WO2009154013A1 - マザー基板からの単位表示パネルの取り出し方法 - Google Patents

マザー基板からの単位表示パネルの取り出し方法 Download PDF

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Publication number
WO2009154013A1
WO2009154013A1 PCT/JP2009/052329 JP2009052329W WO2009154013A1 WO 2009154013 A1 WO2009154013 A1 WO 2009154013A1 JP 2009052329 W JP2009052329 W JP 2009052329W WO 2009154013 A1 WO2009154013 A1 WO 2009154013A1
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WO
WIPO (PCT)
Prior art keywords
substrate
unit display
display panel
terminal
cut surface
Prior art date
Application number
PCT/JP2009/052329
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
生芳 ▲高▼松
和哉 前川
Original Assignee
三星ダイヤモンド工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三星ダイヤモンド工業株式会社 filed Critical 三星ダイヤモンド工業株式会社
Priority to KR1020107022775A priority Critical patent/KR101222894B1/ko
Priority to CN200980118059.8A priority patent/CN102036924B/zh
Priority to JP2010517779A priority patent/JP5193298B2/ja
Publication of WO2009154013A1 publication Critical patent/WO2009154013A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

Definitions

  • the present invention relates to a method of dividing a mother substrate (also referred to as a bonded substrate or a bonded mother substrate) formed by arranging a plurality of unit display panels adjacent to each other into unit display panels and taking them out one by one.
  • the method of taking out the unit display panel of the present invention is specifically used when taking out a liquid crystal display panel or the like from a mother substrate.
  • a liquid crystal display panel In a liquid crystal display panel, two large-area glass substrates are used, a color filter is formed on one substrate, a TFT (Thin film Transistor) that drives the liquid crystal on the other substrate, and a terminal area for external connection Form.
  • a liquid crystal display panel is manufactured by pasting these two substrates together and forming a mother substrate in which liquid crystal is sealed, and then dividing the substrate into individual unit display panels.
  • a first substrate also referred to as a CF side substrate
  • a second substrate also referred to as a TFT side substrate
  • a sealing material is pasted together with a sealing material.
  • the second substrate is bonded so that the substrate surface on which the TFT and the terminal region are formed becomes a bonding surface with the first substrate.
  • the terminal area is an area where the signal line is connected between the TFT and the external device, it is necessary to expose the terminal area. Therefore, when the mother substrate is divided for each unit display panel, the portion of the first substrate (CF side substrate) facing the terminal region is removed as an end material region. Specifically, the second substrate side is divided along the outer end of the terminal region that is opposite to the side to which the TFT is connected, and the width necessary for attaching the signal line from the outer end of the terminal region ( The first substrate is divided at a position inside the terminal width), and a portion of the first substrate facing the terminal region is cut out as an end material region.
  • a cutting method using a cutter wheel is used.
  • a scribe groove is carved in each substrate by making a cutter wheel press-contact and move relative to each of the two substrates (CF side substrate and TFT side substrate) constituting the mother substrate.
  • the mother substrate is completely divided for each unit display panel by applying force to break along the scribe groove (mechanical break) or by applying heated steam to break (steam break). Then, the separated unit display panels are transferred to the subsequent process by the transfer robot.
  • a substrate processing system (substrate cutting system) and a substrate processing method for efficiently processing such a series of substrate processing on the upper and lower surfaces at the same time have already been disclosed (see Patent Document 1 and Patent Document 2).
  • two mother boards are scribed simultaneously from the vertical direction with a pair of upper and lower cutter wheels.
  • two surfaces are simultaneously broken by a steam break mechanism or a roller break mechanism, and divided into unit display panels.
  • the unit display panels thus formed are taken out one by one and sent to the subsequent process.
  • liquid crystal display panels are required to have a larger screen, and accordingly, unit display panels are also required to have a larger area.
  • unit display panels are also required to have a larger area.
  • CF color filter
  • TFT time division multiplexing
  • terminal region the substrate layout is considered so that the edge material region formed between adjacent unit display panels is minimized.
  • the mother substrate has a structure in which the CF side substrate G1 and the TFT side substrate G2 are bonded together. In these examples, a total of eight unit display panels U are arranged on the mother substrate.
  • the mother substrate of FIG. 15A is provided with a unit display panel of a two-terminal panel in which the terminal region T is formed on the periphery of two adjacent sides.
  • the mother board of FIG. 15B is provided with a three-terminal panel in which terminal regions T are formed on the periphery of three sides.
  • a single terminal panel in which a terminal region T is formed on the periphery of one side is disposed.
  • the mother board of FIG. 16 has a four-terminal panel in which terminal regions T are formed on the periphery of four sides. The number of sides on which the terminal region T is formed is selected according to the number of pixels included in the unit display panel U.
  • the second substrate G2 (TFT side substrate) is arranged so that the unit display panels U are in direct contact with each other so that no end material is generated between the adjacent unit display panels U. is there. Therefore, for the second substrate G2, only the outer peripheral portion of the mother substrate is generated as an end material.
  • the first substrate CF side substrate
  • a region facing the terminal region T of the second substrate G2 is generated as an end material together with the outer peripheral portion of the mother substrate U.
  • a portion serving as an end material is indicated by hatching.
  • FIG. 17 is a view showing a part of a cross section of adjacent unit display panels.
  • the unit display panels U1 and U2 are arranged so that the non-terminal surface L2 (the first substrate G1 and the second substrate G2 are on the same end surface) where the terminal region T is not provided in U2.
  • a specific example of the boundary of the unit display panel having such a relationship is indicated by “ ⁇ ” in FIG.
  • scribe grooves (second scribe grooves and third scribe grooves) are formed so that the end surfaces of the second substrate G2 and the first substrate G1 are aligned. It is formed.
  • One cut surface by this scribe groove is called just cut surface Ca.
  • the just cut surface Ca is a cut surface that separates the unit display panel U1 and the unit display panel U2.
  • a scribe groove (only on the first substrate G1 side) at the position of the first substrate G1 facing the inner end of the terminal region T of the unit display panel U1 at a position separated from the just cut surface Ca by the terminal width Wa (FIG. 15).
  • a first scribe groove is formed.
  • the cut surface by the scribe groove is referred to as a terminal cut surface Cb.
  • the terminal cut surface Cb is a cut surface that is divided to expose the terminal surface of the terminal region T.
  • FIG. 18 is a diagram showing three types of separation states after the scribing process and the breaking process are performed on the unit display panel U1, the unit display panel U2, and the end material region E shown in FIG.
  • the end material region E is completely separated from the unit display panels U1 and U2, and any unit display panels U1 and U2 are in a separated state as they are.
  • the unit display panels U1 and U2 separated in this state are transferred to the subsequent process as they are.
  • FIG. 18B shows a state in which the end material region E is not separated from the unit display panel U2, is attached to the just cut surface Ca side, and only the unit display panel U1 is completely separated.
  • FIG. 18C shows a state in which the end material region E is not separated from the unit display panel U1, is attached to the terminal cut surface Cb side, and only the unit display panel U2 is completely separated.
  • the unit display panel U2 is transferred as a non-defective product to the subsequent process as it is, but the unit display panel U1 is discarded as a defective product or is made non-defective by performing an additional break process for separating the end material region E. After that, it will be transferred to the subsequent process.
  • the substrate cutting system is adjusted so that the end material region E is processed as completely as possible (FIG. 18A).
  • the end material region E is justified irregularly.
  • the state of being attached to the cut surface Ca (FIG. 18B) or the state of being attached to the terminal cut surface Cb (FIG. 18C) occurs.
  • the end material region E is always adhered to the just cut surface Ca (FIG. 18B), or the end material region E is always adhered to the terminal cut surface Cb (FIG. 18C).
  • a dividing method is disclosed in which the end material region E is reliably separated using a single type of break mechanism (see Patent Document 3).
  • the first substrate G1 (CF side substrate) is processed, and then turned upside down to form the second substrate G2 (TFT).
  • the side substrate is processed.
  • scribing with a cutter wheel against the terminal cut surface Cb of the first substrate G1 is performed with a strong pressing force P1.
  • substrate G1 is performed with the pressing force P2 weaker than P1.
  • scribing with respect to the just cut surface Ca of the second substrate G2 is performed with a strong pressing force P1.
  • the unit display panel when the upper / lower substrate processing system is adopted, when the unit display panel is taken out from the mother substrate after scribe processing, the unit display panel is generally attached because there is a substrate support mechanism and a transport mechanism under the mother substrate. The pad is taken out by being pulled away from the upper side of the mother substrate (see Patent Document 1 and Patent Document 2).
  • the terminal width Wa is the width of the portion exposed as the terminal region, as compared with the conventional case.
  • the terminal width Wa has been about 10 mm so far, but it is required to be reduced to about 1 mm to 3 mm.
  • the dividing method described in Patent Document 3 shown in FIG. 19 and FIG. It is conceivable to remove.
  • this division method is adopted, there are cases where it cannot be made good.
  • the end material region E in a state where the end material region E is attached to the terminal cut surface Cb side (see FIG. 20), the end material region E is integrated with the unit display panel, and is cut out to form a rectangular parallelepiped as a whole.
  • the protruding portion for gripping only the end material region E is eliminated.
  • the terminal width Wa is 1 mm to 3 mm, it is difficult to separate only the end material region E with the suction pad (see Patent Document 2). Therefore, once adhering to the terminal cut surface Cb side, it is difficult to separate the end material region E from the terminal cut surface Cb, and it must be discarded as a defective product.
  • the upper and lower substrate processing system that does not require the substrate to be inverted is used, and the end material region is always used. It is desirable to employ a substrate processing method (see FIG. 19) in which E is not attached to the terminal cut surface Cb side (even if it is attached to the just cut surface Ca side).
  • the end material region E adheres to the just cut surface Ca side. In this state, there is a problem that the end material region E collides with the terminal region of the adjacent unit display panel.
  • the present invention provides a unit display panel from a mother substrate that can stably and reliably take out a unit display panel even if it is a large-area mother substrate that is difficult to process by inverting the substrate.
  • An object of the present invention is to provide a method for taking out the image. Second, even if the terminal width of the terminal area of the unit display panel is narrowed, there is no defective product in which the end material area covering the terminal area adheres to the terminal cut surface side, and the end material area It is an object of the present invention to provide a method for taking out a unit display panel that can be completely separated, or even if it cannot be completely separated, the end material region can be reliably removed later to make a good product.
  • a third object of the present invention is to provide a method of taking out the unit display panel arranged on the mother board so that the terminal area is not damaged.
  • the mother board is divided to create a unit display panel
  • the end material area can be reliably ensured by additional break processing. This is a take-out method on the premise that the unit display panel is taken out in a state where it can be separated.
  • the mother substrate has a structure in which the first substrate and the second substrate are bonded together.
  • a plurality of unit display panels each having the same shape and square shape are formed side by side so as to be adjacent to each other on the mother substrate.
  • Each square unit display panel has a step formed by projecting the second substrate side more than the first substrate side on the periphery of one side, the periphery of two adjacent sides, or the periphery of three sides of the four sides.
  • a terminal region is provided.
  • a non-terminal surface in which the first substrate and the second substrate are the same end surface is formed on the remaining periphery where the terminal region is not provided.
  • each unit display panel is arranged so that the terminal area of one unit display panel and the non-terminal surface of the other unit display panel are in contact with each other at the boundary with at least one of the adjacent unit display panels. It is.
  • the mother substrate on which the unit display panels are arranged in the above-described layout is scribed for each unit display panel and the unit display panels are taken out from the mother substrate one by one, the following (a) (b) (c) Remove the unit display panel according to the procedure. (A) The mother substrate is arranged so that the second substrate side is the upper surface.
  • the region between the terminal cut surface (first scribe groove) and the just cut surface (second, third scribe groove) is the terminal cut surface (the portion of the first substrate facing the terminal region).
  • the first scribe groove is formed on the second substrate side of the just cut surface (non-terminal surface)
  • the first scribe groove is formed on the first substrate side of the just cut surface (non-terminal surface)
  • a third scribe groove shallower than the first scribe groove and the second scribe groove is formed.
  • the unit display panel on the side where the terminal area contacts is preferentially taken out over the unit display panel on the non-terminal surface side. Since the second substrate side including the terminal region is disposed on the upper surface, the unit display panel can be taken out without any problem by first pulling it away upward so as not to collide with the end material region.
  • the unit display panel can be taken out stably and reliably. Further, even if the terminal width of the terminal area of the unit display panel is narrowed, the end material area of the portion covering the terminal area is not attached to the terminal cut surface side, and the end material area is completely separated, Even when complete separation is not possible, the end material region can be reliably removed later to make a good product, so that the occurrence of defective products due to the end material is reduced. Further, the unit display panel arranged on the mother substrate can be taken out so that the terminal region is not damaged.
  • the width of the first scribe groove and the third scribe groove may be 1 mm to 3 mm. In this way, the unit display panel with a shortened unit width can be used.
  • FIG. 2 is a perspective view of the substrate processing system of FIG.
  • FIG. 4 is a cross-sectional view taken along the line B-B ′ of FIG. 3.
  • FIG. 4 is a sectional view taken along line C-C ′ in FIG. 3.
  • FIG. 4 is a cross-sectional view taken along the line D-D ′ in FIG. 3.
  • FIG. 4 is a cross-sectional view taken along line E-E ′ of FIG. 3.
  • FIG. 4 is a cross-sectional view taken along the line F-F ′ in FIG. 3.
  • substrate processing method of this invention The figure which shows an example of the process order when scribing a mother board
  • substrate (four terminal panel).
  • Substrate processing system 20 Substrate support device 30 Substrate cutting mechanism 50 Clamp device 60 Upper scribe mechanism 70 Lower scribe mechanism 80 Unloading robot 87 Hook 88 Pusher 90 Mother substrate 100 Steam break device 110 Roller break device 120 Substrate unload device Ca Just cut surface Cb Terminal cut surface G1 First substrate (CF side substrate) G2 Second substrate (TFT side substrate) E End material region T Terminal region U1 Unit display panel (terminal cut surface faces the boundary) U2 unit display panel (just cut surface faces the boundary) W1 First cutter wheel W2 Second cutter wheel W3 Backup wheel
  • Embodiments of a method for removing a unit display panel from a mother substrate according to the present invention will be described with reference to the drawings.
  • the method of taking out the unit display panel described below is a method used in the manufacturing process of the liquid crystal display panel. When the unit display panel processed into the liquid crystal display panel is divided from the mother substrate and taken out one by one. used.
  • FIG. 1 is a perspective view showing the overall configuration of a substrate processing system 1 in which the substrate processing method of the present invention is used.
  • FIG. 2 is a perspective view (excluding a platform 10 described later) of FIG.
  • FIG. 3 is a plan view of the substrate processing system 1 (excluding a frame 11 and a column 14 described later).
  • 4 is a sectional view taken along the line BB ′ of FIG. 3
  • FIG. 5 is a sectional view taken along the line CC ′ of FIG. 3
  • FIG. 6 is a sectional view taken along the line DD ′ of FIG. 8 and 8 are cross-sectional views taken along the line FF ′ of FIG.
  • the substrate processing system 1 is configured such that the mother substrate 90 is transported in the Y direction from the substrate carry-in side 1L to the substrate carry-out side 1R, and scribe processing and break processing are performed on the way.
  • the mother substrate 90 (bonded substrate) is placed so that the upper side is the second substrate G2 (TFT side substrate) and the lower side is the first substrate G1 (CF side substrate).
  • a frame structure is formed by the hollow frame 10, the main frame 11, and the support column 14.
  • a substrate support device 20 for supporting the mother substrate 90 is disposed above the gantry 10.
  • the substrate support device includes a first substrate support portion 20A and a second substrate support portion 20B.
  • a substrate cutting mechanism 30 is disposed at an intermediate position between the first substrate support portion 20A and the second substrate support portion 20B.
  • each of the first substrate support portion 20A and the second substrate support portion 20B includes five support units 21 arranged in the X direction. .
  • Each support unit 21 is fixed to the gantry 10 on the side close to the substrate cutting mechanism 30.
  • a timing belt rotates around the upper surface of each support unit 21, and a mother substrate 90 is fed in conjunction with a clamp device 50 described later.
  • the substrate cutting mechanism 30 is provided with an upper guide rail 31 and a lower guide rail 32.
  • the upper scribe mechanism 60 is attached to the upper guide rail 31 so as to be movable in the X direction, and the lower guide rail 32 is movable in the X direction.
  • a lower scribe mechanism 70 to be attached is attached.
  • the scribe mechanism 60 is mounted side by side with the second cutter wheel W2 and the backup roller W3 in the Y direction, and the second cutter wheel W2 and the backup roller W3.
  • Is composed of a lifting mechanism 61 that lifts and lowers, a rotation mechanism 62 that switches the direction of the blade edge of the second cutter wheel W2 and the rotation direction of the backup roller W3 between the Y direction and the X direction, and an X-axis drive mechanism 63.
  • the elevating mechanism 61 and the rotating mechanism 62 can select either the second cutter wheel W1 or the backup wheel W3 and press-contact with the substrate, and direct the moving direction of the press-contacted wheel in the Y direction or the X direction. I can do it.
  • the backup roller W3 is used as a pair with a first cutter wheel W1 to be described later, and is used so as to press from the other side substrate surface when scribing only the one side substrate surface with the first cutter wheel W1.
  • the scribe mechanism 70 is attached to the first cutter wheel W1, and is an elevating mechanism 71 for raising and lowering the first cutter wheel W1, a rotating mechanism 72 for switching the blade edge direction of the first cutter wheel between the Y direction and the X direction, an X-axis drive mechanism 73.
  • a clamp device 50 that clamps the end of the mother substrate 90 on the substrate carry-in side (the rear end of the mother substrate 90) is disposed on the substrate carry-in side 1 ⁇ / b> L side of the substrate support device 20.
  • the clamp device 50 includes a pair of clamp tools 51 (51L, 51R), an elevating mechanism 55 (55L, 55R) for moving the clamp tools 51 up and down, and a moving base 57, and moves in the Y direction with the mother substrate 90 clamped.
  • the clamp device 50 is driven by a linear motor mechanism 58.
  • the clamp tool 51L and the clamp tool 51R are configured to clamp the left column and the right column of the unit display panel formed on the mother substrate 90, respectively, and even after being divided along the Y direction at the center position of the substrate.
  • the mother substrate 90 divided into right and left can be supported in each row and can be sent in the Y direction.
  • an upper steam unit 101 that blows heated steam from above onto the mother substrate 90 is provided on the substrate carry-out side 1R of the substrate support device 20.
  • a steam break device 100 having a lower steam unit 102 sprayed from below is arranged.
  • the mother substrate 90 expands, and active break processing is mainly performed in the X direction of the mother substrate.
  • the steam breaker 100 can be moved in the Y direction by a linear motor mechanism 130.
  • the Y-direction scribe line formed on the substrate is placed at the position 1R on the substrate carry-out side 1R of the steam unit 100.
  • a roller break device 110 that presses the break rollers 111 to 113 along the adjacent position of the groove (next to the scribe groove) and applies a break pressure in the Y direction of the substrate to actively break the substrate is disposed.
  • the roller breaker 110 can be moved in the Y direction by a linear motor 130.
  • a substrate carry-out device that takes out unit display panels one by one from the mother substrate 90 and sends them to the subsequent process at the position on the substrate carry-out side 1R of the roller break 110. 120 is arranged.
  • the substrate carry-out device 120 is provided with an upper guide rail 121, and a carry-out robot 80 that is movable in the X direction is attached to the upper guide rail 121.
  • the substrate carry-out device 120 can be moved in the Y direction by the linear motor 130.
  • the carry-out robot 80 includes a plate 83 to which a suction pad 82 is attached, a rotation mechanism 84 that rotates the plate 83 on the XY plane, an elevating mechanism 85 that raises and lowers the plate 83 in the Z direction, and an X-axis drive mechanism 86. .
  • the unloading robot 80 sucks one of the unit display panels separated from the mother substrate 90 and pulls it upward. Further, the unit display panel that has been separated is moved in the X-axis direction while rotating, and further moved in the Y-direction by the linear motor 130 to carry out one by one.
  • the unloaded unit display panel is transferred to a subsequent process (not shown), and the next processing is performed. At this time, the order of taking out the unit display panels from the mother substrate 90 will be described later.
  • FIG. 9 is a diagram showing an additional break processing operation by the hook 87 and the pusher 88.
  • the hook 87 is configured to be rotatable about a support shaft fixed to the plate 83.
  • the second substrate G2 (TFT side substrate) of the unit display panel is sucked by the suction pad 82 in a state where the hook 87 and the pusher 88 are avoided upward.
  • the hook 87 is operated to come into contact with the end material E at the end of the first substrate G1 opposite to the suction surface, and the end material is supported from below.
  • the pusher 88 is operated to press the end material E adhering to the end of the second substrate G2 from above. In this way, the end material E is surely divided by applying a bending moment to the end material E.
  • the scribing process is performed in the substrate cutting mechanism 30 (FIG. 5).
  • the end material E cannot be separated in the process of taking out the unit display panel from the mother substrate, the end material E is attached to the just cut surface side instead of the terminal cut surface side.
  • the scribe groove is formed so that the just cut surface side of the first substrate G1 to which the metal is attached becomes a scribe groove shallower than the terminal cut surface side to which the first substrate G1 is not attached.
  • the transfer robot 80 is attracted to the upper substrate surface (FIG. 9), so that the second substrate G2 (TFT side substrate) is placed on the upper side and the first substrate (CF side substrate). ) On the bottom.
  • the terminal region T second substrate G2 side
  • the end material region E adheres to the just cut surface Ca of the unit display panel U2 and does not adhere to the terminal cut surface Cb.
  • the second cutter wheel W2 of the scribe mechanism 60 is aligned with the position of the just cut surface Ca of the second substrate G2. Further, the first cutter wheel W1 of the scribe mechanism 70 is aligned with the position of the terminal cut surface Cb of the first substrate G1. Then, the first scribing is performed simultaneously with a strong pressure contact force. At this time, since no stress is generated near the terminal region T, the scribe groove can be extended deeply. Since the terminal region T in which the scribe groove is formed is a region where both sides are fixed by the sealing materials S1 and S2, as a result of the scribe groove spreading, compressive stress is applied in the vicinity of the terminal cut surface Cb.
  • the first cutter wheel W1 of the scribe mechanism 70 is aligned with the position of the just cut surface Ca.
  • the backup roller W3 of the scribe mechanism 60 is aligned with the second substrate G2.
  • the backup roller W3 is moved laterally so as to be disengaged from the position of the just cut surface Ca where the scribe groove is first formed so that the scribe groove is not damaged.
  • the second scribing process is performed with a pressure contact force weaker than the first time.
  • the just cut surface of the first substrate G1 is scribed while resisting compressive stress, so that it is difficult to extend deeply, and the scribe groove becomes shallow. Since this portion was originally intended to form a scribe groove shallower than the terminal cut surface Cb, a preferable scribe groove is formed.
  • each unit display panel includes not only the terminal region T sandwiched between the terminal cut surface Cb and the just cut surface Ca but also boundaries of other shapes.
  • Such a case will be described with a specific example.
  • FIG. 11 shows an example of scribing in the Y direction with respect to a mother board 90 in which unit display panels that are two-terminal panels are arranged in two rows in the X direction and four rows in the Y direction.
  • FIG. 12 shows an example of scribing in the X direction.
  • the central terminal region T is a terminal region sandwiched between the terminal cut surface and the just cut surface (a terminal region in which the end material region may fail to be detached from the terminal cut surface).
  • the first strong scribe (Y1) is performed on the central terminal region T. That is, strong scribing is performed on the terminal cut surface of the first substrate G1 and the just cut surface of the second substrate G2.
  • a second strong scribe (Y2) is performed on the terminal region TL near the left end.
  • a third round strong scribing (to Y3), performed on the just cut surface T R near the right end.
  • the fourth weak scribe (Y4) is performed with a weak scribe against the just cut surface of the first substrate in the central terminal region T.
  • scribing is performed while pressing the backup roller W3 beside the just cut surface of the second substrate G2 (in the figure, the position is indicated by a cross mark instead of an arrow).
  • X2 terminal cut surface of the first substrate G1 and just cut surface of the second substrate G2
  • X3 just cut surface of the first substrate G1
  • X4 first substrate G1.
  • Terminal cut surface and the second substrate G2 just cut surface X5 (first substrate G1 just cut surface)
  • X6 first substrate G1 terminal cut surface and second substrate G2 just cut surface
  • X7 Processing is performed in the order of the just cut surface of the first substrate G1.
  • scribing is performed while pressing the side of the just cut surface of the second substrate G2 with a backup roller.
  • FIG. 13 is a diagram showing the order in which unit display panels are taken out for a mother board having unit display panels arranged in two rows in the X direction and four rows in the Y direction.
  • FIG. 13A shows a two-terminal panel
  • FIG. 13B shows a case of a three-terminal panel
  • FIG. 13C shows a case of a one-terminal panel.
  • the terminal cut surface Cb of the unit display panel (1) is a boundary portion with respect to the boundary (indicated by a circle in the figure) with the adjacent unit display panels (2) and (3). . Therefore, it is necessary to take out the unit display panel (1) first.
  • the unit display panel (2) is a boundary with the adjacent unit display panel (4)
  • the terminal cut surface Cb is a boundary.
  • the unit display panel (3) has a terminal cut surface Cb as a boundary with respect to the boundary between the adjacent unit display panels (4) and (5). At this time, either one of the unit display panels (2) and (3) may be taken out.
  • the unit display panel (2) can be removed first because it can be transported in one direction by taking out from the side closer to the front end of the mother substrate. ).
  • the unit display panel (3) is a boundary with the adjacent unit display panels (4) and (5), and the terminal cut surface Cb is a boundary. Therefore, the unit display panel (3) is then taken out.
  • the unit display panels are taken out in ascending order of numbers (1), (2),... (8) given to the unit display panels in FIG.
  • FIG. 14 is a diagram showing how the end material regions are attached to the extracted unit substrates (1) to (8). Any unit display panel can be taken out without adhering to the terminal cut surface Cb. Therefore, even if the end material adheres to the unit display panel, the end material can be surely removed by the additional break treatment after the hook 87 and the pusher 88 are used.
  • the priority order (1) and (2) is determined between the two unit display panels unless the substrate is transported. And take it out.
  • the numbers assigned to the unit display panels are in ascending order ( 1), (2)... (8), the unit display panel is taken out.
  • the boundary formed by the terminal cut surface Cb and the just cut surface Ca does not exist. In this case, the extraction order does not matter.
  • the substrate processing method of the present invention can be used for scribing a mother substrate for a liquid crystal panel.

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Nonlinear Science (AREA)
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  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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  • Liquid Crystal (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
PCT/JP2009/052329 2008-06-18 2009-02-12 マザー基板からの単位表示パネルの取り出し方法 WO2009154013A1 (ja)

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KR1020107022775A KR101222894B1 (ko) 2008-06-18 2009-02-12 마더 기판으로부터의 단위 표시 패널의 취출 방법
CN200980118059.8A CN102036924B (zh) 2008-06-18 2009-02-12 单位显示板的取出方法
JP2010517779A JP5193298B2 (ja) 2008-06-18 2009-02-12 マザー基板からの単位表示パネルの取り出し方法

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EP3042882A1 (de) * 2015-01-12 2016-07-13 Bystronic Maschinen AG Bearbeitungstisch und verfahren zum bearbeiten von glasscheiben

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TWI384067B (zh) * 2010-06-22 2013-02-01 Univ Nat Taiwan 快速篩選生醫材料對細胞影響之細胞培養盤
KR102152772B1 (ko) * 2013-11-18 2020-09-08 삼성전자 주식회사 레이아웃 디자인 시스템, 레이아웃 디자인 방법, 및 이를 이용하여 제조된 반도체 장치
TWI774883B (zh) * 2017-12-26 2022-08-21 日商三星鑽石工業股份有限公司 黏合基板的劃線方法以及劃線裝置
CN108383368A (zh) * 2018-05-08 2018-08-10 蚌埠市昆宇机械加工厂 一种玻璃制造加工用切割装置
CN111538178B (zh) * 2020-03-31 2022-09-23 上海天马微电子有限公司 显示面板母板、显示模组及其制备方法、显示装置

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WO2002057192A1 (fr) * 2001-01-17 2002-07-25 Mitsuboshi Diamond Industrial Co., Ltd. Separateur et systeme de separation
JP2008056507A (ja) * 2006-08-29 2008-03-13 Seiko Epson Corp 貼合せマザー基板のスクライブ方法および貼合せマザー基板の分割方法

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Publication number Priority date Publication date Assignee Title
WO2002057192A1 (fr) * 2001-01-17 2002-07-25 Mitsuboshi Diamond Industrial Co., Ltd. Separateur et systeme de separation
JP2008056507A (ja) * 2006-08-29 2008-03-13 Seiko Epson Corp 貼合せマザー基板のスクライブ方法および貼合せマザー基板の分割方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3042882A1 (de) * 2015-01-12 2016-07-13 Bystronic Maschinen AG Bearbeitungstisch und verfahren zum bearbeiten von glasscheiben

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JPWO2009154013A1 (ja) 2011-11-24
KR20100135795A (ko) 2010-12-27
JP5193298B2 (ja) 2013-05-08
TWI423938B (zh) 2014-01-21
KR101222894B1 (ko) 2013-01-17
CN102036924B (zh) 2013-06-12
CN102036924A (zh) 2011-04-27

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