WO2009107833A1 - 光学素子の成形方法および成形装置 - Google Patents
光学素子の成形方法および成形装置 Download PDFInfo
- Publication number
- WO2009107833A1 WO2009107833A1 PCT/JP2009/053883 JP2009053883W WO2009107833A1 WO 2009107833 A1 WO2009107833 A1 WO 2009107833A1 JP 2009053883 W JP2009053883 W JP 2009053883W WO 2009107833 A1 WO2009107833 A1 WO 2009107833A1
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- WIPO (PCT)
- Prior art keywords
- optical element
- molding
- temperature
- heating
- cooling
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
- C03B35/005—Transporting hot solid glass products other than sheets or rods, e.g. lenses, prisms, by suction or floatation
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
- C03B11/12—Cooling, heating, or insulating the plunger, the mould, or the glass-pressing machine; cooling or heating of the glass in the mould
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
- G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Definitions
- the present invention relates to a method and an apparatus for manufacturing (molding) an optical element by molding while heating the optical element such as a glass lens.
- an element preheating step for preheating the optical element is provided in order to raise the temperature of the optical element to near the glass transition point Tg (for example, about 500 to 600 ° C.) before molding the optical element.
- Tg glass transition point
- the entire optical element is uniform from the viewpoint of shortening the time required for preheating of the optical element as much as possible while avoiding the situation where the optical element is cracked due to temperature variation of each part of the optical element. There has been a strong demand to raise the temperature.
- the optical element is heated to a high temperature (for example, about 500 ° C.) when the optical element is carried into the molding chamber or unloaded from the molding chamber using the transport device. Therefore, the optical element may be broken due to a temperature difference from the conveying device.
- a high temperature for example, about 500 ° C.
- the optical element W itself (that is, not accompanied by a transport tray) is placed in the element molding portion 11 having the upper mold 12 and the lower mold 13.
- a technique has been proposed in which a series of steps of preheating, heating, pressurizing, gradual cooling, and cooling are performed on the optical element W.
- Patent Document 2 Japanese Patent Laying-Open No. 2005-22879 (particularly, paragraphs [0025] to [0033], FIG. 1)
- Patent Document 3 discloses an apparatus for continuously producing a press lens at high speed.
- This apparatus has a glass preform take-in chamber, a preheating chamber, a heating chamber, a press chamber, a slow cooling chamber, a quenching chamber, and a take-out chamber.
- a glass preform is conveyed to each chamber by a conveyor belt together with a mold and a holder. Therefore, the glass preform is removed from the mold in the removal chamber after being cooled with the mold.
- a molding system in which a preheating device, a molding die and a cooler are arranged in series is used.
- the temperature of the optical element when the optical element is naturally cooled in the mold in such a system is indicated by a virtual line CM in FIG.
- CM the temperature of the optical element when the optical element is naturally cooled in the mold in such a system.
- the processing time in the mold limits the speed of the entire optical element manufacturing process.
- forced cooling with the mold is also conceivable, but the mold requires a large amount of energy for cooling because of its large heat capacity.
- the number of molds required is the same as the number of optical elements, resulting in high costs and maintenance costs and labor.
- the optical element heated and molded in the mold is taken out from the mold at a temperature lower than the glass transition point of the optical element and higher than 400 ° C. (High temperature release).
- a heat-resistant transport member is used.
- the optical element is distorted or cracked when there is a temperature difference exceeding 200 ° C. from the optical element being conveyed. Therefore, in the present invention, in order to achieve high temperature release while preventing the occurrence of such defects in the optical element, the optical element taken out from the mold is brought to a temperature not lower than 200 ° C. than the temperature of the optical element. It was held by a heated member and conveyed to the cooling unit.
- a molding apparatus (1) for molding an optical element a molding part (11) for molding while heating the optical element (W) to a temperature higher than the glass transition point (Tg). ); A cooling unit (19, 20) for cooling the optical element (W) molded by the molding unit (11); and a gripping unit (23) for gripping the optical element, and the temperature of the optical element is A conveying part (41) for grasping the optical element by a grasping part (23) at a temperature lower than the glass transition point and at 400 ° C.
- a molding apparatus (1) comprising a heating section (25) for heating the section (23) to a temperature not lower than 200 ° C from the temperature of the optical element (W) taken out from the molding section (11).
- the optical element is taken out from the mold at a high temperature of 400 ° C. or higher and cooled, so the cooling time is shortened and a continuous manufacturing process of a plurality of optical elements is performed with high efficiency. be able to.
- FIG. 2 is a sectional view taken along line II-II of the optical element molding apparatus shown in FIG. It is a perspective view of the shaping
- FIGS. 9A to 9D are schematic views showing a method of delivering an optical element by the auxiliary arm shown in FIG. It is a perspective view of the suction pad used for the molding device concerning Embodiment 1 of the present invention. It is sectional drawing which shows the heating apparatus used with the shaping
- FIG. 15 is a vertical sectional view of the optical element transport device shown in FIG. 14. It is sectional drawing which shows the heating apparatus used with the shaping
- Embodiment 1 of the Invention An optical element molding apparatus according to Embodiment 1 will be described with reference to FIGS.
- the molding apparatus 1 is provided with a molding chamber 3, a vacuum chamber 5, and a work stocker 9 which are partitioned on a machine body frame 2.
- the molding chamber 3 is purged with nitrogen to form a nitrogen atmosphere.
- a vacuum chamber 5 such as a load lock chamber is provided adjacent to the molding chamber 3.
- a slide door 6 is installed between the molding chamber 3 and the vacuum chamber 5 so as to be freely opened and closed.
- a work stocker 9 surrounds the vacuum chamber 5, and a slide door 7 is installed between the vacuum chamber 5 and the work stocker 9 so as to be openable and closable.
- an element molding unit 11 is installed in the molding chamber 3, and the element molding unit 11 includes an upper molding die 12, a lower molding die, as shown in FIGS. 13, a quartz tube 14 and a molding heater 15 are provided.
- the upper mold 12 is fixed to the molding chamber 3, and the lower mold 13 can be raised and lowered in the Z-axis direction (arrow C and D directions in FIG. 2) with respect to the upper mold 12 below the upper mold 12. It is supported by.
- a quartz tube 14 is installed around the upper mold 12, and the quartz tube 14 communicates with the inside of the molding chamber 3, so that it is purged with nitrogen. It has become.
- a molding heater 15 is installed around the quartz tube 14.
- an infrared heater can be used as the forming heater 15.
- a mold can be used as the upper mold 12 and the lower mold 13.
- ceramics with a noble metal coating on the surface noble metal, silicon carbide, tungsten carbide and the like can be used.
- a first element preheating part (first heating area) 16 is installed behind the element molding part 11 (right side in FIG. 2).
- a second element preheating part (second heating area) 17 is installed in front of the element molding part 11 (left side in FIG. 2).
- the 1st element preheating part 16 has the 1st heater 16a
- the 2nd element preheating part 17 has the 2nd heater 17a.
- the heating temperature of the second heater 17a is set higher than the heating temperature of the first heater 16a.
- the first heater 16a and the second heater 17a are preferably those that can be heated so as not to cause temperature variations depending on the portion of the optical element W.
- a heater that heats the optical element W by radiant heat (radiant heat) in a state where the optical element W is mounted on a mounting table for heating can be used.
- the 2nd element preheating part 17 is demonstrated, referring FIG.
- the second element preheating unit 17 is provided with a heating device 41.
- the heating device 41 includes a table 47, a short cylindrical heating mounting table 42, a cylindrical wall body 46, and quartz.
- the tube 48, a cylindrical infrared heater (heating means) 43, and a thermocouple 49 are included.
- a wall body 46 is erected on the upper side of the table 47 so as to press and fix the heating mounting table 42 around the heating mounting table 42.
- the height H1 is the same height as the upper end of the placement area S1 of the optical element W.
- the wall 46 may be formed from a metal carbide such as tungsten carbide (WC) or silicon carbide (SiC).
- a quartz tube 48 is installed around the wall 46, and the inside of the quartz tube 48 is purged with nitrogen. Further, an infrared heater 43 is installed around the quartz tube 48, and a space between the quartz tube 48 and the infrared heater 43 is open to the atmosphere. The infrared heater 43 has an ability to heat the heating stage 42 to a temperature higher than that of the optical element W. *
- the first element cooling section 19 is installed behind the first element preheating section 16 (+ X side: upstream in the transport direction), and the second element The cooling unit 20 is installed behind the first element cooling unit 19 (+ X side: upstream in the transport direction.
- the first element cooling unit 19 includes a first heat dissipation device 19a.
- the second element cooling unit 20 includes a second heat radiating device 20a, and the cooling temperature of the second heat radiating device 20a is set lower than the cooling temperature of the first heat radiating device 19a.
- the first heat radiating device 19a and the second heat radiating device 20a are preferably those that can be cooled so as not to cause temperature variation depending on the portion of the optical element W.
- a heat dissipation device that naturally cools the optical element W in a state where the optical element W is supported by three support pieces arranged at equal angular intervals on the circumference can be used.
- a heat radiating device that forcibly cools the optical element W by rotating a fan, or a heat radiating device that forcibly cools the optical element W by blowing nitrogen gas at room temperature may be used.
- a cooling device 40 is installed in the first element cooling unit 19, and the cooling device 40 includes a cooling support member 44, a heater power supply unit 51, a sequence controller 52, and a control unit 35.
- the cooling support member 44 includes a plate-like mounting table 241 made of a metal such as aluminum, and three support pieces 42 are arranged on the mounting table 241 at equal angular intervals (that is, 120 °). Are arranged at intervals).
- Each support piece 42 includes a claw 43 made of metal (for example, stainless steel SUS304), an electric heater 45 for heating the claw 43, and a heat insulating member 46.
- claw 43 is mounted on the upper side of the heater 45, and the heater 45 is attached to the upper side of the mounting base 241 via the heat insulation member 46.
- a heater power supply unit 51 is connected to the heaters 45 of the three support pieces 42, and a sequence controller 52 is connected to the heater power supply unit 51. Further, the control unit 35 is connected to the sequence controller 52. Further, the claws 43 of the three support pieces 42 may have the same total heat capacity as that of the optical element W.
- the second element cooling section 20 having the second heat radiating device 20a has a mounting table 47 made of a metal such as aluminum as shown in FIGS. 1 to 3, and the mounting table 47 is a first element. It is formed integrally with the mounting table 241 of the cooling unit 19.
- the second heat radiating device 20a it is preferable that the second heat radiating device 20a can be cooled so as not to cause a temperature variation depending on the part of the optical element W, similarly to the first heat radiating device 19a.
- the second heat radiating device 20a naturally cools the optical element W in a state where the optical element W is supported by three support pieces arranged at equiangular intervals on the circumference, like the first heat radiating device 19a.
- a heat dissipating device can be used.
- a heat radiating device that forcibly cools the optical element W by rotating a fan, or a heat radiating device that forcibly cools the optical element W by blowing nitrogen gas at room temperature may be used.
- the forming chamber 3 is provided with a transfer device 141, and the transfer device 141 includes a guide rail 21, a transfer arm 22, and a suction pad (element transfer) made of a high temperature resistant resin. Member) 23 and a hot plate (conveying member heating means) 25 as a heating unit for the suction pad.
- the molding chamber 3 is provided with an auxiliary arm 26 that transports the optical element W between the molding chamber 3 and the vacuum chamber 5.
- the guide rail 21 is disposed in the X-axis direction (the direction of arrows A and B in FIG. 1), and the transfer arm 22 is provided on the guide rail 21 from the first element preheating unit 16 and the second element preheating unit 17. It is supported so as to be movable and movable in the X-axis direction along a conveyance path that reaches the first element cooling part 19 and the second element cooling part 20 through the element forming part 11. Further, a suction pad 23 is supported on the lower surface of the transfer arm 22 so as to be movable up and down in the Z-axis direction (arrows C and D in FIG. 2). The suction pad 23 sucks the upper surface of the optical element W under reduced pressure. Thus, the optical element W can be supported.
- a motor 55 is installed in the molding chamber 3, and a motor control unit 53 is connected to the motor 55.
- a ball screw 59 is connected to the output shaft of the motor 55, and the transfer arm 22 is screwed to the ball screw 59.
- the suction pad 23 has a disc-shaped pad body 23b as shown in FIGS.
- the pad main body 23b is provided with a ring-shaped element contact portion 23c at the peripheral edge so as to protrude downward integrally with the pad main body 23b.
- a thin heat resistance portion 23d is formed on the circumference in the immediate vicinity of the inner peripheral side of the element contact portion 23c.
- an air inlet 23a is formed at the center of the pad main body 23b so as to penetrate the pad main body 23b.
- a vent pipe 57 connected to the vacuum line is connected to the suction pad 23 so as to communicate with the intake port 23a, and an on / off valve 56 is attached in the middle of the vent pipe 57. Further, a sequence controller 52 is connected to the on / off valve 56.
- the hot plate 25 is a part for controlling the temperature of the suction pad, and is installed between the element molding part 11 and the first element preheating part 16 as shown in FIGS.
- the hot plate 25 includes a flat heat transfer plate 43 made of metal, and an electric heater 45 is built in the heat transfer plate 43.
- a heater power supply unit 51 is connected to the heater 45, and a temperature control unit 58 is connected to the heater power supply unit 51.
- a temperature sensor 49 for measuring the surface temperature of the heat transfer plate 43 is provided in the vicinity of the heat transfer plate 43, and the temperature sensor 49 is connected to the temperature control unit 58.
- the control unit 35 is connected to the temperature control unit 58.
- the control unit 35 controls the molding apparatus 1 and performs an optical element manufacturing process described later.
- the hot plate 25 is a member for controlling the temperature of the suction pad
- the suction pad itself does not need to have a heating device. It should be noted that the absence of a heating device in the suction pad reduces the heat capacity of the suction pad, thereby enabling rapid temperature control of the suction pad itself.
- the high temperature resistant resin of the suction pad 23 may be any resin as long as it can withstand the high temperature of the optical element W.
- polyimide resin for example, “Vespel (registered trademark)” manufactured by DuPont Co., Ltd., Nippon Polypenco Ltd.
- PBI registered trademark
- Iupimol manufactured by Narasaki Industrial Co., Ltd.
- polybenzimidazole resin for example, “Polypenco PBI (registered trademark)” manufactured by Nippon Polypenco Co., Ltd.
- nitriding Boron or the like can be used.
- auxiliary arm 26 is movable in the X axis direction (arrow A and B directions) as shown in FIGS. 8A and 8B in a movable region from the molding chamber 3 to the vacuum chamber 5, In addition, it is provided so as to be movable up and down in the Z-axis direction (arrow C, D direction).
- the auxiliary arm 26 has a flat arm body 26a, and a U-shaped work support piece 26b is mounted on the arm body 26a.
- the width L1 of the auxiliary arm 26 is smaller than the width L2 of the optical element W as shown in FIG.
- a work support 27 is placed in the vacuum chamber 5 as shown in FIG.
- the workpiece support 27 is composed of a pair of L-shaped workpiece mounting pieces 27a and 27b facing each other, and an interval L3 between the workpiece mounting pieces 27a and 27b is as shown in FIG. 8B.
- the width of the optical element W is such that the L-shaped work mounting pieces 27a and 27b support both ends in the width direction of the optical element W and the auxiliary arm 26 can pass between the work mounting pieces 27a and 27b. It is narrower than L2 and wider than the width L1 of the auxiliary arm 26.
- the work stocker 9 is provided with a pallet 31 for stocking the optical elements W before and after molding. Furthermore, the work stocker 9 is provided with a guide rail 32 in the Y-axis direction (the direction of arrows E and F in FIG. 1), and the guide arm 32 has a transfer arm 33 in the Y-axis direction and the X-axis direction (FIG. 1). It is supported so as to be movable in the directions of arrows G and H). Further, a suction pad 34 is supported on the lower surface of the transfer arm 33 so as to be movable up and down in the Z-axis direction. The suction pad 34 is configured so that the optical element W can be sucked and supported under reduced pressure. Yes.
- the optical element molding apparatus 1 Since the optical element molding apparatus 1 has the above-described structure, when the optical element W such as an aspheric glass lens is molded using the optical element molding apparatus 1, a command to that effect is sent to the control unit 35. To do. In response to this, as described below, the control unit 35 carries the optical element W to be molded from the work stocker 9 into the molding chamber 3, and then the preheating step A (first preheating step A1) in the time chart shown in FIG. In accordance with the second preheating step A2), the molding step B, and the cooling step C (first cooling step C1 and second cooling step C2), the optical element W is referred to as two-stage preheating, molding, and two-stage cooling.
- the optical element W is controlled to be carried out from the molding chamber 3 to the work stocker 9. If the molding process of the optical element W is viewed in detail, as shown in FIG. 6, it is composed of three processes of heating, pressurizing and slow cooling.
- the optical element W is carried into the molding chamber 3 from the work stocker 9 via the vacuum chamber 5 and conveyed to the first element preheating unit 16 (S1).
- the slide door 6 is closed, and then the slide door 7 is opened.
- the transport arm 33 is appropriately moved in the Y-axis direction and the X-axis direction, and the suction pad 34 is appropriately lifted in the Z-axis direction.
- the optical element W is transported from the pallet 31 to the vacuum chamber 5 while being supported by being sucked by the suction pad 34 under reduced pressure, and placed on the work support 27 as shown in FIG.
- the support state of the optical element W by the suction pad 34 is released, and the transport arm 33 and the suction pad 34 are retracted while leaving the optical element W on the work support base 27.
- the vacuum chamber 5 is evacuated by a vacuum pump (not shown), and then nitrogen gas is introduced into the vacuum chamber 5.
- nitrogen gas is introduced until the vacuum chamber 5 reaches atmospheric pressure
- the slide door 6 is opened, and in this state, the auxiliary arm 26 is lowered by a predetermined distance in the direction of arrow D as shown in FIG.
- the auxiliary arm 26 is moved by a predetermined distance in the direction of arrow B, and as shown in FIG. 9C, the auxiliary arm 26 is raised by a predetermined distance in the direction of arrow C.
- the optical element W is transferred from the vacuum chamber 5 into the molding chamber 3 by moving the auxiliary arm 26 by a predetermined distance in the arrow A direction.
- the optical element W is transferred from the vacuum chamber 5 to the molding chamber 3.
- the operation can be easily executed by simply driving the auxiliary arm 26 as described above.
- the transport arm 22 is appropriately moved in the X-axis direction and the suction pad 23 is appropriately lifted and lowered in the Z-axis direction, so that the auxiliary arm 26 remains in a state where the optical element W is sucked and supported by the suction pad 23.
- the support state of the optical element W by the suction pad 23 is released, and the transport arm 22 and the suction are left with the optical element W remaining in the first element preheating unit 16.
- the slide door 6 is closed.
- the suction pad 23 has an element contact portion 23 c that contacts the outer peripheral portion (outer portion of the effective diameter) of the optical element W when supporting the optical element W. . Therefore, even if the optical element W is finely damaged by this supporting operation, the product value as the optical element W does not deteriorate.
- the process proceeds to an element preheating step (see “preheating step A” in FIG. 6), and the first element preheating unit 16 and the second element preheating unit 17 change the optical element W.
- Preheating is performed stepwise to the vicinity of the glass transition point (temperature) Tg (S2).
- a first stage element preheating process see “first preheating process A1” in FIG. 7 and step S2 in FIG. 17) is performed.
- the optical element W is preheated by the first heater 16a of the first element preheating unit 16 until a certain temperature (for example, 200 to 300 ° C.) is reached.
- a certain temperature for example, 200 to 300 ° C.
- a gas heater that blows heated nitrogen gas onto the optical element W, or the same one as the hot plate 25 described later can be used.
- the element abutting portion 23c abuts on the outer peripheral portion (outer portion of the effective diameter) of the optical element W. Therefore, even if the optical element W is finely damaged by this supporting operation, the product value as the optical element W does not deteriorate.
- the process proceeds to the second stage element preheating step (see “second preheating step A2” in FIG. 7 and step S4 in FIG. 17).
- the optical element W is further preheated by the second heater 17a of the preheating unit 17 until it reaches a temperature near the glass transition point Tg (for example, 400 to 500 ° C.) (S4).
- the glass transition point Tg means a temperature at which the rigidity and viscosity rapidly decrease and the fluidity increases when the glass is heated.
- the preheating operation in the second element preheating process is executed as follows based on a command from the control unit 35.
- the heat dissipation space S2 has a dimension L1 in the heat dissipation direction as short as 5 mm or less (for example, 4 mm), the heat radiated from the heat dissipation surface 42a of the heating table 42 can reach the optical element W without waste. The heating operation of the optical element W by the heating mounting table 42 can be performed efficiently.
- the optical element W is supported on the outer portion of the effective diameter by the support convex part 42b of the heating stage 42 in the element preheating step. Therefore, even if the optical element W is finely damaged by this supporting operation, the product value as the optical element W does not deteriorate.
- the suction pad 23 can be switched between a support state in which the optical element W is supported and a non-support state in which the support state is released within the movable range, and at the time of preheating the optical element W. Since the suction pad 23 is in an unsupported state, only the optical element W exists in the first element preheating unit 16 and the second element preheating unit 17, and the transport arm 22 and the suction pad 23 are retracted. Is pre-heated by itself (that is, without the transfer arm 22 or the suction pad 23). Therefore, the heat capacity of the object to be heated is minimized, and the energy saving property is excellent.
- the controller 35 mounts the optical element W by appropriately raising and lowering the suction pad 23 in the Z-axis direction. It is left still on the mounting table 241.
- the sequence controller 52 closes the on / off valve 56 and introduces nitrogen gas into the vent pipe 57 so as to place the optical element W on the cooling support member 44, and at the same time, the heater power supply unit 51
- an operation to stop energization of the heater 45 is commanded.
- the predetermined temperature range is desirably + 100 ° C. to ⁇ 200 ° C. (for example, when the temperature of the optical element W is 500 ° C., the temperature of each nail 43 is 600 ° C. to 300 ° C.).
- the process proceeds to an element unloading process, and the optical element W is unloaded from the molding chamber 3 to the work stocker 9 via the vacuum chamber 5 (S11).
- the transport arm 22 is appropriately moved in the X-axis direction, and the suction pad 23 is appropriately moved up and down in the Z-axis direction, whereby the optical element W is sucked and supported by the suction pad 23 under the reduced pressure.
- the support state of the optical element W by the suction pad 23 is changed.
- the transfer arm 22 and the suction pad 23 are retracted while leaving the optical element W on the work support piece 26b.
- the slide door 6 is opened.
- the auxiliary arm 26 is raised by a predetermined distance in the direction of arrow C
- FIG. 9C the auxiliary arm 26 is moved by a predetermined distance in the direction of arrow B
- the auxiliary arm 26 is lowered by a predetermined distance in the direction of arrow D as shown in FIG. 9B.
- the optical element W is transferred from the molding chamber 3 into the vacuum chamber 5 by moving the auxiliary arm 26 by a predetermined distance in the arrow A direction.
- the optical element W is transferred from the molding chamber 3 to the vacuum chamber 5.
- the operation can be easily executed by simply driving the auxiliary arm 26 as described above.
- the slide door 7 is opened.
- the transport arm 33 is appropriately moved in the Y-axis direction and the X-axis direction, and the suction pad 34 is appropriately lifted in the Z-axis direction.
- the optical element W is transported from the vacuum chamber 5 to the pallet 31 while being supported by being sucked by the suction pad 34 under reduced pressure, and then the support state of the optical element W by the suction pad 34 is released.
- the slide arm 7 is closed after the transfer arm 33 and the suction pad 34 are retracted.
- the element unloading process ends.
- the optical element W by carrying out the optical element W from the molding chamber 3 via the vacuum chamber 5, it is possible to avoid the problem that oxygen in the atmosphere flows into the molding chamber 3 as the optical element W is unloaded from the molding chamber 3. Can do.
- optical element manufacturing process by the optical element molding apparatus 1 is completed.
- An experimental example in which an actual optical element is molded according to the manufacturing process using the molding apparatus 1 will be described below.
- the molding material was taken out from the upper and lower molds, conveyed to the first element cooling unit 19 by the suction pad 23, and cooled to 90 ° C.
- the suction pad 23 is preheated to 300 ° C. by the hot plate 25, and the temperature of the claw 43 (stainless steel SUS304) of the first element cooling unit 19 to which the molding material is conveyed is preheated to 380 ° C. I left it.
- the molding material was conveyed from the first element cooling section 19 to the second element cooling section 20 and cooled to 55 ° C.
- the optical element thus obtained had a smooth curved surface as usual and had no cracks or distortion.
- a manufacturing process of one optical element W (an element carrying-in process, a first stage element preheating process, a first element carrying process, a second stage element preheating process, a second element carrying process, The element forming process, the third element conveying process, the first element cooling process, the fourth element conveying process, the second element cooling process, and the element unloading process) have been described in order. As shown in FIG. 4, these manufacturing steps are sequentially performed on a plurality (manufactured number) of optical elements W.
- an element preheating process or an element cooling process of the optical element W separate from the optical element W is simultaneously performed.
- the element cooling process of one optical element W and the element molding process of the next optical element W are performed simultaneously.
- an element molding process for one optical element W and an element preheating process for the next optical element W are performed simultaneously.
- only the manufacturing process (element molding process) that needs to be performed in the element molding unit 11 is performed in the element molding unit 11, so that the next optical element can be obtained without completing the manufacturing process of one optical element W. It becomes possible to start the manufacturing process of W. As a result, the number that can be processed per unit time by the optical element molding apparatus 1 increases.
- the molding process B is a rate-limiting process
- four processes other than the molding process B first preheating process A1, second preheating process A2, first cooling process C1, second If the time of the cooling step C2) is matched with the time of the molding step B, the first preheating step A1 of the second optical element W when the molding step B is performed on the first optical element W,
- the second preheating step A2 for the third optical element W, the first cooling step C1 for the fourth optical element W, and the second cooling step C2 for the fifth optical element W can all be performed simultaneously.
- since the temperature at which the optical element is taken out in the molding process B is higher than 400 ° C.
- the optical element W when the optical element W is transported, the optical element W is directly attracted and supported, so that the optical element W is transported on a transport tray.
- a conveyance tray becomes unnecessary, the number of parts of the shaping
- the inside of the molding chamber 3 is a nitrogen atmosphere and oxygen is excluded, the upper mold 12 and the lower mold 13 are prevented from being oxidized at high temperatures, and the upper mold 12 and the lower mold are prevented.
- the mold 13 can be used for a long time.
- FIGS. 14 and 15 are diagrams showing an element gripping tool (element transporting member) 60 used in Embodiment 2 of the present invention.
- an optical element was molded by the same operation using the molding apparatus 1 similar to that of the first embodiment except that an element transport member different from the element transport member used in the first embodiment was used. The description common to the first embodiment is omitted.
- an element gripping tool (element transport member) 60 is provided in the molding chamber 3 instead of the suction pad 23, and the element gripping tool 60 is equiangular on the circumference. It is composed of three L-shaped gripping pieces 61 arranged at intervals (that is, at intervals of 120 °). Each gripping piece 61 is supported so as to be movable back and forth in the radial direction (arrow M, N direction) of the optical element W, and a hemispherical element contact part 61a is formed at the tip.
- each element contact portion 61a makes point contact with the optical element W, and three points of the optical element W are obtained.
- the gripping state of the optical element W by these gripping pieces 61 is changed. It is configured so that it can be released.
- a columnar or cylindrical heater corresponding to the shape of the optical element W is prepared as a heating means for heating the element contact portions 61a of the three grip pieces 61. Then, prior to the second element conveyance process and the third element conveyance process, the element contact portions 61a of the three gripping pieces 61 are pressed against such a heater.
- a non-contact type heater such as a radiant heat heater may be used.
- the influence of the unevenness of the optical surface of the optical element W is affected. Even if the curvature of the optical element W is large, there is an effect that the optical element W is easily supported stably.
- the heating device 41 used in the above-described embodiment, the heating device 41 composed of the heating table 42 and other components has been described for the optical element molding device 1 installed in the second element preheating unit 17. Of course, the heating device 41 may be installed in the first element preheating unit 16.
- a temperature sensor (not shown) is installed in the optical element W, and while monitoring the speed at which the temperature of the optical element W decreases, the temperature can be as high as possible without causing the optical element W to break. You may make it control the heater 45 so that it may become a high speed. In this case, regardless of the magnitude relationship between the total heat capacity of the claws 43 of the three support pieces 42 and the heat capacity of the optical element W, cracking of the optical element W due to the temperature difference between the optical element W and the claws 43 is prevented. It is possible to efficiently perform the cooling operation of the optical element W while preventing it.
- the metal claw 43 has been described.
- the material of the claw 43 is not limited to metal, and a high temperature resistant resin (for example, polyimide resin) can be substituted.
- the case where the heat insulating member 46 is interposed between the mounting table 41 and the heater 45 to reduce the heat transfer from the heater 45 to the mounting table 41 has been described.
- the shape specifically, by reducing the cross-sectional area perpendicular to the heat transfer direction and increasing the length in the heat transfer direction, the heat resistance can be increased to further reduce the heat transfer performance. it can.
- the suction pad 23 is positioned at a predetermined position and turned on / off.
- a sensor for example, an optical sensor, a limit switch, etc.
- the support of the optical element W is detected based on the output signal of this sensor. It doesn't matter.
- the hot plate 25 is installed between the element forming unit 11 and the first element preheating unit 16 .
- the installation location of the hot plate 25 is not limited to between the element molding unit 11 and the first element preheating unit 16 as long as it is within the movable range of the suction pad 23, and may be anywhere.
- the surface temperature of the heat transfer plate 43 is measured by the temperature sensor 49, and the temperature of the element contact portion 23c is calculated from this surface temperature.
- the heating operation of the element contact portion 23c by the hot plate 25 is controlled has been described.
- the correlation between the energization time of the heater 45 and the temperature of the element contact portion 23c is obtained in advance, and a correlation table (not shown) indicating this correlation is stored in a storage means (not shown).
- nitrogen is employed as the inert gas for purging the inside of the molding chamber 3 .
- an inert gas other than nitrogen for example, a rare gas such as helium, argon, neon, xenon, etc.
- a rare gas such as helium, argon, neon, xenon, etc.
- the optical element W is preheated in two stages in the element preheating step, but the optical element W may be preheated in three stages or more.
- the cooling includes not only the case of positively cooling but also the case of cooling by heat radiation in contact with an object having high thermal conductivity (apparatus).
- the case where the element contact portion 23c of the suction pad 23 is heated corresponding to the high-temperature (200 ° C. or higher) optical element W in the second element transport process and the third element transport process has been described.
- the preheating of the element contact portion 23c of the suction pad 23 in the second element transporting process and the third element transporting process is performed by a process as shown in FIG.
- the temperature may be set.
- the transport arm 22 transports the optical element W between the vacuum chamber 5 and the molding chamber 3 (transport from the vacuum chamber 5 to the molding chamber 3 and transport from the molding chamber 3 to the vacuum chamber 5).
- the method of transporting the optical element W at this time is not limited to this.
- another transport device (not shown) for transporting the optical element W between the vacuum chamber 5 and the molding chamber 3 is installed in the molding chamber 3 and the vacuum is opened with the slide door 6 open.
- the slide door 6 may be closed after the optical element W is transferred from one of the chamber 5 and the molding chamber 3 to the other and retracted.
- the transfer arm 22 since the transfer arm 22 only needs to be driven in the molding chamber 3, the mechanism can be simplified.
- the shape after molding is not limited to an aspherical shape.
- the present invention can be similarly applied when molding into a spherical shape or other shapes.
- the molding apparatus described in the embodiment includes components of the molding apparatus that are not specified in the claims, they are not essential parts for carrying out the invention, or It should be understood that the present invention can be used as an optional part of the molding apparatus or a part available at the installation location.
- the constituent elements described in the claims are not limited to the specific examples described in the embodiments.
- the present invention is suitable for the lens manufacturing industry including a process of molding a lens at a high temperature, and the present invention enables mass production of highly accurate lenses with high efficiency. Therefore, the present invention contributes to the significant development of the opto industry.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
5……真空チャンバー、6、7……スライド扉、9……ワークストッカー
11……素子成形部(素子成形手段)、12……上成形型
13……下成形型、14……石英管、15……成形ヒーター
16……第1素子予熱部、16a……第1ヒーター
17……第2素子予熱部、17a……第2ヒーター
19……第1素子冷却部、19a……第1放熱装置
20……第2素子冷却部、20a……第2放熱装置
21……ガイドレール、22……搬送アーム
23……吸着パッド(素子搬送部材)、23a……吸気口
23b……パッド本体、23c……素子当接部位、23d……熱抵抗部
25……ホットプレート(搬送部材加熱手段)、26……補助アーム
26a……アーム本体、26b……ワーク支持片
27……ワーク支持台、27a、27b……ワーク搭載片
31……パレット、32……ガイドレール、33……搬送アーム
34……吸着パッド、35……制御部、41……加熱装置、43……伝熱板
45……ヒーター、49……温度センサ、51……ヒーター電力供給部
52……シーケンスコントローラ、53……モーター制御部
55……モーター、56……オン/オフ弁、57……通気管
58……温度制御部(温度制御手段)、59……ボールねじ
60……素子把持具(素子搬送部材)、61……把持片
61a……素子当接部位、141……搬送装置(素子搬送手段)
241……載置台、W……光学素子、
実施の形態1に係る光学素子の成形装置を、図1~13を用いて説明する。成形装置1は、図3の透視図に示したように、機体フレーム2上に、成形室3、真空チャンバー5及びワークストッカー9が区画されて設けられている。後の説明上、成形装置1の向きを図1及び3に示したX、YおよびZ方向で表わす。成形室3内は窒素でパージされて窒素雰囲気となっている。ロードロックチャンバーなどの真空チャンバー5が成形室3に隣接して設けられている。成形室3と真空チャンバー5との間にはスライド扉6が開閉自在に設置されている。さらに、ワークストッカー9が真空チャンバー5を包囲しており、真空チャンバー5とワークストッカー9との間にはスライド扉7が開閉自在に設置されている。
光学素子Wの成形前の材料として、フリント系ガラス(Tg=560℃)からなる球面レンズを用いた。この材料を、第1予熱工程で250℃に加熱し、さらに第2予熱工程で450℃に加熱した。次いで、加熱された材料を吸着パッド23を用いて素子成形部11に搬送した。この際、吸着パッド23(ポリイミド製)はホットプレート25で300℃に予め加熱した。成型部11の上下成形型に導入時の材料の温度は420℃であった。成形型中で加熱及び加圧する過程での材料の最大温度は650℃であった。加熱及び加圧終了後、成形された材料の温度が420℃に降下したときに成形材料を上下成形型から取出し、吸着パッド23により第1素子冷却部19に搬送し、90℃まで冷却した。この際、吸着パッド23はホットプレート25で300℃に予め加熱しておき、また、成形材料が搬送される第1素子冷却部19の爪43(ステンレスSUS304)の温度は予め380℃に加熱しておいた。次いで、成形材料を第1素子冷却部19から第2素子冷却部20に搬送し、55℃まで冷却した。こうして得られた光学素子は、型通りの平滑な曲面を有しており、クラックや歪は無かった。
上記実験では成形された材料の温度が420℃に降下したときに成形材料を上下成形型から取出し、300℃に加熱した吸着パッド23で搬送したが、この追加実験では、成形された材料の温度を400℃に降下させて上下成形型から取出し且つ吸着パッド23の温度を以下のように変更した以外は、上記実験例と同様の操作を行った。追加実験1-1では、吸着パッド23の温度を170℃とした(成形材料との温度差230℃)。2種類のフリント系ガラスについてこの実験を行ったところ、1種類のフリント系ガラスの成形材料に欠陥が生じた。また、1種類のクラウン系ガラスについても同じ実験を行ったところ、成形材料に欠陥が生じた。追加実験1-2では、吸着パッド23の温度を220℃とした(成形材料との温度差180℃)。追加実験1-1と同じ3種の成形材料(2種のフリント系ガラスと1種のクラウン系ガラス)についてこの実験を行ったが、得られた成形材料には、いずれもクラックなどの欠陥は見出されなかった。
上記実験では成形された材料の温度が420℃に降下したときに成形材料を上下成形型から取出し、380℃に予め加熱した第1素子冷却部19の爪43で成形された材料を受け取ったが、この追加実験では、成形された材料の温度を400℃に降下させて上下成形型から取出し且つ第1素子冷却部19の爪43の温度を以下のように変更した以外は、先の実験例と同様の操作を行った。追加実験2-1では、爪43の温度を300℃とした(成形材料との温度差100℃)。追加実験1-1で用いたのと同じ2種類のフリント系ガラスについてこの実験を行ったところ、1種類のフリント系ガラスの成形材料に欠陥が生じた。また、追加実験2-1で用いたのと同じ1種類のクラウン系ガラスについて同じ実験を行ったところ、成形材料に欠陥が生じた。追加実験2-2では、爪43の温度を400℃とした(成形材料と同温度)。追加実験2-1と同じ3種類の成形材料(2種類のフリント系ガラスと1種類のクラウン系ガラス)についてこの実験を行ったが、いずれも成形材料に欠陥は生じなかった。
図14および図15は、本発明の実施の形態2で用いた素子把持具(素子搬送部材)60を示す図である。実施の形態2では、実施の形態1で用いた素子搬送部材と異なる素子搬送部材を用いた以外は実施の形態1と同様の成形装置1を用い、同様の操作で光学素子を成形した。実施の形態1と共通する説明は省略する。
図16は、本発明の実施の形態3で用いた加熱装置を示す図である。実施の形態3では、図16に示すように、実施の形態1で用いた加熱装置41において、テーブル47および壁体46が省かれ、赤外線ヒーター43が加熱載置台42の下方に設置されている点で相違する以外は、実施の形態1と同様の成形装置1を用い、同様の操作で光学素子を成形した。実施の形態1と共通する説明は省略する。この実施の形態においては、上述した実施の形態と同じ効果を奏するのに加えて、光学素子Wの外周に壁体46が無いため、光学素子Wの出し入れが円滑になり、また、レンズの形状(直径、凹面形状、凸面形状)に依存しないという利点がある。
上述した実施の形態では、吸着パッド23の素子当接部位23cを加熱するのに、吸着パッド23とは別個のホットプレート25にこの素子当接部位23cを押し当てる場合について説明した。しかし、油浴または金属浴により、吸着パッド23の素子当接部位23cを高温の液体に浸漬して加熱することもできる。また、吸着パッド23の素子当接部位23cを放射熱(輻射熱)で加熱することも可能である。さらに、小型軽量の搬送部材加熱手段(図示せず)、例えば、電熱ヒーター、セラミックヒーターを吸着パッド23に組み込んでも構わない。この場合には、ホットプレート25などの吸着パッド加熱装置を省略することができる。
Claims (26)
- 複数の光学素子を順次成形する成形方法であって:
光学素子を素子加熱部で予備加熱することと;
予備加熱した光学素子を前記素子加熱部から成形型に搬送することと;
前記成形型中で、前記光学素子をガラス転位点より高い温度に加熱しながら成形することと;
成形された光学素子をガラス転位点より低く且つ400℃以上の温度で成形型から取り出すことと;
成形型から取り出した光学素子を、その光学素子の温度よりも200℃より低くない温度に加熱した部材で把持して冷却部に搬送することと;
前記冷却部で前記光学素子を冷却することを含む光学素子の成形方法。 - 前記光学素子を前記成形型に搬送するときに、その光学素子の温度よりも200℃より低くない温度に加熱した前記部材で把持して前記成形型に搬送する請求項1に記載の成形方法。
- 冷却部が光学素子と接触する部位を有し、この部位の温度を、冷却部に搬送される光学素子の温度よりも200℃より低くない温度に維持する請求項1に記載の成形方法。
- 前記部材を、当該部材と異なる加熱体に接触させることで加熱する請求項1に記載の成形方法。
- 複数の光学素子が少なくとも第1~第3の光学素子を含み、第1の光学素子が予備加熱されているときに、第2の光学素子が成形され且つ第3の光学素子が前記冷却部で冷却されている請求項1~4のいずれか一項に記載の成形方法。
- 第1の光学素子を予備加熱している間に、前記部材を加熱する請求項1~5のいずれか一項に記載の成形方法。
- 前記部材が光学部材に当接する当接部と光学素子を減圧吸引する吸引口を有する請求項1に記載の成形方法。
- 前記光学素子の加熱及び冷却時には、前記部材が光学素子から離脱している請求項1に記載の成形方法。
- 前記素子加熱部が複数の加熱エリアを有し、それらの加熱エリアにおいて光学素子が段階的に加熱される請求項1に記載の成形方法。
- 冷却部が複数の冷却エリアを有し、それらの冷却エリアで光学素子が段階的に冷却される請求項1に記載の成形方法。
- 光学素子を成形する成型装置であって:
光学素子をガラス転位点より高い温度に加熱しながら成形する成型部と;
成型部で成形された光学素子が冷却される冷却部と;
光学素子を着脱可能に把持する把持部を有し、光学素子の温度が前記ガラス転位点より低く且つ400℃以上の温度で、上記光学素子を把持部で把持して成型部から取り出して前記冷却部に搬送する搬送部と;
前記把持部を、成型部から取出された光学素子の温度より200℃より低くない温度に加熱する加熱部とを備える成形装置。 - 前記加熱部は伝熱板を有し、前記把持部が伝熱板に接触することで前記把持部を加熱する請求項11に記載の成形装置。
- 前記把持部は光学素子を減圧吸着する吸気口を有する請求項11に記載の成形装置。
- 把持部は、光学素子に当接する当接部を有し、該当接部が前記伝熱板に接触することで加熱される請求項12に記載の成形装置。
- 前記当接部が、高温耐性樹脂、低熱伝導性セラミックス及び耐熱ガラスからなる群から選ばれた一種から形成されている請求項14に記載の成形装置。
- 前記把持部は、前記光学素子を冷却部に搬送した後、当該光学素子の把持を解除し、把持部から解除された状態で光学素子が冷却される請求項11に記載の成形装置。
- 前記冷却部は、冷却温度の異なる複数の放熱装置を備える請求項11に記載の光学素子の成形装置。
- さらに、光学素子を予備加熱する素子加熱部を有する請求項11に記載の光学素子の成形装置。
- 前記素子加熱部は、加熱温度の異なる複数の加熱装置を備える請求項18に記載の光学素子の成形装置。
- 前記素子加熱部、前記成形部、前記冷却部は、不活性ガス雰囲気の成形室に設けられ、成形室には真空チャンバーが付設され、前記成形室と前記真空チャンバーとの間には扉が開閉自在に取り付けられている請求項18に記載の光学素子の成形装置。
- 前記冷却部は、前記光学素子を支持する支持部材と支持部材を加熱する加熱装置を有し、前記支持部材が前記光学素子を支持したときに、当該支持部材の当該光学素子に当接する部位の温度が当該光学素子の温度に対して光学素子の温度より200℃より低くない温度範囲になるように加熱装置を制御する温度制御部が設けられている請求項11に記載の光学素子の成形装置。
- 前記温度制御部は、前記支持部材が前記光学素子を支持した後、前記加熱装置による当該支持部材の加熱動作を中止して当該光学素子を放冷する請求項21に記載の光学素子の成形装置。
- 前記支持部材は、前記光学素子を支持する爪と、この爪を加熱するヒーターと、このヒーターを断熱部材を介して支持する載置台とを備える請求項21に記載の光学素子の成形装置。
- 前記素子加熱部が、前記光学素子に対して熱を放射する放熱面及び前記光学素子の外周部に当接して支持する支持凸部が設けられた載置台と、前記加熱載置台を加熱する加熱具を備え、前記放熱面と前記光学素子の載置予定領域との間には放熱空間が形成されている請求項18に記載の光学素子の成形装置。
- 前記加熱載置台の周囲には、壁体が設けられ、前記加熱具は、前記壁体の周囲に設けられている請求項23に記載の光学素子の成形装置。
- 前記壁体は、金属炭化物から形成されている請求項25に記載の光学素子の成形装置。
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2009
- 2009-02-27 TW TW098106275A patent/TWI483907B/zh active
- 2009-03-02 CN CN2009801068704A patent/CN101959809B/zh active Active
- 2009-03-02 WO PCT/JP2009/053883 patent/WO2009107833A1/ja active Application Filing
- 2009-03-02 JP JP2010500795A patent/JP5494471B2/ja active Active
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JPH0717723A (ja) * | 1993-07-02 | 1995-01-20 | Olympus Optical Co Ltd | 光学素子成形方法及び成形装置 |
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CN101959809B (zh) | 2013-07-31 |
TW200946466A (en) | 2009-11-16 |
JP5494471B2 (ja) | 2014-05-14 |
TWI483907B (zh) | 2015-05-11 |
JPWO2009107833A1 (ja) | 2011-07-07 |
CN101959809A (zh) | 2011-01-26 |
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