WO2009152687A1 - 具有组合散热结构的led灯 - Google Patents

具有组合散热结构的led灯 Download PDF

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Publication number
WO2009152687A1
WO2009152687A1 PCT/CN2009/000610 CN2009000610W WO2009152687A1 WO 2009152687 A1 WO2009152687 A1 WO 2009152687A1 CN 2009000610 W CN2009000610 W CN 2009000610W WO 2009152687 A1 WO2009152687 A1 WO 2009152687A1
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WO
WIPO (PCT)
Prior art keywords
pedestal
led lamp
led
base
led chip
Prior art date
Application number
PCT/CN2009/000610
Other languages
English (en)
French (fr)
Inventor
张迎春
谢玮
孙清波
钱海波
Original Assignee
松下电器产业株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下电器产业株式会社 filed Critical 松下电器产业株式会社
Priority to JP2011513846A priority Critical patent/JP5351259B2/ja
Publication of WO2009152687A1 publication Critical patent/WO2009152687A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a light-emitting diode (LED) lamp with a combined heat dissipation structure, in particular, an LED capable of improving heat dissipation by conduction, convection and radiation by using a combined heat dissipation structure, and capable of improving the light output angle and uniformity of the LED light.
  • LED light-emitting diode
  • LED light sources have received more and more attention due to their outstanding features in environmental protection and energy saving.
  • Current semiconductor LED lamps due to their small size and concentrated power consumption, require high heat dissipation. How to solve the problem of efficient heat dissipation of LED lights is still a major problem that restricts the development of LED light sources.
  • many LED lamps currently on the market are mainly designed by dissipating heat on the outer surface thereof. Most of the heat dissipating bodies are bulky and relatively simple in structure, and the internal structural design is rarely involved. Therefore, the heat dissipation effect of most LED lamps can only meet the heat dissipation requirements of low-power LED lamps.
  • the size of the heat sink of the LED lamp is usually made large. In this case, the LED cannot be outputted.
  • the power of the LED is limited because the heat dissipation requirement cannot be met, so that the luminous flux is too small to achieve the illumination purpose.
  • the existing heat dissipation technology is directly combined with the LED chip using a heat dissipation structure, and the heat dissipation structure achieves a heat dissipation effect by convection and radiation with air.
  • the heat dissipation structure achieves a heat dissipation effect by convection and radiation with air.
  • it is impossible to match the connection of the glass bulbs, and the plane light-emitting effect is used, and the light distribution angle is small. It is not widely used in general lighting, and the design of LED lamps with glass bulbs is even rarer.
  • the luminous flux of LED lamps is currently insufficient to meet the lighting requirements. If the luminous flux is increased, it is necessary to increase the volume of the heat dissipating part, which leads to its cumbersome design or unattractive design. It is not suitable for daily household or office use; and the light output is uneven, the local light is too strong, and it is easy to hurt the eyes, etc. This affects the life and photoelectric performance of the LED.
  • An object of the present invention is to provide an LED lamp having a combined heat dissipation structure, which can improve heat dissipation efficiency by properly assembling a heat dissipation device, and can improve the light extraction angle of the LED by using a heat dissipation device, and can improve the LED light by combining with the glass bulb. Output and uniform characteristics.
  • a light emitting diode LED lamp having a combined heat dissipation structure comprising: at least one LED chip for generating light; a driving circuit for driving the LED chip; a first base for heat dissipation a second base for dissipating heat, the second base is disposed on the first base and in contact with the first base; disposed on the first base and covered a bulb of the second pedestal.
  • At least one of the first base and the second base has a heat sink.
  • the problem of the light output angle and the output uniformity can be well solved by improving the structure of the component in which the LED chip is placed and the configuration of the bulb, thereby protecting the safety of the customer and providing suitable uniform illumination.
  • the heat generated by the LED lamp is efficiently conducted and vented through two internal and external heat sinks, which ensure the performance and safety of the LED chip during operation.
  • the LED lamp of the present invention can adopt a lamp head which is now widely used, and has a shape similar to an incandescent light bulb, and can directly replace an inefficient incandescent light bulb, thereby effectively saving energy.
  • FIG. 1 is a cross-sectional view of an LED lamp having a combined heat dissipation structure in accordance with a first embodiment of the present invention
  • FIG. 2 is a cross-sectional view of an LED lamp having a combined heat dissipation structure in accordance with a second embodiment of the present invention
  • 4 is a schematic view showing the overall appearance of an LED lamp having a combined heat dissipation structure
  • FIG. 4 is a plan view showing the structure of the first pedestal;
  • Figure 5 is a cross-sectional view of an LED lamp having a combined heat dissipation structure in accordance with a third embodiment of the present invention.
  • an LED lamp having a combined heat dissipation structure includes a bulb 1 and an LED chip 2, A base 3, a second base 4, a base (mouth) 5, and a connecting member 6.
  • the connecting member 6 can be connected to the second base 4 and the base 5 by internal and external threads, respectively. It should be noted that the present invention is not limited thereto, and the connecting member 6 may be connected to the second base 4 and the base 6 by other means.
  • the connecting member 6 is connected to the lower portion of the second base 4.
  • first pedestal 3 is disposed at a lower portion of the second pedestal 4, and the heat radiating fins of the first pedestal 3 surround the lower portion of the second pedestal 4. That is, the outer surface of the lower portion of the second pedestal 4 is in contact with the heat radiating fins of the first susceptor 3.
  • the first pedestal 3 is disposed outside the bulb 1 and is located at a lower portion of the bulb 1.
  • the bulb 1 is inserted into the first base 3 and the second base 4 through slots provided in the first base 3 and the second base 4.
  • the second pedestal 4 is disposed inside the bulb 1.
  • the invention is not limited to such a first pedestal with a heat sink and a second pedestal.
  • the first base and the second base may be provided without a heat sink, or at least one of the bases may have a heat sink.
  • the first base 3 can be an inverted cylindrical frustum structure. It should be noted that the present invention is not limited thereto, and a cylindrical shape or a polygonal column shape may also be employed.
  • the upper portion of the first base 3 has a cylindrical shape and the lower portion has an inverted truncated cone shape. That is, the diameter of the lower surface of the truncated cone is smaller than the diameter of the upper surface.
  • a plurality of interphase fins are disposed along the circumference of the first pedestal 3, and the adjacent two fins are separated by an empty space to facilitate air circulation and increase the heat dissipating surface. The heat dissipation fins may be evenly disposed along the circumference of the first base 3 to facilitate uniform heat dissipation thereof.
  • a drive circuit for the LED chip is disposed inside the first pedestal 3 (not shown).
  • Figure 4 shows a top plan view of an example of a first pedestal.
  • a plurality of inter-phase heat dissipation fins 41 are disposed along the circumference of the first base 3, and two adjacent heat dissipation fins are spaced apart from each other to form a heat dissipation passage 42 for air circulation.
  • a slot 43 is provided in a portion near the outer edge of each of the heat radiating fins 41.
  • the slots 43 of each of the heat radiating fins 41 are combined into an annular slot for inserting the wave case 1.
  • the shape of the assembled slot is not limited to a ring shape, but may conform to the shape seen from the upper portion of the first base 3.
  • a grouped slot shape can be a polygon.
  • the second base 4 may be in the shape of a truncated cone, and the inside of the truncated cone is a hollow chamber.
  • the size of the chamber can vary from inside the round table.
  • the size of the inner chamber may be smaller than the size of the lower chamber having a larger diameter.
  • the inside of the bottom near the lower portion of the second base 4 is connected to the outside of the connecting member 6.
  • a plurality of fins are disposed along the axial direction of the second base. Viewed from the side of the truncated cone, these fins form a convex and concave structure.
  • the fins are in the form of a circular sheet formed along the axial direction of the cylinder, and the circular sheets are separated by a uniform space.
  • the shape of the second pedestal 4 is not limited to a truncated cone shape, but may be a polygonal column shape and the first pedestal 3, or with the first The shape of the base 3 corresponds.
  • the top of the second pedestal 4 is a pedestal on which the LED chip 2 is placed.
  • the top LED chip base has a pyramid shape (tapered shape).
  • the inclination angle ⁇ between the slope of the chip base and the horizontal plane is 0-90 degrees. This angle can vary depending on the LED chip and the required light output.
  • An LED chip can be disposed on the chip base, or more than one LED chip can be arranged along the slope of the chip base according to the requirement of light intensity to obtain suitable light intensity and light uniformity, thereby facilitating the design of the illumination system.
  • the large-angle light output LED chip, or the pyramid base with a small angle bevel is also equipped with multiple chips to achieve the best results.
  • the second pedestal 4 is disposed on the first pedestal 3, and is connected to the inside and outside of the first pedestal 3 through the heat dissipating fins of the first pedestal 3.
  • the first pedestal 3 and the second pedestal 4 together conduct heat generated by the LED chips in the bulb through the second pedestal 4 to the first pedestal 3 which is in contact with the air. Then, the first pedestal 3 radiates heat by conducting, convection, and radiation by the air.
  • the bulb 1 is disposed above the first base 3 and covers the second base 4.
  • the material for manufacturing the bulb 1 can be made of transparent glass or frosted glass, thereby improving the coordination and appearance of the appearance of the LED lamp, and at the same time, having a certain scattering property to the light output.
  • the frosted glass bulb has a better heat dissipation effect and can improve the uniformity of light output.
  • the highest point of the chip base is preferably higher than the horizontal center axis of the spherical portion of the bulb 1 (shown by the dashed line in Fig. 1).
  • an effective heat dissipation method is provided, and the LED chip is covered in the bulb.
  • the heat generated by the LED chip is first conducted on the second pedestal 4.
  • the heat sink on the second pedestal 4 effectively increases the heat dissipation area and disperses heat accumulation.
  • the surface of the second pedestal 4 can be simultaneously conducted with the air in the bulb 1 to provide a part of the heat dissipation effect.
  • most of the heat is conducted directly to the first pedestal 3 through the second pedestal 4.
  • the surface of the first pedestal 3 also uses fin-shaped fins to increase the surface area, so that the first pedestal 3 can directly interact with the air to effectively dissipate heat by convection, conduction, heat radiation, and the like. To the outside air. Therefore, the combined heat dissipation structure of the present invention can maintain the heat balance of the susceptor, provide a stable operating temperature for the LED chip, safely and effectively exert its characteristics, increase light efficiency, and save energy.
  • LED lamp having a combined heat dissipation structure according to a second embodiment of the present invention will be described below with reference to FIG.
  • components having the same functions and configurations as those of the above-described LED lamp according to the first embodiment are denoted by the same reference numerals, and a description thereof will be omitted herein.
  • the LED lamp of the second embodiment differs from the LED lamp of the first embodiment described above in that the LED chip base employs a planar base instead of a pyramid-shaped inclined surface base.
  • the planar base of the LED chip is preferably higher than the horizontal center axis of the spherical portion of the bulb 1 (shown by a broken line in Fig. 2).
  • Multiple LED chips can be placed on the planar base of the chip to improve the light output, ie, the light distribution characteristics, to maximize the light output angle and uniformity.
  • Fig. 5 is a cross-sectional view showing an LED lamp having a combined heat dissipation structure in accordance with a third embodiment of the present invention.
  • the LED lamp of the third embodiment will be described below with reference to FIG.
  • components having the same functions and configurations as those of the above-described LED lamps according to the first and second embodiments are denoted by the same reference numerals, and a description thereof will be omitted.
  • the LED chip is placed on the second pedestal, in which case the second pedestal 4 can be used as the pedestal of the LED chip 2.
  • the LED lamp of the third embodiment is different from the LED lamps of the first and second embodiments described above in that the LED chip 2 is mounted on the third pedestal 7 not integral with the second pedestal 4, instead of being directly mounted on the Two bases 4.
  • the third base 7 has a polyhedral shape and is disposed on the second base 4.
  • the shape of the third pedestal 7 is different from that of the pyramid-shaped pedestal of the first embodiment or the planar susceptor given by the second embodiment.
  • Fig. 5 shows an example in which the cross-sectional shape of the third base 7 is a hexahedron shape, one of which is mounted on the top of the second base 4, in contact with the second base 4 to fix the third base 7.
  • the cross-sectional shape of the third pedestal 7 is not limited to the hexagonal shape given in Fig. 5, but may increase the light-emitting angle of the LED chip and improve the shape of any polygon of the light output effect.
  • the third embodiment is shown in the third embodiment that the third base 7 and the second base 4 are not integrated, this is only for the convenience of processing, and is not a specific requirement.
  • This polyhedral shaped third base 7 can also be formed integrally with the second base 4. Whether the second and third bases are integrated does not have a particular effect on the illumination effect of the LED lamp.
  • the dimension of the third pedestal 7 in the horizontal direction may be larger than that of the second pedestal 4 The size or width in the horizontal direction, thereby preventing the second pedestal 4 from blocking the light-emitting direction of the LED chip placed obliquely downward on the third pedestal.
  • the base 5 can be used with a lamp head which is now widely used, and has a shape which is very similar to an incandescent light bulb, and can directly replace an inefficient incandescent light bulb, thereby effectively saving energy.
  • the problem of the light output angle and the uniformity of light output is well solved by improving the base structure in which the LED chip is placed and the configuration of the bulb.
  • the two heat-dissipating pedestals connected inside and outside are used to radiate heat efficiently, which ensures the performance and safety of the LED chip during operation.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

具有组合散热结构的 LED灯 技术领域
本发明涉及一种具有组合散热结构的发光二极管 （LED ) 灯， 特别是， 利用组合 的散热结构， 通过传导、 对流和辐射来提高散热效果， 并且能够改善 LED的光输出角 度和均匀性的 LED灯。 背景技术
随着 LED技术的快速发展， LED光源因其在环保和节能方面的突出特点而越来越 受到重视。 当前的半导体 LED灯， 由于体积小， 功耗集中， 对散热要求较高。 如何解 决 LED灯的高效散热问题， 仍然是制约 LED光源发展的一大问题。 为了解决 LED灯 的散热问题， 目前市面上销售的许多 LED灯主要是通过对其外表面进行散热设计， 其 散热体大多数体积庞大， 结构比较简单， 而对内部的结构设计很少涉及，.因此大部分 LED灯的散热效果只能满足低功率 LED灯的散热要求。
另外， 在现有技术中， 为了达到散热效果， 通常将 LED灯的散热体的尺寸制造得 较大。 这种情况下， 造成 LED无法输出均勾光。 另一方面， 如果要使 LED灯的尺寸 合适且输出均匀光， 因无法满足散热要求， LED的功率就要受到限制， 使得光通量太 小， 无法达到照明目的。
此外， 现有的散热技术都是使用散热结构直接与 LED芯片结合， 散热结构通过与 空气的对流、 辐射达到散热效果。 这种情况下， 无法配合使玻璃玻壳的连接， 且都釆 用平面出光效果，配光角度较小。无法广泛运用到普通照明领域，带有玻璃玻壳的 LED 灯的设计就更加稀少。
鉴于上述问题， 目前 LED灯的光通量不足以达到照明要求。 如果提高光通量又必 然要增大散热部分的体积， 导致其笨重或者装潢设计不美观， 不适合作为日常家庭或 办公使用的灯具；且光输出不均匀，局部光线太强，容易伤害眼睛等等，从而影响 LED 的寿命及光电性能。
发明内容
本发明的目的是提供一种具有组合散热结构的 LED灯，能够通过合理地装配散热 装置提高散热效率， 并且可以利用散热装置改善 LED的出光角度， 通过与玻壳结合， 很好地改善 LED光输出和均匀特性。 根据本发明的一个方面，提供一种具有组合散热结构的发光二极管 LED灯，包括: 至少一个 LED芯片， 用于产生光； 用于驱动所述 LED芯片的驱动电路； 用于散热的 第一基座； 用于散热的第二基座， 所述第二基座设置在所述第一基座之上， 与所述第 一基座接触； 设置在所述第一基座之上， 并覆盖所述第二基座的玻壳。
优选的是， 第一基座和第二基座中的至少一个具有散热片。
根据本发明的 LED灯， 通过改善放置 LED芯片的部件结构和配置玻壳， 能够很 好地解决光输出角度和输出均匀度的问题， 保护好客户的使用安全和提供合适的均勾 照明。 在此基础上， 通过两个内外相连的散热基座， 将 LED灯产生的热量高效地传导 发散出去， 保证了 LED芯片工作时的性能和安全等特性。
另外，本发明的 LED灯可以采用现在大量使用的灯头，且外形十分类似白炽灯泡, 可以直接替代低效的白炽灯泡， 从而有效地节约能源。 附图说明
通过下面结合附图说明本发明的优选实施例， 将使本发明的上述及其它目的、 特 征和优点更加清楚， 其中：
图 1是根据本发明第一实施例的具有组合散热结构的 LED灯的截面图； 图 2是根据本发明第二实施例的具有组合散热结构的 LED灯的截面图； 图 3是根据本发明的具有组合散热结构的 LED灯的整体外观示意图； 图 4是显示第一基座的结构的俯视图； 和
图 5是根据本发明第三实施例的具有组合散热结构的 LED灯的截面图。
具体实施方式
下面参照附图对本发明的优选实施例进行详细说明， 在描述过程中省略了对于本 发明来说是不必要的细节和功能， 以防止对本发明的理解造成混'淆。
以下参考附图， 说明本发明的优选实施例。 第一实施例
图 1是表示根据本发明一个实施例的具有组合散热结构的 LED灯的截面图。如图 1所示， 根据第一实施例， 具有组合散热结构的 LED灯包括玻壳 1， LED芯片 2， 第 一基座 3， 第二基座 4， 灯头 （口金） 5， 和连接件 6。 连接件 6可以通过内外螺纹分 别与第二基座 4和灯头 5连接。 应该指出， 本发明不限于此， 连接件 6也可以通过其 它方式与第二基座 4和灯头 6连接。 连接件 6连接在第二基座 4的下部。 另外， 第一 基座 3设置在第二基座 4的下部，并且第一基座 3的散热鳍片围绕第二基座 4的下部。 就是说， 第二基座 4下部的外表面与第一基座 3的散热鳍片接触。 第一基座 3设置在 玻壳 1的外部， 并且位于在玻壳 1的下部。 玻壳 1通过第一基座 3和第二基座 4上设 置的插槽与第一基座 3和第二基座 4插接在一起。 第二基座 4设置在玻壳 1的内部。 另外， 应该指出， 本发明不限于这种带有散热片的第一基座和第二基座。 例如， 第一 基座和第二基座可以不带有散热片， 或是其中的至少一个基座带有散热片。
如图 3所示， 根据本发明的优选实施例， 第一基座 3可以是倒圆柱锥台形结构。 应该指出， 本发明不限于此， 也可以采用圆柱形状， 或多边柱状。 在第一实施例中， 第一基座 3的上部为圆柱形状， 下部为倒圆锥台形状。 就是说， 圆台下表面的直径小 于上表面的直径。 沿第一基座 3的圆周设置有多个相间的散热鳍片， 相邻的两个散热 鰭片由一个空间隔幵， 以便于空气流通， 且加大散热面。 散热鳍片可以沿第一基座 3 的圆周均匀设置， 以便于其均匀散热。 在第一基座 3的内部设置 LED芯片的驱动电路 (图中未示出。
图 4示出了第一基座的一个实例的俯视示意图。 如图 4所示， 沿第一基座 3的圆 周设置有多个相间的散热鳍片 41， 相邻的两个散热鳍片之间空间隔幵， 构成散热通道 42 以便于空气流通， 且加大散热面。 在靠近每个散热鳍片 41 外侧边缘的部分设置有 插槽 43。 每个散热鰭片 41的插槽 43组合成用于插入波壳 1的环形插槽。 应该指出， 组合成的插槽形状不限于环形， 而是可以与从第一基座 3上部看去的形状一致。例如， 组合成的插槽形状可以是多边形。
返回图 1， 第二基座 4可以是圆台形状， 圆台内部为中空的腔室。 腔室的尺寸在 圆台内部可以不同。 例如， 在第二基座 4直径较小的上部， 其内部腔室的尺寸可以比 直径较大的下部腔室的尺寸小。 靠近第二基座 4下部的底部的内部与连接件 6的外部 相连。 在第二基座 4的圆台上部的圆柱部分， 沿第二基座的轴向设置有多个散热片。 从圆台的侧面看去， 这些散热片形成凸凹相间的结构。 就是说， 在相邻的散热片之间 形成内凹的空间， 加大散热面积。 如果从第二基座 4的圆形截面看去， 散热片为沿圆 柱轴向形成的圆形片状， 且圆形片状之间由均匀的空间间隔隔幵。 应该指出， 根据本 发明， 第二基座 4的形状不限于圆台状， 也可以是多边柱状与第一基座 3， 或与第一 基座 3的形状相对应。
第二基座 4的顶部为放置 LED芯片 2的基座。 在本实施例中， 顶部的 LED芯片 基座呈金字塔状（锥状）。 对于普通 LED芯片， 由于其本身芯片的出光角度受到限制， 因此将芯片基座设置成金字塔状有利于使 LED芯片的光输出角度最大。通过根据所采 用的不同 LED芯片进行计算，可以得出芯片基座的斜面与水平面之间的倾斜角度 α为 0— 90度。 该角度根据 LED芯片的不同， 及所要求的光输出不同而可以改变。
可以在芯片基座上配置一个 LED芯片，或根据光强度的要求沿芯片基座的斜面配 置一颗以上的多颗 LED芯片， 以得到合适的光强度和光均匀性， 从而有利于照明系统 的设计。 对于现在比较少的大角度光输出 LED芯片， 或很小角度斜面的金字塔基座， 同样配置多颗芯片， 也能够达到最佳的效果。
第二基座 4设置在第一基座 3之上， 通过第一基座 3的散热鳍片与第一基座 3内 外相连。第一基座 3和第二基座 4一起将玻壳内的 LED芯片产生的发热量通过第二基 座 4传导至与空气相连触的第一基座 3。 然后， 第一基座 3通过与空气传导、 对流并 通过辐射散发热量。
玻壳 1 设置在第一基座 3的上面， 并且覆盖第二基座 4。 制造玻壳 1的材料可以 采用透明玻璃， 也可以采用磨砂玻璃， 从而可以提高 LED灯外观的协调性及美观性， 同时可以对光输出具有一定的散射性。 尤其以磨砂玻壳的散热效果更佳， 并且可以提 高光输出的均匀效果。
应该指出， 为了获得更好的出光角度， 芯片基座的最高点最好高于玻壳 1 的球形 部分的水平中心轴线 （如图 1中的虚线所示）。
根据本实施例的具有组合散热结构的 LED灯， 提供了一种有效的散热方式， 并且 LED芯片被覆盖在玻壳内。 LED芯片所产生的热量首先在第二基座 4上传导。 第二基 座 4上的散热片有效地增大了散热面积， 分散了热积聚。 第二基座 4的表面同时可以 与玻壳 1 内的空气进行传导， 起到一部分的散热效果。 其次， 大部分的热量通过第二 基座 4直接传导至第一基座 3。 第一基座 3的表面也采用鳍片形状的散热片来增大表 面积， 从而使第一基座 3可以最大限度地直接与空气作用， 通过对流、 传导、 热辐射 等方式将热量有效地散发到外部空气中。 因此， 本发明的这种组合散热结构能够维持 基座的热平衡，为 LED芯片提供稳定的工作温度，安全有效地发挥其特性，增大光效， 节约能源。 第二实施例
下面参考图 2描述根据本发明第二实施例的具有组合散热结构的 LED灯。在根据 第二实施例的 LED灯中， 与上述根据第一实施例的 LED灯的部件具有相同功能和配 置的部件由相同参考数字表示， 在此省略对其的描述。 第二实施例的 LED灯与上述第 一实施例的 LED灯的区别在于 LED芯片基座采用平面基座， 而不是金字塔状的倾斜 面基座。
同样， LED芯片的平面基座最好高于玻壳 1的球形部分的水平中心轴线 （如图 2 中的虚线所示）。 可以在芯片的平面基座上配置多颗 LED芯片， 以改善光输出效果， 即配光特性， 最大限度地提高光输出角度和均匀性。 第三实施例
图 5示出了根据本发明第三实施例的具有组合散热结构的 LED灯的截面图。下面 参考图 5描述第三实施例的 LED灯。 在根据第三实施例的 LED灯中， 与上述根据第 一和第二实施例的 LED灯的部件具有相同功能和配置的部件由相同参考数字表示，在 此省略对其的描述。
在第一和第二实施例中， LED芯片放置在第二基座上， 这种情况下， 可以以第二 基座 4作为 LED芯片 2的基座。
第三实施例的 LED灯与上述第一和第二实施例的 LED灯的区别在于 LED芯片 2 被安装在与第二基座 4不构成一体的第三基座 7, 而不是直接安装在第二基座 4上。 在第三实施例中， 第三基座 7为多面体形状， 设置在第二基座 4上。 第三基座 7的形 状不同于第一实施例的金字塔状基座或第二实施例给出的平面状基座。 图 5示出了第 三基座 7的截面形状为六面体状的例子， 其中的一面安装在第二基座 4的顶部， 与第 二基座 4接触， 以固定第三基座 7。 本领域技术人员可以理解， 第三基座 7的截面形 状不限于图 5中给出的六边形状， 而是可以增加 LED芯片的出光角度， 改善光输出效 果的任意多边的形状。
另外， 需要说明的是， 虽然第三实施例中给出的是第三基座 7与第二基座 4不构 成一体， 但这只是为了便于加工， 而不是特定的要求。 这种多面体形状的第三基座 7 也可以与第二基座 4构成一体。第二与第三基座是否构成一体对 LED灯的照明效果没 有特别的影响。
第三基座 7在水平方向的尺寸 （图 5中所示水平方向的宽度） 可以大于第二基座 4在水平方向的尺寸或宽度， 从而避免第二基座 4遮挡第三基座 Ί上朝斜下方放置的 LED芯片的出光方向。
在第三基座 7的其它平面上设置 LED芯片， 从而使 LED芯片能够向更多的方向 照明， 获得更好的出光角度， 以改善光输出效果， 即配光特性。 根据本发明的第一、 第二和第三实施例， 灯头 5可以釆用现在大量使用的灯头， 且外形十分类似白炽灯泡， 可以直接替代低效的白炽灯泡， 从而有效地节约能源。
根据本发明， 通过改善放置 LED芯片的基座结构和配置玻壳， 很好地解决了光输 出角度和光输出均匀度的问题。 在此基础上， 利用两个内外相连的散热基座， 将热量 高效的传导发散出去， 保证了 LED芯片工作时的性能和安全等特性。 至此己经结合优选实施例对本发明进行了描述。 本领域技术人员应该理解， 在不 脱离本发明的精神和范围的情况下， 可以进行各种其它的改变、 替换和添加。 因此， 本发明的范围不应该被理解为被局限于上述特定实施例，而应由所附权利要求所限定。

Claims

权 利 要 求
1.一种具有组合散热结构的发光二极管 LED灯， 包括：
至少一个 LED芯片， 用于产生光；
用于驱动所述 LED芯片的驱动电路；
用于散热的第一基座；
用于散热的第二基座， 所述第二基座设置在所述第一基座之上， 与所述第一基座 接触；
设置在所述第一基座之上、 并覆盖所述第二基座的玻壳。
2.根据权利要求 1所述的 LED灯， 其中所述第一基座和所述第二基座中的至少一 个具有散热片。
3.根据权利要求 1或 2所述的 LED灯， 其中所述驱动电路设置在所述第一基座的 内部。
4.根据权利要求 1或 2所述的 LED灯，其中所述第二基座的顶部设置有 LED芯片 基座， 用于放置所述 LED芯片。
5.根据权利要求 4所述的 LED灯，其中所述 LED芯片基座为锥状结构，所述锥状 结构的斜面与水平面之间的倾斜角度 α为 0度至 90度。
6.根据权利要求 3所述的 LED灯， 其中所述芯片基座的最高点高于玻壳的球形部 分的水平中心轴线。
7.根据权利要求 4所述的 LED灯， 其中所述芯片基座的最高点高于玻壳的球形部 分的水平中心轴线。
8.根据权利要求 4所述的 LED灯， 其中所述 LED芯片基座为平面结构。
9.根据权利要求 8所述的 LED灯，其中所述 LED芯片基座的平面高于玻壳的球形 部分的水平中心轴线。
10.根据权利要求 4至 9中的任何一项所述的 LED灯， 其中所述 LED芯片基座上 放置多个所述 LED芯片。
11.根据权利要求 1或 2所述的 LED灯，其中所述沿第一基座的圆周设置有多个相 间的散热片， 相邻的两个散热片由空间隔幵。
12.根据权利要求 1、 2或 9中的任何一项所述的 LED灯， 其中所述第一基座为圆 柱状， 或多边柱状。
13.根据权利要求 1或 2所述的 LED灯， 其中所述沿第二基座的轴向设置有多个 相间的散热片， 从所述第二基座的侧面看去， 所述多个相间的散热片凸凹相间。 '
14.根据权利要求 1、 2或 13中的任何一项所述的 LED灯， 其中所述第二基座为 圆柱状， 或多边柱状。
15.根据权利要求 1或 2所述的 LED灯， 其中所述玻壳由透明玻璃或磨砂玻璃制 成。
16.根据权利要求 1或 2所述的 LED灯， 其中连接件分别与灯头和所述第二基座 的下部内侧相连。
17.根据权利要求 1所述的 LED灯， 其中所述第二基座的下部的外表面与所述第 一基座的散热片内外接触。
18.根据权利要求 1或 2所述的 LED灯， 其中包括设置在所述第二基座上的第三 基座， 用于放置所述 LED芯片，
其中所述第三基座为多面体形状。
19.一种具有组合散热结构的发光二极管 LED灯， 包括：
至少一个 LED芯片， 用于产生光；
用于驱动所述 LED芯片的驱动电路；
用于散热的第一基座：
用于散热的第二基座， 所述第二基座设置在所述第一基座之上， 与所述第一基座 接触；
用于放置所述 LED芯片的第三基座， 所述第三基座设置在所述第二基座上； 设置在所述第一基座之上、并覆盖所述第二基座、第三基座、和 LED芯片的玻壳。
20.根据权利要求 19所述的 LED灯， 其中所述第三基座为多面体形状。
21.根据权利要求 19或 20所述的 LED灯， 其中所述第三基座在水平方向的尺寸 大于所述第二基座在水平的尺寸。
22.根据权利要求 19或 20所述的 LED灯， 所述 LED芯片放置在所述第三基座的 多个表面上。
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