WO2009072199A1 - 基板搬送装置及び基板搬送装置の制御方法 - Google Patents

基板搬送装置及び基板搬送装置の制御方法 Download PDF

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Publication number
WO2009072199A1
WO2009072199A1 PCT/JP2007/073510 JP2007073510W WO2009072199A1 WO 2009072199 A1 WO2009072199 A1 WO 2009072199A1 JP 2007073510 W JP2007073510 W JP 2007073510W WO 2009072199 A1 WO2009072199 A1 WO 2009072199A1
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WO
WIPO (PCT)
Prior art keywords
hand part
inclination
substrate
controlling
substrate conveying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/073510
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English (en)
French (fr)
Inventor
Kouji Irie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hirata Corp
Original Assignee
Hirata Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirata Corp filed Critical Hirata Corp
Priority to KR1020107014462A priority Critical patent/KR101218112B1/ko
Priority to PCT/JP2007/073510 priority patent/WO2009072199A1/ja
Priority to JP2009544533A priority patent/JP5006409B2/ja
Priority to CN200780101821.2A priority patent/CN101888959B/zh
Publication of WO2009072199A1 publication Critical patent/WO2009072199A1/ja
Priority to US12/793,894 priority patent/US8444368B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

　本発明は、ハンド部 (１０ ) 上に載置された基板Wを、処理装置又は所定の収容部に搬送する基板搬送装置 (１００) において、前記ハンド部 (１０) の一端である根元側を支持すると共に、前記ハンド部 (１０) をその延長方向に往復移動させる移動手段 (２０ )と、前記ハンド部 (１０) に前記基板を載置した際の撓みに伴う前記ハンド部 (１０) の先端部の水平方向に対する傾きを検出する傾き検出手段 (３０ )と、前記ハンド部 (１０) の前記先端部の傾きをキャンセルするように、前記ハンド部 (１０) 全体をピッチング揺動させる傾き補正手段 (４０) と、を備えたことを特徴とする基板搬送装置 (１００) を提供する。
PCT/JP2007/073510 2007-12-05 2007-12-05 基板搬送装置及び基板搬送装置の制御方法 Ceased WO2009072199A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020107014462A KR101218112B1 (ko) 2007-12-05 2007-12-05 기판 반송 장치 및 기판 반송 장치의 제어 방법
PCT/JP2007/073510 WO2009072199A1 (ja) 2007-12-05 2007-12-05 基板搬送装置及び基板搬送装置の制御方法
JP2009544533A JP5006409B2 (ja) 2007-12-05 2007-12-05 基板搬送装置及び基板搬送装置の制御方法
CN200780101821.2A CN101888959B (zh) 2007-12-05 2007-12-05 基板输送装置及基板输送装置的控制方法
US12/793,894 US8444368B2 (en) 2007-12-05 2010-06-04 Substrate transport apparatus and control method for substrate transport apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/073510 WO2009072199A1 (ja) 2007-12-05 2007-12-05 基板搬送装置及び基板搬送装置の制御方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/793,894 Continuation US8444368B2 (en) 2007-12-05 2010-06-04 Substrate transport apparatus and control method for substrate transport apparatus

Publications (1)

Publication Number Publication Date
WO2009072199A1 true WO2009072199A1 (ja) 2009-06-11

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PCT/JP2007/073510 Ceased WO2009072199A1 (ja) 2007-12-05 2007-12-05 基板搬送装置及び基板搬送装置の制御方法

Country Status (5)

Country Link
US (1) US8444368B2 (ja)
JP (1) JP5006409B2 (ja)
KR (1) KR101218112B1 (ja)
CN (1) CN101888959B (ja)
WO (1) WO2009072199A1 (ja)

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JP2009292570A (ja) * 2008-06-04 2009-12-17 Tokyo Electron Ltd 搬送装置及び処理装置
JP2010076066A (ja) * 2008-09-26 2010-04-08 Nidec Sankyo Corp 産業用ロボット
WO2011102648A3 (ko) * 2010-02-19 2012-01-19 주성엔지니어링(주) 기판 처리 시스템 및 기판 반송 방법
KR101133438B1 (ko) 2009-09-24 2012-04-09 주식회사 로보스타 이송 로봇
KR101334690B1 (ko) * 2011-11-15 2013-12-02 주식회사 로보스타 이송 로봇의 파티클 누출방지장치
KR101386035B1 (ko) * 2012-03-16 2014-04-24 (주)동부로봇 다단 슬라이드형 기판이송장치
JP2015080828A (ja) * 2013-10-22 2015-04-27 日本電産サンキョー株式会社 産業用ロボット
WO2016103292A1 (ja) * 2014-12-22 2016-06-30 川崎重工業株式会社 ロボットシステム及びエンドエフェクタの変形検出方法
WO2017106173A1 (en) * 2015-12-18 2017-06-22 Kimberly-Clark Worldwide, Inc. Apparatus for controlling movement of a substrate
JP2020141083A (ja) * 2019-03-01 2020-09-03 株式会社ダイフク 移載機
JP2020155629A (ja) * 2019-03-20 2020-09-24 日本電産サンキョー株式会社 基板搬送装置
JP2020167256A (ja) * 2019-03-29 2020-10-08 日本電産サンキョー株式会社 パネル搬送装置およびパネル搬送システム
JP2021129076A (ja) * 2020-02-17 2021-09-02 東京エレクトロン株式会社 搬送装置、処理システム及び搬送方法
WO2022050205A1 (ja) * 2020-09-04 2022-03-10 川崎重工業株式会社 ロボット及びハンド部姿勢調整方法
WO2025105238A1 (ja) * 2023-11-17 2025-05-22 東京エレクトロン株式会社 搬送システム、および搬送方法

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JP6404586B2 (ja) * 2014-03-31 2018-10-10 平田機工株式会社 製造方法及び製造装置
JP6415220B2 (ja) * 2014-09-29 2018-10-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
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Publication number Priority date Publication date Assignee Title
JP2009292570A (ja) * 2008-06-04 2009-12-17 Tokyo Electron Ltd 搬送装置及び処理装置
JP2010076066A (ja) * 2008-09-26 2010-04-08 Nidec Sankyo Corp 産業用ロボット
KR101133438B1 (ko) 2009-09-24 2012-04-09 주식회사 로보스타 이송 로봇
US9252034B2 (en) 2010-02-19 2016-02-02 Jusung Engineering Co., Ltd. Substrate processing system and substrate transferring method
CN102763210A (zh) * 2010-02-19 2012-10-31 周星工程股份有限公司 基板处理系统及基板传送方法
CN102763210B (zh) * 2010-02-19 2015-08-19 周星工程股份有限公司 基板处理系统及基板传送方法
WO2011102648A3 (ko) * 2010-02-19 2012-01-19 주성엔지니어링(주) 기판 처리 시스템 및 기판 반송 방법
KR101334690B1 (ko) * 2011-11-15 2013-12-02 주식회사 로보스타 이송 로봇의 파티클 누출방지장치
KR101386035B1 (ko) * 2012-03-16 2014-04-24 (주)동부로봇 다단 슬라이드형 기판이송장치
JP2015080828A (ja) * 2013-10-22 2015-04-27 日本電産サンキョー株式会社 産業用ロボット
US10279485B2 (en) 2014-12-22 2019-05-07 Kawasaki Jukogyo Kabushiki Kaisha Robot system and method of detecting deformation of end effector
WO2016103292A1 (ja) * 2014-12-22 2016-06-30 川崎重工業株式会社 ロボットシステム及びエンドエフェクタの変形検出方法
KR20170091705A (ko) 2014-12-22 2017-08-09 카와사키 주코교 카부시키 카이샤 로봇 시스템 및 엔드 이펙터의 변형 검출 방법
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CN101888959B (zh) 2013-07-03
JPWO2009072199A1 (ja) 2011-04-21
US8444368B2 (en) 2013-05-21
US20100239397A1 (en) 2010-09-23
CN101888959A (zh) 2010-11-17

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