WO2009122965A1 - 型アセンブリと成形方法 - Google Patents
型アセンブリと成形方法 Download PDFInfo
- Publication number
- WO2009122965A1 WO2009122965A1 PCT/JP2009/055798 JP2009055798W WO2009122965A1 WO 2009122965 A1 WO2009122965 A1 WO 2009122965A1 JP 2009055798 W JP2009055798 W JP 2009055798W WO 2009122965 A1 WO2009122965 A1 WO 2009122965A1
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- WIPO (PCT)
- Prior art keywords
- mold
- preform
- core
- temperature
- assembly according
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
- C03B11/06—Construction of plunger or mould
- C03B11/08—Construction of plunger or mould for making solid articles, e.g. lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/02—Press-mould materials
- C03B2215/03—Press-mould materials defined by material properties or parameters, e.g. relative CTE of mould parts
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/40—Product characteristics
- C03B2215/46—Lenses, e.g. bi-convex
- C03B2215/49—Complex forms not covered by groups C03B2215/47 or C03B2215/48
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/72—Barrel presses or equivalent, e.g. of the ring mould type
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/79—Uniting product and product holder during pressing, e.g. lens and lens holder
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Definitions
- the present invention relates to a mold assembly for molding and / or sintering a preform and an improvement of a molding method using the mold assembly.
- Patent Document 1 discloses an example of a mold assembly used when a molded product made of a material such as glass or resin is manufactured.
- FIG. 3 is a schematic cross-sectional view showing a mold assembly disclosed in Patent Document 1.
- a body mold 13 having a cylindrical inner surface is placed on a mold table 31.
- the body mold 13 is made of transparent quartz glass.
- the outer periphery of the body mold 13 is surrounded by a ring-shaped halogen lamp (not shown) as a heat source.
- a lower core mold 11 and an upper core mold 12 are inserted into the cylindrical inner surface of the barrel mold 13.
- the pair of core molds 11 and 12 are made of an opaque cemented carbide or ceramic.
- a glass preform 15 is disposed between the pressing surface S1 of the lower core mold 11 and the pressing surface S2 of the upper core mold 12. In this state, light is emitted from the halogen lamp, and the upper core mold 12 is pressed toward the lower core mold 11 as indicated by an arrow A in FIG.
- infrared light and visible light radiated from the halogen lamp are transmitted through the quartz glass body mold 13 and absorbed by the lower core mold 11 and the upper core mold 12 of the cemented carbide or ceramic, thereby generating heat. Arise.
- the preform 15 sandwiched between the pressing surfaces S1, S2 of the pair of core molds 11, 12 is heated.
- the heated preform 15 is formed into a convex lens shape, for example, by the pressing surfaces S1 and S2.
- Patent Document 1 by using a mold assembly as shown in FIG. 3, the core molds 11, 12 and the preform 15 can be directly and rapidly heated without heating the body mold 13. Thus, it is stated that the molding cycle can be shortened.
- JP 2004-090326 A JP 2004-090326 A
- the present invention provides a mold assembly used for molding and / or sintering and a molding method using the same. It aims to improve.
- a mold assembly includes a barrel mold having a cylindrical inner surface, a sleeve covering the outer peripheral surface of the barrel mold, and a pair of core molds for pressing the preform within the cylindrical inner surface of the barrel mold, At least one of the pair of core molds is guided and slidable by the cylindrical inner surface of the trunk mold, and the sleeve does not transmit light having a wavelength of 5 ⁇ m or less and has a thermal conductivity of 70 W / m ⁇ K or more. It is characterized by.
- such a sleeve can be preferably formed mainly from any of graphite, SiC, and AlN.
- the body mold has a cylindrical inner surface with a diameter D 1 (mm) and the core mold has a columnar outer surface with a diameter D 2 (mm), and the body mold is formed at a temperature T (° C.) at which the preform is pressed.
- T temperature
- the thermal expansion coefficients of the core mold and the core mold are ⁇ 1 (/ ° C.) and ⁇ 2 (/ ° C.), respectively, and the difference between the pressing temperature T and room temperature (° C.) is ⁇ T, ⁇ 1 ⁇ It is preferable to satisfy the relationship of ⁇ 2 and 0.030 ⁇ ( ⁇ 1 D 1 ⁇ 2 D 2 ) ⁇ T + (D 1 ⁇ D 2 ) ⁇ 0.005.
- the mold assembly may further include a frame mold for enclosing the periphery of the preform within the cylindrical inner surface of the barrel mold.
- the body mold has a cylindrical inner surface with a diameter D 1 (mm) and the frame mold has a columnar outer peripheral surface with a diameter D 3 (mm), and at a temperature T (° C.) at which the preform is pressed.
- the body mold is mainly formed of a material having a thermal expansion coefficient of 3.5 ⁇ 10 ⁇ 6 or less.
- a barrel mold can be formed, for example, mainly from quartz glass or silicon nitride.
- the core-type sliding surface may be formed of any of graphite, glassy carbon, DLC, and diamond.
- the frame mold is preferably formed mainly of ceramics having a bending strength of 300 MPa or more. Such a frame mold can be formed mainly from any of silicon carbide, silicon nitride, alumina, B 4 C, and zirconia.
- the edge formed by the core-type sliding surface and the pressing surface has an R chamfering or C chamfering of 0.2 mm or more.
- the preform is heated at a heating rate of 2 ° C./sec or higher up to 85% of the temperature T ° C. for pressing the preform. It is desirable to heat the preform at a heating rate of 0.20 ° C./sec or more and 2 ° C./sec or less from 85% of the temperature to T ° C.
- the outer peripheral surface of the body mold is covered with the sleeve that does not transmit light having a wavelength of 5 ⁇ m or less and has a thermal conductivity of 70 W / m ⁇ K or more. It is possible to produce a molded product with high homogeneity.
- FIG. 1 is a schematic cross-sectional view illustrating a mold assembly according to an embodiment of the present invention.
- FIG. 2 is a schematic cross-sectional view showing a state in which a preform is molded by the mold assembly of FIG. 1.
- FIG. 2 is a schematic cross-sectional view illustrating a mold assembly disclosed in Patent Document 1.
- the mold assembly includes a barrel mold 4 having a cylindrical inner surface, and includes an upper core mold 1 and a lower core mold 2 for pressing the preform 3 within the cylindrical inner surface of the barrel mold.
- the outer periphery of the trunk mold 4 is covered with a sleeve 5 formed of a material that does not transmit heating light.
- At least one of the pair of core molds 1 and 2 is slidable while being guided by the cylindrical inner surface of the trunk mold 4.
- a frame 6 may be disposed around the preform 3.
- the cross section of the cylindrical inner surface of the trunk mold 4 may be circular, polygonal, or any other shape depending on the purpose.
- the outer periphery of the body mold 4 and the sleeve 5 is surrounded by, for example, a ring-shaped halogen lamp (not shown) as a heat source.
- a preform 3 as shown in FIG. 1 is pressed between a pair of core molds 1 and 2 at a temperature T ° C., thereby obtaining a molded product 3a as shown in FIG. T ° C is referred to as pressing temperature or molding temperature).
- pressing temperature or molding temperature For example, by molding the ZnS (zinc sulfide) powder preform 3, a molded article 3a of a convex lens-shaped far-infrared optical element can be obtained.
- the present inventors have developed a sleeve 5 that is opaque and has good thermal conductivity on the outer peripheral surface of the body mold 4 in FIGS. 1 and 2.
- the soaking property of the molding region can be enhanced by such a sleeve.
- Example 1 In Example 1 of the present invention, the body mold 4 was formed of quartz glass having a thermal expansion coefficient of 5.0 ⁇ 10 ⁇ 7 / ° C. The barrel mold 4 was formed with a cylindrical inner surface having an inner diameter of 19.995 mm. The outer periphery of the trunk mold 4 was covered with a sleeve 5. The properties of the sleeve 5 will be detailed later in connection with Table 1.
- the pair of core molds 1 and 2 was formed of glassy carbon having a coefficient of thermal expansion of 2.8 ⁇ 10 ⁇ 6 / ° C.
- the cylindrical outer peripheral surfaces of these core molds 1 and 2 had an outer diameter of 19.944 mm.
- a ZnS powder preform 3 was disposed between the pair of core molds 1 and 2.
- a frame mold 6 was disposed around the preform 3. This frame mold 6 was formed of Si 3 N 4 and had a thermal expansion coefficient of 3.5 ⁇ 10 ⁇ 6 / ° C., a bending strength of 700 MPa, and an outer diameter of 19.915 mm.
- a ZnS circular flat plate having a diameter of 20 mm and a thickness of 5 mm was formed in order to measure the molded product density.
- the relative density with respect to the density of ZnS of 4.1 g / cm 3 was measured.
- the density of the cut piece of the measurement part cut out from the molded article was measured by the Archimedes method.
- the density difference between the region having a diameter of 10 mm at the center and a thickness of 5 mm in the circular flat plate molded product described above and the other peripheral part was evaluated. And when the difference of the relative density of the peripheral part with respect to the relative density of the center part is less than 0.5%, the preform is soaked and the whole is uniformly sintered, and the evaluation standard is satisfied. ⁇ is marked. On the other hand, when the density difference is 0.5% or more, an x mark is given as not satisfying the evaluation standard. In general, the relative density tends to be lower in the peripheral portion than in the central portion.
- the molded products produced in Experiments 1a to 1c and 1f satisfy the evaluation standard of the density variation of the molded product. This is because graphite, SiC, and AlN, which are the materials of the sleeve 5 used in the experiments 1a to 1c and 1f, do not transmit heating light and have a thermal conductivity of 70 W / m ⁇ K or more. It is thought that it is because. That is, the sleeve 5 absorbs light to generate heat and generates heat without causing local heating due to the heating light passing through the quartz glass barrel mold 4 and directly irradiating the core molds 1 and 2. It is considered that the heat uniformity in the molding region is improved because the heat is transferred quickly.
- the molded product produced in Experiment 1d does not satisfy the evaluation standard of the density variation of the molded product.
- the reason for this is that the quartz glass, which is the material of the sleeve 5 used in Experiment 1d, is the same as the material of the body mold 4, transmits the heating light, and has a low thermal conductivity of 5 W / m ⁇ K. It is thought that it is because That is, in Experiment 1d, it is considered that the heating light is directly applied to the core molds 1 and 2 to cause local heating, and the soaking property of the molding region is not improved.
- the molded product produced in Experiment 1e also does not satisfy the evaluation standard of the density variation of the molded product.
- the reason is considered that Al 2 O 3 as the material of the sleeve 5 used in Experiment 1e is non-translucent but has a low thermal conductivity of 20 W / m ⁇ K. That is, in Experiment 1e, since the sleeve 5 is non-translucent, it is possible to prevent the heating light from being directly applied to the core molds 1 and 2, but the low thermal conductivity of the sleeve 5 is equal to that of the body mold 4. It is considered that it does not contribute to the improvement of thermal properties, and as a result, the soaking property of the molding region is not improved.
- Example 2 Also in Example 2 of the present invention, Experiments 2a to 2f similar to those in Example 1 were performed. That is, in Experiments 2a to 2f, the sleeve material was changed variously. However, compared with Example 1, in this Example 2, the structural members of the mold assembly shown in FIGS. 1 and 2 were changed.
- the body die 4 in Example 2 was formed of glassy carbon having a thermal expansion coefficient of 2.8 ⁇ 10 ⁇ 6 / ° C.
- the barrel mold 4 was formed with a cylindrical inner surface having an inner diameter of 19.949 mm.
- the pair of core molds 1 and 2 was formed of SiC having a coefficient of thermal expansion of 4.4 ⁇ 10 ⁇ 6 / ° C. However, these core-type sliding surfaces were coated with a DLC (diamond-like carbon) film.
- the cylindrical outer peripheral surface of the core type had an outer diameter of 19.912 mm.
- Frame mold 6 was made of SiC and had a coefficient of thermal expansion of 4.4 ⁇ 10 ⁇ 6 / ° C., a bending strength of 530 MPa, and an outer diameter of 19.897 mm.
- Table 2 summarizes the results of Experiments 2a to 2f in Example 2 in which molding was performed in the same manner as in Example 1 using the mold assembly configured as described above.
- Example 3 In Example 3 of the present invention, an attempt was made to form a homogeneous molded article with a relatively short production tact (time). In general, it is apparent that the temperature uniformity at the molding temperature T ° C. of the preform 3 disposed in the mold assembly increases as the heating is performed slowly over a longer time. However, if a long heating time is required up to the molding temperature T ° C., it is clear that the manufacturing efficiency of the molded product is lowered and the cost is increased.
- Example 3 the following experiments 3a to 3f were conducted in order to investigate a heating method that can increase the production efficiency while maintaining the homogeneity of the molded product.
- the member configuration of the mold assembly was exactly the same as that of the experiment 2a in the above-described Example 2, but the heating method was variously changed.
- the results of these experiments are summarized in Table 3.
- the heating rate (° C./sec) from room temperature to 85% of the molding temperature T ° C. and the subsequent heating rate up to T ° C. were variously changed. It was done.
- heating up to 0.85 T ° C. is referred to as preheating
- heating from 0.85 T ° C. to the molding temperature T ° C. is referred to as control heating
- the total time of these heatings is referred to as total heating time.
- the molding temperature T ° C. is 1000 ° C. (see Example 1), and thus 0.85 T ° C. means 850 ° C.
- an evaluation item related to the molding time is added. That is, in Table 3, when the total heating time required from room temperature to the molding temperature T ° C. is 20 min or less, the evaluation item related to the molding time is marked with “ ⁇ ” as it can satisfy the desired production efficiency of the molded product. Yes. On the contrary, when the total heating time is longer than 20 minutes, the evaluation item regarding the molding time is marked with ⁇ because the desired production efficiency of the molded product cannot be satisfied.
- the molded product produced in Experiment 3d is marked with an x mark indicating that it does not satisfy the evaluation standard of the molded product density fluctuation.
- the reason for this is that the controlled heating rate from 0.85 T ° C. to the molding temperature T ° C. was 2.5 ° C./sec, which is sharper than 2.0 ° C./sec. Therefore, it is considered that the homogeneity of the molded product was also lowered.
- ⁇ marks are given as satisfying the evaluation criteria for the density variation of the molded product. The reason is that the controlled heating rate was moderate at 2.0 ° C./sec or less, so that the temperature distribution in the molding region became uniform and the uniformity of the molded product was maintained.
- Experiments 3e and 3f are marked with ⁇ because they do not satisfy the molding time evaluation criteria.
- the reason for this is that in Experiment 3e, the controlled heating rate was less than 0.2 ° C./sec, which was too gentle, so the total heating time to the molding temperature T ° C. exceeded 20 min.
- the preheating rate from room temperature to 0.85 T ° C. is moderate to less than 2.0 ° C./sec, and the total heating time exceeds 20 minutes, and is marked with “X”.
- Example 4 of the present invention Experiments 4a to 4g similar to those in Example 3 were performed. That is, also in Experiments 4a to 4g, the preheating rate from room temperature to 85% of the molding temperature T ° C and the subsequent controlled heating rate to T ° C were variously changed. However, in Example 4, the following plural types of mold assemblies 4A to 4D were used.
- the body mold 4 was formed of Adceram (registered trademark of Taiheiyo Cement Co., Ltd.)-CS type D3 manufactured by Sanyo Ceratech Co., Ltd. having a thermal expansion coefficient of 1.4 ⁇ 10 ⁇ 6 / ° C.
- Adserum is a composite ceramic of lithium aluminum silicate (LiAlSi 2 O 6 ) and wollastonite (CaO ⁇ SiO 2 ).
- This barrel mold 4 was formed with a cylindrical inner surface having an inner diameter of 19.9777 mm.
- the outer periphery of the body mold 4 was covered with an SiC sleeve 5 having a thermal conductivity of about 130 W / m ⁇ K.
- the pair of core molds 1 and 2 was formed of a cemented carbide having a thermal expansion coefficient of 5.0 ⁇ 10 ⁇ 6 / ° C. However, the outer peripheral sliding surfaces of these core types were formed of diamond. The cylindrical outer peripheral surface of the core type had an outer diameter of 19.901 mm.
- Frame mold 6 was formed of B 4 C and had a coefficient of thermal expansion of 4.5 ⁇ 10 ⁇ 6 / ° C., a bending strength of 400 MPa, and an outer diameter of 19.895 mm.
- the body mold 4 was formed of quartz glass having a coefficient of thermal expansion of 5.0 ⁇ 10 ⁇ 7 / ° C.
- the barrel mold 4 was formed with a cylindrical inner surface having an inner diameter of 20.010 mm.
- the outer periphery of the body mold 4 was covered with a graphite sleeve 5 having a thermal conductivity of about 100 W / m ⁇ K.
- the pair of core molds 1 and 2 was formed of graphite having a thermal expansion coefficient of 5.5 ⁇ 10 ⁇ 6 / ° C.
- the cylindrical outer peripheral surface of this core type had an outer diameter of 19.891 mm.
- the frame mold 6 was made of Al 2 O 3 and had an outer diameter of 19.766 mm.
- the body mold 4 was formed of glassy carbon having a thermal expansion coefficient of 2.8 ⁇ 10 ⁇ 6 / ° C.
- the barrel mold 4 was formed with a cylindrical inner surface having an inner diameter of 19.974 mm.
- the outer periphery of the body mold 4 was covered with an AlN sleeve 5 having a thermal conductivity of about 170 W / m ⁇ K.
- the pair of core molds 1 and 2 was formed of a cemented carbide having a thermal expansion coefficient of 5.0 ⁇ 10 ⁇ 6 / ° C. However, the outer peripheral sliding surfaces of these core types were coated with a DLC film. The cylindrical outer peripheral surface of the core type had an outer diameter of 19.901 mm. Frame mold 6 was made of zirconia and had an outer diameter of 19.664 mm.
- the body mold 4 was formed of silicon nitride having a coefficient of thermal expansion of 3.2 ⁇ 10 ⁇ 6 / ° C.
- the barrel mold 4 was formed with a cylindrical inner surface having an inner diameter of 20.140 mm.
- the outer periphery of the body mold 4 was covered with a carbon sleeve 5 having a thermal conductivity of about 70 W / m ⁇ K.
- the pair of core molds 1 and 2 was formed of silicon carbide having a thermal expansion coefficient of 4.4 ⁇ 10 ⁇ 6 / ° C.
- the cylindrical outer peripheral surface of the core type had an outer diameter of 19.900 mm.
- the frame mold 6 was made of silicon nitride and had an outer diameter of 20.050 mm.
- Table 3 shows the results of molding using the mold assemblies 4A to 4D configured as described above and variously changing the preheating rate and the control heating rate in the same manner as in Example 3.
- a similar table 4 summarizes the results.
- the molded product produced in Experiment 4e is marked with “X” because it does not satisfy the evaluation standard of the molded product density fluctuation.
- the reason for this is that the controlled heating rate from 0.85 T ° C. to the molding temperature T ° C. was 2.5 ° C./sec, which is sharper than 2.0 ° C./sec. Therefore, it is considered that the homogeneity of the molded product was also lowered.
- ⁇ marks are given as satisfying the evaluation standard of the density variation of the molded product. The reason is that the controlled heating rate was moderate at 2.0 ° C./sec or less, so that the temperature distribution in the molding region became uniform and the uniformity of the molded product was maintained.
- Experiments 4f and 4g are marked with “x” because they do not satisfy the molding time evaluation criteria.
- the reason for this is that in Experiment 4f, the controlled heating rate was less than 0.2 ° C./sec and was too gentle, so the total heating time to the molding temperature T ° C. exceeded 20 min.
- the preheating rate from room temperature to 0.85 T ° C. is moderate to less than 2.0 ° C./sec, and the total heating time exceeds 20 min.
- the sleeve 5 covering the outer peripheral surface of the body die 4 of the mold assembly is desired not to transmit heating light and to have good thermal conductivity. . More specifically, if the sleeve 5 is impermeable to heating light having a wavelength of 5 ⁇ m or less, direct local heating of the molding region by the heating light can be prevented. Further, since the sleeve 5 has a thermal conductivity of 70 W / m ⁇ K or more, the heat generated from the absorption of the heating light can be quickly and uniformly transmitted to the body mold 4 to improve the heat uniformity in the molding region. Can be made.
- a temperature of 85% of the temperature T ° C. for pressing the preform is heated at a preheating rate of 2.0 ° C / sec or higher until a temperature of 85% of T ° C to T ° C is controlled at a heating rate of 0.2 ° C / sec or higher and 2.0 ° C / sec or lower. It is desirable to heat the preform at By satisfying such a heating rate condition, good production efficiency can be obtained while maintaining the uniformity of the molded product.
- the body mold 4 is mainly formed of a material having a thermal expansion coefficient of 3.5 ⁇ 10 ⁇ 6 or less. This is because, if the thermal expansion coefficient of the barrel mold is large, the clearance between the outer peripheral surface of the core mold and the inner peripheral surface of the barrel mold tends to increase at the molding temperature T ° C., and the eccentric accuracy tends to decrease.
- the eccentricity accuracy at the molding temperature T ° C. can be maintained high.
- the outer peripheral diameters of the core molds 1 and 2 are larger than the inner peripheral diameter of the body mold 4 due to thermal expansion at the molding temperature T ° C., a shrink-fit state occurs, and the slidability of the core mold is significantly reduced. Therefore, it is desirable to maintain a clearance of 5 ⁇ m or more between the outer peripheral surfaces of the core molds 1 and 2 and the inner peripheral surface of the body mold 4 even at the molding temperature T ° C.
- the body mold has a cylindrical inner surface with a diameter D 1 (mm) and the core mold has a columnar outer peripheral surface with a diameter D 2 (mm).
- the thermal expansion coefficients of the body mold and the core mold are ⁇ 1 (/ ° C.) and ⁇ 2 (/ ° C.), respectively, and the difference between the pressing temperature T and room temperature (° C.) is ⁇ T
- the frame mold is used for positioning the preform 3 and is formed of a high strength (bending strength) material. Therefore, if a shrink-fit state occurs between the frame mold 6 and the body mold 4, the durability of the body mold is significantly adversely affected, so that the space between the outer peripheral surface of the frame mold 6 and the inner peripheral surface of the body mold 4 is not affected. Is desired to have a relatively large clearance of 15 ⁇ m or more.
- the body mold has a cylindrical inner surface having a diameter D 1 (mm) and the frame mold has a columnar outer surface having a diameter D 3 (mm), and the body mold is formed at a temperature T (° C.) at which the preform is pressed.
- the frame mold are ⁇ 1 (/ ° C.) and ⁇ 3 (/ ° C.), respectively, and the difference between the pressing temperature T and room temperature (° C.) is ⁇ T, ⁇ 1 ⁇ alpha 3 and 0.150 ⁇ ( ⁇ 1 D 1 - ⁇ 3 D 3) ⁇ T + (D 1 -D 3) is desired to satisfy the relationship of ⁇ 0.015.
- the molding pressure is applied as a lateral pressure to the frame 6, its bending strength is important, and it is desirable that it has a bending strength of 300 MPa or more. Any of the frame molds 6 used in the various experiments described above can have this strength.
- the edge portion formed by the sliding surface and the pressing surface of the core molds 1 and 2 was subjected to R chamfering or C chamfering of 0.2 mm or more. These chamfers are for preventing galling and squeezing between the core molds 1 and 2 and the inner peripheral surface of the trunk mold 4.
- the outer peripheral surface of the body mold is covered with the sleeve that does not transmit light having a wavelength of 5 ⁇ m or less and has a thermal conductivity of 70 W / m ⁇ K or more.
- the soaking property of the molding region can be improved, and a molded product with high homogeneity can be produced.
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Abstract
Description
本発明の実施例1において、胴型4は5.0×10-7/℃の熱膨張率を有する石英ガラスで形成された。この胴型4には、内径19.995mmの円筒状内面が形成された。また、胴型4の外周は、スリーブ5によって覆われた。スリーブ5の特性は、後で表1との関連において詳述される。
本発明の実施例2においても、実施例1の場合に類似した実験2a~2fが行なわれた。すなわち、実験2a~2fにおいても、スリーブの材質が種々に変更された。ただし、実施例1に比べて、本実施例2においては、図1および図2に示された型アセンブリの構成部材が変更された。
本発明の実施例3においては、均質な成形品を比較的短い製造タクト(時間)で形成することが試みられた。一般に、型アセンブリ内に配置されたプリフォーム3の成形温度T℃における均熱性は、より長い時間をかけて緩やかに加熱するほど高まることが明らかである。しかし、成形温度T℃までに長い加熱時間を要すれば、成形品の製造効率が低下してコスト上昇を招くことも明らかである。
本発明の実施例4においても、実施例3の場合に類似した実験4a~4gが行なわれた。すなわち、実験4a~4gにおいても、室温から成形温度T℃の85%までの予備加熱速度とその後のT℃までの制御加熱速度とが種々に変更された。ただし、本実施例4においては、以下の複数種類の型アセンブリ4A~4Dが用いられた。
型アセンブリ4Aにおいて、胴型4は、1.4×10-6/℃の熱膨張率を有する山陽セラテック社製のアドセラム(太平洋セメント社の登録商標)-CSタイプD3で形成された。なお、アドセラムは、リチュウム・アルミニウムケイ酸塩(LiAlSi2O6)とケイ灰石(CaO・SiO2)との複合セラミックである。この胴型4には、内径19.977mmの円筒状内面が形成された。また、胴型4の外周は、約130W/m・Kの熱伝導率を有するSiCのスリーブ5によって覆われた。
型アセンブリ4Bにおいて、胴型4は、5.0×10-7/℃の熱膨張率を有する石英ガラスで形成された。この胴型4には、内径20.010mmの円筒状内面が形成された。また、胴型4の外周は、約100W/m・Kの熱伝導率を有するグラファイトのスリーブ5によって覆われた。
型アセンブリ4Cにおいて、胴型4は、2.8×10-6/℃の熱膨張率を有するガラス状カーボンで形成された。この胴型4には、内径19.974mmの円筒状内面が形成された。また、胴型4の外周は、約170W/m・Kの熱伝導率を有するAlNのスリーブ5によって覆われた。
型アセンブリ4Dにおいて、胴型4は、3.2×10-6/℃の熱膨張率を有する窒化ケイ素で形成された。この胴型4には、内径20.140mmの円筒状内面が形成された。また、胴型4の外周は、約70W/m・Kの熱伝導率を有するカーボンのスリーブ5によって覆われた。
上述の種々の実験1a~1fおよび実験2a~2fから分かるように、型アセンブリの胴型4の外周面を覆うスリーブ5は加熱光を透過させずかつ良好な熱伝導率を有することが望まれる。より具体的には、スリーブ5が波長5μm以下の加熱光に対して不透過であれば、加熱光による成形領域の直接的局所加熱を防止することができる。また、スリーブ5が70W/m・K以上の熱伝導率を有することによって、加熱光の吸収から生じた発熱を胴型4に素早くかつ均一に伝えることができて、成形領域の均熱性を向上させることができる。
Claims (12)
- 筒状内面を有する胴型と、
前記胴型の外周面を覆うスリーブと、
前記胴型の筒状内面内でプリフォームを押圧するための一対のコア型とを含み、
前記一対のコア型の少なくとも一方は前記胴型の筒状内面にガイドされて摺動可能であり、
前記スリーブは波長5μm以下の光を透過させずかつ70W/m・K以上の熱伝導率を有することを特徴とする型アセンブリ。 - 前記スリーブは、主としてグラファイト、SiC、およびAlNのいずれかで形成されていることを特徴とする請求の範囲1に記載の型アセンブリ。
- 前記胴型が径D1(mm)の円筒状内面を有し、かつ前記コア型が径D2(mm)の円柱状外周面を有し、
前記プリフォームを押圧する温度T(℃)において、前記胴型と前記コア型との熱膨張率がそれぞれα1(/℃)とα2(/℃)であって、
前記押圧温度Tと室温(℃)との差がΔTであるとした場合に、
α1<α2および0.030≧(α1D1-α2D2)ΔT+(D1-D2)≧0.005の関係を満たすことを特徴とする請求の範囲1に記載の型アセンブリ。 - 前記胴型の筒状内面内で前記プリフォームの周縁を包囲するための枠型をさらに含むことを特徴とする請求の範囲1に記載の型アセンブリ。
- 前記胴型が径D1(mm)の円筒状内面を有し、かつ前記枠型が径D3(mm)の円柱状外周面を有し、
前記プリフォームを押圧する温度T(℃)において、前記胴型と前記枠型との熱膨張率がそれぞれα1(/℃)とα3(/℃)であって、
前記押圧温度Tと室温(℃)との差がΔTであるとした場合に、
α1<α3および0.150≧(α1D1-α3D3)ΔT+(D1-D3)≧0.015の関係を満たすことを特徴とする請求の範囲4に記載の型アセンブリ。 - 前記胴型は、主として熱膨張係数3.5×10-6以下の材料で形成されていることを特徴とする請求の範囲1に記載の型アセンブリ。
- 前記胴型は、主として石英ガラスと窒化ケイ素のいずれかで形成されていることを特徴とする請求の範囲6に記載の型アセンブリ。
- 前記コア型の摺動面は、グラファイト、ガラス状カーボン、DLC、およびダイヤモンドのいずれかによって形成されていることを特徴とする請求の範囲1に記載の型アセンブリ。
- 前記枠型は、主として曲げ強度300MPa以上のセラミックスで形成されていることを特徴とする請求の範囲4に記載の型アセンブリ。
- 前記枠型は、主として炭化ケイ素、窒化ケイ素、アルミナ、B4C、およびジルコニアのいずれかで形成されていることを特徴とする請求の範囲9に記載の型アセンブリ。
- 前記コア型の摺動面と押圧面とで形成されるエッジ部は、0.2mm以上のR面取りまたはC面取りがなされていることを特徴とする請求の範囲1に記載の型アセンブリ。
- 請求の範囲1の型アセンブリを用いて成形品を製造する方法であって、前記プリフォームを押圧する温度T℃の85%の温度までは2.0℃/sec以上の加熱速度で前記プリフォームを加熱し、T℃の85%の温度からT℃までは0.2℃/sec以上2.0℃/sec以下の加熱速度でプリフォームを加熱することを特徴とする成形方法。
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US12/935,466 US20110018170A1 (en) | 2008-03-31 | 2009-03-24 | Die assembly and shaping method |
CN2009801121617A CN101983178A (zh) | 2008-03-31 | 2009-03-24 | 模具组件和成形方法 |
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JP2002234742A (ja) * | 2001-02-01 | 2002-08-23 | Matsushita Electric Ind Co Ltd | 光学素子の成形金型 |
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JP2008013392A (ja) * | 2006-07-05 | 2008-01-24 | Konica Minolta Opto Inc | 光学素子の製造方法 |
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2009
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JPH03295825A (ja) * | 1990-04-12 | 1991-12-26 | Matsushita Electric Ind Co Ltd | 光学素子成形型および成形方法 |
JPH11236230A (ja) * | 1998-02-24 | 1999-08-31 | Minolta Co Ltd | 光学素子の成形用金型及びそれを用いた成形方法 |
JP2002234742A (ja) * | 2001-02-01 | 2002-08-23 | Matsushita Electric Ind Co Ltd | 光学素子の成形金型 |
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CN103387404A (zh) * | 2013-07-29 | 2013-11-13 | 北京超塑新技术有限公司 | 用于模具的材料、模具及制备模具方法 |
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JP5370355B2 (ja) | 2013-12-18 |
EP2272807A1 (en) | 2011-01-12 |
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