WO2009154323A1 - Évaporateur pour système de caloduc en boucle - Google Patents

Évaporateur pour système de caloduc en boucle Download PDF

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Publication number
WO2009154323A1
WO2009154323A1 PCT/KR2008/004493 KR2008004493W WO2009154323A1 WO 2009154323 A1 WO2009154323 A1 WO 2009154323A1 KR 2008004493 W KR2008004493 W KR 2008004493W WO 2009154323 A1 WO2009154323 A1 WO 2009154323A1
Authority
WO
WIPO (PCT)
Prior art keywords
evaporator
heating plate
grooves
sintered wick
vapor
Prior art date
Application number
PCT/KR2008/004493
Other languages
English (en)
Inventor
Chul-Ju Kim
Min-Whan Seo
Byung-Ho Sung
Jung-Hyun Yoo
Jee-Hoon Choi
Jae-Hyung Ki
Original Assignee
Zalman Tech Co., Ltd.
Sungkyunkwan University Foundation For Corporate Collaboration
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zalman Tech Co., Ltd., Sungkyunkwan University Foundation For Corporate Collaboration filed Critical Zalman Tech Co., Ltd.
Priority to US12/546,331 priority Critical patent/US20090314472A1/en
Publication of WO2009154323A1 publication Critical patent/WO2009154323A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/006—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of flat products, e.g. sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an evaporator for a loop heat pipe system including a condenser, a vapor transport line, and a liquid transport line, and more particularly, to an evaporator having an increased contact area between a sintered wick and a heating plate.
  • Electronic parts such as CPUs or semiconductor chips used for various electronic devices such as computers generate a large amount of heat during operation.
  • Such electronic devices are usually designed to operate at room temperature. Accordingly, when heat generated during the operation of an electronic device is not effectively cooled down, the performance of the electronic device is severely deteriorated and, in some cases, the electronic device itself may be damaged.
  • a heat conduction method using a heat sink In order to cool down heat generated by various electronic parts, many approaches have been developed, such as a heat conduction method using a heat sink, a method of using natural convection or radiation of air, a force convection method using a fan, a method using circulation of liquid, or a submerged cooling method.
  • thermosyphon system and a cylindrical heat pipe system are examples of the phase change heat transport system.
  • cooling is achieved using a natural circulation method via a liquid-vapor phase change and a specific gravity difference of working fluid.
  • cooling is obtained by circulating the working fluid using a capillary pumping force generated by a sintered wick installed in an inner surface of a pipe.
  • the working fluid included in the sintered wick 102 is evaporated and moved in a direction indicated by a plurality of arrows 103 as a flow of vapor.
  • the operating fluid is changed back to a liquid state and moved along the sintered wick 102 in a direction indicated by a plurality of arrows 105, thereby circulating in the heat pipe 100.
  • thermosyphon system requires a condensing portion located higher than an evaporating portion and, although this problem is less severe in the case of the heat pipe 100, a heat transport ability of the heat pipe 100 is quite deteriorated when a condensing portion is located lower than the evaporating portion. Accordingly, this limitation prevents electronic devices employing the above cooling systems from being made slim.
  • the vapor and the liquid may be mixed in the middle of the pipe. Another problem is that the mixture may make the amount of heat actually transported less than that that can be ideally transported.
  • LHP loop heat pipe
  • CLP capillary pumped loop heat pipe
  • FIG. 2 illustrates a loop heat pipe system 110 according to this conventional technology.
  • the conventional loop heat pipe system 110 includes a condenser 112, an evaporator 114, and a vapor line 116 and a liquid line 118, which form a loop.
  • the vapor line 116 and the liquid line 118 are connected between the condenser 112 and the evaporator 114.
  • a sintered wick 120 is installed only in the evaporator 114 unlike the conventional linear heat pipe of FIG. 1.
  • loop heat pipe is referred to as a loop heat pipe system and both terms have the same meaning.
  • evaporator and the condenser respectively, have the same meanings as the evaporator section and the condenser section.
  • the loop heat pipe system 1 10 operates in the following manner. Heat is applied to a heating plate 122 which is the bottom portion of the evaporator 114 which is inserted with the sintered wick 120. At that point the sintered wick 120 is saturated with the liquid phase of working fluid due because the heat transported to the sintered wick 120 contacting the heat plate 122. And the applied heat vaporizes the working fluid so that the phase of the working fluid is changed to a vapor state. The vapor is moved toward the condenser 1 12 along the vapor line 116 connected to a side of the evaporator 114. As the vapor passes through the condenser 112, heat is dissipated externally so that the vapor is liquefied. The liquefied working fluid is moved toward the evaporator 114 along the liquid line 1 18 at a side of the condenser 112. The above-described process is repeated so that the heat source can be cooled down.
  • a surface 126 of the sintered wick 120 facing the heating plate 122 includes a contact surface 126b contacting the heating plate 122 and a plurality of micro-channels 126a working as a passage of the generated vapor. Accordingly, the sintered wick 120 receives heat via the contact surface 126b contacting the heating plate 120 so that the received heat makes the operating fluid permeated in the sintered wick 120 evaporate.
  • the generated vapor is moved toward the condenser 112 along the vapor line 116 connected to a side of the evaporator section 114 through the micro-channels 126a formed in the surface 126 facing the sintered wick 120.
  • the performance of an evaporator taking heat from a heat source like an electronic part is determined according to how well the heat transported from the heat source to a heating plate is transported to a sintered wick. In this connection, contact conductance is a factor directly affecting the heat transport between the heat source and the heating plate.
  • the contact conductance is related to the thermal resistance generated when a metal has a surface contact with another metal and heat transport occurs between the metals.
  • the contact conductance is proportional to the contact area between the two metals. That is, as the contact area increases, the contact conductance increases, and as the contact conductance increases, heat transport is generated further.
  • the contact conductance is relatively small. That is, referring to FIG. 5 showing the sintered wick 120 having the micro-channels 126a coupled to the heating plate 122 in a direction rotated by 90° from the direction of the cross-section of FIG. 3, the contact surface 126b of the sintered wick 120 contacting the heating plate 122 is decreased due to the micro-channels 126a so that the amount of heat to be transported is reduced accordingly.
  • the present invention provides an evaporator for a loop heat pipe system, the evaporator having increased contact conductance by increasing a contact area between a metal sintered wick and a heating plate.
  • an evaporator for a loop heat pipe system includes an evaporator section having a sintered wick formed by sintering a metal powder, in which a working fluid permeating through a plurality of pores in the sintered wick is heated so that the phase of the working fluid is changed to a vapor state, a condenser section in which the phase of the working fluid transported from the evaporator section is changed from a vapor state to a liquid state, a vapor transport line connecting between the evaporator section and the condenser section to transport the working fluid, whose phase is changed to a vapor state by the evaporator section, to the condenser section, and a liquid transport line connecting between the condenser section and the evaporator section to transport the working fluid, whose phase is changed to a liquid state by the condenser section, to the evaporator section,
  • the part of the sintered wick inserted in each of the grooves may be an insertion portion, both side surfaces of the insertion portion contact the two side surfaces of each of the grooves, and a lower surface of the insertion portion is any one of a downwardly bulging shape, an inwardly depressed shape, and a flat shape.
  • the heating plate may include a lower plate portion having a circular disc shape and a wall portion extending from a circumferential portion of the lower plate portion, the sintered wick may be coupled to an inner surface having an upper surface of the lower plate portion and an inner surface of the wall portion of the heating plate, and a cover member is provided in an upper portion of the wall portion of the heating plate and the liquid transportation line is coupled to the cover member.
  • FIG. 1 illustrates the operation of a conventional cylindrical heat pipe
  • FIG. 2 illustrates the concept of a conventional loop heat pipe
  • FIG. 3 is a cross-sectional view of a conventional evaporator of FIG. 2;
  • FIG. 4 is a perspective view of the sintered wick of FIG. 3 rotated by 180°;
  • FIG. 5 is a cross-sectional view of a portion of the sintered wick and the heating plate of the conventional evaporator of FIG. 2;
  • FIG. 6 is a perspective view of a loop heat pipe system including an evaporator according to an embodiment of the present invention;
  • FIG. 7 is a cross-sectional view of the evaporator of FIG. 6;
  • FIGS. 8, 9, and 10 are cross-sectional views of the sintered wicks of FIG. 7 according to embodiments of the present invention.
  • FIG. 11 is a cross-sectional view illustrating a state in which the sintered wick and the heating plate are coupled to each other.
  • FIG. 12 is a perspective view of the heating plate where a groove is formed.
  • the present invention is related to an evaporator for a loop heat pipe system including a condenser, a vapor transportation line, and a liquid transportation line.
  • FIG. 6 illustrates the structure of a loop heat pipe system according to an embodiment of the present invention.
  • the loop heat pipe system includes an evaporator 1 , a condenser 210, a vapor transport line 220, and a liquid transport line 230.
  • the condenser 210 changes the phase of a working fluid in a vapor state received from the evaporator 1 to a liquid state.
  • the condenser 210 takes heat from the working fluid and exhausts the heat to the outside air.
  • the vapor transport line 220 is a pipe member connecting the evaporator 1 and the condenser 210 to supply the vapor whose phase is changed by the evaporator 1 back to the condenser 210.
  • the liquid transport line 230 is a pipe member connecting the condenser 210 and the evaporator 1 to supply the liquid whose phase is changed by the condenser 210 back to the evaporator 1.
  • the general operations of the condenser 210, the vapor transport line 220, and the liquid transport line 230 are the same as those described in the background section.
  • the evaporator 1 which is the subject matter of the present invention, is one of the constituent elements of the loop heat pipe system, together with the condenser 210, the liquid transport line 220, and the vapor transport line 230.
  • FIG. 7 is a cross-sectional view of the evaporator 1 of FIG. 6.
  • the evaporator 1 includes a sintered wick 20 that is formed by sintering metal powders. When the working fluid permeating through pores formed inside the sintered wick 20 is heated, the phase of the working fluid is changed to a vapor state.
  • the evaporator 1 includes a heating plate 10, the sintered wick 20, and a plurality of grooves 30.
  • the heating plate 10 is formed of metal and receives heat from a heat source such as electronic parts that generate heat during operation.
  • the heating plate 10 includes a lower plate portion 12 and a side wall portion 14.
  • the lower plate portion 12 has a disc shape.
  • the side wall portion 14 extends upwardly from the circumferential portion of the lower plate portion 12.
  • the lower plate portion 12 and the side wall portion 14 may be integrally formed or coupled together after being manufactured separately.
  • the lower surface of the lower plate portion 12 contacts the heat source and receives heat from the heat source.
  • the heat transported to the lower plate portion 12 is transported to the side wall portion 14 connected to the lower plate portion 12 by conduction.
  • a cover member 16 is provided at an upper end portion of the side wall portion 14 of the heating plate 10.
  • the liquid transport line 230 is connected to the cover member 16 so that the working fluid in a liquid state transported from the condenser 210 flows into an inner space of the evaporator 1.
  • An inlet 17 to which the liquid transport line 230 is connected is formed in the cover member 16 of the evaporator 1 so that the working fluid can flow into the evaporator 1.
  • An outlet 18 to which the vapor transport line 220 is connected is formed in the heating plate 10 so that a vapor can be exhausted.
  • the lower plate portion 12 of the heating plate 10 has a disc shape and the side wall portion 14 has a shape encompassing the lower plate portion 12.
  • the cover member 16 has a disc shape and is provided on top of the heating plate 10.
  • the evaporator 1 has a hollow cylindrical shape.
  • the present invention is not limited to the above descriptions and, for example, the lower plate portion may have a polygonal plate shape such as a rectangle.
  • the sintered wick 20 is coupled to the upper surface of the lower plate portion 12 to receive heat therefrom.
  • the working fluid in a liquid state included in the pores of the sintered wick 20 is evaporated into a vapor state by the received heat.
  • the sintered wick 20 is formed by sintering a metal powder. A large number of spaces or pores are formed in the sintered wick 20 so that the working fluid in the liquid state can permeate in the sintered wick 20.
  • the groves 30 are formed in a surface where the heating plate 10 and the sintered wick 20 contact each other and work as a passage for a vapor in the sintered wick 20 whose phase is changed to exhaust vapor through the vapor transport line 220 via the outlet 18. Thus, since the groves 30 are connected to the outlet 18, the vapor can be exhausted from the evaporator 1 through the vapor transport line 220.
  • the grooves 30 linearly formed in the upper surface of the lower plate portion 12 are separated from one another and parallel to one another. Each space (not shown) is circumferentially formed at both end portions of each of the grooves 30. Also, the grooves 30 are circumferentially formed in the side wall portion 14. Each space penetrating the grooves 30 and connected to the outlet 18 is formed in the side wall portion 14. Accordingly, the vapor generated in the grooves 30 formed in the lower plate portion 12 of the heating plate 10 flows toward the space formed in the circumferential portion of the lower plate portion 12 and then is exhausted via the outlet 18 toward the vapor transport line 220. Also, the vapor generated in the grooves 30 formed in the side wall portion 14 of the heating plate 10 flows toward the space penetrating the grooves 30 and the resultant vapor then travels via the outlet 18 toward the vapor transport line 220.
  • Each of the grooves 30 has a bottom surface 32 and side surfaces 34 and is formed on a side surface of the heating plate 10.
  • the term "a surface" of the heating plate 10 has the same meaning as an "inner side surface” and indicates the upper surface of the lower plate portion 12 and an inner surface of the side wall portion 14. Accordingly, the grooves 30 are formed in the inner side surface, or the side surface, that is, in the upper surface of the lower plate portion 12 and the inner surface of the side wall portion 14 of the heating plate 10.
  • the sintered wick 20 is coupled to the inner side surface of the heating plate 10 to receive heat.
  • the sintered wick 20 is partially inserted into each of the grooves 30 so as to contact at least part of both side surfaces 24 of each of the grooves 30.
  • the part of the sintered wick 20 inserted in each of the grooves 30 is referred to as an insertion portion 22.
  • Both side surfaces 24 of the insertion portion 22 contact the upper portions of the side surfaces 34 of the grooves 30.
  • the insertion portion 22 is inserted in each of the grooves 30 to a depth of about 1/3 of the height of each of the grooves 30.
  • a lower surface 26 of the insertion portion 22 has a flat shape.
  • An insertion length t of a portion of the insertion portion 22 inserted into each of the grooves 30 is defined as a length of both side surfaces of the insertion portion 22 coupled to both side surfaces of each of the grooves 30 assuming that both side surfaces of the insertion portion 22 are symmetrical.
  • the insertion length t of the insertion portion 22 and the shape of the lower surface 26 may be interdependently changed considering factors such as a contact area between the heating plate 10 and the sintered wick 20, a need for the space in the grooves 30 as the passage of the vapor, the size of a surface area where the working fluid can be evaporated. That is, the length t of the insertion portion 22 may be determined as a predetermined value considering the above factors. For example, referring to FIG. 8, a lower surface 26a of an insertion portion 22a downwardly bulges in interrelation with a change in the insertion length t. Referring to FIG. 8, a lower surface 26b of an insertion portion 22b is inwardly depressed. Also, referring to FIG.
  • the insertion length t of an insertion portion 22c of the sintered wick 20 with respect to the side surfaces 34 of the grooves 30 is almost equal to the height of each of the grooves 30 and a lower surface 26c of the insertion portion 22c is inwardly depressed.
  • the shape of the lower surface 26c of the insertion portion 22c can maximize the contact area between both side surfaces 24 of the sintered wick 20 and both side surfaces 34 of the grooves 30 of the heating plate 10 and simultaneously enables the grooves 30 to work as a vapor passage, and also facilitates securing a sufficient area of the lower surface 26c.
  • FIG. 11 is a cross-sectional view illustrating a state in which a sintered wick 2Od and the heating plate 10 are coupled to each other.
  • FIG. 12 is a perspective view of the heating plate 10 where a plurality of grooves 3Od are formed.
  • the sintered wick 2Od and the heating plate 10 are not circular but rectangular for the convenience of calculation, an n-number of grooves, where n is an integer, each having the same length, are formed in the heating plate 10, and the lower surface of an insertion portion is flat. Accordingly, since the shapes of the sintered wick 2Od and the grooves 3Od are different from those shown in FIG. 7, a suffix "d" is added to reference numbers for the sintered wick 2Od and the grooves 3Od.
  • A' contact area r w : insertion length ratio
  • the size and number of the grooves 3Od are determined according to the specification of a system.
  • the contact area is increased.
  • the contact length ratio r w is 0.5
  • the contact area ratio is increased to 0.7-0.83.
  • a method of coupling the sinters wick 20 to a side surface of the heating plate 10 may be a sintering method of sintering metal powder to form the sintered wick 20 and simultaneously coupling the sintered wick 20 to the heating plate 10 and a coupling method of forming the sintered wick 20 and then coupling the sintered wick 20 to the heating plate 10 where the grooves 30 are formed.
  • the coupling method includes a simple pressing coupling method and a metal coupling method.
  • a plurality of grooves are formed in a metal heating plate and the grooves are filled with a sublimate solid material considering the insertion length of an insertion portion and the shape of a lower surface of a sintered wick. That is, in FIG. 7-9, a portion of each of the grooves, corresponding to an empty space, is filled with the sublimate solid material considering the insertion portion inserted in each of the groves. Then, a jig above the sintered plate is arranged to be separated from one another by the thickness of the sintered wick. The heating plate and the jig are packed with metal powder and heated at a predetermined temperature for a period of time according to the type of the metal powder to be sintered.
  • the metal powder As the metal powder is sintered, the metal powder is coupled to the heating plate. Also, simultaneously with the sintering of the metal powder, the sublimate solid material filling the grooves is sublimated and exhausted from the sublimate solid material. Accordingly, with an empty space having a desired shape, the insertion portion of the sintered wick inserted in each of the grooves is formed into a desired shape.
  • a previously manufactured metal sintered wick is prepared to contact the heating plate and then a predetermined load is applied to the sintered wick to be coupled to the heating plate.
  • a previously manufactured metal sintered wick is prepared to contact the heating plate and heated to be sintered again (or secondly sintering) so that the sintered wick is coupled to the heating plate. Any one of the above-described methods may be appropriately selected as a method of coupling the sintered wick 20 to the side surface of the heating plate 10.
  • the contact area between the heating plate and the sintered wick is increased compared to the conventional technology, a contact conductance increases. That is, in the conventional technology, the heating plate and the sintered wick contact each other except for a surface corresponding to the width of each of the grooves functioning as a passage for vapor. In the evaporator of the present invention, since a portion of the sintered wick is inserted in each of the grooves and contacts both side surfaces of each groove, the contact area between the heating plate and the sintered wick increases.
  • the shape of the lower surface of the insertion portion of the sintered wick inserted in each of the grooves can be variously formed, in a state in which the contact area between the heating plate and the sintered wick is increased, a sectional area of the vapor passage and a evaporation surface area can be additionally adjusted so that optimal efficiency suitable for the environment can be obtained.
  • the simultaneous sintering method since a manufacturing process is simple, a cost for manufacturing an evaporator is low. In particular, since the coupling between the sintered wick and the heating plate is performed simultaneously with sintering, a contact state is improved so that contact conductance is increased. Also, by controlling a state of a sublimate material filling the grooves, the insertion portion of the sintered wick can be formed in any shape.
  • the coupling state between the sintered wick and the metal heating plate is slightly deteriorated.
  • the side surface of the insertion portion is coupled to the side surface of each of the grooves, compared to the conventional technology, the contact area between the sintered wick and the heating plate can be increased. Also, the insertion portion of the sintered wick can be mechanically processed into a desired shape.
  • the contact conductance is increased.

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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Life Sciences & Earth Sciences (AREA)
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  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)

Abstract

L'invention porte sur un évaporateur pour un système de caloduc en boucle comprenant un condenseur, une conduite de transport de vapeur et une conduite de transport de liquide, et, plus particulièrement, sur un évaporateur ayant une surface de contact accrue entre une mèche frittée et une plaque chauffante.
PCT/KR2008/004493 2008-06-18 2008-08-01 Évaporateur pour système de caloduc en boucle WO2009154323A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/546,331 US20090314472A1 (en) 2008-06-18 2009-08-24 Evaporator For Loop Heat Pipe System

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0057458 2008-06-18
KR1020080057458A KR20090131533A (ko) 2008-06-18 2008-06-18 루프 히트파이프 시스템용 증발기

Related Child Applications (1)

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US12/546,331 Continuation US20090314472A1 (en) 2008-06-18 2009-08-24 Evaporator For Loop Heat Pipe System

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WO2009154323A1 true WO2009154323A1 (fr) 2009-12-23

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KR (1) KR20090131533A (fr)
TW (1) TW201003023A (fr)
WO (1) WO2009154323A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007247930A (ja) * 2006-03-14 2007-09-27 Fujikura Ltd 蒸発器及びこの蒸発器を使用したループ型ヒートパイプ
JP2007247931A (ja) * 2006-03-14 2007-09-27 Fujikura Ltd 蒸発器及びこの蒸発器を使用したループ型ヒートパイプ
JP2014052109A (ja) * 2012-09-06 2014-03-20 Hosei Nagano 熱交換器および電子機器
WO2015014926A1 (fr) * 2013-08-01 2015-02-05 Euro Heat Pipes Evaporateur à dispositif anti-retour pour boucle diphasique
JP2016156534A (ja) * 2015-02-24 2016-09-01 株式会社フジクラ ループヒートパイプ用蒸発器
JP2021099169A (ja) * 2019-12-20 2021-07-01 国立大学法人東海国立大学機構 装置、熱交換器、および蒸発器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5541361A (en) * 1978-09-20 1980-03-24 Babcock Hitachi Kk Heat pipe
JPS5546331A (en) * 1978-09-25 1980-04-01 Borukano Kk Heat pipe
JPS5816187A (ja) * 1981-07-22 1983-01-29 Hitachi Ltd 熱伝達装置
US4616699A (en) * 1984-01-05 1986-10-14 Mcdonnell Douglas Corporation Wick-fin heat pipe

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5541361A (en) * 1978-09-20 1980-03-24 Babcock Hitachi Kk Heat pipe
JPS5546331A (en) * 1978-09-25 1980-04-01 Borukano Kk Heat pipe
JPS5816187A (ja) * 1981-07-22 1983-01-29 Hitachi Ltd 熱伝達装置
US4616699A (en) * 1984-01-05 1986-10-14 Mcdonnell Douglas Corporation Wick-fin heat pipe

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007247930A (ja) * 2006-03-14 2007-09-27 Fujikura Ltd 蒸発器及びこの蒸発器を使用したループ型ヒートパイプ
JP2007247931A (ja) * 2006-03-14 2007-09-27 Fujikura Ltd 蒸発器及びこの蒸発器を使用したループ型ヒートパイプ
JP2014052109A (ja) * 2012-09-06 2014-03-20 Hosei Nagano 熱交換器および電子機器
WO2015014926A1 (fr) * 2013-08-01 2015-02-05 Euro Heat Pipes Evaporateur à dispositif anti-retour pour boucle diphasique
FR3009377A1 (fr) * 2013-08-01 2015-02-06 Euro Heat Pipes Evaporateur a dispositif anti-retour pour boucle diphasique
JP2016156534A (ja) * 2015-02-24 2016-09-01 株式会社フジクラ ループヒートパイプ用蒸発器
JP2021099169A (ja) * 2019-12-20 2021-07-01 国立大学法人東海国立大学機構 装置、熱交換器、および蒸発器

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KR20090131533A (ko) 2009-12-29

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