second resin substrate. From the viewpoint of improving the productivity and reducing the manufacturing cost, It is conceivable to use a resin film (acrylic resin film) as the two-resin substrate.
  • the acrylic resin film has a problem that defects such as scratches and fish eyes (lumps) are likely to occur.
  • this inventor examined using PET film which consists of a polyethylene terephthalate (PET) of good quality and cheap instead of an acrylic resin film.
  • PET film which consists of a polyethylene terephthalate (PET) of good quality and cheap instead of an acrylic resin film.
  • PET film which consists of a polyethylene terephthalate (PET) of good quality and cheap instead of an acrylic resin film.
  • PET film polyethylene terephthalate
  • An object of the present invention is to provide a method of manufacturing a fluid handling device capable of firmly bonding a PET film to a resin substrate without causing an adhesive to enter the flow path, and a fluid handling device obtained thereby. It is to be.
  • the fluid handling device of the present invention includes a resin substrate having a groove formed on one surface thereof, a polyethylene terephthalate film disposed on the one surface of the resin substrate and covering an opening of the groove, and the resin substrate.
  • the glass transition temperature of the resin substrate is Tg A
  • the melting point of the polyethylene terephthalate film is Tm B
  • the glass transition temperature of the adhesive layer is Tg C
  • the adhesion temperature is Tp.
  • the method of manufacturing a fluid handling device of the present invention includes a step of preparing a resin substrate having a groove formed on one surface, and a polyethylene terephthalate in which an adhesive layer containing an acrylic resin component and a urethane resin component is disposed on one surface
  • a step of preparing a film a step of disposing the polyethylene terephthalate film on the one surface of the resin substrate such that the adhesive layer is positioned between the resin substrate and the polyethylene terephthalate film, Heating the adhesive layer at a predetermined bonding temperature to bond the resin substrate and the polyethylene terephthalate film, the glass transition temperature of the resin substrate is Tg A, and the melting point of the polyethylene terephthalate film was a Tm B, the glass transition temperature of the adhesive layer and Tg C, the bonding temperature T When a, Tg C ⁇ Tp ⁇ Tg A ⁇ Tm B, meet, a configuration.
  • the present invention it is possible to provide a fluid handling apparatus in which the adhesive strength of the PET film to the resin substrate is sufficiently high while controlling the flow path shape with high accuracy.
  • FIG. 1A is a plan view of the microchannel chip of the embodiment.
  • 1B is a cross-sectional view taken along line AA shown in FIG. 1A.
  • FIG. 1C is a bottom view of the microchannel chip according to the embodiment.
  • FIG. 2A is a plan view of the resin substrate.
  • FIG. 2B is a bottom view of the resin substrate.
  • 3A and 3B are cross-sectional views showing the manufacturing process of the microchannel chip.
  • microchannel chip will be described as a representative example of the fluid handling apparatus of the present invention.
  • FIG. 1 is a diagram showing a configuration of a microchannel chip 100 according to an embodiment of the present invention.
  • FIG. 1A is a plan view of the microchannel chip 100.
  • 1B is a cross-sectional view taken along line AA shown in FIG. 1A.
  • FIG. 1C is a bottom view of the microchannel chip 100.
  • the microchannel chip 100 includes a resin substrate 120, a polyethylene terephthalate (PET) film 140, and an adhesive layer 160.
  • the microchannel chip 100 is manufactured by thermocompression bonding in a state where the resin substrate 120, the adhesive layer 160, and the PET film 140 are sequentially laminated.
  • FIG. 2A is a plan view of the resin substrate 120.
  • FIG. 2B is a bottom view of the resin substrate 120.
  • the resin substrate 120 is a transparent, substantially rectangular substrate, and includes two through holes and a groove 129 that connects these through holes.
  • the two through holes (the first through hole 121 and the second through hole 122) have a bottomed concave portion (the first concave portion 125 and the second concave portion 126) by closing one opening portion with the PET film 140.
  • the groove 129 is formed on one surface of the resin substrate 120 and communicates the first through hole 121 and the second through hole 122.
  • the opening of the groove 129 is blocked by the PET film 140, thereby forming a flow path 130 that communicates the first recess 125 and the second recess 126.
  • the thickness of the resin substrate 120 is not particularly limited, but is, for example, 1 to 10 mm.
  • shape of each through-hole is not specifically limited, For example, it is a substantially cylindrical shape.
  • diameter of each through-hole is not specifically limited, For example, it is about 2 mm.
  • the cross-sectional shape of the groove 129 is not particularly limited, but is substantially rectangular, for example.
  • the size of the groove 129 is not particularly limited. For example, the width is about 40 ⁇ m and the depth is about 25 ⁇ m.
  • the type of resin constituting the resin substrate 120 is such that the glass transition temperature (Tg A ) of the resin substrate 120 is higher than the bonding temperature (Tp) at the time of thermocompression bonding described later, and the melting point (Tm B ; 200 ° C.) of the PET film 140. If it is lower, it is not particularly limited. That is, the kind of resin constituting the resin substrate 120 only needs to satisfy the formula of Tp ⁇ Tg A ⁇ Tm B.
  • Tp the adhesion temperature
  • Examples of the type of resin constituting the resin substrate 120 include polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET), and the like.
  • the glass transition temperature (Tg A ) of PMMA used in this embodiment is about 97 ° C.
  • the glass transition temperature (Tg A ) of general PC is about 135 ° C.
  • the glass transition temperature of PET ( Tg A ) is about 70 ° C.
  • the PET film 140 is a transparent substantially rectangular PET resin film disposed on one surface of the resin substrate 120.
  • the PET film 140 is bonded to the surface of the resin substrate 120 where the groove 129 is formed via the adhesive layer 160 and covers the opening of the groove 129.
  • PET is optimal as a material for the film of the microchannel chip 100 from the viewpoint of quality and price.
  • the thickness of the PET film 140 is not particularly limited, but is about 100 ⁇ m, for example.
  • typical glass transition temperature of the resin (PET) constituting the PET film 140 (Tg B) is about 70 ° C.
  • a melting point (Tm B) is about 200 ° C..
  • the adhesive layer 160 is disposed between the resin substrate 120 and the PET film 140, and adheres the resin substrate 120 and the PET film 140 by being heated at a predetermined bonding temperature (Tp). Specifically, the adhesive layer 160 bonds the surface of the resin substrate 120 on which the groove 129 is formed (excluding the opening of the groove 129) and the PET film 140 without a gap. From the viewpoint of improving the adhesion between the resin substrate 120 and the PET film 140, the adhesive layer 160 needs to contain an acrylic resin component and a urethane resin component.
  • the bonding temperature (Tp) needs to be determined in consideration of the glass transition temperature (Tg C ) of the resin constituting the adhesive layer 160.
  • Tg C glass transition temperature of the resin constituting the adhesive layer 160
  • the glass transition temperature (Tg C ) of the resin constituting the adhesive layer 160 is 40 to 50 ° C.
  • the glass transition temperature (Tg C ) of the adhesive layer 160 can be adjusted by adding resin components having different glass transition temperatures and mixing two or more types of resin monomers having different glass transition temperatures. Then, it is possible to control by using a copolymer obtained by polymerization and adjusting the distribution ratio of the monomers as a material for the adhesive layer 160.
  • the thickness of the adhesive layer 160 is not particularly limited, but is preferably about 3 to 4 ⁇ m. When the thickness of the adhesive layer 160 is less than 3 ⁇ m, the resin substrate 120 and the PET film 140 cannot be sufficiently bonded, and the PET film 140 is easily peeled from the resin substrate 120. On the other hand, when the adhesive layer 160 exceeds 4 ⁇ m, the adhesive layer 160 may enter the flow path 130 during thermocompression bonding.
  • the adhesive layer 160 may have an acrylic resin component and a urethane resin component as a block copolymer.
  • the adhesive layer 160 may be a mixture of an acrylic resin and a urethane resin. Furthermore, a mixture of acrylic resin and urethane resin and a block copolymer may be mixed.
  • the acrylic resin component and the urethane resin component contained in the adhesive layer 160 have complementary functions, the adhesive layer 160 having both the light resistance of the acrylic resin and the chemical resistance of the urethane resin can be formed.
  • the microchannel chip 100 is manufactured by heating the adhesive layer 160 at a predetermined bonding temperature (Tp) in a state where the resin substrate 120, the adhesive layer 160, and the PET film 140 are laminated in this order. Is done.
  • the bonding temperature (Tp) for heating the adhesive layer 160 is higher than the glass transition temperature (Tg C ) of the adhesive layer 160, the glass transition temperature (Tg A ; 97 ° C.) of the resin substrate 120, and the PET film 140.
  • Tm B melting point of not particularly limited. That is, the bonding temperature may satisfy Tg C ⁇ Tp ⁇ Tg A ⁇ Tm B.
  • the bonding temperature (Tp) is higher than the glass transition temperature (Tg A ) of the resin substrate 120, the resin substrate 120 is softened during thermocompression bonding.
  • the bonding temperature (Tp) is about 90 ° C.
  • tip 100 of this invention is not specifically limited, For example, it can manufacture with the following method.
  • 3A and 3B are cross-sectional views showing the manufacturing process of the microchannel chip 100.
  • the microchannel chip 100 of the present invention includes 1) a first step of preparing a resin substrate 120, 2) a second step of preparing a PET film 140 on which an adhesive layer 160 is disposed, and 3) a resin substrate. 120 and a third step of laminating the PET film 140 on which the adhesive layer 160 is disposed, and 4) a fourth step of adhering the resin substrate 120 and the PET film 140 to each other.
  • FIG. 3A is a diagram showing a first step and a second step.
  • a resin substrate 120 is prepared.
  • a resin substrate 120 made of PMMA having two through holes and a groove 129 connecting these through holes is manufactured by injection molding.
  • a PET film 140 is prepared in which an adhesive layer 160 containing an acrylic resin component and a urethane resin component is disposed on one surface.
  • the PET film 140 may be manufactured by a melt extrusion method, a solution casting method, a calendar method, or the like, or a commercially available film may be used.
  • the method for disposing the adhesive layer 160 on the PET film 140 is not particularly limited.
  • a resin composition containing an acrylic resin component and a urethane resin component may be applied to the surface of the PET film 140 (application method), or a resin film containing an acrylic resin component and a urethane resin component may be applied to the surface of the PET film 140.
  • Lamination may be performed (lamination method).
  • the adhesive layer 160 is adjusted so that the glass transition temperature is 40 to 50 ° C.
  • FIG. 3B is a diagram showing the third step and the fourth step.
  • the PET film 140 is disposed on one surface of the resin substrate 120 so that the adhesive layer 160 is positioned between the resin substrate 120 and the PET film 140.
  • a PET film 140 in which the adhesive layer 160 faces downward is laminated on the resin substrate 120 with the surface on which the groove 129 is formed facing upward.
  • the adhesive layer 160 is heated at a predetermined bonding temperature to bond the resin substrate 120 and the PET film 140.
  • a predetermined bonding temperature For example, in a state where the adhesive layer is softened by thermocompression bonding, the PET film 140 is bonded to the resin substrate 120 to form the microchannel chip 100.
  • the thermocompression bonding is preferably performed at a temperature of about 90 ° C. for 10 seconds or more. If the time for thermocompression bonding is less than 10 seconds, the resin substrate 120 and the PET film 140 may not be sufficiently bonded.
  • the adhesive layer 160 and the PET film 140 are softened.
  • the bonding temperature is a temperature at which the adhesive layer 160 is sufficiently softened and the PET film 140 follows the surface shape of the resin substrate 120.
  • the manufacturing method of the microchannel chip 100 of the present invention includes 1) satisfying Tg C ⁇ Tp ⁇ Tg A ⁇ Tm B , and 2) the adhesive layer 160 containing the acrylic resin component and the urethane resin component. Including. Thereby, the PET film 140 can be firmly bonded to the resin substrate 120 without causing the adhesive to enter the flow path.
  • the microchannel chip 100 of the present invention manufactured as described above has high accuracy and high strength, the sample does not leak from the channel 130, and the sample can be analyzed with high accuracy.
  • the resin substrate shown in FIG. 2 was produced by injection molding using polymethyl methacrylate (PMMA) as a material.
  • the diameter of the through hole is 2 mm.
  • the width of the groove is 40 ⁇ m, and the depth of the groove is 25 ⁇ m.
  • a PET film (thickness: 100 ⁇ m) on which an adhesive layer containing a resin shown in Table 1 was formed was prepared.
  • the PET film was laminated on the resin substrate so that the surface on which the groove of the resin substrate was formed and the surface on which the adhesive layer was disposed were opposed to each other.
  • a microchannel chip was manufactured by thermocompression bonding at 90 ° C. for 10 seconds to adhere the PET film to the resin substrate.
  • the glass transition temperature (Tg A ) of the resin substrate (PMMA) is 97 ° C.
  • the melting point (Tm B ) of the PET film is 200 ° C.
  • the glass transition temperature (Tg C ) of the adhesive layer is 40 to 50 ° C.
  • the bonding temperature (Tp) during thermocompression bonding is 90 ° C. Therefore, even when any of the above adhesive layers is formed, Tg C ⁇ Tp ⁇ Tg A ⁇ Tm B is satisfied.
  • microchannel chip For each microchannel chip, the adhesive strength of the PET film to the resin substrate and the channel shape were evaluated.
  • Results Table 2 shows the evaluation results of the adhesive strength and the channel shape for each microchannel chip.
  • the microchannel chip of the present invention is excellent in the adhesive strength between the resin substrate and the PET film and the accuracy of the channel shape.
  • microchannel chip of the present invention is useful as a microchannel chip used in, for example, the scientific field and the medical field.

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  • Lining Or Joining Of Plastics Or The Like (AREA)
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Abstract

Un substrat (120) de résine, pourvu d'une rainure (129) sur une surface et d'un film (140) en PET sur une surface, est fourni. Le film (140) en PET est pourvu d'une couche adhésive (160), qui contient un composant de résine (méth) acrylique et un composant de résine d'uréthane. Le film (140) en PET est agencé sur une surface du substrat (120) de résine, de telle sorte que la couche adhésive (160) est positionnée entre le substrat (120) de résine et le film (140) en PET. Le substrat de résine (120) et le film (140) en PET sont collés l'un à l'autre en chauffant la couche adhésive (160) à une température de liaison prédéterminée. À ce moment, la température de transition vitreuse (TgA) du substrat (120) de résine, le point de fusion (TmB) du film (140) de PET, la température de transition vitreuse (TgC) de la couche adhésive (160) et la température (Tp) de liaison satisfont TgC<Tp<TgA<TmB.
PCT/JP2013/000420 2012-02-10 2013-01-28 Appareil de manipulation de fluides et son procédé de fabrication WO2013118447A1 (fr)

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JP7216365B2 (ja) * 2018-10-01 2023-02-01 旭化成株式会社 マイクロ流路用感光性樹脂積層体
JP2021121414A (ja) * 2020-01-31 2021-08-26 住友ベークライト株式会社 マイクロ流路チップ

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